Production line, equipment and method for transferring semiconductor wafers

Abstract

An illustrative embodiment disclosed herein is an apparatus that includes a first carrier tray configured to be coupled to a first wafer support device supporting a plurality of wafers. The first wafer support device includes a first opening. The apparatus includes a second carrier tray configured to be coupled to a second wafer support device. The second wafer support device includes a second opening. The apparatus includes a first motor coupled to the first carrier tray and configured to rotate the first wafer support device until the first opening faces the second opening to allow the plurality of wafers to be transferred from the first wafer support device to the second wafer support device.

Description

Technical Field

[0001] The present application relates to a method and apparatus for transferring a semiconductor wafer, and more particularly, to a method and apparatus for transferring a semiconductor wafer between a first wafer holding device and a second wafer holding device. Background Art

[0002] Conventionally, in order to transfer wafers from a first pod or cassette to a second pod or cassette, users transfer wafers one by one. This requires a lot of time and manpower. In addition, during the manual transfer, the wafers are not protected by the cassette housing and are inevitably exposed to the air. In this case, the wafers may be contaminated, damaged, or otherwise discarded due to the user's incorrect handling of the wafers. Summary of the invention

[0003] An embodiment of the present invention provides a production line (process line) for transferring semiconductor wafers, including a first wafer processing station; a second wafer processing station; and equipment configured to: receive a first wafer supporting device from the first wafer processing station; transfer a plurality of wafers from the first wafer supporting device to the second wafer supporting device; and send the second wafer supporting device to the second wafer processing station.

[0004] An embodiment of the present invention provides an apparatus for transferring semiconductor wafers, comprising: a first loading tray, configured to be coupled to a first wafer supporting device supporting a plurality of wafers, the first wafer supporting device comprising a first opening; a second loading tray, configured to be coupled to a second wafer supporting device, the second wafer supporting device comprising a second opening; and a first motor, coupled to the first loading tray, the first motor being configured to rotate the first wafer supporting device until the first opening faces the second opening to allow the plurality of wafers to be transferred from the first wafer supporting device to the second wafer supporting device.

[0005] An embodiment of the present invention provides a method for transferring semiconductor wafers, comprising: receiving a first wafer supporting device supporting a plurality of wafers, the first wafer supporting device comprising a first opening; receiving a second wafer supporting device comprising a second opening; rotating the second wafer supporting device until the first opening is aligned with the second opening; and transferring the plurality of wafers from the first wafer supporting device to the second wafer supporting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The various aspects of the present disclosure will be best understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the size of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1 is a schematic block diagram of a production line according to some embodiments.

[0008] Figure 2A is a schematic block diagram of an automatic loader for transferring wafers according to some embodiments.

[0009] Figure 2B is a schematic block diagram of an automatic loader for transferring wafers according to some embodiments.

[0010] Figure 3 According to some embodiments Figure 2A A perspective view of an autoloader for transferring wafers is shown.

[0011] Figure 4 According to some embodiments Figure 2A A front view of an autoloader for transferring wafers is shown.

[0012] Figure 5 According to some embodiments Figure 2A A side view of an autoloader for transferring wafers is shown.

[0013] Figure 6 According to some embodiments Figure 2A A top view of an autoloader for transferring wafers is shown.

[0014] Figure 7 is a flow chart of a method for transferring a wafer according to some embodiments. DETAILED DESCRIPTION

[0015] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first feature on or on a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may reuse reference numbers and / or letters in various examples. This repetition is for simplicity and clarity, and does not itself represent the relationship between the various embodiments and / or configurations discussed.

[0016] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein to describe the relationship of one element or feature to another (other) element or feature as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0017] Embodiments of the present disclosure provide an apparatus and method for automatic wafer transfer. Embodiments of the present disclosure reduce or eliminate manual work performed by a user. As a result of these embodiments, various advantages may be obtained, including, for example, improved manufacturing efficiency, reduced manpower requirements, and improved wafer transfer quality and yield (e.g., wafer contamination and wafer waste may be reduced or eliminated).

[0018] According to various embodiments of the present disclosure, an apparatus for semiconductor wafer transfer includes a first carrier tray for placing a first wafer support device, a second carrier tray for placing a second wafer support device, and a motor for rotating the first wafer support device until an opening of the first wafer support device is aligned with an opening of the second wafer support device. In some embodiments, the apparatus includes at least one vertical lift controller, the at least one vertical lift controller being used to move a wafer pod shell of at least one of the first wafer support device or the second wafer support device in a vertical direction. In some embodiments, the apparatus includes a shaft for transferring a plurality of wafers from the first wafer support device to the second wafer support device. In some embodiments, the apparatus includes a plurality of sensors for quality control.

[0019] Figure 11 is a schematic diagram of a production line 100 according to some embodiments. The production line 100 includes a first processing station 102, a first vertical mover 104, a first conveyor belt 106, an automatic loader 108, a second conveyor belt 110, a second vertical mover 112, and a second processing station 114.

[0020] In some embodiments, the first processing station 102 is configured to perform a first processing function (e.g., photolithography) on a plurality of wafers. In some embodiments, the first vertical mover 104 is configured to move the plurality of wafers from the first processing station 102 to a first wafer support device located on a first conveyor belt 106, for example, Figure 2A In some embodiments, the first conveyor belt 106 is configured to move the first wafer support device to the autoloader 108 .

[0021] The autoloader 108 is configured to transfer the plurality of wafers from the first wafer support device to the second wafer support device, for example Figure 2A The second wafer support device 222 shown or about Figure 2B The second wafer support device 282 is shown. In some embodiments, the first wafer support device is a first wafer box, such as Figure 2A The first wafer box shown includes a first cassette 206 and a first wafer box housing 208, and the second wafer support device is a second wafer box, such as Figure 2B The second wafer box including the second cassette 224 and the second wafer box housing 284 is shown. In some embodiments, the first wafer support device is a first cassette, for example Figure 2A The first cassette 206 shown, and the second wafer support device is a second cassette, for example Figure 2A The second cassette 224 is shown. In some embodiments, the first wafer support device is a wafer pod and the second wafer support device is a cassette. In some embodiments, the first wafer support device is a cassette and the second wafer support device is a wafer pod.

[0022] In some embodiments, the second conveyor belt 110 is configured to move the second wafer support device to the second vertical mover 112. In some embodiments, the second vertical mover 112 is configured to move the plurality of wafers from the second conveyor belt 110 to the second processing station 114. In some embodiments, the second processing station 114 is configured to perform a second processing function (e.g., etching) on ​​the plurality of wafers.

[0023] The production line 100 is not limited to two processing stations, two vertical movers, two conveyor belts, and one device. In some embodiments, the production line 100 includes N processing stations, N vertical movers, N conveyor belts, and N-1 devices. According to other other embodiments, the number of processing stations, vertical movers, conveyor belts, and devices may vary.

[0024] Figure 2A is a schematic block diagram of an automatic loader 200 for transferring wafers according to some embodiments. In some embodiments, the automatic loader 200 is similar to the Figure 1 The automatic loader 108 mentioned above. The automatic loader 200 includes a first carrier tray 202, and the first carrier tray 202 is configured to receive and couple to a first wafer support device 204 including a first opening 210. The first wafer support device 204 is configured to support a plurality of wafers. Figure 2A In some embodiments, the first wafer support device 204 includes a first cassette 206 and a first wafer cassette housing 208 (collectively referred to as a cassette) that seals the first cassette 206. In some embodiments, the first wafer support device 204 includes the first cassette 206 without the first wafer cassette housing 208. In some embodiments, upon receiving the first wafer support device 204, the first carrier tray 202 is coupled to (e.g., locked to) the first wafer cassette housing 208.

[0025] The autoloader 200 includes a first vertical lift controller 212 configured to move the first wafer box housing 208 in a vertical direction (e.g., to lift the first wafer box housing 208 off the first cassette 206 or to lower the first wafer box housing 208 onto the first cassette 206). In some embodiments, the first vertical lift controller 212 includes a first hook 214 configured to couple to and decouple from the first wafer box housing 208 and move in a vertical direction. In some embodiments, the autoloader 200 includes a vertical lift motor 216 and a vertical lift screw 218 rotated by the vertical lift motor. In some embodiments, the first hook 214 is movably coupled to the vertical lift screw 218. In some embodiments, when the screw is rotated in a first direction (e.g., clockwise), the first hook 214 moves in a first vertical direction (e.g., upward). In some embodiments, when the screw is rotated in a second direction (eg, counterclockwise), the first hook 214 moves in a second horizontal direction (eg, downward). In some embodiments, the first vertical lift controller 212 unlocks the first wafer box housing 208 from the first carrier tray 202 .

[0026] The autoloader 200 includes a second carrier tray 220 configured to receive and couple to a second wafer support device 222 including a second opening 226. Figure 2A In some embodiments, the second wafer support device 222 includes a second cassette 224 without a second wafer box housing. In some embodiments, the second wafer support device 222 includes a second cassette 224 and a second wafer box housing that seals the second cassette 224, for example, Figure 2B The second wafer box housing 284 (collectively referred to as a wafer box) is shown. In some embodiments, the first carrier tray 202 and the second carrier tray 220 are arranged to have the first wafer support device 204 and the second wafer support device 222 on the same horizontal plane so that the wafer can be transferred from the first wafer support device 204 to the second wafer support device 222. In some embodiments, the first carrier tray 202 and the second carrier tray 220 are coupled to a platform 228.

[0027] The autoloader 200 includes a shaft 230 configured to push or otherwise move the plurality of wafers from the first wafer support device 204 to the second wafer support device 222. In some embodiments, the shaft 230 includes a lower horizontal portion 232 having a proximal end 234 and a distal end 236. The proximal end 234 is coupled to a first motor 250 (e.g., via a screw 252). In some embodiments, the first motor 250 is coupled to the platform 228. In some embodiments, the shaft 230 includes a vertical portion 238 having a lower end 240 and an upper end 242. The lower end 240 is coupled to the distal end 236 of the lower horizontal portion 232. In some embodiments, the shaft 230 includes an upper horizontal portion 244 having a proximal end 246 and a distal end 248. The distal end 248 is coupled to the upper end 242 of the vertical portion 238. In some embodiments, the proximal end 246 of the upper horizontal portion 244 is configured to push or otherwise move the plurality of wafers.

[0028] In some embodiments, the automatic loader 200 includes a plurality of motors. Each motor may be a rotor motor, a stepper motor, etc. In some embodiments, the automatic loader includes a first motor 250. In some embodiments, the first motor 250 is configured to move the shaft 230 in a horizontal direction. In some embodiments, the first motor 250 rotates a screw 252, which is coupled to the first motor 250 at a first end 254 and is movably coupled to the shaft 230 at a first region 256. In some embodiments, when the screw 252 is rotated in a first direction (e.g., clockwise), the shaft 230 moves in a first horizontal direction (e.g., away from the first wafer support device 204). In some embodiments, when the screw 252 is rotated in a second direction (e.g., counterclockwise), the shaft 230 moves in a second horizontal direction (e.g., toward the first wafer support device 204).

[0029] In some embodiments, the autoloader 200 includes a second motor 258 coupled to at least one of the first carrier tray 202 and the first wafer support device 204. In some embodiments, the second motor 258 is configured to rotate the first wafer support device 204 until the first opening 210 faces the second opening 226. In some embodiments, rotating the first wafer support device 204 to align the first opening 210 with the second opening 226 creates a gap for transferring the plurality of wafers from the first wafer support device 204 to the second wafer support device 222. In some embodiments, the second motor 258 rotates the first wafer support device 204 and the first carrier tray 202. In some embodiments, the second motor 258 rotates the first wafer support device 204 without rotating the first carrier tray 202.

[0030] In some embodiments, the automatic loader 200 includes a third motor 260, which is coupled to the platform 228 and is configured to move the second carrier tray 220 in a horizontal direction. In some embodiments, the third motor 260 rotates a screw 262 coupled to the third motor 260. In some embodiments, the screw 262 is movably coupled to a shaft 264, which is coupled to the second carrier tray 220. In some embodiments, when the third motor 260 rotates the screw 262 in a first direction (e.g., clockwise), the shaft 264 and the second carrier tray 220 move in a first horizontal direction (e.g., toward the first carrier tray 202). In some embodiments, when the third motor 260 rotates the screw 262 in a second direction (e.g., counterclockwise), the shaft 264 and the second carrier tray 220 move in a second horizontal direction (e.g., away from the first carrier tray 202).

[0031] In some embodiments, the automatic loader 200 includes a plurality of sensors (e.g., torque sensors, force sensors, optical sensors, thermal sensors, light sensors, sound sensors, pressure sensors, etc.). In some embodiments, each sensor is implemented as at least one of hardware, firmware, or software. In some embodiments, each sensor implemented in firmware or software includes a memory having instructions stored thereon and a processor that retrieves the instructions from the memory and executes the instructions.

[0032] In some embodiments, the autoloader 200 includes a first sensor 266 coupled to the first motor 250. In some embodiments, the first sensor 266 is configured to monitor the torque of the first motor 250. In some embodiments, the first sensor 266 determines whether there is an external disturbance based on the torque of the first motor 250. In some embodiments, the first sensor 266 is configured to monitor the number of rotations performed by the first motor 250. In some embodiments, the first sensor 266 is configured to determine the position of the shaft 230 and the distance between the shaft 230 and the first wafer support device 204 based on the number of rotations performed by the first motor 250.

[0033] In some embodiments, the automatic loader 200 includes a second sensor 268 coupled to the second motor 258. In some embodiments, the second sensor 268 is configured to monitor the torque of the second motor 258. In some embodiments, the second sensor 268 is configured to monitor whether the first opening 210 faces the second opening 226. In some embodiments, the second sensor 268 is configured to monitor and identify the number of rotations performed by the second motor 258. In some embodiments, the second sensor 268 is configured to determine whether the first opening 210 faces the second opening 226 based on identifying the number of rotations performed by the second motor 258.

[0034] In some embodiments, the autoloader 200 includes a third sensor 270 coupled to the first carrier tray 202. In some embodiments, the third sensor 270 is configured to monitor whether the first opening 210 faces the second opening 226. In some embodiments, the third sensor 270 is configured to monitor the position of the first wafer support device 204, and based on the position of the first wafer support device 204, the third sensor 270 determines whether the first opening 210 faces the second opening 226. In some embodiments, the third sensor 270 is configured to monitor whether the first wafer support device 204 is in contact with the first carrier tray 202.

[0035] In some embodiments, the autoloader 200 includes a fourth sensor 272 coupled to the first vertical lift controller 212. In some embodiments, the fourth sensor 272 is configured to monitor the force used by the first vertical lift controller 212 to move the first wafer cassette housing 208 in a vertical direction. In some embodiments, the fourth sensor 272 is configured to monitor whether or how far the first vertical lift controller 212 lifts or otherwise moves the first wafer cassette housing 208. In some embodiments, the fourth sensor 272 is configured to monitor the position and loading of the first hook 214. In some embodiments, the fourth sensor 272 is configured to determine whether or how far the first vertical lift controller 212 lifts or otherwise moves the first wafer cassette housing 208 based on the position and loading of the first hook 214.

[0036] In some embodiments, the automatic loader 200 includes a fifth sensor 274 coupled to the second carrier tray 220, the fifth sensor 274 being configured to detect whether the second wafer support device 222 receives the plurality of wafers or at least one of the plurality of wafers. In some embodiments, the automatic loader 200 includes a sixth sensor 276 coupled to the third motor 260. In some embodiments, the sixth sensor 276 is configured to monitor the torque and movement magnitude of the third motor 260. In some embodiments, the sixth sensor 276 is configured to monitor and identify the number of rotations performed by the third motor 260. In some embodiments, the sixth sensor 276 is configured to determine the distance between the first carrier tray 202 and the second carrier tray 220 based on identifying the number of rotations performed by the third motor 260.

[0037] Figure 2B 2 is a schematic block diagram of an automatic loader 280 for transferring wafers according to some embodiments. In some embodiments, the automatic loader 280 is similar to the automatic loader 280 except that the automatic loader 280 includes a second wafer support device 282 and a second vertical lift controller 286. Figure 2A The automatic loader 200 of the present invention is provided. The second wafer support device 282 includes a second cassette 224 and a second wafer box housing 284. The second vertical lift controller 286 is configured to lift the second wafer box housing 284 away from the second cassette 224. In some embodiments, the second vertical lift controller 286 includes a second hook 288, and the second hook 288 is configured to be coupled to and decoupled from the second wafer box housing 284 and move in a vertical direction. In some embodiments, the automatic loader 280 includes a second vertical lift motor 290 and a second vertical lift screw 292 rotated by the second vertical lift motor 290. In some embodiments, the second hook 288 is movably coupled to the second vertical lift screw 292. In some embodiments, when the second vertical lift motor 290 rotates the second vertical lift screw 292 in a first direction (e.g., clockwise), the second hook 288 moves in a first vertical direction (e.g., upward). In some embodiments, when the second vertical lift motor 290 rotates the second vertical lift screw 292 in a second direction (e.g., counterclockwise), the second hook 288 moves in a second horizontal direction (e.g., downward). In some embodiments, the second vertical lift controller 286 unlocks the second wafer box housing 284 from the second carrier tray 220.

[0038] Figure 3 is a perspective view of an autoloader 200 for transferring wafers according to some embodiments. Figure 4 is a front view of an autoloader 200 for transferring wafers according to some embodiments. Figure 5 is a side view of an autoloader 200 for transferring wafers according to some embodiments. Figure 6 is a top view of an autoloader 200 for transferring wafers according to some embodiments.

[0039] Figure 7 is a flow chart of a method 700 for transferring wafers according to some embodiments. Depending on the embodiment, additional, fewer, or different operations may be performed in method 700. In step 702, an apparatus such as autoloader 200 receives a first wafer support device, such as first wafer support device 204, that supports a plurality of wafers and includes a first opening. In some embodiments, the first wafer support device is received on a first carrier tray, such as first carrier tray 202.

[0040] In step 704, the apparatus receives a second wafer support device including a second opening, such as second wafer support device 222. In some embodiments, the second wafer support device is received on a second carrier tray (such as second carrier tray 220).

[0041] In step 706, the apparatus rotates the second wafer support device until the first opening is aligned with the second opening. In some embodiments, the apparatus moves the second carrier tray toward the first carrier tray until the first carrier tray and the second carrier tray are within a predetermined distance (e.g., 1 inch) of each other. In some embodiments, a sensor detects that the first carrier tray and the second carrier tray are within a predetermined distance of each other. In some embodiments, in response to detecting that the first carrier tray and the second carrier tray are within a predetermined distance of each other, the sensor sends a signal to the apparatus or a component thereon to stop moving the second carrier tray. In step 708, the apparatus transfers the plurality of wafers from the first wafer support device to the second wafer support device.

[0042] In some embodiments, the first wafer support device is a wafer pod, the wafer pod comprising a wafer pod housing, a wafer pod door removably coupled to the wafer pod housing, and a cassette sealed by the wafer pod housing and the wafer pod door. In some embodiments, the apparatus moves the wafer pod housing in a vertical direction. In some embodiments, the apparatus unlocks the wafer pod door from the wafer pod housing. In some embodiments, the second wafer support device comprises a second wafer pod, the second wafer pod comprising a second wafer pod housing, a second wafer pod door, and a second cassette. In some embodiments, the apparatus moves the second wafer pod housing in a vertical direction.

[0043] One aspect of the present description relates to a production line for transferring semiconductor wafers, the production line comprising a first wafer processing station, a second wafer processing station, and an apparatus configured to receive a first wafer support device from the first wafer processing station. The apparatus is configured to transfer the wafer from the first wafer support device to the second wafer support device. The apparatus is configured to send the second wafer support device to the second wafer processing station. In some embodiments, the first wafer support device is a first wafer box, and the second wafer support device is a second wafer box. In some embodiments, the first wafer box includes a wafer box housing and a cassette sealed by the wafer box housing. In some embodiments, the apparatus is configured to move the wafer box housing in a vertical direction until a predetermined gap between the wafer box housing and the cassette is satisfied. In some embodiments, the apparatus includes a sensor configured to monitor whether the predetermined gap between the wafer box housing and the cassette is satisfied. In some embodiments, the apparatus is configured to rotate the first wafer support device until the first opening of the first wafer support device faces the second opening of the second wafer support device. In some embodiments, the apparatus includes a sensor configured to monitor whether the first opening faces the second opening. In some embodiments, the apparatus includes a sensor configured to detect whether the second wafer support device receives the plurality of wafers.

[0044] Another aspect of the present description relates to an apparatus for transferring semiconductor wafers, the apparatus comprising a first carrier tray configured to be coupled to a first wafer support device supporting a plurality of wafers. The first wafer support device comprises a first opening. The apparatus comprises a second carrier tray configured to be coupled to a second wafer support device. The second wafer support device comprises a second opening. The apparatus comprises a first motor coupled to the first carrier tray. The first motor is configured to rotate the first wafer support device until the first opening faces the second opening to allow the plurality of wafers to be transferred from the first wafer support device to the second wafer support device. In some embodiments, the apparatus comprises a sensor configured to monitor whether the first opening faces the second opening. In some embodiments, the first wafer support device comprises a wafer cassette comprising a wafer cassette housing and a cassette sealed by the wafer cassette housing. In some embodiments, the apparatus comprises: a vertical lift controller configured to move the wafer cassette housing in a vertical direction; and a first sensor configured to monitor the force used by the vertical lift controller to move the wafer cassette housing in the vertical direction. In some embodiments, the apparatus comprises a second sensor configured to detect whether the wafer cassette housing is lifted. In some embodiments, the second wafer support device includes a second wafer box, the second wafer box including a second wafer box housing and a second cassette sealed by the second wafer box housing. In some embodiments, the apparatus includes a second vertical lift controller, the second vertical lift controller configured to move the second wafer box housing in the vertical direction. In some embodiments, the apparatus includes: an axis configured to transfer the plurality of wafers from the first wafer support device to the second wafer support device; and a second motor coupled to the axis. In some embodiments, the second motor is configured to move the axis in a horizontal direction. In some embodiments, the apparatus includes a sensor configured to monitor the torque of the second motor. In some embodiments, the second carrier tray is configured to move the second wafer support device toward the first wafer support device. In some embodiments, the apparatus includes a sensor for determining a distance between the first wafer support device and the second wafer support device. In some embodiments, the apparatus includes a sensor configured to detect whether the second wafer support device receives the plurality of wafers.

[0045] Another aspect of the present description relates to a method for transferring semiconductor wafers, the method comprising receiving a first wafer support device supporting a plurality of wafers. The first wafer support device comprises a first opening. The method comprises receiving a second wafer support device comprising a second opening, rotating the second wafer support device until the first opening is aligned with the second opening, and transferring the plurality of wafers from the first wafer support device to the second wafer support device. In some embodiments, the first wafer support device comprises a wafer cassette comprising a wafer cassette housing, a wafer cassette door removably coupled to the wafer cassette housing, and a cassette sealed by the wafer cassette housing and the wafer cassette door. In some embodiments, the method comprises moving the wafer cassette housing in the vertical direction. In some embodiments, the method comprises unlocking the wafer cassette door from the wafer cassette housing. In some embodiments, the second wafer support device comprises a second wafer cassette comprising a second wafer cassette housing, a second wafer cassette door, and a second cassette. In some embodiments, the method comprises moving the second wafer cassette housing in the vertical direction.

[0046] The features of several embodiments are summarized above so that those skilled in the art can better understand the various aspects of the present disclosure. Those skilled in the art will appreciate that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to implement the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art will also recognize that these equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions, and modifications thereto without departing from the spirit and scope of the present disclosure.

Claims

1. A production line for transferring semiconductor wafers, comprising: a first wafer processing station; a second wafer processing station; and The device is configured as: receiving a first wafer support device from the first wafer processing station; rotating the first wafer support device until the first opening of the first wafer support device faces the second opening of the second wafer support device; transferring a plurality of wafers from the first wafer support device to the second wafer support device; and The second wafer support device is sent to the second wafer processing station.

2. The production line of claim 1, wherein the first wafer support device is a first wafer cassette and the second wafer support device is a second wafer cassette.

3. The production line according to claim 2, wherein the first wafer box comprises a wafer box housing and a cassette sealed by the wafer box housing, and the device is further configured to move the wafer box housing in a vertical direction until a predetermined gap is satisfied between the wafer box housing and the cassette.

4. The production line of claim 3, wherein the device comprises a sensor configured to monitor whether the predetermined gap between the wafer cassette housing and the cassette is met. 5 . The production line of claim 1 , wherein the device comprises a sensor configured to monitor whether the first opening faces the second opening.

6. The production line of claim 1, wherein the device comprises a sensor configured to detect whether the second wafer supporting device receives the plurality of wafers.

7. An apparatus for transferring a semiconductor wafer, comprising: a first carrier tray configured to be coupled to a first wafer support device supporting a plurality of wafers, the first wafer support device including a first opening; a second carrier tray configured to be coupled to a second wafer support device, the second wafer support device including a second opening; and A first motor is coupled to the first carrier tray, the first motor being configured to rotate the first wafer support device until the first opening faces the second opening to allow transfer of the plurality of wafers from the first wafer support device to the second wafer support device. 8 . The device of claim 7 , further comprising a sensor configured to monitor whether the first opening faces the second opening.

9. The apparatus of claim 7, wherein the first wafer support device comprises a wafer cassette, the wafer cassette comprising a wafer cassette housing and a cassette sealed by the wafer cassette housing, the apparatus further comprising: a vertical lift controller configured to move the wafer cassette housing in a vertical direction; and A first sensor is configured to monitor the force used by the vertical lift controller to move the wafer cassette housing in the vertical direction. 10 . The apparatus of claim 9 , further comprising a second sensor configured to detect whether the wafer cassette housing is raised or lowered.

11. The apparatus of claim 9, wherein the second wafer support device comprises a second wafer cassette, the second wafer cassette comprising a second wafer cassette housing and a second pocket sealed by the second wafer cassette housing, the apparatus further comprising a second vertical lift controller configured to move the second wafer cassette housing in the vertical direction.

12. The device according to claim 7, further comprising: an axis configured to transfer the plurality of wafers from the first wafer support device to the second wafer support device; and A second motor is coupled to the shaft, the second motor being configured to move the shaft in a horizontal direction.

13. The apparatus of claim 12, further comprising a sensor configured to monitor the torque of the second motor.

14. The apparatus of claim 7, wherein the second carrier tray is configured to move the second wafer support device toward the first wafer support device, the apparatus further comprising a sensor for determining a distance between the first wafer support device and the second wafer support device.

15. The apparatus of claim 7, further comprising a sensor configured to detect whether the second wafer support device receives the plurality of wafers.

16. A method for transferring a semiconductor wafer, comprising: receiving a first wafer support device supporting a plurality of wafers, the first wafer support device comprising a first opening; receiving a second wafer support device including a second opening; rotating the second wafer support device until the first opening is aligned with the second opening; and The plurality of wafers are transferred from the first wafer support device to the second wafer support device.

17. The method of claim 16, wherein the first wafer support device comprises a wafer cassette, the wafer cassette comprising a wafer cassette housing, a wafer cassette door removably coupled to the wafer cassette housing, and a cassette sealed by the wafer cassette housing and the wafer cassette door, the method further comprising moving the wafer cassette housing in a vertical direction.

18. The method of claim 17, further comprising unlocking the wafer pod door from the wafer pod housing.

19. The method of claim 17, wherein the second wafer support device comprises a second wafer cassette, the second wafer cassette comprising a second wafer cassette housing, a second wafer cassette door, and a second pocket, the method further comprising moving the second wafer cassette housing in the vertical direction.

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