Smart Card and Method for Manufacturing the Same

Abstract

The present invention discloses an intelligent card and a manufacturing method thereof. The intelligent card includes a card substrate, and the card substrate includes a front substrate portion and a back substrate portion which are stacked. The front substrate portion includes: a first substrate having a first surface facing away from the back substrate portion and a second surface facing the back substrate portion in the thickness direction; a first light-shielding ink layer disposed on the side where the second surface of the first substrate is located; a grating processing layer disposed on the side where the first surface of the first substrate is located; a grating pattern layer located between the first substrate and the first light-shielding ink layer; and a pattern effect layer disposed at least in one of the following positions: between the first substrate and the grating processing layer; between the grating pattern layer and the first light-shielding ink layer. The present invention enables the intelligent card to have both a grating effect and other personalized effects, and can meet the user's requirements for the surface effect of the intelligent card.

Description

Technical Field

[0001] The present invention relates to the technical field of smart card manufacturing, and particularly relates to a smart card and a manufacturing method thereof. Background Art

[0002] With the development of electronic technology, smart cards are increasingly widely used due to their advantages of large storage capacity and high security.

[0003] For a smart card with a grating effect on its surface, which uses the grating to display a three-dimensional pattern and has a strong pattern expression effect, meeting the user's need for innovation of traditional cards. However, the inventor found that the texture on the surface of the grating card makes it impossible to apply other personalized effect patterns such as silk-screened gold, silver, and pearlescent on the card body surface, resulting in a single surface effect of the grating card. Summary of the Invention

[0004] An embodiment of the present invention provides a smart card and a manufacturing method thereof.

[0005] In a first aspect, an embodiment of the present invention provides a smart card, including a card base, the card base includes a front substrate part and a back substrate part stacked, the front substrate part includes: a first substrate having a first surface facing away from the back substrate part and a second surface facing the back substrate part in the thickness direction; a first light-shielding ink layer disposed on the side where the second surface of the first substrate is located; a grating treatment layer disposed on the side where the first surface of the first substrate is located; a grating pattern layer located between the first substrate and the first light-shielding ink layer; and a pattern effect layer disposed at least in one of the following positions: between the first substrate and the grating treatment layer; between the grating pattern layer and the first light-shielding ink layer.

[0006] According to the foregoing embodiment of the first aspect of the present invention, the pattern effect layer includes a heat transfer film layer, and the heat transfer film layer is disposed between the first substrate and the grating treatment layer.

[0007] According to any of the foregoing embodiments of the first aspect of the present invention, the pattern effect layer includes a standing gold flake layer, and the standing gold flake layer is disposed between the first substrate and the grating treatment layer.

[0008] According to any of the foregoing embodiments of the first aspect of the present invention, the grating treatment layer includes a grating treatment part and a non-treatment part, and the non-treatment part covers the standing gold flake layer.

[0009] According to any of the foregoing embodiments of the first aspect of the present invention, the pattern effect layer includes a first silk-screen effect film layer, and the first silk-screen effect film layer is disposed between the first substrate and the grating treatment layer.

[0010] According to any of the foregoing embodiments of the first aspect of the present invention, the pattern effect layer includes a second silk-screen effect film layer, and the second silk-screen effect film layer is disposed between the grating pattern layer and the first light-shielding ink layer.

[0011] According to any of the foregoing embodiments of the first aspect of the present invention, the front substrate portion further includes a first protective film layer, and the first protective film layer is disposed between the first substrate and the grating processing layer.

[0012] According to any of the foregoing embodiments of the first aspect of the present invention, the pattern effect layer includes a standing gold flake layer, and the standing gold flake layer is disposed between the first substrate and the first protective film layer; and / or the pattern effect layer includes a flat ironing film layer, and the flat ironing film layer is disposed between the first protective film layer and the grating processing layer.

[0013] According to any of the foregoing embodiments of the first aspect of the present invention, the front substrate portion and the back substrate portion are bonded by a pressure-sensitive adhesive layer.

[0014] According to any of the foregoing embodiments of the first aspect of the present invention, the back substrate portion includes: a second substrate having a third surface and a fourth surface in the thickness direction, and the third surface faces away from the front substrate portion; a winding antenna layer disposed on the side where the fourth surface of the second substrate is located; and a compensation layer disposed on the side of the winding antenna layer away from the second substrate.

[0015] According to any of the foregoing embodiments of the first aspect of the present invention, the back substrate portion further includes: a second light-shielding ink layer disposed on the fourth surface of the second substrate, and the winding antenna layer is located on the side of the second light-shielding ink layer away from the second substrate; a back printing layer disposed on the third surface of the second substrate; and a second protective film layer disposed on the side of the back printing layer away from the second substrate, and a magnetic stripe is disposed on the second protective film layer.

[0016] According to any of the foregoing embodiments of the first aspect of the present invention, it further includes a chip. A groove is provided in the thickness direction of the card substrate, and the chip is embedded in the groove, and the chip is electrically connected to the winding antenna layer.

[0017] In a second aspect, an embodiment of the present invention provides a method for manufacturing an intelligent card, including forming a front substrate portion. Forming the front substrate portion includes: providing a first substrate having a first surface and a second surface in the thickness direction; forming a grating pattern layer on the side where the second surface of the first substrate is located; forming a pattern effect layer, wherein the pattern effect layer is formed on the first surface side of the first substrate and / or on the side of the grating pattern layer away from the first substrate; forming a first light-shielding ink layer on the side of the grating pattern layer away from the first substrate; and forming a grating processing layer on the first surface side of the first substrate, wherein the step of forming the grating processing layer is located after the step of forming the pattern effect layer.

[0018] According to the foregoing embodiment of the second aspect of the present invention, forming the pattern effect layer includes: forming a flat ironing film layer on the first surface side of the first substrate.

[0019] According to any of the foregoing embodiments of the second aspect of the present invention, forming the pattern effect layer includes: forming a standing gold sheet layer on the side where the first surface of the first substrate is located.

[0020] According to any of the foregoing embodiments of the second aspect of the present invention, forming the pattern effect layer includes: forming a first screen printing effect film layer on the side where the first surface of the first substrate is located.

[0021] According to any of the foregoing embodiments of the second aspect of the present invention, forming the pattern effect layer includes: forming a second screen printing effect film layer on the side of the grating pattern layer facing away from the first substrate, wherein the step of forming the second screen printing effect film layer is located before the step of forming the first light-shielding ink layer.

[0022] According to any of the foregoing embodiments of the second aspect of the present invention, forming the front substrate portion further includes: forming a first protective film layer on the side where the first surface of the first substrate is located, wherein the step of forming the grating treatment layer is located after the step of forming the first protective film layer.

[0023] According to any of the foregoing embodiments of the second aspect of the present invention, forming the pattern effect layer includes forming a standing gold sheet layer on the side where the first surface of the first substrate is located, and the step of forming the standing gold sheet layer is located before the step of forming the first protective film layer; and / or forming the pattern effect layer includes forming a flat ironing film layer on the side where the first surface of the first substrate is located, and the step of forming the flat ironing film layer is located after the step of forming the first protective film layer.

[0024] According to any of the foregoing embodiments of the second aspect of the present invention, it further includes: forming a back substrate portion; stacking the front substrate portion and the back substrate portion in a manner that the grating treatment layer faces away from the back substrate portion, and fixing the front substrate portion and the back substrate portion into one body through a pressure-sensitive adhesive layer to form a card substrate.

[0025] According to any of the foregoing embodiments of the second aspect of the present invention, forming the back substrate portion includes: providing a second substrate, the second substrate having a third surface and a fourth surface in the thickness direction; forming a second light-shielding ink layer on the fourth surface side of the second substrate; forming a back printing layer on the third surface side of the second substrate; providing a winding antenna layer, and disposing the winding antenna layer on the side of the second light-shielding ink layer facing away from the second substrate; forming a compensation layer on the side of the winding antenna layer facing away from the second substrate.

[0026] According to any of the foregoing embodiments of the second aspect of the present invention, after the step of forming the card substrate, it further includes: encapsulating a chip into the card substrate to form a smart card.

[0027] The smart card and the manufacturing method thereof provided by the embodiments of the present invention endow the smart card with other personalized effects by setting a pattern effect layer. Since the pattern effect layer is arranged on one side of the grating processing layer facing the back substrate portion, there is no need to apply the pattern effect layer on the surface of the grating processing layer, thus avoiding problems such as difficult processing and easy peeling of the pattern effect layer. In addition, the grating pattern layer and the grating processing layer are respectively arranged on both sides of the first substrate. The grating lines of the grating processing layer and the transparent first substrate form a series of lenses, enabling the grating pattern layer to form a three-dimensional or dynamic effect, and the smart card has a grating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Other features, objects, and advantages of the present invention will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which like or similar reference numerals denote like or similar features, and the drawings are not drawn to actual scale.

[0029] Figure 1 is a schematic structural diagram of the smart card provided by the embodiments of the present invention;

[0030] Figure 2 is an example of the front substrate portion in the smart card according to the embodiments of the present invention;

[0031] Figure 3 is another example of the front substrate portion in the smart card according to the embodiments of the present invention;

[0032] Figure 4 is yet another example of the front substrate portion in the smart card according to the embodiments of the present invention;

[0033] Figure 5 is yet another example of the front substrate portion in the smart card according to the embodiments of the present invention;

[0034] Figure 6 is yet another example of the front substrate portion in the smart card according to the embodiments of the present invention;

[0035] Figure 7 is another schematic structural diagram of the smart card provided by the embodiments of the present invention;

[0036] Figure 8 is an example of the back substrate portion in the smart card according to the embodiments of the present invention;

[0037] Figure 9 is yet another schematic structural diagram of the smart card provided by the embodiments of the present invention;

[0038] Figure 10 is a flowchart of the manufacturing method of the smart card provided by the embodiments of the present invention;

[0039] Figure 11Flow chart of the manufacturing method of the smart card provided by another embodiment of the present invention;

[0040] Figure 12 Flow chart of forming the card substrate for the manufacturing method of the smart card according to an embodiment of the present invention;

[0041] Figure 13 Flow chart of forming the back substrate part for the manufacturing method of the smart card provided by an embodiment of the present invention;

[0042] Figure 14 Flow chart of the manufacturing method of the smart card provided by yet another embodiment of the present invention.

[0043] Description of reference numerals:

[0044] 100 - Front substrate part; 110 - First substrate; 120 - First light-shielding ink layer; 130 - Grating pattern layer; 140 - Grating treatment layer; 150 - Pattern effect layer; 151 - Flat ironing film layer; 152 - Standing gold piece layer; 153 - First screen printing effect film layer; 154 - Second screen printing effect film layer; 160 - First protective film layer;

[0045] 200 - Back substrate part; 210 - Second substrate; 220 - Compensation layer; 230 - Winding antenna layer; 240 - Second light-shielding ink layer; 250 - Back printing layer; 260 - Second protective film layer;

[0046] 300 - Pressure-sensitive adhesive layer;

[0047] 400 - Chip. Detailed implementation manners

[0048] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without some of these specific details. The following description of the embodiments is only provided to provide a better understanding of the present invention by showing examples of the present invention.

[0049] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, the elements defined by the statement "comprising..." do not exclude the presence of additional identical elements in the process, method, article or device comprising the said elements.

[0050] With the development of electronic technology, smart cards are increasingly widely used due to their advantages of large storage capacity and high security. Smart cards with a grating effect on the surface use the grating to display three-dimensional patterns, which have a strong pattern expression effect and meet the user's need for innovation in traditional cards. However, the inventor found that the texture on the surface of the grating card makes it impossible to apply other personalized effect patterns such as screen-printed gold, silver, and pearlescent on the card body surface, resulting in a single surface effect of the grating card.

[0051] Based on the above problems, the embodiments of the present invention provide a smart card and a manufacturing method thereof, so that the smart card has both a grating effect and other personalized effects, and can meet the user's requirements for the surface effect of the smart card.

[0052] Please refer to Figure 1 , Figure 1 , which is a schematic structural diagram of the smart card provided by the embodiments of the present invention.

[0053] The smart card provided by the embodiments of the present invention includes a card substrate, and the card substrate includes a front substrate part 100 and a back substrate part 200 arranged in a stacked manner. The front substrate part 100 includes a first substrate 110, a first light-shielding ink layer 120, a grating treatment layer 140, a grating pattern layer 130, and a pattern effect layer 150.

[0054] The first substrate 110 has a first surface facing away from the back substrate part 200 and a second surface facing the back substrate part 200 in the thickness direction. The first light-shielding ink layer 120 is disposed on the side where the second surface of the first substrate 110 is located. The grating treatment layer 140 is disposed on the side where the first surface of the first substrate 110 is located. The grating pattern layer 130 is located between the first substrate 110 and the first light-shielding ink layer 120. The pattern effect layer 150 is disposed at least in one of the following positions: between the first substrate 110 and the grating treatment layer 140; between the grating pattern layer 130 and the first light-shielding ink layer 120.

[0055] According to the smart card provided by an embodiment of the present invention, by providing a pattern effect layer 150, the smart card has other personalized effects. Since the pattern effect layer 150 is provided on the side of the grating processing layer 140 facing the back substrate portion 200, it is not necessary to apply the pattern effect layer 150 on the surface of the grating processing layer 140, avoiding problems such as difficult processing and easy peeling of the pattern effect layer 150.

[0056] It can be understood that the first substrate 110 is usually a transparent substrate; the first light-shielding ink layer 120 can be formed by screen-printing white ink on the side where the first surface of the first substrate 110 is located. The first substrate 110 can be made of materials such as PVC and PET, etc., and the present application does not make specific limitations on this.

[0057] The grating processing layer 140 is the outermost layer on the side of the front substrate portion 100 facing away from the back substrate portion 200. During production, the grating lines can be directly processed on the outer surface of the front substrate portion 100 to form the grating processing layer 140. The grating lines of the grating processing layer 140 can be strip-shaped or circular-ring-shaped, and the present invention does not make specific limitations on this.

[0058] The grating pattern layer 130 and the grating processing layer 140 are respectively provided on both sides of the first substrate 110. The grids of the grating processing layer 140 and the grating pattern layer 130 are closely corresponding. The grating lines of the grating processing layer 140 and the transparent first substrate 110 will form a series of lenses. When observed through the human eye, due to the refraction and diffraction of the observed light by the lenses, a hidden changing double image, changing triple image, and even changing multiple images can be clearly observed at different angles, thus forming a dynamic or depth-of-field effect.

[0059] In summary, the smart card provided by the embodiment of the present invention has both a grating effect and other personalized effects, and can meet the needs of users for the surface effects of smart cards.

[0060] It should be noted that there are various pattern effect layers 150, which can include one or more of a flat ironing film layer, a standing gold sheet layer, a screen-printing effect film layer, etc., and can be specifically selected according to actual needs.

[0061] Figure 2 This is an example of the front substrate portion 100 in the smart card according to an embodiment of the present invention. In some alternative embodiments, such as Figure 2As shown, the pattern effect layer 150 may include a heat transfer film layer 151, and the heat transfer film layer 151 is disposed between the first substrate 110 and the grating processing layer 140. The heat transfer film layer 151 may be, for example, a heat transfer gold and silver film tape, a heat transfer black and white film tape, or a heat transfer color film tape. When manufacturing the smart card, the required film tape may be first heat transferred onto the first surface of the first substrate 110 to form the heat transfer film layer 151, and then a grating pattern may be processed on the side where the first surface of the first substrate 110 is located to form the grating processing layer 140.

[0062] It can be understood that the heat transfer film layer 151 may partially cover the first surface of the first substrate 110. At this time, the grating processing layer 140 may completely cover the heat transfer film layer 151 and the first surface of the first substrate 110, or may only cover the portion of the first substrate 110 where the heat transfer film layer 151 is not provided.

[0063] Figure 3 Another example of the front substrate portion 100 in the smart card according to an embodiment of the present invention. In some alternative embodiments, as Figure 3 shown, the pattern effect layer 150 may include a standing gold sheet layer 152, and the standing gold sheet layer 152 is disposed between the first substrate 110 and the grating processing layer 140. The standing gold sheet layer 152 may be, for example, standing gold sheets of various colors, and the standing gold sheet layer 152 may be formed by pasting standing gold sheets on the first surface of the first substrate 110.

[0064] To make the fixation of the standing gold sheet layer 152 more reliable, the standing gold sheet may be first fixed at a preset position on the side where the first surface of the first substrate 110 is located by spot welding, and then the standing gold sheet and the first substrate 110 may be laminated together.

[0065] Optionally, to make the standing gold sheet layer 152 have a better stereoscopic visual effect, the grating processing layer 140 may include a grating processing portion and a non-processing portion, and the non-processing portion covers the standing gold sheet layer 152, that is, the grating processing layer 140 does not cover the standing gold sheet layer 152, and the standing gold sheet layer 152 is exposed on the outer surface of the front substrate portion 100.

[0066] In some alternative embodiments, the pattern effect layer 150 may include a screen printing effect film layer. The screen printing effect film layer may, for example, have screen printing gold and silver, pearlescent, temperature change, or light change effects, etc., and the present invention does not make specific limitations thereto.

[0067] Figure 4 Another example of the front substrate portion 100 in the smart card according to an embodiment of the present invention. In some alternative embodiments, as Figure 4 shown, the pattern effect layer 150 may include a first screen printing effect film layer 153, and the first screen printing effect film layer 153 is disposed between the first substrate 110 and the grating processing layer 140.

[0068] The first screen printing effect film layer 153 is located between the grating pattern layer 130 and the grating processing layer 140. To prevent the first screen printing effect film layer 153 from affecting the grating effect, optionally, the projection of the first screen printing effect film layer 153 on the first substrate 110 partially covers the first substrate 110.

[0069] Figure 5 Another example of the front substrate portion 100 in the smart card according to an embodiment of the present invention. In some alternative embodiments, as Figure 5 shown, the pattern effect layer 150 may include a second screen printing effect film layer 154, and the second screen printing effect film layer 154 is disposed between the grating pattern layer 130 and the first light-shielding ink layer 120. At this time, the projection of the second screen printing effect film layer 154 on the first substrate 110 may completely cover the first substrate 110.

[0070] Figure 6 Another example of the front substrate portion 100 in the smart card according to an embodiment of the present invention. The smart card provided by the embodiment of the present invention, the front substrate portion 100 may further include a first protective film layer 160, and the first protective film layer 160 is disposed between the first substrate 110 and the grating processing layer 140.

[0071] Optionally, the pattern effect layer 150 includes a gold chip layer 152. The gold chip layer 152 may be disposed between the first substrate 110 and the first protective film layer 160. When the gold chip is laminated with the first substrate 110 into one body through a lamination process, the first protective film layer 160 can protect the gold chip from being damaged.

[0072] Optionally, the pattern effect layer 150 may include a heat transfer film layer 151. The heat transfer film layer 151 is disposed between the first protective film layer 160 and the grating processing layer 140. Disposing the heat transfer film layer 151 on the side of the first protective film layer 160 facing away from the first substrate 110 can ensure the display effect of the heat transfer film layer 151.

[0073] Figure 7 Another structural schematic diagram of the smart card provided by the embodiment of the present invention. As Figure 7 shown, for the smart card provided by the embodiment of the present invention, the front substrate portion 100 and the back substrate portion 200 may be adhered through a pressure-sensitive adhesive layer 300. When manufacturing the smart card, the pressure-sensitive adhesive layer 300 is disposed between the front substrate portion 100 and the back substrate portion 200, and the three are laminated into one body through a lamination process.

[0074] Optionally, the pressure-sensitive adhesive layer 300 may be, for example, a low-temperature pressure-sensitive adhesive. The reaction temperature during lamination is relatively low, which can ensure that the grating lines of the grating processing layer 140 will not melt during lamination.

[0075] Figure 8This is an example of the reverse substrate portion 200 of the smart card provided according to an embodiment of the present invention.

[0076] In some alternative embodiments, for the smart card provided by the embodiment of the present invention, the reverse substrate portion 200 of the card substrate may include a second substrate 210, a wire-wound antenna layer 230, and a compensation layer 220.

[0077] The second substrate 210 has a third surface and a fourth surface in the thickness direction, and the third surface faces away from the front substrate portion 100. The wire-wound antenna layer 230 is disposed on the side where the fourth surface of the second substrate 210 is located, and the compensation layer 220 is disposed on the side of the wire-wound antenna layer 230 that faces away from the second substrate 210. The compensation layer 220 can compensate for the thickness of the card substrate.

[0078] To make the fixation of the wire-wound antenna layer 230 more reliable, the wire-wound antenna layer 230 can be first fixed at a preset position on the side where the fourth surface of the second substrate 210 is located by spot welding, and then the wire-wound antenna layer 230, the compensation layer 220, and the second substrate 210 are laminated together.

[0079] Optionally, the second substrate 210 and the first substrate 110 may be made of the same material, and the second substrate 210 may be a transparent substrate.

[0080] Optionally, the reverse substrate portion 200 may further include a second light-shielding ink layer 240. The second light-shielding ink layer 240 is disposed on the fourth surface of the second substrate 210, and the second light-shielding ink layer 240 can be formed by screen-printing white ink on the fourth surface of the second substrate 210. The wire-wound antenna layer 230 is located on the side of the second light-shielding ink layer 240 that faces away from the second substrate 210. The second light-shielding ink layer 240 can block the wire-wound antenna layer 230 to prevent the wire-wound antenna layer 230 from being exposed to human eyes.

[0081] Optionally, the reverse substrate portion 200 may further include a reverse printing layer 250 and a second protective film layer 260. The reverse printing layer 250 is disposed on the third surface of the second substrate 210, and the second protective film layer 260 is disposed on the side of the reverse printing layer 250 that faces away from the second substrate 210. A magnetic stripe is provided on the second protective film layer 260.

[0082] The reverse printing layer 250 is the reverse pattern layer of the smart card. Specifically, the reverse pattern of the smart card can be formed on the third surface of the second substrate 210 by offset printing. The second protective film layer 260 is provided to protect the reverse pattern of the smart card from being easily worn.

[0083] Figure 9 This is another structural schematic diagram of the smart card provided by the embodiment of the present invention. In some alternative embodiments, such as Figure 9As shown in the figure, the smart card provided by the embodiment of the present invention may further include a chip 400. A groove may be provided in the thickness direction of the card substrate, and the chip 400 is embedded in the groove, and the chip 400 is electrically connected to the winding antenna layer 230.

[0084] Optionally, the groove penetrates the front substrate portion 100, and the chip 400 is exposed on the front of the smart card.

[0085] In addition, the embodiment of the present invention further provides a method for manufacturing a smart card, which can be used to manufacture the smart card as described above.

[0086] Figure 10 It is a flowchart of the method for manufacturing the smart card provided by the embodiment of the present invention. As Figure 10 shown, the method for manufacturing the smart card provided by the embodiment of the present invention may include step S100.

[0087] In step S100, the front substrate portion 100 is formed.

[0088] As Figure 10 shown, step S100 may include: providing a first substrate 110, the first substrate 110 having a first surface and a second surface in the thickness direction; forming a grating pattern layer 130 on the side where the second surface of the first substrate 110 is located; forming a pattern effect layer 150, where the pattern effect layer 150 is formed on the side of the first surface of the first substrate 110 and / or on the side of the grating pattern layer 130 facing away from the first substrate 110; forming a first light-shielding ink layer 120 on the side of the grating pattern layer 130 facing away from the first substrate 110; and forming a grating treatment layer 140 on the side where the first surface of the first substrate 110 is located, where the step of forming the grating treatment layer 140 is located after the step of forming the pattern effect layer 150.

[0089] In the method for manufacturing the smart card provided by the embodiment of the present invention, by first forming the pattern effect layer 150 at a preset position and then forming the grating treatment layer 140 on the side where the first surface of the first substrate 110 is located, the manufactured smart card has both a grating effect and other personalized effects, and can meet the user's requirements for the surface effect of the smart card. In addition, since there is no need to apply the pattern effect layer 150 on the surface of the grating treatment layer 140, problems such as difficult processing and easy peeling of the pattern effect layer 150 are avoided.

[0090] Optionally, a grating pattern layer 130 may be formed by offset printing a pattern on the side where the second surface of the first substrate 110 is located, and a first light-shielding ink layer 120 may be formed by screen printing white ink on the side of the grating pattern layer 130 facing away from the first substrate 110.

[0091] Optionally, grating lines can be directly processed on the outer surface of the front substrate portion 100 to form a grating treatment layer 140. The grating lines of the grating treatment layer 140 can be strip-shaped or circular-ring-shaped, and the present invention does not make specific limitations thereto.

[0092] It should be noted that there are various pattern effect layers 150, which can include one or more of a flat ironing film layer 151, a standing gold flake layer 152, a screen printing effect film layer, etc. Correspondingly, there are also various options for the steps of forming the pattern effect layer 150.

[0093] In some alternative embodiments, the step of forming the pattern effect layer 150 may include: forming a flat ironing film layer 151 on the side where the first surface of the first substrate 110 is located.

[0094] In some alternative embodiments, the step of forming the pattern effect layer 150 may include: forming a standing gold flake layer 152 on the side where the first surface of the first substrate 110 is located.

[0095] Optionally, to make the fixation of the standing gold flake layer 152 more reliable, the standing gold flake can be first fixed at a preset position on the side where the first surface of the first substrate 110 is located by spot welding, and then the standing gold flake and the first substrate 110 are laminated together.

[0096] In some alternative embodiments, the step of forming the pattern effect layer 150 may include: forming a first screen printing effect film layer 153 on the side where the first surface of the first substrate 110 is located.

[0097] In some alternative embodiments, the step of forming the pattern effect layer 150 may include: forming a second screen printing effect film layer 154 on the side of the grating pattern layer 130 away from the first substrate 110, wherein the step of forming the second screen printing effect film layer 154 is located before the step of forming the first light-shielding ink layer 120, so that the second screen printing effect film layer 154 can be located between the grating pattern layer 130 and the first light-shielding ink layer 120.

[0098] Figure 11 It is a flowchart of a manufacturing method of a smart card provided for another embodiment of the present invention. As Figure 11 shown, in some alternative embodiments, step S100 may include step S110 to step S180.

[0099] In step S110, a first substrate 110 is provided.

[0100] In step S120, a first screen printing effect film layer 153 is formed on the first surface of the first substrate 110.

[0101] In step S130, standing gold flakes are pasted on the side of the first screen printing effect film layer 153 away from the first substrate 110 to form a standing gold flake layer 152.

[0102] In step S140, a flat ironing film layer 151 is formed on the side of the standing gold flake layer 152 facing away from the first substrate 110.

[0103] In step S150, a grating pattern layer 130 is formed on the side where the second surface of the first substrate 110 is located.

[0104] In step S160, a second screen printing effect film layer 154 is formed on the side of the grating pattern layer 130 facing away from the first substrate 110.

[0105] In step S170, a first light-shielding ink layer 120 is formed on the side of the grating pattern layer 130 facing away from the first substrate 110.

[0106] In step S180, a grating treatment layer 140 is formed on the side where the first surface of the first substrate 110 is located.

[0107] For the smart card manufactured by the above method, the front substrate part 100 thereof simultaneously includes a flat ironing film layer 151, a standing gold flake layer 152, a first screen printing effect film layer 153, and a second screen printing effect film layer 154.

[0108] In some optional embodiments, step S100 may further include: forming a first protective film layer 160 on the side where the first surface of the first substrate 110 is located, and the step of forming the grating treatment layer 140 is after the step of forming the first protective film layer 160, so that in the obtained smart card, the first protective film layer 160 is located between the first substrate 110 and the grating treatment layer 140.

[0109] Optionally, the step of forming the pattern effect layer 150 may include forming a standing gold flake layer 152 on the side where the first surface of the first substrate 110 is located, and the step of forming the standing gold flake layer 152 is before the step of forming the first protective film layer 160; such that when the standing gold flake layer 152 is laminated with the first substrate 110 to be integrated by a lamination process, the first protective film layer 160 can protect the standing gold flake from being damaged.

[0110] Optionally, the step of forming the pattern effect layer 150 may include forming a flat ironing film layer 151 on the side where the first surface of the first substrate 110 is located, and the step of forming the flat ironing film layer 151 is after the step of forming the first protective film layer 160; such that the flat ironing film layer 151 is located on the side of the first protective film layer 160 facing away from the first substrate 110, which can ensure the display effect of the flat ironing film layer 151.

[0111] Figure 12The flowchart of forming a card substrate for the method of manufacturing a smart card according to an embodiment of the present invention. In some alternative embodiments, the method of manufacturing a smart card according to an embodiment of the present invention may further include step S200 and step S300.

[0112] In step S100, a front substrate portion 100 is formed.

[0113] In step S200, a back substrate portion 200 is formed.

[0114] In step S300, the front substrate portion 100 and the back substrate portion 200 are stacked in a manner that the grating processing layer 140 faces away from the back substrate portion 200, and the front substrate portion 100 and the back substrate portion 200 are fixed together through a pressure-sensitive adhesive layer 300 to form a card substrate.

[0115] It can be understood that the order of step S100 and step S200 is not sequential. That is, when manufacturing a smart card, the front substrate portion 100 can be manufactured first and then the back substrate portion, or the back substrate portion can be manufactured first and then the front substrate portion 100, or the front substrate portion 100 and the back substrate portion can be manufactured simultaneously.

[0116] Optionally, the front substrate portion 100, the pressure-sensitive adhesive layer 300, and the back substrate portion 200 can be laminated together through a lamination process. The pressure-sensitive adhesive layer 300 can be, for example, a low-temperature pressure-sensitive adhesive. During lamination, the reaction temperature is relatively low, which can ensure that the grating lines of the grating processing layer 140 do not melt.

[0117] To prevent misalignment of the front substrate portion 100 and the back substrate portion 200 during lamination, the front substrate portion 100 and the back substrate portion 200 can be fixed at their positions through a spot welding process before lamination.

[0118] Figure 13 The flowchart of forming the back substrate portion 200 for the method of manufacturing a smart card provided according to an embodiment of the present invention. In some alternative embodiments, step S200 may include steps S210 to S250.

[0119] In step S210, a second substrate 210 is provided, and the second substrate 210 has a third surface and a fourth surface in the thickness direction.

[0120] In step S220, a second light-shielding ink layer 240 is formed on the fourth surface side of the second substrate 210.

[0121] In step S230, a back printing layer 250 is formed on the third surface side of the second substrate 210.

[0122] In step S240, a winding antenna layer 230 is provided and the winding antenna layer 230 is disposed on a side of the second light-shielding ink layer 240 facing away from the second substrate 210.

[0123] In step S250, a compensation layer 220 is formed on a side of the winding antenna layer 230 facing away from the second substrate 210.

[0124] It should be noted that the compensation layer 220 is used to compensate for the thickness of the card substrate. The order of steps S220 and S230 is not sequential and can be replaced.

[0125] The reverse printing layer 250 is the reverse pattern layer of the smart card. Specifically, an offset printing process can be used to form the reverse pattern of the smart card on the third surface of the second substrate 210.

[0126] To make the fixation of the winding antenna layer 230 more reliable, the winding antenna layer 230 can be first fixed at a preset position on a side where the fourth surface of the second substrate 210 is located by spot welding, and then the winding antenna layer 230, the compensation layer 220, the second substrate 210, etc. are laminated together by a lamination process.

[0127] It should be noted that in step S300, when the front substrate portion 100 and the back substrate portion 200 are stacked and fixed by the pressure-sensitive adhesive layer 300, the third surface of the second substrate 210 faces away from the front substrate portion 100, so that the winding antenna layer 230 is located between the first substrate 110 and the second substrate 210.

[0128] Optionally, step S200 may further include: forming a second protective film layer 260 on a side of the reverse printing layer 250 facing away from the second substrate 210. The second protective film layer 260 is disposed on a side of the reverse printing layer 250 facing away from the second substrate 210, and a magnetic stripe is provided on the second protective film layer 260. Providing the second protective film layer 260 can protect the reverse pattern of the smart card from being easily worn.

[0129] Figure 14 It is a flowchart of a method for manufacturing a smart card provided by another embodiment of the present invention. In some alternative embodiments, the method for manufacturing a smart card according to an embodiment of the present invention may further include step S400.

[0130] In step S100, a front substrate portion 100 is formed.

[0131] In step S200, a back substrate portion 200 is formed.

[0132] In step S300, the front substrate portion 100 and the back substrate portion 200 are fixed together by the pressure-sensitive adhesive layer 300 to form a card substrate.

[0133] In step S400, the chip 400 is encapsulated into a card substrate to form a smart card.

[0134] Optionally, a groove may be provided in the thickness direction of the card substrate. When encapsulating the chip 400, the chip 400 is embedded in the groove, and the chip 400 is electrically connected to the winding antenna layer 230.

[0135] It can be understood that in the entire manufacturing process of the smart card, when manufacturing the front substrate part 100 and the back substrate part 200, the first substrate 110 and the second substrate 210 can select substrates corresponding to the size of a single card substrate and manufacture each card substrate one by one, but this is less efficient. To improve the manufacturing efficiency of the smart card, when manufacturing the front substrate part 100 and the back substrate part 200, the first substrate 110 and the second substrate 210 can both select large sheets of substrates. After printing, the large sheets are inspected, and the formed large sheets are the front substrate part 100 and the back substrate part 200. After pressing the large sheets of the front substrate part 100 and the back substrate part 200 into one body, multiple single card substrates are formed by punching. After inspection, the chips 400 are then encapsulated onto the card substrates one by one to form smart cards.

[0136] According to the embodiments of the present invention described above, these embodiments do not describe all the details in detail, nor do they limit the invention to only the specific embodiments described. Obviously, according to the above description, many modifications and variations can be made. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and its modifications based on the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. An intelligent card, characterized in that, It includes a card substrate, and the card substrate includes a front substrate part and a back substrate part which are stacked. The front substrate part includes: A first substrate having a first surface facing away from the back substrate part and a second surface facing the back substrate part in the thickness direction; A first light-shielding ink layer provided on the side where the second surface of the first substrate is located; A grating processing layer provided on the side where the first surface of the first substrate is located; A grating pattern layer located between the first substrate and the first light-shielding ink layer; and A pattern effect layer provided between the first substrate and the grating processing layer, or provided between the first substrate and the grating processing layer, and between the grating pattern layer and the first light-shielding ink layer; The pattern effect layer includes a heat transfer film layer provided between the first substrate and the grating processing layer; or the pattern effect layer includes a standing gold flake layer provided between the first substrate and the grating processing layer.

2. The intelligent card according to claim 1, characterized in that, The grating processing layer includes a grating processing part and a non-processing part, and the non-processing part covers the standing gold flake layer.

3. The intelligent card according to claim 1, characterized in that, The pattern effect layer includes a first screen printing effect film layer provided between the first substrate and the grating processing layer.

4. The intelligent card according to claim 1, characterized in that, The pattern effect layer includes a second screen printing effect film layer provided between the grating pattern layer and the first light-shielding ink layer.

5. The intelligent card according to claim 1, characterized in that, The front substrate part further includes a first protective film layer provided between the first substrate and the grating processing layer.

6. The intelligent card according to claim 5, characterized in that, The pattern effect layer includes a standing gold flake layer provided between the first substrate and the first protective film layer; and / or The pattern effect layer includes a heat transfer film layer provided between the first protective film layer and the grating processing layer.

7. The intelligent card according to claim 1, characterized in that, The front substrate part and the back substrate part are adhered through a pressure-sensitive adhesive layer.

8. The intelligent card according to any one of claims 1 to 7, characterized in that, The back substrate part includes: A second substrate having a third surface and a fourth surface in the thickness direction, and the third surface faces away from the front substrate part; A wire-wound antenna layer provided on the side where the fourth surface of the second substrate is located; A compensation layer provided on the side of the wire-wound antenna layer away from the second substrate.

9. The intelligent card according to claim 8, characterized in that, The back substrate part further includes: A second light-shielding ink layer provided on the fourth surface of the second substrate, and the wire-wound antenna layer is located on the side of the second light-shielding ink layer away from the second substrate; A back printing layer provided on the third surface of the second substrate; A second protective film layer provided on the side of the back printing layer away from the second substrate, and a magnetic stripe is provided on the second protective film layer.

10. The intelligent card according to claim 8, characterized in that, It further includes a chip. A groove is provided in the card substrate in the thickness direction, and the chip is embedded in the groove, and the chip is electrically connected to the wire-wound antenna layer.

11. A method for manufacturing an intelligent card, characterized in that, It includes forming a front substrate part, and the forming front substrate part includes: Providing a first substrate having a first surface and a second surface in the thickness direction; Forming a grating pattern layer on the side where the second surface of the first substrate is located; Form a pattern effect layer, where the pattern effect layer is formed on the side where the first surface of the first substrate is located, or, the pattern effect layer is formed on the side where the first surface of the first substrate is located and on the side of the grating pattern layer away from the first substrate; form a heat transfer film layer on the side where the first surface of the first substrate is located, or, form a standing gold foil layer on the side where the first surface of the first substrate is located; Form a first light-shielding ink layer on the side of the grating pattern layer away from the first substrate; and Form a grating treatment layer on the side where the first surface of the first substrate is located, where the step of forming the grating treatment layer is located after the step of forming the pattern effect layer.

12. The manufacturing method of the smart card according to claim 11, wherein, The forming of the pattern effect layer includes: Form a first screen printing effect film layer on the side where the first surface of the first substrate is located.

13. The manufacturing method of the smart card according to claim 11, wherein, The forming of the pattern effect layer includes: Form a second screen printing effect film layer on the side of the grating pattern layer away from the first substrate, where the step of forming the second screen printing effect film layer is located before the step of forming the first light-shielding ink layer.

14. The manufacturing method of the smart card according to claim 11, wherein, The forming of the front substrate part further includes: Form a first protective film layer on the side where the first surface of the first substrate is located, where the step of forming the grating treatment layer is located after the step of forming the first protective film layer.

15. The manufacturing method of the smart card according to claim 14, wherein, The forming of the pattern effect layer includes forming a standing gold foil layer on the side where the first surface of the first substrate is located, and the step of forming the standing gold foil layer is located before the step of forming the first protective film layer; and / or The forming of the pattern effect layer includes forming a heat transfer film layer on the side where the first surface of the first substrate is located, and the step of forming the heat transfer film layer is located after the step of forming the first protective film layer.

16. The manufacturing method of the smart card according to claim 11, wherein, Further include: Form a back substrate part; Stack the front substrate part and the back substrate part in a manner that the grating treatment layer faces away from the back substrate part, and fix the front substrate part and the back substrate part into one body through a pressure-sensitive adhesive layer to form a card substrate.

17. The manufacturing method of the smart card according to claim 16, wherein, The forming of the back substrate part includes: Provide a second substrate, and the second substrate has a third surface and a fourth surface in the thickness direction; Form a second light-shielding ink layer on the side where the fourth surface of the second substrate is located; Form a back printing layer on the side where the third surface of the second substrate is located; Provide a winding antenna layer, and dispose the winding antenna layer on the side of the second light-shielding ink layer away from the second substrate; Form a compensation layer on the side of the winding antenna layer away from the second substrate.

18. The manufacturing method of the smart card according to claim 16, wherein, After the step of forming the card substrate, further include: Package a chip into the card substrate to form a smart card.

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