Transportation System and Transportation Method

Abstract

The present invention provides a conveying system and a conveying method. The conveying system for conveying a focusing ring includes a processing system and a position detection system. The processing system includes: a processing device having a chamber main body and a mounting table including a substrate mounting area and a focusing ring mounting area; and a conveying device capable of conveying the focusing ring. The position detection system includes: a light source; a plurality of optical elements configured to emit light and receive incident reflected light; a driving unit configured to move the optical elements respectively to scan a scanning range from the focusing ring to the substrate mounting area; and a control unit configured to calculate the positional relationship between the focusing ring and the mounting table based on the reflected light within the scanning range for each optical element. The conveying device is configured to adjust the position where the focusing ring is conveyed onto the focusing ring mounting area based on the calculated positional relationship. According to the present invention, a technique for accurately conveying the focusing ring can be provided.

Description

Technical Field

[0001] Exemplary embodiments of the present invention relate to a conveying system and a conveying method. Background Art

[0002] A semiconductor manufacturing apparatus is described in Patent Document 1. The apparatus includes a substrate processing chamber, a focus ring standby chamber, and a conveying mechanism. An electrode is disposed inside the substrate processing chamber. A substrate is placed on the electrode. The focus ring standby chamber houses a plurality of focus rings. The conveying mechanism conveys the focus rings housed in the focus ring standby chamber to the substrate processing chamber without opening the atmosphere in the substrate processing chamber. The focus rings are arranged so as to surround the substrate placed on the electrode.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2006-196691. Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] The present invention provides a technique for conveying a focus ring with high precision.

[0008] Technical Means for Solving the Problems

[0009] In one exemplary embodiment, a conveying system for conveying a focus ring to a processing device is provided. The conveying system includes a conveying device and a position detection system. The processing device includes a chamber main body and a mounting table provided in a chamber provided by the chamber main body. The mounting table includes a substrate mounting area and a focus ring mounting area surrounding the substrate mounting area. The conveying device is configured to be able to convey the focus ring onto the focus ring mounting area. The position detection system includes a light source, a plurality of optical elements, a driving unit, and a control unit. The light source is configured to be able to generate measurement light. The plurality of optical elements are configured to emit the measurement light generated by the light source as outgoing light and to receive incident reflected light. The driving unit is configured to move the optical elements respectively to scan a scanning range from the focus ring supported on the focus ring mounting area to the substrate mounting area. The control unit is configured to calculate, for each optical element, the positional relationship between the focus ring supported on the focus ring mounting area and the mounting table based on the reflected light within the scanning range. The conveying device is configured to adjust the position at which the focus ring is conveyed onto the focus ring mounting area based on the positional relationship calculated by the control unit.

[0010] Advantages of the Invention

[0011] According to the system and method of one exemplary embodiment, a focus ring can be conveyed with high precision. Brief Description of the Drawings

[0012] Figure 1 This is a diagram showing an example of a processing system.

[0013] Figure 2 This is a diagram showing an example of the longitudinal cross-sectional structure of the main part of a processing apparatus.

[0014] Figure 3 This is a structural diagram showing an example of a position detection system according to an embodiment.

[0015] Figure 4 This is a diagram showing an example of scanning using three optical elements.

[0016] Figure 5 This is a diagram showing an example of the scanning range of a position detection system according to an embodiment.

[0017] Figure 6 This is a flowchart showing an example of the processing of a method for transporting a focusing ring according to an embodiment.

[0018] Figure 7 This is a diagram showing an example of determining the transport position of a focusing ring transported to a transport apparatus.

[0019] Figure 8 This is a diagram showing an example of a case where the positional relationship between the mounting table and the focusing ring is appropriate.

[0020] Figure 9 This is a diagram showing an example of a case where the positional relationship between the mounting table and the focusing ring is inappropriate.

[0021] Figure 10 This is a diagram showing an example of scanning using two optical elements.

[0022] Figure 11 This is a diagram showing an example of calculating the positional relationship in polar coordinates based on the scanning result using two optical elements.

[0023] Explanation of reference numerals

[0024] S1... Processing system, 1... System, 2... Processing apparatus, 20... Processing container (chamber main body), S... Processing chamber (chamber), 21... Mounting table, 21a... Substrate mounting area, 21b... Focusing ring mounting area, FR... Focusing ring, 3... Position detection system, 33A... First optical element, 33B... Second optical element, 33C... Third optical element, 30... Light source, 35... Arithmetic unit (control unit), MC... Control device (control unit), 37A... First actuator (drive unit), 37B... Second actuator (drive unit), 37C... Third actuator (drive unit), W... Wafer (substrate), TU2... Transport apparatus. Detailed Implementation Modes

[0025] Next, various exemplary implementation modes will be described.

[0026] In an exemplary implementation mode, a system for transporting a focusing ring to a processing device is provided. The system includes a transport device and a position detection system. The processing device includes a chamber main body and a stage disposed in a chamber provided by the chamber main body. The stage includes a substrate placement area and a focusing ring placement area surrounding the substrate placement area. The transport device is configured to be able to transport the focusing ring onto the focusing ring placement area. The position detection system includes a light source, a plurality of optical elements, a drive unit, and a control unit. The light source is configured to be able to generate measurement light. The plurality of optical elements are configured to emit the measurement light generated by the light source as outgoing light and to allow reflected light to be incident. The drive unit is configured to move the optical elements respectively to scan a scan range from the focusing ring supported on the focusing ring placement area to the substrate placement area. The control unit is configured to calculate, for each optical element, the positional relationship between the focusing ring supported on the focusing ring placement area and the stage based on the reflected light within the scan range. The transport device is configured to adjust the position at which the focusing ring is transported onto the focusing ring placement area based on the positional relationship calculated by the control unit.

[0027] In the above system, by scanning the plurality of optical elements, it is possible to detect the height of the focusing ring based on the height of the substrate placement area within the scan range. Based on the amount of change in this height, it is possible to calculate the positional relationship between the focusing ring and the stage within the scan range. The shape of the substrate placement area is circular, and the outer diameter of the substrate placement area and the inner diameter of the focusing ring are predetermined. Therefore, the position detection system can grasp the positional relationship between the focusing ring and the stage and adjust the transport position by scanning the plurality of optical elements.

[0028] In an exemplary implementation mode, it may be that the plurality of optical elements are three or more optical elements, and the optical elements are respectively configured to be able to emit measurement light to the end of the substrate placement area, and the control unit is configured to be able to judge the positional relationship between the focusing ring supported on the transport device and the stage based on the reflected light from the outer edge of the substrate placement area when the focusing ring is to be transported onto the focusing ring placement area. In this case, the positional relationship between the focusing ring and the stage is judged during the transport of the focusing ring, so the system can prevent contact between the focusing ring and the stage.

[0029] In an exemplary implementation mode, it may also be that the control unit is configured to be able to calculate the positional relationship between the focusing ring supported on the focusing ring placement area and the stage in polar coordinates. Since the positional relationship between the focusing ring and the stage is calculated in polar coordinates, the system can clarify the distance and direction for adjusting the deviation of the position of the focusing ring and the stage.

[0030] In another exemplary embodiment, a method for transporting a focusing ring is provided. The method includes: a step of transporting the focusing ring to a focusing ring placement area that surrounds the substrate placement area where the substrate is placed; a step of scanning a scanning range from the focusing ring supported on the focusing ring placement area to the substrate placement area with a plurality of optical elements, where the plurality of optical elements emit measurement light as outgoing light and receive reflected light; a step of calculating the positional relationship between the focusing ring supported on the focusing ring placement area and the placement table based on the reflected light within the scanning range; and a step of determining the transport position of the focusing ring based on the positional relationship between the focusing ring supported on the focusing ring placement area and the placement table calculated in the calculation step.

[0031] Hereinafter, various exemplary embodiments will be described in detail with reference to the drawings. In addition, the same or corresponding parts are denoted by the same reference numerals in the respective drawings.

[0032] [First Embodiment]

[0033] Figure 1 It is a diagram showing an example of a processing system. Figure 1 The illustrated processing system S1 is a system for processing an object. The object is a disk-shaped object that is a processing target of a processing device, for example, a wafer W (an example of a substrate). The object may have an inclined peripheral portion (edge inclination portion). The wafer W may have been subjected to a processing treatment or a plasma treatment, or may not have been subjected to a processing treatment or a plasma treatment.

[0034] The processing system S1 includes worktables 2a to 2d, containers 4a to 4d, a loading module LM, load lock chambers LL1, LL2, processing modules PM1 to PM6 (an example of a processing device), and a transfer chamber TC.

[0035] The worktables 2a to 2d are arranged along one edge of the loading module LM. The containers 4a to 4d are respectively mounted on the worktables 2a to 2d. The containers 4a to 4d are each configured to be able to accommodate the wafer W.

[0036] The loading module LM has a chamber wall that defines a transport space in an atmospheric pressure state inside it. The loading module LM has a transport device TU1 in the transport space. The transport device TU1 can transport the wafer W between the containers 4a to 4d and the load lock chambers LL1 to LL2.

[0037] The load lock chamber LL1 and the load lock chamber LL2 are each provided between the loading module LM and the transfer chamber TC. The load lock chamber LL1 and the load lock chamber LL2 each provide a preliminary decompression chamber.

[0038] The transfer chamber TC is connected to the load lock chambers LL1 and LL2 via gate valves. The transfer chamber TC provides a decompression chamber capable of decompression, and the transfer device TU2 is accommodated in this decompression chamber. The transfer device TU2 can transfer the wafer W between the load lock chambers LL1 to LL2 and the processing modules PM1 to PM6, and between any two of the processing modules PM1 to PM6.

[0039] The processing modules PM1 to PM6 are connected to the transfer chamber TC via gate valves. Each of the processing modules PM1 to PM6 is a processing device capable of performing dedicated processing such as plasma processing on the wafer W.

[0040] A series of operations when processing the wafer W in the processing system S1 are exemplified as follows. The transfer device TU1 of the loading module LM takes out the wafer W from any one of the containers 4a to 4d and transfers the wafer W to any one of the load lock chambers LL1 and LL2. Next, one of the load lock chambers decompresses the pressure in the preliminary decompression chamber to a specified pressure. Next, the transfer device TU2 takes out the wafer W from one of the load lock chambers and transfers the wafer W to any one of the processing modules PM1 to PM6. Then, one or more of the processing modules PM1 to PM6 process the wafer W. Then, the transfer device TU2 transfers the processed wafer from the processing module to one of the load lock chambers LL1 and LL2. Next, the transfer device TU1 transfers the wafer W from one of the load lock chambers to any one of the containers 4a to 4d.

[0041] The processing system S1 further includes a control device MC (an example of a control unit). The control device MC can be a computer having a processor, a storage device such as a memory, a display device, an input / output device, a communication device, etc. The above series of operations of the processing system S1 are realized by controlling each part of the processing system S1 by the control device MC in accordance with a program stored in the storage device.

[0042] Next, an example of the processing modules PM1 to PM6, i.e., the processing device 2, will be described. Figure 2 It is a diagram showing an example of the longitudinal sectional structure of the main part of the processing device. As Figure 2 shown, the processing device 2 has a processing container 20 (an example of a chamber main body) for accommodating the wafer W and performing plasma processing on it.

[0043] The processing container 20 defines a processing chamber S (an example of a chamber) inside thereof. The processing chamber S can be evacuated. A stage 21 for placing the wafer W and a focus ring FR described later is provided in the processing chamber S. The stage 21 is configured such that the peripheral portion of the upper surface portion of the cylindrical body is cut off over the entire circumference to form a step, that is, on the upper surface portion, a portion other than the peripheral portion protrudes in a cylindrical shape. The stage 21 includes a substrate placement area 21a and a focus ring placement area 21b on its upper surface.

[0044] The substrate placement area 21a is an area for placing a substrate. The substrate placement area 21a is circular with the axis of the stage 21 as the center. The focus ring placement area 21b is an area for placing the focus ring FR. The focus ring placement area 21b is set to surround the substrate placement area 21a. The focus ring placement area 21b has an annular shape defined by two concentric circles. The inner circle becomes the outer edge of the substrate placement area 21a.

[0045] The substrate placement area 21a protrudes from the focus ring placement area 21b. A step is formed between the substrate placement area 21a and the focus ring placement area 21b. The height of the step is, for example, the difference between the wafer W and the focus ring FR. In other words, this protruding portion constitutes the substrate placement area 21a for placing the substrate, and the peripheral portion surrounding the substrate placement area 21a constitutes the focus ring placement area 21b for placing the focus ring FR. Below the substrate placement area 21a, there is an electrostatic chuck mechanism (not shown) for adsorbing the wafer W. In addition, it may be that there is an electrostatic chuck mechanism below the focus ring placement area 21b.

[0046] The stage 21 is made of a conductive material and has an RF rod (not shown) capable of applying high-frequency electric power. The stage 21 is electrically connected to a high-frequency power source (not shown) via a power supply rod 24.

[0047] The focus ring placement area 21b supports the focus ring FR surrounding the periphery of the substrate placement area 21a. The focus ring FR is an annular member. The focus ring FR is provided to improve the in-plane uniformity of the plasma processing of the wafer W. The focus ring FR is removed from the focus ring placement area 21b during maintenance and can be replaced with a new focus ring FR. The replacement of the focus ring FR is performed, for example, by the above-described transfer device TU2.

[0048] A bottom plate 25 is provided at the bottom of the processing container 20, and a gap 26 is formed between the mounting table 21 and the bottom plate 25. The gap 26 is wide enough to insulate the mounting table 21 from the bottom plate 25. In addition, a drive mechanism (not shown) for a lift pin (not shown) is provided in the gap 26. The lift pin picks up the wafer W from a transfer arm such as the transfer device TU2, places it on the substrate mounting area 21a, and raises the wafer W from the substrate mounting area 21a to transfer it to the transfer arm. In addition, the lift pin picks up the focus ring FR from a transfer arm such as the transfer device TU2, supports it on the focus ring mounting area 21b, and raises the focus ring FR from the focus ring mounting area 21b to transfer it to the transfer arm. In addition, the gap 26 is not a vacuum atmosphere but an air atmosphere.

[0049] Above the mounting table 21, a counter electrode 27 is provided so as to face the mounting table 21 with a gap therebetween. The counter electrode 27 is constituted by a so-called shower head and can supply a prescribed processing gas to the wafer W placed on the substrate mounting area 21a in a shower-like manner. The counter electrode 27 can be set to a ground potential or be applied with high-frequency electric power.

[0050] A first window 28A is formed in the upper part of the counter electrode 27. The first window 28A is formed so as to go from above the processing container 20 to below, and has a structure that is optically connected and hermetically sealed. A first through hole 29A corresponding to the first window 28A is provided in the processing container 20. The first window 28A and the first through hole 29A constitute a first light introduction path for irradiating the measurement light to the processing chamber S.

[0051] A first optical element 33A (an example of an optical element), which is a component of the position detection system 3 described later, is disposed at the upper end of the first through hole 29A. The first optical element 33A is connected to a light source via a first optical fiber 36A, and irradiates the measurement light to the processing chamber S via the first window 28A, the first through hole 29A, and the counter electrode 27. The first optical element 33A is, as an example, a collimator or a concentrator. A first actuator 37A (an example of a drive unit) that moves the first optical element 33A to scan in the horizontal direction is connected to the first optical element 33A. The first actuator 37A is a drive mechanism that can be electrically controlled, and is, for example, a stepping motor or the like.

[0052] In the processing container 20, a plurality of light introduction paths having the same structure as the above-described first light introduction path are provided along the circumferences of the mounting table 21 and the focusing ring FR. Specifically, as the second light introduction path, a second window 28B and a second through hole 29B (not shown) are provided along the circumferences of the mounting table 21 and the focusing ring FR, and as the third light introduction path, a third window 28C and a third through hole 29C (not shown) are provided along the circumferences of the mounting table 21 and the focusing ring FR. In addition, corresponding second optical elements 33B (an example of an optical element) and third optical elements 33C (an example of an optical element) are arranged in the second light introduction path and the third light introduction path. The second optical element 33B and the third optical element 33C are, for example, collimators or focusing elements. In this way, a group of a plurality of windows, through holes, and optical elements is formed above the counter electrode 27.

[0053] Figure 3 FIG. is a structural diagram showing an example of a position detection system according to an embodiment. The position detection system 3 is a system that measures the distance to the reflection site based on the front or back surface of the counter electrode 27 using optical interference, and based on the measurement result, detects the positional relationship between, for example, the mounting table 21 and the focusing ring FR. As Figure 3 shown, the position detection system 3 includes a light source 30, an optical circulator 31, an optical switch 32, a first optical element 33A, a second optical element 33B, a third optical element 33C, and a measurement unit 34. The position detection system 3 may not include the optical switch 32.

[0054] The measurement unit 34 is connected to an arithmetic device 35 (an example of a control unit). The arithmetic device 35 may be a computer having a processor, a storage device, a display device, an input / output device, a communication device, etc. A series of operations of the position detection system 3 described later are realized by the control of each part of the position detection system 3 performed by the arithmetic device 35 in accordance with a program stored in the storage device. The storage device stores in advance the positions of the optical elements, the inner diameter size of the focusing ring FR, the outer shape size of the substrate mounting area 21a, etc. The information stored in the storage device is used for the arithmetic operation of the arithmetic device 35. The arithmetic device 35 may be integrated with Figure 1 the control device MC shown. The light source 30, the optical circulator 31, the optical switch 32, the first optical element 33A, the second optical element 33B, the third optical element 33C, and the measurement unit 34 are each connected using optical fibers.

[0055] The light source 30 can generate measurement light. The light source 30 generates, for example, measurement light having a wavelength that can transmit through the measurement object. The light source 30 is, for example, a wavelength scanning light source. The measurement object is, for example, an object (wafer W), or parts (components) of the processing device 2 such as the focusing ring FR and the counter electrode 27. The measurement object is made of, for example, Si (silicon), SiO 2(Quartz) or Al 2 O 3 (Sapphire), etc. An example of the measurement light that can pass through an object made of such a material is infrared light.

[0056] The optical circulator 31 is connected to the light source 30, the optical switch 32, and the measurement unit 34. The optical circulator 31 transmits the measurement light generated by the light source 30 to the optical switch 32. The optical switch 32, as an example, has an input terminal and three output terminals. The input terminal is connected to the optical circulator 31. In addition, the three output terminals are connected to the first optical element 33A via the first optical fiber 36A, to the second optical element 33B via the optical fiber 36B, and to the third optical element 33C via the optical fiber 36C. The optical switch 32 can switch the output target. The optical switch 32 alternately transmits the light from the optical circulator 31 from the input terminal to the three output terminals.

[0057] The first optical element 33A, the second optical element 33B, and the third optical element 33C emit the measurement light generated by the light source 30 as outgoing light and make the reflected light incident. Specifically, the first optical element 33A, the second optical element 33B, and the third optical element 33C respectively emit the measurement light adjusted to convergent light rays to the focusing ring FR via the counter electrode 27. Moreover, the first optical element 33A, the second optical element 33B, and the third optical element 33C respectively make the reflected light from the counter electrode 27 and the focusing ring FR incident. Among the reflected lights, it includes not only the reflected light on the surface but also the reflected light on the back surface. The first optical element 33A, the second optical element 33B, and the third optical element 33C respectively transmit the reflected light to the optical switch 32.

[0058] The first actuator 37A (an example of the driving unit), the second actuator 37B (an example of the driving unit), and the third actuator 37C (an example of the driving unit) are driven by the arithmetic unit 35. The first optical element 33A, the second optical element 33B, and the third optical element 33C respectively move the first optical element 33A, the second optical element 33B, and the third optical element 33C to scan a specified scanning range. The first optical element 33A, the second optical element 33B, and the third optical element 33C can respectively scan a specified scanning range through the first actuator 37A, the second actuator 37B, and the third actuator 37C. The scanning range is the range from the substrate mounting area 21a to the focusing ring FR. For example, it corresponds to the width of the first through hole 29A and the first window 28A as shown in Figure 2 shown. Figure 4 It is a diagram showing an example of the scanning using three optical elements. As shown in Figure 4As shown, the first optical element 33A scans within a first scanning range Q1 that extends radially. The second optical element 33B scans within a second scanning range Q2 that extends radially at a position circumferentially spaced apart from the first scanning range Q1. The third optical element 33C scans within a third scanning range Q3 that extends radially at a position circumferentially spaced apart from the first scanning range Q1 and the second scanning range Q2. In addition, the scanning direction can be either radially outward or inward.

[0059] Return Figure 3 , the optical switch 32 alternately transmits the reflected light obtained by the first optical element 33A, the second optical element 33B, and the third optical element 33C to the optical circulator 31. The optical circulator 31 transmits the reflected light to the measurement unit 34. The measurement unit 34 measures the reflected light spectrum of the reflected light obtained from the optical circulator 31. The reflected light spectrum represents the intensity distribution depending on the wavelength or frequency of the reflected light. The measurement unit 34 outputs the reflected light spectrum to the arithmetic unit 35.

[0060] The arithmetic unit 35 calculates the positional relationship between the stage 21 and the focusing ring FR based on the reflected light in the scanning range for each optical element. Figure 5 is a diagram showing an example of the scanning range of the position detection system 3 according to an embodiment. In Figure 5 , as an example, the scanning of the first optical element 33A will be described. The first optical element 33A moves within the first scanning range Q1 from the substrate mounting area 21a to the focusing ring FR while outputting the outgoing light.

[0061] The outgoing light output from the first optical element 33A is reflected by the respective components of the processing device 2 in the scanning range. For example, the outgoing light is reflected on the front and back surfaces of the counter electrode 27, the substrate mounting area 21a of the stage 21, and the front and back surfaces of the focusing ring FR. The first optical element 33A acquires the reflected light at the scanning position. The arithmetic unit 35 measures the height of the scanning range based on the reflected light spectrum.

[0062] The arithmetic unit 35 measures the horizontal distance D between the stage 21 and the focusing ring FR based on the change in the height of the scanning range A . Specifically, the arithmetic unit 35 measures the positions of the substrate mounting area 21a, the flat upper portion FRA and the flat lower portion FRB of the focusing ring FR, and the horizontal distance D from the position of the height change between the flat portions A . As an example, the arithmetic unit 35 measures the distance D from the substrate mounting area 21a to the flat upper portion FRA of the focusing ring FR A1 . The arithmetic unit 35 can measure the distance D to the inclined surface FRE of the focusing ring FR A2Alternatively, the distance D to the flat lower portion FRB of the focusing ring FR can also be measured. A3 The above distance is an example, and the arithmetic unit 35 can measure the distance based on a portion other than the flat portion.

[0063] The second optical element 33B and the third optical element 33C also perform scanning within their respective scanning ranges. The arithmetic unit 35 measures the horizontal distance D between the stage 21 and the focusing ring FR B (D B1 、D B2 、D B3 ) and D C (D C1 、D C2 、D C3 ).

[0064] The arithmetic unit 35 calculates the positional relationship based on the horizontal distance D between the stage 21 and the focusing ring FR measured by each optical element. The outer diameter of the substrate placement area 21a and the inner diameter of the focusing ring FR are circular and are predetermined in size. Therefore, the positional relationship between the stage 21 and the focusing ring FR can be calculated based on the horizontal distance D, the inner diameter of the focusing ring FR, and the outer diameter of the substrate placement area 21a. Specifically, the inner diameter of the flat upper portion FRA of the focusing ring FR is set as A FRA , and the outer diameter of the substrate placement area 21a is set as A 21 . When the centers of the substrate placement area 21a and the focusing ring FR coincide, the horizontal distance D (D A1 、D B1 、D C1 ) can be calculated by the following mathematical formula (1).

[0065]

[0066] Thus, based on the difference between the value obtained by dividing the difference between the inner diameter of the substrate placement area 21a and the inner diameter of the focusing ring FR by 2 ((A FRA -A 21 ) / 2) and the horizontal distance D (D A1 、D B1 、D C1 ), the positional relationship between the stage 21 and the focusing ring FR can be calculated. That is, based on the differences corresponding to the distances D A1 、D B1 、D C1 respectively, the deviation amount and deviation direction of the center positions of the substrate placement area 21a and the focusing ring FR can be calculated. The above relationship also holds for the inner diameter of the inclined surface FRE of the focusing ring FR and the inner diameter of the flat lower portion FRB of the focusing ring FR with respect to the horizontal distance D corresponding to their respective positions. Therefore, by measuring the distance DA1 , D B1 , D C1 Group of, distance D A2 , D B2 , D C2 Group of, distance D A2 , D B2 , D C2 At least one group in the group is sufficient.

[0067] The control device MC adjusts the conveyance position of the focus ring FR based on the positional relationship between the stage 21 and the focus ring FR. When the difference between the value obtained by dividing the difference between the inner diameter of the substrate placement region 21a and the focus ring FR by 2 and the distance D in the horizontal direction is larger than a specified threshold value, the arithmetic device 35 outputs the difference corresponding to the measurement position of each optical element to the control device MC. In this case, the control device MC adjusts the training value (parameters for controlling the operation of the conveyance device TU2) of the conveyance device TU2 so that each difference becomes 0.

[0068] The control device MC adjusts the training value after sending out the focus ring FR from the processing chamber S, and sends in the focus ring FR again. The control device MC may also not send out the focus ring FR and adjust the training value inside the processing chamber S. The conveyance device TU2 adjusts the conveyance position of the focus ring FR by the adjustment of the training value performed by the control device MC.

[0069] A system 1 for conveying the focus ring FR according to an embodiment includes the above-described conveyance device TU2, control device MC, and position detection system 3. The arithmetic device 35 of the control device MC and the position detection system 3 do not need to be separate. The control device MC may be configured to be able to perform part or all of the functions of the arithmetic device 35.

[0070] [Operation of the system for conveying the focus ring]

[0071] Figure 6 is a flowchart showing an example of the processing of a method for conveying the focus ring FR according to an embodiment. When the focus ring FR is unloaded from the focus ring placement region 21b and a new focus ring FR is sent in, the system 1 executes Figure 6 the flowchart shown.

[0072] As Figure 6 shown, first, the conveyance device TU2 conveys the focus ring FR to the focus ring placement region 21b surrounding the substrate placement region 21a on which the wafer W is placed (step S10). Next, the position detection system 3 scans the focus ring FR. As an example, the scanning range from the focus ring placement region 21b to the focus ring FR is scanned by three optical elements (step S20).

[0073] The arithmetic unit 35 calculates the positional relationship between the stage 21 and the focusing ring FR based on the horizontal distance D between the substrate placement area 21a and the focusing ring FR measured by each optical element. The positional relationship is calculated based on the outer diameter of the substrate placement area 21a, the inner diameter of the focusing ring FR, and the horizontal distance D between the substrate placement area 21a and the focusing ring FR measured by each optical element (step S30).

[0074] The arithmetic unit 35 determines whether the conveying position of the focusing ring FR is appropriate based on the positional relationship between the stage 21 and the focusing ring FR (step S40). The arithmetic unit 35 determines that the conveying position is appropriate when the difference between the value obtained by dividing the difference between the inner diameter of the substrate placement area 21a and the focusing ring FR by 2 and the horizontal distance D is below a specified threshold. When it is determined that the conveying position is appropriate (step S40: Yes), Figure 6 the flowchart ends.

[0075] The arithmetic unit 35 determines that the conveying position is inappropriate when the difference between the value obtained by dividing the difference between the inner diameter of the substrate placement area 21a and the focusing ring FR by 2 and the horizontal distance D is greater than the specified threshold. When it is determined that the conveying position is inappropriate (step S40: No), the conveying device TU2 sends out the focusing ring FR (step S50). In this case, the arithmetic unit 35 outputs to the control device MC the difference between the value obtained by dividing the difference between the inner diameter of the substrate placement area 21a and the focusing ring FR by 2 and the horizontal distance D.

[0076] The control device MC adjusts the conveying position of the focusing ring FR based on the positional relationship between the stage 21 and the focusing ring FR (step S60). The control device MC adjusts the training value of the conveying device TU2 (the control parameter for controlling the operation of the conveying device TU2) so that each difference becomes 0. After adjusting the conveying position of the focusing ring FR, the focusing ring FR is conveyed again (step S10). In this way, the processes of step S10 to step S60 are repeatedly executed until it is determined that the conveying position is appropriate.

[0077] [Second Embodiment]

[0078] Figure 7This is a diagram showing an example of determining the conveyance position of the focus ring FR during conveyance. Before placing the focus ring FR on the focus ring placement area 21b, the position detection system of the second embodiment determines the positional relationship between the placement stage 21 and the focus ring FR using at least three or more optical elements. For example, when the focus ring FR is conveyed to the conveyance device TU2, the position detection system determines the positional relationship between the placement stage 21 and the focus ring FR when the focus ring FR is placed on the lift pins of the focus ring placement area 21b. The position detection system can also determine the positional relationship between the placement stage 21 and the focus ring FR while being supported by the conveyance device TU2.

[0079] The first optical element 33A, the second optical element 33B, and the third optical element 33C are arranged at positions where outgoing light can be emitted toward the peripheral portion of the substrate placement area 21a. The first optical element 33A, the second optical element 33B, and the third optical element 33C are arranged such that the irradiation positions along the circumferential direction of the placement stage 21 are spaced apart from each other.

[0080] The arithmetic device 35 determines the positional relationship between the placement stage 21 and the focus ring FR based on the reflected light incident on each optical element. Figure 8 (A) and (B) are diagrams showing an example of a proper positional relationship between the placement stage 21 and the focus ring FR. Figure 8 (A) is a top view of the placement stage 21 and the focus ring FR. Figure 8 (B) is a partial cross-sectional view of the placement stage 21 and the focus ring FR. In Figure 8 (A) and (B), the center position of the substrate placement area 21a coincides with the center position of the focus ring FR. When the positional relationship between the placement stage 21 and the focus ring FR is proper, the inner diameter of the focus ring FR is larger than the outer diameter of the substrate placement area 21a, so the outgoing light is reflected at the peripheral portion of the placement stage 21. The arithmetic device 35 determines that the positional relationship between the placement stage 21 and the focus ring FR is proper when the heights measured by the three optical elements are all consistent with the predetermined height of the substrate placement area 21a.

[0081] Figure 9 (A) and (B) are diagrams showing an example of an improper positional relationship between the placement stage 21 and the focus ring FR. Figure 9 (A) is a top view of the placement stage 21 and the focus ring FR. Figure 9 (B) is a partial cross-sectional view of the placement stage 21 and the focus ring FR. In Figure 9In (A) and (B), the center position of the focusing ring FR is displaced to the right with respect to the center position of the substrate placement area 21a, and the inner diameter of the focusing ring FR overlaps with the outer diameter of the substrate placement area 21a. When the positional relationship between the placement stage 21 and the focusing ring FR is inappropriate, the emitted light is reflected by the focusing ring FR. The arithmetic device 35 determines that the positional relationship between the placement stage 21 and the focusing ring FR is inappropriate based on the situation where the height measured by at least one of the three optical elements is inconsistent with the height of the predetermined substrate placement area 21a.

[0082] The arithmetic device 35 outputs the measurement results of the three optical elements to the control device MC. The control device MC adjusts the training value of the conveying device TU2 based on the measurement results of the three optical elements. The conveying device TU2 can re-feed the focusing ring FR according to the adjusted training value after sending the focusing ring FR out of the chamber, or can adjust the holding position of the focusing ring FR in the chamber based on the adjusted training value.

[0083] When the focusing ring FR is conveyed in a state where the positional relationship between the placement stage 21 and the focusing ring FR is inappropriate, there is a possibility that the placement stage 21 comes into contact with the focusing ring FR. The position detection system of the second embodiment can prevent this situation by determining the position of the focusing ring FR being conveyed.

[0084] The structure described in the second embodiment can be used in combination with the first embodiment. The system 1 can determine the positional relationship between the placement stage 21 and the focusing ring FR in Figure 6 step S10. For example, the system 1 can determine the positional relationship between the placement stage 21 and the focusing ring FR using at least three or more optical elements after feeding the focusing ring FR into the chamber and before arranging it on the focusing ring placement area 21b.

[0085] [Third Embodiment]

[0086] Figure 10 FIG. is an example showing a scan using two optical elements. In the position detection system of the third embodiment, the arithmetic device 35 calculates the positional relationship between the placement stage 21 and the focusing ring FR based on the horizontal distance D between the substrate placement area 21a and the focusing ring FR measured by the two optical elements. In the position detection system of the third embodiment, the first optical element 33A is provided at a position not 180 degrees opposite to the second optical element 33B with respect to the center position of the substrate placement area 21a.

[0087] Even if there are two optical elements, the relationship of the above mathematical formula (1) holds. Therefore, based on the difference between the value obtained by dividing the difference between the substrate placement area 21a and the inner diameter of the focusing ring FR by 2 and the horizontal distance D, the positional relationship between the placement stage 21 and the focusing ring FR can be calculated.

[0088] Figure 11 (A) and (B) of FIG. are diagrams showing an example of calculating a positional relationship based on a scanning result using two optical elements in polar coordinates. Figure 11 In (A) of FIG., a polar coordinate system is shown in which a specified rotational position θ is set to zero coordinates with respect to the center position of the substrate placement area 21a. The first optical element 33A is arranged at the rotational position θ. 0 The distance D in the horizontal direction between the substrate placement area 21a at the rotational position θ and the focus ring FR is set. A Regarding the rotational position θ. A The second optical element 33B is arranged at the rotational position θ. A1 The distance D in the horizontal direction between the substrate placement area 21a at the rotational position θ and the focus ring FR is set. B Regarding the rotational position θ. B The distance D in the horizontal direction between the substrate placement area 21a at the rotational position θ and the focus ring FR is set. B1 .

[0089] Figure 11 In (B) of FIG., a curve graph is drawn based on the polar coordinates of (A) of FIG.. The vertical axis represents the distance in the horizontal direction between the substrate placement area 21a and the focus ring FR, and the horizontal axis represents the rotational position. When the center positions of the substrate placement area 21a and the focus ring FR coincide, the distance in the horizontal direction between the substrate placement area 21a and the focus ring FR is maintained as a fixed value. In (B) of FIG., as an example, the fixed distance in the horizontal direction is 1.0 mm. When the center position of the substrate placement area 21a and the center position of the focus ring FR do not coincide, as shown in (B) of FIG., the distance in the horizontal direction varies in a sine wave shape. The distances D and D in the horizontal direction scanned and calculated by the first optical element 33A and the second optical element 33B are respectively shown as the distances at the rotational positions θ and θ of the sine wave. Figure 11 Regarding the rotational position θ. Figure 11 In (B) of FIG., a curve graph is drawn based on the polar coordinates of (A) of FIG.. The vertical axis represents the distance in the horizontal direction between the substrate placement area 21a and the focus ring FR, and the horizontal axis represents the rotational position. When the center positions of the substrate placement area 21a and the focus ring FR coincide, the distance in the horizontal direction between the substrate placement area 21a and the focus ring FR is maintained as a fixed value. In (B) of FIG., as an example, the fixed distance in the horizontal direction is 1.0 mm. When the center position of the substrate placement area 21a and the center position of the focus ring FR do not coincide, as shown in (B) of FIG., the distance in the horizontal direction varies in a sine wave shape. The distances D and D in the horizontal direction scanned and calculated by the first optical element 33A and the second optical element 33B are respectively shown as the distances at the rotational positions θ and θ of the sine wave. Figure 11 In (B) of FIG., a curve graph is drawn based on the polar coordinates of (A) of FIG.. The vertical axis represents the distance in the horizontal direction between the substrate placement area 21a and the focus ring FR, and the horizontal axis represents the rotational position. When the center positions of the substrate placement area 21a and the focus ring FR coincide, the distance in the horizontal direction between the substrate placement area 21a and the focus ring FR is maintained as a fixed value. In (B) of FIG., as an example, the fixed distance in the horizontal direction is 1.0 mm. When the center position of the substrate placement area 21a and the center position of the focus ring FR do not coincide, as shown in (B) of FIG., the distance in the horizontal direction varies in a sine wave shape. The distances D and D in the horizontal direction scanned and calculated by the first optical element 33A and the second optical element 33B are respectively shown as the distances at the rotational positions θ and θ of the sine wave. A1 and D B1 are respectively shown as the distances at the rotational positions θ A and the rotational position θ B of the sine wave.

[0090] Let the distance by which the center position of the substrate placement area 21a is offset from the center position of the focus ring FR be R FR , and the rotational position of the offset be θ FR , as shown in (A) and (B) of FIG.. The distances D and D in the horizontal direction scanned and calculated by the first optical element 33A and the second optical element 33B, Figure 11 and R A1 and D B1 , and θ FR and θ FR have the relationships of the following mathematical formulas (2) and (3) hold.

[0091]

[0092]

[0093] Rotational position θ A and the rotational position θ B , since it is the mounting position of the optical element, it is known. The inner diameter A of the focusing ring FR FR and the outer diameter A21 of the substrate placement area 21a are also known. Therefore, the arithmetic unit 35 can calculate the deviation distance R FR and the deviated rotational position θ FR . In this way, by performing calculations in polar coordinates, it is possible to clarify the distance and direction for adjusting the deviation of the position of the focusing ring FR from the placement table 21.

[0094] [Modification Example]

[0095] As described above, various exemplary embodiments have been described, but the present invention is not limited to the above-described exemplary embodiments, and various omissions, substitutions, and changes can be made. In addition, elements in different embodiments can be combined to form other embodiments.

[0096] The optical element is not limited to a focusing device. The optical element may be any element that has a function of irradiating light to an object and obtaining reflected light from the object, and is not particularly limited, and may be a collimator or the like. In addition, the light source 30 may be an SLD (Super Luminescent Diode), and in this case, the measurement unit 34 uses a spectroscope. The position detection system 3 can measure the distance from the optical element to the reflection site based on the optical element using optical interference.

[0097] The arithmetic unit 35 can calculate the positional relationship between the focusing ring FR supported on the focusing ring placement area 21b and the placement table 21 in polar coordinates based on the scanning results of three or more optical elements. As an example, in addition to the first optical element 33A and the second optical element 33B, the polar coordinates are calculated based on the scanning results of the third optical element 33C. When the horizontal distance D calculated by scanning the third optical element 33C in the θ C direction is set as D C1 , the following mathematical formula (4) holds.

[0098]

[0099] Accordingly, the arithmetic unit 35 can use the simultaneous equations of mathematical formula (2) and mathematical formula (3), the simultaneous equations of mathematical formula (3) and mathematical formula (4), and the simultaneous equations of mathematical formula (2) and mathematical formula (4). The rotational position θ A , the rotational position θ B and the rotational position θ C are known because they are the mounting positions of the optical elements, but there are mounting errors of the optical elements and the like. In addition, there may sometimes be measurement errors. The arithmetic unit 35 can reduce the errors by, for example, averaging the solutions of the respective simultaneous equations. The third embodiment can be applied to the first embodiment and the second embodiment.

[0100] [Summary of the Embodiments]

[0101] According to the systems and methods of the respective embodiments, by scanning a plurality of optical elements, the height of the focus ring FR with respect to the height of the substrate placement area 21a can be detected. Based on the change amount of this height, the positional relationship between the focus ring FR and the placement stage 21 within the scanning range can be calculated. The shape of the substrate placement area 21a is circular, and the outer diameter of the substrate placement area 21a and the inner diameter of the focus ring FR are predetermined. Therefore, the position detection system can grasp the positional relationship between the focus ring FR and the placement stage 21 by scanning a plurality of optical elements and adjust the conveyance position.

[0102] According to the system and method of the second embodiment, the positional relationship between the focus ring FR and the placement stage 21 can be determined during the conveyance of the focus ring FR. Therefore, this system and method can prevent contact between the focus ring FR and the placement stage 21.

[0103] According to the system and method of the third embodiment, the positional relationship between the focus ring FR and the placement stage 21 can be calculated in polar coordinates. Therefore, the system can clarify the distance and direction for adjusting the deviation of the position of the focus ring FR from the placement stage 21.

[0104] From the above description, it should be understood that various changes can be made to the various embodiments of the present invention without departing from the scope and gist of the present invention. Therefore, the various embodiments disclosed in this specification are not restrictive, and the true scope and gist are given by the scope of the appended claims.

Claims

1. A conveying system for conveying a focusing ring to a processing device, characterized in that: the conveying system includes a conveying device and a position detection system, the processing device has: a chamber body; and a mounting table, which is arranged in a chamber provided by the chamber body, and includes a substrate mounting area and a focusing ring mounting area surrounding the substrate mounting area, the conveying device is configured to be able to convey the focusing ring onto the focusing ring mounting area, the position detection system includes: a light source configured to be able to generate measurement light; a plurality of optical elements configured to emit the measurement light generated by the light source as outgoing light and allow reflected light to enter; a driving unit configured to move the optical elements respectively to scan a scanning range from the focusing ring supported on the focusing ring mounting area to the substrate mounting area; and a control unit configured to calculate, for each of the optical elements, the positional relationship between the focusing ring supported on the focusing ring mounting area and the mounting table based on the reflected light within the scanning range, the conveying device is configured to adjust the position of conveying the focusing ring onto the focusing ring mounting area based on the positional relationship calculated by the control unit.

2. The conveying system according to claim 1, characterized in that: the plurality of optical elements are three or more optical elements, the optical elements are respectively configured to be able to emit the measurement light to the end of the upper surface of the substrate mounting area, the control unit is configured to be able to judge the positional relationship between the focusing ring supported on the conveying device and the substrate mounting area based on the reflected light of the outer edge of the substrate mounting area when the focusing ring is to be conveyed onto the focusing ring mounting area.

3. The conveying system according to claim 1 or 2, characterized in that: the control unit is configured to calculate the positional relationship between the focusing ring supported on the focusing ring mounting area and the mounting table in polar coordinates.

4. A conveying method for conveying a focusing ring, characterized in that, it includes: a step of conveying the focusing ring to a focusing ring mounting area, where the focusing ring mounting area surrounds the substrate mounting area for mounting a substrate of a mounting table; a step of scanning a scanning range from the focusing ring supported on the focusing ring mounting area to the substrate mounting area with a plurality of optical elements, where the plurality of optical elements emit the measurement light as outgoing light and allow the reflected light to enter; a step of calculating the positional relationship between the focusing ring supported on the focusing ring mounting area and the mounting table based on the reflected light within the scanning range; and a step of determining the conveying position of the focusing ring based on the positional relationship between the focusing ring supported on the focusing ring mounting area and the mounting table calculated in the calculating step.

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