Operating mechanism and wafer adsorption device

Abstract

This invention relates to the field of automated equipment technology, and discloses a running mechanism and a wafer adsorption device. The running mechanism includes: an operating head, a first driving component connected to the rotating part of the operating head, and a second driving component configured to drive the operating head to slide. The second driving component is connected to the first driving component to drive the first driving component to slide along a first direction, and the first driving component drives the operating head to rotate around the first direction. The first driving component includes a hollow rotating shaft, and the operating head communicates with the rotating shaft to form a communicating cavity. Using the running mechanism provided by this invention, the second driving component drives the first driving component to slide along the first direction, thereby allowing the first driving component to adjust the displacement position of the operating head. Simultaneously, by driving the operating head to rotate around the first direction, the rotational position of the operating head can be adjusted, thereby achieving position calibration and resulting in high operational accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and in particular to an operating mechanism and a wafer adsorption device. Background Art

[0002] A die bonder is a device that fixes the chip on a substrate. The types of die bonders include upright die bonders and flip-chip die bonders. Among them, upright die bonders mainly use gold wires to connect the PN junction of the chip to the positive and negative poles of the bracket. The flip-chip die bonder mainly solders solder paste on the die bonding area of ​​the substrate, and then places the chip on the solder paste. The electrodes of the chip correspond to the solder paste, and after reflow soldering, the die is bonded. The upright die bonder does not need to calibrate the placed chip. After placing the chip on the bracket, the electrical connection of the chip can be achieved by bonding. The flip-chip die bonder requires the chip to be accurately placed on the solder paste. A slight deviation will cause the chip to be non-conductive.

[0003] The prior art crystal bonder includes an operating head and a swing arm, the operating head is fixedly mounted on the swing arm, the operating head adsorbs the wafer, and then the swing arm rotates to transfer the wafer. However, the prior art crystal bonder has the following technical problems: after the operating head adsorbs the wafer, during the process of the swing arm transferring the wafer, the adsorbed wafer will have displacement deviation and rotation angle deviation, thereby reducing the precision of crystal bonding, resulting in low accuracy of crystal bonding. Summary of the invention

[0004] In order to solve the technical problem of position calibration during operation, the present invention provides an operation mechanism and a wafer adsorption device.

[0005] In a first aspect, the present invention provides an operating mechanism, comprising:

[0006] An operating head, a first driving assembly connected to the operating head for rotational driving, and a second driving assembly configured to drive the operating head to slide; wherein,

[0007] The second driving assembly is connected to the first driving assembly to drive the first driving assembly to slide along a first direction, and the first driving assembly is used to drive the operating head to rotate around the first direction;

[0008] The first driving assembly includes a hollow rotating shaft, and the operating head is connected to the rotating shaft to form a connected cavity.

[0009] Optionally, the operating head comprises:

[0010] A core part, wherein the core part has an opening and a core inner cavity communicating with the opening; the core part is communicated with the rotating shaft to form a communicating cavity;

[0011] A first fixing sleeve, wherein the core is inserted into the first fixing sleeve, and the first fixing sleeve is connected to the rotating shaft.

[0012] Optionally, the operating mechanism further includes a first sensor, and the first sensor is used to control the second driving assembly to complete a first preset fixed stroke.

[0013] Optionally, the first sensor includes one or more of a photoelectric encoder or a magnetic grating encoder.

[0014] Optionally, the operating mechanism further includes a second sensor, and the second sensor is used for real-time monitoring of the operating state of the second drive component in a second preset stroke and controlling the operation of the second drive component.

[0015] Optionally, the second sensor includes one or more of a pressure sensor, a force feedback sensor, and a current sensor.

[0016] Optionally, the operating mechanism further includes a controller, which is mounted on the second driving component and is provided with a power supply interface and a network cable interface.

[0017] Optionally, the first driving assembly further includes a joint and an adapter block, the joint is mounted on the adapter block, and the adapter block is connected to the rotating shaft.

[0018] Optionally, the operating mechanism further includes a first base and a second base, the first drive assembly is mounted on the first base, and the second drive assembly is mounted on the second base and connected to the first drive assembly.

[0019] In a second aspect, the present invention provides a wafer adsorption device, comprising: an operating head, a first driving component connected to the operating head for rotational driving, a second driving component configured to drive the operating head to slide, and a negative pressure air pipe; wherein,

[0020] The second driving assembly is connected to the first driving assembly to drive the first driving assembly to slide along a first direction, and the first driving assembly is used to drive the operating head to rotate around the first direction; the first driving assembly includes a hollow rotating shaft, the operating head is connected to the rotating shaft to form a connected cavity, and the negative pressure air pipe is used to suck the cavity to form a vacuum.

[0021] The above technical solution provided by the embodiment of the present invention has the following advantages compared with the prior art:

[0022] The operating mechanism and wafer adsorption device provided by the embodiment of the present invention, wherein the operating mechanism includes: an operating head, a first drive assembly connected to the operating head for rotational driving, and a second drive assembly configured to drive the operating head to slide; wherein the second drive assembly is connected to the first drive assembly to drive the first drive assembly to slide along the first direction, and the first drive assembly is used to drive the operating head to rotate around the first direction; the first drive assembly includes a hollow rotating shaft, and the operating head is connected to the rotating shaft to form a connected cavity. Utilizing the operating mechanism provided by the embodiment of the present invention, the first drive assembly is driven to slide along the first direction by the second drive assembly, so that the first drive assembly can adjust the displacement position of the operating head, and at the same time, the first drive assembly drives the operating head to rotate around the first direction, so that the rotation position of the operating head can be adjusted, thereby realizing position calibration, and improving the accuracy of the operation of the operating mechanism during operation. At the same time, the first drive assembly includes a hollow rotating shaft, and the operating head is connected to the rotating shaft, and vacuum adsorption or liquid injection can be performed through the rotating shaft for spraying. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] In the attached figure:

[0026] Figure 1 is a structural schematic diagram of an operating mechanism provided by an embodiment of the present invention;

[0027] Figure 2 is an exploded diagram of the operating mechanism provided by an embodiment of the present invention;

[0028] Figure 3 is a schematic structural diagram of a first drive assembly and an operating head provided in an embodiment of the present invention;

[0029] Figure 4 is an exploded view of a first drive assembly and an operating head provided in an embodiment of the present invention;

[0030] Figure 5 It is a schematic diagram of the structure of the second driving component provided in an embodiment of the present invention.

[0031] Reference numerals:

[0032] 100, operating mechanism; 110, operating head; 120, first driving assembly; 130, second driving assembly; 140, first base; 150, second base; 160, first sensor;

[0033] 111, core; 112, first fixed sleeve; 113, second fixed sleeve;

[0034] 121, first driving member; 122, rotating shaft; 123, joint; 124, adapter block; 125, sealing ring; 126, optical observation window;

[0035] 161. Grating scale; 162. Grating scale reading head; 163. Reading head base. DETAILED DESCRIPTION

[0036] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the device or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present invention.

[0037] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", etc. can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0038] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0039] refer to Figures 1 to 5 According to the operating mechanism 100 provided in the embodiment of the present invention, it includes: an operating head 110, a first driving assembly 120 connected to the operating head 110 for rotational driving, and a second driving assembly 130 configured to drive the operating head 110 to slide. Among them, the second driving assembly 130 is connected to the first driving assembly 120 to drive the first driving assembly 120 to slide along the first direction, and the first driving assembly 120 is used to drive the operating head 110 to rotate around the first direction; the first driving assembly 120 includes a hollow rotating shaft 122, and the operating head 110 is connected to the rotating shaft 122 to form a connected cavity. Using the operating mechanism 100 provided in the embodiment of the present invention, the first driving assembly 120 is driven to slide along the first direction by the second driving assembly 130, so that the first driving assembly 120 drives the operating head 110 to slide along the first direction, and the second driving assembly 130 can also drive the operating head 110 to rotate around the first direction, thereby realizing the position calibration of the operating head 110. At the same time, the hollow rotating shaft 122 is connected to the operating head 110, so that gas can be sucked through the rotating shaft 122, so that the operating head 110 can perform vacuum negative pressure adsorption, or vacuum positive pressure blowing, or liquid can be introduced through the rotating shaft 122 and sprayed out from the operating head 110.

[0040] The first direction may be a horizontal direction. In a specific embodiment, reference Figure 1 The first direction may also be a vertical direction, that is, the first direction is the A direction shown in the figure, and the second direction is the B direction shown in the figure. The first direction is a direction parallel to the central axis L of the operating head 110. The second direction is a direction of rotation around the central axis L of the operating head 110.

[0041] The second drive assembly 130 drives the first drive assembly 120 to slide along the first direction, so that the first drive assembly 120 drives the operating head 110 to slide along the first direction. Specifically, the second drive assembly 130 drives the first drive assembly 120 to move linearly along the first direction. The second drive assembly 130 includes a linear motor or a voice coil motor, and the linear motor can drive the first drive assembly 120 to perform linear reciprocating operation. The first drive assembly 120 includes a first drive member 121 and a rotating shaft 122, and the first drive member 121 includes a rotating motor, and the rotating motor drives the rotating shaft 122 to perform rotational motion.

[0042] The operating head 110 includes a core 111 and a first fixed sleeve 112. The core 111 has an opening and a core cavity connected to the opening; the core 111 is connected to the rotating shaft 122 to form a connected cavity; the core 111 is inserted into the first fixed sleeve 112, and the first fixed sleeve 112 is connected to the rotating shaft 122. Specifically, the core 111 is a hollow columnar structure, the columnar structure has a hollow core cavity, both sides of the columnar structure are provided with openings, and the core cavity is connected to the openings on both sides. In this way, the opening on one side of the columnar structure is connected to the rotating shaft 122, and the opening on the other side of the columnar structure is connected to the core cavity, so that gas, liquid and / or light beam can pass through the core cavity and the opening. For example, for gas or liquid, it can flow out with positive pressure or be inhaled with negative pressure. For light beams, they can be irradiated through the openings.

[0043] The core 111 is inserted into the first fixing sleeve 112, and the core 111 and the first fixing sleeve 112 can be fixedly connected by interference fit. In a specific embodiment, the operating head 110 also includes a second fixing sleeve 113, and the second fixing sleeve 113 is sleeved on the circumference of the first fixing sleeve 112. The first fixing sleeve 112 is a chuck-shaped cylindrical structure, and one end of the first fixing sleeve 112 has a chamfered slope. The second fixing sleeve 113 is a nut, and one end of the internal thread of the nut has a slope, and the core 111 is clamped by pressing the chamfered slope of the first fixing sleeve 112 with the slope of the second fixing sleeve 113.

[0044] The operating mechanism 100 also includes a first sensor 160, which is used to control the second drive assembly 130 to complete a first preset stroke. The first sensor 160 can realize a coarse adjustment of the displacement of the second drive assembly 130, such as presetting the numerical range of the first preset stroke to 5 cm, so that the second drive assembly 130 reaches a preset specific position after moving 5 cm. Of course, the numerical value of the first preset stroke can also be set to other numerical values, such as 4 cm or 6 cm. The first sensor 160 controls the second drive assembly 130 to complete the first preset stroke. When the second drive assembly 130 completes the first preset stroke, the second drive assembly 130 synchronously drives the first drive assembly 120 to complete the first preset stroke, and the first drive assembly 120 drives the operating head 110 to complete the first preset stroke, so that the operating head 110 approaches the target position.

[0045] The first sensor 160 includes one or more of a photoelectric encoder or a magnetic grating encoder. An encoder is a device that compiles signals or data and converts them into a signal form that can be used for communication, transmission and storage. The encoder includes one or more of a photoelectric encoder or a magnetic grating encoder. The advantages of a photoelectric encoder are small size, high precision, high resolution, non-contact, and no wear. The advantages of a magnetic grating encoder are moderate size, non-contact, no wear, and resistance to harsh environments.

[0046] refer to Figure 2 The photoelectric encoder includes a grating ruler 161, a grating ruler reading head 162, and a reading head base 163. The grating ruler reading head 162 is mounted on the reading head base 163, and the reading head base 163 is mounted on the second base 150. The grating ruler 161 is mounted above the grating ruler reading head 162. In this way, the grating ruler 161 can detect the displacement of the first base 140.

[0047] The operating mechanism 100 further includes a second sensor (not shown), which is used to monitor the operating state of the second drive assembly 130 in the second preset stroke in real time and control the operation of the second drive assembly 130. After the second drive assembly 130 is roughly adjusted, the second sensor can be used to accurately control the stop position of the second drive assembly 130 in the second preset stroke, so that the displacement of the second drive assembly 130 can be finely adjusted.

[0048] In a specific embodiment, the numerical range of the second preset stroke is smaller than the numerical range of the first preset stroke, and by real-time monitoring the running state of the second drive assembly 130 in the second preset stroke, the second drive assembly 130 is controlled to drive the first drive assembly 120 to also achieve fine adjustment of the displacement, thereby making the position calibration of the operating head 110 more accurate. In a specific embodiment, the numerical range of the second preset stroke can be preset to 0.1 cm, so that the displacement of the second drive assembly 130 controlled by the second sensor can be less than or equal to 0.1 cm.

[0049] By real-time monitoring the operation of the second drive assembly 130 in the second preset stroke, the second drive assembly 130 is controlled to drive the first drive assembly 120 to achieve fine adjustment of the displacement, thereby making the position calibration of the operating head 110 more accurate.

[0050] For example, the value of the second preset stroke is 0.1 cm. When the second driving component 130 is running for 0.1 cm, if the second sensor is triggered (such as the operating head 110 touches the substrate), the operation is interrupted. In this way, precise control is achieved without knowing the exact height in advance. If the second sensor is not triggered, the second driving component stops running for 0.1 cm.

[0051] The second sensor includes one or more of a pressure sensor, a force feedback sensor, and a current sensor. The second sensor may be disposed on the circumference of the core 111 , or may be disposed on the second driving assembly 130 .

[0052] The operating mechanism 100 also includes a controller, which is mounted on the second drive assembly 130 and electrically connected to the second drive assembly 130. The controller is provided with a power interface and a network cable interface. The power interface can be connected to a 24V voltage, and the network cable interface can be connected to an external network to achieve a communication function. The network cable interface can be connected via a CAN bus or an Ethercat bus.

[0053] The first driving assembly 120 further includes a joint 123 and an adapter block 124, wherein the joint 123 is mounted on the adapter block 124, and the adapter block 124 is connected to the rotating shaft 122. The adapter block 124 is used to control the gas, liquid, etc. introduced into the rotating shaft 122. The joint 123 can be connected to an external vacuum generator, or to an external water pump to introduce water into the adapter block 124.

[0054] The operating mechanism 100 further includes a first base 140 and a second base 150 . The first driving assembly 120 is mounted on the first base 140 . The second driving assembly 130 is mounted on the second base 150 and connected to the first driving assembly 120 .

[0055] The second driving assembly 130 includes a linear motor, which includes a coil and a magnet, wherein the coil is arranged around the circumference of the magnet. Specifically, the linear motor includes a stator and a mover, wherein the stator is fixedly connected to the second base 150, and the mover is connected to the first base 140. The movement of the mover drives the first base 140 to move relative to the second base 150.

[0056] The first drive assembly 120 also includes an optical observation window 126. The optical observation window 126 is arranged on the adapter block 124 and on a side away from the core 111. The optical observation window 126 is made of glass, and the light transmittance of the glass is as high as 96%, which can facilitate the observation of the wafer adsorption situation. Of course, the optical observation window 126 can also be made of other materials with high light transmittance. Through the optical observation window 126, it is possible to check whether the core 111 adsorbs the wafer, or to detect whether the core 111 is blocked. The optical observation window 126 is fixedly mounted on the adapter block 124. Specifically, the optical observation window 126 is fixedly mounted on the adapter block 124 by screws.

[0057] In order to improve the airtightness in the rotating shaft 122, the first driving assembly 120 further includes a sealing ring 125, and a sealing ring 125 is provided between the optical observation window 126 and the adapter block 124. The sealing ring 125 is used to seal the gap between the optical observation window 126 and the adapter block 124 to improve the airtightness in the adapter block 124, thereby improving the efficiency of wafer adsorption. In a specific embodiment, the number of sealing rings 125 can be set to 3, which can achieve a better sealing effect.

[0058] The embodiment of the present invention also provides a wafer adsorption device, comprising: an operating head 110, a first drive assembly 120 connected to the operating head 110 for rotational driving, a second drive assembly 130 configured to drive the operating head 110 to slide, and a negative pressure air pipe; wherein the second drive assembly 130 is connected to the first drive assembly 120 to drive the first drive assembly 120 to slide along a first direction, and the first drive assembly 120 is used to drive the operating head 110 to rotate around the first direction; the first drive assembly 120 includes a hollow shaft 122, the operating head 110 is connected to the shaft 122 to form a connected cavity, and the negative pressure air pipe is used to suck the cavity to form a vacuum. In this way, the rotation angle of the operating head 110 is adjusted by the first drive assembly 120, thereby adjusting the rotation position of the wafer, so that the wafer can be accurately placed on the contact point to achieve electrical contact and conduction of the wafer.

[0059] During the crystal bonding process, the wafer adsorption device adsorbs the wafer on the crystal disk, thereby transferring the wafer on the crystal disk to the crystal bonding disk. Since it is difficult for the crystal disk to be in an absolutely horizontal state when placed, the wafer placed on the crystal disk is not in an absolutely horizontal state, and there will be a height difference between the multiple wafers on the crystal disk. At this time, the displacement position of the operating head 110 is adjusted by the second drive component 130, and the interval between the operating head 110 and the crystal disk is adjusted, so that the operating head 110 can adsorb the wafer more accurately, avoiding excessive squeezing of the wafer by the operating head 110 during the adsorption process due to the tilt of the crystal disk, and preventing damage to the wafer.

[0060] It can be understood that the above embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the present invention. It should be pointed out that, for ordinary technicians in this field, the above technical features can be freely combined without departing from the concept of the present invention, and several deformations and improvements can be made, which all belong to the protection scope of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should belong to the coverage of the claims of the present invention.

Claims

1. A running mechanism, characterized in that: include: An operating head, a first driving assembly connected to the operating head for rotational driving, and a second driving assembly configured to drive the operating head to slide; wherein, The second driving assembly is connected to the first driving assembly to drive the first driving assembly to slide along a first direction, and the first driving assembly is used to drive the operating head to rotate around the first direction; The first drive assembly includes a hollow rotating shaft, and the operating head is connected to the rotating shaft to form a connected cavity; the first drive assembly also includes a joint and an adapter block, the joint is installed on the adapter block, and the adapter block is connected to the rotating shaft; the first drive assembly also includes an optical observation window, and the optical observation window is arranged on the adapter block; the optical observation window is made of a light-transmitting material; The operating head comprises: A core part, wherein the core part has an opening and a core inner cavity communicating with the opening; the core part is communicated with the rotating shaft to form a communicating cavity; a first fixing sleeve, wherein the core is inserted into the first fixing sleeve, and the first fixing sleeve is connected to the rotating shaft; The operating head further comprises a second fixing sleeve, which is sleeved on the circumference of the first fixing sleeve; the first fixing sleeve is a chuck-shaped cylindrical structure, and one end of the first fixing sleeve has a chamfered slope; the second fixing sleeve is a nut, and one end of the internal thread of the nut has a slope, and the slope of the second fixing sleeve presses the chamfered slope of the first fixing sleeve to clamp the core; The operating mechanism further includes a first sensor, which is used to control the second drive assembly to complete a first preset stroke; the operating mechanism further includes a second sensor, which is used to monitor the operating state of the second drive assembly in a second preset stroke in real time and control the operation of the second drive assembly; the numerical range of the second preset stroke is smaller than the numerical range of the first preset stroke; after the second drive assembly is roughly adjusted, the second sensor can be used to accurately control the stop position of the second drive assembly in the second preset stroke, so that the displacement of the second drive assembly can be finely adjusted; When the second drive component runs within the second preset stroke, if the second sensor is triggered, the operation of the second drive component is controlled to be interrupted; if the second sensor is not triggered, the operation of the second drive component is controlled to stop at the second preset stroke position.

2. The operating mechanism according to claim 1, characterized in that: The first sensor includes one or more of a photoelectric encoder and a magnetic grating encoder.

3. The operating mechanism according to claim 1, characterized in that: The second sensor includes one or more of a pressure sensor, a force feedback sensor, and a current sensor.

4. The operating mechanism according to claim 1, characterized in that: The operating mechanism further comprises a controller, which is mounted on the second driving assembly and is provided with a power supply interface and a network cable interface.

5. The operating mechanism according to claim 1, characterized in that: The operating mechanism further includes a first base and a second base, the first driving assembly is mounted on the first base, and the second driving assembly is mounted on the second base and connected to the first driving assembly.

6. A wafer adsorption device, characterized in that: include: An operating head, a first driving assembly connected to the operating head for rotational driving, a second driving assembly configured to drive the operating head to slide, and a negative pressure air pipe; wherein, The second driving assembly is connected to the first driving assembly to drive the first driving assembly to slide along a first direction, and the first driving assembly is used to drive the operating head to rotate around the first direction; the first driving assembly includes a hollow rotating shaft, the operating head is connected to the rotating shaft to form a connected cavity, and the negative pressure air pipe is used to suck the cavity to form a vacuum; The first driving assembly further includes a joint and an adapter block, wherein the joint is mounted on the adapter block, and the adapter block is connected to the rotating shaft; the first driving assembly further includes an optical observation window, wherein the optical observation window is arranged on the adapter block; the optical observation window is made of a light-transmitting material; The operating head comprises: A core part, wherein the core part has an opening and a core inner cavity communicating with the opening; the core part is communicated with the rotating shaft to form a communicating cavity; a first fixing sleeve, wherein the core is inserted into the first fixing sleeve, and the first fixing sleeve is connected to the rotating shaft; The operating head further comprises a second fixing sleeve, which is sleeved on the circumference of the first fixing sleeve; the first fixing sleeve is a chuck-shaped cylindrical structure, and one end of the first fixing sleeve has a chamfered slope; the second fixing sleeve is a nut, and one end of the internal thread of the nut has a slope, and the slope of the second fixing sleeve presses the chamfered slope of the first fixing sleeve to clamp the core; The wafer adsorption device further includes a first sensor, which is used to control the second drive assembly to complete a first preset stroke; the wafer adsorption device further includes a second sensor, which is used to monitor the operating state of the second drive assembly in a second preset stroke in real time and control the operation of the second drive assembly; the numerical range of the second preset stroke is smaller than the numerical range of the first preset stroke; after the second drive assembly is roughly adjusted, the second sensor can be used to accurately control the stop position of the second drive assembly in the second preset stroke, so that the displacement of the second drive assembly can be finely adjusted; When the second drive component runs within the second preset stroke, if the second sensor is triggered, the operation of the second drive component is controlled to be interrupted; if the second sensor is not triggered, the operation of the second drive component is controlled to stop at the second preset stroke position.

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