Carrier, device having a carrier and method for producing a carrier

Abstract

A carrier (100) comprises: a main body (101), the main body being made of a material having a thermal conductivity of at least 380 W / (mK), wherein the main body (101) has a mounting surface (103) for mechanically and thermally connecting to a device (300), wherein the main body (101) has a recess (105), the recess penetrating the main body (101) along a first direction (x) perpendicular to a main extension plane (131) of the main body, an electrically insulating filler (107) is arranged in the recess (105), the filler has another recess (108), the other recess penetrating the filler (107) along the first direction (x), and an inner wall (109) of the filler (107) surrounding the other recess (108) is provided with a conductive coating (110) so as to form a via (111) passing through the main body (101).

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of German patent application 10 2018 131 954.1, the disclosure content of which is incorporated herein by reference. Technical Field

[0003] A carrier and an arrangement comprising a carrier and a substrate are specified. Furthermore, a method for producing a carrier is specified. Summary of the invention

[0004] According to at least one embodiment, the carrier is a mechanically self-supporting component. The carrier is in particular a carrier for an electronic component. The carrier is then in particular designed to mechanically support, carry, electrically conductively contact and / or thermally contact the electronic component. For example, an electronic component can be mounted on the mounting surface of the carrier and can be electrically conductively contacted by means of the carrier. In particular, the carrier is designed to remove heat generated during operation of the electronic component mounted on the carrier from the electronic component. In particular, the carrier is particularly well suited for optoelectronic components such as, for example, light-emitting diodes, light-emitting diode chips, laser diodes or laser diode chips, in order to electrically conductively contact the optoelectronic component and remove heat generated during operation.

[0005] According to at least one embodiment, the carrier has a main body. The main body is formed from a material with a thermal conductivity of at least 380 W / (mK). For example, the main body has a material with a thermal conductivity of at least 390 W / (mK). For example, the main body has a material with a thermal conductivity of at least about 400 W / (mK). For example, the main body has a material having a thermal conductivity that is at least as good as the thermal conductivity of copper. The main body is especially formed from metal. For example, the main body is formed from copper. For example, the main body consists of copper. The main body is formed, for example, to at least 99.8% of Cu. A sufficiently high thermal conductivity of the main body can thereby be achieved.

[0006] According to at least one embodiment, the main body has a mounting surface. The mounting surface is used for mechanical and thermal connection with the component. The component, for example an optoelectronic component, can be fixed on the mounting surface so that heat generated during operation can be coupled into the main body via the mounting surface and can be discharged. In addition, the mounting surface is designed to mechanically support and stabilize the component.

[0007] According to at least one embodiment, the main body has a recess. The recess penetrates the main body along a first direction perpendicular to the main extension plane of the main body. In the main extension plane, the carrier has a greater extension along the first direction than transversely to the main extension direction. The first direction extends in particular perpendicular to the mounting surface. The recess is introduced into the main body, for example by means of an ear. The recess penetrates the main body in particular completely along the first direction. The recess has a circular shape in a cross section in the main extension plane, for example. Other shapes are also possible.

[0008] According to at least one embodiment, an electrically insulating filler is arranged in the recess. The electrically insulating filler is in direct contact with the main body surrounding the recess. The main body is electrically insulated at the recess by means of the electrically insulating filler, so that no or substantially no current can flow from the main body through the electrically insulating filler. The electrically insulating filler is formed, for example, by means of a polymer or ceramic. In particular, the filler is introduced into the recess by means of a pressing process.

[0009] According to at least one embodiment, the filler has a further recess. The further recess penetrates, in particular completely penetrates, the filler along the first direction. The recess and the further recess are in particular concentrically or approximately concentrically formed. The further recess is introduced into the filler, for example, by means of drilling. The diameter of the further recess is in particular smaller than the diameter of the recess. The recess is completely surrounded by the insulating filler, in particular in a cross section in the main extension plane. Along the first direction, the further recess is open at the first end and the second end. The further recess is electrically insulated from the main body by means of the filler.

[0010] According to at least one embodiment, the inner wall of the filler surrounds the further recess. The inner wall has, for example, the shape of a cylindrical side surface.

[0011] According to at least one embodiment, the inner wall is provided with a conductive coating. For example, the conductive coating has copper or is formed by copper. For example, the conductive coating is applied to the inner wall of the filler by electroplating. The conductive coating extends through the main body in the other recess along the first direction. The conductive coating is spaced apart from the main body. The filler separates the main body and the coating from each other. The main body and the conductive coating are electrically insulated from each other by means of the filler.

[0012] According to at least one embodiment, the filler and the conductive coating form a via through the body. The via is formed in the recess of the body to electrically connect the side of the body having the mounting surface and the side opposite along the first direction. The body itself, in particular the area on which the mounting surface is formed, is not used for electrical conduction, but is primarily used to dissipate heat generated by the component during operation.

[0013] For example, components such as high-power electronic components, such as high-power LEDs, generate a lot of waste heat in addition to the intensive light during operation. This waste heat can be effectively discharged with the aid of the carrier. As a result, the component can be operated reliably and, for example, the desired brightness can be achieved. In addition, the carrier allows integration into the device by means of soldering.

[0014] In this case, the carrier described here is also based on the following considerations. Ceramic substrates for high-power LED chips have, for example, a plurality of contact pads for electrical contact and contact pads for thermal contact on their underside. Alternatively, metal alloy substrates are used. The metal alloy substrates have solder pads in which thermal and electrical contact are combined. In addition, alloys generally have a low thermal conductivity, in particular a thermal conductivity of less than 200 W / (mK). In addition, the thickness is generally limited to less than 500 μm and has reduced heat dissipation and less mechanical stability compared to metal core circuit boards.

[0015] Now, the carrier described here also uses the following idea, that is, a carrier with sufficient thickness composed of pure copper has very good thermal properties. In addition, fixing by means of screws or clamps can be abandoned. The carrier described here therefore combines the advantages of ceramic substrates, metal alloy substrates and metal core circuit boards. The main body is mainly formed by pure copper. Along the first direction, the main carrier has sufficient thickness so that sufficient heat can be discharged as desired during operation. The thickness is, for example, in the range of 1mm, for example, between 0.75mm and 1.25mm. Due to the through-holes electrically insulated from the main body by means of the coating, the thermal connection and electrical connection of the carrier are separated from each other. In particular, multiple electrical contact locations and thermal coupling surfaces separated therefrom can be realized. The carrier thus has a high thermal conductivity and can be soldered for electrical connection and thermal connection. A surface-mountable carrier (SMT) is thus formed. The carrier with a main body composed especially of pure copper has a thermal conductivity of about 400W / (mK). The thermal conductivity is particularly significantly higher than in the case of a ceramic substrate or a conventional lead frame. The carrier can also be contacted electrically and thermally by means of soldering, in contrast to conventional carriers based on metal core substrates, in particular copper.

[0016] According to at least one embodiment, the carrier has an electrical contact pad for electrical coupling to the device. The contact pad is electrically insulated from the main body. The contact pad is electrically connected to the cover. As a result, the contact pad can be electrically contacted from the side of the carrier facing away from the mounting side by means of a via. The electrical contact pad for electrical coupling to the device is formed separately from the mounting surface for thermal coupling to the device.

[0017] According to at least one embodiment, the main body has a first plane in the same direction as the main extension plane. The mounting surface is arranged in the first plane.

[0018] The contact pad is arranged offset from the first plane along the first direction. The mounting surface and the contact pad are thus arranged offset from each other along the first direction. Thus, electrical insulation between the main body having the mounting surface and the contact pad can be achieved.

[0019] According to at least one embodiment, the electrically insulating material is arranged between the contact disc and the main body along the first direction. As a result, the contact disc is electrically insulated from the main body. In addition, the electrically insulating material causes the contact disc to be arranged offset from the mounting surface. The electrically insulating material is, for example, a polymer or other dielectric.

[0020] According to at least one embodiment, the mounting surface is arranged on an area protruding above the first plane in the first direction. The main body has a protruding area. On the protruding area, laterally next to the mounting surface, the contact disk is formed, in particular, in the same plane as the mounting surface. Between the contact disk and the main body, an insulating material is arranged, and the main body is set back laterally next to the protruding area compared to the protruding area. As a result, the contact disk is electrically insulated from the main body and the mounting surface.

[0021] According to at least one embodiment, the carrier has an electrically conductive contact location. The electrically conductive contact location is arranged on a side of the main body facing away from the mounting surface. The contact location is electrically insulated from the main body.

[0022] The contact point is electrically conductively connected to the coating. The contact point forms an electrical contact between the carrier and the other substrate. The electrical contact point is in particular solderable, i.e. can be electrically conductively connected to the other substrate by means of soldering, for example. The conductive contact point is electrically conductively connected to the contact pad by means of the coating. The via makes it possible to form the conductive contact point on the side facing away from the mounting surface and to form the contact pad on the side of the mounting surface.

[0023] According to at least one embodiment, the inner cavity of the via is laterally delimited by the coating. The coating surrounds the inner cavity. The inner cavity is hollow or filled with air according to an embodiment. According to other embodiments, the inner cavity is filled with another filler. The other filler prevents solder or other components from entering the via, especially the inner cavity, especially during production.

[0024] According to at least one embodiment, the carrier comprises a plurality of vias which are formed corresponding to one another. The vias are in particular each formed as described here and each comprise a filling and a coating.

[0025] Furthermore, a device is proposed, which has a carrier and a substrate. The device has in particular a carrier as described here. All features and advantages applicable to the carrier also apply to the carrier of the device and vice versa.

[0026] According to at least one embodiment, the carrier is fixed to the substrate on the side of the body facing away from the mounting surface. The substrate has at least one conductor track and at least one heat sink. The body is directly connected to the heat sink in a heat-conducting manner. The coating is electrically conductively connected to the conductor track. In particular, the carrier and the substrate are connected to each other by means of welding. In particular, a large-area connection of the body to the heat sink is achieved. Therefore, the heat generated during operation can be reliably discharged into the substrate by means of the carrier. The substrate has copper or is formed by copper, for example.

[0027] For example, the device has a plurality of carriers, which are in direct contact with a common substrate. For example, electrical and thermal contact between the carriers and the electronic components arranged on the carriers can be achieved by means of the substrate.

[0028] Furthermore, a method for producing a carrier is proposed. With the aid of the method, it is particularly possible to produce the carrier described here. Accordingly, all features and advantages described for the carrier also apply to the method and vice versa.

[0029] According to at least one embodiment, a main body is provided, which is composed of a material having a thermal conductivity of at least 380 W / (mK). The main body has a mounting surface, which is used to mechanically and thermally connect to the device. The recess is introduced into the main body completely along a first direction perpendicular to the main extension plane of the main body. For example, the recess is drilled into the main body. The recess extends completely through the main body.

[0030] According to at least one embodiment, an electrically insulating filler is introduced into the recess. For example, the electrically insulating filler comprises a polymer. For example, the electrically insulating filler is pressed into the recess. The insulating filler, for example, first completely fills the recess.

[0031] According to at least one embodiment, the further recess is introduced into the filler completely along the first direction. For example, the further recess is introduced into the filler by means of drilling. The further recess extends completely through the filler.

[0032] According to at least one embodiment, the further recess is surrounded by the inner wall of the filler. The inner wall of the filler is coated with a conductive coating. For example, the inner wall is coated with electroplating. Thus, according to at least one embodiment, the via is formed by the main body. The conductive coating is electrically insulated from the main body. This is achieved by introducing an electrically insulating filler into the recess of the main body, into which the further recess is introduced. The electrically insulating filler thus separates the main body from the conductive coating.

[0033] According to at least one embodiment, providing the main body includes forming a mounting surface of the main body on a region of the main body that protrudes along the first direction. The electrically insulating material is arranged laterally next to the protruding region. The contact pad is formed on the side of the electrically insulating material facing away from the main body. The contact pad is formed so that it is electrically connected to the coating. It is thus possible to manufacture the carrier so that the contact pad and the mounting surface are electrically separated from each other. As a result, thermal connection and electrical connection are achieved separately from each other.

[0034] According to at least one embodiment, providing the main body includes coating the main surface of the main body with an electrically insulating material. The electrically insulating material is removed in one area. This exposes the mounting surface of the main body. The contact pad is formed on the side of the electrically insulating material facing away from the main body. The contact pad is connected to the coating. This allows the electrical connection and the thermal connection to be separated at the carrier.

[0035] According to at least one embodiment, the coupling surface is formed on a side of the main body facing away from the mounting surface. The coupling surface is used to directly connect the main body to a heat sink of the base plate.

[0036] According to at least one embodiment, providing the main body comprises providing the main body consisting of copper. The main body is particularly composed of copper approximately completely or completely, for example 99.8% or more. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Further advantages, features and improvements are derived from the embodiments described below in conjunction with the drawings. Identical, similar and identically functioning elements may be provided with the same reference numerals. The drawings and the size relationships of the elements shown in the drawings to one another are not to be regarded as being true to scale. Rather, individual elements may be shown exaggeratedly for better illustration and / or for better understanding.

[0038] The accompanying drawings show:

[0039] Figure 1 A schematic diagram showing an apparatus according to one embodiment;

[0040] Figure 2 A schematic diagram showing a carrier according to one embodiment;

[0041] Figure 3 shows a schematic cross-sectional view of a carrier according to one embodiment;

[0042] Figure 4 Show according to Figure 3 A schematic diagram of the details of the vector;

[0043] Figure 5 A schematic diagram showing a carrier according to one embodiment;

[0044] Figure 6 A schematic diagram showing an apparatus according to one embodiment;

[0045] Figure 7 shows a schematic cross-sectional view of a device according to one embodiment;

[0046] Figure 8 shows a schematic cross-sectional view of a device according to one embodiment;

[0047] Fig. 9A schematic diagram showing a carrier according to one embodiment; and

[0048] Fig.10 A schematic cross-sectional view of a carrier according to one embodiment is shown. DETAILED DESCRIPTION

[0049] Figure 1 A schematic diagram of a device 200 is shown. The device 200 comprises a carrier 100 and a substrate 120. The carrier 100 and the substrate 120 are connected to one another, for example by means of a solder connection. The solder connection comprises, for example, solder 127.

[0050] The carrier 100 is designed, in particular, to electrically and thermally contact the electronic component 300 ( Figure 5 ), for example optoelectronic devices such as LEDs or LED chips.

[0051] The carrier 100 has a main body 101. The main body 101 is formed of copper and consists essentially of pure copper. This results in a thermal conductivity of the main body 101 of at least 380 W / mK, in particular about 400 W / mK. The material 102 of the main body 101 is selected so that a sufficiently high thermal conductivity is obtained. The material 102 is in particular copper or at least 99.8%, for example at least 99.9%, is copper.

[0052] The main body 101 has a mounting surface 103. The mounting surface 103 is used to carry the device 300. The mounting surface 103 forms a mechanical and thermal interface between the main body 101 and the device 300.

[0053] For electrically contacting the component 300 , the carrier 100 has at least one contact pad 112 , in particular a plurality of contact pads 112 .

[0054] The contact pad 112 is electrically conductively connected to the conductive coating 110. In particular, the contact pad 112 and the coating 110 are at least partially in direct contact with each other. The coating 110 extends through the main body 101 along the first direction x to the side 117 of the main body 101 facing away from the mounting surface 103. On the side 117, the coating 110 is electrically conductively connected to the contact location 116. The contact location 116 is used to electrically contact the carrier 100. The side of the main body 101 on which the mounting surface 103 is formed and the side 117 of the main body 101 facing away from it are therefore electrically connected to each other by means of the via 111. The via 111, the contact pad 112 and the contact location 116 are in particular electrically insulated from the mounting surface 103 and the main body 101, respectively.

[0055] The main body 101 has a recess 105 . The recess 105 completely penetrates the main body 101 along the x direction. The main body 101 has a main extension plane 131 , which is particularly developed by the y direction and the z direction. Transversely thereto, the main body 101 is penetrated by the recess 105 .

[0056] The recess 105 is at least partially filled with an electrically insulating filler. The filler 107 is, for example, plastic or another electrically insulating material. The filler 107 is, for example, introduced into the recess 105 so that the filler 107 first completely fills the recess 105.

[0057] A further recess 108 is introduced into the filler 107. The further recess 108 completely penetrates the filler 107 along the first direction x. For example, the further recess 108 is drilled into the filler 107 or introduced in another way so that the filler 107 is completely penetrated along the first direction. The inner wall of the filler 109 surrounds the further recess 108 laterally along the y direction and along the z direction.

[0058] The inner wall of the filler 109 is coated with a coating 110. The coating 110 in the other recess 108 thus has the shape of a cylindrical side surface.

[0059] In particular, the other recess 108 within the coating 110 is hollow. The coating 110 surrounds the inner cavity 118. The inner cavity 118 extends through the main body 101 in particular along the first direction. The coating 110 is thus an electrically conductive connection that passes through the main body 101 along the first direction x. The electrically conductive connection is electrically insulated from the main body 101. With the help of the via 111, the carrier is thus formed as a surface-mountable component. The electrical contact at the contact point 116 and the coupling surface for thermally connecting the carrier 100 are formed at the side 117.

[0060] The size of the body portion 101 is designed to be large enough to ensure sufficient heat dissipation from the device 300 to the substrate 120. The selection of the material 102 and the geometry of the body portion 101 can achieve sufficient heat dissipation when the device 300 is in operation.

[0061] exist Figure 1 In the embodiment of the present invention, the mounting surface 103 is arranged on the protruding area 115 of the main body 101. The first plane 113 of the main body 101 is arranged offset from the mounting surface 103 along the x direction. The first plane 113 is coated with an electrically insulating material 114, for example, next to the protruding area 115. Along the first direction x, a contact pad 112 is arranged on a side 124 of the electrically insulating material 114 facing away from the main body 101. Therefore, the electrically insulating material 114 is arranged between the contact pad 112 and the main body 101 along the first direction x.

[0062] Since the mounting surface 103 is arranged on the protruding area 115, the mounting surface 103 and the contact pad 112 are still arranged at the same height in a common plane along the first direction x. In the plane, an electrically insulating material 114 is also arranged between the mounting surface 103 and the contact pad 112. It is also possible to abandon the electrically insulating material 114 here.

[0063] In the yz plane, the contact pad 112 and the protruding region 115 with the mounting surface 103 are spaced apart from each other so that the contact pad 112 and the mounting surface 103 are electrically insulated from each other.

[0064] The substrate 120 has conductor tracks 121. The conductor tracks can be connected to a voltage source, for example. The substrate 120 also has a heat sink 122. The heat sink is used, in particular, to dissipate heat generated during operation.

[0065] The carrier 100 is connected to the conductor track 121 by means of the contact locations 116. The contact locations 116 and the conductor track 121 are directly connected to one another in an electrically conductive manner. The conductor track 121 thus provides the component 300 with electrical power, for example.

[0066] The main body 101 is directly connected to the heat sink 122 on the coupling surface 125. For example, a solder 127 is provided between the coupling surface 125 and the heat sink 122, and the solder realizes a mechanical connection and a thermal connection between the carrier 100 and the substrate 120. Thus, a thermal connection 126 is formed between the carrier 100 and the substrate 120. The thermal connection has a large area and a conductive capacity sufficient to realize the desired high heat transfer.

[0067] The device 300 can be placed on the mounting surface 103. For example, the device 300 is connected to the carrier 100 by means of gold-tin thin film welding. Mechanical and thermal connections with the device 300 are achieved on the mounting surface 103. Heat dissipation is achieved below the device 300 along the first direction x by means of the main body 101. The carrier 100 is thermally connected to the substrate 120 with a large area downward by means of the coupling surface 125.

[0068] Electrical contact is made on the top side of the carrier 101 by means of copper applied to a dielectric as an electrically insulating material 114, which forms the contact pads 112. The electrical connection between the contact pads 112 and the component 300 is made by means of wire bonding, for example.

[0069] A recess 105 is introduced into the main body 101. The recess is filled with a dielectric as filler 107. The dielectric is then drilled through. The coating 110 is then metallized. This results in a continuous electrical contact from the top to the bottom 117 of the carrier 100. In particular, it is possible to avoid the electrical potential of the thermal mounting surface 103 being determined.

[0070] The connection between the carrier 100 and the substrate 120 is performed, for example, by means of vapor phase soldering. Here, for example, tin solder 127 is used. The substrate 120 is, for example, a metal core circuit board. The carrier 100 can achieve thermal and electrical connection of the component 300 based on the main body 101 composed of copper. This can achieve sufficiently high heat transfer and good mechanical stability. In addition, a surface-mountable carrier 100 can be realized.

[0071] Figure 2 1 shows a perspective view of a carrier 100. A mounting surface 103 is realized in the middle. Two contact pads 112 are provided, which are electrically insulated from each other. Each contact pad 112 has a plurality of vias 111, which are particularly connected to the bonding pad 112. Figure 1 The via 111 described above is constructed accordingly. Figure 2 In FIG. 1 , three vias 111 are shown for each contact pad 112. More or fewer vias 111 may also be provided.

[0072] Figure 3 The carrier 100 is shown along Figure 2 A cross-sectional view of plane A.

[0073] The vias 111 extend completely through the main body 101 along a first direction x. Here, the contact pads 112 are electrically insulated from the material 102 of the main body 101 by means of an electrically insulating material 114. The coating 110 is electrically insulated from the material 102 by means of a filler 107. In the yz plane, the main body 101 is first arranged along the direction y. Then the filler 107 follows. Then the coating 110 follows. Then the inner cavity 118 follows. Then the coating 110 follows again. Then the filler 107 follows again. Then the material 102 of the main body 101 follows. All vias 111 are formed accordingly.

[0074] Figure 4 A detailed view of via 111 is shown according to one embodiment.

[0075] The recess 105 has a first diameter 128. The first diameter 128 is in particular in the millimeter range. For example, the first diameter has a value of 1.5 mm to 3 mm, for example 2.5 mm.

[0076] The further recess 108 has a second diameter 129. The second diameter 129 is smaller than the first diameter 128. The first diameter 128 is, for example, twice as large as the second diameter 129. The first diameter 128 is, for example, 1.5 to 3 times as large as the second diameter 129. The second diameter 129 is, for example, in the range of 0.5 mm to 1 mm.

[0077] The body part 101 has a thickness 130 along the first direction x. The thickness 130 is, for example, approximately 1 mm, for example between 0.8 mm and 2 mm. An electrically insulating material 114 is arranged laterally above and below the body part 101 beside the mounting surface 103 along the x direction.

[0078] Figure 5 Shown along Figure 2 sectional view of plane B. Furthermore, a component 300 is schematically shown.

[0079] Along the first direction x, the contact pads 112 are arranged spaced apart from the first plane 113 of the main body 101. An electrically insulating material 114 is arranged between the contact pads 112 and the main body 101 along the first direction x. In the region of the mounting surface 103, a protruding region 115 of the main body 101 extends through the electrically insulating material 114 along the first direction. A plurality of structured electrical contact pads 112 are formed on the upper side of the carrier 100, which can also be referred to as electrical conductor tracks.

[0080] A plurality of electrical contacts formed by means of the contact locations 116 , the coating 110 and the contact pads 112 can be connected in parallel.

[0081] Figure 6 A plan view of an arrangement 200 according to an exemplary embodiment is shown. The carrier 100 is arranged on a substrate 120 and is electrically connected to conductor tracks 121 .

[0082] Figure 7 Show according to Figure 6 2 is a cross-sectional view of a device 200. The carrier 100 is thermally coupled to the base plate 120 at the coupling surface 125 by means of solder 127. An electrical connection is established between the via 111 and the conductor track 121.

[0083] Figure 8 A cross section is shown in the region of via 111. Solder 127 can penetrate into via 111, in particular into inner cavity 118, when inner cavity 118 is not filled.

[0084] According to an embodiment, an additional filler 119 is arranged in the inner cavity 118 of the via 111. For example, the additional filler 119 is pressed into the inner cavity in order to avoid the entry of solder. Uncontrolled diffusion of solder can be avoided. In particular, the orientation of the carrier 100 relative to the substrate 120 becomes more reliable and overturning can be avoided. However, according to other embodiments, the additional filler 119 can be abandoned. According to an embodiment, the additional filler 119 is planarized with copper on the upper side and / or on the lower side. The electrical connection is improved and the solder 127 is prevented from rising into the inner cavity 118.

[0085] Fig. 9 and 10A carrier 100 according to further embodiments is shown. The via 111 corresponds to the via as described so far.

[0086] According to Figures 1 to 8 The carrier is 100 different, according to Fig. 9 and 10 The carrier 100 has no protruding region 115 .

[0087] The mounting surface 103 is formed in a first plane 113. The main body 101 has a planar main surface 106 on the mounting surface 103. An electrically insulating material 114 is applied to the main surface 106. During production, the electrically insulating material 114 is first applied to the main surface 106 over the entire surface. Subsequently, the electrically insulating material 114 is removed again in the region 123 in order to expose the mounting surface 103 again. Thus, no electrically insulating material 114 is provided in the region 123.

[0088] The contact pad 112 is arranged on the side 124 of the electrically insulating material 114 facing away from the main body 101. Thus, along the first direction x, the contact pad 112 is arranged spaced apart from the mounting surface 103. The mounting surface 103 and the contact pad 112 are arranged in different planes.

[0089] In accordance with Figures 1 to 8 In the embodiment with the protruding region 115, copper is etched to produce the body 101 so as to form the protruding region 115 and the region recessed relative thereto along the first plane 113. Subsequently, an electrically insulating material 114 and contact pads 112 are applied so as to obtain a carrier 100 with a constant height on the top side.

[0090] Different from this, according to Fig. 9 and 10 In the embodiment of the present invention, the main body 101 is not etched. The electrically insulating material 114 is first applied as a dielectric to the main surface 106 of the main body 101 over the entire surface and then removed again in places to expose the access to the main body 101 composed of copper. This ensures that the component 300 is placed on the main body 101 composed of copper.

[0091] According to other exemplary embodiments, it is also possible to apply electrically insulating material 114 already in a structured manner, such that mounting area 103 remains exposed.

[0092] The carrier 100 forms an interface for the component 300, which allows sufficiently effective removal of waste heat generated during operation of the component 300. In this case, the carrier 100 can be connected to other circuits, such as a substrate 120, by means of soldering. As a result, the carrier 100 can be realized with very high thermal conductivity, which can be soldered for electrical and thermal connection, in particular as a surface-mountable component.

[0093] The invention is not limited to the exemplary embodiments by the description based on the exemplary embodiments. Rather, the invention includes any new features and any combination of features, which in particular includes any combination of features in the exemplary embodiments, even if the features or the combination themselves are not described in detail in the exemplary embodiments.

[0094] Reference numerals list

[0095] 100 vectors

[0096] 101 Main body

[0097] 102 Materials

[0098] 103 Mounting surface

[0099] 105 recess

[0100] 106 Main side

[0101] 107 Filler

[0102] 108 Another recess

[0103] 109 Inner wall of filler

[0104] 110 Coating

[0105] 111 Via

[0106] 112 Contact plate

[0107] 113 First Plane

[0108] 114 Insulation Materials

[0109] 115 Prominent Areas

[0110] 116 Contact area

[0111] 117 The side away from the main body

[0112] 118 Lumen

[0113] 119 Additional Filling

[0114] 120 substrate

[0115] 121 Printed conductor

[0116] 122 Heat sink

[0117] 123 Area

[0118] 124 Side of electrical insulating material

[0119] 125 Coupling surface

[0120] 126 Thermal connection

[0121] 127 Solder

[0122] 128 First diameter

[0123] 129 Second diameter

[0124] 130 Thickness

[0125] 131 Main extension plane

[0126] 200 Installations

[0127] 300 devices

[0128] x, y, z directions

Claims

1. A carrier (100), comprising: - a main body (101) consisting of a material (102) having a thermal conductivity of at least 380 W / (mK), wherein The main body (101) has a mounting surface (103) for mechanical and thermal connection with the device (300), wherein - the main body (101) has a recess (105) penetrating the main body (101) along a first direction (x) perpendicular to a main extension plane (131) of the main body, - an electrically insulating filler (107) is arranged in the recess (105), the filler having a further recess (108) penetrating the filler (107) along the first direction (x), - an inner wall (109) of the filler (107) surrounding the further recess (108) is provided with a conductive coating (110) so as to form a through hole (111) passing through the main body (101), wherein the main body (101) has a first plane (113) in the same direction as the main extension plane (131), wherein the mounting surface (103) is arranged on a protruding area (115) higher than the first plane (113) along the first direction (x), and wherein The inner cavity (118) delimited laterally by the coating (110) has a further filling (119) which is planarized with copper.

2. The carrier according to claim 1, comprising: - an electrical contact pad (112) for electrically coupling with the device (300), wherein the contact pad (112) is electrically insulated from the body portion (101) and the contact pad is electrically connected to the cover (110).

3. The vector according to claim 2, The main body (101) has a first plane (113) in the same direction as the main extension plane (131), the mounting surface (103) is arranged in the first plane (113), and the contact plate (112) is arranged offset from the first plane (113) along the first direction (x).

4. The vector according to claim 2 or 3, The electrically insulating material (114) is arranged between the contact plate (112) and the main body (101) along the first direction (x).

5. A carrier according to any one of claims 1 to 3, comprising an electrically conductive contact location (116) on a side (117) of the main body (101) facing away from the mounting surface (103), wherein the contact location (116) is electrically insulated from the main body (101) and is electrically conductively connected to the coating (110). 6 . The carrier according to claim 1 , comprising a plurality of vias ( 111 ) which are formed corresponding to one another.

7. The vector according to any one of claims 1 to 3, The material (102) of the main body is copper.

8. A device comprising a substrate (120) and a carrier (100) according to any one of claims 1 to 7, wherein On the side of the main body (101) facing away from the mounting surface (103), the carrier (100) is fixed on the substrate (120), wherein - the substrate (120) has at least one conductor track (121) and at least one heat sink (122), - the main body (101) is directly thermally coupled to the heat sink (122), and The coating (110) is electrically conductively connected to the conductor track (121).

9. A method for manufacturing a carrier (100), the method comprising: - providing a body portion (101), the body portion being composed of a material having a thermal conductivity of at least 380 W / (mK), wherein the body portion (101) has a mounting surface (103) for mechanical and thermal connection with the device (300); - introducing the recess (105) into the main body (101) entirely along a first direction (x) perpendicular to a main extension plane (131) of the main body (101); - introducing an electrically insulating filler (107) into the recess (105); - introducing a further recess (108) completely into the filler (107) along the first direction (x); - coating the inner wall (109) of the filler (107) surrounding the further recess (108) with a conductive coating (110), thereby - forming a through hole (111) passing through the main body (101), wherein providing the main body (101) comprises: - a mounting surface (103) of the main body (101) is formed on a region (115) of the main body (101) that protrudes along the first direction (x); - arranging an electrically insulating material (114) laterally beside the protruding area (115); A contact pad (112) is formed on the side (124) of the electrically insulating material (114) facing away from the main body (101), the contact pad being electrically connected to the covering (110), and wherein The inner cavity (118) delimited laterally by the coating (110) has a further filling (119) which is planarized with copper.

10. The method according to claim 9, The main body (101) includes: - coating the main surface (106) of the main body (101) with an electrically insulating material (114); - removing said electrically insulating material (114) in a region (123) so that - exposing the mounting surface (103) of the main body (101); A contact pad (112) is formed on the side (124) of the electrically insulating material (114) facing away from the main body (101), wherein the contact pad is electrically connected to the coating (110).

11. The method according to claim 9 or 10, A coupling surface (125) is formed on the side (117) of the main body (101) facing away from the mounting surface (103), for directly connecting the main body (101) to a heat sink (122) of a substrate (120).

12. The method according to claim 9 or 10, The main body (101) includes: - Providing said body part (101) consisting of copper.

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