Self-Supporting Heat Piping Systems for Electronic Assemblies

Abstract

Various embodiments described herein include systems, methods, and / or apparatus for dissipating heat generated by electronic components of an electronic system (e.g., a memory system including densely packed memory modules). In one aspect, an electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connection module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connection module so that the first circuit board and the second circuit board are substantially parallel and separated by a space, wherein the space forms at least a portion of a channel configured to direct airflow through the space between the first circuit board, the second circuit board, and the connection module.

Description

[0001] This application is a divisional application of the Chinese national phase application No. 201580003541.2 entitled “SELF-SUPPORTING HEAT CONDUIT SYSTEM FOR ELECTRONIC ASSEMBLY” of PCT international patent application PCT / US2015 / 017722 filed on February 26, 2015. Technical Field

[0002] The disclosed embodiments relate generally to heat dissipation and, more particularly, to dissipating heat generated by electronic components in electronic systems. Background Art

[0003] Many electronic systems include semiconductor memory modules, such as solid-state drives (SSDs), dual in-line memory modules (DIMMs), and small form factor DIMMs, all of which utilize memory cells to store data as charge or voltage. Improvements in the storage density of these modules have been achieved by using enhanced manufacturing techniques to increase the density of the memory cells on each individual memory component. In addition, the storage density of these modules has also been increased by using advanced board-level packaging techniques to include more memory elements for each memory device or module. However, as the storage density increases, the total heat generated by the module also increases. These heatings are particularly problematic in blade server systems, where high-density SSDs and DIMMs are frequently accessed for memory read and write operations. In the absence of an effective heat dissipation mechanism, the increased heat may ultimately result in a reduction in performance or failure of a separate storage cell or entire module.

[0004] In order to dissipate the heat generated by the tightly packed memory components, the memory module can use a heat sink coupled to the semiconductor memory device or module. The heat sink is usually mounted on the top of the memory device or memory module. The airflow from the fan can be routed or passed through the heat sink to help dissipate the heat. However, in view of the increasingly compact form factor of the memory module, the heat dissipation effect of the combination of the heat sink and the airflow is usually insufficient. Therefore, a larger cooling system and / or running its fan at a higher speed is generally required, which results in a noisy, inefficient, and high-cost system that cannot fully solve the problem of uneven heat dissipation throughout each memory module. Therefore, it is desirable to provide a cooling system that can solve the above problems. Summary of the invention

[0005] Heat generating electronic devices, such as memory modules, processors, etc., are typically mounted to circuit boards. As described above, a variety of different techniques have been used to dissipate heat from these electronic devices. For example, fans are used to blow or draw air over heat generating components to keep the components cool. Managing the airflow over these components (including managing the speed and direction of the airflow) can be critical to ensure that the airflow can remove enough waste heat to keep the electronic components at the appropriate temperature. One way to carefully control the airflow (and ensure that the airflow is delivered to the correct components) is to use ducts to direct the air. For example, ducts can direct forced air over the heat sink of the memory module.

[0006] The systems and methods described herein use circuit boards on which heat generating components are mounted as one or more walls of an airflow channel. For example, instead of providing a conduit to direct airflow to components on a circuit board, the present application describes that one or more circuit boards can be assembled to form a channel through which air is forced to cool components mounted on the one or more circuit boards. In addition, the assemblies described herein are self-supporting, avoiding the need for additional mounting rails and brackets to form the channel.

[0007] In one aspect, an electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connection module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connection module so that the first circuit board and the second circuit board are substantially parallel and separated by a space, wherein the space forms at least a portion of a channel configured to direct airflow through the space between the first circuit board, the second circuit board, and the connection module.

[0008] Other embodiments and advantages will be apparent to those skilled in the art from the description in this specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order that the present disclosure may be understood in more detail, a more particular description may be made with reference to the features of various embodiments, some of which are illustrated in the accompanying drawings. However, the accompanying drawings only illustrate the more relevant features of the present disclosure and are therefore not to be considered limiting, as the description may allow for other effective features.

[0010] Figure 1 is a block diagram of exemplary system modules in a typical computing device in accordance with some embodiments.

[0011] Figure 2A is an oblique view of an exemplary electronic assembly forming a self-supporting channel according to some embodiments.

[0012] Figure 2B-2D is a side view of an exemplary electronic assembly forming a self-supporting channel according to some embodiments.

[0013] Figure 3A is an oblique view of another exemplary electronic assembly forming a self-supporting channel according to some embodiments.

[0014] Figure 3B-3D is a side view of another exemplary electronic assembly forming a self-supporting channel in accordance with some embodiments.

[0015] Figures 4A-4C are oblique views of illustrative electronic assemblies having various fastener configurations according to some embodiments.

[0016] Figure 5 An exemplary flow chart of a method for assembling an electronic assembly according to some embodiments is shown.

[0017] Figure 6 An exemplary flow chart of a method for dissipating heat in an electronic assembly according to some embodiments is shown.

[0018] Figure 7 is a block diagram of an energy holding capacitor circuit according to some embodiments.

[0019] As is common practice, the various features shown in the drawings may not be drawn to scale. Accordingly, the dimensions of the various features may be intentionally enlarged or reduced for clarity. In addition, some of the drawings may not depict all of the components of a given system, method, or device. Finally, throughout the specification and drawings, similar reference numerals may be used to refer to similar features. DETAILED DESCRIPTION

[0020] Various embodiments described herein include systems, methods, and / or devices that can be used or integrated in electronic assemblies. In particular, the electronic assemblies and channels formed by the electronic assemblies described herein facilitate dissipating heat generated by electronic components in electronic systems.

[0021] Although the embodiments described below mainly describe memory systems, the present invention is not limited thereto. In fact, the present invention is equally applicable to electronic systems that require heat dissipation, especially those electronic systems that include multiple heat-generating components mounted on one or more circuit boards.

[0022] According to some embodiments, an electronic assembly for heat dissipation includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connection module coupled to the second circuit board, and a fastener. The fastener is configured to couple the first circuit board to the connection module so that the first circuit board and the second circuit board are substantially parallel and separated by a space, wherein the space forms at least a portion of a channel configured to guide airflow through the space between the first circuit board, the second circuit board, and the connection module.

[0023] In some embodiments, a flexible interconnect is used to flexibly couple the first circuit board to the second circuit board. In some embodiments, the flexible interconnect electrically couples the first circuit board to the second circuit board. In some embodiments, the first side of the channel includes a connection module and the second side of the channel includes a flexible interconnect.

[0024] In some embodiments, the first circuit board is flexibly coupled to the second circuit board using one or more flexible interconnects and one or more additional circuit boards. In some embodiments, the second circuit board is flexibly coupled to the connection module. In some embodiments, the second circuit board is flexibly coupled to the connection module using a flexible interconnect. In some embodiments, the flexible interconnect electrically couples the second circuit board to the connection module.

[0025] In some embodiments, the fastener is attached to the first circuit board. In some embodiments, the fastener is attached to the connection module. In some embodiments, the fastener includes a first sub-fastener attached to the first circuit board and a second sub-fastener attached to the connection module. In some embodiments, each of the first sub-fastener and the second sub-fastener includes one or more solder pads.

[0026] In some embodiments, the first circuit board includes a hole in a substrate of the first circuit board, and the connection module includes a protrusion configured to cooperate with the hole in the first circuit board. In some embodiments, the connection module includes a hole in a substrate of the connection module, and the first circuit board includes a protrusion configured to cooperate with the hole in the connection module. In some embodiments, the first circuit board includes a recess in the substrate of the first circuit board, and the connection module includes a protrusion configured to cooperate with the recess in the first circuit board. In some embodiments, the connection module includes a recess in the substrate of the connection module, and the first circuit board includes a protrusion configured to cooperate with the recess in the connection module.

[0027] In some embodiments, the fastener is configured to mechanically and electrically couple the first circuit board to the second circuit board. In some embodiments, the second circuit board includes one or more second fasteners configured to couple the second circuit board to the base plate.

[0028] According to some embodiments, a method of manufacturing an electronic assembly for heat dissipation includes providing an electronic assembly. The electronic assembly includes a first circuit board, a second circuit board flexibly coupled to the first circuit board, a connection module coupled to the second circuit board, and a fastener. The first circuit board is coupled to the connection module using the fastener so that the first circuit board and the second circuit board are substantially parallel and separated by a space, wherein the space forms at least a portion of a channel configured to direct airflow through the space between the first circuit board, the second circuit board, and the connection module.

[0029] In some embodiments, the method further includes: before connecting the first circuit board to the connection module, when the first circuit board and the second circuit board are not substantially parallel, connecting the second circuit board to the base circuit board, and adjusting the electronic assembly so that the first circuit board is set substantially parallel to the second circuit board, wherein adjusting the electronic assembly so that the first circuit board is set substantially parallel to the second circuit board causes at least a portion of the first flexible interconnect connecting the first circuit board and the second circuit board to deform.

[0030] In some embodiments, the connection module is flexibly connected to the second circuit board, and the method further includes: before adjusting the first circuit board, adjusting the electronic assembly so that the connection module is set substantially perpendicular to the second circuit board, wherein adjusting the electronic assembly causes at least a portion of a second flexible interconnect connecting the connection module to the second circuit board to deform.

[0031] Some embodiments provide an electronic assembly for heat dissipation. The electronic assembly includes a first circuit board, a second circuit board flexibly connected to the first circuit board, a connection module connected to the second circuit board, and a fastener. At least one of the first circuit board, the second circuit board, and the connection module includes one or more of the following: (i) a solid-state drive (SSD), (ii) an energy retention capacitor circuit, and (iii) one or more three-dimensional (3D) memory devices. The fastener is configured to connect the first circuit board to the connection module so that the first circuit board and the second circuit board are substantially parallel and separated by a space. The space is configured to guide airflow between the first circuit board, the second circuit board, and the connection module.

[0032] Numerous details are described herein to provide a thorough understanding of the example embodiments shown in the accompanying drawings. However, some embodiments may be practiced without these numerous specific details, and the scope of the claims is limited only by those features and aspects specifically recited in the claims. In addition, well-known methods, components, and circuits are not described in detail in order to avoid unnecessarily obscuring the more relevant aspects of the embodiments described herein.

[0033] Figure 11 is a block diagram of an exemplary system module 100 in a typical computing device according to some embodiments. The system module 100 in the computing device includes at least a central processing unit (CPU) 102, a memory module 104 for storing programs, instructions and data, an input / output (I / O) controller 106, one or more communication interfaces such as a network interface 108, and one or more communication buses 150 for interconnecting these components. In some embodiments, the I / O controller 106 allows the CPU 102 to communicate with I / O devices (such as keyboards, mice, trackpads, etc.) via a universal serial bus interface (or any other suitable wired or wireless interface). In some embodiments, the network interface 108 includes one or more interfaces for Wi-Fi, Ethernet, and / or Bluetooth networks, each of which allows the computing device 100 to exchange data with an external source (such as a server or another computing device). In some embodiments, the communication bus 150 includes circuits (sometimes referred to as a chipset) to interconnect and control the communication between the various system components included in the system module.

[0034] In some embodiments, the memory module 104 includes a high-speed random access memory, such as DRAM, SRAM, DDRRAM or other random access solid-state memory devices, a volatile memory device, such as a dynamic random access memory ("DRAM") or a static random access memory ("SRAM") device, a non-volatile memory device, such as a resistive random access memory ("ReRAM"), an electrically erasable programmable read-only memory ("EEPROM"), a flash memory (which can also be considered a subset of EEPROM), a ferroelectric random access memory ("FRAM"), a magnetoresistive random access memory ("MRAM"), and other semiconductor elements capable of storing information. In addition, each type of memory device can have a different configuration. For example, a flash memory device can be configured as a NAND or NOR configuration.

[0035] Memory devices may be formed from passive components, active components, or both. As non-limiting examples, passive semiconductor memory components include ReRAM device components, which in some embodiments include a resistive switch storage element (e.g., an anti-fuse, a phase change material, etc.), and an optional steering element (e.g., a diode, etc.). As further non-limiting examples, active semiconductor memory components include EEPROM and flash memory device components, which in some embodiments include components that include a charge storage region, such as a floating gate, conductive nanoparticles, or a charge storage dielectric material.

[0036] A variety of storage elements may be configured so that they are connected in series, or so that each element is independently accessible. As a non-limiting example, a NAND device includes storage elements (e.g., a device including a charge storage region) connected in series. For example, a NAND memory array may be configured so that the array consists of multiple strings of memory, where each string consists of multiple memory elements that share a single bit line and are accessed as a group. In contrast, memory elements may be configured so that each element is independently accessible, such as a NOR memory array. Those skilled in the art will recognize that NAND and NOR memory configurations are exemplary, and that memory elements may be configured in other ways.

[0037] Semiconductor memory elements contained in a single device (e.g., memory elements positioned within and / or on the same substrate, or memory elements in a single bare die) can be distributed in a two-dimensional or three-dimensional manner (e.g., a two-dimensional (2D) memory array structure or a three-dimensional (3D) memory array structure).

[0038] In a two-dimensional memory structure, semiconductor memory elements may be arranged as a single plane or a single memory device level. Typically, in a two-dimensional memory structure, the memory elements are positioned in a plane (e.g., in an xz-direction plane) that extends substantially parallel to a major surface of a substrate supporting the memory elements. The substrate may be a wafer on which material layers of the memory elements are deposited and / or in which the memory elements are formed, or the substrate may be a carrier substrate that is attached to the memory elements after the memory elements are formed.

[0039] The memory elements may be arranged in an ordered array, such as a single memory device level of multiple rows and / or columns. However, the memory elements may be arranged in an irregular or non-orthogonal configuration, as will be appreciated by those skilled in the art. Each memory element may have two or more electrodes or contact lines, including bit lines and word lines.

[0040] A three-dimensional memory array is organized such that the memory elements occupy multiple planes or multiple device levels, forming a three-dimensional structure (i.e., in the x, y and z directions, where the y direction is substantially perpendicular to the major surface of the substrate and the x and z directions are substantially parallel to the major surface of the substrate).

[0041] As a non-limiting example, each plane in a three-dimensional memory array structure can be physically positioned in two dimensions (one memory level) with multiple two-dimensional memory levels to form a three-dimensional memory array structure. As another non-limiting example, a three-dimensional memory array can be physically constructed as a plurality of vertical columns (e.g., columns extending substantially perpendicular to the main surface of the substrate in the y direction), each column having a plurality of elements, and thus having elements across several vertically stacked planes of the memory device. The columns can be arranged in a two-dimensional configuration, such as in the xz plane, thereby producing a three-dimensional arrangement of memory elements. It will be appreciated by those skilled in the art that other configurations of memory elements in three dimensions will also constitute a three-dimensional memory array.

[0042] As a non-limiting example, in a three-dimensional NAND memory array, memory elements can be connected together to form NAND strings in a single plane, which is sometimes referred to as a horizontal (e.g., xz) plane for ease of discussion. Alternatively, the memory elements can be connected together to extend through multiple parallel planes. Other three-dimensional configurations can be envisioned, in which some NAND strings contain memory elements in a single plane of memory elements (sometimes referred to as a memory level), while other strings contain memory elements extending through multiple parallel planes (sometimes referred to as parallel memory levels). The three-dimensional memory array can also be designed as a NOR configuration and a ReRAM configuration.

[0043] In a monolithic three-dimensional memory array, multiple planes of memory cells (also referred to as multiple memory levels) are formed on or within a single substrate (e.g., a semiconductor wafer) according to a sequence of manufacturing processes. In a monolithic 3D memory array, the material layers forming the respective memory levels (e.g., the topmost memory level) are positioned on top of the material layers forming the memory levels below, but on the same single substrate. In some embodiments, adjacent memory levels of a monolithic 3D memory array optionally share at least one material layer, while in other embodiments, adjacent memory levels have intermediate material layers separating them.

[0044] In contrast, two-dimensional memory arrays can be formed separately and subsequently integrated together to form a non-monolithic 3D memory device in a hybrid manner. For example, stacked memories have been constructed by forming 2D memory levels on separate substrates and integrating the formed 2D memory levels on top of each other. The substrate of each 2D memory level can be thinned or removed before integration into a 3D memory device. When the individual memory levels are formed on separate substrates, the resulting 3D memory array is a non-monolithic three-dimensional memory array.

[0045] Furthermore, more than one memory array selected from 2D memory arrays and 3D memory arrays (monolithic or hybrid) can be formed separately and subsequently packaged together to form a stacked chip memory device. A stacked chip memory device includes multiple planes or layers of memory devices, sometimes referred to as memory levels.

[0046] The term "three-dimensional memory device" (or 3D memory device) is defined herein to mean a memory device having multiple layers or multiple levels (e.g., sometimes referred to as multiple memory levels) of memory elements, including any of the following: a memory device having a monolithic or non-monolithic 3D memory array, some non-limiting examples of which have been described above; or two or more 2D and / or 3D memory devices packaged together to form a stacked chip memory device, some non-limiting examples of which have been described above.

[0047] Those skilled in the art will recognize that the invention described and claimed herein is not limited to the two-dimensional and three-dimensional exemplary structures described herein, but covers all related memory structures suitable for implementing the invention described herein and as understood by those skilled in the art.

[0048] In some embodiments, the memory module 104 includes non-volatile memory, such as one or more magnetic disk storage devices, optical disk storage devices, flash memory storage devices, or other non-volatile solid-state storage devices. In some embodiments, the memory module 104, or alternatively, the (multiple) non-volatile memory devices within the memory module 104, include a non-transitory computer-readable storage medium. In some embodiments, a memory slot is reserved on the system module 100 to receive the memory module 104. Once inserted into the memory slot, the memory module 104 is integrated into the system module 100.

[0049] In many embodiments, the system module 100 further includes one or more components selected from the following:

[0050] A memory controller 110 in a computing device controls communications between the CPU 102 and memory components including the memory module 104;

[0051] Solid-state drive (SSD) 112, which employs an integrated circuit assembly to store data in a computing device, and in some embodiments, solid-state drive 112 is based on a NAND or NOR memory configuration;

[0052] Hard disk drive 114, which is a conventional data storage device for storing and retrieving digital information based on an electromechanical disk;

[0053] a power supply connector 116 electrically coupled to receive an external power supply;

[0054] a power management integrated circuit (PMIS) 118 that modulates the received external power supply to other desired DC voltage levels, such as 5V, 3.3V, or 1.8V, as required by various components and circuits within the computing device;

[0055] Graphics card 120 that generates a feed of output images to the one or more display devices according to their desired image / video format; and

[0056] Sound card 122, which facilitates the input and output of audio signals to and from the computing device under the control of a computer program.

[0057] It should be noted that communication buses 150 also interconnect and control communications between various system components, including components 110 - 122 (as well as other components not listed).

[0058] In addition, those skilled in the art will appreciate that other non-temporary computer-readable storage media may be used. In particular, as new data storage technologies are developed, these new data storage technologies may be used in the memory modules described herein. These new non-temporary computer-readable storage media include, but are not limited to, those storage media made from biomaterials, nanowires, carbon nanotubes, and single molecules, even if the corresponding data storage technologies are currently under development and have not yet been commercialized.

[0059] Some of the aforementioned components (or other components not mentioned) generate heat during normal operation, and therefore heat sinks are integrated to reduce the temperature of the corresponding components. For example, a solid-state drive 112 used in a blade server can have a heat sink mounted on top of each individual dual in-line memory module (DIMM) or mounted on an electronic assembly containing the DIMM. The heat generated by the electronic components in the DIMM is directed to the heat sink and dissipated by the airflow generated by the fan. However, as the data workload in these blade servers increases and the form factor of the DIMM decreases (e.g., the memory slots are closely arranged in the memory module 104), it is more difficult for conventional heat sinks and high-speed fans to effectively guide and dissipate heat. More generally, as the size of electronic components decreases, and more and more electronic components are arranged adjacent to each other on the circuit board, it is more difficult to keep the electronic components adequately cooled.

[0060] To address this problem, various embodiments described herein describe an electronic assembly that forms a self-supporting tube or channel to direct airflow over the electronic components of the assembly. In particular, the channel structure helps to confine the air flow to the space within the channel. Therefore, by passing air through the channel (e.g., by convection, a fan, or any other technique), heat can be effectively removed from components within the channel or components that are otherwise thermally coupled to the channel (e.g., components mounted outside the channel but thermally coupled to a heat sink within the channel). Because the channel structure confines the airflow to the space within the channel, for a given amount of airflow, better cooling performance can be achieved than would otherwise be possible.

[0061] Figure 2A An embodiment of an electronic assembly 200 ("assembly 200") is shown, wherein assembly 200 forms a self-supporting channel. In particular, assembly 200 includes a first circuit board 202, a second circuit board 204, and a connection module 206. The first circuit board and the second circuit board are sometimes referred to herein simply as "boards."

[0062] In some embodiments, the connection module 206 is a third circuit board. In other embodiments, the connection module 206 is a mechanical structure for connecting the first circuit board and the second circuit board to each other in the manner described herein. In embodiments where the connection module 206 is a third circuit board, the third circuit board can perform any of a variety of functions that are the same or different from the first circuit board and the second circuit board. For example, any one or more of the first, second, and third circuit boards can include one or more SSDs.

[0063] In some embodiments, the third circuit board includes components that generate a large amount of heat, such as energy retention capacitor circuits, e.g. Figure 7 The power storage and distribution module 704 shown. In some embodiments, the power storage and distribution module 704 includes circuits for monitoring, storing, and distributing power for storage devices, including monitoring, controlling, charging, and / or testing energy storage device 705. In some embodiments, energy storage device 705 includes one or more capacitors. In other embodiments, energy storage device 705 includes one or more inductors, or any other passive element that stores energy. In some embodiments, the power storage and distribution module 704 includes a boost circuit 720, energy storage device 705, transistors 710 and 712, and a voltage V dd 702, V holdup 706 and V switched 708. In some embodiments, V dd 702 is the voltage supplied by the main system and has a target value of 1.5 volts or less. In some embodiments, V holdup 706 is from Vdd 702, and has a target value of 5.7 volts. In some embodiments, V holdup 706 is used to charge the energy storage device 705. In some embodiments, V SPD 704 is the voltage supplied for the serial presence detection (SPD) function and has a target value of 3.3 volts. In addition, in some embodiments, at any time, only one of the transistors 710 and 712 is enabled. For example, whenever the transistor 712 is enabled, the transistor 710 is disabled (off state), thereby ensuring that the power from the energy storage device 705 does not drain into the main system. In some embodiments, both transistors 710 and 712 can be disabled at the same time. In some embodiments, the energy storage device 705 includes a power retention circuit implemented using one or more capacitors. Further details of a suitable power storage and distribution module 704 can be found in U.S. Application No. 14 / 135,386, entitled "Power Failure Architecture and Verification", filed on December 19, 2013, the entire contents of which are incorporated herein by reference.

[0064] Placing components that generate a lot of heat on a third circuit board within the thermal channel allows for more robust heat dissipation and / or cooling of these components. In addition, arranging the heat generating components on a board separate from other components (e.g., more heat sensitive components) allows for better thermal separation between different types of components.

[0065] The assembly 200 includes one or more electronic components 210 coupled to the board. In some embodiments, the assembly 200 is configured to be mechanically and / or electrically coupled to a base board (eg, Figure 2B In some embodiments, the base board is a motherboard of a computer. In some embodiments, the base board is any circuit board to which the assembly 200 is configured to couple. In some embodiments, the assembly 200 is a daughterboard assembly.

[0066] In some embodiments, at least one of the first circuit board 202 and the second circuit board 204 includes one or more solid state drives (SSDs). In some embodiments, at least one of the first circuit board 202 and the second circuit board 204 includes one or more three-dimensional (3D) memory devices.

[0067] In some embodiments, electronic component 210 is or includes a memory module. In some embodiments, electronic component 210 is or includes a processor. In some embodiments, electronic component 210 is a combination of electronic components (e.g., Figure 2A One or more electronic components 210 are memory modules, and Figure 2A One or more other electronic components 210 are processors, etc.).

[0068] The first circuit board 202, the second circuit board 204, and the connection module 206 are mechanically and / or electrically connected via one or more flexible interconnects. For example, the assembly 200 includes a flexible interconnect 211, which mechanically and / or electrically connects the first board 202 to the second board 204. The assembly 200 also includes a flexible interconnect 212, which mechanically and / or electrically connects the connection module 206 to the second board 204. In some embodiments, the flexible interconnect (e.g., flexible interconnects 211, 212) is a flat interconnect mechanism for electrically connecting two boards (e.g., the first board 202 and the second board 204) or other electronic components or subassemblies. The flexible interconnect can be a flexible board, a flexible wire array, a flexible PCB, a flexible flat cable, a ribbon cable (e.g., a flexible flat ribbon cable), or a combination thereof. The flexible interconnect can carry electrical signals between two boards (e.g., the first board 202 and the second board 204) or between other electronic components and subassemblies. However, in some embodiments, the flexible interconnect does not carry electrical signals between the two components.

[0069] It should be understood that more or fewer flexible interconnects may be used to connect boards of an electronic assembly according to the teachings of the description in this application. For example, an electronic assembly may be composed of four (or more) boards, where flexible interconnects are used to interconnect the four (or more) boards to each other. Figures 3A-3D One example of such an assembly is described.

[0070] Back to Figure 2A , the boards 202, 204, 206 have been configured such that a channel 214 is formed by the first board 202, the second board 204, and the connection module 206. Air can then be forced through the channel (e.g., using a fan, compressed air, convection, etc.) to remove heat from the electronic components 210. In particular, the first board 202 and the connection module 206 are coupled via one or more fasteners 224. The one or more fasteners 224 include any shape, component, or device that mechanically and / or electrically couples the first board 202 and the connection module 206. For example, the one or more fasteners 224 can be any group consisting of: clips, screws, bolts, nuts, solder tabs and / or welded connections, adhesives, slots, holes, nails, protrusions, or the like (or any combination of the foregoing). For example, as Figure 2AAs shown, the connection module 206 includes two protrusions that are received in corresponding recesses of the first board 202. In some embodiments, the protrusions and recesses include solder tabs so that the first board 202 can be soldered to the connection module 206, thereby forming at least a mechanical connection between the boards 202 and 206. In some embodiments, the solder tabs also form an electrical connection between the boards 202 and 206 (e.g., for power and ground signals, or any other suitable electrical signals). Figures 4A-4C Fastener 224 is described in greater detail.

[0071] By joining the connection module 206 to the first plate 202, the assembly 200 forms a channel (e.g., channel 214) bounded by the first plate 202, the second plate 204, and the third plate 206, as well as any flexible interconnects (e.g., interconnects 211, 212) that couple the plates to each other. Thus, the channel is formed without the need for external supports, rails, brackets, or other hardware, reducing the cost and complexity of the assembly 200 while still providing the increased cooling that may be achieved by such a channel. In particular, since the channel 214 can be simply formed by joining the first plate 202 and the connection module 206, the assembly 200 can be more easily manufactured than structures that require more complex mounting hardware. In addition, since the entire assembly 200 can be welded together (e.g., the flexible interconnects 211, 212 can be welded to the respective plates, and the first plate 202 can be welded to the connection module 206), the resulting assembly is more robust than an assembly using less fixed mounting or attachment techniques. In particular, soldered connections are more resistant to separation or loosening caused by the heating and cooling cycles that frequently occur in computer hardware.

[0072] like Figure 2A As shown, the channel 214 is supported in some positions by a flexible interconnect. For example, the flexible interconnect 211 joins the first plate 202 and the second plate 204, and when the assembly is formed into the channel 214, the flexible interconnect 211 provides structural support to separate the first plate 202 and the second plate 204. Similarly, although smaller than the flexible interconnect 211, the flexible interconnect 212 that joins the second plate 204 and the connection module 206 also supports the assembly 200 to maintain the structural integrity of the channel 214. When the assembly is completed, although the rigidity of the flexible interconnects 211, 212 is sufficient to maintain the separation of the first plate 202 and the connection module 204, their flexibility is sufficient to provide a flexible connection so that the plates can be moved relative to each other without damaging the connection. This allows the plates to be manipulated relative to each other for ease of installation and assembly. For example, when the first plate 202 and the connection module 206 are separated, the assembly 200 can be mounted to a base plate (e.g. Figure 2BThe first plate 202 is then folded over the second plate 204 so that the first plate 202, the second plate 204 are substantially parallel to each other. The connection module 206 is then coupled to the first plate 202 to form the channel 214. Thus, the flexible interconnects 211, 212 (and any other flexible interconnects that may be used to join plates in an assembly according to the concepts of the present invention) are flexible enough to allow the plates to move relative to each other, but rigid enough to support the channel 214 in normal operation and orientation (e.g., so that the channel 214 does not collapse).

[0073] In some embodiments, multiple assemblies 200 are combined to form a substantially continuous channel. For example, in some embodiments, several assemblies 200 are coupled to one or more base plates so that the respective channels 214 are substantially aligned, thereby allowing air to pass through the respective channels. In some embodiments, multiple assemblies 200 form a single channel, and the assemblies 200 are coupled to each other to form a substantially continuous channel. For example, in some embodiments, a bracket, a seal, a guide rail, or any other suitable component is disposed between two adjacent assemblies to prevent air from escaping from the channel.

[0074] Figure 2B is a side view of the assembly 200. Figure 2B As shown, the first plate 202 , the second plate 204 , and the connection module 206 have been arranged to form a channel 214 . Figure 2B Also shown is a base plate 208 (e.g., a motherboard) to which the assembly 200 is mechanically and / or electrically coupled. In some embodiments, the assembly 200 includes one or more fasteners 222 in or coupled to the second plate 204 to facilitate such coupling. For example, in some embodiments, the one or more fasteners 222 include one or more threaded nuts embedded in the plate 204, into which mounting screws on the base plate 208 are screwed to couple the assembly 200 to the base plate 208. In some embodiments, the one or more fasteners 222 are selected from the group consisting of screws, nuts (e.g., PEM nuts), bolts, grid arrays (e.g., ball grid arrays, pin grid arrays, etc.), wires, pins (e.g., dual in-line, quad in-line, etc.), standoffs, clips, flexible interconnects, solder tabs, solder joints, and adhesives. Other suitable fasteners and fastening techniques may also be used.

[0075] Figure 2C is a side view of the assembly 200 without the first plate 202 coupled to the connection module 206 . Figure 2D214. FIG. 215 is another side view of the assembly 200 in which the first plate 202 is not coupled to the connection module 206 and the first plate 202 is at an obtuse angle relative to the second plate 204. This orientation facilitates mounting the assembly 200 to the base plate 208 because the surface of the second plate 204 is easily accessible. In particular, when the assembly 200 is closed and forms a channel 214, it will be more difficult to reach the surface of the second plate 204 to facilitate installation. In some embodiments, after the first plate 202 and the connection module 206 have been coupled to facilitate maintenance and removal of the assembly, the first plate 202 and the connection module 206 can be separated. For example, the assembly 200 can be opened so that dust, particles or other contaminants deposited due to airflow through the channel 214 can be removed. In some embodiments, one or more fasteners 224 (not in Figure 2B-2D 206) is configured to allow the first plate 202 and the connection module 206 to be separated without destroying the assembly 200 (e.g., using spring clips, screws, etc.). In some embodiments, where the first plate 202 and the connection module 206 are welded together (e.g., the fastener 224 includes pads that have been welded together), the first plate 202 and the connection module 206 can be separated by desoldering the plates.

[0076] Figure 3A An embodiment of an electronic assembly 300 ("assembly 300") is shown, wherein assembly 300 forms a self-supporting channel. Assembly 300 includes and Figures 2A-2D The assembly 200 is shown with many of the same components (eg, electronic components 210, first board 202, second board 204, connection module 206, etc.), and the details and explanations provided above for these components are incorporated by reference into the assembly 300 and are not repeated here.

[0077] Although the assembly 200 ( Figure 2A ) includes a flexible interconnect 211 that mechanically and / or electrically couples the first board 202 to the second board 204, but the assembly 300 ( Figure 3A ) includes a fourth circuit board 216, which is connected to the first board 202 and the second board 204 through flexible interconnects 218 and 220. The addition of the fourth board 216 can increase the degree of rigidity of the assembly, which can be advantageous in some applications. For example, in some embodiments, the rigidity of the flexible interconnect 211 in the assembly 200 is not sufficient to support the channel 214. This may occur if the channel 214 is too large, or the first board 202 is too heavy to be supported by the flexible interconnect 211. In addition, the addition of the fourth board 216 provides more surface area on which the electronic components 210 can be mounted. Therefore, a more compact, densely packed electronic assembly can be provided without increasing the overall size of the assembly.

[0078] Although flexible interconnects (220 and 218, respectively) are used to couple the fourth plate 216 to both the first plate 202 and the second plate 204, in some embodiments, only one of these connections is flexible. For example, the connection between the first plate 202 and the fourth plate 216 or the connection between the second plate 204 and the fourth plate 216 can be a rigid connection. Any suitable technique and any suitable fastener (e.g., as described above with reference to Figure 2A The fasteners described herein, and the fasteners referred to below Figures 4A-4C fasteners) to achieve a rigid connection between the fourth plate 216 and another plate.

[0079] Figure 3B and 3C is a side view of the assembly 300. Figure 3B As shown, the first plate 202, the second plate 204, the connection module 206 and the fourth plate 216 have been arranged to form the channel 214. Figure 3C , the first plate 202 is not coupled to the connection module 206 . Figure 3D 2 is another side view of assembly 300, wherein first plate 202 is not connected to connection module 206 and first plate 202 is at an obtuse angle relative to second plate 204. This orientation facilitates mounting assembly 300 to base plate 208, as the surface of second plate 204 is easily accessible.

[0080] Figures 4A-4C The embodiment of the assembly 200 is shown with variations in the one or more fasteners 224 used to couple the first plate 202 to the connection module 206. For example, Figure 4A Shows Figure 2A The assembly 200 is depicted in which the first plate 202 includes a hole 402, and the connection module includes a protrusion 404 configured to cooperate (eg, fit) with the hole 402. The hole 402 is any suitable shape, including circular, square, rectangular, oval, or the like.

[0081] In some embodiments, hole 402 includes solder tab 406, and protrusion includes solder tab 408 for connecting to solder tab 406 (it should be appreciated that the hole or protrusion may include solder tab 408). Figure 4A In some embodiments, when the first board 202 is coupled to the connection module 206, the welding tabs 406, 408 are welded together to securely couple the first board 202 to the connection module 206. In some embodiments, this also electrically couples the first board 202 and the connection module 206. In some embodiments, welding electrically couples the first board 202 to the second board 204 (e.g., via the flexible interconnect 212).

[0082] In some embodiments, soldering is used only to mechanically couple the first board 202 to the connection module 206 (eg, no electrical signals are intended to be transmitted between the first board 202 and the connection module 206 via the solder tabs 406 , 408 ).

[0083] Although Figure 4A Two holes and two corresponding protrusions are shown, but it should be understood that this is exemplary only, and more or fewer (eg, 3, 4, 5, 10, etc.) holes and corresponding protrusions may be used.

[0084] Figure 4B The assembly 200 is shown where the first plate 202 includes a recess 412 and the connection module includes a protrusion 414 configured to mate with (or fit into) the recess 412. The recess 412 is any suitable shape including circular, square, rectangular, oval, or the like.

[0085] In some embodiments, the recess 412 includes a solder tab 416, and the protrusion includes a solder tab 418 for coupling to the solder tab 416 (it should be appreciated that the hole or protrusion may include a solder tab 418). Figure 4B Solder tabs 416 and 418 are similar to solder tabs 406, 408, and the description of the structure and function of solder tabs 406, 408 applies equally to solder tabs 416 and 418 and will not be repeated here.

[0086] Figure 4C The assembly 200 is shown wherein the first plate 202 includes a slot 422 (eg, an elongated hole), and the connection module includes a protrusion 424 configured to cooperate (eg, fit) with the slot 422 .

[0087] In some embodiments, the slot 422 includes a solder tab 426, and the protrusion includes a solder tab 428 for coupling to the solder tab 426 (it should be appreciated that the hole or protrusion may include a solder tab 428). Figure 4C Solder tabs 422 and 426 are similar to solder tabs 406 and 408, and the description of the structure and function of solder tabs 406 and 408 applies equally to solder tabs 416 and 418 and will not be repeated here.

[0088] exist Figures 4A-4C In the , protrusions, holes, slots, recesses and pads are considered fasteners or parts of fasteners. In addition, you can also use Figures 4A-4C Other fastener components described or shown in the drawings may be used to help connect the first plate 202 to the connection module 206 (e.g., screws, snaps, clips, adhesives, brackets, magnets, etc.).

[0089] Figure 5An exemplary flow chart of a method 500 for manufacturing an electronic assembly for heat dissipation according to some embodiments is shown. A first electronic assembly (502) is provided. The electronic assembly includes a first circuit board (e.g., first circuit board 202), a second circuit board (e.g., second circuit board 204), a connection module (e.g., third circuit board), and a fastener (e.g., one or more fasteners 224).

[0090] In some embodiments, when the first circuit board and the second circuit board are not substantially parallel, the second circuit board is coupled to a base circuit board (e.g., base board 208) (504). The electronic assembly (e.g., the first circuit board) is then adjusted (e.g., by machine or hand) so that the first circuit board is disposed substantially parallel to the second circuit board (506). Adjusting the first circuit board so that the first circuit board is disposed substantially parallel to the second circuit board causes at least a portion of a first flexible interconnect (e.g., flexible interconnect 211) that couples the first circuit board to the second circuit board to deform or bend.

[0091] In some embodiments, the connection module is adjusted so that the connection module is arranged substantially perpendicular to the second circuit board (eg, Figure 2A ), wherein adjusting the connection module causes deformation (506) of at least a portion of a second flexible interconnect (eg, flexible interconnect 212) coupling the connection module to the second circuit board.

[0092] The first circuit board is coupled to the connection module using fasteners (e.g., one or more fasteners 224) such that the first circuit board and the second circuit board are substantially parallel and separated by a space, wherein the space forms at least a portion of a channel (e.g., channel 214) configured to direct airflow through the space between the first circuit board, the second circuit board, and the connection module (508).

[0093] Figure 6 An exemplary flow chart of a method 600 for heat dissipation in an electronic assembly according to some embodiments is shown. Figure 1-4C The electronic assembly (602) described herein. In some embodiments, the electronic assembly includes a first circuit board, a second circuit board, and a fastener. The second circuit board is flexibly coupled to the first circuit board. A connection module is coupled to the second circuit board. The fastener couples the first circuit board to the connection module so that the first circuit board and the second circuit board are substantially parallel and separated by a space.

[0094] In some embodiments, at least one of the first circuit board and the second circuit board includes one or more solid state drives (SSDs). In some embodiments, at least one of the first circuit board and the second circuit board includes one or more three-dimensional (3D) memory devices.

[0095] Thereafter, as described above, air flow is directed (604) through the space between the first circuit board, the second circuit board and the connection module to dissipate heat, ie, air passes through the channel.

[0096] Those skilled in the art will recognize that the invention described and claimed herein is not limited to the two-dimensional and three-dimensional exemplary structures described herein, but covers all related memory structures suitable for implementing the invention described herein and as understood by those skilled in the art.

[0097] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish elements from each other. For example, a first contact may be referred to as a second contact, and similarly, a second contact may be referred to as a first contact, which changes the meaning of the description, as long as all occurrences of "first contact" are consistently renamed and all occurrences of "second contact" are consistently renamed. Both the first contact and the second contact are contacts, but they are not the same contact.

[0098] The term set used herein is only for describing specific embodiments and is not intended to limit the claims. As used in the description of the embodiments and the appended claims, the singular forms of "a" and "the" are intended to also include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any and all possible combinations of one or more related enumerated items. It should also be understood that when used in the specification, the terms "include" and / or "comprising" specify the presence of stated features, wholes, steps, operations, elements, and / or parts, but do not exclude the presence of one or more additional features, wholes, steps, operations, elements, parts and / or their groups.

[0099] As used herein, the term "if" may be interpreted to mean "when" or "upon" or "in response to a determination" or "upon a determination" or "in response to detection," the stated antecedent is true, depending on the context. Similarly, the phrase "if it is determined that [the stated antecedent is true]" or "if [the stated antecedent is true]" or "when [the stated antecedent is true]" may be interpreted to mean "at the time of the determination" or "in response to the determination" or "upon a determination" or "upon detection" or "in response to detection," the stated antecedent is true, depending on the context.

[0100] For purposes of explanation, the foregoing description has been described with reference to specific embodiments. However, the above illustrative discussion is not intended to be exhaustive or to limit the invention to the precise form disclosed. In view of the above teachings, many modifications and variations are possible. The embodiments selected and described are intended to best explain the principles of the invention and its practical application, thereby enabling those skilled in the art to best utilize the invention and various embodiments with various modifications to suit the specific purposes contemplated.

Claims

1. An electronic assembly for heat dissipation, comprising: a first circuit board including a first fastener; a second circuit board flexibly coupled to the first circuit board; as well as a connection module coupled to the second circuit board and comprising a second fastener, wherein the second fastener is different from the first fastener and is configured to be connected to the first fastener; wherein the first fastener and the second fastener are configured to couple the first circuit board to the connection module such that the first circuit board and the second circuit board are substantially parallel and separated by a space, wherein the space forms at least a portion of a channel configured to direct airflow through the space between the first circuit board, the second circuit board, and the connection module, wherein the connection module is electrically connected to the second circuit board, and Wherein the channel is formed without external supports, rails, brackets or other hardware.

2. The electronic assembly of claim 1, wherein the first circuit board is flexibly coupled to the second circuit board using a flexible interconnect.

3. The electronic assembly of claim 2, wherein the flexible interconnect electrically couples the first circuit board to the second circuit board.

4. The electronic assembly of claim 1, wherein a first side of the channel comprises the connection module and a second side of the channel comprises a flexible interconnect.

5. The electronic assembly of claim 1, wherein the first circuit board is flexibly coupled to the second circuit board using one or more flexible interconnects and one or more additional circuit boards.

6. The electronic assembly of claim 1, wherein the second circuit board is flexibly coupled to the connection module.

7. The electronic assembly of claim 6, wherein the second circuit board is flexibly coupled to the connection module using a flexible interconnect.

8. The electronic assembly of claim 7, wherein the flexible interconnect electrically couples the second circuit board to the connection module.

9. The electronic assembly of claim 1, wherein at least one of the first circuit board and the second circuit board comprises one or more three-dimensional (3D) memory devices.

10. The electronic assembly of any one of claims 1 to 9, wherein the first circuit board comprises two opposite surfaces, and a plurality of electronic components are disposed on the two opposite surfaces of the first circuit board.

11. The electronic assembly of any one of claims 1-9, wherein the electronic assembly is mounted to a base plate, and the first circuit board and the second circuit board are substantially parallel to the base plate.

12. The electronic assembly of any one of claims 1-9, wherein the first fastener is selected from the group consisting of a hole, a notch, and a slot.

13. The electronic assembly of claim 12, wherein each of the first fastener and the second fastener comprises one or more solder pads.

14. The electronic assembly of any one of claims 1-9, wherein the first circuit board includes a hole in a substrate of the first circuit board, and the connection module includes a protrusion configured to mate with the hole in the first circuit board.

15. The electronic assembly of any one of claims 1-9, wherein the connection module includes a hole in a base plate of the connection module, and the first circuit board includes a protrusion configured to mate with the hole in the connection module.

16. The electronic assembly of any one of claims 1-13, wherein the first circuit board includes a recess in a substrate of the first circuit board, and the connection module includes a protrusion configured to mate with the recess in the first circuit board.

17. The electronic assembly of any one of claims 1-9, wherein the connection module includes a recess in a base plate of the connection module, and the first circuit board includes a protrusion configured to mate with the recess in the connection module.

18. The electronic assembly of any one of claims 1-9, wherein the fastener is configured to mechanically and electrically couple the first circuit board to the second circuit board.

19. The electronic assembly of any one of claims 1-9, wherein the second circuit board comprises one or more second fasteners configured to couple the second circuit board to a base plate.

20. The electronic assembly of any one of claims 1-9, wherein at least one of the first circuit board, the second circuit board, and the connection module comprises one or more solid state drives (SSDs).

21. The electronic assembly of any one of claims 1-9, wherein at least one of the first circuit board, the second circuit board, and the connection module comprises an energy holding capacitor circuit.

22. A method for manufacturing an electronic assembly for heat dissipation, comprising: An electronic assembly is provided, the electronic assembly comprising: A first circuit board including a first fastener; a second circuit board flexibly coupled to the first circuit board; and a connection module coupled to the second circuit board and comprising a second fastener, wherein the second fastener is different from the first fastener and is configured to connect to the first fastener; and coupling the first circuit board to the connection module using the first fastener and the second fastener such that the first circuit board and the second circuit board are substantially parallel and separated by a space, wherein the space forms at least a portion of a channel configured to direct airflow through the space between the first circuit board, the second circuit board, and the connection module, wherein the connection module is electrically connected to the second circuit board, and Wherein the channel is formed without external supports, rails, brackets or other hardware.

23. The method of claim 22, further comprising, before coupling the first circuit board to the connection module: coupling the second circuit board to a base circuit board when the first circuit board and the second circuit board are not substantially parallel; and Adjusting the electronic assembly so that the first circuit board is disposed substantially parallel to the second circuit board, wherein adjusting the electronic assembly so that the first circuit board is disposed substantially parallel to the second circuit board causes deformation of at least a portion of a first flexible interconnect coupling the first circuit board and the second circuit board.

24. The method of claim 23, wherein the connection module is flexibly connected to the second circuit board, adjusting the electronic assembly includes adjusting the electronic assembly so that the connection module is arranged substantially perpendicular to the second circuit board, and adjusting the electronic assembly causes deformation of at least a portion of a second flexible interconnect connecting the connection module to the second circuit board.

25. The method of any one of claims 22-23, wherein at least one of the first circuit board and the second circuit board comprises one or more three-dimensional (3D) memory devices, one or more solid-state drives (SSDs), or energy retention capacitor circuits.

Images