Edge computing device cooling system and edge cabinet including the same

Abstract

The present application discloses an edge cooling system and an edge cabinet including the same. According to one embodiment, an edge cooling system having an IT chassis has an edge device partially immersed in a liquid coolant. The device generates heat, which is transferred to the liquid coolant, thereby evaporating the liquid coolant into steam. The system includes: a condenser that condenses steam into liquid coolant; a steam buffer configured to buffer steam and provide steam to the condenser; an accumulator configured to accumulate condensed liquid coolant and provide liquid coolant to the IT chassis; a main liquid supply line that connects the condenser and the IT chassis to the accumulator; and a main steam return line that connects the condenser and the IT chassis to the steam buffer to form a heat exchange loop. The system design includes a accumulator and a steam buffer, and performs multiple cooling modes including supplemental cooling. Each component is completely enclosed in the edge chassis.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to a cooling system for an edge computing device or enclosed electronic package. Background Art

[0002] Today, billions of computing devices are connected to the Internet. Therefore, the Internet of Things (IoT) ecosystem is an exponentially growing network of interconnected computing devices. IoT devices may include smart devices, smart vehicles, connected systems, etc. that use wired or wireless communications over the Internet. Data from IoT devices can be processed and analyzed in a cloud environment, which may include a data center housing thousands of servers and information technology (IT) equipment for central or core computing. However, it is not feasible or cost-effective to send all data from IoT devices to the cloud for analysis and processing to serve IoT devices.

[0003] In such an IoT environment, edge computing allows data from IoT devices to be analyzed and processed at or near the edge before being sent from the IoT devices to a data center or cloud environment. This allows edge computing to provide high-performance computing, storage, and network resources to users closer to the IoT devices in order to improve response time and computing performance, rather than relying solely on cloud resources, and in addition, to reduce the substantial cost of data transmission. Therefore, edge computing plays an important role in offloading and distributing processing and computing from the cloud in a data center with thousands of information technology (IT) devices and equipment to handle large amounts of data storage and analysis of IoT devices.

[0004] For example, time-sensitive applications include artificial intelligence (AI) applications such as autonomous driving (AD). Vehicles with AD driving capabilities require edge computing because data analysis needs to be implemented in real time with no or very little latency (which may occur if all analysis is performed in the cloud). As a result, edge computing for this type of application should be as close as possible to the end user, such as in the vehicle providing AD capabilities. Therefore, the location used for edge computing deployment and infrastructure is also critical for processing time-sensitive applications for IoT devices.

[0005] The environment at the location where the edge computing device is deployed may be different from that of the data center. In particular, the data center may be designed and controlled to have an optimal environment for information technology (IT) equipment (e.g., servers) to operate therein. For example, the data center controls and manages the temperature, humidity, flow rate and air quality of the cooling air in the data center room where the IT equipment is deployed. As a result, the cooling system for the IT equipment, such as a forced air cooling system, is designed in conjunction with the environment of the data center.

[0006] However, the locations where edge computing devices are deployed may not have a controlled environment similar to a data center and therefore may not be optimal for cooling systems deployed within a data center. For example, some locations may be exposed to the outside environment. As a result, these locations may be sensitive to dynamic changes in ambient temperature and humidity (e.g., based on the time of day and time of year). In addition, unlike data centers, some locations may not include air filtration systems and may be sensitive to air contamination, which may adversely affect the performance of the cooling system and edge computing devices. Therefore, there is a need for an edge cooling system that is capable of adequately cooling edge computing devices regardless of environmental conditions such as ambient temperature. In addition, these systems need to be completely sealed from the edge computing devices in order to protect the devices (and the cooling system) from environmental influences. Summary of the invention BRIEF DESCRIPTION OF THE DRAWINGS

[0007] These aspects are shown by way of example and not by way of limitation in the various figures of the accompanying drawings, in which like reference numerals denote similar elements. It should be noted that references to "an" aspect or "one" aspect of the present disclosure are not necessarily to the same aspect, and that they mean at least one. In addition, for the sake of brevity and to reduce the total number of drawings, a given drawing may be used to illustrate features of more than one aspect, and all elements in the drawing may not be required for a given aspect.

[0008] Figure 1 is a block diagram illustrating an example of an edge cooling system according to one embodiment.

[0009] Figure 2 is a block diagram illustrating an example of multiple heat exchangers of an edge cooling system according to one embodiment.

[0010] Figure 3 is a block diagram illustrating an example of an edge chassis according to one embodiment.

[0011] Figure 4 is a block diagram illustrating an example of an edge cabinet according to one embodiment.

[0012] Figure 5 is a flow chart of a process for determining in which cooling mode an edge cooling system is to operate based on ambient temperature, according to one embodiment.

[0013] FIG. 6A to FIG. 6C is an example of how to design and manage liquid coolant and vapor flow through an edge cooling system based on ambient temperature according to one embodiment. DETAILED DESCRIPTION

[0014] Several aspects of the present disclosure are now explained with reference to the accompanying drawings. Whenever the shapes, relative positions and other aspects of the components described in a given aspect are not clearly defined, the scope disclosed herein is not limited to the components shown, which are only for illustrative purposes. In addition, although many details are set forth, it should be understood that certain aspects can be practiced without these details. In other cases, well-known circuits, structures and techniques are not shown in detail to avoid obscuring the understanding of the description. In addition, unless explicitly stated to the contrary, all ranges described herein are considered to include the endpoints of each range.

[0015] Reference to "one embodiment" or "an embodiment" in the specification means that a particular feature, structure, or characteristic described in conjunction with the embodiment can be included in at least one embodiment of the present disclosure. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0016] Various embodiments of the present disclosure describe a cooling solution design for edge computing devices. The solution uses a two-phase change technique in designing two heat exchange loops for transferring heat generated by edge devices to the surrounding environment. In particular, the solution is an edge cooling system in which one or more edge devices are at least partially immersed in a two-phase liquid coolant with a low boiling point in an IT chassis, which is completely sealed within an edge housing (or chassis). A fluid heat circuit including a supply liquid line and a return steam line is used within the housing to connect the IT chassis to a condenser to form one of the two heat exchange loops. Moreover, each of these components can be completely sealed within the housing together with the IT chassis. During operation (for example, when the edge device performs data processing services), heat is generated and extracted by the two-phase liquid coolant. When the temperature reaches its boiling point, the coolant evaporates into steam, which enters the condenser through the return steam line. The condenser is coupled (via ports on the enclosure) to one or more heat exchangers external to the enclosure to form a second heat exchange loop to provide cooling to the condenser, thereby allowing the condenser to condense the vapor back into a liquid that is recirculated back to the IT chassis through the supply liquid line. Thus, the system is able to cool edge devices while the first heat exchange loop is completely sealed within the enclosure and is therefore less sensitive to the surrounding environment.

[0017] In addition, the edge cooling system is designed to operate in different modes based on various temperature conditions. Specifically, the system also includes a steam buffer that stores excess steam and is assembled in parallel with the return steam line, and a liquid accumulator that accumulates excess liquid coolant and is assembled in parallel with the supply liquid line. The system manages excess liquid coolant and steam by using several valves connected to the liquid supply line and the steam return line. Depending on the ambient temperature, the system will operate in one of several modes in which the valves are controlled to regulate the flow of liquid coolant in the liquid supply line and regulate the flow of steam in the steam return line. Therefore, the system is able to operate in any environment through appropriate design (for example, when the buffer system is large enough, the system is able to operate in any environment), and is able to maintain peak performance during environmental changes.

[0018] Embodiments of the present disclosure address the problem of deploying and cooling edge computing devices (or edge devices) in different environments. Specifically, unlike deployment in a data center with a controlled environment (e.g., controlled temperature, humidity, air quality, etc.), edge devices may need to be deployed in an external environment that is directly exposed to external (or ambient) air and is therefore not as effectively controlled as a data center. The deployment of such devices in an external environment includes many challenges, such as ensuring that there is adequate cooling at all times given ambient temperature changes, and ensuring that air quality does not affect the long-term reliability of the edge device.

[0019] The solution proposed in the present disclosure provides an edge cooling system, which includes an IT chassis having an edge device that is at least partially immersed in a liquid coolant; a condenser; a steam buffer; an accumulator; a main liquid supply line that circulates the liquid coolant and connects the condenser, the IT chassis and the accumulator together; and a main steam return line that circulates the liquid coolant evaporated by the IT chassis and connects the condenser, the IT chassis and the steam buffer together, all of which are completely enclosed in the edge chassis. Connected to the condenser are one or more heat exchangers that draw heat from the condenser and release it to the external environment. Therefore, the heat exchange circuit that draws heat from the edge device is contained in a completely closed environment, thereby protecting the components from the external environment. The system also includes several valves that control the flow of liquid coolant and steam within the system in response to the ambient temperature. As a result, the system is able to effectively cool the edge device to meet the dynamic temperature changes of the external environment.

[0020] According to one embodiment, an edge cooling system includes an information technology (IT) chassis having an edge device configured to provide IT services and at least partially immersed in a liquid coolant, wherein when the edge device provides the IT services, the edge device generates heat that is transferred to the liquid coolant, thereby causing at least some of the liquid coolant to become vapor. The system also includes: a condenser configured to condense the steam back into a liquid coolant; a steam buffer configured to at least one of: buffer the steam and provide the buffered steam to the condenser; a liquid reservoir configured to at least one of: accumulate the liquid coolant condensed by the condenser and provide the accumulated liquid coolant to the IT chassis; a main liquid supply line and a main steam return line, the main liquid supply line connecting the condenser and the IT chassis to the liquid reservoir, and the main steam return line connecting the condenser and the IT chassis to the steam buffer to form a heat exchange loop; and an edge chassis, wherein the IT chassis, the steam buffer, the condenser, the liquid reservoir, the main liquid supply line, and the main steam return line are completely enclosed in the edge chassis.

[0021] In one embodiment, the heat exchange circuit is a first heat exchange circuit, wherein the edge cooling system further comprises a heat exchanger connected to the condenser via a liquid supply line and a vapor return line to form a second heat exchange circuit. In another embodiment, the edge chassis comprises a main supply port and a main return port, both of which are connected to the condenser, wherein the main supply port and the main return port each have a drip-free quick disconnect fitting, which is configured to be removably connected to the liquid supply line and the vapor return line, respectively. In some embodiments, the liquid coolant is a first liquid coolant and the steam is a first steam, wherein the liquid supply line is configured to provide a second liquid coolant from the heat exchanger to the condenser, and the vapor return line is configured to provide a second steam from the condenser to the heat exchanger, the second steam being generated when the condenser transfers heat contained in the steam in the first heat exchange circuit to the second liquid coolant, wherein the heat exchanger has a cooling coil and one or more fans, the cooling coil being configured to condense the second steam in the second heat exchange circuit into the second liquid coolant, and the fan being configured to move ambient air over the cooling coil. In another embodiment, the heat exchanger is a first heat exchanger comprising: 1) a supply port and a return port, each configured to be removably coupled to a liquid supply line and a vapor return line, respectively; and 2) an extended supply port and an extended return port, both configured to be removably coupled to a second heat exchanger via an extended liquid supply line and an extended vapor return line, respectively, to extend the second heat exchange circuit to include the first heat exchanger and the second heat exchanger. In another embodiment, the heat exchanger and the edge chassis are an integral unit.

[0022] In one embodiment, the main liquid supply line includes a first three-way valve connected between the condenser, the accumulator and the IT chassis and a first two-way valve connected between the accumulator and the IT chassis, and the main steam return line includes a second three-way valve connected between the IT chassis, the steam buffer and the condenser and a second two-way valve connected between the steam buffer and the condenser. In some embodiments, the edge cooling system further includes a temperature sensor and a controller, the temperature sensor being configured to sense an ambient temperature and generate a signal representing the ambient temperature, the controller being communicatively coupled to the temperature sensor and configured to control the opening degree of the valve based on the ambient temperature measured and processed by the temperature sensor.

[0023] In one embodiment, when the ambient temperature is above a temperature threshold, the controller is configured to 1) open the first three-way valve to allow only liquid coolant to flow from the condenser into the accumulator, 2) open the first two-way valve to allow liquid coolant to flow from the accumulator into the IT chassis, 3) open the second three-way valve to allow steam to flow from the IT chassis into the steam buffer and the condenser, and 4) close the second two-way valve.

[0024] In one embodiment, wherein the temperature threshold is a first temperature threshold, wherein when the ambient temperature is below a second temperature threshold that is lower than the first temperature threshold, the controller is configured to 1) open the first three-way valve to allow liquid coolant to flow from the condenser into the accumulator and the IT chassis, 2) close the first two-way valve, 3) open the second three-way valve to allow only steam to flow from the IT chassis into the condenser; and 4) open the second two-way valve to allow steam to flow from the steam buffer into the condenser.

[0025] In another embodiment, when the ambient temperature is within a range from a first temperature threshold to a second temperature threshold, the controller is configured to: 1) open the first three-way valve to allow only liquid coolant to flow from the condenser to the IT chassis, 2) close the first two-way valve, 3) open the second three-way valve to allow only steam to flow from the IT chassis to the condenser, and 4) close the second two-way valve.

[0026] According to one embodiment, the edge cabinet includes an edge cabinet in which the IT chassis, condenser, steam buffer, accumulator, main liquid supply line and main steam return line as described above are enclosed. In one embodiment, the edge cabinet also includes one or more slots, each slot is configured to accommodate at least one heat exchanger, and the heat exchanger is configured to be connected to the condenser to form a second heat exchange loop as described above. In some embodiments, the edge cabinet also includes a temperature sensor and a controller as described above.

[0027] Figure 1is a block diagram showing an example of an edge cooling system according to one embodiment. Specifically, the figure illustrates a block diagram of an edge cooling system 1, which includes a temperature sensor 4, a controller 3, one or more heat exchangers 5a-5n, a condenser 6, an IT chassis 9, a liquid reservoir 7, a steam buffer 8, a main liquid supply line 11, a main steam return line 12, a liquid supply line 13, and a steam return line 14. In one embodiment, the system may include more or fewer elements (or components) as described herein. For example, the system may include more than one liquid reservoir and / or steam buffer.

[0028] In one embodiment, at least some of the components described herein are enclosed within the edge chassis 2. As shown, the condenser 6, accumulator 7, steam buffer 8, IT chassis 9, main liquid supply line 11, and main steam return line 12 are completely enclosed within the edge chassis. For example, the chassis can seal the components from the external environment to form a closed heat exchange loop. As described herein, the chassis may include at least two ports that enable the liquid supply line 13 and the steam return line 14 to be connected to the condenser 6. In one embodiment, the edge chassis may include other components, such as a controller 3. In another embodiment, the temperature sensor 4 may be located outside the edge chassis 2 (e.g., connected to a surface of the edge chassis). More information about the edge chassis is described herein.

[0029] The IT chassis 9 includes an edge device 10 at least partially immersed in a liquid coolant 16. In one embodiment, the chassis may include several (e.g., one or more) edge devices, each configured to provide IT services (e.g., cloud-based storage services, image processing, deep data learning algorithms or modeling, etc.). Specifically, the edge devices may include any number of computing devices, such as blade servers, which may be deployed at a location close to an Internet of Things (IoT) device (not shown) compared to cloud computing (e.g., cloud computing performed by IT devices deployed in a centralized data center). Examples of IoT devices may include smart phones, smart home devices, self-driving cars or vehicles, smart factor devices or sensors, smart city devices (including traffic lights), smart hospital devices, bank / financial institution devices, school devices, etc. As a result, by bringing the edge devices closer to the IoT devices, data exchange and transmission can be faster and at a lower cost, as opposed to operations being performed by a centralized data center.

[0030] In another embodiment, the IT chassis 9 may include a battery backup unit (BBU) configured to provide backup battery power (e.g., to one or more edge devices) when power (e.g., alternating current (AC) power) is unavailable (e.g., during a power outage).

[0031] In one embodiment, the liquid coolant 16 can be any type of thermally conductive dielectric liquid. In another embodiment, the coolant can be a non-toxic fluid. In some embodiments, the liquid coolant can be designed and operated to have a low boiling point (e.g., below the threshold operating temperature of the edge device 10).

[0032] In one embodiment, the edge device 10 is configured to generate heat while providing IT services. The heat is transferred to the liquid coolant 16, thereby causing at least some of the liquid coolant to transform (e.g., evaporate) into a (first) vapor 17, which can be collected within the IT chassis 9 (e.g., above the top level of the liquid coolant). In one embodiment, the edge device 10 and the liquid coolant 16 (and the collected vapor 17) are enclosed in the IT chassis (e.g., sealed therein) to prevent fluid (e.g., liquid coolant and / or vapor) from leaking into the environment.

[0033] As shown, the main steam return line 12 connects the IT chassis 9 to (e.g., steam input) the condenser 6. In one embodiment, "coupling" refers to fluidly coupling at least two components together so as to allow a fluid (e.g., steam 17 and / or liquid coolant 16) to flow from one component to another. In this case, the line 12 is configured to allow steam to travel from the IT chassis to the condenser (or in other words, configured to provide steam 17 generated in the IT chassis to the condenser). The main steam return line 12 also connects the condenser and the IT chassis to a steam buffer 8, which is configured to buffer (or store) steam 17 evaporated from the liquid coolant 16 in the IT chassis. In one embodiment, the buffer 8 is also configured to provide the steam buffered in the buffer to the condenser 6. In one embodiment, the steam buffer is connected in parallel with the main steam return line 12, so that the return line 12 is coupled to the input end of the steam buffer and to the output end of the steam buffer. This article describes in more detail how to configure the steam buffer to buffer and provide steam.

[0034] A main liquid supply line 11 couples the IT chassis 9 to the condenser 6 (e.g., its liquid output). Similar to the main vapor return line 12, the main liquid supply line 11 is configured to allow liquid coolant condensed from the vapor 17 by the condenser 6 to flow from the condenser to the IT chassis. The main liquid supply line also couples the condenser and the IT chassis to an accumulator 7, which is configured to at least one of accumulate liquid coolant condensed by the condenser or provide accumulated liquid coolant to the IT chassis. Similar to the vapor buffer, the accumulator is connected in parallel with the main liquid supply line 11, such that the supply line 11 is coupled to the input of the accumulator and to the output of the accumulator. More information about how the accumulator accumulates and provides liquid coolant is described herein.

[0035] The condenser 6 is a two-phase liquid-to-liquid heat exchanger configured to condense vapor 17 into a cooled (condensed) liquid coolant 16. As described herein, a main liquid supply line 11 connects the condenser 6 and the IT chassis 9 to the liquid reservoir 7, and a main steam return line 12 connects the condenser and the IT chassis to the steam buffer 8 to form a (first) heat exchange loop. In addition, the condenser is connected to one or more heat exchangers 5a-5n via a liquid supply line 13 and a steam return line 14 to form another (second) heat exchange loop. During operation (e.g., when the edge device 10 provides IT services), steam 17 is generated and provided to the condenser by the main steam return line 12. The (second) liquid coolant (e.g., Figure 2 The liquid coolant 29 shown is provided to the condenser by the heat exchanger via the liquid supply line 13 (via the liquid input). The heat from the steam in the first heat exchange circuit is transferred to the second liquid coolant and evaporates the second liquid coolant into a (second) steam (e.g., Figure 2 17 and 18. The condenser may include a coil coupled between the main steam return line 12 and the main liquid supply line 11. The second liquid coolant may contact the coil, extracting the latent heat contained in the steam 17, thereby condensing the steam into liquid coolant 16. In one embodiment, the second liquid coolant in the second heat exchange circuit has a lower boiling point than the first liquid coolant 16 in the first heat exchange circuit. The condensed liquid coolant is provided to the IT chassis by the main liquid supply line 11 (which is connected to the liquid output of the condenser). As described herein, the heat transfer causes the second liquid coolant to evaporate into a second vapor, which is provided to one or more heat exchangers via the vapor return line 14 (which is coupled to the vapor output of the condenser), and then the heat exchanger condenses it back into the second liquid coolant.

[0036] In one embodiment, the pipelines configured to provide steam (e.g., main steam return line 12 and steam return line 14) can be different from the pipelines configured to provide liquid coolant (e.g., main liquid supply line 11 and liquid supply line 13). For example, the diameter of the steam line can be greater than the diameter of the liquid line. In one embodiment, any pipeline (steam and liquid) can be made of any material. For example, the pipeline can be made of metal, such as copper, polymer (e.g., EPDM rubber) and / or plastic. In one embodiment, the pipeline can be made of a flexible material such as rubber.

[0037] In one embodiment, the heat exchangers 5a-5n can be any type of two-phase heat exchanger configured to condense steam into a liquid. For example, the heat exchanger can be a forced air cooled heat exchanger configured to transfer heat contained in the steam received from the condenser 6 to the air (e.g., of the surrounding environment), thereby condensing (and cooling) the steam into a liquid coolant. As another example, the heat exchanger can be a liquid to liquid heat exchanger configured to transfer heat from the steam to a (third) liquid coolant that is provided to an external cooling source (e.g., an IT liquid cooling water system or any type of cooling fluid source). In one embodiment, the heat exchangers 5a-5n can include any combination of heat exchangers (e.g., some are forced air cooled heat exchangers and others are liquid to liquid heat exchangers). In one embodiment, the heat exchanger (more specifically, the heat exchanger 5a) can be configured to be removably coupled to the edge chassis. In another embodiment, one or more heat exchangers (e.g., 5a and 5b) can be part of the edge chassis 2 or fixedly coupled to the edge chassis 2. Specifically, heat exchangers 5a and 5b and edge chassis 2 can be integrated into one unit. As described herein, although two heat exchangers can be integrated with the edge chassis, in order to increase the cooling capacity of the cooling system, an additional heat exchanger (e.g., 5n) can be coupled to the heat exchanger (e.g., 5b). Heat exchangers 5a-5n are described in more detail herein.

[0038] As described herein, the edge cooling system 1 is configured to dynamically operate (e.g., provide cooling solution) one or more edge devices 10 in various environments and under changing conditions within the environment (e.g., changing temperature, humidity, etc.). To this end, the system is configured to dynamically change the opening degree of one or more valves within the main liquid supply line 11 and / or the main steam return line 12 so as to adjust the flow rate of steam 17 and / or liquid coolant 16 circulating in the first heat exchange loop. For example, the main liquid supply line includes a (first) three-way valve 15a connected between the condenser 6, the accumulator 7 (the input end) and the IT chassis 9, and includes a (first) two-way valve 15b connected between the accumulator (the output end) and the IT chassis. The valve 15a is configured to operate in one of at least four positions: a first open position, in which liquid coolant flows from the condenser into (input into) the accumulator; a second open position, in which liquid coolant flows from the condenser into the IT chassis; a third open position, in which liquid coolant flows from the condenser into the accumulator and the IT chassis; and a closed position, in which liquid coolant is not allowed to flow from the condenser into the accumulator or the IT chassis. The valve 15b is configured to operate in one of at least two positions: an open position, in which liquid coolant flows from the accumulator (the output end of the accumulator) into the IT chassis, and a closed position, in which liquid coolant from the accumulator is not allowed to flow into the IT chassis.

[0039] Similar to the main liquid supply line 11, the main steam return line 12 includes a (second) three-way valve 15c connected between the IT chassis 9, the steam buffer 8 (the input end) and the condenser 6, and includes a (second) two-way valve 15d connected between the steam buffer (the output end) and the condenser. The valve 15c is configured to operate in one of at least four positions: a first open position, in which steam 17 flows from the IT chassis into the condenser; a second open position, in which steam flows from the IT chassis into the steam buffer; a third open position, in which steam flows from the IT chassis into the condenser and the steam buffer; and a closed position, in which steam is not allowed to flow from the IT chassis into the condenser or the steam buffer. The valve 15d is configured to operate in one of at least two positions: an open position and a closed position, in which the steam flows from the steam buffer into the condenser, and in which the steam is not allowed to flow from the steam buffer into the condenser. In one embodiment, the valve in the open position can be a fully open or at least partially open (e.g., with a 50% opening degree) valve. More aspects of the open / close valve are described herein.

[0040] In one embodiment, any valve may be any combination of a two-way valve or a three-way valve. For example, instead of the liquid valve 15a being a three-way valve, the main liquid supply line 11 may include two independently operated two-way valves to allow liquid coolant to flow to the reservoir 7, the IT chassis, or a combination thereof.

[0041] The temperature sensor 4 is configured to sense an ambient temperature (e.g., a temperature relative to the external environment of the edge chassis 2) and generate a signal representative of the ambient temperature. In one embodiment, the temperature sensor can be any type of temperature sensor configured to sense or measure temperature as a signal (e.g., a thermocouple, a resistance temperature detector (RTD), etc.). In one embodiment, the temperature sensor can be part of the edge chassis 2 or at least one of the heat exchangers 5a-5n. In another embodiment, the temperature sensor can be part of a separate electronic device (not shown).

[0042] The controller 3 can be a dedicated processor, such as an application specific integrated circuit (ASIC), a general purpose microprocessor, a field programmable gate array (FPGA), a digital signal controller, or a set of hardware logic structures (e.g., filters, arithmetic logic units, and dedicated state machines). In one embodiment, the controller can be a circuit having a combination of analog elements (e.g., resistors, capacitors, inductors, etc.) and / or digital elements (e.g., logic-based elements, such as transistors, etc.). The control mechanism (and / or controller) may also include a memory. In one embodiment, the controller can be part of (or integrated into) the edge chassis 2. In another embodiment, the controller can be part of (or one of the edge devices 10) the edge device 10 within the IT chassis 9.

[0043] In one embodiment, the controller 3 is communicatively coupled (e.g., wired and / or wirelessly connected) to the valves 15a-15d and / or the temperature sensor 4. Specifically, the controller is configured to receive ambient temperature readings from the sensor 4 (as electrical signals) and control at least one valve (e.g., by sending a control signal to a control circuit (such as an electronic switch) of the valve) to adjust the opening (or position) of the valve (e.g., at least partially open the valve, always open the valve, or close the valve), as described herein. More information on how the controller controls the valve is described herein.

[0044] Figure 2 is a block diagram showing an example of multiple heat exchangers of an edge cooling system according to one embodiment. Specifically, the figure shows two heat exchangers 5a and 5b, which are connected in parallel to each other to increase Figure 1The cooling capacity (e.g., heat transfer cooling surface area) of the second heat exchange circuit of the edge cooling system 1. In one embodiment, the heat exchangers can be connected in parallel and / or in series with each other and / or with the condenser 6. In one embodiment, more or fewer heat exchangers can be connected to each other. Each heat exchanger can include one or more fans 19, which can be part of the heat exchanger (e.g., fan 19a is part of exchanger 5a). As another example, the fan can be part of an air cooling system that is connected to the air inlet of the heat exchanger via an air duct (not shown).

[0045] As shown, both heat exchangers are two-phase air-to-liquid heat exchangers, which include ports connected to condenser 6 (or another heat exchanger) and extension ports that enable the heat exchanger to be added to or removed from a second heat exchange circuit. In one embodiment, the port may include a connector that enables a pipeline to be removably connected to the port. In another embodiment, the connector may be a drip-free blind plug quick disconnect connector (or a drip-free quick disconnect connector). For example, the port may have a male connector (e.g., supply port 21), and the pipeline includes a female connector (e.g., liquid supply line 13) that enables a technician to connect the pipeline to the port. In one embodiment, each heat exchanger also includes a cooling coil 27, which is configured to extract heat from the steam to condense the steam back into a liquid coolant. More information about how the cooling coil condenses is described herein.

[0046] As shown, the heat exchanger 5a includes a supply port 21 and a return port 22, the supply port 21 is configured to be detachably connected to the liquid supply line 13, and the return port 22 is configured to be detachably connected to the steam return line 14. In addition, the heat exchanger includes an extended supply port 23 and an extended return port 24, the extended supply port 23 is configured to be detachably connected to the extended liquid supply line 25, and the extended return port 24 is configured to be detachably connected to the extended steam return line 26. As shown, the extended liquid supply line and the extended steam return line are respectively connected to the supply port and the return port of the heat exchanger 5b. This configuration enables the second heat exchange circuit to be extended to include any number of heat exchangers (e.g., heat exchangers 5a and 5b).

[0047] During operation, the (second) steam 28 produced by the condenser 6 travels from the condenser, through the steam return line 14, and enters the heat exchanger 5a (cooling coil 27a) via the return port 22. The steam travels upward to (and through) the cooling coil, which condenses at least some of the steam back into the (second) liquid coolant 29. At least some of the steam is also distributed to the heat exchanger 5b (cooling coil 27b) via the extended return port 24, the extended steam return line 26, and the return port of the heat exchanger. At least one of the heat exchangers condenses the steam using their respective fans, which are configured to move ambient air into the air inlet of the heat exchanger and over their respective cooling coils. For example, the fan 19a moves (e.g., can push) ambient air into the inlet of the heat exchanger 5a, and the air extracts heat from the steam in the cooling coil 27a, causing the steam to condense back into the second liquid coolant. The heat exchanger 5a discharges hot exhaust air from the air outlet, and the condensed second liquid coolant flows back to the condenser via the liquid supply line 13. Similar operations occur for each heat exchanger coupled to the first heat exchanger 5a. For example, heat exchanger 5b condenses the vapor back into the second liquid coolant, which then flows back to the condenser through the supply port, the extended liquid supply line 25, the extended liquid supply port 23, and the (cooling coil of) heat exchanger 5a.

[0048] In another embodiment, the controller 3 can be communicatively coupled to the fan and can be configured to control the fan speed based on certain criteria. For example, the controller can increase the fan speed based on the ambient temperature (e.g., by sending a control signal to the fan 19a). As another example, the controller can increase or decrease the fan speed based on the time of day. For example, the fan can have a higher fan speed during the day than the fan speed at night.

[0049] In one embodiment, heat exchangers can be added to the second heat exchange circuit based on the environment in which the cooling system 1 is used. For example, the condensation rate of the heat exchangers 5a-5n depends on the ambient air temperature. As a result, when the system is deployed in a hot or warm climate, the cooling surface area (e.g., the area of ​​the cooling coil) must be increased in order to increase the cooling capacity of the system. Therefore, more heat exchangers can be deployed in hotter or warmer climates than in colder climates. In one embodiment, since the heat exchanger can be detachably coupled to the second heat exchange circuit, the heat exchanger can be added / removed throughout the year to accommodate different climates between different seasons.

[0050] Figure 3is a block diagram showing an example of an edge chassis according to one embodiment. As shown, the condenser 6, the accumulator 7, the steam buffer 8, and the IT chassis 9 can each be completely enclosed (sealed) in the edge chassis 2 to protect the components from the surrounding environment (e.g., air pollution, etc.). In one embodiment, the edge chassis may also include a main liquid supply line 11 and a main steam return line 12. In another embodiment, the components may be arranged as shown herein. For example, the condenser 6 is located above the IT chassis, and the accumulator and the steam buffer are located between the condenser and the IT chassis. Because steam rises from the IT chassis into the condenser, the steam buffer, or a combination thereof, these components can be arranged in this manner. Once condensed, gravity helps the liquid coolant flow down from the condenser back to the fluid accumulator, the IT chassis, or a combination thereof. In one embodiment, the accumulator and the steam buffer may be side by side (as shown) or may be stacked on top of each other (e.g., the accumulator is on top of the steam buffer).

[0051] In addition, as shown in the figure, the edge chassis includes a main supply port 40 and a main return port 41, both of which are connected to the condenser 6 and are configured to be detachably connected to the heat exchanger 5a through the liquid supply line 13 and the vapor return line 14, respectively. Figure 2 , ports 40 and 41 may include connectors, such as blind-mate quick disconnect fittings, that enable ports 40 and 41 to be removably coupled to lines 13 and 14, respectively. For example, as described herein, the connectors may be male connectors configured to be removably coupled to female connectors of a liquid supply line and a vapor return line. Thus, in one embodiment, ports 40 and 41 enable the edge chassis to be shipped to a particular location as a single unit and then coupled to one or more heat exchangers.

[0052] Figure 4 is a block diagram showing an example of an edge cabinet 50 according to one embodiment. The edge cabinet 50 is configured to accommodate Figure 1 The structure (or housing) of the edge cooling system 1. Specifically, the edge cabinet includes a bottom 52 configured to accommodate an edge chassis 2 and at least one slot 51 configured to accommodate one or more heat exchangers 5. In particular, the cabinet 50 includes two slots 51a and 51b, each slot accommodating a heat exchanger 51a and 51b, respectively. In addition, each slot includes one or more fans 19a and 19b integrated therein, respectively. In one embodiment, the edge cabinet may include additional components of the edge cooling system, such as the temperature sensor 4 and / or the controller 3 described herein. As another example, the cabinet 50 may include connectors (e.g., supply lines and return lines) for a heat exchanger and / or edge chassis as described herein.

[0053] In one embodiment, each of the components described herein can be assembled within an edge cabinet to enable convenient and efficient transportation and deployment of the edge cooling system. In another embodiment, at least some of the components can be removably housed within the cabinet. For example, a heat exchanger can be added to or removed from a slot. Thus, each component can be transported separately to a specific location and then assembled during deployment. In another embodiment, the cabinet 50 can include additional environmental protection. For example, the edge chassis can be sealed within the bottom to provide double protection for the components contained within the edge chassis 2.

[0054] Figure 5 is a flow chart of a process 60 for determining in which cooling mode an edge cooling system will operate based on ambient temperature according to one embodiment. Figure 11 is described. In particular, at least some operations of process 60 can be performed by a controller 3 of system 1. Process 60 begins with the controller 3 obtaining an ambient temperature reading generated by a temperature sensor 4 (e.g., represented as a generated electrical signal) (at box 61). The controller determines whether the ambient temperature is above a first temperature threshold (at decision box 62). In particular, the controller can compare the ambient temperature with a temperature value that may be based on one of several factors. For example, the temperature value can be based on a component within the edge cooling system and / or an operating temperature requirement (e.g., 10 operating requirements of an edge device). In one embodiment, the temperature valve can be based on the type of liquid coolant used in the first heat exchange circuit and / or the second heat exchange circuit. In one embodiment, the temperature value can be changed dynamically (e.g., based on a component within the system). In another embodiment, the temperature value is a predetermined value (e.g., determined within a controlled setting (such as a laboratory)). If yes, then process 60 operates the edge cooling system in a supplemental cooling and steam buffering mode, in which the controller controls the open positions of valves 15a-15d to allow the system to use the accumulator 7 and the steam buffer 8 for supplemental cooling and steam buffering. In one embodiment, the first temperature threshold may represent a warm or hot ambient temperature (e.g., temperature during the day and / or warmer seasons such as spring or summer). At warm or high ambient temperatures, the condensation rate of the condenser 6 may be lower than the boiling rate of the liquid coolant 16. In other words, the IT chassis may generate more vapor than the condenser can condense back into liquid coolant. As a result, the controller adjusts valves 15c and 15d to allow the steam buffer to store at least some of the vapor generated by the IT chassis to reduce the amount of vapor received by the condenser. Because the condenser has a lower condensation rate, it may not condense a sufficient amount of liquid coolant for the IT chassis. As a result, the controller adjusts the open position of valve 15b to allow the liquid coolant already stored in the accumulator to supplement the reduced and condensed liquid coolant. As a result, the edge cooling system may continue to operate even at high ambient temperatures (eg, during hot summer days) due to the collection of vapor and supplemental liquid coolant.

[0055] However, if the ambient temperature is not above the first threshold temperature, the process 60 determines whether the ambient temperature is below a second temperature threshold that is lower than the first temperature threshold (at decision box 64). In one embodiment, the second temperature threshold may represent a cold ambient temperature (e.g., a temperature at night and / or in a colder season, such as fall or winter). If so, the process 60 causes the edge cooling system to operate in a recharge mode (at box 65). For example, in the previous mode, the system may operate for a considerable period of time (e.g., 10 hours) during which time the reservoir is depleted due to replenishment of liquid coolant condensed by the condenser 6. As a result, when the temperature drops to a colder temperature (e.g., at night), the controller controls the open position of the valve to recharge or replenish the reservoir. For example, during this mode, the controller opens valves 15c and 15d to allow steam generated by the IT chassis and steam buffered in the steam buffer to be condensed by the condenser 6. Due to the low ambient temperature, the condenser is able to handle this additional steam from the buffer. In addition, the controller opens valve 15a and closes valve 15b to allow condensed liquid coolant from the condenser to flow into the IT chassis and the reservoir. As a result, the reservoir can be replenished during times when the ambient temperature is low. In one embodiment, the reservoir can include a level gauge, and when the level gauge reaches a certain threshold, the controller can adjust valve 15a to only allow condensed liquid coolant to flow into the IT chassis so as not to overflow the reservoir.

[0056] However, if the ambient temperature is not below the second temperature threshold, the process 60 determines that the ambient temperature is between the first temperature threshold and the second temperature threshold (at box 66). As a result, the process 60 operates the edge cooling system in a normal mode (at box 67). In this mode, the ambient temperature is neither too high nor too low. As a result, the system does not require a liquid accumulator to replenish the condensed liquid coolant from the condenser 6, nor does it require a steam buffer 8 to store excess steam. Therefore, the controller controls the valve to remove the liquid accumulator and the steam buffer from the first heat exchange circuit (e.g., relative to a state in parallel with their respective pipelines).

[0057] Some embodiments may perform variations on process 60. For example, specific operations of the process may not be performed in the exact order shown and described. Specific operations may not be performed in a series of continuous operations, and different specific operations may be performed in different embodiments. For example, the process may switch between modes based on the operating conditions of the system 1. In particular, if the edge device 10 generates excess heat (e.g., during a period when the device is performing a higher workload), the liquid coolant 16 stored within the IT chassis may evaporate at a faster rate. As a result, during periods of overloaded operation of the edge device 10 (or during times when the temperature of the IT chassis or liquid coolant 16 is above a threshold), the controller 3 may switch to a supplemental mode, causing the reservoir 7 to supplement the condenser 6. In one embodiment, if one or more fans (e.g., 19a) fail, the supplemental cooling mode may be used for a short period of time to allow the system to operate.

[0058] In one embodiment, the controller 3 may operate in a given mode for a predetermined amount of time and based on the operational needs of the edge cooling system 1. For example, the size (or capacity) of the accumulator 7 and the steam buffer 8 may be designed to operate the system in the replenishment mode for a given amount of time (e.g., 10 hours). Thus, the system may be modified to accommodate the predetermined amount of time.

[0059] FIG. 6A to FIG. 6C is an example of an operating mode of an edge cooling system based on ambient temperature according to one embodiment. Specifically, Fig. 6A The edge cooling system 1 is shown operating in supplemental cooling and steam buffering mode. For example, when the ambient temperature is above a first temperature threshold, the controller 3 is configured to 1) (partially) open valve 15a to allow only liquid coolant to flow from "a" to "b"; 2) open valve 15b; 3) (fully) open valve 15c to allow steam to flow from "d" to "f" and from "d" to "e"; and 4) close valve 15d.

[0060] Figure 6B The edge cooling system 1 is shown operating in the recharge mode. For example, when the ambient temperature is below the second temperature threshold, the controller is configured to 1) (fully) open valve 15a to allow liquid coolant to flow from "a" to "b" and from "a" to "c"; 2) close valve 15b; 3) (partially) open valve 15c to only allow steam to flow from "d" to "f"; and 4) open valve 15d.

[0061] Figure 6CThe edge cooling system operating in the normal mode is shown. For example, when the ambient temperature is within the range of the first temperature threshold to the second temperature threshold, the controller is configured to 1) (partially) open valve 15a to allow only liquid coolant to flow from "a" to "c"; 2) close valve 15b; 3) (partially) open valve 15c to allow only steam to flow from "d" to "f"; and 4) close valve 15d.

[0062] In one embodiment, the controller 3 can adjust the opening of one or more valves as described herein. For example, during the recharge mode, the controller can control the valve 15a to have two different openings. For example, the valve can have a low opening (e.g., 30%) between "a" and "c", while the valve can have a high opening (e.g., 100%) between "a" and "b". The opening can be adjusted to allow the controller to fill the reservoir at a fast rate. In another embodiment, when setting the valve to open, the controller can always apply a valve with a 100% opening (or fully open).

[0063] As previously described, embodiments of the present disclosure may be (or include) a non-transitory machine-readable medium (such as a microelectronic memory) having stored thereon instructions that program one or more data processing components (collectively referred to herein as "processes") to perform blind control operations, such as determining whether certain characteristics or criteria exist (e.g., whether the internal temperature is above a threshold), and in response controlling one or more blinds. As described herein. In other embodiments, some of these operations may be performed by specific hardware components that include hard-wired logic. Alternatively, these operations may be performed by any combination of programmed data processing components and fixed hard-wired circuit components.

[0064] In the foregoing description, embodiments of the present disclosure have been described with reference to specific exemplary embodiments of the present disclosure. Obviously, various modifications may be made thereto without departing from the broader spirit and scope of the present disclosure as set forth in the appended claims. Therefore, the description and the drawings are to be considered illustrative rather than restrictive.

[0065] Although certain aspects have been described and shown in the drawings, it should be understood that these aspects are merely illustrative and not limiting of the broad disclosure, and the disclosure is not limited to the specific constructions and arrangements shown and described, since various other modifications may occur to one of ordinary skill in the art. Therefore, this description is to be regarded as illustrative rather than restrictive.

[0066] In some aspects, the present disclosure may include statements such as, for example, “at least one of [element A] and [element B]”. This statement may refer to one or more elements. For example, “at least one of A and B” may refer to “A”, “B”, or “A and B”. Specifically, “at least one of A and B” may refer to “at least one of A and at least one of B” or “at least one of A or B”. In some aspects, the present disclosure may include statements such as, for example, “[element A], [element B] and / or [element C]”. This statement may refer to these elements or any combination thereof. For example, “A, B and / or C” may refer to “A”, “B”, “C”, “A and B”, “A and C”, “B and C”, or “A, B and C”.

Claims

1. Edge cooling system, including: An information technology IT chassis having an edge device configured to provide IT services and at least partially immersed in a liquid coolant, wherein when the edge device provides the IT services, the edge device generates heat that is transferred into the liquid coolant, thereby causing at least some of the liquid coolant to become vapor; a condenser configured to condense the vapor back into a liquid coolant; a steam buffer configured to at least one of: buffer the steam and provide the buffered steam to the condenser; an accumulator configured to at least one of: accumulate the liquid coolant condensed by the condenser and provide the accumulated liquid coolant to the IT chassis; a main liquid supply line coupling the condenser and the IT cabinet to the liquid accumulator and a main steam return line coupling the condenser and the IT cabinet to the steam buffer to form a heat exchange loop; and An edge chassis, wherein the IT chassis, the steam buffer, the condenser, the liquid accumulator, the main liquid supply line and the main steam return line are completely enclosed in the edge chassis.

2. The edge cooling system of claim 1, wherein: the heat exchange circuit is a first heat exchange circuit, the liquid coolant is a first liquid coolant, and the steam is a first steam, wherein the edge cooling system further comprises a heat exchanger, the heat exchanger being coupled to the condenser via a liquid supply line and a vapor return line to form a second heat exchange loop, wherein 1) the liquid supply line is configured to provide a second liquid coolant from the heat exchanger to the condenser, and 2) the vapor return line is configured to provide a second vapor from the condenser to the heat exchanger, the second vapor being generated when the condenser transfers heat contained in the vapor in the first heat exchange loop to the second liquid coolant, Wherein, the heat exchanger comprises: a cooling coil configured to condense the second vapor into the second liquid coolant, and At least one fan is configured to move ambient air over the cooling coil.

3. The edge cooling system of claim 2, wherein: The edge chassis includes a main supply port and a main return port, each of which is connected to the condenser, wherein each of the main supply port and the main return port has a drip-free quick disconnect connector, and the drip-free quick disconnect connector is configured to be removably connected to the liquid supply pipeline and the vapor return pipeline, respectively.

4. The edge cooling system of claim 2, wherein: The heat exchanger is a first heat exchanger, and the first heat exchanger comprises: 1) a supply port and a return port, each of the supply port and the return port being configured to be removably coupled to the liquid supply line and the vapor return line, respectively; and 2) an extended supply port and an extended return port, each of which is configured to be removably coupled to a second heat exchanger via an extended liquid supply line and an extended vapor return line, respectively, so that the second heat exchange circuit is extended to include both the first heat exchanger and the second heat exchanger.

5. The edge cooling system of claim 2, wherein: The heat exchanger and the edge chassis are an integral unit.

6. The edge cooling system of claim 1, wherein: The main liquid supply line includes a first three-way valve connected between the condenser, the liquid reservoir and the IT chassis, and a first two-way valve connected between the liquid reservoir and the IT chassis. Wherein, the main steam return pipeline includes a second three-way valve connected between the IT cabinet, the steam buffer and the condenser, and a second two-way valve connected between the steam buffer and the condenser.

7. The edge cooling system of claim 6, further comprising: a temperature sensor configured to sense an ambient temperature and generate a signal representative of the ambient temperature; as well as A controller is communicatively coupled to the temperature sensor and configured to control the opening degrees of the first three-way valve, the first two-way valve, the second three-way valve, and the second two-way valve based on the ambient temperature.

8. The edge cooling system of claim 7, wherein: When the ambient temperature is higher than a temperature threshold, the controller is configured to: 1) opening the first three-way valve to allow only liquid coolant to flow from the condenser into the accumulator; 2) opening the first two-way valve to allow liquid coolant to flow from the reservoir into the IT chassis; 3) opening the second three-way valve to allow steam to flow from the IT chassis into the steam buffer and the condenser; and 4) Close the second two-way valve.

9. The edge cooling system of claim 8, wherein: The temperature threshold is a first temperature threshold, wherein when the ambient temperature is lower than a second temperature threshold lower than the first temperature threshold, the controller is configured to: 1) opening the first three-way valve to allow liquid coolant to flow from the condenser into the accumulator and the IT chassis; 2) closing the first two-way valve; 3) opening the second three-way valve to only allow steam to flow from the IT chassis into the condenser; and 4) Opening the second two-way valve to allow steam to flow from the steam buffer into the condenser.

10. The edge cooling system of claim 9, wherein: When the ambient temperature is within the range from the first temperature threshold to the second temperature threshold, the controller is configured as follows: 1) Opening the first three-way valve to allow only liquid coolant to flow from the condenser into the IT chassis; 2) closing the first two-way valve; 3) opening the second three-way valve to only allow steam to flow from the IT chassis into the condenser; and 4) Close the second two-way valve.

11. Edge cabinet, including: An edge chassis having the following components enclosed therein: An information technology IT chassis having an edge device configured to provide IT services and at least partially immersed in a liquid coolant, wherein when the edge device provides the IT services, the edge device generates heat that is transferred into the liquid coolant, thereby causing at least some of the liquid coolant to become vapor; a condenser configured to condense the vapor back into a liquid coolant; a steam buffer configured to at least one of: buffer the steam and provide the buffered steam to the condenser; an accumulator configured to at least one of: accumulate the liquid coolant condensed by the condenser and provide the accumulated liquid coolant to the IT chassis; and A main liquid supply line couples the condenser and the IT cabinet to the liquid accumulator, and a main steam return line couples the condenser and the IT cabinet to the steam buffer to form a heat exchange loop.

12. The edge cabinet of claim 11, wherein: The heat exchange circuit is a first heat exchange circuit, wherein the edge cabinet further includes one or more slots, each of the slots being configured to accommodate at least one heat exchanger configured to be coupled to the condenser via a liquid supply line and a vapor return line to form a second heat exchange circuit.

13. The edge cabinet of claim 12, wherein: The edge chassis includes a main supply port and a main return port, each of which is connected to the condenser, wherein each of the main supply port and the main return port has a drip-free quick disconnect connector, and the drip-free quick disconnect connector is configured to be removably connected to the liquid supply pipeline and the vapor return pipeline, respectively.

14. The edge cabinet of claim 12, wherein: the liquid coolant is a first liquid coolant, and the vapor is a first vapor, wherein the liquid supply line is configured to provide a second liquid coolant from the heat exchanger to the condenser, and the vapor return line is configured to provide a second vapor from the condenser to the heat exchanger, the second vapor being generated when the condenser transfers heat contained in the vapor in the first heat exchange circuit to the second liquid coolant, Wherein, the at least one heat exchanger comprises: a cooling coil configured to condense the second vapor into the second liquid coolant; and One or more fans are configured to move ambient air over the cooling coil.

15. The edge cabinet of claim 12, wherein: The at least one heat exchanger is a first heat exchanger, the first heat exchanger comprising: 1) a supply port and a return port, each of the supply port and the return port being configured to be removably coupled to the liquid supply line and the vapor return line, respectively; and 2) an extended supply port and an extended return port, each of which is configured to be removably coupled to a second heat exchanger via an extended liquid supply line and an extended vapor return line, respectively, so that the second heat exchange circuit is extended to include both the first heat exchanger and the second heat exchanger.

16. The edge cabinet of claim 11, wherein: The main liquid supply line includes a first three-way valve connected between the condenser, the liquid reservoir and the IT chassis, and a first two-way valve connected between the liquid reservoir and the IT chassis. Wherein, the main steam return pipeline includes a second three-way valve connected between the IT cabinet, the steam buffer and the condenser, and a second two-way valve connected between the steam buffer and the condenser.

17. The edge cabinet of claim 16, further comprising: a temperature sensor configured to sense an ambient temperature and generate a signal representative of the ambient temperature; as well as A controller is communicatively coupled to the temperature sensor and configured to control the opening degrees of the first three-way valve, the first two-way valve, the second three-way valve, and the second two-way valve based on the ambient temperature.

18. The edge cabinet of claim 17, wherein: When the ambient temperature is higher than a temperature threshold, the controller is configured to: 1) opening the first three-way valve to allow only liquid coolant to flow from the condenser into the accumulator; 2) opening the first two-way valve to allow liquid coolant to flow from the reservoir into the IT chassis; 3) opening the second three-way valve to allow steam to flow from the IT chassis into the steam buffer and the condenser; and 4) Close the second two-way valve.

19. The edge cabinet of claim 18, wherein: The temperature threshold is a first temperature threshold, wherein when the ambient temperature is lower than a second temperature threshold lower than the first temperature threshold, the controller is configured to: 1) opening the first three-way valve to allow liquid coolant to flow from the condenser into the accumulator and the IT chassis; 2) closing the first two-way valve; 3) opening the second three-way valve to only allow steam to flow from the IT chassis into the condenser; and 4) Opening the second two-way valve to allow steam to flow from the steam buffer into the condenser.

20. The edge cabinet of claim 19, wherein: When the ambient temperature is within the range from the first temperature threshold to the second temperature threshold, the controller is configured as follows: 1) Opening the first three-way valve to allow only liquid coolant to flow from the condenser into the IT chassis; 2) closing the first two-way valve; 3) opening the second three-way valve to only allow steam to flow from the IT chassis into the condenser; and 4) Close the second two-way valve.

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