Heat source simulation structure

Abstract

The present invention is a heat source simulation structure, comprising a heating body and a heating element that are heat-conductively coupled to each other to form a simulated heat source body, the simulated heat source body is surrounded by a shell with insulating and heat-insulating properties and a heating substrate to prevent heat dissipation, wherein one end of the heating element is electrically connected to an external power supply to heat the heating body, a thermocouple element is provided on the side of the heating body corresponding to the heating element, and a temperature monitoring interface is used to connect a data acquisition instrument to record the temperature of the upper surface of the heating body. By using the heat insulation design that is surrounded by the simulated heat source body structure, the contact thermal resistance between the heating element and the heating body can be reduced, so as to reduce the heat loss of the heat source simulation structure, thereby improving the measurement accuracy and reliability.

Description

Technical Field

[0001] The invention relates to the technical field of heat sources, in particular to a heat source simulation structure. Background Art

[0002] In recent years, with the rapid development of science and technology, the high frequency and high speed of electronic devices, the density and miniaturization of integrated circuits, the power of equipment has increased with the improvement of performance, and the heat generated per unit volume has also increased, so the heat dissipation problem has become more and more important. Since the performance of high heat sources is an important factor affecting the results of heat exchange experiments, in order to ensure that electronic devices work normally and are not affected by heat energy, it is extremely important to conduct simulated heat source tests on the performance of high heat source products in advance.

[0003] At present, heat source simulation devices used to simulate the heating of electronic devices use ceramic heating plates, heating wires and heating blocks to construct a heat source device to simulate whether the heat generated by the electronic devices is completely taken away by the heat transfer device. However, due to the non-uniformity of the aforementioned structures and materials, the entire heating structure is not a compatible design for average heat generation, but is generated by each heating module separately, making it difficult for the heat transfer between the heating structure and the heat dissipation device to reach a steady state, thereby resulting in disadvantages such as large heat transfer losses. As a result, the measurement results are inconsistent with the actual heat dissipation of the electronic devices, with large errors, thereby affecting the accuracy and reliability of the measurement.

[0004] Furthermore, since the heating device in the above test method also has a certain heat dissipation effect, part of the heat is dissipated by the heating device, thus affecting the accuracy of the measurement result.

[0005] Therefore, how to solve the problems and deficiencies of the above-mentioned heating device is equivalent to solving the heating problem of electronic devices such as chips, which is the direction that the inventor of this case and related manufacturers engaged in this industry are eager to study and improve. Summary of the invention

[0006] In order to improve the above-mentioned problems, one purpose of the present invention is to simulate the heat source body by thermally coupling the heating element and the heating body, which are surrounded by an insulating shell and a heating substrate to prevent the heat source body from dissipating heat (thermal radiation and environmental radiation heat dissipation), thereby reducing the heat loss of the heat source simulation structure, or the heating body can be properly heated by the heating element to perform temperature compensation on the heating body. The heating amount can control the impact of the measurement result, thereby improving the measurement accuracy and reliability.

[0007] Another object of the present invention is to connect the heating element and the heating body by welding to prevent the two from generating a large contact thermal resistance and to have a simple structure and easy operation.

[0008] Another object of the present invention is that the heat source simulation structure can be used independently or synchronously with the test platform.

[0009] To achieve the above-mentioned purpose, the present invention provides a heat source simulation structure, which includes: a carrier, on which a temperature monitoring interface is arranged; a shell, which is correspondingly covered on the carrier, and the shell and the carrier jointly define a storage space; and a heat source body, including: a heating element, which is accommodated in the storage space, and at least one through hole is arranged on one side of the heating element; at least one heating element, one end of the heating element is arranged in the through hole of the heating element, and the other end of the heating element is exposed from the shell and is electrically connected to an external power supply to heat the heating element; at least one thermocouple element is arranged on the side of the heating element corresponding to the heating element.

[0010] The aforementioned carrier includes a base and a heating substrate arranged on one side of the base, the temperature monitoring interface is arranged on the base, and the accommodating space is located between the shell and the heating substrate.

[0011] After one end of the heating element is arranged at the through hole of the heating element, the connection is connected by welding.

[0012] A heating wire is arranged in the heating element.

[0013] The aforementioned heating element and heating body are made of high temperature resistant materials.

[0014] The aforementioned heating element and heating component are made of copper or stainless steel.

[0015] The aforementioned heating element is an electric heating tube or a heating rod.

[0016] The temperature monitoring interface is electrically connected to a data acquisition device to record the temperature of the upper surface of the heating element.

[0017] The aforementioned housing and heating substrate are made of high temperature resistant insulating materials.

[0018] The aforementioned shell and heating substrate are made of glass fiber, which has heat insulation and insulating effects.

[0019] The shell is arranged on a side of the heating element away from the base and is used for insulation and heat conduction.

[0020] The size and area of ​​the heating element and the number of heating elements are specifically designed according to the size of the heating power and the specific requirements of the area and shape of the chip.

[0021] The direction of the perforation on the aforementioned heating element is along the length direction of the base, or the direction of the perforation is along the width direction of the base.

[0022] The aforementioned heat source simulation structure can be used alone or simultaneously with a test platform.

[0023] The present invention can reduce the contact thermal resistance between the heating element and the heating body by simulating the heat source main body structure to be surrounded by a heat insulation design, thereby reducing the heat loss of the heat source simulation structure, thereby improving the measurement accuracy and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A three-dimensional composite diagram of the heat source simulation structure of the present invention;

[0025] Figure 2A , Figure 2B It is a three-dimensional exploded view of two embodiments of the heat source simulation structure of the present invention;

[0026] Figure 3 , Figure 4 for Figure 1 A cross-sectional view of a combined portion of the heat source simulation structure shown;

[0027] Figure 5 It is a schematic diagram of the dot-line relationship between power and temperature difference obtained after different electrical energies and experimental test analysis of the heat source simulation structure of the present invention;

[0028] Figure 6 A schematic diagram of the relationship between power and temperature difference obtained after different electrical energies and experimental test analysis of the heat source simulation structure of the present invention;

[0029] Figure 7 The figure is a table showing the relationship between power and heat loss of the heat source simulation structure of the present invention obtained after different electrical energies and experimental test analysis.

[0030] Explanation of the reference numerals: 100 heat source simulation device; 1 carrier; 11 base; 11a top surface; 111 temperature monitoring component interface; 112 assembly portion (such as assembly groove or assembly hole); 12 heating substrate; 121 first plate; 122 second plate; R1 drop section; 13 outer shell; 131 shell bottom frame; 132 shell cover; 133 accommodating space; 134 first notch; 135 second notch; R2 limiting portion; 136 display hole; 2 heat source body; 21 heating body; 211 heating block; 212 heating core; 213 through hole; 214 mounting hole; 22 heating element; 221 first end; 222 second end; 23 heating wire (heating resistor wire); 24 thermocouple element. DETAILED DESCRIPTION

[0031] The above-mentioned objects and the structural and functional characteristics of the present invention will be described with reference to the preferred and specific embodiments of the accompanying drawings.

[0032] See also Figure 1 A three-dimensional composite diagram of the heat source simulation structure of the present invention; Figure 2A , Figure 2B It is a three-dimensional exploded view of two embodiments of the heat source simulation structure of the present invention; Figure 3 , Figure 4 for Figure 1 A cross-sectional view of a combined portion of the heat source simulation structure shown; Figure 5 It is a schematic diagram of the dot-line relationship between power and temperature difference obtained after different electrical energies and experimental test analysis of the heat source simulation structure of the present invention; Figure 6 A schematic diagram of the relationship between power and temperature difference obtained after different electrical energies and experimental test analysis of the heat source simulation structure of the present invention; Figure 7 The heat source simulation structure of the present invention is a table diagram showing the relationship between power and heat loss obtained after different electrical energies and experimental test analysis. As shown in the figure, the heat source simulation device 100 of the present invention includes a carrier 1, a shell 13 and a heat source body 2. The carrier 1 includes a base 11 and a heating substrate 12. In other words, Figure 2A The base 11 and the heating substrate 12 can be integrally formed into the carrier 1, or as shown in Figure 2B As shown, the base 11 and the heating substrate 12 can be formed separately, and then the base 11 and the heating substrate 12 are stacked in order from bottom to top to form the carrier 1. The above structure is described in detail as follows.

[0033] The base 11 has a top surface 11 a , on which a temperature monitoring interface 111 and an assembly portion 112 are disposed. In this embodiment, the assembly portion 112 is, for example, an assembly groove, an assembly hole or other embodiments.

[0034] The heating substrate 12 is disposed on one side of the top surface 11a of the base 11. The heating substrate 12 has a first plate 121 and a second plate 122 located on one side of the first plate 121. The longitudinal cross-sectional area of ​​the second plate 122 is smaller than the longitudinal cross-sectional area of ​​the first plate 121, so that the second plate 122 and the first plate 121 form at least one drop section (two drop sections in the present invention) R1 at the connection between the two, and the drop sections R1 are respectively adjacent to the left and right sides of the second plate 122.

[0035] The housing 13 includes a hollow bottom frame 131 and a hollow cover 132 connected to the top of the bottom frame 131. The bottom frame 131 and the cover 132 define a receiving space 133 together. A first notch 134 (located on the bottom frame 131) and a second notch 135 (located on the cover 132) are respectively opened on the same side of the bottom frame 131 and the cover 132. However, it includes but is not limited to whether the first notch 134 and the second notch 135 are connected.

[0036] In this embodiment, the bottom frame 131 forms two opposite limiting portions R2 on both sides corresponding to the first notch 134. Figure 2A , Figure 2B As shown, the first notch 134 can accommodate the second plate 122 of the heating substrate 12, and the two limiting portions R2 are used to limit the two drop sections R1 between the first plate 121 and the second plate 122. The top surface of the shell cover 132 of the housing 13 is provided with a display hole 136, and the display hole 136 is connected to the accommodating space 133, so that the housing 13 can be covered outside the heating substrate 12.

[0037] The aforementioned heating substrate 12 and the housing 13 may be made of high temperature resistant insulating materials. Further, the materials of the heating substrate 12 and the housing 13 include but are not limited to glass fibers with low thermal conductivity; preferably, the glass fibers have insulating, high temperature resistant, and corrosion resistant properties, so that the heating substrate 12 and the housing 13 have heat insulation and insulating effects.

[0038] The temperature monitoring interface 111 can be electrically connected to a data acquisition device to record the temperature of the upper surface of the heating element 21 of the heat source body 2 .

[0039] The heat source body 2 is used to be disposed in the receiving space 133 of the housing 13. The heat source body 2 includes a heating element 21, at least one heating element 22 and at least one thermocouple element 24.

[0040] In this embodiment, the heating element 21 includes a heating block 211 and a heating core 212 stacked from bottom to top. Figure 2A , Figure 2B As shown, a through hole 213 corresponding to the heating element 22 is recessed on one side of the heating block 211 for inserting and positioning one end of the heating element 22; the heating core 212 is disposed on the top surface of the heating block 211, and the cross-sectional area of ​​the heating core 212 is at least equal to the diameter of the display hole 136 of the housing 13, and a mounting hole 214 is recessed at a specific position on one side of the heating core 212. It is particularly noted that the through hole 213 of the heating block 211 and the mounting hole 214 of the heating core 212 are located on the same side and can both correspond to the second notch 135 of the shell cover 132 of the housing 13.

[0041] Furthermore, in order to increase the heating speed of the heating block 211 and maintain its own heat, Figure 3 , Figure 4 As shown, the heating block 211 is provided with a heating wire (or heating resistor wire) 23 embedded therein, or the heating block 211 is provided with a hole for inserting the heating wire 23. In this embodiment, the number and position of the heating wire 23 in the heating block 211 are not limited; and the heating wire 23 includes but is not limited to high temperature resistant iron-chromium-aluminum alloy heating wire and nickel-chromium alloy heating wire or others.

[0042] The heating element 22 , including but not limited to an electric heating tube or a heating rod, has a first end 221 and a second end 222 opposite to the first end 221 . After the first end 221 of the heating element 22 is accommodated in the through hole 213 of the heating block 211, the first end 221 and the through hole 213 can be connected by welding to prevent the heating element 22 and the heating body 21 from generating a large contact thermal resistance. The second end 222 of the heating element 22 corresponds to the outer shell 13 and can be appropriately exposed outside the second notch 135 of the shell cover 132, and can be appropriately extended with positive and negative electrodes for electrically connecting to an external power supply (not shown in the figure). Through the external power supply, most of the heat in the heating element 22 is transferred to the heating body 21 to heat the heating body 21, and the heat generation and power of the heating element 22 (electric heating tube or heating rod) can be controlled by controlling the voltage of the external power supply to be timely corrected, thereby obtaining a heating method equivalent to electronic devices such as insulated gate bipolar transistors (IGBTs), diodes, high-power amplifiers, and field-effect transistors (MOSFETs).

[0043] The thermocouple element 24 has one end installed in the mounting hole 214 on one side of the heating core 212 and is located on the side of the heating element 21 away from the heating element 22. The thermocouple element 24 is used to measure the temperature of the heating element 21 and can be accurately monitored. The thermocouple element 24 includes but is not limited to designs arranged at different depths in the heating element 21.

[0044] In more detail, in order to accurately monitor the temperature of the heating block 211, the mounting hole 214 on one side of the heating core 212 is set to correspond to the thermocouple element 24 and is designed with a similar outer diameter, so that one end of the thermocouple element 24 can be inserted, and the mounting hole 214 is located at the edge of the heating core 212 and appropriately extended to the center. The mounting hole 214 in the center is provided for the thermocouple element 24 to be inserted and is used to measure the temperature of the heating core 212 close to the central surface, and the mounting holes 214 at the edge are usually used as auxiliary.

[0045] The heating element 21 and the heating component 22 may be made of high temperature resistant materials. Furthermore, the materials of the heating element 21 and the heating component 22 include but are not limited to copper or stainless steel.

[0046] The extending direction of the through hole 213 on the heating element 21 is set to be along the length direction of the base 11 , or the extending direction of the through hole 213 is set to be along the width direction of the base 11 .

[0047] The size and area of ​​the heating element 21 and the number of the heating elements 22 are specifically designed according to the size of the heating power and the specific requirements of the size and shape of the chip or other electronic devices. For example, the chip size is enlarged by about 0.5mm to 3mm or other.

[0048] The aforementioned thermocouple elements 24 include but are not limited to a plurality of them, and one end of each of the plurality of thermocouple elements 24 is inserted into a mounting hole 214 on a side of the heating core 212. The plurality of thermocouple elements 24 are arranged in the heating body 21 at different depths.

[0049] Accordingly, by implementing the combination of the above components, please refer to Figures 1 to 4 As shown, the heating substrate 12 is first arranged on the top surface of the base 11, and then the heating body 21 is overlapped with its bottom surface on the heating substrate 12, and then the first end 221 of the heating element 22 is accommodated in the through hole 213 of the heating block 211 and then the two are connected by welding, so that the heating element 22 is connected to the heating block 211, and one end of the thermocouple element 24 is installed in the mounting hole 214 on one side of the heating core 212 of the heating element 21, so as to form a heat source body, and finally the outer shell 13 is used to accommodate and cover the heating body 21 and the heating substrate 12 with the accommodating space 133, and the outer shell 13 is screwed to the assembly part 112 of the top surface 11a of the base 11 with the shell bottom frame 131 by screw locking parts, and the second end 222 of the heating element 22 and the other end of the thermocouple element 24 are exposed outside the second notch 135 of the shell cover 132 of the shell 13. In addition, the second end 222 of the heating element is exposed outside the housing 13 and is electrically connected to the external power supply to heat the heating element 21. The thermocouple element 24 is used to measure the temperature of the heating element 21 and its other end is exposed to facilitate accurate monitoring of the temperature value. Furthermore, the temperature monitoring interface 111 is used to connect a data acquisition instrument to record the temperature of the upper surface of the heating element. Thereby, the heat source body 2 is configured to have a thermally conductive insulating property to reduce the contact thermal resistance between the heating element and the heating element, and the exterior is covered by the housing 13 and the heating substrate 12 to have an insulating and heat-insulating property, thereby preventing the heat source body from dissipating heat, thereby improving the measurement accuracy and reliability.

[0050] The heat source simulation structure 100 of the present invention can be used alone or synchronously with a test platform.

[0051] Refer to the following Figures 1 to 4 , and cooperate with Figures 5 to 7 , more specific description:

[0052] Through relevant experimental tests and analysis using the above components and structural design, the heat loss (Q loss / heat loss) of the heat source simulation structure 100 of the present invention is less than (<) 4%, which is of great significance for improving the credibility and accuracy of experimental test data. The specific connection relationship and requirements between them are as follows Figures 5 to 7 :

[0053] The present invention couples the heating element 22 and the heating body 21 with each other to form a simulated heat source body 2 to prevent the generation of a large contact thermal resistance, and the heat source body 2 is surrounded by a glass fiber shell 13 with low thermal conductivity and a heating substrate 12 to prevent the heat dissipation (thermal radiation and environmental radiation heat dissipation) of the heating element 22 and the heating body 21. Through measurement and analysis, it is found that the heat loss of the heat source simulation structure 100 can be controlled within 4%. The measurement and analysis is obtained by measuring the temperature of the heating body 21 by the thermocouple element 24 and facilitating accurate monitoring of the temperature value, and the temperature monitoring interface 111 is electrically connected to a data acquisition instrument to record the temperature of the upper surface (heating surface) of the heating body, thereby improving the measurement accuracy and reliability. And the structure is simple and easy to operate.

[0054] When measuring, the temperature of the heating element 21 is measured by thermocouple elements 24 arranged at different depths and different radial positions, and a data acquisition instrument can be electrically connected according to the temperature monitoring interface 111 to record the temperature of the heating surface of the heating element 21. For example, when detecting the temperature value of the heating element 21, if the value shows a sudden rise, the heating power of the heating element 22 and the heating wire 23 is adjusted to make the heat transfer of the heating element 21 to the chip equal to the heat dissipation of the chip to the environment, and finally realize the mechanism of compensating the heat loss of the chip, thereby avoiding the influence of the heat loss of the heating element 21 on the measurement result, thereby improving the measurement accuracy and reliability.

[0055] The above description is only illustrative rather than restrictive of the present invention. Those skilled in the art will understand that many modifications, changes or equivalents may be made without departing from the spirit and scope defined by the claims, but all will fall within the scope of protection of the present invention.

Claims

1. A heat source simulation structure, characterized in that: include: A carrier includes a base and a heating substrate disposed on one side of the base, a temperature monitoring interface is disposed on the base, the heating substrate is disposed on one side of the top surface of the base, the heating substrate has a first plate and a second plate located on one side of the first plate, and the longitudinal cross-sectional area of ​​the second plate is smaller than the longitudinal cross-sectional area of ​​the first plate; A shell, corresponding to the cover, is disposed on the carrier, and a storage space is defined between the shell and the heating substrate. The shell includes a hollow shell bottom frame and a hollow shell cover connected to the top of the shell bottom frame. The interior of the shell bottom frame and the shell cover jointly defines the storage space, and a first notch and a second notch are respectively opened on the same side of the shell bottom frame and the shell cover. Two opposite limiting parts are formed on both sides of the shell bottom frame corresponding to the first notch. The first notch can be used to accommodate the second plate of the heating substrate. A display hole is opened on the top surface of the shell cover of the shell, and the display hole is connected to the storage space, so that the shell can be covered on the outside of the heating substrate; and A heat source body, comprising: A heating element is disposed in the accommodation space and its bottom surface is overlapped on the heating substrate, and at least one through hole is provided on one side of the heating element; At least one heating element, one end of which is disposed in the through hole of the heating element, and the other end of which is exposed from the housing and electrically connected to an external power source to heat the heating element; At least one thermocouple element is disposed on a side of the heating body corresponding to the heating element; The shell and the heating substrate are enclosed and configured to have insulation, heat preservation and heat insulation properties, thereby preventing the heat source body from dissipating heat.

2. The heat source simulation structure according to claim 1, characterized in that: One end of the heating element is arranged behind the through hole of the heating element, and the connection is combined by welding.

3. The heat source simulation structure according to claim 1, characterized in that: A heating wire is arranged inside the heating element.

4. The heat source simulation structure according to claim 1, characterized in that: The heating element and the heating body are made of high temperature resistant materials.

5. The heat source simulation structure according to claim 1, characterized in that: The heating body and the heating element are made of copper or stainless steel.

6. The heat source simulation structure according to claim 1, characterized in that: The heating element is an electric heating tube or a heating rod.

7. The heat source simulation structure according to claim 1, characterized in that: The temperature monitoring interface is electrically connected to a data acquisition device to record the temperature of the upper surface of the heating element.

8. The heat source simulation structure according to claim 1, characterized in that: The shell and the heating substrate are made of high temperature resistant insulating materials.

9. The heat source simulation structure according to claim 1, characterized in that: The shell and the heating substrate are made of glass fiber and have heat insulation and insulating properties.

10. The heat source simulation structure according to claim 1, characterized in that: The shell is arranged on a side of the heating element away from the base and is used for insulation and heat conduction.

11. The heat source simulation structure according to claim 1, characterized in that: The heat source simulation structure is used alone or synchronously with a test platform.

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