Wire spool device and its potting process

Abstract

The present invention provides a coil spool device and its potting process. The coil spool device includes: a coil tray, an exciting wire, an insulating board, a ferrite component, and a heat dissipation board; the exciting wire is received in the wire groove of the coil tray, and a plurality of limiting protrusions are further provided at the bottom of the coil tray. The insulating board is stacked above the exciting wire, and the plurality of limiting protrusions support the insulating board. A first potting space is formed between the insulating board and the coil tray. The ferrite component is stacked above the insulating board, and the heat dissipation board is installed at the opening of the coil tray. A second potting space is formed between the heat dissipation board and the ferrite component. The present invention specially designs a potting flow channel to facilitate the flow of the thermal conductive adhesive during potting, ensuring that the thermal conductive adhesive quickly fills the entire internal cavity. By integrally designing the ferrite component, it ensures convenient assembly and reduces the magnetic loss of the ferrite. By adding limiting protrusions on the coil tray, the gap between the insulating board and the coil tray is increased, which is beneficial to form a potting channel.

Description

Technical Field

[0001] The present invention relates to the technical field of high-power wireless charging, and particularly relates to a coil disc device and its potting process. Background Art

[0002] With the development of science and technology and in response to the current environmental problems, new energy vehicles have developed rapidly in recent years. Electric vehicles in new energy vehicles use high-energy density battery packs as power sources and utilize clean energy to achieve power conversion. Currently, the battery packs of electric vehicles mainly rely on charging piles and are charged in a wired manner. However, the convenience and versatility of the wired charging method are subject to certain limitations. Therefore, existing electric vehicles can be charged wirelessly.

[0003] In the wireless charging system of existing electric vehicles, there are the following problems in the coil disc device: 1) The gaps between the components are very small, resulting in the thermal conductive adhesive not flowing in place during potting and unable to completely submerge the components. 2) The large number of ferrite components is inconvenient to assemble, and there is no limit slot, so it is easy to place them in the wrong position. 3) The size of the insulating board is too large, and it is easy to warp and deform during processing. Therefore, in view of the above problems, it is necessary to propose a further solution. Summary of the Invention

[0004] The present invention aims to provide a coil disc device and its potting process to overcome the deficiencies in the prior art.

[0005] To solve the above technical problems, the technical solution of the present invention is as follows:

[0006] A coil disc device, which includes: a coil tray, an exciting wire, an insulating board, a ferrite component, and a heat dissipation plate;

[0007] The exciting wire is received in the wire groove of the coil tray. A plurality of limiting protrusions are further provided at the bottom of the coil tray. The insulating board is stacked above the exciting wire, and the plurality of limiting protrusions support the insulating board. A first potting space is formed between the insulating board and the coil tray. The ferrite component is stacked above the insulating board, and the heat dissipation plate is installed at the opening of the coil tray. A second potting space is formed between the heat dissipation plate and the ferrite component.

[0008] As an improvement of the coil disc device of the present invention, the plurality of protrusions are provided at the four corner positions and the middle area of the bottom of the coil tray.

[0009] As an improvement of the coil disc device of the present invention, a plurality of hollowed-out areas are provided on the insulating board. The insulating board includes: two annular parts and an intermediate part connecting the two annular parts. The area enclosed by the two annular parts and the areas on both sides of the intermediate part form the hollowed-out areas.

[0010] As an improvement of the coil spool device of the present invention, the ferrite component includes: a ferrite plate integrally provided, and ferrite blocks distributed around the ferrite plate.

[0011] As an improvement of the coil spool device of the present invention, a first potting port is provided on the ferrite plate, and a second potting port opposite to the first potting port is provided on the heat dissipation plate.

[0012] As an improvement of the coil spool device of the present invention, the first and second potting ports also serve as the outlet ports of the exciting wire.

[0013] As an improvement of the coil spool device of the present invention, a plurality of holes are also provided on the heat dissipation plate, and the plurality of holes are distributed in the middle and on both sides of the heat dissipation plate.

[0014] As an improvement of the coil spool device of the present invention, the surface of the heat dissipation plate facing the ferrite component is a rough surface.

[0015] To solve the above technical problems, the technical solution of the present invention is:

[0016] A potting process for the coil spool device as described above, which includes the following steps:

[0017] Preheat the coil tray assembled with the exciting wire.

[0018] Place the coil tray assembled with the exciting wire and the insulating plate in a vacuum environment and perform a pressure holding process.

[0019] After pressure relief, pot the exciting wire, perform pressure pumping and pressure holding again. When no bubbles appear, after pressure relief again, supplement pot the exciting wire and perform pressure pumping and pressure holding until no bubbles.

[0020] Assemble the ferrite component and the heat dissipation plate, perform potting between the ferrite component and the heat dissipation plate, and repeatedly perform pressure pumping and pressure relief at the same time.

[0021] After potting is completed, perform a curing and heat preservation process.

[0022] To solve the above technical problems, the technical solution of the present invention is:

[0023] A potting process for the coil spool device as described above, which includes the following steps:

[0024] Assemble the coil tray, the exciting wire, the insulating plate, the ferrite component and the heat dissipation plate to form a coil spool device.

[0025] Preheat the coil spool device.

[0026] After the preheating process, place it in a vacuum environment and perform a pressure holding process.

[0027] After pressure relief, the internal potting space is potted, and then it is evacuated and pressure maintained again. When no bubbles appear, after pressure relief again, the excitation wire is supplemented with potting and evacuated and pressure maintained until no bubbles;

[0028] After potting is completed, curing and heat preservation treatment is carried out.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows: The potting flow channel is specially designed in the structure of the coil assembly of the present invention, which is convenient for the flow of the heat-conducting glue during potting, and ensures that the heat-conducting glue quickly fills the entire internal cavity. By integrating the ferrite component, it ensures convenient assembly and reduces the magnetic loss of the ferrite. By adding a limit protrusion on the coil tray, the gap between the insulating board and the coil tray is increased, which is beneficial to forming a potting channel. By forming a rough surface on the heat dissipation plate, it is beneficial to increase the bonding strength of the heat-conducting glue with the heat dissipation plate. Description of the Drawings

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0031] Figure 1 It is a three-dimensional exploded view of an embodiment of the coil assembly of the present invention;

[0032] Figure 2 It is a three-dimensional schematic diagram showing the first potting space and the second potting space;

[0033] Figure 3 It is Figure 1 a three-dimensional enlarged schematic diagram of the coil tray in Detailed Embodiments

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0035] As Figure 1 shown, an embodiment of the present invention provides a coil assembly, which includes: a coil tray 10, an excitation wire 20, an insulating board 30, a ferrite component 40, and a heat dissipation plate 50.

[0036] The coil tray 10 is used for the installation and fixation of the exciting wire 20. Correspondingly, a wire groove 11 adapted to the winding shape of the exciting wire 20 is formed on the coil tray 10, and the exciting wire 20 can be received in the wire groove 11 of the coil tray 10. The above-mentioned wire groove 11 is defined by a partition plate provided on the coil tray 10.

[0037] As Figure 2 , 3 shown, a number of limiting protrusions 12 are also provided at the bottom of the coil tray 10. The insulating plate 30 is stacked above the exciting wire 20, and the number of limiting protrusions 12 supports the insulating plate 30, and a first potting space 13 is formed between the insulating plate 30 and the coil tray 10. With this setting, through a dedicated potting flow channel, it is convenient for the heat-conducting glue to flow during potting. At the same time, the strength of the coil tray 10 is also increased. A number of protrusions are provided at the four corners and the middle area of the bottom of the coil tray 10 to facilitate the full flow of the heat-conducting glue. In one embodiment, a number of limiting protrusions 12 are provided at: the top of the partition plate forming the wire groove 11 and the top of the reinforcing rib on the coil tray 10.

[0038] Considering the problem that in the prior art, the size of the insulating plate 30 is too large and it is easy to warp and deform during processing. A number of hollow areas are provided on the insulating plate 30. In this way, by reducing the size of the insulating plate 30, it is beneficial for the heat-conducting glue to completely immerse the exciting wire 20 and the ferrite component 40 during potting, ensuring the waterproof, shock-proof and heat-conducting performance of the product. In one embodiment, the insulating plate 30 includes: two annular portions 31 and an intermediate portion 32 connecting the two annular portions 31. At this time, the area enclosed by the two annular portions 31 and the areas on both sides of the intermediate portion 32 form hollow areas.

[0039] The ferrite component 40 is stacked above the insulating plate 30. Considering the problem that in the prior art, the number of ferrites is large and the assembly is inconvenient, the ferrite component 40 includes: a ferrite plate 41 integrally provided and ferrite blocks 42 distributed around the ferrite plate 41. In this way, the integrally provided ferrite plate 41 can facilitate assembly and improve the assembly efficiency of the coil device.

[0040] At the same time, a first potting port 410 is also opened on the ferrite plate 41, and the first potting port 410 is communicated with the first potting space 13 to facilitate the heat-conducting glue to flow into the first potting space 13 during potting. At the same time, considering that the exciting wire 20 needs to be led out from the inside of the coil device, in this embodiment, the first potting port 410 also serves as the outlet port of the exciting wire 20.

[0041] The heat dissipation plate 50 is used for heat dissipation during the operation of the coil disc device. It is installed at the opening of the coil tray 10, and a second potting space 51 is formed between the heat dissipation plate 50 and the ferrite component 40. To facilitate potting, a second potting port 52 is also provided on the heat dissipation plate 50. The second potting port 52 is disposed opposite to the first potting port 410 and is in communication with the second potting space 51. A plurality of holes are also provided on the heat dissipation plate 50. These holes facilitate exhaust during potting and can also be used as observation holes to observe whether the thermal conductive adhesive is filled up. To exhaust evenly and observe different potting positions, the plurality of holes are distributed in the middle and on both sides of the heat dissipation plate 50.

[0042] In addition, in this embodiment, the surface of the heat dissipation plate 50 facing the ferrite component 40 is a rough surface. Such a setting is beneficial to increasing the bonding strength of the thermal conductive adhesive to the heat dissipation plate 50. In one implementation, the heat dissipation plate 50 can be a water-cooled plate. At this time, shot peening treatment can be performed on the water-cooled plate to form a rough surface on the water-cooled plate.

[0043] Technologically, the present invention also provides a potting process for the coil disc device as described above, which includes the following steps:

[0044] Preheat the coil tray assembled with the exciting wire;

[0045] Place the coil tray assembled with the exciting wire and the insulating plate in a vacuum environment and perform a pressure holding treatment;

[0046] After pressure relief, pot the exciting wire, then perform pressure pumping and pressure holding treatment again. When no bubbles appear, after pressure relief again, supplement pot the exciting wire and perform pressure pumping and pressure holding until no bubbles;

[0047] Assemble the ferrite component and the heat dissipation plate, and perform potting between the ferrite component and the heat dissipation plate while repeatedly performing pressure pumping and pressure relief;

[0048] After potting is completed, perform a curing and heat preservation treatment.

[0049] In the above potting process, potting is performed in two potting steps, that is, first pot the coil tray assembled with the exciting wire and the insulating plate, and then pot the coil device after assembling the ferrite component and the heat dissipation plate.

[0050] Next, with reference to specific embodiments, the potting process of the coil disc device will be illustrated by way of example.

[0051] The potting process of this embodiment includes:

[0052] S1. Preheat the coil tray assembled with the exciting wire at 50 °C for 1 h.

[0053] Among them, the purpose of preheating is to facilitate the discharge and treatment of air bubbles during subsequent resin filling. In addition, according to the material of the coil tray, other temperatures can also be used for preheating.

[0054] S2. Place the coil tray assembled with the exciting wire and the insulating board in a vacuum environment and perform pressure holding treatment.

[0055] Among them, the coil tray assembled with the exciting wire and the insulating board can be placed in a vacuum chamber, and the air pressure in the vacuum chamber is controlled to be maintained below 10 mbar and the pressure is held for 30 minutes.

[0056] S3. After releasing the pressure to 150 mbar, perform the first resin filling on the exciting wire, and the resin filling amount is about 500 g. Then, evacuate and pressurize again to below 10 mbar and hold the pressure for about 3 minutes. When no obvious air bubbles appear, release the pressure again and then perform supplementary resin filling on the exciting wire. At this time, the purpose of the supplementary resin filling is to replenish the resin. Evacuate and pressurize to about 10 mbar and hold the pressure for 5 minutes until there are no air bubbles.

[0057] S4. Assemble the ferrite component and the heat dissipation plate, perform resin filling between the ferrite component and the heat dissipation plate, and repeatedly evacuate and release the pressure at the same time. When the thermal conductive adhesive is observed through the holes on the heat dissipation plate, stop the resin filling.

[0058] S5. After the resin filling is completed, perform curing and heat preservation treatment.

[0059] Technologically, the present invention also provides a resin filling process for the coil assembly device as described above, which includes the following steps:

[0060] Assemble the coil tray, the exciting wire, the insulating board, the ferrite component and the heat dissipation plate to form a coil assembly device;

[0061] Perform preheating treatment on the coil assembly device;

[0062] After the preheating treatment, place it in a vacuum environment and perform pressure holding treatment;

[0063] After releasing the pressure, perform resin filling on the internal resin filling space, evacuate and pressurize again and perform pressure holding treatment. When no air bubbles appear, release the pressure again and then perform supplementary resin filling on the exciting wire, evacuate and pressurize until there are no air bubbles;

[0064] After the resin filling is completed, perform curing and heat preservation treatment.

[0065] In the above resin filling process, the assembled coil assembly device is encapsulated by means of one-time resin filling.

[0066] In summary, the coil spool device of the present invention is specifically designed with a potting runner in its structure, which facilitates the flow of thermal conductive adhesive during potting and ensures that the thermal conductive adhesive quickly fills the entire internal cavity. By integrating the ferrite components, it ensures convenient assembly and reduces the magnetic loss of the ferrite. By adding limit protrusions on the coil tray, the gap between the insulating board and the coil tray is increased, which is beneficial to forming a potting channel. By forming a rough surface on the heat dissipation plate, it is beneficial to increase the bonding strength of the thermal conductive adhesive with the heat dissipation plate.

[0067] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claimed invention.

[0068] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A potting process for a coil spool device, the coil spool device comprises: a coil tray, an exciting wire, an insulating plate, a ferrite component, and a heat dissipation plate; The exciting wire is received in the wire groove of the coil tray. A plurality of limiting protrusions are further provided at the bottom of the coil tray. The insulating plate is stacked above the exciting wire, and the plurality of limiting protrusions support the insulating plate. A first potting space is formed between the insulating plate and the coil tray. The ferrite component is stacked above the insulating plate. The heat dissipation plate is installed at the opening of the coil tray. A second potting space is formed between the heat dissipation plate and the ferrite component. It is characterized in that the potting process comprises the following steps: Preheat the coil tray assembled with the exciting wire; Place the coil tray assembled with the exciting wire and the insulating plate in a vacuum environment and perform a pressure holding process; After pressure relief, pot the exciting wire, perform pressure pumping and pressure holding again. When no bubbles appear, after pressure relief again, supplement pot the exciting wire and perform pressure pumping and pressure holding until no bubbles; Assemble the ferrite component and the heat dissipation plate, pot between the ferrite component and the heat dissipation plate, and repeatedly perform pressure pumping and pressure relief at the same time; After potting is completed, perform a curing and heat preservation process.

2. The potting process according to claim 1, characterized in that, The plurality of limiting protrusions are arranged at the four corners and the middle area of the bottom of the coil tray.

3. The potting process according to claim 1, characterized in that, A plurality of hollow areas are provided on the insulating plate. The insulating plate comprises: two annular parts and a middle part connecting the two annular parts. The area enclosed by the two annular parts and the areas on both sides of the middle part form the hollow areas.

4. The potting process according to claim 1, characterized in that, The ferrite component comprises: a ferrite plate integrally provided, and ferrite blocks distributed around the ferrite plate.

5. The potting process according to claim 4, characterized in that, A first potting port is opened on the ferrite plate, and a second potting port opposite to the first potting port is opened on the heat dissipation plate.

6. The potting process according to claim 5, characterized in that, The first and second potting ports also serve as the wire outlet ports of the exciting wire.

7. The potting process according to claim 1, characterized in that, A plurality of holes are further opened on the heat dissipation plate, and the plurality of holes are distributed in the middle and on both sides of the heat dissipation plate.

8. The potting process according to claim 1, characterized in that, The surface of the heat dissipation plate facing the ferrite component is a rough surface.

9. A potting process for a coil spool device, the coil spool device comprises: a coil tray, an exciting wire, an insulating plate, a ferrite component, and a heat dissipation plate; The exciting wire is received in the wire groove of the coil tray. A number of limiting protrusions are further provided at the bottom of the coil tray. The insulating board is stacked above the exciting wire, and the number of limiting protrusions support the insulating board. A first potting space is formed between the insulating board and the coil tray. The ferrite component is stacked above the insulating board. The heat dissipation plate is installed at the opening of the coil tray. A second potting space is formed between the heat dissipation plate and the ferrite component. It is characterized in that the potting process includes the following steps: Assemble the coil tray, exciting wire, insulating board, ferrite component and heat dissipation plate to form a coil device; Perform a preheating treatment on the coil device; After the preheating treatment, place it in a vacuum environment and perform a pressure holding treatment; After pressure relief, pot the internal potting space, perform pressure pumping and pressure holding treatment again. When no bubbles appear, after pressure relief again, supplement pot the exciting wire, and perform pressure pumping and pressure holding until no bubbles; After potting is completed, perform a curing and heat preservation treatment.

10. According to the potting process described in claim 9, It is characterized in that, The number of limiting protrusions are arranged at the four corners and the middle area of the bottom of the coil tray.

11. According to the potting process described in claim 9, It is characterized in that, A number of hollow areas are provided on the insulating board. The insulating board includes: two annular parts and an intermediate part connecting the two annular parts. The area surrounded by the two annular parts and the areas on both sides of the intermediate part form the hollow areas.

12. According to the potting process described in claim 9, It is characterized in that, The ferrite component includes: a ferrite plate integrally provided, and ferrite blocks distributed around the ferrite plate.

13. According to the potting process described in claim 12, It is characterized in that, A first potting port is opened on the ferrite plate, and a second potting port opposite to the first potting port is opened on the heat dissipation plate.

14. According to the potting process described in claim 13, It is characterized in that, The first and second potting ports also serve as the wire outlet ports of the exciting wire.

15. According to the potting process described in claim 9, It is characterized in that, A number of holes are also opened on the heat dissipation plate, and the number of holes are distributed in the middle and on both sides of the heat dissipation plate.

16. According to the potting process described in claim 9, It is characterized in that, The surface of the heat dissipation plate facing the ferrite component is a rough surface.

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