Warping correction method, carrying device and carrying system

Abstract

The present application discloses a warping correction method, a carrying device and a carrying system, wherein the carrying device obtains a first distance between the adsorption surface of the adsorbent and the workpiece to be tested; when the first distance between the adsorption surface of the adsorbent and the workpiece to be tested is greater than a first preset distance and less than or equal to a second preset distance, the adsorbent is determined to be a first target adsorbent, and the second preset distance is greater than the first preset distance; the driving device is controlled to drive the first target adsorbent to move toward the workpiece to be tested; when the first distance is less than or equal to the first preset distance, the first target adsorbent is controlled to adsorb the workpiece to be tested; the driving device is controlled to drive the adsorbent to move in a direction away from the workpiece to be tested until the bottom of the first target adsorbent abuts against the bottom of the accommodating groove. The workpiece to be tested in different areas is adsorbed by adsorbents distributed at different positions on the carrying body, so that different areas of the workpiece to be tested can be flattened by vacuum adsorption, thereby improving the detection accuracy of the workpiece to be tested.

Description

Technical Field

[0001] The present application relates to the field of detection technology, and in particular to a warping correction method, a carrying device and a carrying system. Background Art

[0002] During the preparation process of the wafer, the wafer often warps due to the internal stress of the wafer. When the warped wafer is inspected, the degree of warping of the wafer will affect the inspection accuracy of the wafer. The existing warping correction device mainly presses the warped wafer as a whole through a pressure plate to flatten the warped wafer as a whole. However, pressure plates of different shapes may cause the warped part of the wafer to not be completely flattened, and it is impossible to press a specific position separately, thereby affecting the inspection accuracy of the wafer. Summary of the invention

[0003] Embodiments of the present application provide a warping correction method, a carrying device, and a carrying system.

[0004] In a first aspect, an embodiment of the present application provides a warpage correction method, which is applied to a carrying device, wherein the carrying device includes a carrying body, an adsorbent, a distance measuring component, and a driving device, wherein a carrying surface of the carrying body is provided with a receiving groove, and an end of the adsorbent away from the receiving groove is provided with an adsorption surface, wherein the adsorption surface is used to adsorb a workpiece to be tested, and the other end is received in the receiving groove and connected to the driving device, wherein the driving device is used to drive the adsorbent to move along the normal direction of the carrying surface, and the method includes:

[0005] Acquiring a first distance between the adsorption surface of the adsorption member and the object to be tested;

[0006] When a first distance between the adsorption surface of the adsorption component and the object to be tested is greater than a first preset distance and less than or equal to a second preset distance, the adsorption component is determined to be a first target adsorption component, and the second preset distance is greater than the first preset distance;

[0007] Controlling the driving device to drive the first target adsorption component to move toward the object to be tested;

[0008] When the first distance is less than or equal to the first preset distance, controlling the first target adsorption component to adsorb the object to be tested;

[0009] The driving device is controlled to drive the adsorption component to move in a direction away from the test object until the bottom of the first target adsorption component abuts against the bottom of the accommodating groove.

[0010] Optionally, the step of obtaining a first distance between the adsorption surface of the adsorption component and the object to be tested further includes:

[0011] When the first distance is greater than a second preset distance, the adsorbent is determined to be a second target adsorbent, and the second preset distance is greater than the first preset distance;

[0012] The step of controlling the driving device to drive the first target adsorption component to move toward the object to be tested further includes:

[0013] Real-time monitoring of a second distance between the adsorption surface of the second target adsorption component and the object to be tested;

[0014] When the second distance is less than or equal to the first preset distance, controlling the second target adsorbing component to adsorb the test object;

[0015] The driving device is controlled to drive the second target adsorption component to move in a direction away from the test object until the bottom of the second target adsorption component abuts against the bottom of the accommodating groove.

[0016] Optionally, the step of obtaining a first distance between the adsorption surface of the adsorption component and the object to be tested further includes:

[0017] When a first distance between the adsorption surface of the adsorption component and the object to be measured is less than or equal to a first preset distance, determining that the adsorption component is a third target adsorption component;

[0018] The third target adsorption component is controlled to adsorb the test object.

[0019] Optionally, the adsorption member includes an adsorption portion and a support portion, one end of the support portion is connected to the driving device, and the other end is movably connected to the adsorption portion, and the controlling the driving device to drive the first target adsorption member to move toward the object to be tested includes:

[0020] determining the warpage of the test piece according to the first distance;

[0021] Determining a moving distance of the driving device of the first target adsorption component according to the warping degree;

[0022] The driving device is controlled to drive the first target adsorption component to move according to the moving distance.

[0023] Optionally, determining the moving distance of the driving device according to the warping degree includes:

[0024] Adjusting a first compensation height of the first target adsorption component along a normal direction of the carrying surface according to the warping degree;

[0025] The moving distance of the driving device is determined according to the area and the first compensation height.

[0026] In a second aspect, an embodiment of the present application provides a carrying device, the carrying device comprising a carrying body, an adsorbent and a driving device, the carrying surface of the carrying body comprising a plurality of accommodating grooves, the bottom of the accommodating grooves being provided with through holes, the driving device being arranged through the through holes, one end of the adsorbent being provided with an adsorption surface, the adsorption surface being adsorbed and connected to the test piece, the other end of the adsorbent being received in the accommodating groove and being connected to the driving device;

[0027] The diameter of the accommodating groove is larger than the diameter of one end of the adsorption member close to the carrying body;

[0028] The adsorption member is provided with an adsorption hole, the adsorption hole is connected to the vacuum air path, and the adsorption hole is used to adsorb the object to be tested;

[0029] The driving device is used to drive the adsorption component to move back and forth along the normal direction of the surface of the supporting body.

[0030] Optionally, the adsorption part includes an adsorption part and a supporting part, one end of the supporting part is connected to the driving device, and the other end is movably connected to the adsorption part, the adsorption hole passes through the adsorption part and the supporting part, the diameter of the supporting part is smaller than the inner diameter of the accommodating groove, and the diameter of the adsorption part is larger than the inner diameter of the accommodating groove.

[0031] Optionally, the bottom of the accommodating groove is a first arc surface structure, the side of the supporting portion close to the accommodating groove is a second arc surface structure, and the first arc surface structure abuts against the second arc surface structure.

[0032] Optionally, the adsorption portion is detachably connected to the supporting portion, and the adsorption hole is arranged through the adsorption portion.

[0033] In a third aspect, an embodiment of the present application provides a bearing system, which includes a bearing device as described in any of the above embodiments.

[0034] It can be seen that in the embodiment of the present application, the carrying device includes a carrying body, an adsorbent, a distance measuring component and a driving device, and the carrying device obtains a first distance between the adsorbent surface of the adsorbent and the part to be tested; when the first distance between the adsorbent surface of the adsorbent and the part to be tested is greater than a first preset distance and less than or equal to a second preset distance, the adsorbent is determined to be a first target adsorbent, and the second preset distance is greater than the first preset distance; the driving device is controlled to drive the first target adsorbent to move toward the part to be tested; when the first distance is less than or equal to the first preset distance, the first target adsorbent is controlled to adsorb the part to be tested; the driving device is controlled to drive the adsorbent to move away from the part to be tested until the bottom of the first target adsorbent abuts against the bottom of the accommodating groove. The parts to be tested in different areas are adsorbed by adsorbents distributed at different positions on the carrying body, so that different areas of the part to be tested can be flattened by vacuum adsorption, thereby improving the detection accuracy of the part to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 It is a flowchart of a warping correction method provided in an embodiment of the present application;

[0037] Figure 2 It is a structural schematic diagram of a carrying device provided in an embodiment of the present application;

[0038] Figure 3 is a top view of a carrying device provided in an embodiment of the present application;

[0039] Figure 4 yes Figure 3 A cross-sectional view of an embodiment along the AA direction;

[0040] Figure 5 yes Figure 3 A cross-sectional view of another embodiment along the AA direction;

[0041] Figure 6 yes Figure 3 A partial cross-sectional view of another embodiment along the AA direction;

[0042] Figure 7 yes Figure 3 A partial cross-sectional view of yet another embodiment along line AA.

[0043] Description of Figure Numbers:

[0044] Label name Label name 10 Carrying body 22 Support 11 Storage tank 211 Adsorption surface 20 Adsorption parts 212 Adsorption hole 21 Adsorption Department 30 Drive device DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0046] The following are detailed descriptions of each.

[0047] The terms "first", "second", "third" and "fourth" etc. in the specification and claims of the present application and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0048] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0049] See also Figure 1 , Figure 1 It is a flow chart of a warpage correction method provided in an embodiment of the present application, wherein the warpage correction method is applied to a carrying device, wherein the carrying device comprises a carrying body 10, an adsorbent 20, a distance measuring assembly and a driving device 30, wherein a carrying surface of the carrying body 10 is provided with a receiving groove 11, and an end of the adsorbent 20 away from the receiving groove 11 is provided with an adsorption surface 211, wherein the adsorption surface 211 is used for adsorbing a workpiece to be tested, and the other end is connected to the driving device 30, and the driving device 30 is used for driving the adsorbent 20 to move along the normal direction of the carrying surface of the carrying body 10.

[0050] The device under test is a wafer or a silicon chip. In other embodiments, the device under test may also be a glass substrate.

[0051] The driving device 30 is used to drive the adsorption component 20 to move. Specifically, the driving device 30 can be a motor or a rotating shaft structure.

[0052] The carrier body 10 is a wafer suction cup, and the carrier surface of the carrier body 10 is the surface of the DUT that contacts or is closest to the carrier body 10. When the carrier body 10 fixes the DUT by vacuum adsorption, the carrier surface of the carrier body 10 abuts against the DUT, and when the carrier body 10 fixes the DUT by air flotation, the carrier surface of the carrier body 10 is spaced close to the DUT.

[0053] The bearing surface is provided with a plurality of receiving grooves 11, each of which is spaced apart from each other, and the receiving grooves 11 are used to accommodate the adsorbent 20. In one embodiment, the receiving parts are evenly spaced apart on the bearing surface, and all the bearing surfaces are arranged in a circular shape. In another embodiment, the plurality of receiving grooves 11 on the receiving part are evenly spaced apart along a plurality of straight line directions, and in another embodiment, the plurality of receiving grooves 11 in the receiving part are evenly spaced apart along a circumferential direction.

[0054] Wherein, the distance measuring component can be an infrared distance measuring sensor or an ultrasonic distance measuring sensor, and the distance measuring component is connected to the adsorption component 20. In a preferred embodiment, the distance measuring sensor is flush with the adsorption surface 211 of the adsorption component 20, so as to measure the distance between the adsorption surface 211 and the object to be measured. It can be understood that the distance measuring component can also be arranged at other positions. In one embodiment, the distance measuring component is connected to the adsorption component 20. When the distance between the adsorption surface 211 and the object to be measured is measured by the distance measuring component, the distance between the distance measuring component and the adsorption surface 211 is set as a pre-stored distance, and after measuring the distance between the adsorption component and the object to be measured, the distance between the adsorption surface 211 and the object to be measured is converted by the measurement result and the pre-stored distance. In another embodiment, the distance measuring component is not connected to the adsorption component 20, and the distance between the adsorption surface 211 and the object to be measured is converted by obtaining the moving distance of the driving device 30.

[0055] The warping correction method comprises:

[0056] Step 10: The carrying device obtains a first distance between the adsorption surface 211 of the adsorption component 20 and the object to be tested.

[0057] Step 20: When the first distance between the adsorption surface 211 of the adsorption component 20 and the object to be tested is greater than the first preset distance and less than or equal to the second preset distance, the adsorption component 20 is determined to be the first target adsorption component 20, and the second preset distance is greater than the first preset distance.

[0058] The first distance is 5 mm, 10 mm or other values.

[0059] The first preset distance is 7 mm, 12 mm or other values.

[0060] The second preset distance is 20 mm, 30 mm or other values, and the second preset distance is greater than the first preset distance.

[0061] Among them, the carrying device obtains the first distance between the adsorption surface 211 and the part to be tested. When the first distance is greater than the first preset distance and less than or equal to the second preset distance, the adsorption component 20 is determined to be the first target adsorption component 20. When the first target adsorption component 20 does not move, it is impossible to complete the adsorption operation on the part to be tested. However, after the driving device 30 drives the first target adsorption component 20 to move, it can ensure that the distance between the adsorption surface 211 of the first target adsorption component 20 and the part to be tested is less than the first preset distance.

[0062] Step 30: Control the driving device 30 to drive the first target adsorption component 20 to move toward the object to be tested.

[0063] Step 40: When the first distance is less than or equal to the first preset distance, controlling the first target adsorption component 20 to adsorb the test object.

[0064] Among them, after determining the first target adsorption component 20, in order to reduce the first distance, the driving device 30 drives the first target adsorption component 20 to move toward the side close to the adsorption component 20 during the movement, thereby reducing the first distance. In one embodiment, the driving device 30 controls the first target adsorption component 20 to move toward the test piece, until the adsorption surface 211 of the first adsorption component 20 abuts against the test piece or the first distance is less than the first preset distance, and then controls the driving device 30 to stop moving, thereby increasing the probability of successful adsorption of the first target adsorption component 20 to the test piece.

[0065] In a preferred embodiment, the adsorption surface 211 of the adsorption member 20 can rotate in different directions. When the adsorption member 20 abuts against the object to be tested, the adsorption surface 211 of the adsorption member 20 rotates and remains parallel to the surface of the object to be tested, thereby increasing the probability of successful adsorption of the object to be tested by the adsorption member 20.

[0066] Step 50 : controlling the driving device 30 to drive the adsorption member 20 to move in a direction away from the object to be tested, until the bottom of the first target adsorption member 20 abuts against the bottom of the receiving groove 11 .

[0067] Among them, after the adsorption component 20 adsorbs the test piece, the driving device 30 drives the adsorption component 20 to move toward the side close to the supporting surface. Driven by the adsorption component 20, the warping degree of the test piece is reduced and the flatness of the test piece is improved, thereby completing the warping correction process of the test piece.

[0068] Optionally, the step of obtaining the first distance between the adsorption surface 211 of the adsorption member 20 and the object to be tested further includes:

[0069] When the first distance between the adsorption surface 211 of the adsorption component 20 and the object to be tested is greater than the second preset distance, the carrying device determines that the adsorption component 20 is the second target adsorption component 20, and the second preset distance is greater than the first preset distance;

[0070] The step of controlling the driving device 30 to drive the first target adsorption component 20 to move toward the object to be tested further includes:

[0071] The carrying device monitors the second distance between the adsorption surface 211 of the second target adsorption component 20 and the object to be tested in real time;

[0072] When the second distance is less than or equal to the first preset distance, the carrying device controls the second target adsorption component 20 to adsorb the test object;

[0073] The carrying device controls the driving device 30 to drive the second target adsorption component 20 to move in a direction away from the test object until the bottom of the second target adsorption component 20 abuts against the bottom of the accommodating groove 11 .

[0074] The second distance is 10 mm, 15 mm or other values.

[0075] Among them, when the first distance is greater than the second preset distance, it means that the adsorption component 20 is still unable to complete the adsorption action of the test piece when it is driven and moved by the driving device 30. Therefore, in order to calibrate the test piece, it is necessary to first drive the test piece to be tested by other adsorption components 20 to move to one side of the supporting surface, and then perform further warping correction operations.

[0076] Among them, when the first distance is greater than the second preset distance, the adsorbent 20 is determined to be the second target adsorbent 20. In order to complete the warpage correction of the corresponding area of ​​the second target adsorbent 20, it is necessary to perform warpage correction on the second target adsorbent 20 after performing warpage correction on other adsorbents 20 except the second target adsorbent 20. Specifically, when the carrying device drives the first target adsorbent 20 to move toward the side close to the carrying surface, the distance measuring component corresponding to the second target adsorbent 20 monitors the second distance between the adsorption surface 211 of the second target adsorbent 20 and the object to be tested in real time, and when the second distance is less than the first preset distance, it indicates that the second target adsorbent 20 can start to perform the warpage correction operation, so the carrying device controls the second target adsorbent 20 to adsorb the object to be tested, and drives the second target adsorbent 20 to move toward the side close to the carrying surface after adsorption. When the bottoms of all adsorbents 20 are in contact with the bottom of the accommodating groove 11, the object to be tested improves the overall flatness under the drive of the adsorbent 20, thereby completing the warpage correction process of the object to be tested.

[0077] Optionally, the step of obtaining the first distance between the adsorption surface 211 of the adsorption member 20 and the object to be tested further includes:

[0078] When the first distance between the adsorption surface 211 of the adsorption member 20 and the object to be tested is less than or equal to the first preset distance, the adsorption member 20 is determined to be the third target adsorption member 20;

[0079] The third target adsorption component 20 is controlled to adsorb the test object.

[0080] When the first distance between the adsorption surface 211 of the adsorption component 20 and the test piece is less than or equal to the first preset distance, the adsorption component 20 is determined to be the third target adsorption component 20. Specifically, the third target adsorption component 20 can adsorb the test piece.

[0081] Specifically, when the distance between the adsorbent 20 and the workpiece to be tested is less than the first preset distance, the adsorbent 20 can adsorb the workpiece to be tested when performing vacuum adsorption through the vacuum air path, without having to completely abut against the workpiece to be tested. Therefore, during the warpage correction process of the workpiece to be tested, the adsorbent 20 can complete the adsorption process of the workpiece to be tested without moving.

[0082] Optionally, the adsorption member 20 includes an adsorption portion 21 and a support portion 22, one end of the support portion 22 is connected to the driving device 30, and the other end is movably connected to the adsorption portion 21, and the control of the driving device 30 drives the first target adsorption member 20 to move toward the object to be tested includes:

[0083] determining the warpage of the test piece according to the first distance;

[0084] Determining a moving distance of the driving device 30 according to the warping degree;

[0085] The driving device 30 is controlled to drive the first target adsorption component 20 to move according to the moving distance.

[0086] Wherein, determining the warpage of the test piece according to the first distance includes:

[0087] The warping degree of the test piece is determined according to the first formula Q=u / H and the first distance, wherein Q is the warping degree of the test piece, u is the distance between the adsorption surface 211 and the test piece, and H is the diameter of the test piece.

[0088] Among them, after determining the distance between the distance measuring unit and the piece to be tested, the degree of warping of the piece to be tested can be determined by the distance measuring unit at different positions and the detection distance. Specifically, in one embodiment, 8 adsorbents 20 are included along the first direction. When the distance between the adsorption surface 211 and the piece to be tested is measured by the distance measuring unit, the detection distances are (0, 0, 0.2, 0.3, 0.5, 0.7, 0.5, 0.3, 0.2, 0), respectively. The diameter H of the wafer is 300 mm. The maximum distance between the adsorption surface 211 of the adsorbent 20 and the piece to be tested is 8 mm. Then the degree of warping of the piece to be tested at the corresponding position of the adsorbent 20 is 0.027.

[0089] When it is detected that the distance between the adsorption surface 211 and the object to be tested is less than the first preset distance, the adsorption member 20 can directly adsorb the object to be tested, so the object to be tested can be adsorbed without moving the adsorption member 20 .

[0090] When it is detected that the distance between the adsorption surface 211 and the object to be tested is greater than the first preset distance and less than or equal to the second preset distance, it means that the adsorption component 20 cannot complete the adsorption process of the object to be tested without moving, so the driving device 30 is controlled to drive the adsorption component 20 to move toward the side close to the object to be tested.

[0091] Specifically, after the adsorption member 20 is moved by the driving device 30 , when the adsorption surface 211 of the adsorption member 20 abuts against the object to be tested or the distance between the adsorption surface 211 and the object to be tested is less than the first preset distance, the adsorption surface 211 can complete the adsorption action on the object to be tested.

[0092] When the distance between the adsorption surface 211 of the adsorption component 20 and the test piece is greater than or equal to the second preset distance, it means that the adsorption component 20 still cannot complete the adsorption action after being moved by the driving device 30. In order to solve this problem, it is necessary to first determine the target adsorption component 20 whose distance between the adsorption surface 211 and the test piece is greater than the second preset distance, and then move other adsorption components 20 except the target adsorption component 20, and make the test piece move to the side close to the carrying surface under the adsorption action of the other adsorption components 20. When the other adsorption components 20 move, the distance measuring sensor corresponding to the target adsorption component 20 detects the second distance between the adsorption surface 211 of the target adsorption component 20 and the test piece in real time, and when the second distance is less than the first preset distance, the vacuum of the target adsorption component 20 is opened, and the test piece is adsorbed by the target adsorption component 20, thereby solving the problem that the warping degree of the test piece is too large and the warping correction cannot be completed in a single time.

[0093] In a specific embodiment, the carrying device has 10 adsorption parts 20 along a direction, and each of the adsorption parts 20 has a corresponding ranging sensor, and the ranging sensor measures the distance between the adsorption surface 211 and the test piece as (0, 0.8, 1.5, 1.9, 2.1, 2.5, 1.7, 1.4, 0.7, 0), wherein the first preset distance is 1 mm, then in the data of the first detection distance, when the maximum distance moved by the driving device 30 along the carrying surface is 1 mm, then after the driving device 30 drives the adsorption part 20 to move, the fifth adsorption part 20 and the sixth adsorption part 20 along the first direction are the target adsorption parts 20, so as to correct the warped test piece.

[0094] Wherein, determining the moving distance of the driving device 30 according to the warping degree includes:

[0095] A first compensation height of the first target adsorption component 20 along the normal direction of the carrying surface is adjusted according to the warping.

[0096] The moving distance of the driving device 30 is determined according to the area and the first height.

[0097] Wherein, adjusting the first height of the first target adsorption component 20 along the normal direction of the carrying surface according to the warping degree includes:

[0098] According to the second formula S=Q*H*k and the warpage, the first compensation height of the adsorption component 20 along the normal direction of the bearing surface is determined, wherein S is the first compensation height, Q is the warpage, H is the diameter of the test piece, and k is a preset parameter.

[0099] The greater the warping degree, the greater the moving distance of the driving device 30. When the driving device 30 drives multiple adsorbents 20 to move together, the moving distances of the multiple adsorbents 20 are the same. Therefore, when the adsorbents 20 are driven to move by the driving device 30, the moving distance of each adsorbent 20 is the same. When any of the adsorbents 20 is in contact with the part to be tested, the other adsorbents 20 may still have a large distance from the part to be tested. In order to avoid this situation, before the driving device 30 drives all the adsorbents 20 to move, the relative positions of the adsorbents 20 can be adjusted so that different adsorbents 20 have different first heights, thereby ensuring that the height of the adsorbent 20 is close to the curved surface of the adsorbent 20 of the part to be tested, so that the adsorbents 20 at different positions can all be in contact with the part to be tested at the same time.

[0100] After determining the first height corresponding to each of the adsorbents 20, the moving distance of the driving device 30 is determined according to the first compensation height and the first distance. Specifically, when the first distance is 20 mm and the first compensation height is +5 mm, the moving distance of the driving device 30 is 15 mm. When the first preset distance is 2 mm, the moving range of the driving device 30 is 13-15 mm.

[0101] See also Figure 2 , Figure 2 The present invention provides a carrying device, which includes a carrying body 10 and an adsorbent 20. The carrying surface of the carrying body 10 includes a plurality of receiving grooves 11. One end of the adsorbent 20 close to the carrying body 10 is received in the receiving groove 11, and the other end protrudes from the surface of the carrying body 10.

[0102] The diameter of the accommodating groove 11 is larger than the diameter of the end of the adsorption member 20 close to the carrying body 10;

[0103] The adsorption member 20 is provided with an adsorption hole 212, the adsorption hole 212 is connected to the vacuum air path, and the adsorption hole 212 is used to adsorb the wafer;

[0104] The carrying device further includes a driving device 30 , which is connected to a side of the adsorption member 20 close to the carrying body 10 , and is used to drive the adsorption member 20 to reciprocate along a normal direction of a surface of the carrying body 10 .

[0105] The carrying device is used to carry and adsorb the object to be tested. In one embodiment, the object to be tested is a wafer. In other embodiments, the object to be adsorbed may also be a glass substrate.

[0106] The bearing surface of the bearing body 10 includes a plurality of accommodating grooves 11. In one embodiment, Figure 1 As shown, the accommodating grooves 11 are evenly spaced and distributed along the circumference of the bearing surface of the bearing body 10. In another embodiment, as shown in FIG. Figure 2 As shown, the receiving grooves 11 are evenly spaced and distributed along multiple directions of the carrying surface of the carrying body 10 .

[0107] One end of the adsorption member 20 is received in the receiving groove 11 , and the other end protrudes from the supporting surface of the supporting body 10 or is arranged flush with the supporting surface.

[0108] Preferably, the diameter of the receiving groove 11 is larger than the diameter of one end of the adsorption member 20 close to the supporting body 10 , thereby ensuring that the adsorption member 20 can move in the receiving groove 11 along the direction of the supporting surface of the supporting body 10 .

[0109] Among them, the adsorption component 20 is provided with an adsorption hole 212, and the adsorption hole 212 is connected to the vacuum air path. Specifically, the adsorption hole 212 is set through the adsorption component 20. Specifically, when the supporting body 10 carries the workpiece to be tested, the adsorption component 20 abuts against the workpiece to be tested. Since the adsorption hole 212 on the adsorption component 20 is connected to the vacuum air path, the adsorption component 20 can adsorb the workpiece to be tested through the adsorption hole 212 and drive the workpiece to be tested to correct the warping of the workpiece to be tested.

[0110] The carrying device further includes a driving device 30, which is connected to one end of the adsorbent 20 close to the carrying body 10, and is used to drive the adsorbent 20 to reciprocate along the normal direction of the surface of the carrying body 10. In a specific embodiment, when the test piece is placed on the carrying body 10, the test piece cannot contact each of the adsorbents 20 due to the warping of the test piece. Therefore, the position of the adsorbent 20 is adjusted by the driving device 30, and the adsorbent 20 is first moved toward a side close to the test piece. After the adsorbent 20 adsorbs the test piece, it is again moved toward a side close to the carrying body 10 driven by the driving device 30, thereby adjusting the warping degree of the test piece.

[0111] The bottom of the support portion 22 is an end of the support portion 22 close to the bottom of the receiving groove 11 , and the other end of the support portion 22 is connected to the adsorption portion 21 .

[0112] Among them, when the adsorbent 20 is located at the initial position, the bottom of the adsorbent 20 abuts against the bottom of the receiving groove 11. When the adsorbent 20 is ready to adsorb the wafer, the adsorbent 20 moves away from the bottom side of the receiving groove 11 under the drive of the driving device 30, and approaches the warped wafer. Since the adsorption hole 212 on the adsorption part 21 of the adsorbent 20 is connected to the vacuum air path, when the adsorption surface 211 of the adsorption part 21 contacts the surface of the wafer, the adsorbent 20 can adsorb the wafer. Then, the adsorbent 20 moves again to the bottom side of the receiving groove 11 under the drive of the driving device 30, so that the adsorbent 20 returns to the initial position, and in the process of returning to the initial position, the warped wafer is deformed to reduce the degree of warping of the wafer.

[0113] In one embodiment of the present application, the carrying device includes a carrying body 10 and an adsorbent 20, the carrying surface of the carrying body 10 includes a plurality of accommodating grooves 11, one end of the adsorbent 20 close to the carrying body 10 is received in the accommodating groove 11, and the other end protrudes from the surface of the carrying body 10; the diameter of the accommodating groove 11 is larger than the diameter of the end of the adsorbent 20 close to the carrying body 10; the adsorbent 20 is provided with an adsorption hole 212, the adsorption hole 212 is connected to the vacuum air path, and the adsorption hole 212 is used to adsorb the wafer; the carrying device also includes a driving device 30, the driving device 30 is connected to the side of the adsorbent 20 close to the carrying body 10, and is used to drive the adsorbent 20 to reciprocate along the normal direction of the surface of the carrying body 10. The carrying device adsorbs different areas of the test piece through the adsorbents 20 distributed at different positions on the carrying body 10, so that different areas of the test piece can be flattened by vacuum adsorption, thereby improving the detection accuracy of the test piece.

[0114] In an optional embodiment, the adsorption member 20 includes an adsorption portion 21 and a support portion 22, one end of the support portion 22 is connected to the driving device 30, and the other end is connected to the adsorption portion 21, and the adsorption hole 212 is set through the adsorption portion 21 and the support portion 22. Specifically, the adsorption portion 21 is connected to the support portion 22. In a specific embodiment, the adsorption portion 21 and the support portion 22 are integrally arranged. When the adsorption portion 21 approaches the wafer, the wafer approaches the adsorption portion 21 under the vacuum adsorption of the adsorption portion 21, and is adsorbed by the adsorption portion 21, and moves toward one side of the receiving groove 11 together with the adsorption member 20, completing the warping correction process.

[0115] It can be understood that, in another embodiment, the adsorption portion 21 is movably connected to the supporting portion 22, and the adsorption portion 21 can rotate relative to the supporting portion 22. When the adsorption portion 21 approaches the wafer, the adsorption portion 21 interferes with the wafer and rotates, so that the plane where the adsorption portion 21 is located is parallel to the warping surface of the wafer, so that the adsorption portion 21 can more effectively complete the adsorption process of the wafer. After completing the adsorption process, the adsorption portion 21 moves to one side of the accommodating groove 11 under the drive of the driving device 30, and under the limitation of the supporting portion 22, the axial direction of the adsorption portion 21 is collinear with the axial direction of the supporting portion 22, so as to ensure that the wafer is corrected for warping under the drive of the driving device 30, thereby improving the detection accuracy of the wafer.

[0116] In a preferred embodiment, the diameter of the support portion 22 is smaller than the inner diameter of the receiving groove 11, and the diameter of the adsorption portion 21 is larger than the inner diameter of the receiving groove 11. Specifically, in one embodiment, when the adsorption member 20 does not adsorb the wafer, the adsorption portion 21 protrudes from the bearing surface of the bearing body 10 and can move along the normal direction of the bearing surface under the drive of the driving device 30. In order to ensure that the support portion 22 can move freely in the receiving groove 11, the diameter of the support portion 22 is smaller than the diameter of the receiving groove 11. In a preferred embodiment, the diameter of the support portion 22 is less than half the diameter of the receiving groove 11.

[0117] It is understandable that, in another embodiment, the inner diameter of the receiving groove 11 gradually increases along the first direction. Specifically, in order to ensure that the adsorbent 20 has a larger range of motion in the receiving groove 11, the aperture of the receiving groove 11 close to the bearing surface is set to be larger than the aperture of the bottom of the receiving groove 11, so that when the adsorbent 20 moves in the receiving groove 11, the adsorbent 20 is prevented from being blocked by the edge of the receiving groove 11 close to the bearing surface, thereby affecting the range of motion of the adsorbent 20. In a preferred embodiment, the receiving groove 11 is a trapezoidal groove.

[0118] In an optional embodiment, the adsorption member 20 further includes a rotating member, one end of which is connected to the support portion 22, and the other end is connected to the adsorption portion 21, and the rotating member is used to drive the adsorption portion 21 to rotate. Specifically, the adsorption portion 21 is provided with the adsorption hole 212, and the adsorption hole 212 is connected to the vacuum air path, so as to ensure that the adsorption portion 21 can adsorb the wafer. When the adsorption portion 21 approaches and contacts the wafer, the rotating member drives the adsorption portion 21 to rotate, so that the adsorption surface 211 of the adsorption member 20 is parallel to the surface of the wafer, so as to better complete the adsorption process of the wafer. In one embodiment, the rotating member is integrally arranged with the adsorption portion 21 or the support portion 22.

[0119] In an optional embodiment, a groove is provided on one side of the support portion 22 close to the adsorption portion 21, and a rotating portion is provided on one side of the adsorption portion 21 close to the support portion 22, and the support portion 22 is rotatably connected to the adsorption portion 21 through the rotating portion. Specifically, the rotating portion is received in the groove, and the rotating portion can rotate in the groove, so as to adjust the direction of the adsorption surface 211 of the adsorption portion 21, so that when the adsorption portion 21 is used to adsorb the wafer, the adsorption surface 211 of the adsorption member 20 is parallel to the surface of the wafer, so as to better complete the adsorption process of the wafer.

[0120] In an optional embodiment, the bottom of the receiving groove 11 is a first curved surface structure, and the side of the support portion 22 close to the receiving groove 11 is a second curved surface structure, and the first curved surface structure abuts against the second curved surface structure. Specifically, when the bottom of the receiving groove 11 is a plane, and the side of the support portion 22 close to the bottom of the receiving groove 11 is a plane structure, when the support portion moves in the receiving groove 11, the end edge of the side of the support portion 22 close to the receiving groove 11 is easy to collide with the side wall of the receiving groove 11, thereby affecting the service life of the adsorption portion 21. When the bottom of the receiving groove 11 is a curved surface structure, and the bottom of the support portion 22 is a curved surface structure, when the bottom of the support portion 22 abuts against the bottom of the receiving groove 11, the abutment area between the support portion 22 and the receiving groove 11 can be increased, thereby increasing the stability of the support portion 22 when it is set in the initial position. In a preferred embodiment, the diameter of the first curved surface structure is the same as the diameter of the second curved surface structure, thereby ensuring that when the bottom of the support portion 22 abuts against the bottom of the accommodating groove 11, the first curved surface structure portion of the support portion 22 and the second curved surface structure at the bottom of the accommodating groove 11 can fit together, thereby improving the stability of the relative position of the support portion 22 and the accommodating groove 11.

[0121] In an optional embodiment, the supporting body 10 and the adsorption component 20 are made of aluminum alloy or ceramic material.

[0122] In an optional embodiment, the rotating portion is detachably connected to the supporting portion 22, and the adsorption hole 212 is arranged through the adsorption portion 21. Specifically, when the adsorption portion 21 contacts the wafer multiple times, the adsorption portion 21 may collide with the wafer or with other parts of the supporting device. In order to increase the service life of the supporting device, the adsorption portion 21 and the supporting portion 22 may be detachably connected. When the adsorption portion 21 is damaged or the adsorption hole 212 is blocked, the supporting device can be maintained by replacing the adsorption portion 21, thereby avoiding the problem that the supporting device cannot be used only due to damage to the adsorption portion 21.

[0123] The present invention also proposes a bearing system, which includes a bearing device as described in any of the above-mentioned embodiments. The specific structure of the bearing device refers to the above-mentioned embodiments. Since the bearing device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0124] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of the embodiments of the present application. It should be understood that the above description is only the specific implementation method of the embodiments of the present application and is not intended to limit the protection scope of the embodiments of the present application. Any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application should be included in the protection scope of the embodiments of the present application.

Claims

1. A warpage correction method, characterized in that: The method is applied to a carrying device, the carrying device comprises a carrying body, a plurality of adsorbents, a distance measuring assembly and a plurality of driving devices, the carrying surface of the carrying body is provided with a receiving groove, one end of the adsorbent away from the receiving groove is provided with an adsorption surface, the adsorption surface is used to adsorb the object to be measured, and the other end is received in the receiving groove and connected to the driving device and corresponds to the driving device one by one, and the driving device is used to drive the corresponding adsorbent to move along the normal direction of the carrying surface alone, and the method comprises: Acquiring a first distance between the adsorption surface of the adsorption member and the object to be tested; When a first distance between the adsorption surface of the adsorption component and the object to be tested is greater than a first preset distance and less than or equal to a second preset distance, the adsorption component is determined to be a first target adsorption component, and the second preset distance is greater than the first preset distance; Controlling the driving device to drive the first target adsorption component to move toward the object to be tested; When the first distance is less than or equal to the first preset distance, controlling the first target adsorption component to adsorb the object to be tested; Controlling the driving device to drive the adsorbent to move in a direction away from the test object until the bottom of the first target adsorbent abuts against the bottom of the receiving groove; The adsorption member includes an adsorption part and a support part, one end of the support part is connected to the driving device, and the other end is movably connected to the adsorption part, the adsorption part can rotate relative to the support part, and the control of the driving device drives the first target adsorption member to move toward the test object, including: determining the warpage of the test piece according to the first distance; Determining a moving distance of the driving device according to the warping degree; The driving device is controlled to drive the first target adsorption component to move according to the moving distance.

2. The warpage correction method according to claim 1, characterized in that: The step of obtaining a first distance between the adsorption surface of the adsorption member and the object to be tested further includes: When the first distance is greater than a second preset distance, the adsorbent is determined to be a second target adsorbent, and the second preset distance is greater than the first preset distance; The step of controlling the driving device to drive the first target adsorption component to move toward the object to be tested further includes: Real-time monitoring of a second distance between the adsorption surface of the second target adsorption component and the object to be tested; When the second distance is less than or equal to the first preset distance, controlling the second target adsorbing component to adsorb the test object; The driving device is controlled to drive the second target adsorption component to move in a direction away from the test object until the bottom of the second target adsorption component abuts against the bottom of the accommodating groove.

3. The warpage correction method according to claim 1, characterized in that: The step of obtaining a first distance between the adsorption surface of the adsorption member and the object to be tested further includes: When a first distance between the adsorption surface of the adsorption component and the object to be measured is less than or equal to a first preset distance, determining that the adsorption component is a third target adsorption component; The third target adsorption component is controlled to adsorb the test object.

4. The warpage correction method according to claim 1, characterized in that: Determining the moving distance of the driving device according to the warping degree includes: Adjusting a first compensation height of the first target adsorption component along a normal direction of the carrying surface according to the warping degree; The moving distance of the driving device is determined according to the first distance and the first compensation height.

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