Circuit structure and method for removing FPC oxide layer

Abstract

The present invention provides a circuit structure and method for removing an FPC oxide layer, which relates to the technical field of circuit boards, including a CELL layer, an FPC layer, an FPC connector and a control circuit, wherein two FPC gold fingers are crimped with one CELL gold finger, and the other ends of the two FPC gold fingers are respectively used as input ends of a control signal and a product signal, and through the switching of the control circuit, a large current loop can be formed between the two FPC gold fingers and one CELL gold finger to achieve the purpose of removing the oxide layer. The present invention uses a new FPC structure design to form a large current with an electrical signal, thereby eliminating the oxide layer, reducing the conduction impedance of the gold finger, and reducing the transmission loss of the electrical signal.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a circuit structure and method for removing an oxide layer of an FPC. Background Art

[0002] The FPC (Flexible Printed Circuit) and the CELL display unit are pressed together by external force, such as Figure 1 As shown, the FPC gold finger and the CELL gold finger are connected to achieve electrical conduction, and the FPC gold finger and the CELL gold finger are in a one-to-one correspondence. However, if there is an oxide layer on the FPC gold finger or the CELL gold finger, the conduction impedance between the gold fingers will increase after crimping, affecting the transmission of electrical signals.

[0003] like Figure 2 As shown, when an oxide layer exists, the contact impedance becomes higher, affecting electrical transmission, which will reduce the voltage obtained by the CELL or the voltage obtained by the FPC, resulting in display abnormalities. Summary of the invention

[0004] The technical problem to be solved by the present invention is: in order to overcome the deficiencies in the prior art, the present invention provides a circuit structure and method for removing an FPC oxide layer.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a circuit structure for removing the FPC oxide layer, comprising a CELL layer, an FPC layer, an FPC connector and a control circuit, wherein the FPC layer is provided with an FPC gold finger, the CELL layer is provided with a CELL gold finger,

[0006] When in use, two FPC gold fingers form a group, one end is crimped with a CELL gold finger, and the other end is connected to the FPC connector. The other side of the FPC connector is used to input product signals and control signals, wherein the product signal flows into the crimped FPC gold fingers and CELL gold fingers after passing through the FPC connector; the control circuit is arranged between the control signal and the FPC connector, and the control circuit has a first working mode and a second working mode, the first working mode is to remove the oxide layer between the FPC gold finger and the CELL gold finger, in the first working mode, two FPC gold fingers and one CELL gold finger can form a loop; the second working mode is to normally input product signals, in the second working mode, the two FPC gold fingers serve as parallel input ends of the product signal; the control circuit can be switched between the first working mode and the second working mode by adjusting the input control signal.

[0007] In the present invention, the original one-to-one corresponding FPC gold finger and CELL gold finger are improved into two FPC gold fingers crimped on one CELL gold finger, which is equivalent to setting two signal terminals on the CELL gold finger. A loop can be formed through the two signal terminals. Before use, current can be injected into the loop to achieve the removal of the oxide layer between the FPC gold finger and the CELL gold finger.

[0008] Specifically, the control circuit includes a transistor T1, a transistor T2 and a resistor R, the base of the transistor T1 serves as an input end of the control signal I, the collector of the transistor T1 is connected to an input line of a product signal, and the input line of the product signal is connected to one of a group of FPC gold fingers through an FPC connector, and the emitter of the transistor T1 is connected to another gold finger in the group of FPC gold fingers; the collector of the transistor T2 is connected to the emitter of the transistor T1 after being connected in series with the resistor R, the emitter of the transistor T2 serves as an input end of the control signal II, and the base of the transistor T2 serves as an input end of the control signal III.

[0009] The transistor is a controlled conduction element. When the transistor base voltage reaches the transistor conduction voltage, the transistor collector and emitter are turned on. The function of the resistor R is to limit the conduction current to prevent excessive current from burning the components and the CELL gold fingers.

[0010] Furthermore, it also includes a PCBA, and the FPC connector and the control circuit are both arranged on the PCBA.

[0011] Furthermore, the circuit structure can realize the removal of the oxide layer of a single gold finger and can also realize the removal of the oxide layers of multiple gold fingers. In the case of removing the oxide layers of multiple gold fingers, there are multiple product signals, each of which corresponds to a control circuit, to realize the switching between the first working mode and the second working mode between a group of FPC gold fingers and CELL gold fingers.

[0012] A method for removing the oxide layer of FPC using the above circuit structure includes two working processes: removing the oxide layer and inputting product signals, wherein:

[0013] The working process of removing the oxide layer is as follows: first, the input end of the product signal provides a high voltage, the input end of the control signal I provides a low voltage, and the transistor T1 is turned off; then, the input end of the control signal III provides a high voltage, and at the same time, the input end of the control signal II provides a low voltage, and the transistor T2 is turned on. At this time, the product signal passes through the FPC gold finger, the CELL gold finger, the FPC gold finger, the resistor R, the collector of the transistor T2, the base of the transistor T2 and the control signal II in sequence to form a large current loop, and the oxide layer is broken down by the large current to achieve the removal of the oxide layer;

[0014] The working process of product signal input is: when the oxide layer is cleared and a signal needs to be provided to the product, the input end of the control signal III provides a low voltage to turn off the transistor T2. At the same time, the input end of the control signal I provides a high voltage to turn on the transistor T1. The product signal is divided into two paths at the transistor T1. One path passes through the product signal input line, the FPC connector, the FPC gold finger connected to the product signal input line, and the CELL gold finger in sequence to enter the CELL layer; the other path passes through the transistor T1, the FPC connector, the FPC gold finger connected to the emitter of the transistor T1, and the CELL gold finger in sequence to enter the CELL layer; the two product signals converge at the CELL gold finger; during this process, the control signal II is at zero potential.

[0015] The beneficial effects of the present invention are as follows: the circuit structure and method for removing the FPC oxide layer provided by the present invention can eliminate the oxide layer, reduce the gold finger conduction impedance, and reduce the electrical signal transmission loss through a new FPC structure design and a large current formed by an electrical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0017] Figure 1 It is a schematic diagram of the crimping structure of FPC and CELL in the prior art.

[0018] Figure 2 It is a schematic diagram of the cross-sectional structure of the gold finger where the FPC and the CELL are crimped in the prior art.

[0019] Figure 3 It is a schematic diagram of the structure of the FPC and CELL before crimping.

[0020] Figure 4 It is a schematic diagram of the principle of removing the oxide layer of the present invention.

[0021] Figure 5 It is a schematic diagram of the cross-sectional structure of the gold finger where the FPC and the CELL are crimped after the oxide layer is removed according to the present invention.

[0022] Figure 6 It is a schematic diagram of the principle of signal input of the product of the present invention.

[0023] Figure 7 It is a schematic diagram of the FPC and CELL structure with multiple sets of gold fingers.

[0024] In the figure: 1. FPC layer, 2. FPC gold finger, 3. Oxide layer, 4. CELL gold finger, 5. CELL layer, 6. PCBA layer, 7. FPC connector, 8. Control circuit. DETAILED DESCRIPTION

[0025] The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, which only illustrates the basic structure of the present invention in a schematic manner, and therefore only shows the components related to the present invention.

[0026] like Figure 3 and Figure 4 As shown, a circuit structure for removing an FPC oxide layer of the present invention comprises a CELL layer 5, an FPC layer 1 and a PCBA layer 6, PCBA is the abbreviation of Printed Circuit Board Assembly in English, an FPC connector 7 and a control circuit 8 are arranged on the PCBA layer 6, an FPC gold finger 2 is arranged on the FPC layer 1, and a CELL gold finger 4 is arranged on the CELL layer 5, two FPC gold fingers 2 form a group, one end of which is crimped with a CELL gold finger 4, and the other end is connected to the FPC connector 7, and the other side of the FPC connector 7 is used to input product signals and control signals.

[0027] The control circuit 8 is arranged between the control signal and the FPC connector 7, and includes a transistor T1, a transistor T2 and a resistor R. The base of the transistor T1 serves as the input end of the control signal I, the collector of the transistor T1 is connected to the input line of the product signal, and the input line of the product signal is connected to one of the gold fingers in a group of FPC gold fingers 2 after passing through the FPC connector 7, and the emitter of the transistor T1 is connected to another gold finger in the group of FPC gold fingers 2; the collector of the transistor T2 is connected to the emitter of the transistor T1 after being connected in series with the resistor R, the emitter of the transistor T2 serves as the input end of the control signal II, and the base of the transistor T2 serves as the input end of the control signal III.

[0028] The control circuit 8 has a first working mode and a second working mode. The first working mode is to remove the oxide layer 3 between the FPC gold finger 2 and the CELL gold finger 4. In the first working mode, two FPC gold fingers 2 and one CELL gold finger 4 can form a loop. The second working mode is to input product signals normally. In the second working mode, the two FPC gold fingers 2 serve as parallel input terminals of product signals. The control circuit 8 can switch between the first working mode and the second working mode by adjusting the input control signal. The cross-sectional schematic diagram of the gold finger after removing the oxide layer 3 is shown in FIG. Figure 5 shown.

[0029] like Figure 7 As shown, in the case of removing multiple gold finger oxide layers 3, there are multiple product signals, each product signal corresponds to a control circuit 8, and each control circuit 8 has three control signal input terminals to realize the switching between the first working mode and the second working mode between a group of FPC gold fingers 2 and CELL gold fingers 4.

[0030] A method for removing the FPC oxide layer 3 using the above circuit structure includes two working processes: removing the oxide layer 3 and inputting a product signal, wherein:

[0031] The process of removing the oxide layer 3 is as follows Figure 4 As shown: First, the input end of the product signal provides a high voltage, the input end of the control signal I provides a low voltage, and the transistor T1 is turned off; then, the input end of the control signal III provides a high voltage, and at the same time, the input end of the control signal II provides a low voltage, and the transistor T2 is turned on. At this time, the product signal passes through FPC gold finger 2, CELL gold finger 4, FPC gold finger 2, resistor R, the collector of transistor T2, the base of transistor T2 and the control signal II in sequence to form a large current loop, and the oxide layer 3 is broken down by a large current to achieve the removal of the oxide layer 3. In this process, the product signal will enter the subsequent circuit of CELL at the same time, but because it is equipotential, no current will be generated, so it has no effect on CELL and subsequent circuits.

[0032] The working process of product signal input is as follows Figure 6 As shown: after the oxide layer 3 is removed, when a signal needs to be provided for the product, the input end of the control signal III provides a low voltage to close the transistor T2. At the same time, the input end of the control signal I provides a high voltage to open the transistor T1. The product signal is divided into two paths at the transistor T1. One path passes through the product signal input line, the FPC connector 7, the FPC gold finger 2 connected to the product signal input line, and the CELL gold finger 4 to enter the CELL layer 5; the other path passes through the transistor T1, the FPC connector 7, the FPC gold finger 2 connected to the emitter of the transistor T1, and the CELL gold finger 4 to enter the CELL layer 5; the two product signals converge at the CELL gold finger 4, which can also improve the reliability of the product signal; in this process, the control signal II is at zero potential.

[0033] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the scope of the present invention through the above description. The technical scope of this invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A circuit structure for removing an FPC oxide layer, characterized in that: It includes a CELL layer, an FPC layer, an FPC connector and a control circuit, wherein the FPC layer is provided with an FPC gold finger, and the CELL layer is provided with a CELL gold finger. When in use, two FPC gold fingers form a group, one end of the FPC gold finger is crimped with a CELL gold finger, and the other end is connected to the FPC connector, and the other side of the FPC connector is used to input product signals and control signals, wherein the product signal flows into the crimped FPC gold finger and CELL gold finger after passing through the FPC connector; the control circuit is arranged between the control signal and the FPC connector, and the control circuit has a first working mode and a second working mode, the first working mode is to remove the oxide layer between the FPC gold finger and the CELL gold finger, in the first working mode, two FPC gold fingers and one CELL gold finger can form a loop; the second working mode is to input product signals normally, in the second working mode, the two FPC gold fingers serve as parallel input ends of the product signal; the control circuit can be switched between the first working mode and the second working mode by adjusting the input control signal; The control circuit includes a transistor T1, a transistor T2 and a resistor R, the base of the transistor T1 serves as an input end of a control signal I, the collector of the transistor T1 is connected to an input line of a product signal, and the input line of the product signal is connected to one of a group of FPC gold fingers through an FPC connector, and the emitter of the transistor T1 is connected to another gold finger in the group of FPC gold fingers; the collector of the transistor T2 is connected to the emitter of the transistor T1 after being connected in series with the resistor R, the emitter of the transistor T2 serves as an input end of a control signal II, and the base of the transistor T2 serves as an input end of a control signal III; The product signal passes through the FPC gold finger, CELL gold finger, FPC gold finger, resistor R, the collector of transistor T2, the emitter of transistor T2 and the control signal II in sequence to form a large current loop, which uses a large current to break through the oxide layer to clear the oxide layer.

2. The circuit structure for removing the FPC oxide layer according to claim 1, characterized in that: It also includes a PCBA, on which the FPC connector and the control circuit are both arranged.

3. The circuit structure for removing the FPC oxide layer according to claim 1, characterized in that: There are multiple product signals, each of which corresponds to a control circuit, so as to realize the switching between the first working mode and the second working mode between a group of FPC gold fingers and CELL gold fingers.

4. A method for removing an FPC oxide layer using the circuit structure according to any one of claims 1 to 3, characterized in that: It includes two working processes: removing the oxide layer and inputting product signals. The working process of removing the oxide layer is as follows: first, the input end of the product signal provides a high voltage, the input end of the control signal I provides a low voltage, and the transistor T1 is turned off; then, the input end of the control signal III provides a high voltage, and at the same time, the input end of the control signal II provides a low voltage, and the transistor T2 is turned on. At this time, the product signal passes through the FPC gold finger, the CELL gold finger, the FPC gold finger, the resistor R, the collector of the transistor T2, the emitter of the transistor T2 and the control signal II in sequence to form a large current loop, and the oxide layer is broken down by the large current to achieve the removal of the oxide layer; The working process of product signal input is: when the oxide layer is cleared and a signal needs to be provided to the product, the input end of the control signal III provides a low voltage to close the transistor T2. At the same time, the input end of the control signal I provides a high voltage to open the transistor T1. The product signal is divided into two paths at the transistor T1. One path passes through the product signal input line, the FPC connector, the FPC gold finger connected to the product signal input line, and the CELL gold finger in turn to enter the CELL layer; the other path passes through the transistor T1, the FPC connector, the FPC gold finger connected to the emitter of the transistor T1, and the CELL gold finger in turn to enter the CELL layer; the two product signals converge at the CELL gold finger; during this process, the control signal I is at zero potential.

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