A kind of ultra-high thermal conductivity aluminum-based copper-clad laminate and preparation method thereof

Abstract

The present invention provides an ultra-high thermal conductivity aluminum-based copper-clad laminate and a preparation method thereof, and relates to the field of metal-based copper-clad laminate preparation. The ultra-high thermal conductivity aluminum-based copper-clad laminate comprises a copper-plated layer, a copper-sinking layer, a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer which are sequentially stacked. The preparation process of the ultra-high thermal conductivity aluminum-based copper-clad laminate is simpler and the cost is lower. At the same time, the first aluminum oxide layer and the second aluminum oxide layer can utilize the high electrical insulation and good thermal conductivity of aluminum oxide to ensure that the ultra-high thermal conductivity aluminum-based copper-clad laminate has good heat dissipation performance and insulation performance.

Description

Technical Field

[0001] The present invention relates to the field of preparation of metal-based copper-clad laminates, and in particular to an ultra-high thermal conductivity aluminum-based copper-clad laminate and a preparation method thereof. Background Art

[0002] With the development of electronic technology, the design of electronic components is becoming more and more miniaturized and personalized, and the circuits are becoming more and more refined, so it is necessary to meet the requirements of good circuit design flexibility and heat dissipation characteristics. Metal-based copper-clad laminates that carry electronic components have been widely used in light emitting diodes (LEDs), intelligent power modules, and power supplies due to their excellent insulation performance, fast heat dissipation, long life, and diversified circuit design, as well as superior processing characteristics.

[0003] However, the current metal-based copper-clad laminate has a relatively complex structure and a relatively complicated preparation process. Summary of the invention

[0004] The purpose of the present invention is to provide an ultra-high thermal conductivity aluminum-based copper-clad laminate and a preparation method thereof in view of the deficiencies in the above-mentioned prior art, which can simplify the preparation process of the aluminum-based copper-clad laminate while ensuring that the aluminum-based copper-clad laminate meets the heat dissipation performance and insulation performance.

[0005] To achieve the above purpose, the technical solution adopted by the embodiment of the present invention is as follows:

[0006] In a first aspect, an embodiment of the present invention provides an ultra-high thermal conductivity aluminum-based copper-clad laminate, comprising a copper plating layer, a copper deposition layer, a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer stacked in sequence.

[0007] In one embodiment, the first aluminum oxide layer, the pure aluminum layer, and the second aluminum oxide layer are integrally formed.

[0008] In one embodiment, the thickness of the first aluminum oxide layer is greater than or equal to 55 micrometers (um) and less than or equal to 60 um.

[0009] In one embodiment, the thickness of the second aluminum oxide layer is greater than or equal to 3 um and less than or equal to 5 um.

[0010] In one embodiment, the surface roughness of the first aluminum oxide layer is between 0.40 and 0.20 Ra.

[0011] In one embodiment, the thickness of the copper plating layer is greater than or equal to 5 um and less than or equal to 8 um.

[0012] In one embodiment, the thickness of the copper plating layer is greater than or equal to 30 um and less than or equal to 50 um.

[0013] Optionally, the breakdown voltage of the ultra-high thermal conductivity aluminum-based copper-clad laminate is 1000-1500V.

[0014] In a second aspect, an embodiment of the present invention provides a method for preparing an ultra-high thermal conductivity aluminum-based copper-clad laminate, which can be used to prepare the ultra-high thermal conductivity aluminum-based copper-clad laminate as described in the first aspect.

[0015] The method for preparing the ultra-high thermal conductivity aluminum-based copper-clad laminate comprises:

[0016] The surface of the stamped pure aluminum plate is degreased, and the plate is immersed in a tank filled with an oxidizing liquid to oxidize the two surfaces of the pure aluminum plate respectively, so as to obtain a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer which are integrally formed and sequentially stacked;

[0017] Acidizing the first aluminum oxide layer with an acid solution having a concentration of 10% to 20%;

[0018] Performing copper deposition on the surface of the first aluminum oxide layer after the acidification treatment, so as to obtain a copper deposition layer having a thickness greater than or equal to 5 μm and less than or equal to 8 μm on the surface of the first aluminum oxide layer;

[0019] Copper plating is performed on the surface of the copper deposition layer to obtain a copper plating layer with a thickness greater than or equal to 30 um and less than or equal to 50 um. The copper plating layer, the copper deposition layer, the first aluminum oxide layer, the pure aluminum layer, and the second aluminum oxide layer are stacked in sequence to form an ultra-high thermal conductivity aluminum-based copper clad laminate.

[0020] Optionally, the surface of the stamped pure aluminum plate is degreased, and the two surfaces of the pure aluminum plate are respectively oxidized by immersing the plate in a tank filled with an oxidizing liquid to obtain a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer that are integrally formed and sequentially stacked, comprising:

[0021] Degreasing the surface of the stamped pure aluminum plate;

[0022] The first surface of the pure aluminum plate after degreasing treatment is immersed in a tank filled with an oxidizing liquid for oxidation for 120 minutes to 150 minutes, and the second surface is immersed in a tank filled with an oxidizing liquid for oxidation for 20 minutes to 40 minutes to obtain the first aluminum oxide layer, the pure aluminum layer, and the second aluminum oxide layer which are integrally formed and sequentially stacked;

[0023] Wherein, the thickness of the first aluminum oxide layer is greater than or equal to 55 micrometers and less than or equal to 60um; the thickness of the second aluminum oxide layer is greater than or equal to 3um and less than or equal to 5um.

[0024] Optionally, after the first aluminum oxide layer is acidified with an acid solution having a concentration of 10%-20%, the surface roughness of the first aluminum oxide layer is between 0.40 and 0.20 Ra.

[0025] In a third aspect, an embodiment of the present application further provides an electronic circuit board, comprising the ultra-high thermal conductivity aluminum-based copper-clad laminate as described in the first aspect. The preparation cost of the electronic circuit board is lower and it can have better heat dissipation performance and higher reliability.

[0026] The beneficial effects of the present invention are as follows: In the embodiment of the present invention, the ultra-high thermal conductivity aluminum-based copper-clad laminate comprises a copper-plated layer, a copper-sinking layer, a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer stacked in sequence. The preparation process of the ultra-high thermal conductivity aluminum-based copper-clad laminate is simpler and the cost is lower. At the same time, the first aluminum oxide layer and the second aluminum oxide layer can utilize the high electrical insulation and good thermal conductivity of aluminum oxide to ensure that the ultra-high thermal conductivity aluminum-based copper-clad laminate has good heat dissipation and insulation properties.

[0027] For example, when the ultra-high thermal conductivity aluminum-based copper-clad laminate is applied to LED chips, it can facilitate the heat dissipation of the LED chips, thereby realizing high-power LED design. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 A schematic diagram of the structure of an ultra-high thermal conductivity aluminum-based copper-clad laminate provided by an embodiment of the present invention is shown;

[0030] Figure 2 A schematic flow chart of a method for preparing an ultra-high thermal conductivity aluminum-based copper-clad laminate provided by an embodiment of the present invention is shown;

[0031] Figure 3 Another schematic flow chart of the method for preparing an ultra-high thermal conductivity aluminum-based copper-clad laminate provided by an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. If no specific conditions are specified in the following embodiments, the conventional conditions shall be followed.

[0033] In addition, it should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or collections thereof.

[0034] It should be noted that, in the description of this application, "plurality" refers to two or more. The words "first", "second", etc. are only used to distinguish the description and are not used to specifically limit a certain feature. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship.

[0035] Figure 1 FIG. 1 shows a schematic diagram of the structure of an ultra-high thermal conductivity aluminum-based copper-clad laminate provided by an embodiment of the present invention. Figure 1 As shown, the ultra-high thermal conductivity aluminum-based copper-clad laminate provided by an embodiment of the present invention includes a copper plating layer 110, a copper deposition layer 120, a first aluminum oxide layer 130, a pure aluminum layer 140, and a second aluminum oxide layer 150 which are stacked in sequence.

[0036] The ultra-high thermal conductivity aluminum-based copper-clad laminate has a simple structure, so the preparation process is simpler and the cost is lower. At the same time, the first aluminum oxide layer and the second aluminum oxide layer can utilize the high electrical insulation and good thermal conductivity of aluminum oxide to ensure that the ultra-high thermal conductivity aluminum-based copper-clad laminate has good heat dissipation and insulation properties.

[0037] Optionally, the first aluminum oxide layer, the pure aluminum layer, and the second aluminum oxide layer are integrally formed.

[0038] For example, the surface of the stamped pure aluminum plate can be degreased, and then the two sides of the degreased pure aluminum plate are immersed in a tank filled with an oxidizing liquid for oxidation, to obtain a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer that are integrally formed and stacked in sequence. It can be understood that the first aluminum oxide layer is obtained by oxidizing the first surface of the pure aluminum plate, the second aluminum oxide layer is obtained by oxidizing the second surface of the pure aluminum plate, and the pure aluminum layer is the unoxidized portion in the middle of the pure aluminum plate.

[0039] Optionally, the first aluminum oxide layer can be obtained by oxidizing the first surface of the pure aluminum plate for 120 minutes (min) to 150 minutes, and its thickness is greater than or equal to 55um and less than or equal to 60um. For example, the thickness of the first aluminum oxide layer can be 58um, 59um, etc.

[0040] By oxidizing the first surface of the pure aluminum plate for 120 minutes (min) to 150 minutes, the first aluminum oxide layer with a thickness greater than or equal to 55 um and less than or equal to 60 um can have better thermal conductivity and insulation properties.

[0041] Optionally, the second aluminum oxide layer can be obtained by oxidizing the second surface of the pure aluminum plate for 20 minutes to 40 minutes, and its thickness is greater than or equal to 3 um and less than or equal to 5 um. For example, the thickness of the second aluminum oxide layer can be 4 um, 4.5 um, etc.

[0042] Optionally, the copper deposition layer is obtained by copper deposition on the first aluminum oxide layer. The thickness of the copper deposition layer may be greater than or equal to 5 um and less than or equal to 8 um. For example, the thickness of the copper deposition layer may be 6 um, 7 um, etc.

[0043] Among them, copper plating treatment is a relatively mature existing technology and will not be described in detail.

[0044] Optionally, before copper deposition treatment is performed on the first aluminum oxide layer, the first aluminum oxide layer may be acidified with an acid solution having a concentration of 10% to 20%. After the acidification treatment, the surface roughness of the first aluminum oxide layer is between 0.40 and 0.20 Ra. For example, the surface roughness of the first aluminum oxide layer may be 0.30 Ra.

[0045] The copper-plated layer is obtained by copper-plating the surface of the above copper-plated layer, and its thickness can be greater than or equal to 30 um and less than or equal to 50 um. For example, the thickness of the copper-plated layer can be 40 um.

[0046] Optionally, the breakdown voltage of the ultra-high thermal conductivity aluminum-based copper-clad laminate is 1000-1500V.

[0047] Optionally, the embodiments of the present invention may also be extended to other metal-based copper-clad laminates and are not limited to aluminum-based copper-clad laminates, and are not limited here either.

[0048] Based on the ultra-high thermal conductivity aluminum-based copper-clad laminate provided in the aforementioned embodiment, an embodiment of the present invention further provides a method for preparing an ultra-high thermal conductivity aluminum-based copper-clad laminate, which can be used to prepare the ultra-high thermal conductivity aluminum-based copper-clad laminate as described in the aforementioned embodiment.

[0049] Figure 2 The schematic diagram of the process of preparing the ultra-high thermal conductivity aluminum-based copper-clad laminate provided by the embodiment of the present invention is shown. Figure 2 As shown, the method for preparing the ultra-high thermal conductivity aluminum-based copper-clad laminate comprises:

[0050] S201, degreasing the surface of the stamped pure aluminum plate, and immersing it in a tank filled with an oxidizing liquid to oxidize the two surfaces of the pure aluminum plate respectively, to obtain a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer that are integrally formed and stacked in sequence.

[0051] S202, acidifying the first aluminum oxide layer with an acid solution having a concentration of 10%-20%.

[0052] S203, copper deposition is performed on the surface of the first aluminum oxide layer after the acidification treatment, so as to obtain a copper deposition layer with a thickness greater than or equal to 5 um and less than or equal to 8 um on the surface of the first aluminum oxide layer.

[0053] S204, copper plating is performed on the surface of the copper deposition layer to obtain a copper plating layer with a thickness greater than or equal to 30 um and less than or equal to 50 um, and the copper plating layer, the copper deposition layer, the first aluminum oxide layer, the pure aluminum layer, and the second aluminum oxide layer are stacked in sequence to form an ultra-high thermal conductivity aluminum-based copper clad laminate.

[0054] The ultra-high thermal conductivity aluminum-based copper-clad laminate as described in the above embodiment can be prepared through S201 to S204.

[0055] Figure 3 Another schematic flow chart of the method for preparing an ultra-high thermal conductivity aluminum-based copper-clad laminate provided by an embodiment of the present invention is shown.

[0056] Alternatively, if Figure 3 As shown, S201 may include:

[0057] S301, degreasing the surface of the stamped pure aluminum plate.

[0058] S302, immerse the first surface of the pure aluminum plate after degreasing treatment in a tank filled with oxidizing liquid for oxidation for 120 minutes-150 minutes, and immerse the second surface in a tank filled with oxidizing liquid for oxidation for 20 minutes-40 minutes to obtain a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer that are integrally formed and stacked in sequence.

[0059] The thickness of the first aluminum oxide layer is greater than or equal to 55 micrometers and less than or equal to 60 um; the thickness of the second aluminum oxide layer is greater than or equal to 3 um and less than or equal to 5 um.

[0060] Since the oxidation time of the first surface of the pure aluminum plate is 120 minutes min-150 minutes, and the oxidation time of the second surface is 20 minutes-40 minutes, the thickness of the first aluminum oxide layer can reach a range greater than or equal to 55 microns um and less than or equal to 60um, and the thickness of the second aluminum oxide layer can reach a range greater than or equal to 3um and less than or equal to 5um. At this time, the first aluminum oxide layer can meet the heat dissipation performance of the aluminum-based copper clad laminate, and there is no need to set an additional thermal conductive insulation layer for the aluminum-based copper clad laminate, which reduces the preparation cost and simplifies the preparation process.

[0061] Optionally, after the first aluminum oxide layer is acidified with an acid solution having a concentration of 10%-20%, the surface roughness of the first aluminum oxide layer is between 0.40 and 0.20 Ra.

[0062] Above Figure 2 and Figure 3 The method for preparing the ultra-high thermal conductivity aluminum-based copper-clad laminate shown has the advantages of simple process, high production efficiency and low cost.

[0063] Optionally, an embodiment of the present application also provides an electronic circuit board, which may include the ultra-high thermal conductivity aluminum-based copper-clad laminate as described in the aforementioned embodiment. The preparation cost of the electronic circuit board is lower and it may have better heat dissipation performance and higher reliability.

[0064] Although the present invention has been illustrated and described with specific embodiments, it should be appreciated that the above-described embodiments only express several implementation methods of the present invention and are not intended to limit the present invention. Many other changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Therefore, this means that all changes and modifications within the scope of the present invention are included in the claims attached to the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A method for preparing an ultra-high thermal conductivity aluminum-based copper-clad laminate, characterized in that: include: The surface of the stamped pure aluminum plate is degreased, and the two surfaces of the pure aluminum plate are respectively oxidized by immersing the plate in a tank filled with an oxidizing liquid to obtain a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer which are integrally formed and sequentially stacked; wherein the oxidation time of the first surface of the pure aluminum plate is 120 minutes min-150 minutes, and the oxidation time of the second surface is 20 minutes min-40 minutes; the thickness of the first aluminum oxide layer is greater than or equal to 55 micrometers um and less than or equal to 60um; the thickness of the second aluminum oxide layer is greater than or equal to 3um and less than or equal to 5um; Acidizing the first aluminum oxide layer with an acid solution having a concentration of 10% to 20%; Performing copper deposition on the surface of the first aluminum oxide layer after the acidification treatment, so as to obtain a copper deposition layer having a thickness greater than or equal to 5 μm and less than or equal to 8 μm on the surface of the first aluminum oxide layer; Copper plating is performed on the surface of the copper deposition layer to obtain a copper plating layer with a thickness greater than or equal to 30 um and less than or equal to 50 um, and the copper plating layer, the copper deposition layer, the first aluminum oxide layer, the pure aluminum layer, and the second aluminum oxide layer are sequentially stacked to form an ultra-high thermal conductivity aluminum-based copper clad laminate; After the first aluminum oxide layer is acidified with an acid solution having a concentration of 10%-20%, the surface roughness of the first aluminum oxide layer is between 0.40 and 0.20 Ra.

2. An ultra-high thermal conductivity aluminum-based copper-clad laminate, characterized in that: The ultra-high thermal conductivity aluminum-based copper-clad laminate is manufactured by the method for preparing the ultra-high thermal conductivity aluminum-based copper-clad laminate as claimed in claim 1, comprising a copper plating layer, a copper deposition layer, a first aluminum oxide layer, a pure aluminum layer, and a second aluminum oxide layer stacked in sequence; The first aluminum oxide layer, the pure aluminum layer, and the second aluminum oxide layer are integrally formed; The thickness of the copper plating layer is greater than or equal to 30um and less than or equal to 50um; The thickness of the copper plating layer is greater than or equal to 5um and less than or equal to 8um; The thickness of the first aluminum oxide layer is greater than or equal to 55 um and less than or equal to 60 um; The thickness of the second aluminum oxide layer is greater than or equal to 3 um and less than or equal to 5 um; The surface roughness of the first aluminum oxide layer is between 0.40 and 0.20 Ra; The breakdown voltage of the ultra-high thermal conductivity aluminum-based copper-clad laminate is 1000-1500V.

3. An electronic circuit board, characterized in that: The electronic circuit board comprises the ultra-high thermal conductivity aluminum-based copper-clad laminate as claimed in claim 2.

Images