Electrostatic Conductive Substrate Holding Device

Abstract

The present invention provides an electrostatic conductive substrate holding device, comprising: a substrate chuck for driving the substrate to rotate; a central rotating shaft for driving the substrate chuck to rotate; an electrostatic conductive structure including a first electrostatic conductive structure and a second electrostatic conductive structure; a hollow outer shell connected to the second electrostatic conductive structure through a bearing, the second electrostatic conductive structure being electrically connected to the bearing, and the bearing being electrically connected to the hollow outer shell; a sealing housing surrounding the second electrostatic conductive structure, which is located between the substrate chuck and the bearing in the axial direction of the central rotating shaft; a first annular sealing tooth is provided on the inner wall of the sealing housing, and a second annular sealing tooth is provided on the outer wall of the second electrostatic conductive structure, which are staggered with each other to isolate the substrate chuck from the bearing. By using a bearing as the electrostatic conductive structure for the transition between the rotating part and the non-rotating part, the rotating structure and the electrostatic conductive structure can be well compatible; the staggered first annular sealing tooth and the second annular sealing tooth also ensure that the lubricating oil in components such as the bearing will not contaminate the wafer during operation.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing equipment, and in particular to an electrostatic conductive substrate holding device. Background Art

[0002] During wet etching or cleaning processes in semiconductor manufacturing, a chuck device is used to fix and rotate substrates such as wafers. During the above process, static electricity often remains on the surface of the wafer. If static electricity cannot be eliminated in time, the structure of the semiconductor device may be damaged due to electrostatic discharge, which will greatly reduce the number of qualified devices on a single wafer, thereby affecting the product yield.

[0003] At present, there are some solutions that provide a static conductive structure in the chuck device to conduct the static electricity of the wafer. The static electricity generated on the wafer during the process is promptly conducted to the ground terminal through the static conductive structure, thereby preventing static electricity from damaging the wafer. However, in the existing chuck device, the rotating structure and the static conductive structure cannot be well compatible. The friction between the rotating and non-rotating parts of the static conductive structure of the chuck device has the risk of generating particulate contaminants. How to ensure that the static electricity can be smoothly conducted through the static conductive structure while ensuring the normal rotation of the rotating structure is a difficult problem that the industry needs to solve urgently, and it is also the key to improving the yield of related processes. In addition, the grease volatilized in the bearings of the rotating structure or the particulate contamination generated by the friction between the moving and static parts, once leaked into the wafer processing area, will cause contamination to the wafer in operation.

[0004] Therefore, it is necessary to propose a new static conductive substrate holding device to solve the above problems. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide an electrostatic conductive substrate holding device to solve the problems in the prior art that the rotating structure and the electrostatic conductive structure are not well compatible and the lubricating oil pollution of the rotating structure.

[0006] To achieve the above-mentioned object and other related objects, the present invention provides a static conductive substrate holding device, characterized in that it comprises:

[0007] A substrate chuck, used to fix and drive the substrate to rotate;

[0008] A central rotating shaft, one end of which is connected to the substrate chuck and is used to drive the substrate chuck to rotate;

[0009] Electrostatic conduction structure, the electrostatic conduction structure includes a first electrostatic conduction structure and a second electrostatic conduction structure. The first electrostatic conduction structure is used for electrically connecting the substrate and the second electrostatic conduction structure. The second electrostatic conduction structure is disposed around the periphery of the central rotating shaft and fixedly connected to the outer wall of the central rotating shaft;

[0010] Hollow outer shell, the hollow outer shell is disposed around the periphery of the second electrostatic conduction structure and connected to the second electrostatic conduction structure through a bearing. The second electrostatic conduction structure is electrically connected to the bearing, and the bearing is electrically connected to the hollow outer shell;

[0011] Sealing housing, the sealing housing is disposed around the periphery of the second electrostatic conduction structure and fixedly connected to the hollow outer shell, and the sealing housing is located between the substrate chuck and the bearing in the axial direction of the central rotating shaft;

[0012] The inner wall of the sealing housing close to the central rotating shaft is provided with a first annular sealing tooth surrounding the central rotating shaft. The outer wall of the second electrostatic conduction structure far from the central rotating shaft is provided with a second annular sealing tooth surrounding the central rotating shaft. The first annular sealing tooth and the second annular sealing tooth are staggered in the axial direction of the central rotating shaft and isolate the substrate chuck and the bearing.

[0013] As an optional solution of the present invention, the bearing includes a first bearing and a second bearing. The first bearing is disposed at one end of the hollow outer shell close to the substrate chuck, and the second bearing is disposed at one end of the hollow outer shell far from the substrate chuck.

[0014] As an optional solution of the present invention, the sealing housing is composed of two paired semi-circular housings. The two semi-circular housings are mutually held and connected to the periphery of the second electrostatic conduction structure and fixedly connected to the hollow outer shell in the axial direction of the central rotating shaft through fasteners.

[0015] As an optional solution of the present invention, the first annular sealing tooth and the second annular sealing tooth are multiple.

[0016] As an optional solution of the present invention, there is a gap between the first annular sealing tooth and the second annular sealing tooth arranged in an alternating manner, and the gap forms a flow channel.

[0017] As an optional solution of the present invention, the first electrostatic conduction structure includes:

[0018] Electrostatic conduction seat, the electrostatic conduction seat is disposed at the edge of the substrate chuck for receiving and electrically connecting the substrate;

[0019] The static conductive rod is disposed below the substrate chuck and is used to electrically connect the static conductive seat and the second static conductive structure.

[0020] As an optional solution of the present invention, the static conductive seats are multiple and arranged in pairs, and the static conductive rods are multiple and correspond one to one with the static conductive seats.

[0021] As an optional solution of the present invention, static electricity on the substrate is conducted to the hollow shell via the static electricity conductive seat, the static electricity conductive rod, the second static electricity conductive structure and the bearing.

[0022] As an optional solution of the present invention, the substrate chuck is further provided with positioning pins for clamping and fixing the substrate and guide pillars for guiding and limiting the substrate at a set position.

[0023] As an optional solution of the present invention, the static conductive substrate holding device further includes a base, and the hollow shell is electrically connected to and fixed to the base.

[0024] As described above, the present invention provides a static conductive substrate holding device, which has the following beneficial effects:

[0025] The present invention introduces a new electrostatic conductive substrate holding device, which adopts a bearing as an electrostatic conductive structure for transition between the rotating and non-rotating parts, so that the rotating structure and the electrostatic conductive structure can be well compatible; the staggered arrangement of the first annular sealing teeth and the second annular sealing teeth also ensures that the lubricating oil in the bearing and other components will not contaminate the wafer in operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Shown is a front cross-sectional view of the static conductive substrate holding device provided in the first embodiment of the present invention.

[0027] Figure 2 Shown is an enlarged side view of the edge area of ​​the substrate chuck provided in the first embodiment of the present invention.

[0028] Figure 3 Shown is a perspective enlarged view of the edge area of ​​the substrate chuck provided in the first embodiment of the present invention.

[0029] Figure 4 Shown is a bottom view of the substrate chuck provided in the first embodiment of the present invention.

[0030] Figure 5 The electrostatic conductive substrate holding device provided in the first embodiment of the present invention is shown in Figure 1 Magnified view of area A.

[0031] Figure 6Shown is a bottom view of the substrate chuck provided in the second embodiment of the present invention.

[0032] Element number description

[0033] 100 Substrate

[0034] 101 Substrate chuck

[0035] 102 Central rotating shaft

[0036] 103 First electrostatic conduction structure

[0037] 103a Electrostatic conduction seat

[0038] 103b Electrostatic conduction rod

[0039] 104 Second electrostatic conduction structure

[0040] 104a Second annular sealing tooth

[0041] 105 Hollow outer shell

[0042] 106 Bearing

[0043] 106a First bearing

[0044] 106b Second bearing

[0045] 107 Sealing housing

[0046] 107a First annular sealing tooth

[0047] 108 Positioning pin

[0048] 108a Clamping structure

[0049] 108b Counterweight structure

[0050] 108c Rotating shaft

[0051] 109 Guide post

[0052] 110 Base

[0053] 203b Electrostatic conduction rod

[0054] 208 Positioning pin

[0055] 209 Guide post Detailed implementation manner

[0056] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0057] Please refer to Figures 1 to 6 . It should be noted that the diagrams provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Although only the components related to the present invention are shown in the diagrams, they are not drawn according to the number, shape, and size of the components in actual implementation. The form, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the layout form of its components may also be more complex.

[0058] Embodiment 1

[0059] Please refer to Figures 1 to 5 . This embodiment provides an electrostatic conductive substrate holding device.

[0060] As Figure 1 and Figure 4 shown, the electrostatic conductive substrate holding device includes: a substrate chuck 101 for fixing and driving the substrate 100 to rotate. Optionally, the substrate 100 can be a wafer or other substrates used in semiconductor processes. The substrate chuck 101 fixes the substrate 100 and drives it to rotate to meet the process requirements for uniformity in single-wafer wet etching or wet cleaning. In addition, the electrostatic conductive substrate holding device provided by the present invention can also be used in other processes that require the wafer to rotate, such as photolithography coating or ion implantation.

[0061] As Figure 1 shown, the electrostatic conductive substrate holding device further includes: a central rotating shaft 102. One end of the central rotating shaft 102 is connected to the substrate chuck 101 for driving the substrate chuck 101 to rotate. Optionally, the other end of the central rotating shaft 102 can be connected to a transmission mechanism such as a transmission belt or a motor (not shown in the figure) to drive the central rotating shaft 102 to rotate, and then drive the connected substrate chuck 101 to rotate.

[0062] As Figures 1 to 4 shown, the electrostatic conductive substrate holding device further includes: an electrostatic conductive structure. The electrostatic conductive structure includes a first electrostatic conductive structure 103 and a second electrostatic conductive structure 104. The first electrostatic conductive structure 103 is used for electrically connecting the substrate 100 to the second electrostatic conductive structure 104. The second electrostatic conductive structure 104 is disposed around the periphery of the central rotating shaft 102 and fixedly connected to the outer wall of the central rotating shaft 102.

[0063] As an example, such as Figures 1 to 4 shown, the first static conductive structure 103 includes: a static conductive seat 103a disposed at the edge of the substrate chuck 101 for receiving and electrically connecting the substrate 100; a static conductive rod 103b disposed below the substrate chuck 101 for electrically connecting the static conductive seat 103a and the second static conductive structure 104. Optionally, the substrate chuck 101 is further provided with a positioning pin 108 for clamping and fixing the substrate 100 and a guide post 109 for guiding and limiting the substrate 100 to a set position. The positioning pin 108 can clamp and fix the wafer at a set position when the substrate chuck 101 rotates; the guide post 109 is a column with a conical shape at the upper part, and when the wafer is placed from above, the wafer is guided to the set position by a plurality of cones. Such as Figure 2 shown, is a side view enlarged drawing of the edge area of the substrate chuck 101 provided in the present invention. Such as Figure 3 shown, is a perspective enlarged drawing including the positioning pin 108 and the guide post 109, in which the substrate 100 and the substrate chuck 101 in Figure 2 are not drawn. It can be seen from Figure 3 that the positioning pin 108 is located between the two guide posts 109. The positioning pin 108 includes a clamping structure 108a at the upper part and a counterweight structure 108b at the lower part. The connecting part of the clamping structure 108a and the counterweight structure 108b is movably connected to a rotating shaft 108c and can rotate around the rotating shaft 108c. When the substrate chuck 101 rotates, under the action of centrifugal force, the counterweight structure 108b will rotate outward away from the substrate chuck 101 and drive the clamping structure 108a to rotate inward to clamp the substrate 100; when the substrate chuck 101 is stationary, the counterweight structure 108b returns to its original position under the action of gravity, and the clamping structure 108a no longer clamps the substrate 100, so as to load and unload the substrate 100.

[0064] Optionally, a plurality of the static conductive seats 103a are arranged in pairs, and a plurality of the static conductive rods 103b are provided and correspond to the static conductive seats 103a one by one. Specifically, such as Figure 4As shown in the bottom view of the substrate chuck 101, in this embodiment, there are two electrostatic conduction seats 103a and the corresponding electrostatic conduction rods 103b, which are arranged in pairs. The electrostatic conduction seats 103a and the electrostatic conduction rods 103b need to be symmetrically distributed in the substrate chuck 101 to balance the weight of the substrate chuck 101, so that the substrate chuck 101 can maintain stability during rotation. In addition, the electrostatic conduction seats 103a may not be arranged in pairs, but the rotational balance of the substrate chuck 101 can be balanced by other weights provided on the substrate chuck 101. Figure 4 In, in addition to the electrostatic conduction seats 103a arranged in pairs, seats for receiving wafers are also provided at other positions on the edge of the chuck, and these seats do not need to have the function of electrostatic conduction. Figure 4 As shown, including the electrostatic conduction seats 103a, a total of 3 pairs of 6 seats are provided for receiving and placing wafers, and a positioning pin 108 and a pair of guide posts 109 are also configured at all seat positions.

[0065] As Figure 1 As shown, the electrostatic conduction substrate holding device further includes: a hollow housing 105, the hollow housing 105 is disposed around the periphery of the second electrostatic conduction structure 104 and is connected to the second electrostatic conduction structure 104 through a bearing 106, the second electrostatic conduction structure 104 is electrically connected to the bearing 106, and the bearing 106 is electrically connected to the hollow housing 105.

[0066] Optionally, there are two bearings 106, namely a first bearing 106a and a second bearing 106b. The first bearing 106a is disposed at one end of the hollow housing 105 close to the substrate chuck 101, and the second bearing 106b is disposed at one end of the hollow housing 105 far from the substrate chuck 101. In this embodiment, by providing a bearing at each of the upper and lower ends of the hollow housing 105, compared with a single bearing, the stability of the rotating structure is enhanced. In other embodiments of the present invention, the number of bearings can also be changed according to actual needs. For example, the number of bearings can be increased to further enhance the stability of the rotating structure, or a single bearing can be provided to simplify the device structure and reduce costs.

[0067] As an example, the static electricity on the substrate 100 is conducted to the hollow housing 105 through the static-conductive seat 103a, the static-conductive rod 103b, the second static-conductive structure 104, and the bearing 106. That is to say, in the present invention, the bearing 106 not only participates in forming the rotating structure but also is a part of the static-conductive structure. Specifically, each of the above structures through which the static electricity passes is made of a conductive material. Optionally, the bearing 106 is a metal bearing, which can be a ball bearing or a roller bearing with cylindrical or conical rollers. Considering that the bearing 106 also needs to participate in static conduction, its lubricating medium can also be a conductive lubricating oil containing a conductive medium, so that static electricity can be smoothly conducted through the bearing 106.

[0068] On the other hand, in a rotating structure using a bearing, since the lubricating oil volatilizes and grease small particles are generated due to friction when the bearing 106 rotates. The volatilized lubricating oil or grease small particles will be discharged through the gap between the hollow rotating shaft 105 and the central rotating shaft 102. Once they reach the surface of the wafer, it is possible to cause grease contamination on the wafer surface. In addition, mechanical friction of the rotating structure may also generate particulate contamination, which will also become a source of particulate contamination on the wafer surface. In response to this, the present invention also specifically introduces a device structure for preventing the above-mentioned contamination.

[0069] As Figure 1 and Figure 5 shown, the static-conductive substrate holding device further includes: a sealing housing 107, the sealing housing 107 is disposed around the periphery of the second static-conductive structure 104 and fixedly connected to the hollow housing 105, and the sealing housing 107 is located between the substrate chuck 101 and the bearing 106 in the axial direction of the central rotating shaft 102.

[0070] As Figure 5 shown, it is Figure 1 a partial enlarged view of area A in Figure 1 and Figure 5 It can be seen that the inner wall of the sealing housing 107 close to the central rotating shaft 102 is provided with a first annular sealing tooth 107a surrounding the central rotating shaft 102, and the outer wall of the second static-conductive structure 104 away from the central rotating shaft 102 is provided with a second annular sealing tooth 104a surrounding the central rotating shaft 102. The first annular sealing tooth 107a and the second annular sealing tooth 104a are staggered with each other in the axial direction of the central rotating shaft 102 and isolate the substrate chuck 101 and the bearing 106.

[0071] Optionally, there are multiple first annular sealing teeth 107a and second annular sealing teeth 104a. In this embodiment, three first annular sealing teeth 107a and three second annular sealing teeth 104a are provided respectively. As can be seen from Figure 5 it, the three first annular sealing teeth 107a and the three second annular sealing teeth 104a are arranged alternately and isolate the substrate chuck and the bearing in the axial direction of the central rotating shaft 102. Of course, in the present invention, the number of the first annular sealing teeth 107a and the second annular sealing teeth 104a can be changed according to actual needs. For example, when there is more lubricating oil overflowing from the bearing, the number of sealing teeth can be further increased to improve the isolation effect.

[0072] Optionally, there is a gap between the alternately arranged first annular sealing teeth 107a and second annular sealing teeth 104a, and the gap forms a flow channel. That is, the first annular sealing teeth 107a and the second annular sealing teeth 104a do not directly contact each other to avoid mechanical friction therebetween. The flow channel can also improve the heat dissipation condition of the bearing position during rotation, increase the service life of components, and reduce the device maintenance frequency.

[0073] As an example, the sealing housing 107 is composed of two paired semi-circular housings. The two semi-circular housings are mutually held and connected to the periphery of the second static conductive structure 104 and are fixedly connected to the hollow outer shell 105 in the axial direction of the central rotating shaft 102 through fasteners. By providing the sealing housing 107 composed of detachable paired semi-circular housings, the present invention simplifies the operation of device maintenance, enabling hidden components such as the bearing covered by the sealing housing 107 to be conveniently exposed and maintained. It should be noted that in other embodiments of the present invention, the sealing housing 107 and the hollow outer shell 105 can also be integrally formed, which can greatly simplify the device structure and reduce the device manufacturing cost without considering the device detachable property.

[0074] As an example, as Figure 1 shown, the static conductive substrate holding device further includes a base 110, and the hollow outer shell 105 is electrically connected and fixed to the base 110. Specifically, the base 110 itself is grounded. During the process flow, the static electricity remaining on the substrate 100 is transmitted to the grounded base 110 through the static conductive seat 103a, the static conductive rod 103b, the second static conductive structure 104, the bearing 106, and the hollow outer shell 105, so that the static electricity of the substrate 100 is released, thereby improving the static electricity protection performance of the device.

[0075] In this embodiment, by using the bearing 106 as the connecting component between the second static conductive structure 104 and the hollow housing 105, the friction coefficient of the rotating structure is reduced, ensuring the stability of the system; the bearing 106 also serves as a component of the static conductive structure, conducting static electricity from the second static conductive structure 104 to the hollow housing 105, and through the first annular sealing teeth 107a and the second annular sealing teeth 104a provided on the sealing housing 107 and the second static conductive structure 104, the risk of contamination by grease or particulate matter brought by rotating structure components such as bearings is avoided.

[0076] Embodiment 2

[0077] Please refer to Figure 6 , this embodiment provides a static conductive substrate holding device. Compared with Embodiment 1, the difference in this embodiment is that there are 3 pairs in total, 6 in number, of the static conductive seats and the corresponding static conductive rods provided in pairs. As Figure 6 shown, it is the bottom view of the substrate chuck provided in this embodiment. It can be seen in Figure 6 that a total of 6 static conductive rods 203b are provided below the substrate chuck, and these static conductive rods 203b are provided in pairs and evenly distributed below the substrate chuck. The corresponding positioning pins 208 and guide posts 209 are also provided at the edge position of the substrate chuck. Each static conductive rod 203b has a corresponding static conductive seat provided thereto.

[0078] In this embodiment, compared with Embodiment 1, by introducing additional static conductive seats and static conductive rods, the static conductive performance of the static conductive substrate holding device is enhanced, ensuring that no static electricity remains on the surface of the wafer. It should be noted that the number of the static conductive seats and the static conductive rods is not limited to the number exemplified in this embodiment, and in other embodiments of the present invention, it can also be increased or decreased according to specific needs. In addition, the first static conductive structure in the present invention is not limited to being realized by the static conductive rods. For example, what connects the static conductive seat and the second static conductive structure can also be a conductive plate covering the entire bottom surface of the substrate chuck. The conductive plate can be a solid plate or a hollow grid structure.

[0079] Other implementation schemes of this embodiment are the same as those of Embodiment 1 and will not be elaborated here.

[0080] In summary, the present invention provides an electrostatic conductive substrate holding device, comprising: a substrate chuck for fixing and driving the rotation of the substrate; a central rotating shaft, one end of the central rotating shaft is connected to the substrate chuck for driving the rotation of the substrate chuck; an electrostatic conductive structure, the electrostatic conductive structure includes a first electrostatic conductive structure and a second electrostatic conductive structure, the first electrostatic conductive structure is used for electrically connecting the substrate and the second electrostatic conductive structure, the second electrostatic conductive structure is disposed around the periphery of the central rotating shaft and fixedly connected to the outer wall of the central rotating shaft; a hollow outer shell, the hollow outer shell is disposed around the periphery of the second electrostatic conductive structure and connected to the second electrostatic conductive structure through a bearing, the second electrostatic conductive structure is electrically connected to the bearing, and the bearing is electrically connected to the hollow outer shell; a sealing housing, the sealing housing is disposed around the periphery of the second electrostatic conductive structure and fixedly connected to the hollow outer shell, and the sealing housing is located between the substrate chuck and the bearing in the axial direction of the central rotating shaft; a first annular sealing tooth surrounding the central rotating shaft is provided on the inner wall of the sealing housing close to the central rotating shaft, and a second annular sealing tooth surrounding the central rotating shaft is provided on the outer wall of the second electrostatic conductive structure away from the central rotating shaft, the first annular sealing tooth and the second annular sealing tooth are staggered with each other in the axial direction of the central rotating shaft and isolate the substrate chuck from the bearing. By using a bearing as the electrostatic conductive structure for the transition between the rotating part and the non-rotating part, the present invention enables the rotating structure and the electrostatic conductive structure to be well compatible; the staggered first annular sealing tooth and the second annular sealing tooth also ensure that the lubricating oil in components such as the bearing will not contaminate the wafer during operation.

[0081] The above embodiments are only illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. An electrostatic conductive substrate holding device, characterized in that, Comprising: A substrate chuck for fixing and driving the rotation of the substrate; A central rotating shaft, one end of the central rotating shaft is connected to the substrate chuck for driving the rotation of the substrate chuck; An electrostatic conduction structure, the electrostatic conduction structure includes a first electrostatic conduction structure and a second electrostatic conduction structure, the first electrostatic conduction structure is used for electrically connecting the substrate and the second electrostatic conduction structure, and the second electrostatic conduction structure is disposed around the periphery of the central rotating shaft and fixedly connected to the outer wall of the central rotating shaft; A hollow outer shell, the hollow outer shell is disposed around the periphery of the second electrostatic conduction structure and connected to the second electrostatic conduction structure through a bearing, the second electrostatic conduction structure is electrically connected to the bearing, and the bearing is electrically connected to the hollow outer shell; A sealed housing, the sealed housing is disposed around the periphery of the second electrostatic conduction structure and fixedly connected to the hollow outer shell, and the sealed housing is located between the substrate chuck and the bearing in the axial direction of the central rotating shaft; The inner wall of the sealed housing close to the central rotating shaft is provided with a first annular sealing tooth surrounding the central rotating shaft, and the outer wall of the second electrostatic conduction structure away from the central rotating shaft is provided with a second annular sealing tooth surrounding the central rotating shaft. The first annular sealing tooth and the second annular sealing tooth are staggered in the axial direction of the central rotating shaft and isolate the substrate chuck from the bearing.

2. The static conductive substrate holding device according to claim 1, characterized in that, The bearing includes a first bearing and a second bearing, the first bearing is disposed at one end of the hollow outer shell close to the substrate chuck, and the second bearing is disposed at one end of the hollow outer shell away from the substrate chuck.

3. The static conductive substrate holding device according to claim 1, characterized in that, The sealed housing is composed of two paired semi-circular housings, and the two semi-circular housings are mutually clamped and connected to the periphery of the second electrostatic conduction structure and fixedly connected to the hollow outer shell in the axial direction of the central rotating shaft through fasteners.

4. The static conductive substrate holding device according to claim 1, wherein The first annular sealing tooth and the second annular sealing tooth are multiple.

5. The static conductive substrate holding device according to claim 1, wherein A gap is left between the staggered first annular sealing tooth and the second annular sealing tooth, and a flow channel is formed by the gap.

6. The static conductive substrate holding device according to claim 1, wherein The first electrostatic conduction structure includes: An electrostatic conduction seat disposed at the edge of the substrate chuck for receiving and electrically connecting the substrate; An electrostatic conduction rod disposed below the substrate chuck for electrically connecting the electrostatic conduction seat and the second electrostatic conduction structure.

7. The static conductive substrate holding device according to claim 6, wherein The electrostatic conduction seats are multiple and are paired, and the electrostatic conduction rods are multiple and correspond to the electrostatic conduction seats one by one.

8. The static conductive substrate holding device according to claim 6, characterized in that, The static electricity on the substrate is led out to the hollow outer shell through the electrostatic conduction seat, the electrostatic conduction rod, the second electrostatic conduction structure and the bearing.

9. The static conductive substrate holding device according to claim 1, wherein, The substrate chuck is further provided with a positioning pin for clamping and fixing the substrate and a guide post for guiding and limiting the substrate to a set position.

10. The static conductive substrate holding device according to claim 1, characterized in that, The electrostatic conduction substrate holding device further includes a base, and the hollow outer shell is electrically connected to and fixed on the base.

Images