A PCBA board soft material in-mold injection molding process

Abstract

The present invention provides a PCBA board soft material in-mold injection molding process, comprising the following steps: 1) preheating PET film, 2) printing pattern, 3) preparing film A, 4) FPC flexible circuit board laminating film, 5) scraping ink, 6) scraping adhesive, 7) preparing inner film B, 8) placing the prepared film A and the FPC flexible circuit board laminating film into the injection mold cavity of the Haitian 130T injection molding machine, preheating the injection mold to 30°C, and then injecting TPU resin through the injection hole, so that the film A is on the outside of the product mobile phone protective shell, and the FPC flexible circuit board laminating film is on the inside of the product mobile phone protective shell, and the temperature of the TPU resin is 180°C. The present invention is that the FPC flexible circuit board uses a thin film printing technology to laminate the PET film and the FPC flexible circuit board to form an FPC flexible circuit board laminating film, and then forms a film A and an inner film B based on the FPC flexible circuit board laminating film, and uses the in-mold injection molding process technology to combine the film A and the inner film B with the mobile phone shell.

Description

Technical Field

[0001] The invention relates to a PCBA board soft material in-mold injection molding technology, and in particular to a PCBA board soft material in-mold injection molding process. Background Art

[0002] The existing method of making soft PCBA boards is to use 3M glue to glue the FPC flexible circuit board to the already injection-molded mobile phone protective shell, and then cover it with flannel and other materials. The appearance of the existing products is too heavy, which is inconvenient for consumers to use; the 3M glue is not reliable, the service life is not long, and it is easy to age; the waterproof, moisture-proof and anti-leakage performance of the product FPC board is poor. Summary of the invention

[0003] In view of this, the main purpose of the present invention is to provide a PCBA board soft material in-mold injection molding process. The technical solution adopted is as follows:

[0004] A PCBA board soft material in-mold injection molding process comprises the following steps:

[0005] 1) Preheating of PET film: Place the PET film in a baking oven and bake it at 60-120°C for 3-5 minutes;

[0006] 2) Printing pattern: Place the preheated PET film on the printing machine to print the pattern. After printing, it needs to be baked and dried at a temperature of 80-110°C for 0.5-1.5 hours.

[0007] 3) Preparation of membrane A: Cutting the required shape with a mold to obtain membrane A;

[0008] 4) FPC flexible circuit board laminating film: Apply UV laminating glue to the printed surface of the PET film printed in step 2) and laminate it to the FPC flexible circuit board, then perform UV light curing and drying to form an FPC flexible circuit board laminating film;

[0009] 5) Scraping ink: Scrape a layer of ink on one side of the FPC flexible circuit board in the FPC flexible circuit board laminating film prepared in step 4);

[0010] 6) Apply adhesive by scraping: Apply a layer of adhesive on one side of the ink layer in step 5) and put it into a baking oven for curing at a temperature of 80-120°C for 0.5-1.5 hours;

[0011] 7) Preparation of inner film sheet B: After step 6) is completed, the FPC flexible circuit board bonding film sheet coated with adhesive is cut into the required shape with a mold to make inner film sheet B;

[0012] 8) Place the prepared diaphragm A and FPC flexible circuit board bonding diaphragm into the cavity of the injection mold, preheat the injection mold to 30-70°C, and then inject TPU resin through the injection hole so that diaphragm A is on the outside of the product mobile phone protective case and the FPC flexible circuit board bonding diaphragm is on the inside of the product mobile phone protective case.

[0013] In step 2), the PET film is placed on a printing press and the pattern is printed using Imperial IMD's special ink.

[0014] In step 5), IMD-IPX series color ink is scraped and coated on the FPC flexible circuit board.

[0015] In step 6), IMD-003 adhesive is applied by knife coating on the ink layer.

[0016] In step 8), TPU resin injection molding is performed using a Haitian 130T injection molding machine.

[0017] In step 8), the temperature of the TPU resin is 180-220°C.

[0018] In step 1), the PET film is placed in a baking oven and baked at a temperature of 80 to 105° C. for 3 to 5 minutes.

[0019] In step 2), the preheated PET film is placed on a printing machine to print a pattern, and after printing, it needs to be baked and dried at a temperature of 85 to 100° C. for 0.8 to 1.2 hours.

[0020] In step 6), a layer of adhesive is scraped on one side of the ink layer and placed in a baking oven for curing at a temperature of 85 to 100° C. for 0.8 to 1.2 hours.

[0021] In step 8), the prepared film A and the FPC flexible circuit board bonding film are placed in the cavity of the injection mold, the injection mold is preheated to 40-50°C, and then TPU resin is injected through the injection hole, so that the film A is on the outside of the product mobile phone protective case, and the FPC flexible circuit board bonding film is on the inside of the product mobile phone protective case.

[0022] The present invention is that the FPC flexible circuit board uses thin film printing technology to laminate PET film and FPC flexible circuit board to form an FPC flexible circuit board laminated film, and then forms a film A and an inner film B based on the FPC flexible circuit board laminated film, and uses in-mold injection molding technology to combine the film A and the inner film B with a mobile phone case. DETAILED DESCRIPTION

[0023] The present invention is described in detail below with reference to embodiments.

[0024] Example 1

[0025] A PCBA board soft material in-mold injection molding process comprises the following steps:

[0026] 1) Preheating of PET film: Place the PET film in a baking oven and bake it at 60°C for 3 minutes;

[0027] 2) Printing pattern: put the preheated PET film on the printing machine and use the special ink of Imperial IMD to print the pattern. After printing, it needs to be baked and dried at 80℃ for 0.5h;

[0028] 3) Preparation of membrane A: Cutting the required shape with a mold to obtain membrane A;

[0029] 4) FPC flexible circuit board laminating film: Apply UV laminating glue to the printed surface of the PET film printed in step 2) and laminate it to the FPC flexible circuit board, then perform UV light curing and drying to form an FPC flexible circuit board laminating film;

[0030] 5) Scrape and apply ink: Scrape and apply a layer of ink using IMD-IPX series color ink on one side of the FPC flexible circuit board in the FPC flexible circuit board laminating film prepared in step 4);

[0031] 6) Apply adhesive by scraping: Apply a layer of adhesive by scraping IMD-003 adhesive on one side of the ink layer in step 5), and put it into a baking oven for curing at 80°C for 0.5h;

[0032] 7) Preparation of inner film sheet B: After step 6) is completed, the FPC flexible circuit board bonding film sheet coated with adhesive is cut into the required shape with a mold to make inner film sheet B;

[0033] 8) Place the prepared diaphragm A and FPC flexible circuit board bonding diaphragm into the injection mold cavity of the Haitian 130T injection molding machine, preheat the injection mold to 30°C, and then inject TPU resin through the injection hole so that diaphragm A is on the outside of the product mobile phone protective case and the FPC flexible circuit board bonding diaphragm is on the inside of the product mobile phone protective case. The temperature of the TPU resin is 180°C.

[0034] Example 2

[0035] A PCBA board soft material in-mold injection molding process comprises the following steps:

[0036] 1) Preheating of PET film: Place the PET film in a baking oven and bake it at 120°C for 5 minutes;

[0037] 2) Printing pattern: put the preheated PET film on the printing machine and use the special ink of Imperial IMD to print the pattern. After printing, it needs to be baked and dried at a temperature of 110°C for 1.5 hours;

[0038] 3) Preparation of membrane A: Cutting the required shape with a mold to obtain membrane A;

[0039] 4) FPC flexible circuit board laminating film: Apply UV laminating glue to the printed surface of the PET film printed in step 2) and laminate it to the FPC flexible circuit board, then perform UV light curing and drying to form an FPC flexible circuit board laminating film;

[0040] 5) Scrape and apply ink: Scrape and apply a layer of ink using IMD-IPX series color ink on one side of the FPC flexible circuit board in the FPC flexible circuit board laminating film prepared in step 4);

[0041] 6) Apply adhesive by scraping: Apply a layer of adhesive using IMD-003 adhesive on one side of the ink layer in step 5) and place in a baking oven for curing at 120°C for 1.5 hours;

[0042] 7) Preparation of inner film sheet B: After step 6) is completed, the FPC flexible circuit board bonding film sheet coated with adhesive is cut into the required shape with a mold to make inner film sheet B;

[0043] 8) Place the prepared diaphragm A and FPC flexible circuit board bonding diaphragm into the injection mold cavity of the Haitian 130T injection molding machine, preheat the injection mold to 70°C, and then inject TPU resin through the injection hole so that diaphragm A is on the outside of the product mobile phone protective case and the FPC flexible circuit board bonding diaphragm is on the inside of the product mobile phone protective case. The temperature of the TPU resin is 220°C.

[0044] Example 3

[0045] A PCBA board soft material in-mold injection molding process comprises the following steps:

[0046] 1) Preheating of PET film: Place the PET film in a baking oven and bake it at 80°C for 4 minutes;

[0047] 2) Printing pattern: put the preheated PET film on the printing machine and use the special ink of Imperial IMD to print the pattern. After printing, it needs to be baked and dried at 85℃ for 0.8h.

[0048] 3) Preparation of membrane A: Cutting the required shape with a mold to obtain membrane A;

[0049] 4) FPC flexible circuit board laminating film: Apply UV laminating glue to the printed surface of the PET film printed in step 2) and laminate it to the FPC flexible circuit board, then perform UV light curing and drying to form an FPC flexible circuit board laminating film;

[0050] 5) Scrape and apply ink: Scrape and apply a layer of ink using IMD-IPX series color ink on one side of the FPC flexible circuit board in the FPC flexible circuit board laminating film prepared in step 4);

[0051] 6) Apply adhesive by scraping: Apply a layer of adhesive by scraping IMD-003 adhesive on one side of the ink layer in step 5), and put it into a baking oven for curing at 85°C for 0.8h;

[0052] 7) Preparation of inner film sheet B: After step 6) is completed, the FPC flexible circuit board bonding film sheet coated with adhesive is cut into the required shape with a mold to make inner film sheet B;

[0053] 8) Place the prepared diaphragm A and FPC flexible circuit board bonding diaphragm into the injection mold cavity of the Haitian 130T injection molding machine, preheat the injection mold to 40°C, and then inject TPU resin through the injection hole so that diaphragm A is on the outside of the product mobile phone protective case and the FPC flexible circuit board bonding diaphragm is on the inside of the product mobile phone protective case. The temperature of the TPU resin is 190°C.

[0054] Example 4

[0055] A PCBA board soft material in-mold injection molding process comprises the following steps:

[0056] 1) Preheating of PET film: Place the PET film in a baking oven and bake it at 90°C for 4 minutes;

[0057] 2) Printing pattern: Place the preheated PET film on the printing machine and use the Imperial IMD special ink to print the pattern. After printing, it needs to be baked and dried at 90°C for 1 hour;

[0058] 3) Preparation of membrane A: Cutting the required shape with a mold to obtain membrane A;

[0059] 4) FPC flexible circuit board laminating film: Apply UV laminating glue to the printed surface of the PET film printed in step 2) and laminate it to the FPC flexible circuit board, then perform UV light curing and drying to form an FPC flexible circuit board laminating film;

[0060] 5) Scrape and apply ink: Scrape and apply a layer of ink using IMD-IPX series color ink on one side of the FPC flexible circuit board in the FPC flexible circuit board laminating film prepared in step 4);

[0061] 6) Apply adhesive by scraping: Apply a layer of adhesive by scraping IMD-003 adhesive on one side of the ink layer in step 5), and put it into a baking oven for curing at 90°C for 1 hour;

[0062] 7) Preparation of inner film sheet B: After step 6) is completed, the FPC flexible circuit board bonding film sheet coated with adhesive is cut into the required shape with a mold to make inner film sheet B;

[0063] 8) Place the prepared diaphragm A and FPC flexible circuit board bonding diaphragm into the injection mold cavity of the Haitian 130T injection molding machine, preheat the injection mold to 50°C, and then inject TPU resin through the injection hole so that diaphragm A is on the outside of the product mobile phone protective case and the FPC flexible circuit board bonding diaphragm is on the inside of the product mobile phone protective case. The temperature of the TPU resin is 200°C.

[0064] Example 5

[0065] A PCBA board soft material in-mold injection molding process comprises the following steps:

[0066] 1) Preheating of PET film: Place the PET film in a baking oven and bake it at 105°C for 4 minutes;

[0067] 2) Printing pattern: put the preheated PET film on the printing machine and use the special ink of Imperial IMD to print the pattern. After printing, it needs to be baked and dried at a temperature of 100°C for 1.2 hours;

[0068] 3) Preparation of membrane A: Cutting the required shape with a mold to obtain membrane A;

[0069] 4) FPC flexible circuit board laminating film: Apply UV laminating glue to the printed surface of the PET film printed in step 2) and laminate it to the FPC flexible circuit board, then perform UV light curing and drying to form an FPC flexible circuit board laminating film;

[0070] 5) Scrape and apply ink: Scrape and apply a layer of ink using IMD-IPX series color ink on one side of the FPC flexible circuit board in the FPC flexible circuit board laminating film prepared in step 4);

[0071] 6) Apply adhesive by scraping: Apply a layer of adhesive by scraping IMD-003 adhesive on one side of the ink layer in step 5), and put it into a baking oven for curing at a temperature of 100°C for 1.2 hours;

[0072] 7) Preparation of inner film sheet B: After step 6) is completed, the FPC flexible circuit board bonding film sheet coated with adhesive is cut into the required shape with a mold to make inner film sheet B;

[0073] 8) Place the prepared diaphragm A and FPC flexible circuit board bonding diaphragm into the injection mold cavity of the Haitian 130T injection molding machine, preheat the injection mold to 60°C, and then inject TPU resin through the injection hole so that diaphragm A is on the outside of the product mobile phone protective case and the FPC flexible circuit board bonding diaphragm is on the inside of the product mobile phone protective case. The temperature of the TPU resin is 210°C.

[0074] In Examples 1-5 of the present invention, the FPC flexible circuit board uses a thin film printing technology to laminate the PET film and the FPC flexible circuit board to form an FPC flexible circuit board laminated film, and then forms a film A and an inner film B based on the FPC flexible circuit board laminated film, and uses an in-mold injection molding process to combine the film A and the inner film B with the mobile phone case. The product prepared by the present invention meets market demand, enhances the aesthetic appearance of the product, conducts technical innovation in accordance with market demand, enhances the safety of the product, and improves the green environmental protection function of the product.

[0075] The technical solutions disclosed in the embodiments of the present invention are introduced in detail above. The principles and implementation methods of the embodiments of the present invention are explained in this article using specific embodiments. The description of the above embodiments is only applicable to help understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, according to the embodiments of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A PCBA board soft material in-mold injection molding process, characterized in that: The steps include: 1) Preheating of PET film: Place the PET film in a baking oven and bake it at 60-120°C for 3-5 minutes; 2) Printing pattern: Place the preheated PET film on the printing machine to print the pattern. After printing, it needs to be baked and dried at a temperature of 80-110°C for 0.5-1.5 hours. 3) FPC flexible circuit board laminating film: Apply UV laminating glue to the printed surface of the PET film printed in step 2) and laminate it to the FPC flexible circuit board, then perform UV light curing and drying to form an FPC flexible circuit board laminating film; 4) Prepare diaphragm A: Use a mold to fit the FPC flexible circuit board to the diaphragm and cut it into the required shape to obtain diaphragm A; 5) Scraping ink: Scrape a layer of ink on one side of the FPC flexible circuit board in the FPC flexible circuit board laminating film prepared in step 4); 6) Apply adhesive by scraping: Apply a layer of adhesive on one side of the ink layer in step 5) and put it into a baking oven for curing at a temperature of 80-120°C for 0.5-1.5 hours; 7) Preparation of inner film sheet B: After step 6) is completed, the FPC flexible circuit board bonding film sheet coated with adhesive is cut into the required shape with a mold to make inner film sheet B; 8) Place the prepared diaphragm A and inner diaphragm B into the cavity of the injection mold, preheat the injection mold to 30-70°C, and then inject TPU resin through the injection hole so that diaphragm A is on the outside of the product mobile phone protective case and inner diaphragm B is on the inside of the product mobile phone protective case.

2. The PCBA board soft material in-mold injection molding process according to claim 1, characterized in that: In step 2), the PET film is placed on a printing press and the pattern is printed using Imperial IMD's special ink.

3. The PCBA board soft material in-mold injection molding process according to claim 1, characterized in that: In step 5), IMD-IPX series color ink is scraped and coated on the FPC flexible circuit board.

4. The PCBA board soft material in-mold injection molding process according to claim 1, characterized in that: In step 6), IMD-003 adhesive is applied by knife coating on the ink layer.

5. The PCBA board soft material in-mold injection molding process according to claim 1, characterized in that: In step 8), TPU resin injection molding is performed using a Haitian 130T injection molding machine.

6. The PCBA board soft material in-mold injection molding process according to claim 1, characterized in that: In step 8), the temperature of the TPU resin is 180-220°C.

7. The PCBA board soft material in-mold injection molding process according to claim 1, characterized in that: In step 1), the PET film is placed in a baking oven and baked at a temperature of 80 to 105° C. for 3 to 5 minutes.

8. The PCBA board soft material in-mold injection molding process according to claim 1, characterized in that: In step 2), the preheated PET film is placed on a printing machine to print a pattern, and after printing, it needs to be baked and dried at a temperature of 85 to 100° C. for 0.8 to 1.2 hours.

9. The PCBA board soft material in-mold injection molding process according to claim 1, characterized in that: In step 6), a layer of adhesive is scraped on one side of the ink layer and placed in a baking oven for curing at a temperature of 85 to 100° C. for 0.8 to 1.2 hours.

10. The PCBA board soft material in-mold injection molding process according to claim 1, characterized in that: In step 8), the prepared diaphragm A and inner diaphragm B are placed into the cavity of the injection mold, the injection mold is preheated to 40-50° C., and then TPU resin is injected through the injection hole, so that the diaphragm A is on the outside of the product mobile phone protective case and the inner diaphragm B is on the inside of the product mobile phone protective case.