Array substrate and manufacturing method thereof, and display panel

Abstract

The present invention provides an array substrate, a method for manufacturing the same, and a display panel, belonging to the field of display technology. These methods can at least partially address the problem in existing display devices where the driving electric field is easily affected by other signals, thereby affecting the display effect. The array substrate of the present invention comprises: a substrate; a transistor structure located on the substrate; a flexible circuit board, one end of which is connected to the transistor structure and the other end of which can be bent to a side of the substrate away from the transistor structure; and a shielding conductive layer located on the flexible circuit board for shielding the array substrate from interference electric fields in the external environment.

Description

Technical Field

[0001] The present invention belongs to the field of display technology, and particularly relates to an array substrate and a preparation method thereof, and a display panel. Background Art

[0002] With the continuous development of display technology, the performance of display devices has been continuously improved and the application scope of display devices has been continuously expanded. Liquid crystal display devices and organic light emitting diode display devices are the most widely used types of display devices.

[0003] For a liquid crystal display device, a driving electric field generated by a driving electrode drives the deflection of liquid crystal molecules in the liquid crystal layer to realize the display of the liquid crystal display device. However, the inventors found that the driving electric field is easily affected by other signals, thereby adversely affecting the display effect of the liquid crystal display device. Summary of the Invention

[0004] The present invention at least partially solves the problem that the driving electric field of the existing display device is easily affected by other signals and thus affects the display effect, and provides an array substrate that can ensure the display effect.

[0005] The technical solution adopted to solve the technical problem of the present invention is an array substrate, comprising:

[0006] substrate;

[0007] a transistor structure located on the substrate;

[0008] a flexible circuit board, one end of which is connected to the transistor structure, and the other end of which can be bent to a side of the substrate away from the transistor structure;

[0009] The shielding conductive layer is located on the flexible circuit board and is used to shield the array substrate from the influence of the interference electric field in the external environment.

[0010] It is further preferred that it also includes: a wire structure, located on the side of the transistor structure away from the substrate, the shielding conductive layer is located on the first surface of the flexible circuit board, and the shielding conductive layer covers at least part of the wire structure, and the first surface is the surface of the flexible circuit board away from the transistor structure.

[0011] Further preferably, the shielding conductive layer includes: a black conductive layer, a black conductive glue and an insulating layer stacked in sequence, and the insulating layer separates the black conductive glue from the flexible circuit board.

[0012] Further preferably, the array substrate further includes: a heat dissipation layer located on a second surface of the flexible circuit board, where the second surface is a surface of the flexible circuit board opposite to the first surface.

[0013] Further preferably, the heat dissipation layer covers at least a portion of the transistor structure.

[0014] Further preferably, the heat dissipation layer includes a first insulating layer, a thermal conductive adhesive layer, and a second insulating layer stacked in sequence.

[0015] Further preferably, the shielding conductive layer and the heat dissipation layer are an integrally formed structure.

[0016] Further preferably, the array substrate further comprises: a chip structure located on a side of the transistor structure away from the substrate, and the chip structure is located between the transistor structure and the shielding conductive layer.

[0017] The technical solution adopted to solve the technical problem of the present invention is a display panel, comprising:

[0018] The above-mentioned array substrate;

[0019] The backlight module is located on the side of the substrate of the array substrate away from the transistor structure of the array substrate, the flexible circuit board of the array substrate is bent from the array substrate to the side of the backlight module away from the array substrate, and the shielding conductive layer of the array substrate is bent from the array substrate to the side of the backlight module away from the array substrate.

[0020] Further preferably, the array substrate further comprises: a color filter substrate located on a side of the transistor structure away from the substrate, with a gap between the color filter substrate and the chip structure of the array substrate.

[0021] Further preferably, the heat dissipation layer of the array substrate is bent from the array substrate to a side of the backlight module away from the array substrate.

[0022] The technical solution adopted to solve the technical problem of the present invention is a method for preparing an array substrate. Based on the above array substrate, the method includes:

[0023] forming a transistor structure on a substrate;

[0024] forming a flexible circuit board, wherein one end of the flexible circuit board is connected to the transistor structure;

[0025] A shielding conductive layer is formed on the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following detailed description, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0027] Figure 1is a structural schematic diagram of an array substrate according to an embodiment of the present invention;

[0028] Figure 2 is a schematic cross-sectional view of a shielding conductive layer according to an embodiment of the present invention;

[0029] Figure 3 This is a schematic structural diagram of a shielding conductive layer according to an embodiment of the present invention;

[0030] Figure 4 is a cross-sectional schematic diagram of a heat dissipation layer according to an embodiment of the present invention;

[0031] Figure 5 Schematic diagram of the structure of a heat dissipation layer according to an embodiment of the present invention;

[0032] Figure 6 A schematic structural diagram of a display panel according to an embodiment of the present invention

[0033] Figure 7 is a schematic structural diagram of a display panel according to an embodiment of the present invention;

[0034] Figure 8 A structural side view of a display panel according to an embodiment of the present invention;

[0035] Figure 9 is a schematic structural diagram of a display panel according to an embodiment of the present invention;

[0036] Figure 10 A structural side view of a display panel according to an embodiment of the present invention;

[0037] Figure 11 Schematic diagram of a process for preparing an array substrate according to an embodiment of the present invention;

[0038] Among them, the figures are marked as: 1. substrate; 2. transistor structure; 3. flexible circuit board; 4. shielding conductive layer; 41. black conductive layer; 42. black conductive glue; 43. insulating layer; 5. wire structure; 6. heat dissipation layer; 61. first insulating layer; 62. thermal conductive glue layer; 63. second insulating layer; 7. chip structure; 8. color film substrate; 9. backlight module. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0040] In the present invention, "patterning process" refers to the steps of forming a structure with a specific pattern, which may be a photolithography process, which includes one or more steps of forming a material layer, coating a photoresist, exposing, developing, etching, and photoresist stripping; of course, the "patterning process" may also be other processes such as an imprinting process and an inkjet printing process.

[0041] The present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, identical elements are represented by similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale. In addition, some well-known parts may not be shown in the drawings.

[0042] Many specific details of the present invention are described below, such as component structures, materials, dimensions, processing techniques, and technologies, to provide a clearer understanding of the present invention. However, as will be appreciated by those skilled in the art, the present invention may be practiced without these specific details.

[0043] Example 1:

[0044] like Figures 1 to 11 As shown, this embodiment provides an array substrate, comprising: a substrate 1, a transistor structure 2, a flexible circuit board 3, and a shielding conductive layer 4. The transistor structure 2 (TFT) is located on the substrate 1; the flexible circuit board 3 has one end connected to the transistor structure 2 and the other end capable of being bent to a side of the substrate 1 away from the transistor structure 2; and the shielding conductive layer 4 is located on the flexible circuit board 3 and is used to shield the array substrate from interference electric fields in the external environment.

[0045] The array substrate of this embodiment has a display area (such as Figure 1 The flexible circuit board 3 includes a region AA in the array substrate and an edge region surrounding the display area. The display area is provided with a display unit for displaying an image. One end of the flexible circuit board 3 is connected to the transistor structure 2 in the edge region. The flexible circuit board 3 provides a drive signal to the display unit of the array substrate through the transistor structure 2, enabling the display unit to display an image. A shielding conductive layer 4 is provided on the surface of the flexible circuit board 3 to shield the array substrate from interference electric fields from the external environment.

[0046] It should be noted that the array substrate of this embodiment can be a liquid crystal display array substrate (TLCM) or other suitable array substrate. The following description uses a liquid crystal display array substrate (TLCM) as an example. When the array substrate is a liquid crystal display array substrate, the display unit of the array substrate is a liquid crystal layer. The liquid crystal molecules in the liquid crystal layer are deflected by the driving electric field generated by the driving electrodes to form a display image.

[0047] The inventors have discovered that in the prior art array substrate, the interference electric field in the external environment surrounding the array substrate may interfere with the driving electric field of the array substrate, thereby affecting the display performance of the array substrate.

[0048] In the array substrate of this embodiment, when one end of the flexible circuit board 3 is connected to the transistor structure 2 and the other end can be bent to the side of the substrate 1 away from the transistor structure 2, the shielding conductive layer 4 located on the flexible circuit board 3 can play a shielding role, thereby avoiding the influence of the interference electric field in the external environment on the driving electric field of the array substrate, thereby ensuring the performance of the array substrate.

[0049] In addition, the shape of the shielding conductive layer 4 can match the shape of the flexible circuit board 3, and the number of the shielding conductive layers 4 can also match the number of the flexible circuit boards 3, such as Figure 3 It should be noted that the structure of the shielding conductive layer 4 is not limited to the above structure, and may also be other suitable structures.

[0050] Preferably, the array substrate also includes: a wire structure 5, located on the side of the transistor structure 2 away from the substrate 1, a shielding conductive layer 4 located on the first surface of the flexible circuit board 3, and the shielding conductive layer 4 covers at least part of the wire structure 5, and the first surface is the surface of the flexible circuit board 3 away from the transistor structure 2.

[0051] The conductive structure includes various wirings in the edge area of ​​the array substrate, such as data lines, gate lines, etc. The connecting portion between the shielding conductive layer 4 and the transistor structure 2 covers the wire structure 5 .

[0052] Since the shielding conductive layer 4 covers part of the routing structure, the shielding conductive layer 4 can not only provide shielding protection for the routing structure, thereby avoiding the influence of external interference electric fields on the wire structure 5, but also the shielding conductive layer 4 can release excess charge on the wire structure 5, thereby avoiding the influence of the interference electric field generated by the charge on the wire structure 5 on the driving electric field.

[0053] Preferably, Figure 2 As shown, the shielding conductive layer 4 includes: a black conductive layer 41 (Black Conductive Fabtic), a black conductive adhesive 42 (Black Conductive Adhesive) and an insulating layer 43 (Paper Liner) stacked in sequence. The insulating layer 43 separates the black conductive adhesive 42 from the flexible circuit board 3.

[0054] Specifically, in the direction from the first surface of the flexible circuit board 3 toward the first surface away from the flexible circuit board 3, the structure of the shielding conductive layer 4 is, in order, an insulating layer 43, black conductive adhesive 42, and a black conductive layer 41. The black conductive adhesive 42 connects the insulating layer 43 and the black conductive layer 41; the insulating layer 43 separates the black conductive adhesive 42 from the flexible circuit board 3, thereby ensuring the signal transmission performance of the flexible circuit board 3. The black conductive layer 41 ensures the conductivity of the shielding conductive layer 4, thereby ensuring the release of excess charge on the wire structure 5.

[0055] Preferably, the array substrate further includes: a heat dissipation layer 6 located on the second surface of the flexible circuit board 3 , where the second surface is a surface of the flexible circuit board 3 opposite to the first surface.

[0056] The second surface of the flexible circuit board 3 has a heat dissipation layer 6 , that is, the heat dissipation layer 6 and the shielding conductive layer 4 are respectively provided on the two surfaces of the flexible circuit board 3 .

[0057] The flexible circuit board 3 may have an overheated temperature during signal transmission. When the temperature of the flexible circuit board 3 is too high, the heat dissipation layer 6 can quickly dissipate the heat of the flexible circuit board 3, that is, quickly conduct the heat away from the flexible circuit board 3.

[0058] In addition, the shape of the heat dissipation layer 6 can match the shape of the flexible circuit board 3, and the number of the heat dissipation layers 6 can also match the number of the flexible circuit boards 3, such as Figure 5 It should be noted that the structure of the heat dissipation layer 6 is not limited to the above structure, and may also be other suitable structures.

[0059] Preferably, the heat dissipation layer 6 covers at least a portion of the transistor structure 2 .

[0060] During operation of the array substrate, the temperature of the transistor structure 2 may be too high. When the temperature of the transistor structure 2 is too high, the heat dissipation layer 6 can accelerate the heat dissipation of the transistor structure 2, that is, quickly dissipate the heat of the transistor structure 2.

[0061] Preferably, Figure 4 As shown, the heat dissipation layer 6 includes a first insulating layer 61 (PET film), a thermal conductive adhesive layer 62 (Thermal Conductive Adhesive Tape), and a second insulating layer 63 (PET film) stacked in sequence.

[0062] Specifically, in the direction from the second surface of the flexible circuit board 3 toward the second surface away from the flexible circuit board 3, the structure of the shielding conductive layer 4 is, in order, a first insulating layer 61, a thermally conductive adhesive layer 62, and a second insulating layer 63. The first insulating layer 61 is used to insulate the thermally conductive adhesive layer 62 from the flexible circuit board 3 and the transistor structure 2, thereby ensuring the performance of the flexible circuit board 3 and the transistor structure 2. The thermally conductive adhesive layer 62 has strong thermal conductivity. The second insulating layer 63 ensures insulation between the thermally conductive adhesive layer 62 and other structures in the array substrate.

[0063] Preferably, the shielding conductive layer 4 and the heat dissipation layer 6 are an integrally formed structure.

[0064] In other words, the shielding conductive layer 4 and the heat dissipation layer 6 can be an integral structure. This integral structure can be folded so that it can cover both surfaces of the flexible circuit board 3 at the same time, that is, sandwich the flexible circuit board 3 therebetween, serving as the shielding conductive layer 4 and the heat dissipation layer 6 respectively.

[0065] Preferably, the array substrate further includes: a chip structure 7 located on a side of the transistor structure 2 away from the substrate 1 , and the chip structure 7 is located between the transistor structure 2 and the shielding conductive layer 4 .

[0066] The chip structure 7 may include a display chip and a driver chip (TP chip) integrated on the display chip to drive the display unit to display.

[0067] Because chip structure 7 includes at least two chips, it is prone to overheating, which in turn causes overheating in transistor structure 2. The provision of heat dissipation layer 6 can quickly dissipate the temperature in chip structure 7 or transistor structure 2, thereby preventing the array substrate from overheating and improving the user experience.

[0068] If necessary, Figure 6 As shown, the display panel formed by the array substrate further includes a color filter layer 8 (CF) located on the side of the transistor structure 2 away from the substrate 1. If the resistance of the color filter layer 8 is relatively high, especially if it is formed from a high-resistance film, the charge on the color filter layer 8 is difficult to release, resulting in interference electric fields (EMI or EMS) and radiation. However, the shielding conductive layer 4 in the array substrate of this embodiment can prevent the interference electric field from affecting the transistor structure 2 and the conductive line structure 5, thereby ensuring the display performance of the array substrate.

[0069] Example 2:

[0070] like Figures 1 to 11As shown, this embodiment provides a display panel, comprising: the array substrate and a backlight module 9 in Embodiment 1. The backlight module 9 is located on a side of the substrate 1 of the array substrate away from the transistor structure 2 of the array substrate; the flexible circuit board 3 of the array substrate is bent from the array substrate to the side of the backlight module 9 away from the array substrate; and the shielding conductive layer 4 of the array substrate is bent from the array substrate to the side of the backlight module 9 away from the array substrate.

[0071] Among them, Figure 7 and Figure 8 As shown, the display panel includes stacked array substrates and a backlight module 9 . The backlight module 9 is used to provide light source to the array substrate so that a display image can appear on the side of the array substrate away from the backlight module 9 .

[0072] The flexible circuit board 3 is connected to the main board. In order to reduce the edge area of ​​the display panel, the flexible circuit board 3 is bent to the back of the backlight module 9 so that the main board is located on the back of the backlight module 9.

[0073] In the display panel of this embodiment, when one end of the flexible circuit board 3 is connected to the transistor structure 2 and the other end can be bent to the side of the substrate 1 away from the transistor structure 2, the shielding conductive layer 4 located on the flexible circuit board 3 can play a shielding role, thereby avoiding the influence of the interference electric field in the external environment on the driving electric field of the array substrate, thereby ensuring the performance of the array substrate.

[0074] At the same time, since the shielding conductive layer 4 covers part of the routing structure, the shielding conductive layer 4 can not only shield and protect the routing structure, thereby avoiding the influence of external interference electric fields on the wire structure 5, but also the shielding conductive layer 4 can release excess charges on the wire structure 5, thereby avoiding the influence of the interference electric field generated by the charges on the wire structure 5 on the driving electric field.

[0075] Preferably, Figure 9 and Figure 10 As shown, the heat dissipation layer 6 of the array substrate is bent from the array substrate to a side of the backlight module 9 away from the array substrate.

[0076] The flexible circuit board 3 may have an overheated temperature during signal transmission. When the temperature of the flexible circuit board 3 is too high, the heat dissipation layer 6 can quickly dissipate the heat of the flexible circuit board 3.

[0077] Furthermore, since the heat dissipation layer 6 covers at least a portion of the transistor structure 2, when the temperature of the transistor structure 2 is too high, the heat dissipation layer 6 can accelerate the heat dissipation of the transistor structure 2, that is, quickly dissipate the heat of the transistor structure 2. Furthermore, the display panel of this embodiment is a lightweight and low-cost product.

[0078] Preferably, Figure 6As shown, the array substrate further includes: a color filter substrate 8 (CF), which is located on a side of the transistor structure 2 away from the substrate 1 , and a gap exists between the color filter substrate 8 and the chip structure 7 of the array substrate.

[0079] The color filter substrate 8 may be located in the display area of ​​the array substrate, so as to enable the array substrate to form a color display screen.

[0080] It should be noted that the color filter substrate 8 has a relatively high resistance, especially when formed from a high-resistance film. This makes it difficult for the charge on the color filter substrate 8 to be released, resulting in interference electric fields (EMI or EMS) and radiation. However, the shielding conductive layer 4 in the array substrate of this embodiment can prevent the interference electric field from affecting the transistor structure 2 and the conductive line structure 5, thereby ensuring the display performance of the array substrate.

[0081] In addition, a transparent cover plate (CG) is provided on the upper side of the color filter substrate 8. The transparent cover plate can be a glass cover plate or other suitable cover plates. The transparent cover plate is attached by transparent adhesive, which can be OCR optical adhesive or OCA optical adhesive.

[0082] Specifically, the display panel can be any product or component with a display function, such as a liquid crystal display panel (in-cell TLCM), electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc.

[0083] Example 3:

[0084] like Figures 1 to 11 As shown, this embodiment provides a method for preparing an array substrate. Based on the array substrate of Example 1, the method includes steps S11 to S13.

[0085] In step S11 , a transistor structure 2 is formed on a substrate 1 .

[0086] The array substrate of this embodiment has a display area and an edge area surrounding the display area, and the transistor structure 2 is at least partially located in the edge area.

[0087] In step S12 , a flexible circuit board 3 is formed, and one end of the flexible circuit board 3 is connected to the transistor structure 2 .

[0088] One end of the flexible circuit board 3 is connected to the transistor structure 2 in the edge region. The flexible circuit board 3 can provide a driving signal to the display unit of the array substrate through the transistor structure 2 so that the display unit can display an image.

[0089] In step S13 , a shielding conductive layer 4 is formed on the flexible wiring board 3 .

[0090] Specifically, the shielding conductive layer 4 is attached to the flexible circuit board 3 by a specific method. The shielding conductive layer 4 is provided on the surface of the flexible circuit board 3 to shield the array substrate from interference electric fields in the external environment. The attachment of the shielding conductive layer 4 does not affect the subsequent attachment of the cover plate.

[0091] In the preparation method of the array substrate of this embodiment, when one end of the flexible circuit board 3 is connected to the transistor structure 2 and the other end can be bent to the side of the substrate 1 away from the transistor structure 2, the shielding conductive layer 4 located on the flexible circuit board 3 can play a shielding role, thereby avoiding the influence of the interference electric field in the external environment on the driving electric field of the array substrate, thereby ensuring the performance of the array substrate.

[0092] In addition, step S13 further includes: forming a heat dissipation layer 6 on the flexible circuit board 3 .

[0093] Specifically, the heat dissipation layer 6 is attached to the flexible circuit board 3 using a specific technique. The attachment of the heat dissipation layer 6 does not affect the subsequent attachment of the cover. The flexible circuit board 3 may overheat during signal transmission. When the temperature of the flexible circuit board 3 is too high, the heat dissipation layer 6 can quickly dissipate the heat from the flexible circuit board 3.

[0094] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0095] While embodiments of the present invention have been described above, these embodiments do not exhaustively describe all details and do not limit the invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification in order to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An array substrate, characterized in that: include: substrate; a transistor structure located on the substrate; a flexible circuit board, one end of which is connected to the transistor structure, and the other end of which can be bent to a side of the substrate away from the transistor structure; A shielding conductive layer, located on the flexible circuit board, for shielding the array substrate from the influence of an interference electric field in the external environment; The shielding conductive layer is located on a first surface of the flexible circuit board, and the first surface is a surface of the flexible circuit board away from the transistor structure; The array substrate further includes: a heat dissipation layer, located on a second surface of the flexible circuit board, where the second surface is a surface of the flexible circuit board opposite to the first surface; The shielding conductive layer and the heat dissipation layer are an integrally formed structure, and the integrally formed shielding conductive layer and heat dissipation layer are respectively covered on the first surface and the second surface of the flexible circuit board by folding.

2. The array substrate according to claim 1, wherein: Also includes: The conductive line structure is located on a side of the transistor structure away from the substrate, and the shielding conductive layer covers at least a portion of the conductive line structure.

3. The array substrate according to claim 1, wherein: The shielding conductive layer includes: a black conductive layer, a black conductive glue and an insulating layer stacked in sequence, and the insulating layer separates the black conductive glue from the flexible circuit board.

4. The array substrate according to claim 1, wherein: The heat dissipation layer covers at least a portion of the transistor structure.

5. The array substrate according to claim 1, wherein: Also includes: The chip structure is located on a side of the transistor structure away from the substrate, and the chip structure is located between the transistor structure and the shielding conductive layer.

6. A display panel, characterized in that: include: The array substrate according to any one of claims 1 to 5; The backlight module is located on the side of the substrate of the array substrate away from the transistor structure of the array substrate, the flexible circuit board of the array substrate is bent from the array substrate to the side of the backlight module away from the array substrate, and the shielding conductive layer of the array substrate is bent from the array substrate to the side of the backlight module away from the array substrate.

7. The display panel according to claim 6, wherein: Also includes: The color filter substrate is located on a side of the transistor structure away from the substrate, and a gap exists between the color filter substrate and the chip structure of the array substrate.

8. The display panel according to claim 6, wherein: The heat dissipation layer of the array substrate is bent from the array substrate to a side of the backlight module away from the array substrate.

9. A method for preparing an array substrate, characterized in that: Based on the array substrate according to any one of claims 1 to 5, the method comprises: forming a transistor structure on a substrate; forming a flexible circuit board, wherein one end of the flexible circuit board is connected to the transistor structure; A shielding conductive layer and a heat dissipation layer are formed on the flexible circuit board. The shielding conductive layer and the heat dissipation layer are an integral structure. The integral structure is folded and covers both surfaces of the flexible circuit board at the same time.

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