Distance sensor and method of manufacturing the same

Abstract

The present invention relates to the technical field of distance sensors, and provides a distance sensor and a manufacturing method thereof. The distance sensor comprises a substrate, a light-emitting chip, a sensing chip, a partitioning rubber wall and a light-blocking rubber shell, wherein the light-emitting chip and the sensing chip are mounted on the substrate, the partitioning rubber wall is convexly arranged on the sensing chip, the light-blocking rubber shell is mounted on the substrate, and the partitioning rubber wall separates the internal chamber of the light-blocking rubber shell into a first chamber and a second chamber. The distance sensor and the manufacturing method thereof provided by the present invention adopt a partitioning rubber wall convexly arranged between the light-sensitive area of ​​the transmitting end and the light-sensitive area of ​​the receiving end, and the partitioning rubber wall can completely isolate the light interference between the first chamber and the second chamber, thereby solving the technical problem of low detection accuracy of the existing distance sensor, thereby improving the detection accuracy of the distance sensor, and the light-blocking rubber shell will not crush the light-emitting chip and the sensing chip when installed.

Description

Technical Field

[0001] The present invention relates to the technical field of distance sensors, and in particular to a distance sensor and a manufacturing method thereof. Background Art

[0002] Distance sensors are sensors that detect the approach of objects in a non-contact manner. Because they can detect in a non-contact manner without wearing or damaging the detected object, distance sensors are widely used in various industries. For example, ATMs use distance sensors to detect whether a cashier is approaching, production lines use distance sensors to count products, smartphones use distance sensors to detect whether the user has left, and smart headphones use distance sensors to detect the distance from the human ear, and so on.

[0003] Please refer to Figure 1 and Figure 2 The distance sensor includes a substrate 11, a transmitting chip 12, a sensing chip 13 and a plastic shell 14. The transmitting chip 12 and the sensing chip 13 are installed on the substrate 11 at intervals. The sensing chip 13 includes a transmitting end photosensitive area 15 and a receiving end photosensitive area 16. The plastic shell 14 is covered on the substrate 11 and separates two chambers, wherein the transmitting chip 12 and the transmitting end photosensitive area 15 are located in one chamber, and the receiving end photosensitive area 16 is located in another chamber. The working principle of the distance sensor is that part of the light emitted by the transmitting chip 12 directly reaches the transmitting end photosensitive area 15, and the other part of the light emitted by the transmitting chip 12 is emitted from the plastic shell 14 and encounters the detection object 17 and then reflects back to the receiving end photosensitive area 16. According to the time difference between the light received by the transmitting end photosensitive area 15 and the receiving end photosensitive area 16, the distance of the detection object 17 is calculated.

[0004] According to the relevant technology known by the inventor, please refer to Figure 2 and Figure 3 The plastic housing 14 in the distance sensor has two chambers, but the two chambers are not completely separated. In order to prevent the partition wall 18 from crushing the sensing chip 13, a gap 19 is formed between the partition wall 18 and the sensing chip 13, causing the light in the two chambers to affect each other, and the detection accuracy of the distance sensor is reduced. Summary of the invention

[0005] The object of the present invention is to provide a distance sensor and a manufacturing method thereof, aiming to solve the technical problem of low detection accuracy of the existing distance sensor.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a distance sensor, including a substrate, a sensing chip, a partitioning rubber wall and a light-blocking rubber shell, the light-emitting chip is installed on the substrate; the sensing chip is installed on the substrate and is spaced apart from the light-emitting chip, the sensing chip includes a transmitting end photosensitive area close to the light-emitting chip and a receiving end photosensitive area away from the light-emitting chip; the partitioning rubber wall is protruding from the sensing chip and is located between the transmitting end photosensitive area and the receiving end photosensitive area; the light-blocking rubber shell is installed on the substrate, the top of the partitioning rubber wall is connected to the light-blocking rubber shell, and the internal chamber of the light-blocking rubber shell is divided into a first chamber and a second chamber, the receiving end photosensitive area is located in the first chamber, the light-emitting chip and the transmitting end photosensitive area are located in the second chamber, and the light-blocking rubber shell also has a first light hole connected to the first chamber and a second light hole connected to the second chamber.

[0007] In one of the embodiments, the substrate includes a bottom plate and a flange circumferentially arranged around the bottom plate, the flange has a notch, and the light-shielding plastic shell has a protrusion matched with the notch.

[0008] In one embodiment, the separation glue wall spans across the sensing chip, two ends of the separation glue wall respectively abut against the inner wall of the flange, and the top of the separation glue wall is flush with the top of the flange.

[0009] In one embodiment, the distance sensor further includes two transparent adhesive blocks, and the two transparent adhesive blocks are respectively filled in the first chamber and the second chamber.

[0010] In one embodiment, the distance sensor further includes a lens, which is integrally formed with the transparent plastic block located in the first chamber, and the lens is used to guide the incident light passing through the first light hole to converge to the photosensitive area of ​​the receiving end.

[0011] In one embodiment, the transparent adhesive block located in the second chamber has a third light hole whose position corresponds to the position of the light-emitting chip.

[0012] In one of the embodiments, the transparent adhesive block is flush with the separating adhesive wall.

[0013] In one embodiment, the transparent plastic block is higher than the partitioning plastic wall, a clamping groove is formed between the two transparent plastic blocks, and the light-shielding plastic shell has a partition wall extending into the clamping groove and fitting with the partitioning plastic wall.

[0014] In one embodiment, the light-shielding plastic shell is a plastic shell or a molded plastic shell.

[0015] The present invention also provides a distance sensor, comprising a substrate, a light-emitting chip, a sensing chip, a light-blocking plastic shell and a separating plastic wall, wherein the light-emitting chip and the sensing chip are installed on the substrate at intervals, the sensing chip comprises a transmitting end photosensitive area close to the light-emitting chip and a receiving end photosensitive area away from the light-emitting chip, the light-blocking plastic shell is installed on the substrate, the top of the light-blocking plastic shell has a pore, one end of the separating plastic wall is connected to the inner side wall of the pore, the other end of the separating plastic wall is connected to the sensing chip and is located between the transmitting end photosensitive area and the receiving end photosensitive area, the separating plastic wall separates the internal chamber of the light-blocking plastic shell into a first chamber and a second chamber, and the light-blocking plastic shell also has a first light hole connected to the first chamber and a second light hole connected to the second chamber.

[0016] The present invention also provides a method for manufacturing a distance sensor, comprising:

[0017] Providing a substrate, and installing the light emitting chip and the sensing chip on the substrate at intervals;

[0018] Forming a separation glue wall between the transmitting end photosensitive area and the receiving end photosensitive area on the sensing chip;

[0019] A light-blocking plastic shell covering the light-emitting chip and the sensing chip is formed on the substrate by a molding injection process; wherein the top of the partitioning plastic wall is connected to the light-blocking plastic shell, and a second light-blocking wall separates the internal chamber of the light-blocking plastic shell into a first chamber and a second chamber, the receiving end photosensitive area is located in the first chamber, the light-emitting chip and the transmitting end photosensitive area are located in the second chamber, and the light-blocking plastic shell also has a first light hole connected to the first chamber and a second light hole connected to the second chamber.

[0020] The beneficial effects of the distance sensor and the manufacturing method thereof provided by the present invention are: a separation rubber wall is protruded between the light-sensitive area of ​​the transmitting end and the light-sensitive area of ​​the receiving end, and the separation rubber wall can completely isolate the light interference between the first chamber and the second chamber, thereby solving the technical problem of low detection accuracy of the existing distance sensor, thereby improving the detection accuracy of the distance sensor, and the light-emitting chip and the sensing chip will not be crushed when the light-blocking rubber shell is installed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1This is the working principle diagram of the distance sensor;

[0023] Figure 2 An exploded view of a distance sensor in the related art;

[0024] Figure 3 An internal view of a distance sensor in the related art;

[0025] Figure 4 It is an exploded view of the distance sensor in the third embodiment;

[0026] 5(a) to (f) are manufacturing flow charts of the manufacturing method of the distance sensor in the third embodiment;

[0027] Figure 6 is an exploded view of the distance sensor in the fourth embodiment;

[0028] 7(a) to (e) are manufacturing flow charts of the manufacturing method of the distance sensor in the fourth embodiment;

[0029] Figure 8 is an exploded view of yet another distance sensor in the fourth embodiment;

[0030] Fig. 9 for Figure 8 A cross-sectional view of the light-blocking plastic shell of the mid-range sensor;

[0031] 10(a) to (h) are manufacturing flow charts of another manufacturing method of a distance sensor in Embodiment 4;

[0032] Fig.11 It is an exploded view of the distance sensor in the fifth embodiment;

[0033] 12( a ) to ( g ) are manufacturing flow charts of the manufacturing method of the distance sensor in the fifth embodiment.

[0034] Among them, the reference numerals in the figure are:

[0035] 11—substrate, 12—transmitter chip, 13—sensor chip, 14—plastic housing, 15—transmitter photosensitive area, 16—receiver photosensitive area, 17—detection object, 18—partition wall, 19—gap;

[0036] 100—base plate, 110—bottom plate, 120—flange, 121—notch;

[0037] 200—luminescent chip;

[0038] 300—sensing chip, 310—transmitter photosensitive area, 320—receiver photosensitive area;

[0039] 410—dividing adhesive wall, 430—transparent adhesive block, 431—third optical hole, 432—clamping groove, 440—lens, 450—first optical filter, 460—second optical filter;

[0040] 500—light-blocking plastic shell, 501—partition wall, 510—first chamber, 520—second chamber, 530—first light hole, 540—second light hole, 550—bump, 560—aperture;

[0041] 610—molding jig, 611—hole cover, 630—glue dispensing head. DETAILED DESCRIPTION

[0042] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0043] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0045] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] Embodiment 1

[0047] Please refer to Figure 4 , Figure 8 and Fig. 9 A distance sensor includes a substrate 100, a light-emitting chip 200, a sensing chip 300, a partitioning adhesive wall 410 and a light-blocking adhesive shell 500. The light-emitting chip 200 is mounted on the substrate 100. The sensing chip 300 is mounted on the substrate 100 and is spaced apart from the light-emitting chip 200. The sensing chip 300 includes a transmitting end photosensitive area 310 close to the light-emitting chip 200 and a receiving end photosensitive area 320 away from the light-emitting chip 200. The partitioning adhesive wall 410 is protruding from the sensing chip 300 and is located between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320. The light-blocking adhesive shell 500 is mounted on the substrate 100, and the top of the partitioning adhesive wall 410 is connected to the light-blocking adhesive shell 500, and the internal chamber of the light-blocking adhesive shell 500 is separated into a first chamber 510 and a second chamber 520 (please refer to Figures 7 and Fig. 9 ), the receiving end photosensitive area 320 is located in the first chamber 510, the light-emitting chip 200 and the transmitting end photosensitive area 310 are located in the second chamber 520, and the light-blocking plastic shell 500 also has a first light hole 530 connected to the first chamber 510 and a second light hole 540 connected to the second chamber 520.

[0048] The distance sensor provided by the present invention adopts a protruding separation rubber wall 410 between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320. When the light-blocking rubber shell 500 is installed on the substrate 100, the separation rubber wall 410 can completely isolate the light interference between the first chamber 510 and the second chamber 520, thereby solving the technical problem of low detection accuracy caused by cavity light leakage of the existing distance sensor, thereby improving the detection accuracy of the distance sensor, and the light-emitting chip 200 and the sensing chip 300 will not be crushed when the light-blocking rubber shell 500 is installed.

[0049] It should be noted that the “abutment” mentioned in this embodiment includes the situation where the two are connected to each other, and also includes the situation where the two are in contact with each other but not physically connected.

[0050] The substrate 100 includes but is not limited to a printed circuit board, a bismaleimide triazine substrate, a glass fiber substrate or a direct copper clad substrate. The light emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The light emitting chip 200 can be, for example, a laser chip. The sensor chip 300 is electrically connected to the substrate 100 through a wire bonding process.

[0051] The light-shielding plastic shell 500 and the partitioning plastic wall 410 can be made of light-proof epoxy resin, acrylate resin or polyurethane independently. Optionally, the light-shielding plastic shell 500 and the partitioning plastic wall 410 are both made of black plastic.

[0052] The light-blocking plastic shell 500 can be selected as a plastic shell, which is manufactured in advance through an injection molding process and then installed on the substrate 100; the light-blocking plastic shell 500 can also be selected as a molded plastic shell. Using the molding process, the mold is pressed on the substrate 100 with the light-emitting chip 200 and the sensing chip 300 installed, and the glue is injected to form the light-blocking plastic shell 500 on the substrate 100.

[0053] In some embodiments, please refer to Figure 4 As shown in FIG5 , the substrate 100 includes a bottom plate 110 and a flange 120 arranged circumferentially around the bottom plate 110, the flange 120 has a notch 121, and the light-shielding plastic shell 500 has a convex block 550 adapted to the notch 121. When the light-shielding plastic shell 500 is a molded plastic shell, the notch 121 is provided to facilitate molding and molding. When the light-shielding plastic shell 500 is a plastic shell, the notch 121 is provided to facilitate positioning, thereby improving the docking accuracy between the plastic shell and the substrate 100, avoiding offset or even gap between the two, preventing light leakage, protecting the light-emitting chip 200 and the sensing chip 300 located inside the light-shielding plastic shell 500 from water vapor rust in the external environment, reducing the difficulty of alignment between the light-shielding plastic shell 500 and the substrate 100, thereby reducing the manufacturing cost and improving the airtightness of the distance sensor.

[0054] Specifically, please refer to Figure 4 The partitioning adhesive wall 410 spans the sensing chip 300, and the two ends of the partitioning adhesive wall 410 respectively abut against the inner wall of the flange 120, and the top of the partitioning adhesive wall 410 is flush with the top of the flange 120. In this way, the partitioning adhesive wall 410 separates the substrate 100 into two independent parts to prevent light interference.

[0055] In some embodiments, please refer to Figure 4 and Figure 6 The distance sensor further includes two transparent adhesive blocks 430, which are respectively filled in the first chamber 510 and the second chamber 520. The transparent adhesive blocks 430 are manufactured by a molding process.

[0056] Please refer to Figure 4 When the substrate 100 has a notch 121, the colloid can enter the first chamber 510 and the second chamber 520 through the notch 121, and after the transparent plastic block 430 is formed, the transparent plastic block 430 located at the notch 121 is removed to facilitate the secondary molding to form the light-blocking plastic shell 500.

[0057] Specifically, please refer to Figure 4 The distance sensor further includes a lens 440, which is integrally formed with the transparent plastic block 430 located in the first chamber 510, and is used to guide the incident light through the first light hole 530 to converge to the receiving end photosensitive area 320. The lens 440 is located between the first light hole 530 and the receiving end photosensitive area 320.

[0058] The inventors understand that in the related art, some distance sensors need to be provided with mounting structures at both ends of the first light hole 530, so as to facilitate the installation of the filter at the top of the first light hole 530, and the lens 440 is bonded to the bottom of the first light hole 530. However, since the lens 440 is very small and the edge thickness is only 0.1 mm, if it is necessary to provide a mounting structure for mounting the lens 440 on the end wall of the first light hole 530, production and manufacturing are very difficult, and the product defect rate is high. In addition, the lens 440 is connected by glue, and the glue is easily liquefied or even loses its viscosity when passing through the SMT (Surface Mounted Technology) high-temperature furnace, causing the lens 440 to fall off easily. In this embodiment, the lens 440 and the transparent adhesive block 430 are integrally molded, and there is no need to provide a mounting structure on the end wall of the first light hole 530, which simplifies the manufacturing process, reduces the investment in automation equipment, improves production efficiency, and reduces production costs.

[0059] Specifically, please refer to Fig.11 12(e), the transparent plastic block 430 located in the second chamber 520 has a third light hole 431 corresponding to the position of the light emitting chip 200. The light emitted by the light emitting chip 200 is emitted directly through the third light hole 431 without passing through the transparent plastic block 430, and there is no refraction loss, which is conducive to improving the detection accuracy of the distance sensor.

[0060] Among them, the processing of the third light hole 431 can use a molding jig 610 with a hole cover 620. The molding jig 610 covers the light-emitting chip 200, so that the colloid will not enter the inside of the hole cover 620 during molding, and the side wall of the hole cover 620 is vertically arranged upward, parallel to the movement direction of the molding jig 610, and there is no obstruction during demolding.

[0061] The transparent adhesive block 430 is flush with or not flush with the partition adhesive wall 410 .

[0062] In one embodiment, please refer to Figure 4 , the transparent adhesive block 430 is flush with the partition adhesive wall 410 .

[0063] In another embodiment, please refer to Figure 6 7( c ), the transparent plastic block 430 is higher than the partitioning plastic wall 410 , a clamping groove 432 is formed between the two transparent plastic blocks 430 , and the light-shielding plastic housing 500 has a partition wall 501 extending into the clamping groove 432 and fitting with the partitioning plastic wall.

[0064] The partition wall 501 is attached to the partition adhesive wall 410 to form a closed light-blocking wall.

[0065] In some embodiments, please refer to Figure 8 and Fig. 9 The top of the light-blocking plastic shell 500 has a hole 560, one end of the partition rubber wall 410 is connected to the inner wall of the hole 560, the other end of the partition rubber wall 410 is connected to the sensing chip 310, and the partition rubber wall 410 is located between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320. The partition rubber wall 410 separates the internal chamber of the light-blocking plastic shell 500 into a first chamber 510 and a second chamber 520. The light-blocking plastic shell 500 also has a first light hole 530 connected to the first chamber 510 and a second light hole 540 connected to the second chamber 520.

[0066] Similarly, the separating plastic wall 410 can completely isolate the light interference between the first chamber 510 and the second chamber 520, thereby improving the detection accuracy of the distance sensor, and the light-blocking plastic shell 500 will not crush the light-emitting chip 200 and the sensing chip 300 when installed.

[0067] In some embodiments, please refer to Figure 4 The above distance sensor further includes a first optical filter 450 installed on the first optical hole 530. The first optical filter 450 is used to filter stray light and optical noise.

[0068] In some embodiments, please refer to Figure 4 The distance sensor further includes a second filter 460 installed on the second light hole 540. The second filter 460 is used to filter stray light and optical noise.

[0069] Embodiment 2

[0070] The present invention also provides a method for manufacturing a distance sensor, comprising the following steps:

[0071] S100, please refer to FIG. 5(b) and FIG. 12(a), provide a substrate 100, and install the light emitting chip 200 and the sensing chip 300 on the substrate 100 at intervals. Optionally, the light emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process.

[0072] S200 , referring to FIG. 5( c ), FIG. 7( a ) and FIG. 12( b ), a separation adhesive wall 410 is formed on the sensing chip 300 between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320 .

[0073] S300 , referring to FIG. 5( f ), FIG. 7( d ) and FIG. 12( f ), is to form a light-shielding plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 on the substrate 100 by using a compression molding process.

[0074] Among them, the top of the partition rubber wall 410 is connected to the light-blocking rubber shell 500, and the internal chamber of the light-blocking rubber shell 500 is divided into a first chamber 510 and a second chamber 520. The receiving end photosensitive area 320 is located in the first chamber 510, and the light-emitting chip 200 and the transmitting end photosensitive area 310 are located in the second chamber 520. The light-blocking rubber shell 500 also has a first light hole 530 connected to the first chamber 510 and a second light hole 540 connected to the second chamber 520.

[0075] The manufacturing method of the distance sensor in the second embodiment can obtain the distance sensor in the first embodiment, and accordingly has the technical effects corresponding to the distance sensor in the first embodiment, which will not be elaborated here.

[0076] In some embodiments, after step S300, the manufacturing method of the distance sensor further includes step S400, referring to FIG. 7(e) and FIG. 12(g), installing the first filter 450 and the second filter 460 in the first light hole 530 and the second light hole 540 respectively.

[0077] In some embodiments, in step S100 , referring to FIG. 5( a ), a sunken trough is formed in the middle of the plate to obtain a bottom plate 110 and a flange 120 circumferentially arranged around the bottom plate 110 , and a notch 121 is opened on the flange 120 .

[0078] Before step S300, please refer to Figure 5(d), and use a molding injection molding process to form two transparent plastic blocks 430 for filling the sunken groove body through the gap 121. The two transparent plastic blocks 430 are respectively located on both sides of the partition plastic wall 410, and the transparent plastic block 430 located in the gap 121 is removed. The purpose is to inject glue when molding the light-blocking plastic shell 500 to form a closed structure to prevent light leakage.

[0079] The provision of the notch 121 facilitates the injection of glue when molding the transparent glue block 430 , the injection of glue when molding the light-shielding plastic shell 500 , and the precise positioning of the light-shielding plastic shell 500 during installation.

[0080] Specifically, in the step of "using the molding injection process to form two transparent plastic blocks 430 filling the sunken groove through the gap 121", the transparent plastic block 430 and the lens 440 are molded in the first cavity. In this way, the transparent plastic block 430 and the lens 440 in the first cavity are integrally formed, eliminating the installation process of the lens 440 and reducing the manufacturing cost.

[0081] In other embodiments, the substrate 100 is a flat plate without a sunken groove.

[0082] Before step S300, it also includes, please refer to Figure 7(b), using a molding process to form a transparent adhesive block 430 higher than the partition adhesive wall 410, please refer to Figure 7(c), and removing the transparent adhesive block 430 located above the partition adhesive wall 410, thereby forming two transparent adhesive blocks 430 located on both sides of the partition adhesive wall 410.

[0083] Specifically, step S300 is as shown in FIG. 7( d ), where an opaque colloid is injected onto the substrate 100 by a molding process, thereby forming a light-blocking plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 , and the light-blocking plastic shell 500 is connected to the top of the partition plastic wall 410 .

[0084] In some other embodiments, the substrate 100 is a flat plate without a sunken tank, and step S300 includes:

[0085] In step S310 , please refer to FIG. 10( b ), a light shielding plastic shell 500 having a pore 560 is formed by an injection molding process. The position of the pore 560 corresponds to the position of the partitioning plastic wall 410 .

[0086] In step S320 , please refer to FIG. 10( f ), the light-shielding plastic shell 500 is installed on the substrate 100 and covers the light-emitting chip 200 and the sensor chip 300 .

[0087] In step S330 , please refer to FIG. 10 ( g ) and FIG. 10 ( h ), an opaque colloid is injected into the pores 560 to form a separation glue wall 410 .

[0088] Specifically, before step S320, the following steps are also included:

[0089] In step S340 , please refer to FIG. 10( c ), the lens 440 is mounted on the bottom of the first light hole 530 of the light shielding plastic housing 500 .

[0090] In step S350, please refer to FIG. 10(d), the light-shielding plastic housing 500 is turned over 180 degrees, and the first filter 450 and the second filter 460 are installed on the top of the first light hole 530 and the second light hole 540 respectively.

[0091] There is no particular order in which step S340 and step S350 are performed.

[0092] Embodiment 3

[0093] Please refer to Figure 4 The present embodiment provides a distance sensor, including a substrate 100, a light emitting chip 200, a sensing chip 300, a separation plastic wall 410 and a light shielding plastic shell 500. The substrate 100 includes a bottom plate 110 and a flange 120. The flange 120 has a notch 121.

[0094] Specifically, there are multiple notches 121 , and the multiple notches 121 are distributed at intervals.

[0095] Specifically, the distance sensor further includes a transparent plastic block 430 located between the light-shielding plastic shell 500 and the substrate 100. A lens 440 is also provided in the first chamber 510, and the lens 440 and the transparent plastic block 430 are integrally molded.

[0096] Referring to FIG. 5 , this embodiment further provides a method for manufacturing a distance sensor, comprising the following steps:

[0097] S31 , referring to FIG. 5( a ), a substrate 100 is formed. The substrate 100 includes a bottom plate 110 and a flange 120 circumferentially arranged around the bottom plate 110 . The flange 120 has a notch 121 .

[0098] S32, please refer to FIG. 5(b), the light emitting chip 200 and the sensing chip 300 are installed on the bottom plate 110 at intervals.

[0099] S33, please refer to FIG. 5(c), draw a separation glue wall 410 on the sensing chip 300. The separation glue wall 410 is located between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320, and spans the sensing chip 300. The two ends of the separation glue wall 410 respectively abut against the inner wall of the flange 120, and the top of the separation glue wall 410 is flush with the top of the flange 120.

[0100] S34, please refer to FIG. 5(d), two transparent adhesive blocks 430 are formed above the bottom plate 110 through the notch 121 by a molding process, and the two transparent adhesive blocks 430 are respectively located on both sides of the partition adhesive wall 410. At the same time, a lens 440 is also formed on the transparent adhesive block 430 located in the receiving end photosensitive area 320.

[0101] S35 , please refer to FIG. 5( e ), remove the transparent adhesive block 430 in the gap 121 .

[0102] S36, please refer to FIG. 5(f), a light-blocking plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 is formed on the transparent plastic block 430 through the notch 121 by using a molding process. The top of the partitioning plastic wall 410 is connected to the light-blocking plastic shell 500, and the internal chamber of the light-blocking plastic shell 500 is separated into a first chamber 510 and a second chamber 520, the receiving end photosensitive area 320 is located in the first chamber 510, the light-emitting chip 200 and the transmitting end photosensitive area 310 are located in the second chamber 520, and the light-blocking plastic shell 500 also has a first light hole 530 connected to the first chamber 510 and a second light hole 540 connected to the second chamber 520.

[0103] Embodiment 4

[0104] Referring to FIG. 7 , this embodiment provides a method for manufacturing a distance sensor, comprising the following steps:

[0105] S41 , providing a substrate 100 , and mounting the light emitting chip 200 and the sensing chip 300 on the substrate 100 at intervals.

[0106] S42, please refer to FIG. 7(a), draw a separation glue wall 410 on the sensing chip 300. The separation glue wall 410 is located between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320, and crosses the sensing chip 300.

[0107] S43, please refer to FIG. 7(b), a transparent adhesive block 430 higher than the partition adhesive wall 410 is formed by a molding process, please refer to FIG. 7(c), and the transparent adhesive block 430 located above the partition adhesive wall 410 is removed.

[0108] S44 , referring to FIG. 7( d ), an opaque colloid is injected onto the substrate 100 by a molding process, thereby forming a light-blocking colloid shell 500 covering the light-emitting chip 200 and the sensing chip 300 .

[0109] Optionally, after step S44, the method further includes:

[0110] S45, please refer to FIG. 7(e), respectively install the first filter 450 and the second filter 460 in the first light hole 530 and the second light hole 540 of the light shielding plastic housing 500.

[0111] Referring to FIG. 10 , the fourth embodiment further provides another method for manufacturing a distance sensor, including:

[0112] S51 , please refer to FIG. 10( a ), provide a substrate 100 , and install the light emitting chip 200 and the sensing chip 300 on the substrate 100 at intervals.

[0113] S52, referring to FIG. 10( b ), a light shielding plastic shell 500 having a pore 560 is provided. The light shielding plastic shell 500 further comprises a first chamber 510, a second chamber 520, a first light hole 530 communicating with the first chamber 510, and a second light hole 540 communicating with the second chamber 520. The pore 560 is located between the first chamber 510 and the second chamber 520.

[0114] S53 , please refer to FIG. 10( c ), install the lens 440 at the bottom of the first light hole 530 .

[0115] S54, please refer to FIG. 10(d) and FIG. 10(e), turn over the light-blocking plastic housing 500, and install the first filter 450 and the second filter 460 on the top of the first light hole 530 and the second light hole 540 respectively.

[0116] S55, please refer to FIG. 10(f), install the light shielding plastic shell 500 on the substrate 100 and cover the light emitting chip 200 and the sensing chip 300. The receiving end photosensitive area 320 is located in the first cavity 510, and the transmitting end photosensitive area 310 and the light emitting chip 200 are located in the second cavity 520.

[0117] S56, please refer to FIG10(g), inject light-blocking glue into the pores 560 to form the partition glue wall 410. Optionally, the light-blocking glue is injected into the pores 560 using a glue dispensing head 630.

[0118] Finally, the distance sensor shown in FIG. 10( h ) is manufactured through the above manufacturing method.

[0119] Embodiment 5

[0120] Referring to FIG. 12 , this embodiment provides a method for manufacturing a distance sensor, including:

[0121] S61 , please refer to FIG. 12( a ), provide a substrate 100 , and install the light emitting chip 200 and the sensing chip 300 on the substrate 100 at intervals.

[0122] S62, please refer to FIG. 12(b), draw a separation glue wall 410 on the sensing chip 300. The separation glue wall 410 is located between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320, and crosses the sensing chip 300.

[0123] S63, please refer to Figure 12 (c) to (e), use the molding jig 610 with a hole cover 620 to mold two transparent plastic blocks 430 on the upper side of the substrate 100, and the two transparent plastic blocks 430 are respectively located on both sides of the partition plastic wall 410. The transparent plastic block 430 located above the light emitting chip 200 has a third light hole 431, and the transparent plastic block 430 located in the receiving end light sensing area 320 has an integrally formed lens 440.

[0124] S64 , referring to FIG. 12( f ), an opaque colloid is injected onto the substrate 100 by a molding process, thereby forming a light-blocking plastic shell 500 covering the light-emitting chip 200 and the sensing chip 300 .

[0125] S65, please refer to FIG. 12(g), install the first filter 450 and the second filter 460.

[0126] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A distance sensor, characterized in that: include: A base plate, comprising a bottom plate and a flange arranged circumferentially around the bottom plate, wherein the flange has a notch; A light-emitting chip is mounted on the substrate; A sensing chip is mounted on the substrate and spaced apart from the light emitting chip, wherein the sensing chip comprises a transmitting end photosensitive region close to the light emitting chip and a receiving end photosensitive region far from the light emitting chip; A separating glue wall is protruded from the sensing chip and is located between the transmitting end photosensitive area and the receiving end photosensitive area; as well as A light-blocking plastic shell is installed on the substrate, the top of the partitioning plastic wall is connected to the light-blocking plastic shell, and the internal chamber of the light-blocking plastic shell is divided into a first chamber and a second chamber, the receiving end photosensitive area is located in the first chamber, the light-emitting chip and the transmitting end photosensitive area are located in the second chamber, the light-blocking plastic shell also has a first light hole connected to the first chamber and a second light hole connected to the second chamber, and the light-blocking plastic shell has a protrusion adapted to the notch.

2. The distance sensor according to claim 1, characterized in that: The separation glue wall spans across the sensing chip, two ends of the separation glue wall respectively abut against the inner wall of the flange, and the top of the separation glue wall is flush with the top of the flange.

3. The distance sensor according to claim 1, characterized in that: The distance sensor further includes two transparent adhesive blocks, and the two transparent adhesive blocks are respectively filled in the first cavity and the second cavity.

4. The distance sensor according to claim 3, characterized in that: The distance sensor further comprises a lens, which is integrally formed with the transparent plastic block located in the first chamber, and is used for guiding the incident light through the first light hole to converge to the photosensitive area of ​​the receiving end.

5. The distance sensor according to claim 3, characterized in that: The transparent adhesive block located in the second chamber has a third light hole whose position corresponds to the position of the light emitting chip.

6. The distance sensor according to claim 3, characterized in that: The transparent adhesive block is flush with the partition adhesive wall; Alternatively, the transparent plastic block is higher than the partitioning plastic wall, a clamping groove is formed between the two transparent plastic blocks, and the light-shielding plastic shell has a partition wall extending into the clamping groove and fitting with the partitioning plastic wall.

7. A distance sensor, characterized in that: The distance sensor comprises: A base plate, the base plate comprising a bottom plate and a flange arranged circumferentially around the bottom plate, the flange having a notch; A light-emitting chip is mounted on the substrate; A sensing chip is mounted on the substrate and spaced apart from the light emitting chip, wherein the sensing chip comprises a transmitting end photosensitive region close to the light emitting chip and a receiving end photosensitive region far from the light emitting chip; A separating glue wall is protruded from the sensing chip and is located between the transmitting end photosensitive area and the receiving end photosensitive area; A light-shielding plastic shell is mounted on the substrate, the top of the partitioning plastic wall is connected to the light-shielding plastic shell, and the internal chamber of the light-shielding plastic shell is divided into a first chamber and a second chamber, the receiving end photosensitive area is located in the first chamber, the light-emitting chip and the transmitting end photosensitive area are located in the second chamber, the light-shielding plastic shell also has a first light hole connected to the first chamber and a second light hole connected to the second chamber, the light-shielding plastic shell is a plastic shell or a molded plastic shell, and the light-shielding plastic shell has a protrusion adapted to the notch; and Two transparent adhesive blocks are respectively filled in the first cavity and the second cavity; the transparent adhesive blocks are flush with the partition adhesive wall.

8. A distance sensor, characterized in that: It includes a substrate, a light-emitting chip, a sensing chip, a light-blocking plastic shell and a separating plastic wall, wherein the light-emitting chip and the sensing chip are installed on the substrate at intervals, the sensing chip includes a transmitting end photosensitive area close to the light-emitting chip and a receiving end photosensitive area away from the light-emitting chip, the light-blocking plastic shell is installed on the substrate, the top of the light-blocking plastic shell has a pore, one end of the separating plastic wall is connected to the inner side wall of the pore, the other end of the separating plastic wall is connected to the sensing chip and is located between the transmitting end photosensitive area and the receiving end photosensitive area, the separating plastic wall separates the internal chamber of the light-blocking plastic shell into a first chamber and a second chamber, and the light-blocking plastic shell also has a first light hole connected to the first chamber and a second light hole connected to the second chamber; The base plate comprises a bottom plate and a flange which is arranged circumferentially around the bottom plate, the flange has a notch, and the light-shielding plastic shell has a convex block which is matched with the notch.

9. A method for manufacturing a distance sensor, characterized in that: include: A substrate is provided, the substrate comprising a bottom plate and a flange arranged circumferentially around the bottom plate, the flange having a notch, and a light emitting chip and a sensing chip are installed on the substrate at intervals, the sensing chip having a transmitting end photosensitive area and a receiving end photosensitive area; Forming a separation glue wall between the transmitting end photosensitive area and the receiving end photosensitive area on the sensing chip; A light-blocking plastic shell covering the light-emitting chip and the sensing chip is formed on the substrate by a molding injection process; wherein the light-blocking plastic shell has a protrusion adapted to the notch, the top of the partitioning plastic wall is connected to the light-blocking plastic shell, and the internal chamber of the light-blocking plastic shell is divided into a first chamber and a second chamber, the receiving end photosensitive area is located in the first chamber, the light-emitting chip and the transmitting end photosensitive area are located in the second chamber, and the light-blocking plastic shell also has a first light hole connected to the first chamber and a second light hole connected to the second chamber.

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