A thin film processing system

Abstract

The present invention discloses a film processing system, which includes: an unwinding unit, configured to provide and convey a film, wherein a plurality of film-applying areas are provided on the film; a film-applying device, configured to attach the film to the corresponding film-applying areas of the film; a buffer unit, configured to perform buffering treatment on the film with the film attached thereto, so as to store or release the film with the film attached thereto; a gluing device, configured to inject slurry into the film with the film attached thereto; a curing unit, configured to perform curing treatment on the film with the slurry injected on the surface; and a rewinding unit, configured to receive the film after the curing treatment. In this way, not only can the continuous production of adhesive tape and slurry curing be realized, but it is also suitable for large-format, large-size, multi-point adhesive tape, thereby improving the production efficiency and yield of the product.

Description

[Technical field]

[0001] The invention relates to the field of thin film processing, in particular to a thin film processing system in the field of conductive film production. [Background technology]

[0002] The AD film structure includes the first UV (Ultraviolet Rays) adhesive layer, the second UV adhesive layer and the third UV adhesive layer. After the first UV adhesive layer is embossed, the lead area needs to be pasted with tape, and then the second UV adhesive layer is formed by loading and UV curing. The existing tape pasting and UV curing devices are carried out step by step. The production efficiency is low if the tape pasting is done first and then UV curing.

[0003] Tape is widely used in industrial production and daily life. However, in many occasions, it needs to be applied manually. Although manual operation can ensure the flexibility of its application, in large-scale production sites, this manual link often limits the speed of the entire process. In addition, in the process of manual application, due to factors such as the operator's proficiency and the speed of application, there will be different degrees of irregular application or bubbles in the application part. These defects caused by manual operation often affect the performance of the entire product or packaging. More importantly, there is often no industry scenario for the application of tape in the conductive film industry. If the tape is applied across industries to the conductive film production industry, it is an innovative application in itself. Further, how to realize the automated processing of tape film (automatic application or removal of tape) will be a technical problem worth solving, because the conductive film production field has unique industry characteristics, which are closely related to the characteristics of the conductive film material itself. If the application or removal of the tape is completely handled manually, the cost is high, the efficiency is low, and it is easy to make mistakes.

[0004] Therefore, it is necessary to propose an improved technical solution to overcome the above problems. [Summary of the invention]

[0005] The technical problem to be solved by the present invention is to provide a thin film processing system, which can not only realize the continuous production of film pasting and slurry curing, but also is suitable for large-format and large-size multi-point tape pasting, thereby improving the production efficiency and yield of the product.

[0006] According to one aspect of the present invention, there is provided a film processing system, comprising: a unwinding unit, configured to provide and convey a film, wherein a plurality of film-applying areas are provided on the film; a film-applying device, configured to attach the film to the film-applying areas corresponding to the film; a buffer unit, configured to perform buffering treatment on the film with the film attached thereto, so as to store or release the film with the film attached thereto; a gluing device, configured to inject slurry onto a side of the film with the film attached thereto; a curing unit, configured to perform curing treatment on the film with the slurry injected on the surface; and a winding unit, configured to receive the film after the curing treatment.

[0007] Furthermore, the film pasting equipment includes: a working platform, configured to carry the film and move forward; a film pasting assembly, configured to attach the film to the corresponding area to be pasted on the film, the film pasting equipment includes a conveying mode and a film pasting mode, and alternates between the conveying mode and the film pasting mode, when the film pasting equipment is in the conveying mode, the film pasting assembly stops the film pasting work, the working platform works, and the working platform conveys the film provided by the unwinding unit forward by a preset length so that the film pasting assembly corresponds to the area to be pasted on the film carried on the working platform; when the film pasting equipment is in the film pasting mode, the working platform stops working, the film pasting assembly works, and the film pasting assembly respectively adheres the film to the corresponding areas to be pasted on the film, and there are N film pasting assemblies, where N is greater than or equal to 1.

[0008] Furthermore, the film before the buffer unit is called the front half film, and the film after the buffer unit is called the back half film. When the film pasting device is in the film pasting mode, the front half film does not move, and the buffer unit releases the stored film; when the film pasting device is in the conveying mode, the front half film continues to be conveyed. At this time, the conveying speed of the front half film is greater than the curing speed of the back half film in the curing unit, or the conveying speed of the front half film is greater than the conveying speed of the back half film, and the buffer unit stores the film.

[0009] Furthermore, the film is a conductive film, the area to be pasted is the lead area on the conductive film, and the lead area is distributed on the same side or multiple sides; the slurry is a UV curing glue; the curing unit includes a curing device, and the curing device is a UV curing device.

[0010] Furthermore, the unwinding unit includes a feed roller and a film collection roller, the feed roller is used to place the first composite film, the first composite film includes a film and a first protective film attached to the film; the film collection roller is used to receive the first protective film separated from the first composite film.

[0011] Furthermore, the buffer unit includes a first side plate, a second side plate, a first fixed roller, a second fixed roller and a sliding roller, the first side plate and the second side plate are opposite to each other and placed vertically, a first vertical slide groove is arranged on the inner side surface of the first side plate, a second vertical slide groove is arranged on the inner side surface of the second side plate, and the first vertical slide groove is opposite to the second vertical slide groove; two ends of the first fixed roller are respectively fixed to the first side plate and the second side plate, and are located on one side of the first vertical slide groove and the second vertical slide groove; two ends of the second fixed roller are respectively fixed to the first side plate and the second side plate, and are located on the other side of the first vertical slide groove and the second vertical slide groove; two ends of the sliding roller are respectively located in the first vertical slide groove and the second vertical slide groove, and the sliding roller can slide vertically along the first vertical slide groove and the second vertical slide groove.

[0012] Furthermore, the film with the film attached thereto outputted from the working platform passes through the first fixed roller, the sliding roller and the second fixed roller in sequence; when the film between the first fixed roller and the second fixed roller becomes longer, the sliding roller moves down along the first vertical slide groove and the second vertical slide groove to store the film with the film attached thereto; when the film between the first fixed roller and the second fixed roller becomes shorter, the sliding roller moves up along the first vertical slide groove and the second vertical slide groove to release the film with the film attached thereto stored in the buffer unit.

[0013] Furthermore, the side surfaces of the first vertical slide groove and the second vertical slide groove are tooth surface structures; and both ends of the sliding roller are tooth surface structures.

[0014] Furthermore, the gluing device is placed perpendicular to the conveying direction of the film, and when the film passes through the gluing device, the gluing device slidably injects slurry on the film; the curing unit includes a curing device, and a slurry pressing roller, a plate roller and a peeling roller arranged in sequence, and when the film with slurry injected on the surface passes through the slurry pressing roller and the plate roller in sequence, the slurry on the surface of the film is first pressed evenly by the slurry pressing roller, and then molded by the plate roller, and the film with slurry injected on the surface is cured by the curing device; the film collecting unit includes a protective film roller, a composite device and a collecting roller, the protective film roller is used to provide a second protective film; the composite device is used to composite the second protective film with the film after the curing treatment to form a second composite film; the collecting roller is used to recover the second composite film.

[0015] Furthermore, the film processing system also includes a dust-binding device located between the buffer unit and the gluing device, and the dust-binding device is used to perform dust-binding treatment on the film output by the buffer unit, and provide the film after the dust-binding treatment to the gluing device.

[0016] Furthermore, the film laminating assembly includes: a peeling mechanism, which is used to peel off the composite material strip; a feeding mechanism, which is used to convey the composite material strip to the peeling mechanism; a returning mechanism, which is used to take away the base film of the composite material strip separated by the peeling mechanism; and a rolling assembly, which is used to roll the film laminating of the composite material strip separated by the peeling mechanism onto the area to be laminating of the film.

[0017] Furthermore, the peeling mechanism includes a peeling mechanism body and a peeling edge located at the end of the peeling mechanism body, the peeling mechanism body includes a first guide surface and a second guide surface, the first guide surface and the second guide surface intersect at the peeling edge; the first guide surface of the peeling mechanism body is used to guide the composite material strip to move toward the peeling edge, the peeling edge is used to separate the composite material strip into a base film located on a side close to the peeling mechanism body and a sticking film located on a side away from the peeling mechanism body, and the second guide surface is used to guide the base film to flip over the peeling edge and move away from the peeling edge.

[0018] Furthermore, the rolling assembly has an initial state and a pressing state. When the rolling assembly is in the pressing state, the feeding mechanism and / or the returning mechanism are used to drive the composite material strip to move synchronously with the film on the working platform. The rolling of the rolling assembly can make the film segment gradually separated from the composite material strip stick together with the area to be film-sticked on the film. The composite material strip includes a base film and a film attached to one side of the base film. The composite material strip is driven to move along the first guide surface of the peeling mechanism body toward the peeling edge and is separated at the peeling edge. The stripping mechanism is separated into a base film located on a side close to the stripping mechanism body and a pasting film located on a side away from the stripping mechanism body, wherein the base film turns over the stripping edge and is driven to move along the second guide surface away from the stripping edge, and before the composite material strip is fed into the stripping mechanism, the pasting film on the composite material strip has been cut into pasting film segments of a predetermined length, while the base film on the composite material strip has not been cut and remains continuous, the stripping mechanism strips the cut pasting film segments of a predetermined length from the composite material strip, and the rolling assembly rolls the separated pasting film segments of a predetermined length onto the area to be pasted on the film.

[0019] Furthermore, the rolling assembly includes a first rolling roller and a second rolling roller arranged at an interval, the first rolling roller being closer to the peeling edge of the peeling mechanism than the second rolling roller, the first rolling roller and the second rolling roller both having an initial state and a pressing state, in which the first rolling roller and the second rolling roller roll the separated film segments of a predetermined length in turn in the pressing state, the film laminating equipment also includes a rolling roller driving device fixedly connected to the second rolling roller, the rolling roller driving device drives the second rolling roller to switch between the initial state and the pressing state, the second rolling roller returns to the initial state from the pressing state with a predetermined delay compared to the first rolling roller, and the peeling mechanism returns to the initial state together with the first rolling roller. and a pressing state, the feeding mechanism comprising a discharge tray and one or more guide rollers, the return material mechanism comprising one or more guide rollers, an active roller and a driven roller cooperating with the active roller, a return material tray and a return material driving device, the return material driving device drives the return material tray and one or more active rollers to rotate, thereby driving the composite material strip and the base film to move, the discharge tray is provided with a brake to provide a certain resistance for the discharge tray, wherein the driven roller can move between a clamping position and a remote position under the drive of the roller driving device, and when the driven roller is in the clamping position, the base film is clamped between the active roller and the driven roller,

[0020] The film sticking equipment also includes: a half-cutting device, which is used to cut the film on the composite material strip into film segments of predetermined length before the composite material strip is fed into the stripping mechanism; and a length adjustment device, which can adjust the predetermined length of the film segment obtained by the half-cutting device cutting the film.

[0021] Compared with the prior art, the film processing system in the present invention includes a unwinding unit, a film laminating device, a buffer unit, a gluing device, a curing unit and a winding unit, which can not only realize the continuous production of film laminating and slurry curing, but also is suitable for large-format, large-size and multi-point tape laminating, thereby improving the production efficiency and yield of the product.

[0022] Other objects, features and advantages of the present invention will be described in detail below in conjunction with the accompanying drawings in the specific implementation manner.

Brief Description of the Drawings

[0023] The present invention will be more easily understood with reference to the accompanying drawings and the following detailed description, wherein like reference numerals correspond to like structural components, wherein:

[0024] Figure 1 A schematic diagram of a three-dimensional structure of a film sticking device of the present invention from a viewing angle in an embodiment;

[0025] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure of the film laminating device from another perspective;

[0026] Figure 3 for Figure 1 A schematic diagram of the front three-dimensional structure of a film laminating device;

[0027] Figure 4 for Figure 3 A schematic diagram of the side structure of the film laminating device;

[0028] Figure 5 for Figure 3 A schematic diagram of the reverse three-dimensional structure of the film laminating device;

[0029] Figure 6 for Figure 3 A schematic diagram of the three-dimensional structure of the peeling mechanism;

[0030] Figure 7-Figure 9 The schematic diagram of the film sticking principle of the film sticking device in the present invention is shown in FIG. Figure 7 The peeling mechanism, the first pressing roller and the second pressing roller are all in the initial state. Figure 8 The peeling mechanism, the first pressing roller and the second pressing roller have all moved from the initial state to the pressing state. Fig. 9 The middle peeling mechanism and the first pressing roller have been restored from the pressing state to the initial state, and the second pressing roller is still in the pressing state;

[0031] Fig.10 It is a schematic diagram of the structure of the composite material strip in the present invention;

[0032] Fig.11 It is a schematic diagram of the structure of the composite material strip after half-cutting in the present invention;

[0033] Fig.12 It is a schematic diagram of the structure of the conductive film of the present invention after being pasted with a film;

[0034] Fig.13 The figure is a schematic diagram of the process of the film pasting method based on the film pasting equipment in the present invention.

[0035] Fig.14 is a schematic diagram of the three-dimensional structure of a thin film processing system in one embodiment of the present invention;

[0036] Fig.15 for Fig.14 An enlarged three-dimensional structural schematic diagram of the rear half of the film processing system shown;

[0037] Fig.16 Conductive film Fig.14 A schematic diagram of the structure of the film sticking device after the film is stuck. [Specific implementation method]

[0038] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] The term "one embodiment" or "embodiment" as used herein means that a particular feature, structure or characteristic associated with the embodiment may be included in at least one implementation of the present invention. The term "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor does it necessarily refer to a separate or selected embodiment that is mutually exclusive with other embodiments. The terms "multiple" and "several" in the present invention mean two or more. The term "and / or" in the present invention means "and" or "or".

[0040] According to one aspect of the present invention, the present invention provides a film sticking device, which can automatically stick the film on a target object such as a conductive film 5 by pasting or other means instead of manual work.

[0041] Figure 1 is a schematic diagram of a three-dimensional structure of a film-sticking device in one embodiment of the present invention from a viewing angle, Figure 2 for Figure 1 A three-dimensional structural diagram of the film laminating equipment from another perspective. Figure 1 and Figure 2 As shown, two film sticking devices 1a and 1b are arranged one behind the other. In other embodiments, the number of the film sticking devices can be set as needed, such as 1, 3, 4 or more. The film sticking devices 1a and 1b can be used to stick the film on a target object such as a conductive film 5 by pasting or other means. The whole process does not require manual participation, which improves production efficiency and has high product consistency.

[0042] like Figure 1 and Figure 2 As shown, the film pasting equipment 1a or 1b includes a frame 50, a working platform 40 formed on the frame 50, a film pasting assembly 10, a film pasting position adjusting device 20, and a film pasting position positioning device 30.

[0043] The working platform 40 can carry the conductive film 5 and drive the conductive film 5 to move forward. The working platform 40 is driven by a platform power device, and a code disc 41 is arranged on the working platform 40. The code disc 41 is used to measure the movement speed of the conductive film 5 and feed the speed back to the platform power device. The platform power device controls the movement speed of the conductive film 5 based on the movement speed fed back by the code disc 41.

[0044] like Fig.12As shown, the conductive film 5 includes a lead area 51 located at a designated position, and the film sticking assembly 10 of the present invention can stick a film 82 on the lead area 51 of the conductive film 5 to cover the lead area 51. In other embodiments, it is obvious that the working platform 40 can also transport other films or other items that need to be stuck with films, which can be collectively referred to as target objects to be stuck in the present invention, and the conductive film 5 is mainly used as an example for description in this article. The film 82 can also be a sticky film or a non-sticky film.

[0045] Figure 3 for Figure 1 A schematic diagram of the front three-dimensional structure of a film laminating device. Figure 3 As shown, the film-sticking position positioning device 30 can be used to locate the lateral position and longitudinal position of the lead area on the conductive film 5, wherein the longitudinal direction is the conveying direction X of the conductive film, referred to as the X direction, and the lateral direction is the perpendicular direction Y of the conveying direction of the conductive film, referred to as the Y direction. The film-sticking position positioning device 30 includes a camera 31, a light source 32 and an image recognition unit (not shown). The camera 31 is used to photograph the conductive film 5, and the light source 32 is used to provide fill light when the camera 31 is photographing. The image recognition unit is used to recognize the lateral position and longitudinal position of the lead area of ​​the conductive film 5 based on the image photographed by the camera 31.

[0046] Combination Figure 3 As shown, the film-sticking position adjustment device 20 includes a transverse guide rail 21 fixed on the frame 50 and extending laterally, a transverse slider 22 capable of sliding on the transverse guide rail 21, and a slider driving device 23. The film-sticking assembly 10 is connected to the transverse slider 22, and the slider driving device 23 can drive the transverse slider 22 to move laterally along the transverse guide rail 21, and the transverse movement of the transverse slider 22 can drive the transverse movement of the film-sticking assembly 10. In this way, even if the conductive film 5 is laterally offset during transportation, the film-sticking position adjustment device 20 can adjust the transverse position of the film-sticking assembly 10 based on the transverse position of the lead area obtained by positioning, so that the film can be attached to the lead area of ​​the conductive film more accurately. The slider driving device 23 can be a motor.

[0047] In some embodiments, the film sticking position adjustment device 20 may not be provided. In this case, the film sticking assembly 10 may be directly fixed on the frame 50, so that the lateral position of the film sticking assembly 10 cannot be adjusted. In order to ensure the normal operation of the film sticking equipment, it is necessary to ensure that the position deviation of the conductive film 5 transmitted by the working platform 40 is acceptable.

[0048] In some embodiments, the film position positioning device 30 may not be provided. In this case, the film pasting equipment needs to know the position of the lead area of ​​the conductive film 5 in advance. As long as the position of the lead area of ​​the conductive film 5 does not shift, the film pasting assembly 10 can automatically adhere the film 82 to the lead area 51 of the conductive film 5.

[0049] Figure 4 for Figure 3 A schematic diagram of the side structure of the film laminating device; Figure 5 for Figure 3 The film laminating assembly 10 includes a peeling mechanism 100, a rolling assembly 200, a feeding mechanism 300, a material returning mechanism 400, a half-cutting device 500, a length adjusting device 600, a film laminating assembly base 700 and a film laminating assembly base driving device 800.

[0050] The stripping mechanism 100, the rolling assembly 200, the feeding mechanism 300, the material return mechanism 400, the half-cutting device 500, and the length adjustment device 600 are all arranged on the film assembly base 700. The movement of the film assembly base 700 can drive the stripping mechanism 100, the rolling assembly 200, the feeding mechanism 300, the material return mechanism 400, the half-cutting device 500, and the length adjustment device 600 to move synchronously. One end of the film assembly base driving device 800 is fixed on the transverse slider 21, and the other end is fixed on the film assembly base 700. The film assembly base driving device 800 can drive the film assembly base 700 to move between the initial position and the downward pressing position. Preferably, the film assembly base driving device 800 can be a cylinder.

[0051] Figure 6 for Figure 3 Schematic diagram of the three-dimensional structure of the peeling mechanism 100. Figure 6 As shown, the stripping mechanism 100 includes a stripping mechanism body 110 and a stripping edge 120 located at the end of the stripping mechanism body 110, the stripping mechanism body 110 includes a first guide surface 111 and a second guide surface 112, the first guide surface 111 and the second guide surface 112 intersect at the stripping edge 120. The rolling assembly 200 includes a first pressing roller 210 and a second pressing roller 220 that are spaced apart, the first pressing roller 210 being closer to the stripping edge 120 of the stripping mechanism 100 than the second pressing roller 220. The first pressing roller 210 and the second pressing roller 220 both have an initial state and a pressing state. Fig.10 FIG. 8 is a schematic diagram of the structure of the composite material strip 80 in the present invention. Fig.10As shown, the composite material strip 80 includes a base film 81 and a film 82 attached to one side of the base film 81 , wherein a first surface of the film 82 attached to the base film 81 is adhesive, and a second surface of the film 82 opposite to the first surface is non-adhesive.

[0052] like Figure 8 As shown, the composite material strip 80 is driven to move along the first guide surface 111 of the peeling mechanism body 110 toward the peeling edge 120, and is separated at the peeling edge 120 into a base film 81 located on a side close to the peeling mechanism body 110 and a pasting film 82 located on a side away from the peeling mechanism body 110, wherein the base film 81 turns over the peeling edge 120 and is driven to move along the second guide surface 112 away from the peeling edge 120. Preferably, as Figure 6 As shown, the film edge 120 may be a curved edge rather than a sharp edge, which may facilitate the base film 81 to pass through the peeling edge 120 smoothly.

[0053] In order to facilitate the peeling of the composite tape 80, Figure 6 and 7 As shown, the angle between the first guide surface 111 and the second guide surface 112 can be less than 15 degrees, such as 10 degrees, 12 degrees, etc. The first side of the stripping mechanism body 110 forming the first guide surface 111 is provided with a guide groove 130, and the bottom surface of the guide groove 130 is the first guide surface 111. The guide groove 130 is used to guide the composite material strip 80. The width of the guide groove 130 can match the width of the material strip.

[0054] The first side of the peeling mechanism body 110 is provided with an arc-shaped pit 140 near the peeling edge, and the arc-shaped pit 140 matches and is arranged close to the outer edge of the first pressing roller 210, but does not contact the arc-shaped pit of the peeling mechanism. In this way, the pressing part 211 of the first pressing roller 210 can be as close as possible to the peeling edge 120 of the peeling mechanism 100, so that the first pressing roller 210 can more easily press the separated film 82.

[0055] like Figure 8 As described above, when in the pressed state, the first pressing roller 210 and the second pressing roller 220 are sequentially pressed on the non-sticky second surface of the separated film 82 , so that the first surface of the film 82 is adhered to the lead area of ​​the conductive film 5 carried on the working platform 40 .

[0056] like Figure 7As shown, the first pressing roller 210 and the film-mounting assembly base 700 move synchronously. When the film-mounting assembly base 700 is in the initial position, the first pressing roller 210 is in the initial state. At this time, the first pressing roller 210 is separated from the conductive film 5 on the working platform 40 by a distance. Figure 8 As shown, when the film-mounting assembly base 700 is driven to the downward pressing position by the film-mounting assembly base driving device 800, the first pressing roller 210 is pressed downward together with the film-mounting assembly base 700 to enter the pressing state, and at this time, the first pressing roller 210 is pressed on the conductive film 5 on the working platform 40. Specifically, the timing of switching the stripping mechanism 100 from the initial state to the pressing state can be determined based on the longitudinal position of the lead area obtained by the film-mounting position positioning device 20, so that the stripping mechanism 100 can be aligned with the lead area in the pressing state.

[0057] like Figure 5 As shown, the film sticking assembly 10 also includes a pressure roller driving device 221 disposed on the film sticking assembly base 700. One end of the pressure roller driving device 221 is fixedly connected to the film sticking assembly base 700, and the other end is fixedly connected to the second pressure roller 220. The pressure roller driving device 221 drives the second pressure roller 220 to switch between the initial state and the pressing state. The second pressure roller 220 moves independently of the first pressure roller 210. The second pressure roller 220 can enter the pressing state from the initial state later than, earlier than, or at the same time as the first pressure roller 210, as long as the second pressure roller 220 can press the separated film 82 in time. However, the second pressure roller 220 usually returns to the initial state from the pressing state at a predetermined time later than the first pressure roller 210, as shown in FIG. Figure 8 and Fig. 9 , so that the second pressing roller 220 can press the separated film 82 from the beginning to the end. The pressing roller driving device 221 can be a cylinder.

[0058] The feeding mechanism 300 is used to convey the composite material strip 80 to the stripping mechanism 100, and its movement direction is as follows: Figure 8 D1 in the figure, the material return mechanism 400 is used to take away the base film 81 on the composite material strip 80 from the stripping mechanism 100, and its movement direction is as follows Figure 8 When the rolling assembly 200 is in the pressed state, the composite material strip 80 is driven by the feeding mechanism 300 and / or the returning mechanism 400, and moves synchronously with the conductive film 5 on the working platform 40. The moving direction of the conductive film 5 on the working platform 40 is as shown in FIG. Figure 8 In the direction X, the film 82 gradually separated from the composite material strip 80 is adhered to the lead area of ​​the conductive film 5 by the rolling of the rolling assembly 200. The rotation direction of the first pressing roller 210 can be seen in Figure 8 The rotation direction of the first pressing roller 210 can be seen from r2 in Figure 8 The rotation direction of the guide roller 320 is shown in FIG. Figure 8 r1 in.

[0059] like Figure 4 As shown, the feeding mechanism 300 includes a discharge tray 310 and one or more guide rollers 320, and the return material mechanism 400 includes one or more guide rollers 410, a driving roller 421, a driven roller 422, a return material tray 430 and a return material driving device 440. The return material driving device 440 drives the driving roller 421, the driven roller 422 and the return material tray 430 to rotate, thereby driving the composite material strip 80 and the base film 81 to move. A brake is provided on the discharge tray 310 to provide a certain resistance for the discharge tray 310. The brake can be a magnetic powder brake. The return material driving device 440 can be a synchronous motor. The driven roller 422 can move between the clamping position and the away position under the drive of the roller driving device 4221. When the driven roller 422 is in the clamping position, the base film 81 is clamped between the driving roller 421 and the second driving roller 422. The roller driving device 4221 can be a cylinder. When the composite material strip 80 needs to be replaced, the roller driving device 4221 drives the driven roller to lift up and replace the composite material strip.

[0060] like Fig.11 As shown, the half-cutting device 500 can be used to cut the film 82 on the composite material strip 80 into film segments 82n of a predetermined length L before the composite material strip 80 is fed into the stripping machine 100. The half-cutting device 80 includes a half-cutting knife 510 and a half-cutting driving device 520. The half-cutting driving device 520 drives the half-cutting knife 510 to perform a cutting action, and the half-cutting knife 510 cuts the film 82 on the composite material strip 80 into film segments 82n of a predetermined length.

[0061] The length adjustment device 600 can adjust the predetermined length L of the film-applying section. The length adjustment device 600 includes a slit sensor 610 and a scale plate 620. The length of the adhesive tape between the slit sensor 610 and the peeling edge 120 of the peeling mechanism 100 is equal to a positive integer multiple of the predetermined length L, such as 1 or 2 times. After the slit sensor 610 senses the slit, the composite tape 80 is stopped from being fed into the peeling mechanism 100. At the same time, the film-applying assembly base 700 returns from the pressing position to the initial position, and the first pressing roller 210 and the peeling mechanism 100 return from the pressing state to the initial state.

[0062] For ease of understanding, the following Figure 7-Figure 9 The film sticking principle of the film sticking equipment is introduced in detail.

[0063] like Figure 7 As shown, the peeling mechanism 100, the first pressing roller 210 and the second pressing roller 220 are all in the initial state, and the working platform 40 drives the conductive film 5 thereon to move forward in the X direction. Figure 7-9 The working platform 40 is intentionally omitted in the figure, but in fact the working platform 40 is located below the conductive film 5. At this time, the feeding mechanism 300 and the receiving mechanism 400 can remain stationary.

[0064] When the conductive film 5 moves to the specified position, the film assembly base driving device 800 drives the film assembly 10 to press down. Figure 8 As shown, at this time, the stripping mechanism 100 and the first pressing roller 210 have entered the clamping state from the initial state, and the second pressing roller 220 has also entered the clamping state from the initial state driven by the pressing roller driving device 221. At this time, the composite material strip 80 is driven by the feeding mechanism 300 and / or the returning mechanism 400 and moves synchronously with the conductive film 5 on the working platform 40, that is, the movement speed of the conductive film 5 is substantially consistent with the movement speed of the composite material strip 80. The film segment 82n of a predetermined length gradually separated from the composite material strip 80 is successively pressed by the first pressing roller 210 and the second pressing roller 220 and pasted together with the lead area of ​​the conductive film 5. Specifically, whether the conductive film 5 moves to the specified position can be determined based on the longitudinal position of the lead area located by the film position positioning device 20 and the movement speed of the conductive film.

[0065] After a period of time, when the slit sensor 610 senses the slit of the conductive film 5, the film assembly base 700 is driven to return from the pressed position to the initial position, and the first pressing roller 210 is restored from the pressed state to the initial state, and the composite material strip 80 is stopped from being fed into the stripping mechanism 100. Fig. 9 As shown, at this time, the peeling mechanism 100 and the first pressing roller 210 have been restored from the pressing state to the initial state, and the second pressing roller 220 is still in the pressing state, so that the second pressing roller 220 can press the separated film segment 82n from the beginning to the end.

[0066] After a predetermined delay, the second pressing roller 220 is driven to return from the pressing state to the initial state, so that the film tearing device returns to the initial state. Figure 7 The state shown. So far, one film pasting process is completed, and the above process can be repeated to complete multiple film pastings.

[0067] In a preferred embodiment, before the first pressing roller 210 enters the pressing state, the composite material strip 80 is fed into the stripping mechanism 100 for pre-stripping to obtain a film of pre-stripping length M, and after the first pressing roller 210 enters the pressing state, the composite material strip 80 is continuously fed into the stripping mechanism 100 for further stripping to obtain a film of the remaining length LM of the predetermined length L. The pre-stripping length M is greater than or equal to the distance from the stripping edge 120 to the bottom of the first pressing roller 210. After the pre-stripping of the composite material strip is completed, the half-cutting device 500 cuts the film 82 on the composite material strip 80, and the sum of the length of the composite material strip between the half-cutting device 500 and the slit sensor 610 of the length adjustment device 600 and the pre-stripping length M is equal to the predetermined length L. Because the composite material strip 80 is fed into the stripping mechanism 100 for pre-stripping to obtain a pre-stripped film of length M before the first pressing roller 210 enters the pressing state, the first pressing roller 210 can directly press the pre-stripped film of length M when entering the pressing state, so that the laminating process between the film section and the lead area can be started normally. If the composite material strip 80 is not pre-stripped before the first pressing roller 210 enters the pressing state, the peeled film may sometimes curl when entering between the first pressing roller 210 and the lead area of ​​the conductive film 5, which may easily lead to film laminating failure.

[0068] In a specific embodiment: for example, if a film section with a length of 50 mm (i.e., L=50 mm) is required, the position of the length adjustment device 600 is adjusted so that the scale indicated by it is 45 mm (where 5 mm is the pre-peeling length M, which needs to be deducted), and the composite material strip 80 is driven to move from the discharge tray 310 to the peeling mechanism 100. At this time, the film assembly base 700 is not pressed down, and pre-peeling is performed. The pre-peeling length M is 5 mm, that is, the return material driving device 440 moves 5 mm first. When the lead area of ​​the conductive film 5 moves to the specified position, the film assembly base driving device 800 is driven The film pasting component base 700 is pressed down. At this time, the speed of the return material driving device 440 is synchronized with the transmission speed of the conductive film 5. The pressure roller driving device 221 drives the second pressure roller 220 to press down as well to perform the film pasting work. At this time, the length of the subsequent film pasting is 45 mm. When the slit sensor 610 on the length adjustment device 600 detects the slit on the composite material strip, the film pasting component base driving device 800 drives the film pasting component base 700 to be lifted up. At this time, the second pressure roller 220 is still pressed down. When the second pressure roller 220 has pasted the last 5 mm, the second pressure roller 220 is also lifted up, and the above steps are repeated.

[0069] In a modified embodiment, before the composite material strip 80 is placed on the material discharging tray 310, the film 82 in the composite material strip 80 has been cut into film segments of a predetermined length L in advance, and at this time, the film assembly 10 may not be provided with the half-cutting device 500. In this embodiment, the slit sensor 610 still needs to function normally. When the slit sensor 610 senses the slit, it stops feeding the composite material strip 80 into the stripping mechanism 100, and controls the film assembly base 700 to return from the pressed position to the initial position.

[0070] It can be seen that the timing of pausing the feeding of the feeding mechanism 300 and / or the material collection of the return mechanism 400, and the timing of controlling the film assembly base 700 to return from the pressing position to the initial position are determined based on the slit signal sensed by the slit sensor 610. The timing of starting the feeding of the feeding mechanism 300 and / or the material collection of the return mechanism 400, and the timing of controlling the film assembly base 700 to enter the pressing position from the initial position are determined based on the longitudinal position of the lead area of ​​the conductive film 5 located by the film position positioning device 30.

[0071] In a replaceable embodiment, the pressure roller assembly 200 may also include only one pressure roller, such as the first pressure roller 210 or the second pressure roller 220. When the pressure roller assembly 200 includes one pressure roller, the pressure roller needs to roll all the film segments 82n to be pasted before it can return to the initial state from the pressing state. At this time, the pressure roller can switch between the pressing state and the initial state synchronously with the peeling mechanism 100, or can switch between the pressing state and the initial state asynchronously.

[0072] In a modified embodiment, the feeding mechanism 300 and the return mechanism 400 may also adopt other structural forms, for example, the number and position of the guide rollers 410, 320 may be adjusted as needed, the discharge tray 310 may also adopt other discharge structures, and the return tray 430 may adopt other existing return structures. In fact, as long as the feeding mechanism 300 can transfer the composite film 80 to the stripping mechanism 100, as long as the return mechanism 400 can recycle the base film 81, as long as the feeding mechanism 300 and / or the return mechanism 400 can drive the composite film 80 and the base film 81 to move, it will be sufficient.

[0073] In a modified embodiment, the length adjustment device 600 may not be provided, and the length of the film section 82n may be fixed instead of adjustable, which can fully meet the needs in some customized applications. However, the slit sensor 610 in the length adjustment device 600 is still required, but in this case, the slit sensor 610 no longer belongs to the length adjustment device 600.

[0074] In another modified embodiment, the peeling mechanism 100, the rolling assembly 200, the feeding mechanism 300, the material returning mechanism 400, the half-cutting device 500, and the length adjusting device 600 can be independently arranged, and not necessarily all arranged on the film laminating assembly base 700. According to the application requirements, the peeling mechanism 100 and the first pressing roller 210 may not move synchronously with the film laminating assembly base 700, but may have their own independent driving device, so that the peeling mechanism 100 and the first pressing roller 210 may not move synchronously, but may be arranged according to the requirements to see whether synchronous movement or asynchronous movement is required.

[0075] According to another aspect of the present invention, the present invention may also provide a film pasting method based on the film pasting equipment. Fig.13 FIG. 1 is a flow chart of a film pasting method 1300 of a film pasting device in the present invention. Fig.13 As shown, the method 1300 includes the following steps:

[0076] Step 1310: the transport platform 40 carries the conductive film 5 and moves forward.

[0077] Step 1320, when the conductive film 5 moves to the specified position, the rolling assembly 200 enters the clamping state from the initial state; specifically, based on the longitudinal position of the lead area 51 obtained by the film position positioning device 20 and the movement speed of the conductive film 5, it is determined whether the conductive film 5 moves to the specified position.

[0078] Step 1330 , driving the composite material strip 80 from the feeding mechanism 300 to move along the first guide surface 111 of the stripping mechanism body 110 toward the stripping edge 120 .

[0079] In step 1340, the composite material strip 80 is separated at the peeling edge into a base film 81 located on a side close to the peeling mechanism body and a pasting film 82 located on a side away from the peeling mechanism body.

[0080] In step 1350, the base film 81 is driven to move away from the peeling edge 120 along the second guide surface 112, and finally the base film is transferred to the return mechanism 400. Preferably, the composite material strip 80 is driven by the feeding mechanism and / or the return mechanism to move synchronously with the conductive film 5 on the transport platform 40, so that the film pasting effect is good, the film pasting is flat and there are no bubbles.

[0081] In step 1360 , the rolling assembly 200 rolls the separated film 82 onto the lead area of ​​the conductive film 5 in a compacted state.

[0082] Preferably, before the composite material strip 80 is fed into the stripping mechanism 100, the film on the composite material strip 82 is cut into film segments 82n of a predetermined length, and each time a film is pasted, one film segment 82n is pasted on the lead area of ​​the conductive film 5. More preferably, before the first pressing roller 210 enters the pressing state, the composite material strip 80 is fed into the stripping mechanism 100 for pre-stripping to obtain a film of the pre-stripping length, and after the first pressing roller 210 enters the pressing state, the composite material strip 80 is continuously fed into the stripping mechanism 100 for further stripping to obtain a film segment 82n of the remaining length of the predetermined length L.

[0083] For simplicity, the specific implementation of the film pasting method 1300 can refer to the relevant description of the film pasting device, which will not be repeated here.

[0084] In one embodiment, the equipment described in this patent can be used to produce the following product, whose product structure and basic production process are as follows.

[0085] A composite transparent conductive film comprises a transparent substrate, one side of which is provided with a first UV adhesive layer, a second UV adhesive layer, and a third UV adhesive layer;

[0086] The first UV adhesive layer is a first layer of UV curing adhesive coated on the surface of the transparent substrate, the first UV adhesive layer is patterned and embossed and cured to form grid-shaped grooves of the first conductive layer and lead grooves of the first lead area, the grid-shaped grooves of the first conductive layer and the lead grooves of the first lead area are filled with conductive paste, and the depths of the grid-shaped grooves of the first conductive layer and the lead grooves of the first lead area are less than the thickness of the first UV adhesive layer;

[0087] A second UV adhesive layer is disposed on the surface of the first UV adhesive layer, and the second UV adhesive layer serves as a reinforced insulating support layer; the lead groove of the first lead area is not coated with the second layer of UV curing adhesive, the lead groove of the first lead area is covered with adhesive tape, and the second lead area of ​​the third UV adhesive layer does not overlap with the first lead area of ​​the first UV adhesive layer;

[0088] A third UV adhesive layer is provided on the surface of the second UV adhesive layer, and the surface of the third UV adhesive layer is patterned and embossed and cured to form a grid-shaped groove of the second conductive layer and a lead groove of the second lead area, the grid-shaped groove of the second conductive layer and the lead groove of the second lead area are filled with conductive paste, and the depth of the grid-shaped groove of the second conductive layer and the lead groove of the second lead area is less than the thickness of the third UV adhesive layer;

[0089] The first UV adhesive layer containing conductive paste, the third UV adhesive layer containing conductive paste, and the second UV adhesive layer are sintered and cured with the transparent substrate to form a composite transparent conductive film.

[0090] The materials of the second UV glue layer and the third UV glue layer are different, and the materials of the first UV glue layer and the third UV glue layer are the same. The lead grooves in the first lead area are covered with a thin film (a film of the composite material tape), and then the grid-shaped grooves of the first conductive layer and the lead grooves in the first lead area are all coated with a second layer of UV curing glue. After the first UV glue layer containing conductive paste, the third UV glue layer containing conductive paste, and the second UV glue layer and the transparent substrate are sintered and cured, the thin film covering the first lead area is removed.

[0091] The second UV adhesive layer is a multilayer UV curing adhesive coated on the surface of the first UV adhesive layer to form a composite layer as the second UV adhesive layer for reinforcing the insulating support layer. The surface of the first lead area is not coated with the second layer of UV curing adhesive.

[0092] A protective layer is provided on the upper surface of the third UV adhesive layer, and the protective layer is a polymer layer. The first UV adhesive layer, the second UV adhesive layer, the third UV adhesive layer, the protective layer and the transparent substrate are sintered and cured to form a composite transparent conductive film, and the second lead area of ​​the third UV adhesive layer does not overlap with the first lead area of ​​the first UV adhesive layer.

[0093] The basic preparation method of the composite transparent conductive film comprises the following steps:

[0094] Step 1: coating a first layer of UV curing adhesive on the surface of the transparent substrate, and patterning and curing the first layer of UV curing adhesive to form grid-shaped grooves of the first conductive layer and lead grooves of the first lead area;

[0095] Step 2: filling the grid-shaped grooves of the first conductive layer and the lead grooves of the first lead area with a conductive paste;

[0096] Step 3: Then apply a second layer of UV curing glue on the surface of the first UV glue layer, and the first lead area is not coated with the second layer of UV curing glue. The first lead area needs to be covered in advance, such as with tape, and the surface of the first lead area of ​​the first UV glue layer is first covered with a thin film using the patented equipment, and then the second layer of UV curing glue is applied on the surface of the first UV glue layer, and the second layer of UV curing glue covers the first lead area with the thin film.

[0097] Step 4: coating a third layer of UV curing adhesive on the surface of the second UV adhesive layer, patterning and embossing the third layer of UV curing adhesive and curing it to form a grid-shaped groove with a second conductive layer and a lead groove of a second lead area, wherein the second lead area does not overlap with the first lead area;

[0098] Step 5: filling the grid-shaped grooves of the second conductive layer and the lead grooves of the second lead area with conductive paste;

[0099] Step 6: Sinter and solidify the first UV adhesive layer containing conductive paste, the third UV adhesive layer containing conductive paste, the second UV adhesive layer and the transparent substrate to form a composite transparent conductive film. When the composite transparent conductive film is sintered, the surface of the first lead area of ​​the first UV adhesive layer is covered with a thin film to isolate the second UV adhesive layer, and the thin film covering the first lead area is removed after sintering.

[0100] According to another aspect of the present invention, the present invention provides a thin film processing system using the above-mentioned film laminating equipment.

[0101] Please refer to Fig.14 As shown, it is a three-dimensional structural schematic diagram of the thin film processing system in one embodiment of the present invention, please refer to Fig.15 As shown, it is Fig.14 The enlarged three-dimensional structural schematic diagram of the rear half of the film processing system is shown. Fig.14 and Fig.15 In the illustrated embodiment, the film processing system includes an unwinding unit 1410 , a film laminating device 1420 , a buffer unit 1430 , a dust-binding device 1440 , a gluing device 1450 , a curing unit 1460 and a winding unit 1470 .

[0102] 1. Unwinding unit 1410

[0103] The unwinding unit 1410 is used to supply and transport the conductive film 5, on which a plurality of lead areas are arranged. Fig.14In the illustrated embodiment, the unwinding unit 1410 includes a feed roller 1412 and a film collection roller 1414, the feed roller 1412 is used to place the first composite film 12, the first composite film 12 includes a conductive film 5 and a first protective film (not marked) attached to the conductive film 5; the film collection roller 1414 is used to receive the first protective film separated from the first composite film 12.

[0104] In an alternative embodiment, the structure of the unwinding unit 1410 may be changed without affecting the operation of the film processing system. For example, in one embodiment, the conductive film 5 may not be covered with the first protective film, in which case the film collection roller 1414 does not need to be provided; for example, in another embodiment, the conductive film 5 may be directly transferred from the previous process in the assembly line, in which case the unwinding roller 1412 and the film collection roller 1414 do not need to be provided. Of course, there are many other ways to change the structure of the unwinding unit 1410, which will not be listed here one by one.

[0105] The conductive film 5 separated from the first composite film 12 is further conveyed forward to the film laminating device 1420 for film laminating treatment.

[0106] 2. Film laminating equipment 1420

[0107] For the specific structure of the film laminating device 1420, please refer to the above Figure 1-13 And related text description.

[0108] There are N film-sticking devices 1420 , where N is a natural number greater than or equal to 1. Fig.14 , that is, N is 3, which are placed in different positions, and each film sticking device shares a working platform. The film sticking device 1420 is used to stick the film on the lead area corresponding to the conductive film 5. Fig.14 In the illustrated embodiment, the film is an adhesive tape, and the film assembly 10 is used to attach the adhesive tape to the lead area corresponding to the conductive film 5 .

[0109] In this embodiment, the film laminating device 1420 and Figure 1-Figure 9The film pasting equipment in the embodiment of the present invention is changed. The difference between the two is that: when pasting film, the working platform does not move, and the film pasting assembly 10 moves, so that the working platform and the film pasting assembly 10 form a relative movement to complete the film pasting; when not pasting film, the working platform carries the conductive film to move forward, and the film pasting assembly 10 does not perform the film pasting work. In other words, the film pasting equipment 1420 includes a conveying mode and a film pasting mode, and alternates between the conveying mode and the film pasting mode. In order to realize the movement of the film pasting assembly 10 relative to the working platform, the film pasting equipment 1420 also includes a driving device for driving the movement of the film pasting assembly 10 relative to the working platform.

[0110] When the film pasting device 1420 is in the conveying mode, the film pasting component 10 stops working, the working platform works, and the working platform conveys the conductive film 5 provided by the unwinding unit 1410 forward by a preset length, so that the film pasting component 10 corresponds one by one to the N lead areas of the conductive film 5 carried on the working platform; after the working platform conveys the conductive film 5 forward by a preset length, the film pasting device 1420 switches to the film pasting mode; when the film pasting device 1420 is in the film pasting mode, the working platform stops working (at this time, the conductive film 5 carried on the working platform does not move), the film pasting component 10 works, and the film pasting component 10 respectively adheres the film to the corresponding N lead areas on the conductive film 5; when the film pasting work of the film pasting component 10 is completed, the film pasting device 1420 switches to the conveying mode again.

[0111] Please refer to Fig.16 As shown, the conductive film 5 is Fig.14 Schematic diagram of the structure of the film sticking device 1420 after the film is stuck. Fig.16 The conductive film 5 in the figure is the conductive film 5 corresponding to the one-time film pasting mode, and the conductive film 5 is provided with three lead areas (not marked) at different positions and in different directions, and the three lead areas are all pasted with a film 82. In the conductive film 5 corresponding to the one-time film pasting mode, the specific number and distribution of the lead areas are set according to needs and actual production, and the positions of the lead areas can be distributed on the same side or multiple sides.

[0112] In summary, the film laminating device 1420 can be used for large-format films (for example, films with a width of 86 inches) or simultaneous film laminating at multiple points on multiple formats. The film laminating device 1420 works intermittently, that is, when laminating, the front half of the film (that is, the film in the film laminating device 1420 and the unwinding unit 1410) is stationary.

[0113] The conductive film 5 with the film attached thereto outputted from the working platform is further transferred forward to the buffer unit 1430 .

[0114] 3. Buffer unit 1430

[0115] The buffer unit 1430 is used to perform buffering processing on the conductive film 5 with the film attached thereto outputted by the film attaching device 1420, so as to store or release the conductive film 5 with the film attached thereto. Fig.15 In the illustrated embodiment, the buffer unit 1430 includes a first side plate 1431, a second side plate 1432, a first fixed roller 1433, a second fixed roller 1434 and a sliding roller 1435. The first side plate 1431 and the second side plate 1432 are opposite to each other and are placed vertically. A first vertical slide groove 14312 is provided on the inner side surface of the first side plate 1431, and a second vertical slide groove (not shown) is provided on the inner side surface of the second side plate 1432. The first vertical slide groove 14312 is opposite to the second vertical slide groove; two ends of the first fixed roller 1433 are respectively fixed to the first side plate 1431 and the second side plate 1432, and are located on one side of the first vertical slide groove 14312 and the second vertical slide groove; two ends of the second fixed roller 1434 are respectively fixed to the first side plate 1431 and the second side plate 1432, and are located on one side of the first vertical slide groove 14312 and the second vertical slide groove; two ends of the second fixed roller 1434 are respectively fixed to the first side plate 1431 and the second side plate 1432, and are located on one side of the first vertical slide groove 14312 and the second vertical slide groove; They are fixed on the first side plate 1431 and the second side plate 1432 respectively, and are located on the other side of the first vertical slide groove 14312 and the second vertical slide groove; the two ends of the sliding roller 1435 are located in the first vertical slide groove 14312 and the second vertical slide groove respectively, and the sliding roller 1435 can slide vertically along the first vertical slide groove 14312 and the second vertical slide groove; the conductive film 5 with the film attached output by the working platform passes through the first fixed roller 1433, the sliding roller 1435 and the second fixed roller 1434 in sequence. Preferably, the side surface of the first vertical slide groove 14312 is a tooth surface structure 14314, the side surface of the second vertical slide groove is also a tooth surface structure (not shown), and the two ends of the sliding roller 1435 are tooth surface structures (not shown).

[0116] The specific working process of the buffer unit 1430 is as follows: when the conductive film 5 between the first fixed roller 1433 and the second fixed roller 1434 becomes longer, the sliding roller 1435 moves down along the first vertical slide groove 14312 and the second vertical slide groove to store the conductive film 5 with the film attached; when the conductive film 5 between the first fixed roller 1433 and the second fixed roller 1434 becomes shorter, the sliding roller 1435 moves up along the first vertical slide groove 14312 and the second vertical slide groove to release the conductive film 5 with the film attached stored in the buffer unit 1430. In other embodiments, the buffer unit 1430 may also adopt other existing buffer units of other structures, as long as it can buffer the conductive film 5 with the film attached output by the working platform, which will not be described in detail here.

[0117] The conductive film 5 with the film attached thereto outputted by the buffer unit 1430 is further conveyed forward to the dust-binding device 1440 .

[0118] 4. Dust-binding device 1440

[0119] The dust-binding device 1440 is used to perform dust-binding treatment on the conductive film 5 with the film attached thereto outputted from the buffer unit 1430. Fig.15 In the illustrated embodiment, the dust-adhering device 1440 includes one or more dust-adhering rollers 1442, and the conductive film 5 passes through the one or more dust-adhering rollers 1442 to remove dust from the surface of the conductive film 5. In other embodiments, the dust-adhering device 1440 may also be omitted.

[0120] The conductive film 5 after the dust-binding treatment outputted from the dust-binding device 1440 is further conveyed forward to the gluing device 1450 .

[0121] 5. Gluing device 1450

[0122] The gluing device 1450 is used to receive the dust-adhesive conductive film 5 output by the dust-adhesive device 1440, and inject UV glue on the side of the conductive film 5 where the film is attached. Fig.15 In the embodiment shown, the gluing device 1450 is placed perpendicular to the conveying direction of the conductive film 5. When the conductive film 5 passes through the gluing device 1450, the gluing device 1450 slidably injects slurry on the conductive film 5 along the direction perpendicular to the conveying direction of the conductive film 5. The gluing device 1450 can inject light-curing materials such as UV glue or heat-curing materials. Fig.14 In the specific embodiment shown, the slurry injected by the gluing device 1450 is UV glue (which can be called ultraviolet light curing glue).

[0123] The conductive film 5 with the UV glue injected on the surface outputted by the glue applying device 1450 is further conveyed forward to the curing unit 1460 .

[0124] 6. Curing unit 1460

[0125] The curing unit 1460 is used to receive the conductive film 5 with UV glue injected on the surface output by the glue-applying device 1450, and perform molding and UV curing treatment on the conductive film 5 with UV glue injected on the surface. Fig.15 In the illustrated embodiment, the curing unit 1460 includes a curing device (not shown), and a slurry pressing roller 1462, a plate roller 1464, and a peeling roller 1466, which are located above the curing device and arranged in sequence. When the conductive film 5 with UV glue injected on the surface passes through the slurry pressing roller 1462, the slurry pressing roller 1462 presses the UV glue on the surface evenly, and then passes through the plate roller 1464 for molding. Fig.15In the embodiment shown, the surface of the plate roller is smooth and has no structure. The specific surface structure of the plate roller is set according to actual needs. After molding, the curing device performs UV curing treatment on the conductive film 5 with UV glue injected on the surface, and the UV-cured conductive film 5 is peeled off by the peeling roller 1466. In another embodiment, the slurry pressing roller 1462, the plate roller 1464 and the peeling roller 1466 arranged in sequence can also be located below the curing device. When the gluing device 1450 injects light-curing materials such as UV glue, the curing device can be a light-curing device such as a mercury lamp or an LED lamp; in addition, the gluing device 1450 can also inject heat-curing materials. At this time, a heat-curing device, such as an infrared heating device, is selected for curing.

[0126] The conductive film 5 after UV curing outputted from the curing unit 1460 is further conveyed forward to the winding unit 1470 .

[0127] 7. Rewinding unit 1470

[0128] The reeling unit 1470 is used to receive the conductive film 5 output by the curing unit 1460 after being UV cured and peeled off. Fig.14 In the illustrated embodiment, the winding unit 1470 includes a protective film roller 1472, a compounding device (not labeled), and a receiving roller 1474. The protective film roller 1472 is used to provide a second protective film (not labeled); the compounding device is used to compound the second protective film with the conductive film 5 after curing to form a second composite film (not labeled); and the receiving roller 1474 is used to recycle the second composite film.

[0129] In an alternative embodiment, the structure of the winding unit 1470 may be changed without affecting the operation of the film processing system. For example, in one embodiment, if the conductive film 5 does not need to be coated for protection, the protective film roller 1472 and the composite device do not need to be provided; for another example, if the conductive film 5 does not need to be coated for preservation, but is directly transferred to the next process of the assembly line for processing, then the protective film roller 1472, the composite device, and the receiving roller 1474 do not need to be provided. Of course, there are many other ways to change the structure of the winding unit 1470, which will not be listed here one by one.

[0130] It should be noted that the buffer unit 1430, the dust sticking device 1440, the gluing device 1450, the curing unit 1460 and the winding unit 1470 work continuously. For the convenience of description, the conductive film 5 before the buffer unit 1430 is called the front half of the film, and the conductive film 5 after the buffer unit 1430 is called the back half of the film. When the film laminating device 1420 is in the film laminating mode, the front half of the film does not move, then the conductive film 5 stored in the buffer unit 1430 is released, and the sliding roller 1435 moves up; then, when the film laminating device 1420 is in the conveying mode, the front half of the film continues to be conveyed, and at this time the conveying speed of the front half of the film is greater than the curing speed of the back half of the film in the curing unit 1460 (or the conveying speed of the back half of the film), then the buffer unit 1430 stores some more conductive film 5, and the sliding roller 1435 moves down.

[0131] It should be noted that, in other embodiments, the conductive film 5 can be replaced by a non-conductive film, the lead area can be replaced by the area to be film-attached, and the UV glue can be replaced by other slurries except UV glue.

[0132] In summary, the beneficial effects of the thin film processing system of the present invention are:

[0133] (1) Realize continuous production of film lamination and UV curing.

[0134] When laminating a large-format film at multiple points, since the position and direction of the laminating equipment may be different, it is necessary to stop the film transmission so that the film can be laminating in a static state, while the gluing and curing units still need to operate continuously. By setting up a buffer unit, the film processing system of the present invention does not require manual intervention during the entire processing process of the conductive film, from removing the first protective film, to laminating the lead area on the conductive film, to filling and curing the conductive film with UV glue, and finally to protecting the conductive film with the second protective film. Continuous production of laminating and slurry curing is achieved, with the characteristics of fast speed and good consistency.

[0135] (2) It is suitable for large-format large-size or multi-format small-size multi-point and multi-directional film lamination to improve product production efficiency and yield.

[0136] The above description has fully disclosed the specific embodiments of the present invention. It should be pointed out that any changes made by those skilled in the art to the specific embodiments of the present invention do not deviate from the scope of the claims of the present invention. Accordingly, the scope of the claims of the present invention is not limited to the above specific embodiments.

Claims

1. A thin film processing system, characterized in that: It includes: An unwinding unit is configured to provide and convey a film, wherein a plurality of areas to be laminated are arranged on the film; A film sticking device configured to stick the film on the to-be-sticked area corresponding to the film; a buffer unit configured to perform buffering on the film with the film attached thereto, so as to store or release the film with the film attached thereto; A gluing device configured to inject slurry on the side of the film to which the film is attached; A curing unit configured to perform a curing treatment on the film with the slurry injected on the surface; A winding unit is configured to receive the film after curing, The film is a conductive film, and the area to be filmed is a lead area on the conductive film. The film sticking device comprises a film sticking assembly configured to stick the film on the to-be-sticked area corresponding to the film; The film sticking assembly comprises: A stripping mechanism, the stripping mechanism is used to strip the composite material strip; A feeding mechanism, used for conveying the composite material strip to the stripping mechanism; A material returning mechanism, used for taking away the base film of the composite material strip separated by the stripping mechanism; A rolling assembly is used to roll the film-laminating composite material strip separated by the peeling mechanism onto the film-laminating area to be laminated. The film sticking equipment also includes: A half-cutting device, used for cutting the film on the composite material strip into film segments of predetermined length before the composite material strip is fed into the stripping mechanism; and a length adjustment device, which can adjust the predetermined length of the film segment obtained by the half-cutting device cutting the film, The half-cutting device comprises a half-cutting driving device and a half-cutting knife. The half-cutting driving device drives the half-cutting knife to perform cutting action. The half-cutting knife cuts the film on the composite material strip into film segments of predetermined length. The length adjustment device includes a scale plate and a slit sensor, the distance between the slit sensor and the peeling edge of the peeling mechanism is equal to a positive integer multiple of the predetermined length, the slit sensor stops feeding the composite material strip into the peeling mechanism after sensing the slit, and controls the first pressing roller to return to the initial state from the pressing state, Before the first pressing roller enters the pressing state, the composite material strip is fed into the stripping mechanism for pre-stripping to obtain a film having a pre-stripping length. After the first pressing roller enters the pressing state, the composite material strip is continuously fed into the stripping mechanism for further stripping to obtain a film having a remaining length of the predetermined length. The half-cutting device cuts the film on the composite material strip after the pre-stripping of the composite material strip is completed, and the sum of the length of the composite material strip between the half-cutting device and the slit sensor of the length adjustment device and the pre-stripping length is equal to the predetermined length. The film pasting equipment includes: A film pasting position positioning device, which is used to locate the transverse position and the longitudinal position of the area to be pasted on the film, wherein the longitudinal direction is the conveying direction of the film, and the transverse direction is the perpendicular direction to the conveying direction of the film; A film pasting position adjustment device, which adjusts the lateral position of the peeling edge of the peeling mechanism based on the lateral position of the film pasting area obtained by positioning; The timing of switching the peeling mechanism from the initial state to the pressing state is determined based on the longitudinal position of the film-applying area obtained by positioning, The film pasting position positioning device includes a camera, a light source and an image recognition unit. The camera is used to photograph the area to be pasted on the film. The image recognition unit is used to recognize the horizontal position and the vertical position of the area to be pasted on the film based on the image photographed by the camera.

2. The thin film processing system according to claim 1, characterized in that: The film pasting equipment comprises: A working platform configured to carry the film and move forward; The film sticking device includes a conveying mode and a film sticking mode, and alternates between the conveying mode and the film sticking mode. When the film pasting device is in the conveying mode, the film pasting assembly stops the film pasting operation, the working platform works, and the working platform conveys the film provided by the unwinding unit forward by a preset length, so that the film pasting assembly corresponds to the film pasting area to be pasted on the film carried on the working platform; When the film pasting device is in the film pasting mode, the working platform stops working, and the film pasting assembly works, and the film pasting assembly respectively adheres the film to the corresponding areas to be pasted on the film. The number of the film-sticking components is N, where N is greater than or equal to 1.

3. The thin film processing system according to claim 2, characterized in that: The film before the buffer unit is called the front half film, and the film after the buffer unit is called the back half film. When the film sticking device is in the film sticking mode, the front half of the film does not move, and the buffer unit releases the stored film; When the film laminating device is in the conveying mode, the first half of the film continues to be conveyed. At this time, the conveying speed of the first half of the film is greater than the curing speed of the second half of the film in the curing unit, or the conveying speed of the first half of the film is greater than the conveying speed of the second half of the film, then the buffer unit stores the film.

4. The thin film processing system according to claim 1, characterized in that: The lead areas are located on the same side or multiple sides; The slurry is a UV curing adhesive; The curing unit comprises a curing device, and the curing device is an ultraviolet light curing device.

5. The thin film processing system according to claim 1, characterized in that: The unwinding unit comprises a material unwinding roller and a film taking-up roller. The unwinding roller is used to place a first composite film, wherein the first composite film comprises a film and a first protective film attached to the film; The film receiving roller is used for receiving the first protective film separated from the first composite film.

6. The thin film processing system according to claim 2, characterized in that: The buffer unit includes a first side plate, a second side plate, a first fixed roller, a second fixed roller and a sliding roller. The first side plate and the second side plate are opposite to each other and placed vertically, a first vertical slide groove is arranged on the inner side surface of the first side plate, a second vertical slide groove is arranged on the inner side surface of the second side plate, and the first vertical slide groove is opposite to the second vertical slide groove; Two ends of the first fixed roller are respectively fixed to the first side plate and the second side plate, and are located on one side of the first vertical slide groove and the second vertical slide groove; Two ends of the second fixed roller are respectively fixed to the first side plate and the second side plate, and are located on the other side of the first vertical slide groove and the second vertical slide groove; Two ends of the sliding roller are respectively located in the first vertical sliding groove and the second vertical sliding groove, and the sliding roller can slide vertically along the first vertical sliding groove and the second vertical sliding groove.

7. The thin film processing system according to claim 6, characterized in that: The film with the film attached thereto outputted from the working platform passes through the first fixed roller, the sliding roller and the second fixed roller in sequence. When the film between the first fixed roller and the second fixed roller becomes longer, the sliding roller moves downward along the first vertical slide groove and the second vertical slide groove to store the film with the film attached thereto; when the film between the first fixed roller and the second fixed roller becomes shorter, the sliding roller moves upward along the first vertical slide groove and the second vertical slide groove to release the film with the film attached thereto stored in the buffer unit.

8. The thin film processing system according to claim 7, characterized in that: The side surfaces of the first vertical slide groove and the second vertical slide groove are tooth surface structures; Both ends of the sliding roller are tooth surface structures.

9. The thin film processing system according to claim 1, characterized in that: The gluing device is placed perpendicular to the conveying direction of the film, and when the film passes through the gluing device, the gluing device slidably injects slurry on the film; The curing unit comprises a curing device, and a slurry pressing roller, a plate roller and a stripping roller arranged in sequence. When the film with slurry injected on the surface passes through the slurry pressing roller and the plate roller in sequence, the slurry on the surface of the film is firstly pressed evenly by the slurry pressing roller, and then molded by the plate roller, and the film with slurry injected on the surface is cured by the curing device; The winding unit includes a protective film roller, a composite device and a receiving roller. The protective film roller is used to provide a second protective film; the composite device is used to composite the second protective film with the film after curing to form a second composite film; and the receiving roller is used to recycle the second composite film.

10. The thin film processing system according to claim 1, characterized in that: It also includes a dust-binding device located between the buffer unit and the gluing device. The dust-binding device is used to perform dust-binding treatment on the film output by the buffer unit, and provide the film after the dust-binding treatment to the gluing device.

11. The thin film processing system according to claim 2, characterized in that: The peeling mechanism includes a peeling mechanism body and a peeling edge located at the end of the peeling mechanism body, the peeling mechanism body includes a first guide surface and a second guide surface, the first guide surface and the second guide surface intersect at the peeling edge; the first guide surface of the peeling mechanism body is used to guide the composite material strip to move toward the peeling edge, the peeling edge is used to separate the composite material strip into a base film located on a side close to the peeling mechanism body and a pasting film located on a side away from the peeling mechanism body, and the second guide surface is used to guide the base film to flip over the peeling edge and move away from the peeling edge.

12. The thin film processing system according to claim 11, characterized in that: The rolling assembly has an initial state and a pressing state. When the rolling assembly is in the pressing state, the feeding mechanism and / or the returning mechanism are used to drive the composite material strip and the film on the working platform to move synchronously. The rolling of the rolling assembly can make the film-applying section gradually separated from the composite material strip adhere to the film-applying area to be adhered together. The composite material strip comprises a base film and a pasting film attached to one side of the base film, the composite material strip is driven to move along the first guide surface of the peeling mechanism body toward the peeling edge, and is separated at the peeling edge into a base film located on a side close to the peeling mechanism body and a pasting film located on a side away from the peeling mechanism body, wherein the base film turns over the peeling edge and is driven to move along the second guide surface away from the peeling edge, Before the composite material strip is fed into the stripping mechanism, the film on the composite material strip has been cut into film segments of a predetermined length, while the base film on the composite material strip has not been cut and remains continuous. The stripping mechanism strips the cut film segments of a predetermined length from the composite material strip, and the rolling assembly rolls the separated film segments of a predetermined length onto the area of ​​the film to be filmed.

13. The thin film processing system according to claim 1, characterized in that: The rolling assembly comprises a first rolling roller and a second rolling roller which are arranged at an interval, the first rolling roller being closer to the peeling edge of the peeling mechanism than the second rolling roller, the first rolling roller and the second rolling roller both having an initial state and a pressing state, in which the first rolling roller and the second rolling roller sequentially roll the separated film sections of a predetermined length in the pressing state, The film laminating device further comprises a roller driving device fixedly connected to the second roller, the roller driving device driving the second roller to switch between an initial state and a pressing state, and the second roller returns to the initial state from the pressing state with a predetermined delay compared to the first roller. The peeling mechanism switches between the initial state and the pressing state together with the first pressing roller. The feeding mechanism includes a discharge tray and one or more guide rollers, the return mechanism includes one or more guide rollers, a driving roller and a driven roller matched with the driving roller, a return tray and a return drive device, and the return drive device drives the return tray and one or more driving rollers to rotate, thereby driving the composite material strip and the base film to move. The discharge tray is provided with a brake to provide a certain resistance for the discharge tray. The driven roller can be moved between a clamping position and a distance position under the drive of the roller driving device. When the driven roller is located at the clamping position, the base film is clamped between the driving roller and the driven roller.

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