Sputtered thin film pressure core assembly, pressure sensor and packaging method

Abstract

The present invention provides a sputtered film pressure core assembly, a pressure sensor and a packaging method. The sputtered film pressure core assembly includes a base and a sputtered film sensitive element. The base is provided with a receiving hole. The sputtered film sensitive element is received in the receiving hole. The lower edge of the sputtered film sensitive element is welded and sealed at the connection point with the lower end edge of the receiving hole.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of pressure sensors, and in particular to a sputtered thin film pressure core assembly, a pressure sensor, and a packaging method. Background Art

[0002] The sputtered thin film pressure sensor adopts a strain gauge resistor structure. On a stainless steel substrate, ion beam sputtering coating, ion beam etching and micromachining processes are combined to form a thin film pressure sensitive structure.

[0003] In the prior art, sputtered thin film pressure sensors, taking patent CN202010651589.7 as an example, usually weld the connection between the sputtered thin film sensitive element and the side of the core seat, that is, welding on the arc surface. On the one hand, it is inconvenient to operate, and on the other hand, it has high process requirements, high cost and low integration. Summary of the Invention

[0004] The purpose of the embodiments of the present invention is to provide a sputtered thin film pressure core assembly, a pressure sensor and a packaging method, aiming to solve the problems of high installation cost, inconvenient operation and low integration of sputtered thin film sensitive elements of sputtered thin film pressure sensors in the prior art.

[0005] In order to solve the above technical problems, an embodiment of the present invention provides a sputtering thin film pressure core assembly, which includes:

[0006] The base is provided with a receiving hole;

[0007] The sputtered thin film sensitive element is accommodated in the accommodating hole, and the lower edge of the sputtered thin film sensitive element is welded and sealed at the connection point with the lower end edge of the accommodating hole.

[0008] The present invention sets a base, and the base is provided with a accommodating hole. The sputtered thin film sensitive element is accommodated in the accommodating hole. The button-type installation method has high integration. The lower edge of the sputtered thin film sensitive element and the lower end edge of the accommodating hole are welded and sealed. In this way, plane-to-plane welding is achieved. Compared with welding on the side wall (curved surface), it is convenient to operate, the welding process is simple, and the cost is low.

[0009] Preferably, in the sputtering thin film pressure core assembly, the accommodating hole is a stepped hole that is wider at the top and narrower at the bottom, and the first stepped surface of the accommodating hole supports the sputtering thin film sensitive element.

[0010] Preferably, in the sputtered thin film pressure core assembly, upper and lower ends of the base are flush with upper and lower ends of the sputtered thin film sensitive element.

[0011] In order to achieve the above-mentioned object, the present invention provides a sputtered thin film pressure sensor, comprising the above-mentioned sputtered thin film pressure core assembly.

[0012] Preferably, in the sputtered thin film pressure sensor, the accommodating hole is a multi-stepped hole that is wide at the top and narrow at the bottom;

[0013] The sputtered thin film pressure sensor further comprises a substrate, the substrate is provided with a clearance hole for avoiding the sputtered thin film sensitive element, and the substrate is supported on a second step surface located above the accommodating hole.

[0014] Preferably, in the sputtered thin film pressure sensor, the sputtered thin film pressure sensor further comprises:

[0015] A housing having a cavity and a medium channel communicating with the cavity;

[0016] The first sealing member is provided between the base and the bottom wall of the cavity to separate the cavity into an upper cavity and a lower cavity which are isolated from each other. The lower cavity is communicated with the medium channel.

[0017] Preferably, in the sputtered thin film pressure sensor, the sputtered thin film pressure sensor further includes a connector and an electrical connector, the electrical connector is riveted inside the upper edge of the shell, and the connector is provided between the electrical connector and the base.

[0018] Preferably, in the sputtered thin film pressure sensor, a third step surface is formed on the inner wall of the housing, the third step surface supports the electrical connector, and a second sealing member is provided between the electrical connector and the third step surface.

[0019] In order to achieve the above object, the present invention further provides a packaging method for the above-mentioned sputtered thin film pressure sensor, the packaging method comprising:

[0020] Installing the sputtered thin film sensitive element in the receiving hole;

[0021] Turning the sputtered thin film sensor and the base upside down as a whole, and making the upper parts of the sputtered thin film sensor and the base flush;

[0022] The upward edge of the sputtering film sensitive element and the upward end edge of the accommodating hole are welded and sealed to form a sputtering film pressure core assembly.

[0023] Preferably, in the packaging method, the packaging method further comprises:

[0024] The welded sputtering film pressure core assembly is placed upright and installed into the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0026] Figure 1 A schematic diagram of an embodiment of a sputtered thin film pressure sensor provided by an embodiment of the present invention;

[0027] Figure 2 for Figure 1 A cross-sectional view of a sputtered thin film pressure sensor;

[0028] Figure 3 for Figure 1 A three-dimensional diagram of the middle structure;

[0029] Figure 4 for Figure 3 Schematic diagram of the decomposition;

[0030] Figure 5 for Figure 3 sectional view of

[0031] Figure 6 for Figure 5 Inverted cross-section view.

[0032] Description of the accompanying drawings of the present invention:

[0033] Label name Label name 1 base 31 Make way hole 11 Accommodation hole 4 case 111 Lower edge 41 Upper cavity 112 First step surface 42 Lower cavity 113 Second step surface 43 Media Channel 114 The third step surface 5 First seal 2 Sputtered thin film sensor 6 Connectors 21 bottom edge 7 Electrical connector 3 substrate 8 Second seal

[0034] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0037] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0038] The present invention provides a sputtering thin film pressure core assembly, please refer to Figures 4 to 6 The sputtering film pressure core assembly includes a base 1 and a sputtering film sensitive element 2. The base 1 is penetrated by a receiving hole 11. The sputtering film sensitive element 2 is received in the receiving hole 11, and the lower edge 21 of the sputtering film sensitive element 2 is welded and sealed to the lower end edge 111 of the receiving hole 11.

[0039] In the prior art, the sputtered thin film pressure sensor usually welds the connection between the sputtered thin film sensitive element 2 and the side of the core seat. This method is inconvenient to operate, has high process requirements, high installation cost and low integration.

[0040] The present invention provides a base 1, and the base 1 is provided with a receiving hole 11, and the sputtered thin film sensitive element 2 is received in the receiving hole 11. The button-type installation method has a high degree of integration, and then the lower edge 21 of the sputtered thin film sensitive element 2 is welded and sealed at the connection with the lower end edge 111 of the receiving hole 11. In this way, plane-to-plane welding is achieved. Compared with welding on the side wall (curved surface), the operation is convenient, the welding process is simple, and the cost is low.

[0041] See also Figure 6 , Figure 6 The schematic diagram shows the inversion of the sputtered thin film sensitive element 2 and the base 1 as a whole. During welding, the sputtered thin film sensitive element 2 is installed in the accommodating hole 11, and the sputtered thin film sensitive element 2 and the base 1 are inverted as a whole, and the upward parts of the sputtered thin film sensitive element 2 and the base 1 are flush. The upward edge of the sputtered thin film sensitive element 2 and the upward end edge of the accommodating hole 11 are welded and sealed to form a sputtered thin film pressure core assembly.

[0042] Specifically, the accommodating hole 11 is a stepped hole that is wider at the top and narrower at the bottom, and the first stepped surface 112 of the accommodating hole 11 supports the sputtered thin film sensitive element 2 .

[0043] If the base 1 is too high, it will be inconvenient to machine and will take up a lot of space. If the base 1 is too low, it will be difficult to ensure that the welding surfaces are completely flush during welding. In this embodiment, the upper and lower ends of the base 1 are flush with the upper and lower ends of the sputtered thin-film sensor 2. This not only facilitates welding, but also ensures that the welding surfaces are completely flush and the weld is continuous. To improve welding quality, the lower end of the sputtered thin-film sensor 2 is clearance-fitted with the lower end of the receiving hole 11.

[0044] To achieve this, see Figures 1 to 3 The present invention also provides a sputtered thin film pressure sensor, which includes the above-mentioned sputtered thin film pressure core assembly.

[0045] In order to further improve the integration, the accommodating hole 11 is a multi-step stepped hole that is wide at the top and narrow at the bottom; the sputtered thin film pressure sensor also includes a substrate 3, and the substrate 3 is provided with a makeshift hole 31 for avoiding the sputtered thin film sensitive element 2. The substrate 3 is supported on a second step surface 113 located at the upper part of the accommodating hole 11. In this way, the installation space can be further saved, the overall volume can be reduced, and the integration can be improved.

[0046] The sputtered thin-film pressure sensor also includes a housing 4 and a first sealing member 5. The housing 4 has a chamber and a media channel 43 communicating with the chamber. The first sealing member 5 is disposed between the base 1 and the bottom wall of the chamber to separate the chamber into an upper chamber 41 and a lower chamber 42, which are isolated from each other. The lower chamber 42 communicates with the media channel 43. In this embodiment, the first sealing member 5 is an O-ring. The first sealing member 5 isolates the upper chamber 41 from the lower chamber 42.

[0047] Furthermore, the sputtered thin film pressure sensor also includes a connector 6 and an electrical connector 7. The electrical connector 7 is riveted to the upper edge of the housing 4, and the connector 6 is disposed between the electrical connector 7 and the base 1. In this embodiment, the connector 6 is a sleeve, and the sleeve is disposed between the electrical connector 7 and the base 1 to complete the abutment installation.

[0048] For convenience, a third step surface 114 is formed on the inner wall of the shell 4, and the third step surface 114 supports the electrical connector 7, and a second seal 8 is provided between the electrical connector 7 and the step surface, so that the upper cavity 41 can be isolated from the outside world. In this embodiment, the second seal 8 is an O-ring.

[0049] In order to achieve the above object, the present invention further provides a packaging method for the above-mentioned sputtered thin film pressure sensor, the packaging method comprising:

[0050] Step S210: Install the sputtered thin film sensor 2 in the receiving hole 11;

[0051] Specifically, see Figure 5 The lower end of the sputtered thin film sensitive element 2 is clearance-matched with the lower end of the accommodating hole 11 .

[0052] Step S220: turning the sputtered thin film sensor 2 and the base 1 upside down as a whole, and making the upper parts of the sputtered thin film sensor 2 and the base 1 flush;

[0053] Specifically, see Figure 6 In this embodiment, the upper and lower ends of the sputtered thin film sensitive element 2 are flush with the upper and lower ends of the base 1. After the sputtered thin film sensitive element 2 and the base 1 are inverted as a whole and placed on a plane, the upper parts of the sputtered thin film sensitive element 2 and the base 1 are flush.

[0054] Step S230: welding and sealing the upward edge of the sputtered thin film sensor 2 and the upward end edge of the accommodating hole 11 to form a sputtered thin film pressure core assembly.

[0055] The present invention provides a base 1, and the base 1 is provided with a receiving hole 11, and the sputtered thin film sensitive element 2 is received in the receiving hole 11. The button-type installation method has a high degree of integration, and then the lower edge 21 of the sputtered thin film sensitive element 2 is welded and sealed at the connection with the lower end edge 111 of the receiving hole 11. In this way, plane-to-plane welding is achieved. Compared with welding on the side wall (curved surface), the operation is convenient, the welding process is simple, and the cost is low.

[0056] The packaging method includes placing the welded sputtered thin film pressure core assembly upright and installing it into the housing 4, and also includes installing the first sealing member 5 and other steps, which will not be described in detail here.

[0057] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's description and drawings, or direct / indirect applications in other related technical fields, within the scope of the present invention are included in the patent protection scope of the present invention.

Claims

1. A method for packaging a sputtered thin film pressure sensor, characterized in that: The sputtered thin film pressure sensor includes a sputtered thin film pressure core assembly, the sputtered thin film pressure core assembly includes a base having an accommodating hole therethrough and a sputtered thin film sensitive element accommodated in the accommodating hole, and the upper and lower ends of the base are respectively flush with the upper and lower ends of the sputtered thin film sensitive element; The packaging method comprises: Installing the sputtered thin film sensitive element in the accommodating hole; Turning the sputtered thin film sensor and the base upside down as a whole, and making the upper parts of the sputtered thin film sensor and the base flush; The upward edge of the sputtering film sensitive element and the upward end edge of the accommodating hole are welded and sealed to form the sputtering film pressure core assembly.

2. The packaging method of the sputtered thin film pressure sensor according to claim 1, wherein: The accommodating hole is a stepped hole that is wider at the top and narrower at the bottom, and a first stepped surface of the accommodating hole supports the sputtered thin film sensitive element.

3. The packaging method of the sputtered thin film pressure sensor according to claim 1, wherein: The receiving hole is a multi-step hole that is wide at the top and narrow at the bottom; The sputtered thin film pressure sensor further comprises a substrate, the substrate is provided with a clearance hole for avoiding the sputtered thin film sensitive element, and the substrate is supported on a second step surface located above the accommodating hole.

4. The packaging method of a sputtered thin film pressure sensor according to claim 1, wherein: The sputtered thin film pressure sensor further comprises: A housing having a cavity and a medium channel communicating with the cavity; The first sealing member is provided between the base and the bottom wall of the cavity to separate the cavity into an upper cavity and a lower cavity which are isolated from each other. The lower cavity is communicated with the medium channel.

5. The packaging method of the sputtered thin film pressure sensor according to claim 4, wherein: The sputtered thin film pressure sensor further includes a connector and an electrical connector. The electrical connector is riveted inside the upper edge of the shell, and the connector is disposed between the electrical connector and the base.

6. The packaging method of the sputtered thin film pressure sensor according to claim 5, wherein: A third step surface is formed on the inner wall of the housing, the third step surface supports the electrical connector, and a second sealing member is provided between the electrical connector and the third step surface.

7. The packaging method of a sputtered thin film pressure sensor according to claim 1, wherein: The packaging method further comprises: The welded sputtering film pressure core assembly is placed upright and installed into the housing.

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