Vibration sensor packaging structure

Abstract

A vibration sensor packaging structure is disclosed, comprising: a substrate; a packaging shell, fixed on the first surface of the substrate, and forming a first cavity with the substrate; a MEMS chip, fixed on the first surface of the substrate and located in the first cavity, and the MEMS has a second cavity; wherein the substrate is provided with a first air hole penetrating the substrate, and the packaging shell is provided with at least one second air hole penetrating the packaging shell; one side of the MEMS chip is connected to the outside world via the first cavity and the second air hole, and the other side of the MEMS chip is connected to the outside world via the second cavity and the first air hole. The vibration sensor packaging structure of the present application forms a first air hole in the substrate and a second air hole in the packaging shell, so that both the upper and lower sides of the diaphragm can receive sound signals in the air, thereby reducing the noise interference of the sound signal in the air to the vibration sensor, and improving the yield and reliability of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of MEMS devices, and in particular to a vibration sensor packaging structure. Background Art

[0002] Vibration is widely present in nature, industry and human life, and different vibrations transmit various signals. To obtain the information carried in vibration, we need to use various vibration sensors, which are widely used in many fields such as energy, chemical industry, medicine, automobile, metallurgy, machinery manufacturing, military industry, scientific research and teaching. For example, the sound signal transmitted by air vibration is read through a microphone; the accelerometer is used to measure the acceleration of the vibrating object; the ultrasonic detector detects and analyzes the vibration signal of mechanical equipment to determine the degree of deterioration of the machine itself and predict its life; the geological disaster early warning device detects the geological vibration caused by seismic waves to warn of earthquakes and other disasters.

[0003] Common sensors in the market include microphone sensors, pressure sensors, and acceleration sensors. Microphone sensors have been extended to bone conduction microphones that convert sound signals through vibration. Traditional bone conduction microphones transmit compressed air to the MEMS diaphragm through the vibration of the mass block. However, the existing vibration microphones are easily affected by the sound signals transmitted in the air, resulting in large noise in the received signals, thereby reducing the yield and reliability of the vibration sensor. Summary of the invention

[0004] In view of the above problems, the object of the present invention is to provide a vibration sensor packaging structure, which reduces the influence of the sound signal on the vibration signal in the signal received by the sensor by changing the air flow path in the vibration sensor, thereby improving the yield and reliability of the vibration sensor.

[0005] According to one aspect of the present invention, a vibration sensor packaging structure is provided, characterized in that it includes: a substrate; a packaging shell, fixed on the first surface of the substrate and forming a first cavity between the packaging shell and the substrate; a MEMS chip, fixed on the first surface of the substrate and located in the first cavity, and the MEMS has a second cavity; wherein the substrate is provided with a first air hole penetrating the substrate, and the packaging shell is provided with at least one second air hole penetrating the packaging shell; one side of the MEMS chip is connected to the outside world via the first cavity and the second air hole, and the other side of the MEMS chip is connected to the outside world via the second cavity and the first air hole.

[0006] Optionally, the second air hole is located on the upper surface and / or side surface of the packaging shell.

[0007] Optionally, it also includes: a PCB board, located on the second surface of the substrate; a rubber sleeve, arranged on the periphery of the packaging shell and the PCB board; wherein the first air hole also penetrates the PCB board, and a sound channel is formed between the rubber sleeve and the second air hole, part of the packaging shell and part of the PCB board, and the second air hole is connected to the outside world via the sound channel.

[0008] Optionally, a sound channel is formed between a portion of the upper surface of the packaging shell, one of the side surfaces of the packaging shell, a portion of the lower surface of the PCB board, and the rubber sleeve.

[0009] Optionally, a sound channel is formed between a portion of the side surface of the packaging shell and a portion of the lower surface of the PCB board and the rubber sleeve.

[0010] Optionally, the rubber sleeve has a second opening, and the second opening connects the sound channel with the external environment.

[0011] Optionally, the second opening is arranged opposite to the first air hole and / or the second air hole.

[0012] Optionally, the second opening is located in a middle area of ​​the sound channel.

[0013] Optionally, the first air hole is located directly below the MEMS chip.

[0014] Optionally, the MEMS chip further includes a diaphragm and a back plate, and the positions of the diaphragm and the back plate are interchangeable.

[0015] Optionally, a cross-sectional shape of the second air hole along the surface of the packaging shell is any one of square, circular and polygonal.

[0016] Optionally, it further includes: an ASIC chip, and the MEMS chip is electrically connected to the ASIC chip.

[0017] Optionally, the second surface of the substrate includes a first solder pad and a second solder pad.

[0018] Optionally, the PCB board is electrically connected to the first pad and the second pad.

[0019] The vibration sensor packaging structure provided by the present invention forms a second air hole in the packaging shell, and the second air hole is connected to the first cavity of the sensor, and the first air hole is connected to the second cavity, so that the upper and lower sides of the diaphragm of the MEMS chip can receive air and pressure, thereby reducing the noise interference of the sound signal to the vibration sensor when only the second cavity of the MEMS chip receives air and pressure, thereby improving the yield and reliability of the vibration sensor.

[0020] The vibration sensor packaging structure provided by the present invention forms a second air hole in the packaging shell, and uses a rubber sleeve to surround the PCB board and the packaging shell, so that a sound channel connecting the first air hole and the second air hole is formed between the rubber sleeve, the PCB board and the packaging shell, and a second opening is formed at a position of the rubber sleeve corresponding to the first air hole or the second air hole to connect the outside with the sound channel, so that the sound signals reaching the upper and lower sides of the diaphragm through the first air hole and the second air hole are of the same source, thereby greatly reducing the noise interference of the sound signal on the vibration sensor.

[0021] In a preferred embodiment, the second opening of the rubber sleeve is located in the middle part of the sound channel, so that the length of the path of the air flow entering the sound channel through the second opening to reach the upper and lower sides of the diaphragm can be adjusted. When the lengths of the two paths are roughly the same, the vibration sensor packaging structure has the strongest anti-interference ability. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0023] Figure 1 A structural diagram showing a vibration sensor packaging structure according to a first embodiment of the present invention;

[0024] Figure 2a and Figure 2b A schematic diagram of a first surface of a substrate in a vibration sensor packaging structure according to a first embodiment of the present invention is shown;

[0025] Figure 3 A schematic diagram showing a second surface of the substrate in the vibration sensor packaging structure of the first embodiment of the present invention is shown;

[0026] Figure 4 A structural diagram showing a vibration sensor packaging structure according to a second embodiment of the present invention;

[0027] Figure 5 A structural diagram showing a vibration sensor packaging structure according to a third embodiment of the present invention;

[0028] Figure 6 A structural diagram showing a vibration sensor packaging structure according to a fourth embodiment of the present invention. DETAILED DESCRIPTION

[0029] The present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, the same elements are represented by similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale. In addition, some well-known parts may not be shown. For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.

[0030] It should be understood that when describing the structure of a device, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Furthermore, if the device is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0031] If it is intended to describe a situation where it is directly on another layer or another area, this article will use the expression “directly on…” or “on… and adjacent to…”.

[0032] The specific implementation of the present invention is further described in detail below in conjunction with the drawings and examples.

[0033] Figure 1 A structural diagram showing a vibration sensor packaging structure according to a first embodiment of the present invention; Figure 2a and Figure 2b A schematic diagram of a first surface of a substrate in a vibration sensor packaging structure according to a first embodiment of the present invention is shown; Figure 3 A schematic diagram of the second surface of the substrate in the vibration sensor packaging structure of the first embodiment of the present invention is shown.

[0034] refer to Figure 1 The vibration sensor packaging structure 100 of the embodiment of the present invention includes: a substrate 3, in which a first air hole 5 penetrating the substrate 3 is formed; a packaging shell 1, which is fixed to the first surface of the substrate 3, and a first cavity 2 is formed between the packaging shell 1 and the substrate 3, and the first air hole 5 is located in the first cavity 2. The packaging shell 1 has a second air hole 4, and the second air hole 4 connects the first cavity with the external environment; a MEMS chip 10, which is arranged in the first cavity 2, and the MEMS chip 10 includes a diaphragm 11, a back plate 12 and a supporting structure. The top of the supporting structure supports the diaphragm 11 and the back plate 12, and the bottom is fixed to the first surface of the substrate 3, and a second cavity 6 is formed between the diaphragm 11, the supporting structure and the substrate 3, and the second cavity 6 is located above the first air hole 5, so that the second cavity 6 is connected to the outside through the first air hole 5.

[0035] The vibration sensor package structure 100 further includes an ASIC chip 13, which is disposed on the first surface of the substrate 3 in the first cavity 2. The ASIC chip 13 is a dedicated integrated circuit chip, which is connected to the MEMS chip 10 through a wire 14. In this specific embodiment, the dedicated integrated circuit chip 13 is fixed to the first surface of the substrate 3. In other specific embodiments, the dedicated integrated circuit chip 13 can also be embedded or integrated inside the substrate 3. The dedicated integrated circuit chip 13 is used to obtain the sensing signal output by the MEMS chip 10 and process it.

[0036] The material of the substrate 3 can be RF-4, BT or ceramic substrate and other commonly used substrate materials. A sealing ring 15 is formed on the first surface of the substrate 3 and surrounds the edge of the first surface of the substrate 3. Figure 2a and Figure 2b The package shell 1 is fixedly connected to the first surface of the substrate 3 through the sealing ring 15 to form a first cavity 2. The second surface of the substrate 3 is formed with a first pad 7 and / or a second pad 9 for providing an electrical connection point, such as Figure 3 The substrate 3 may be a single-layer or multi-layer circuit board, and the first surface of the substrate 3 may also be formed with a circuit structure or an electrical contact portion, such as a solder pad, etc. An electrical connection structure may also be formed inside the substrate 3 to connect the electrical contact portions on the first surface and the second surface of the substrate 3.

[0037] The packaging shell 1 serves as a packaging shell of the vibration sensor packaging structure, which is used to protect the internal electronic components and form a first cavity 2 between the substrate 3. The packaging shell 1 can be made of metal, which is resistant to high temperatures and has a simple production process, and can be mass-produced. In addition, the metal shell packaging shell 1 also has the characteristics of corrosion resistance, electromagnetic shielding, and high mechanical properties, which provide a high degree of protection for the product. In other embodiments, the packaging shell 1 can also be made of other hard materials such as plastic, which is not limited here. The edge of the packaging shell 1 is fixed to the sealing ring 15 on the first surface of the substrate 3 by welding or gluing, so that a first cavity 2 is formed between the packaging shell 1 and the substrate 3.

[0038] In this embodiment, a second air hole 4 penetrating the packaging shell 1 is formed on the top of the packaging shell 1, and the sound signal in the air can reach the upper side of the diaphragm 11 of the MEMS chip 10 via the second air hole 4 and the first cavity 2, thereby offsetting the sound signal reaching the lower side of the diaphragm 11 of the MEMS chip 10 via the first air hole 5 and the second cavity 6, thereby improving the anti-interference ability of the device. In some specific embodiments, the cross-section of the second air hole 4 along the direction parallel to the first surface of the substrate 3 can also be square, circular, polygonal, etc. In some specific embodiments, the cross-sectional shape of the second air hole along the direction perpendicular to the first surface of the substrate 3 is various shapes such as trapezoidal, rectangular, arc-shaped or polygonal. Those skilled in the art can reasonably set the shape of the second air hole 4.

[0039] The MEMS chip 10 is used as a sensing element for sound signals, and the positions of the diaphragm 11 and the back plate 12 can be interchanged. The bottom of the MEMS chip 10 is fixedly connected to the first surface of the substrate 3 through the colloid 8 .

[0040] The MEMS chip 10 includes a second cavity 6 as a back cavity. The pressure sensing layer of the MEMS chip 10 includes a back plate 12 and a diaphragm 11, which are arranged opposite to each other to form a sensing capacitor. When the pressure in the second cavity 6 changes, the pressure sensing layer is deformed, so that the capacitance value changes and a sensing signal is output.

[0041] The support structure of the MEMS chip 10 is fixed to the first surface of the substrate 3 through the colloid 8. When fixing the MEMS chip 10, a certain force is applied to the MEMS chip 10 through the device, so that the bottom of the support structure has a larger contact area with the colloid 8, thereby improving the fixing effect. The colloid is squeezed and overflows to both sides of the bottom of the support structure, overflows to both sides of the support structure, and climbs up a certain height along the outer wall of the MEMS chip 10. Subsequently, the colloid is solidified at a certain temperature and for a certain time, thereby realizing a close connection between the MEMS chip 10 and the substrate 3.

[0042] In this embodiment, a first air hole 5 is formed in the substrate 3 and passes through the substrate 3. The second cavity 6 of the MEMS chip 10 is connected to the outside via the first air hole 5. A second air hole 4 is formed on the top of the packaging shell 1, and the first cavity 2 is connected to the external environment via the second air hole 4. Therefore, the upper and lower sides of the diaphragm 11 of the MEMS chip 10 can receive the sound signal transmitted in the air. However, since they are respectively located on the upper and lower sides of the diaphragm 11, the sound signals can cancel each other out, reducing the interference of the sound signal on the vibration signal, which not only improves the anti-interference ability of the vibration sensor packaging structure 100, but also improves the yield and reliability of the device.

[0043] In other embodiments, the second air hole 4 may be located at any position on the upper surface or the side surface of the packaging shell 1 , and the number of the second air hole 4 may be one or more.

[0044] Figure 4 The structure diagram of the vibration sensor packaging structure of the second embodiment of the present invention is shown. Compared with the vibration sensor packaging structure 100 of the first embodiment, the vibration sensor packaging structure 200 of the second embodiment adds some structures on the basis of the first embodiment, and the similarities are not repeated here, and only the differences are described.

[0045] refer to Figure 4In the vibration sensor packaging structure 200 of the second embodiment, on the second surface of the substrate 3, a PCB board 16 is also included. The PCB board 16 is electrically connected to the first pad 7 and the second pad 9 on the second surface of the substrate 3. At the position of the PCB board 16 corresponding to the first air hole 5, a first opening 19 penetrating the PCB board is formed, so that the second cavity 6 is connected to the outside world through the first air hole 5 and the first opening 19 of the PCB board 16; the rubber sleeve 17, the rubber sleeve 17 wraps the PCB board 16, the substrate 3 and the packaging shell 1, and a second opening 20 is formed in the rubber sleeve 17 at a position corresponding to the first air hole 5, so that the second cavity 6 can also communicate with the outside world through the first air hole 5, the first opening 19 of the PCB board 16 and the second opening 20 of the rubber sleeve 17. In this embodiment, for the convenience of description, the first opening 19 of the PCB board 16, the second opening 20 of the rubber sleeve 17, and the first air hole 5 in the substrate 3 can be collectively referred to as the first air hole, that is, the first air hole penetrates the substrate 3, the PCB board 16 and the rubber sleeve 17.

[0046] In this embodiment, on one side of the rubber sleeve 17, a sound channel 18 is formed between the rubber sleeve 17 and the PCB board 16, the substrate 3 and the packaging shell 1. One end of the sound channel 18 is connected to the second opening 20 of the rubber sleeve 17, that is, it is connected to the first air hole 5, and the other end is connected to the second air hole 4 on the packaging shell 1, so that the first cavity 2 is connected to the outside world via the second air hole 4, the sound channel 18 and the second opening 20.

[0047] exist Figure 4 In the embodiment, only one embodiment is shown in which a sound channel 18 is formed in the rubber sleeve 17 to connect the first air hole 5 and the second air hole 4. The sound channel 18 can also connect the first air hole 5 and the second air hole 4 along other paths. Of course, the position of the second air hole 4 can also be any position on the upper surface of the packaging shell 1.

[0048] Figure 5 The structure diagram of the vibration sensor packaging structure of the third embodiment of the present invention is shown. Compared with the vibration sensor packaging structure 200 of the second embodiment, the second air hole 4 in the vibration sensor packaging structure 300 of the third embodiment is located differently, and the similarities are not repeated here, only the differences are described.

[0049] refer to Figure 5 In the vibration sensor packaging structure 300, the second air hole 4 on the packaging shell 1 is located in the side surface of the packaging shell 1, and the sound channel 18 connects the second opening 20 of the rubber sleeve 17 with the second air hole 4, that is, the first air hole 5 is connected with the second air hole 4 via the sound channel 18, so that the upper and lower sides of the diaphragm of the MEMS chip 10 can receive sound signals in the air.

[0050] In this embodiment, the height of the second air hole 4 on the package shell 1 is the same as the height of the MEMS chip 10 in the first cavity 2, and the air flow entering the first cavity 2 from the second air hole 4 can easily reach the upper side of the diaphragm 11. In other embodiments, the position and height of the second air hole 4 can also be any position on the side of the package shell 1.

[0051] Figure 6 The structure diagram of the vibration sensor packaging structure of the fourth embodiment of the present invention is shown. Compared with the vibration sensor packaging structure 200 of the second embodiment, the second buckle 20 of the rubber sleeve 17 in the vibration sensor packaging structure 400 of the fourth embodiment is different in position, and the similarities are not repeated here, and only the differences are described.

[0052] refer to Figure 6 In the vibration sensor packaging structure 400, the sound channel 18 connects the first air hole 5 and the second air hole 4, and the second opening 20 of the rubber sleeve 17 is located in the middle part of the sound channel 18. The air flow through the second opening 20 reaches the first air hole 5 and the second air hole 4 through the sound channel 18 respectively, and then reaches the upper and lower sides of the diaphragm.

[0053] In other embodiments, the second air hole 4 is, for example, located on the side of the packaging shell 1 . In this case, the second opening 20 of the rubber sleeve 17 may also be located in the middle part of the sound channel 18 , and the sound channel 18 connects the first air hole 5 and the second air hole 4 .

[0054] In this embodiment, the second opening 20 of the rubber sleeve 17 is located in the middle part of the sound channel 18, so that the length of the path of the air flow entering the sound channel 18 through the second opening 20 to reach the upper and lower sides of the diaphragm 11 can be adjusted. When the lengths of the two paths are roughly the same, the vibration sensor packaging structure 400 has the strongest anti-interference ability.

[0055] When the vibration sensor is in use, the caller makes a sound, and the sound reaches the vibration sensor through two channels: air and vibration. Among them, the sound signal in the air reaches the second cavity 6 of the MEMS chip 10 through the first air hole 5, causing the capacitance value between the diaphragm 11 and the back plate 12 to change, thereby obtaining a sound signal. The sound signal transmitted by the vibration reaches the diaphragm 11 and the back plate 12 of the MEMS chip 10 along the structure of the vibration sensor, causing the capacitance value between the diaphragm 11 and the back plate 12 to change, thereby obtaining a sound signal. However, in the vibration sensor, the change in capacitance between the diaphragm 11 and the back plate 12 caused by the sound signal in the air causes noise interference to the sound signal obtained by vibration. In this embodiment, part of the sound signal in the air reaches the second cavity 6 of the MEMS chip 10 along the first air hole 5, forcing the diaphragm 11 to vibrate, and part reaches the MEMS chip 10 along the second air hole 4 or the first air hole 5, the sound channel 18, the second air hole 4 and the first cavity 2, forcing the diaphragm 11 to vibrate from the opposite direction. Since the same air pressure in two opposite directions acts on the same diaphragm 11, the sound signal in the air is canceled. When the sound emitted by the caller is transmitted through the oral bones to the vibration sensor of the earphone close to the bones, the vibration is transmitted through the earphone shell to the substrate 3 of the vibration sensor and then to the MEMS chip 10, causing the diaphragm 11 on the surface of the MEMS chip 10 to vibrate, forming a parallel plate capacitor with the back plate 12 of the MEMS chip 10, and the integrated circuit chip 13 receives the signal of the capacitance change for processing.

[0056] When making a call in a noisy environment, the vibration sensor of the present application can automatically shield the sound signal and only transmit the sound signal transmitted by the bone vibration of the caller when speaking, thereby achieving the highest quality noise reduction.

[0057] In addition, the vibration sensor is not only used for call headsets, but can also be applied to other electronic products that work on the same principle.

[0058] The vibration sensor packaging structure provided by the present invention forms a second air hole in the packaging shell, and the second air hole is connected to the first cavity of the sensor, and the first air hole is connected to the second cavity, so that the upper and lower sides of the diaphragm of the MEMS chip can receive air and pressure, thereby reducing the noise interference of the sound signal to the vibration sensor when only the second cavity of the MEMS chip receives air and pressure, thereby improving the yield and reliability of the vibration sensor.

[0059] The vibration sensor packaging structure provided by the present invention forms a second air hole in the packaging shell, and uses a rubber sleeve to surround the PCB board and the packaging shell, so that a sound channel connecting the first air hole and the second air hole is formed between the rubber sleeve, the PCB board and the packaging shell, and a second opening is formed at a position of the rubber sleeve corresponding to the first air hole or the second air hole to connect the outside with the sound channel, so that the sound signals reaching the upper and lower sides of the diaphragm through the first air hole and the second air hole are of the same source, thereby greatly reducing the noise interference of the sound signal on the vibration sensor.

[0060] In a preferred embodiment, the second opening of the rubber sleeve is located in the middle part of the sound channel, so that the length of the path of the air flow entering the sound channel through the second opening to reach the upper and lower sides of the diaphragm can be adjusted. When the lengths of the two paths are roughly the same, the vibration sensor packaging structure has the strongest anti-interference ability.

[0061] According to the embodiments of the present invention as described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and the modified use based on the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A vibration sensor packaging structure, characterized in that: include: substrate; A packaging shell is fixed on the first surface of the substrate and forms a first cavity with the substrate; A MEMS chip is fixed on the first surface of the substrate and is located in the first cavity, and the MEMS has a second cavity; The substrate is provided with a first air hole penetrating the substrate, and the packaging shell is provided with at least one second air hole penetrating the packaging shell; One side of the MEMS chip is connected to the outside world via the first cavity and the second air hole, and the other side of the MEMS chip is connected to the outside world via the second cavity and the first air hole. The sound signal reaching the MEMS chip diaphragm through the first air hole and the sound signal reaching the MEMS chip diaphragm through the second air hole cancel each other out.

2. The vibration sensor packaging structure according to claim 1, characterized in that: The second air hole is located on the upper surface and / or the side surface of the packaging shell.

3. The vibration sensor packaging structure according to claim 2, characterized in that: Also includes: A PCB board is located on the second surface of the substrate; A rubber sleeve, arranged on the periphery of the packaging shell and the PCB board; The first air hole also penetrates the PCB board, and a sound channel is formed between the rubber sleeve and the second air hole, part of the packaging shell and part of the PCB board, and the second air hole is connected to the outside through the sound channel.

4. The vibration sensor packaging structure according to claim 3, characterized in that: A sound channel is formed between a portion of the upper surface of the packaging shell, one of the side surfaces of the packaging shell, a portion of the lower surface of the PCB board and the rubber sleeve.

5. The vibration sensor packaging structure according to claim 3, characterized in that: A sound channel is formed between a portion of the side surface of the packaging shell, a portion of the lower surface of the PCB board and the rubber sleeve.

6. The vibration sensor packaging structure according to claim 3, characterized in that: The rubber sleeve is provided with a second opening, and the second opening is connected with the sound channel and the external environment.

7. The vibration sensor packaging structure according to claim 6, characterized in that: The second opening is arranged opposite to the first air hole and / or the second air hole.

8. The vibration sensor packaging structure according to claim 6, characterized in that: The second opening is located in a middle area of ​​the sound channel.

9. The vibration sensor packaging structure according to claim 1, characterized in that: The first air hole is located directly below the MEMS chip.

10. The vibration sensor packaging structure according to claim 1, characterized in that: The MEMS chip also includes a diaphragm and a back plate, and the positions of the diaphragm and the back plate are interchangeable.

11. The vibration sensor packaging structure according to claim 1, characterized in that: The cross-sectional shape of the second air hole along the surface of the packaging shell is any one of square, circle and polygon.

12. The vibration sensor packaging structure according to claim 1 or 3, characterized in that: Also includes: ASIC chip, the MEMS chip is electrically connected to the ASIC chip.

13. The vibration sensor packaging structure according to claim 1 or 3, characterized in that: The second surface of the substrate includes a first pad and a second pad.

14. The vibration sensor packaging structure according to claim 13, characterized in that: The PCB board is electrically connected to the first pad and the second pad.

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