Fabric-based article with array of electronic components

Abstract

This application relates to fabric-based articles having an array of electronic components. More specifically, a fabric-based article that can include a fabric layer and other material layers is disclosed. An array of electronic components can be mounted in the fabric-based article. The electronic components can be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit can have a grid shape formed by an array of openings. Serpentine flexible printed circuit segments can extend between the openings. The electronic components can be light emitting diodes or other electronic devices. A polymer having light scattering particles or other materials can cover the electronic components. The flexible printed circuit can be laminated between the fabric layer or other material layers in the fabric-based article.

Description

[0001] This application is a divisional application of Chinese patent application 201680048969.3, filed on August 17, 2016, entitled "Fabric-based article with array of electronic components".

[0002] This patent application claims priority to U.S. Provisional Patent Application No. 62 / 207,499, filed August 20, 2015, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This patent application generally relates to fabric-based articles, and more specifically to fabric-based articles having an array of electronic components. Background Technology

[0004] It may be desirable to form furniture, clothing, and other items from materials such as fabrics. Fabric-based items typically do not include electronic components. However, it may be desirable to incorporate electronic components into fabric-based items to provide users with fabric-based items with enhanced functionality.

[0005] Integrating electronic components into fabric-based articles can be challenging. Fabric is soft, making it difficult to mount structures onto it. Electronic components must be coupled to signal paths, which can be damaged by bending and stretching the fabric unless handled with great care.

[0006] Therefore, it is expected that improved technologies can be provided for integrating electronic components into fabric-based articles. Summary of the Invention

[0007] Fabric-based articles may include electronic components. For example, fabric-based articles may have an array of electronic components and one or more fabric layers. The fabric layers may serve as a substrate for the electronic components or as a support structure on which the electronic components are mounted.

[0008] The electronic component can be mounted to a supporting structure such as a flexible printed circuit. The flexible printed circuit can have a grid pattern formed by an array of openings. Winding flexible printed circuit segments can extend between these openings and interconnect portions of the flexible printed circuit to which the electronic component has been soldered.

[0009] The electronic component can be a light-emitting diode or other electronic device. A polymer containing light-scattering particles or other materials can cover the electronic component. The flexible printed circuit and component array can be laminated between layers of fabric or other materials. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of an exemplary fabric-based article according to an implementation scheme.

[0011] Figure 2 A side view of an exemplary fabric according to an implementation scheme.

[0012] Figure 3 A side view of a material layer that can be incorporated into a fabric-based article according to the implementation scheme.

[0013] Figure 4 This is a cross-sectional side view of an exemplary electronic component according to an implementation scheme.

[0014] Figure 5 A cross-sectional side view of an exemplary electronic component of an electronic device mounted on an inserter according to an embodiment.

[0015] Figure 6 A cross-sectional side view of an exemplary electronic component having multiple electronic devices mounted on an inserter according to an embodiment.

[0016] Figure 7 This is a cross-sectional side view of an exemplary electronic component mounted on a substrate and covered with polymer beads according to an embodiment.

[0017] Figure 8 A cross-sectional side view of an exemplary electronic component that utilizes polymer beads, such as translucent polymer beads, to cover and overlap with polymer beads, such as opaque polymer beads, according to an embodiment.

[0018] Figure 9 A perspective view of a material layer in a fabric-based article including an array of electronic components, according to an embodiment.

[0019] Figure 10 The image is a cross-sectional side view of an exemplary fabric layer according to an embodiment, illustrating how strands of conductive material, such as conductive yarns, can be selectively introduced onto the surface of the fabric layer and used to form contact points, such as solder pads, for coupling to electronic components.

[0020] Figure 11 The following is a cross-sectional side view of an exemplary fabric layer according to an embodiment, which has areas where additional material strands, such as floating conductive warp yarns, are being bonded to form contact points, such as solder pads.

[0021] Figure 12 A cross-sectional side view of an array of electronic components covered and embedded in a polymer or other material according to an embodiment.

[0022] Figure 13 A cross-sectional side view of an exemplary substrate layer that is filled with an array of electronic components and covered with a material layer such as a polymer layer, according to an embodiment.

[0023] Figure 14 A cross-sectional side view of an exemplary substrate layer that is filled with an array of electronic components according to an embodiment and has a lower surface covered with a material layer such as a polymer layer.

[0024] Figure 15 A cross-sectional side view of an exemplary array of electronic components mounted on a substrate, such as a flexible polymer substrate, which may be provided with an optional array of openings to enhance flexibility, according to an embodiment.

[0025] Figure 16 A perspective view of an exemplary grid-shaped (grid-patterned) flexible substrate filled with an array of electronic components according to an embodiment.

[0026] Figure 17 An exploded perspective view of an exemplary grid-shaped (grid-patterned) flexible substrate and associated material layers such as fabric layers or other flexible layers with matching contact pads, according to an embodiment.

[0027] Figure 18 This is a cross-sectional side view of an exemplary array of electronic components mounted on a flexible substrate and laminated between fabric layers, according to an embodiment. Detailed Implementation

[0028] Items such as Figure 1 Article 10 may be based on fabric. Article 10 may be an electronic device or an accessory to an electronic device, such as a laptop computer; a computer monitor containing an embedded computer; a tablet computer; a cellular phone; a media player; or other handheld or portable electronic devices; smaller devices, such as wristwatches, hanging devices, headphones or handsets, devices embedded in glasses, or other devices worn on a user's head; or other wearable or micro-devices; a television set; a computer monitor that does not contain an embedded computer; a gaming device; a navigation device; an embedded system, such as a system in which the fabric-based article 10 is installed in an information kiosk, a car, an airplane, or other means of transportation; other electronic devices, or devices that perform the functions of two or more of these devices. If desired, item 10 may be a removable housing for an electronic device, may be a strip, may be a wristband or headband, may be a removable cover for a device, may be a housing or bag having a strip or other structure for receiving and carrying electronic devices and other items, may be a necklace or armband, may be a wallet, sleeve, pocket, or other structure into which electronic devices or other items may be inserted, may be part of a chair, sofa, or other seating (e.g., a cushion or other seating structure), may be part of clothing or other wearable items (e.g., a hat, belt, wristband, headband, etc.), or may be any other suitable fabric-based item.

[0029] Article 10 may include entangled strands of material such as monofilaments and yarns forming fabric 12. Fabric 12 may form all or part of a housing wall or other layer in an electronic device, may form an internal structure in an electronic device, or may form other fabric-based structures. Article 10 may be soft (e.g., article 10 may have a fabric surface for producing a light touch), may be rigid (e.g., the surface of article 10 may be formed of a rigid fabric), may be rough, may be smooth, may have ribs or other patterned textures, and / or may be formed as part of a device having portions formed of non-woven structures of plastic, metal, glass, crystalline materials, ceramics, or other materials.

[0030] The material strands in fabric 12 may be monofilament strands (sometimes referred to as fibers), or may be yarns or other strands formed by intertwining multiple material filaments together. Examples of fabric 12 formed from yarns are sometimes described herein as examples. However, these are merely illustrative. If desired, the yarn-based fabric for article 10 may be formed partially or entirely from monofilaments.

[0031] The yarns in fabric 12 may be formed from polymers, metals, glass, graphite, ceramics, natural materials (such as cotton or bamboo), or other organic and / or inorganic materials, and combinations thereof. Conductive coatings, such as metallic coatings, may be formed on non-conductive materials. For example, plastic yarns and monofilaments in fabric 12 may be coated with metal to make them conductive. Reflective coatings, such as metallic coatings, may be applied to make the yarns and monofilaments reflective. The yarns may be formed from a bundle of bare metal wires or metal wires entangled with insulating monofilaments (as an example).

[0032] Yarns can be wound together using entanglement equipment such as braiding, knitting, or knotting equipment to form fabric 12. The entangled yarns can, for example, form a woven fabric. Conductive and insulating yarns can be braided, knitted, or otherwise entangled to form contact pads that can be electrically coupled to conductive structures (such as contact pads for electronic components) in article 10.

[0033] Conductive and insulating yarns can also be braided, knitted, or otherwise entangled to form conductive paths. These conductive paths can be used to form signal paths (e.g., signal buses, power lines, etc.), to form part of capacitive touch sensor electrodes, resistive touch sensor electrodes, or other input-output devices, or to form other patterned conductive structures. The conductive structures in fabric 12 can be used to carry power signals, digital signals, analog signals, sensor signals, control signals, data, input signals, output signals, or other suitable electrical signals.

[0034] Article 10 may include additional mechanical structures 14, such as polymer adhesives for holding yarns together in fabric 12, support structures (such as frame members), housing structures (e.g., electronic device housings), and other mechanical structures.

[0035] To enhance the mechanical robustness and conductivity of yarn-to-yarn connections, additional structures and materials (such as solder, crimped metal connections, welded components, conductive adhesives (such as anisotropic conductive films and other conductive adhesives), non-conductive adhesives, fasteners, etc.) can be used to facilitate the formation of these connections. These yarn-to-yarn connections can be formed at locations where yarns intersect perpendicularly or at intersections of other yarns where a connection is desired. Where yarn-to-yarn connections are not desired, insulating material can be inserted between intersecting conductive yarns. This insulating material can be a plastic dielectric or other dielectric, and may include insulated yarns or conductive yarns with an insulating coating or insulated conductive monofilaments. Solder connections can be formed between conductive yarns by melting solder and allowing it to flow onto the conductive yarns. The solder can be heated using an induction welding head, a reflow oven, a laser or hot press, or other welding equipment. During welding, the outer dielectric coating (e.g., the outer polymer layer) can be melted away in the presence of molten solder, thereby allowing the underlying metal yarns to be welded together.

[0036] Circuit 16 may be included in article 10. Circuit 16 may include electronic components coupled to fabric 12, electronic components housed within a housing formed of fabric 12, or electronic components attached to fabric 12 using welding, solder joints, adhesives (e.g., conductive adhesives such as anisotropic conductive adhesives or other conductive adhesives), crimp connections, or other electronic and / or mechanical adhesives. Circuit 16 may include metallic structures for carrying current, electronic components (such as integrated circuits), light-emitting diodes, sensors, and other electronic devices. Control circuitry in circuit 16 may be used to control the operation of article 10 and / or support communication with article 18 and / or other devices.

[0037] Article 10 can interact with electronic devices or other attached articles 18. Article 18 can be attached to article 10, or article 10 and article 18 can be separate articles configured to operate on each other (e.g., when one article is a housing and the other is a device housed within that housing, etc.). Circuitry 16 may include an antenna and other structures for supporting wireless communication with article 18. Article 18 may also interact with article 10 using a wired communication link or other connection that allows the exchange of information.

[0038] In some cases, article 18 may be an electronic device, such as a cellular phone, computer, or other portable electronic device, and article 10 may form a cover, housing, bag, or other structure that receives the electronic device in a pocket, internal cavity, or other part of article 10. In other cases, article 18 may be a wristwatch device or other electronic device, and article 10 may be a strap or other fabric-based article attached to article 18 (e.g., article 10 and article 18 may together form a fabric-based article, such as a wristwatch with a strap). In still other cases, article 10 may be an electronic device, fabric 12 may be used to form the electronic device, and attached article 18 may include accessories or other devices that interact with article 10. Signal paths formed by conductive yarns and monofilaments may be used to route signals in article 10 and / or article 18.

[0039] The fabric constituting article 10 may be formed from yarns and / or monofilaments wound using any suitable entanglement device. Utilizing a suitable arrangement sometimes described herein as an example, fabric 12 may be a woven fabric formed using a loom. In this type of exemplary configuration, the fabric may have a plain weave, square weave, satin weave, twill weave, or variations thereof, may be a three-dimensional fabric, or may be other suitable fabrics.

[0040] Figure 2 A cross-sectional side view of an exemplary fabric 12 is shown in the figure. Figure 2 As shown, fabric 12 may include yarns or other material strands, such as warp yarns 20 and weft yarns 22. Figure 2 In the exemplary configuration, fabric 12 has a single layer of woven yarn. If desired, a multi-layer fabric construction can be used for fabric 12.

[0041] The fabric-based article 10 may include non-woven materials (e.g., structures formed from plastics, metals, glass, ceramics, crystalline materials such as sapphire). These materials can be formed through molding operations, machining, laser processing, and other manufacturing techniques. In some configurations, part or all of the fabric-based article 10 may include one or more layers of material such as Figure 3 Layer 24 may include layers of polymers, metals, glass, fabrics, adhesives, crystalline materials, ceramics; a substrate on which components are mounted; a patterned material layer; a material layer containing patterned metal traces, thin-film devices (such as transistors); and / or other layers.

[0042] Figure 4 A side view shows an exemplary electronic component of a type that can be used in the fabric-based article 10. The electronic component in article 10 includes, for example,... Figure 4Exemplary electronic components 26 may include discrete electronic components such as resistors, capacitors, and inductors; may include connectors; and may include input-output devices such as switches, buttons, light-emitting components (such as light-emitting diodes), audio components (such as microphones and speakers), vibrators (e.g., vibrating piezoelectric actuators), solenoids, electromechanical actuators, motors, and other electromechanical devices, microelectromechanical systems (MEMS) devices, pressure sensors, photodetectors, proximity sensors (light-based proximity sensors, capacitive proximity sensors, etc.), force sensors (e.g., piezoelectric sensors), strain gauges, humidity sensors, temperature sensors, accelerometers, gyroscopes, compasses, magnetic sensors (e.g., Hall effect sensors and magnetoresistive sensors such as giant magnetoresistive sensors), touch sensors, and other sensors, components forming a display, touch sensor arrays (e.g., an array of capacitive touch sensor electrodes forming a touch sensor that detects touch events in two dimensions), and other input-output devices, electronic components forming control circuitry such as non-volatile and volatile memories, microprocessors, application-specific integrated circuits, system-on-a-chip devices, baseband processors, wired and wireless communication circuits, and other integrated circuits. Electronic components such as component 26 may be semiconductor dies (e.g., laser dies, LED dies, integrated circuits, etc.) or packaged components (e.g., semiconductor dies or other devices encapsulated in plastic, ceramic, or other package structures). One or more electronic terminals, such as contact pads 30, may be formed on the body 28 of component 26. The body 28 may be a semiconductor die (e.g., laser die, LED die, integrated circuit, etc.) or a package for the component (e.g., a plastic or other dielectric package containing one or more semiconductor dies or other electronic devices). Contacts for the body 28, such as pads 30, may be protruding leads, flat contacts, may be formed in an array, may be formed on any suitable surface of the body 28, or any other suitable contact used to form an electrical connection with component 26. For example, pads 30 may be metal solder pads.

[0043] like Figure 5As shown in the example, the body 28 may be mounted on a support structure such as an interposer 36. The interposer 36 may be a printed circuit, a ceramic carrier, or another dielectric substrate. The interposer 36 may be larger than the body 28 or may have other suitable dimensions. The interposer 36 may have a planar shape with a thickness of 700 micrometers, greater than 500 micrometers, less than 500 micrometers, or other suitable thickness. The thickness of the body 28 may be 500 micrometers, greater than 300 micrometers, less than 1000 micrometers, or other suitable thickness. The occupied area (area seen from above) of the body 28 and the interposer 36 may be 10 micrometers × 10 micrometers, 100 micrometers × 100 micrometers, greater than 1 mm × 1 mm, less than 10 mm × 10 mm, and may be rectangular, square, L-shaped, or have other suitable shapes and sizes.

[0044] The interposer 36 may include signal paths such as metal traces 38. Metal traces 38 may have portions forming contact points such as pads 34 and 40. Pads 34 and 40 may be formed on the upper surface of the interposer 36, on the lower surface of the interposer 36, or on the sides of the interposer 36. A conductive material such as conductive material 32 may be used to mount the body 28 to the interposer 36. The conductive material 32 may be solder (e.g., low-temperature or high-temperature solder), a conductive adhesive (isotropic conductive adhesive or anisotropic conductive film) that may be formed during soldering, or other conductive material used to couple electronic device pads (body pads), such as pad 30 on the body 28, to the interposer pad 34. The metal traces 38 in the interposer 36 may couple pad 34 to other pads such as pad 40. If desired, pads 40 may be larger and / or wider spaced than pads 34, thereby facilitating the attachment of the interposer 36 to conductive yarns and / or other conductive paths in the article 10. Solder, conductive adhesive, or other conductive connectors may be used to couple pad 40 to conductive yarns, conductive monofilaments, printed circuit traces, or other conductive path materials in fabric-based article 10.

[0045] Figure 6 This illustrates how interposer 36 can be large enough to accommodate multiple electronic devices, each with its own respective body 28. For example, multiple light-emitting diodes, sensors, and / or other electronic devices can be mounted into a common interposer such as... Figure 6 The interposer 36. The light-emitting diode (LED) may be a miniature LED (e.g., an LED semiconductor die with an area of ​​approximately 10 μm x 10 μm, greater than 5 μm x 5 μm, less than 100 μm x 100 μm, or other suitable sizes). The LED may include LEDs of different colors (e.g., red, green, blue, white, etc.). Redundant LEDs or other redundant circuitry may be included on the interposer 36. Multiple electronic devices (each having a corresponding body 28) are mounted on a common interposer. Figure 6In the configuration of the type shown, electronic component 26 may include any suitable combination of electronic devices (e.g., light-emitting diodes, sensors, integrated circuits, actuators, and / or combinations thereof). Figure 4 Other devices of the type described in electronic component 26).

[0046] Electronic components may be coupled to fabric structures, individual yarns or monofilaments, printed circuits (e.g., rigid printed circuits formed from epoxy resin or other rigid printed circuit board materials filled with glass fibers, or flexible printed circuits formed from sheets of polyimide substrates or other flexible polymer materials), metal or plastic components with signal traces, or other structures in article 10. Figure 7 In the configuration, component 28 has been mounted to support structure 40 (e.g., fabric layer, printed circuit, etc.).

[0047] It may be desirable to cover component 26 with one or more layers of material. For example, in a configuration where component 26 is sensitive to moisture, it may be desirable to seal component 26 within a waterproof material. In a configuration where component 26 emits light, it may be desirable to cover component 26 with a light-diffusing layer, such as a polymer layer comprising metal oxide particles (e.g., white titanium dioxide particles, colored particles, or other light-diffusing particles). Opaque materials and / or materials having other optical, mechanical, and / or electronic properties may also be used to cover part or all of component 26. Figure 7 In the exemplary configuration, beads of a polymer, such as polymer 42, have been used to cover adjacent portions of the upper surfaces of component 26 and support structure 40. Polymer 42 may be, for example, a light-diffusing material such as a white potting compound (e.g., a polymer with white light-scattering particles). Other materials may be used to cover electronic components on support structure 40 if desired. Beads of this light-diffusing polymer have been used to cover electronic component 26. Figure 7 The configuration is merely illustrative.

[0048] Figure 8 This illustrates how polymer or other material beads can be formed above and below component 26. Upper beads 42 may cover adjacent portions of component 26 and support structure 40. Lower beads 44 may cover the back of support structure 40 below component 26. Using an exemplary arrangement, Figure 8 The support structure 40 is a flexible substrate layer (e.g., a flexible printed circuit layer), the upper beads 42 are light-diffusing polymer beads, and the lower beads 44 are opaque (e.g., black) light-absorbing polymer beads. Beads 42 help diffuse and homogenize light emitted by component 26 in the upward direction, and beads 44 help block stray light that might otherwise propagate in the downward direction. Figure 8 (in the orientation).

[0049] The surface of the support structure 40 to which the bead 42 is attached may sometimes be referred to as the top surface, front surface, or outer surface of the structure 40, and the surface of the structure 40 to which the bead 44 is attached may sometimes be referred to as the bottom surface, rear surface, or inner surface of the structure 40. If desired, an arrangement in which opaque polymer beads are formed on the outer surface of the structure 40 and translucent polymer beads are formed on the inner surface (back side) of the structure 40 may be used. Figure 8 The configuration is presented as an example. If desired, beads of polymer or other materials may be used to encapsulate component 26 and thereby protect component 26 from moisture, dust and other contaminants, to help attach component 26 to support structure 40, etc.

[0050] One or more electronic components 26 may be included in the article 10. In some configurations, multiple components 26 may be provided on the outer casing wall, inner casing structure, flat material layer, and / or other material layer. For example, as Figure 9 As shown, structure 46 may be provided with an array of electronic components 26. Structure 46 may include support structures such as Figure 7 and Figure 8 The support structure 40 (or may be a structure such as support structure 40). Components 26 may be arranged in a two-dimensional array (e.g., an array with rows and columns), in a pseudo-random pattern, in circles, lines, triangles, or other shapes, or organized into other patterns. Structure 46 may be flexible and stretchable, and may include an outer layer of fabric or other material. Structure 46 may be used to form the walls of a bag, part of a strip, a layer in a garment or other article, or other parts of fabric-based article 10.

[0051] Component 26 may be mounted on the outermost surface of structure 46 or may be mounted inside structure 46. For example, structure 46 may include multiple material layers (plastic layers, printed circuit layers, adhesive layers, fabric layers, etc.). In this type of arrangement, structure 46 may include window structures aligned with component 26. For example, in a configuration where component 26 is a light-emitting diode or other light source and / or a photodetector, structure 46 may include an array of light-transparent windows. As another example, component 26 may be an antenna or other component using radio frequency electromagnetic signals. In this type of arrangement, structure 46 may include radio-transparent windows (e.g., windows formed of plastic or other dielectrics that allow radio frequency signals to pass through). In a configuration where electronic component 26 is a temperature sensor, the window in structure 46 may be a thermally conductive window that allows component 26 to perform temperature measurements. The window may be circular, square, formed as part of an elongated shape (e.g., a strip of window material), may have a shape with a combination of curved and straight sides, and / or may have other suitable shapes. Alternatively, a configuration of structure 46 with a uniform appearance (no identifiable windows) can be used (e.g., by providing all fabric layers or other outer layers in structure 46 with appropriate light transmittance, radio wave transparency and / or thermal conductivity, or other properties compatible with component 26).

[0052] In some configurations, article 10 may include an electrical connection between component 26 and a conductive path in fabric 12. Fabric 12 may include conductive yarns and / or conductive monofilaments for carrying signals. The yarns and / or monofilaments may be used to form a fabric contact pad. For example, consider... Figure 10 Fabric 12. For example... Figure 10 As shown, fabric 12 may comprise material strands, such as warp yarns 20 and weft yarns 22. One or more of these yarns may be conductive and may be exposed on the surface of fabric 12 to form contact pads. Figure 10 In the example, the conductive yarn 22' has been woven in a pattern such that a portion 22" of the yarn 22' forms a contact pad on the upper surface 50 of the fabric layer 12 in region 52. Component 26 may have contact pads such as pad 56. Solder or other conductive material 54 may be used to couple the pad 56 to the pad formed by the portion 22" of the yarn 22'. Figure 10 In the exemplary configuration, the pad 22' has been formed by selectively raising the weft yarn 22' to the surface 50 in region 52 (e.g., using a three-dimensional loom). If desired, other suitable material strands in the warp yarn or fabric 12 can be used to form the contact pad 22'. For example, as... Figure 11As shown, a portion 20' of the floating warp yarn 20 can be used to form a contact pad on the surface 50 of the fabric 12 (and the remainder of the yarn 20 can be cut off). Embossing techniques (such as those using sewing equipment to bond conductive yarns to the fabric 12) can also be used to form fabric contact pads in the fabric 12. If desired, transparent yarns or yarns with other desired properties can also be patterned to form surface structures such as Figure 11 The pad 22' (e.g., forming a transparent window for the underlying component 26). The use of weaving techniques and other patterning techniques to form the solder pad is merely exemplary.

[0053] like Figure 12 As shown, if desired, component 26 on support structure 40 may be embedded within a material layer such as layer 60. Layer 60 may be an elastomeric material such as an elastic polymer (e.g., silicone, polyurethane, acrylic, or other low-modulus polymers that can be stretched without disintegrating). If desired, beads of polymer or other materials such as beads 42 and / or 44 may be formed above and / or below component 26 (e.g., to help encapsulate component 26, adjust the optical properties of materials near component 26, etc.). Layer 60 may cover beads 42 and / or beads 44. Layer 40 may be made of fabric (e.g., having a fabric with a material such as...) Figure 10 and Figure 11 The conductive yarns forming the contact pads (fabricated as shown) can be used to form a flexible printed circuit layer or other suitable support layer. Layer 60 can be formed on both the upper and lower surfaces of the support structure 40 (e.g., in an arrangement covering beads 42 and / or 44), or it can be formed only on the upper surface of the structure 40 (e.g., Figure 13 (as shown), or may be formed only on the lower surface of structure 40 (as shown). Figure 14 (As shown).

[0054] The array of components 26 can be mounted to a flexible and / or stretchable fabric layer or other material layer (see, for example...). Figure 9 Structure 46). For example, combining Figure 9 The window may be aligned with component 26 in the material to which component 26 is mounted (if desired), or the window may be omitted from structure 46 (e.g., in a configuration in which structure 46 has suitable properties such as the desired level of light transmission).

[0055] To accommodate a configuration where component 26 is mounted within a flexible and / or stretchable material layer, it may be desirable to use a flexible and / or stretchable structure to form the support structure 40. If desired, the flexibility and / or stretchability of the support structure 40 can be enhanced by forming openings in the structure 40. Figure 15As shown, openings that pass completely or partially through the support structure 40 may be formed in regions of the support structure 40, such as region 62, located between the electronic components 26. Using an exemplary configuration, the support structure 40 is a flexible printed circuit (e.g., a polyimide layer or other flexible printed circuit polymer sheet), and the openings 62 are organized in an array to provide a printed circuit layer with a grid shape that enhances flexibility and stretchability.

[0056] Figure 15 The diagram also illustrates how the support structure 40 may include a metal trace 70. The metal trace 70 can be used to interconnect components 26 and route signals between components 26 and other circuitry in article 10. Portions of the metal trace 70 can be used to form contact pads, such as pad 68, on the upper and / or lower surfaces of the structure 40. Solder 57 can be used to couple pad 68 to mating pads (e.g., fabric contact pads, printed circuit contact pads, component contact pads such as pad 56, etc.) on other structures within article 10.

[0057] A perspective view of a support structure (e.g., a printed circuit substrate or other substrate layer) having a grid shape formed by an array of openings 62. Figure 16 As shown in the image. Figure 16 As shown, the array of openings 62 may have an area 40-1 to which components 26 are mounted (sometimes referred to as an island, island region, or component support region) (see, for example, [reference needed]). Figure 4 , Figure 5 and Figure 6 (Component 26). Region 40-1 may be interconnected by elongated portions of the support structure 40, such as segments 40-2. Segments 40-2 may extend between openings 62 and may be straight, curved, or have both straight and curved portions. Figure 16 In the exemplary configuration, segment 40-2 has a meandering shape to help enhance the flexibility and stretchability of structure 40 without damaging structure 40 or component 26. Other grid-shaped support structures may be used if desired (e.g., grid substrates with circular openings, triangular openings, grid patterns with a combination of circular and square openings, grids with irregularly patterned openings, etc.).

[0058] like Figure 17 As shown, a flexible printed circuit or other support structure 40, in a grid shape filled with an array of components 26, can be coupled to fabric layer 12. Fabric layer 12 may contain an array of pads such as pads 64. Pads 64 may be formed using conductive yarns (e.g., conductive warp or weft yarns) or may be formed from other conductive pad structures. Pads 64 may be connected to printed circuit pads (such as...) on the lower surface of structure 40. Figure 15 The pads (68) are patterned in a matching array. Solder can be used in... Figure 17When structure 40 moves in direction 66, the pads of structure 40 and pad 64 of the mating structure 40 are engaged. As shown in optional layer 60, structure 40, component 26, and / or layer 12 may be embedded within a polymer layer or other flexible and stretchable material layer. Layer 60 may be light-transmitting, translucent, opaque, may have white light-scattering particles, may have colored light-scattering particles, or may have other suitable optical, electronic, and mechanical properties.

[0059] Such as combination Figure 9 The component 26 may be mounted in a structure such as structure 46 (e.g., a wall or other material layer in article 10, a portion of a loop or strip, etc.). Structure 46 may be, for example, a flexible and stretchable layer for forming one or more outermost material layers in article 10 or other flexible and stretchable portions of article 10. A grid-shaped (grid-patterned) flexible printed circuit substrate or other support layer 40 may be laminated to a fabric layer, plastic layer, metal layer, and / or other material layer to form a multilayer flexible and stretchable structure such as structure 46.

[0060] Figure 18 The image shows a cross-sectional side view of this type of flexible and stretchable structure. (See image for reference.) Figure 18 As shown, the flexible and stretchable layer 46 may include structure 40. Structure 40 may be a grid-shaped flexible printed circuit (e.g., a grid formed by a patterned layer of polyimide or other polymers having an array of openings 62, having islands 40-1 of pads on component 26 soldered to or otherwise coupled to using a conductive material, and elongated portions such as meandering segments 40-2 coupled to the respective islands 40-1). Component 26 may be mounted on structure 40 using solder, anisotropic conductive adhesive, isotropic conductive adhesive, or other conductive materials. Optional polymer beads may be disposed on structure 40, such as beads 42 above component 26. Beads 42 may contain light-scattering particles (e.g., beads 42 may be a translucent light-scattering material, such as a polymer containing titanium dioxide particles or other light-scattering particles that scatter light emitted by component 26).

[0061] An elastomeric layer, such as an optional elastomeric polymer layer 60, may be formed above and below the structure 40 (i.e., the structure 40 may be embedded within the layer 60). Layer 60 may be a light-transmitting stretchable polymer or other suitable material. Fabric layers or other material layers may be attached to the structure 40. Figure 18In the example, structure 46 has an outer surface formed by an outer fabric layer 12A and an inner surface formed by an inner fabric layer 12B. Layer 12A may have a window 80. The window 80 may be formed by a region with reduced yarn density, a region with increased yarn transparency, a region with different types of yarn, a region where perforations or other openings have been formed in fabric 12A, a region where a light-transmitting polymer or other polymer has been embedded in fabric 12A (e.g., a region with an embedded polymer different from the polymer embedded in adjacent portions of fabric 12A), or other window structures. The window 80 may be omitted if desired (e.g., in configurations where fabric 12A is sufficiently transparent to allow light from component 26 to pass through or has other desired properties). Adhesive layer 82 may be used to attach fabric 12A to layer 60 (and thereby mount fabric 12A to structure 40). Adhesive layer 76 may be used to attach fabric 12B (or other material layers such as polymer sheets, etc.) to layer 60 (and thereby mount fabric 12B to structure 40).

[0062] Adhesive layers such as layers 82 and 76 may be pressure-sensitive adhesive layers, liquid adhesives, or other suitable adhesives. If desired, polymer layer 60 may be omitted from one or both sides of structure 40, polymer beads 42 may be omitted, additional polymer beads 44 may be included, and / or one or more intermediate material layers and adhesive layers may be inserted. Figure 18 The layers are attached to structure 46 in a manner between and / or otherwise. Figure 18 The configuration is merely illustrative.

[0063] According to one embodiment, a fabric-based article is provided, comprising: an array of electronic components mounted on a flexible substrate; a polymer layer in which the array of electronic components and the flexible substrate are embedded; and a fabric layer to which the polymer layer is attached.

[0064] According to another embodiment, the flexible substrate includes a flexible printed circuit with an array of openings.

[0065] According to another embodiment, the electronic component includes a light-emitting diode, and the polymer layer includes a light-transmitting polymer layer.

[0066] According to another embodiment, the fabric-based article includes translucent polymer beads covering each electronic component in the electronic components.

[0067] According to another embodiment, the translucent polymer beads are embedded within a light-transmitting polymer layer.

[0068] According to another embodiment, the fabric-based article includes opaque polymer beads, each of which is overlapped by a corresponding electronic component.

[0069] According to another embodiment, the fabric-based article includes an adhesive layer inserted between a fabric layer and a polymer layer.

[0070] According to another embodiment, the flexible substrate includes a substrate layer having an array of openings and metal traces forming solder pads, and the electronic component has solder pads that are soldered to the substrate layer.

[0071] According to another embodiment, each electronic component in the electronic component includes an interposer to which multiple semiconductor dies are mounted.

[0072] According to another embodiment, the flexible substrate layer includes a fabric substrate.

[0073] According to another embodiment, the fabric substrate has contact pads to which electronic components are electrically coupled.

[0074] According to another embodiment, the contact pads of the fabric substrate are formed from conductive yarns in the fabric substrate, and the fabric-based article includes solder, the contact pads of the fabric substrate being soldered to pads in electronic components using solder.

[0075] According to another embodiment, an apparatus is provided, comprising: an array of electronic components mounted on a substrate having an array of openings; and a fabric layer attached to the substrate.

[0076] According to another embodiment, the substrate includes a flexible printed circuit having portions to which electronic components are soldered and having meandering segments extending between the portions to which the electronic components are soldered.

[0077] According to another embodiment, the electronic component includes a light-emitting diode.

[0078] According to another embodiment, the device includes a semi-transparent polymer covering a light-emitting diode.

[0079] According to another embodiment, the device includes an adhesive layer inserted between a fabric layer and a substrate having an array of openings.

[0080] According to another embodiment, the electronic component includes an actuator.

[0081] According to another embodiment, the electronic component includes a sensor.

[0082] According to one embodiment, a fabric-based article is provided, the fabric-based article including a fabric layer, a material layer, electronic components, and a flexible printed circuit to which the electronic components are mounted, the flexible printed circuit having a plurality of openings and being mounted between the fabric layer and the material layer.

[0083] According to another embodiment, the material layer includes a fabric.

[0084] According to another embodiment, the electronic component is soldered to a flexible printed circuit, and the fabric-based article includes: a first adhesive layer between a fabric layer and the flexible printed circuit; and a second adhesive layer between a material layer and the flexible printed circuit.

[0085] According to another embodiment, the fabric-based article includes a polymer containing light-scattering particles and overlapping with electronic components.

[0086] According to another embodiment, the electronic component includes an actuator and a sensor.

[0087] According to one embodiment, a fabric-based article is provided, comprising: a first fabric layer; a second fabric layer; an electronic component; a flexible printed circuit to which the electronic component is attached, the flexible printed circuit having an array of openings and being mounted between the fabric layer and the material layer; a first adhesive layer between the first fabric layer and the flexible printed circuit; and a second adhesive layer between the second fabric layer and the flexible printed circuit.

[0088] According to another embodiment, the electronic component is soldered to a flexible printed circuit and includes a sensor; the fabric-based article includes a polymer containing light-scattering particles and overlapping the electronic component.

[0089] The foregoing description is merely illustrative, and those skilled in the art can make various modifications without departing from the scope and spirit of the described embodiments. The foregoing embodiments can be implemented individually or in any combination.

Claims

1. An apparatus comprising: Substrate, the substrate having an array of openings; An array of electronic components, the array of electronic components being mounted on the substrate; A fabric layer attached to the substrate, wherein the substrate includes a flexible printed circuit having portions to which electronic components are attached and having segments extending between the portions to which electronic components are attached, and wherein each segment has a curved portion. and Transparent polymer beads covering the electronic components.

2. The device according to claim 1, wherein the electronic component comprises a light-emitting diode.

3. The apparatus of claim 2 further includes an adhesive layer inserted between the fabric layer and the substrate having an array of openings.

4. The apparatus of claim 1, wherein the electronic component includes an actuator.

5. The apparatus of claim 1, wherein the electronic component includes a sensor.

6. The apparatus of claim 1, wherein the electronic component is soldered to the portion to which the electronic component is attached.

7. The apparatus of claim 1, wherein the substrate includes metal traces for routing signals between the array of electronic components.

8. A fabric-based article comprising: An array of electronic components, the array of electronic components being mounted on a flexible substrate; A polymer layer covering an array of electronic components; and A fabric layer, wherein the polymer layer is attached to the fabric layer, wherein the fabric layer has a plurality of windows, each window being aligned with a corresponding electronic component, and each window having a lower yarn density than the rest of the fabric layer.

9. The fabric-based article of claim 8, further comprising: A first adhesive layer, wherein the first adhesive attaches the polymer layer to the fabric layer; An additional polymer layer, wherein the flexible substrate is inserted between the polymer layer and the additional polymer layer; An additional fabric layer, wherein the additional polymer layer is attached to the additional fabric layer; and A second adhesive layer attaches the additional polymer layer to the additional fabric layer.

10. The fabric-based article of claim 8, wherein the flexible substrate comprises a flexible printed circuit having an array of openings.

11. The fabric-based article of claim 8, wherein the electronic component comprises components selected from the group consisting of: light-emitting diodes, actuators, sensors, and interpolators.

12. The fabric-based article of claim 8, further comprising translucent polymer beads covering each of the electronic components, wherein the polymer layer is a transparent polymer layer and the translucent polymer beads are embedded within the transparent polymer layer.

13. A fabric-based article comprising: A light-emitting diode array, wherein the light-emitting diode array is mounted on a flexible substrate; A transparent polymer layer covering the light-emitting diode array; and A fabric layer covering the transparent polymer layer and the array of light-emitting diodes, wherein the fabric layer has multiple windows, each light-emitting diode emitting light through one of the multiple windows, and each window includes a perforation.

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