Equipment and method for melting and sealing ceramic coated chips

Abstract

The present invention discloses a device for melting and sealing to produce ceramic coated chips, including an assembly platform device, a component supply device, a clamp supply device and a material discharge device; wherein the assembly platform device includes a plurality of limit mechanisms; an assembly space is formed between the plurality of limit mechanisms; the distance between the plurality of limit mechanisms can be adjusted so that the assembly space matches the cover plate gasket element. The present invention also discloses a method for melting and sealing to produce ceramic coated chips. The present invention at least solves the technical problem that the conventional equipment for melting and sealing to produce ceramic coated chips is not compatible with ceramic coated chips of various sizes and shapes.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic film-coated chips, and more specifically to a device and method for melting and sealing ceramic film-coated chips. Background Art

[0002] Traditional equipment used for melting and sealing to produce ceramic coated chips has the following defects: 1) It is not compatible with ceramic coated chips of various sizes and shapes; 2) The process of assembling ceramic coated chips is prone to position deviation and has low reliability. Summary of the invention

[0003] An object of the present invention is to at least solve the above problems and provide corresponding beneficial effects.

[0004] Another object of the present invention is to provide a device and method for melting and sealing ceramic coated chips, which at least solves the technical problem that the conventional device for melting and sealing ceramic coated chips is not compatible with ceramic coated chips of various sizes and shapes. The present invention is mainly achieved through the following technical solutions:

[0005] <First Aspect of the Invention>

[0006] A first aspect provides a device for sealing and producing ceramic coated chips, comprising:

[0007] An assembly platform device is used to stack the cover plate gasket element, the cover plate element, the tube shell element and the tube shell gasket element in order from bottom to top in the assembly space, and then clamp them by a clamp to form a target assembly, and the target assembly is used to produce a ceramic coated chip in the sealing step;

[0008] A component supply device, used for conveying cover plate gasket components, cover plate components, tube shell components, and tube shell gasket components to the assembly platform device;

[0009] A clamping member supply device, used for providing clamping members for the assembly platform device;

[0010] A material unloading device, used for receiving the target component assembled from the assembly platform device;

[0011] Wherein, the assembly platform device includes a plurality of limiting mechanisms;

[0012] The assembly space is formed between a plurality of limiting mechanisms;

[0013] The distances between the plurality of limiting mechanisms can be adjusted so that the assembly space matches the cover plate gasket element.

[0014] In the first aspect of the present invention, a plurality of limiting mechanisms are arranged in the assembly platform device, wherein the distance between the plurality of limiting mechanisms can be adjusted. Therefore, according to the size and shape of the cover gasket element, the distance between the plurality of limiting mechanisms can be adjusted to an assembly space matching the cover gasket element, so that the assembly space can be compatible with cover gasket elements of various sizes and shapes, thereby solving the technical problem that the conventional equipment used for melting and sealing the production of ceramic coated chips cannot be compatible with ceramic coated chips of various sizes and shapes, and effectively improving the compatibility of equipment assembly.

[0015] In some technical solutions, the limiting end of the limiting mechanism is arranged toward the assembly space and can perform reciprocating linear motion toward the assembly space.

[0016] In some technical solutions, a plurality of the limiting mechanisms surround the assembly space.

[0017] In some technical solutions, a plurality of the limiting mechanisms surround the assembly space in a centrally symmetrical manner.

[0018] In some technical solutions, the limiting mechanism includes a first limiting unit, and the limiting end of the first limiting unit has a groove, and the groove is used to accommodate the limited portion of the cover plate gasket element.

[0019] In some technical solutions, the limiting mechanism includes a second limiting unit located above the first limiting unit, and a limiting end of the second limiting unit extends toward the first limiting unit to form a pressing limiting portion.

[0020] The tube shell component comprises a placement area and a non-placement area, wherein the non-placement area is used to be pressed by the pressing limiter after the tube shell component is placed on the cover plate component, and the placement area is used to place the tube shell gasket component.

[0021] In the above technical solution, the tube shell element is pressed by pressing the limiting part, so that the cover gasket element, the cover element and the tube shell element in the assembly space can be fixed on the assembly space, which effectively prevents the position deviation during the assembly process of the ceramic coated chip and improves the reliability of assembly.

[0022] In some technical solutions, the pressing limiter is an elastic mechanism.

[0023] In some technical solutions, the limiting mechanism further includes a first driving unit for driving the first limiting unit to move and a second driving unit for driving the second limiting unit to move.

[0024] In some technical solutions, the assembly platform device further includes at least one clamping member installation mechanism;

[0025] The clamping member installation mechanism is used to receive the clamping members provided by the clamping member supply device and transport them to the assembly space to clamp the cover plate gasket element, the cover plate element, the tube shell element and the tube shell gasket element together.

[0026] In some technical solutions, the carrying end of the clamp mounting mechanism is arranged toward the assembly space and can perform reciprocating linear motion toward the assembly space.

[0027] In some technical solutions, the component supply device includes:

[0028] The first loading mechanism comprises a first loading platform, a first robot arm and a flipping mechanism, wherein the first robot arm is used to grab the tube shell components from the first loading platform and transport them to the flipping mechanism for flipping, and then transport the flipped tube shell components to the assembly space.

[0029] In some technical solutions, the component supply device further includes:

[0030] The second feeding mechanism comprises a first material containing mechanism, a second material containing mechanism, a third material containing mechanism and a second mechanical arm, wherein the second mechanical arm is used for:

[0031] Grab the cover plate gasket element from the first material storage mechanism and transport it to the assembly space;

[0032] Grab the cover plate element from the second material storage mechanism and transport it to the assembly space;

[0033] The tube shell gasket element is grasped from the third material receiving mechanism and transported to the assembly space.

[0034] In some technical solutions, the second feeding mechanism further includes:

[0035] A first standby material containing mechanism corresponding to the first material containing mechanism;

[0036] A second standby material containing mechanism corresponding to the second material containing mechanism;

[0037] A third backup material containing mechanism corresponding to the third material containing mechanism.

[0038] In some technical solutions, the clamping member supply device includes:

[0039] A second material placement platform and a third robotic arm, wherein the third robotic arm is used to grab the clamping piece from the second material placement platform and transport it to the assembly platform device.

[0040] In some technical solutions, the unloading device includes a material receiving platform and a material receiving machine, wherein the material receiving machine is used to provide a material receiving tray placed on the material receiving platform; and the material receiving tray is used to receive the target component transported from the assembly space.

[0041] <Second Aspect of the Invention>

[0042] A second aspect of the present invention provides a method for producing a ceramic coated chip by fusion sealing, comprising:

[0043] Providing clamping parts to the assembly platform device through a clamping part supply device;

[0044] The distance between the multiple limiting mechanisms of the assembly platform device is adjusted to form an assembly space; this is to enable the assembly space to match the cover plate gasket element transported in later, and the cover plate gasket element is limited in the assembly space by the multiple limiting mechanisms;

[0045] Transporting the cover plate gasket element to the assembly space through the element supply device and placing it in the assembly space;

[0046] The cover plate element is transported to the assembly space by the element supply device and is stacked on the cover plate gasket element;

[0047] The tube shell component is transported to the assembly space by the component supply device and stacked on the cover plate component;

[0048] The tube shell gasket element is transported to the assembly space by the element supply device, and is stacked on the tube shell element;

[0049] After obtaining the clamping member, the assembly platform device clamps the stacked cover plate gasket element, cover plate element, tube shell element, and tube shell gasket element to form a target assembly; the target assembly is used to produce ceramic coated chips in the sealing step;

[0050] The target component assembled from the assembly platform device is received by the unloading device.

[0051] The technical effects of the embodiments of the present invention include at least:

[0052] In the present invention, by setting a plurality of limiting mechanisms in the assembly platform device, wherein the distance between the plurality of limiting mechanisms can be adjusted, therefore, according to the size and shape of the cover plate gasket element, the distance between the plurality of limiting mechanisms can be adjusted to an assembly space that matches the cover plate gasket element, so that the assembly space can be compatible with cover plate gasket elements of various sizes and shapes, thereby solving the technical problem that the conventional equipment for melting and sealing the production of ceramic coated chips cannot be compatible with ceramic coated chips of various sizes and shapes. Therefore, the beneficial effects of the present invention at least include: 1) effectively improving the compatibility of the conventional equipment for melting and sealing the production of ceramic coated chips with various sizes and shapes; 2) effectively preventing the phenomenon of position deviation in the process of assembling ceramic coated chips, thereby improving the reliability of assembly.

[0053] Other advantages, objectives and features of the present invention will be embodied in part through the following description, and in part will be understood by those skilled in the art through study and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0055] Figure 1 It is a schematic diagram of the structure of the device for melting and sealing to produce ceramic coated chips in some embodiments of the present invention;

[0056] Figure 2 It is a schematic diagram of the structure of the equipment for melting and sealing the production of ceramic coated chips in other embodiments of the present invention;

[0057] Figure 3 It is a schematic diagram of the stacked structure of the cover plate gasket element, the cover plate element, the tube shell element and the tube shell gasket element in some embodiments of the present invention;

[0058] Figure 4 It is a schematic diagram of the structure of the assembly platform device of the present invention in some embodiments;

[0059] Figure 5 For the present invention Figure 4 A magnified view of part A;

[0060] Figure 6 It is a schematic diagram of the structure of the limiting mechanism of the present invention in some embodiments;

[0061] Figure 7 For the present invention Figure 6A magnified view of part B;

[0062] Figure 8 Schematic diagram of the structure of the tube shell element of the present invention in some embodiments;

[0063] Fig. 9 It is a schematic diagram of the structure of the clamping member installation mechanism of the present invention in some embodiments;

[0064] Fig.10 It is a schematic structural diagram of the assembly platform device of the present invention in other embodiments;

[0065] Fig.11 It is a schematic structural diagram of the component supply device of the present invention in some embodiments;

[0066] Fig.12 is a top view of the first feeding mechanism of the present invention in some embodiments;

[0067] Fig.13 is a three-dimensional diagram of the first feeding mechanism of the present invention in some embodiments;

[0068] Fig.14 is a top view of the second feeding mechanism of the present invention in some embodiments;

[0069] Fig.15 It is a schematic structural diagram of the second feeding mechanism of the present invention in other embodiments;

[0070] Fig.16 It is a schematic structural diagram of the clamping member supply device of the present invention in some embodiments;

[0071] Fig.17 is a top view of the material discharging device of the present invention in some embodiments;

[0072] Description of reference numerals:

[0073] 1. Equipment used for melting and sealing the production of ceramic coated chips;

[0074] 10. Assembly platform device; 11. Limiting mechanism; 110. Limiting end; 1111. Groove; 1112. Pressing limiting portion; 111. First limiting unit; 112. Second limiting unit; 113. First driving unit; 114. Second driving unit; 12. Clamping member installation mechanism; 121. Carrying end; 13. First lifting mechanism;

[0075] 20. Component supply device; 21. First feeding mechanism; 211. First material placement platform; 212. Turning mechanism; 213. First mechanical arm; 22. Second feeding mechanism; 221. First material storage mechanism; 222. Second material storage mechanism; 223. Third material storage mechanism; 224. Second mechanical arm; 225. Second lifting mechanism; 226. Material storage column; 227. First standby material storage mechanism; 228. Second standby material storage mechanism; 229. Third standby material storage mechanism;

[0076] 30. Clamping piece supply device; 31. Second material placement platform; 32. Third robotic arm;

[0077] 40. Unloading device; 41. Material receiving platform; 42. Material receiving machine;

[0078] 50. Cover plate gasket element; 510. Restricted portion;

[0079] 60. Cover plate element;

[0080] 70, tube and shell component; 710, placement area; 720, non-placement area;

[0081] 80. Shell and tube gasket elements;

[0082] S1. Assembly space. DETAILED DESCRIPTION

[0083] In order to make the purpose, technical solution and advantages of the present invention more clear, the technical solution in the embodiment of the present application will be clearly and completely described below in conjunction with the drawings in the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0084] The terms "first", "second", and "third" in the description of the embodiments of the present application are used to distinguish different objects rather than to describe a specific order of the objects. For example, the first robotic arm, the second robotic arm, and the third robotic arm are used to distinguish different robotic arms rather than to describe a specific order of the robotic arms. For another example, the first limiting unit and the second limiting unit are used to distinguish different limiting units rather than to describe a specific order of the limiting units.

[0085] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0086] It should be noted that, in this document, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatus.

[0087] <Equipment for melting and sealing ceramic coated chips>

[0088] like Figure 1 and Figure 2 The figure shows a device 1 for melting and sealing a ceramic coated chip provided by the present invention. The device 1 for melting and sealing a ceramic coated chip comprises:

[0089] An assembly platform device 10 is used to stack the cover plate gasket element 50, the cover plate element 60, the tube shell element 70 and the tube shell gasket element 80 in order from bottom to top at the assembly space S1, and then clamp them by a clamp to form a target assembly, and the target assembly is used to produce a ceramic coated chip in a sealing step;

[0090] The component supply device 20 is used to supply the cover plate gasket component 50, the cover plate component 60, the tube shell component 70, and the tube shell gasket component 80 to the assembly platform device 10;

[0091] A clamping member supplying device 30, used for providing clamping members for the assembly platform device 10;

[0092] A material unloading device 40, used for receiving the target component assembled from the assembly platform device 10;

[0093] Wherein, the assembly platform device 10 includes a plurality of limiting mechanisms 11;

[0094] The assembly space S1 is formed between a plurality of limiting mechanisms 11;

[0095] The distances between the plurality of limiting mechanisms 11 can be adjusted so that the assembly space S1 matches the cover plate gasket element 50 , thereby allowing the cover plate gasket element 50 to be confined at the assembly space S1 .

[0096] It should be understood that the assembly platform device 10, the component supply device 20, the clamp supply device 30 and the unloading device 40 are sequentially arranged in the equipment 1 for sealing and producing ceramic coated chips.

[0097] In the embodiment of the present application, the number of the plurality of limiting mechanisms 11 may be four.

[0098] like Figure 3 As shown, it is a schematic diagram of the structure in which the cover plate gasket element 50, the cover plate element 60, the tube shell element 70 and the tube shell gasket element 80 are stacked in sequence from bottom to top.

[0099] In the first aspect of the present invention, a plurality of limiting mechanisms 11 are arranged in the assembly platform device 10, wherein the distance between the plurality of limiting mechanisms 11 can be adjusted. Therefore, according to the size and shape of the cover gasket element 50, the distance between the plurality of limiting mechanisms 11 can be adjusted to an assembly space S1 matching the cover gasket element 50, so that the assembly space S1 can be compatible with cover gasket elements 50 of various sizes and shapes, thereby solving the technical problem that the conventional equipment 1 for melting and sealing the production of ceramic coated chips cannot be compatible with ceramic coated chips of various sizes and shapes, and effectively improving the compatibility of equipment assembly.

[0100] exist Figure 4 and Figure 5 In some embodiments, the limiting end 110 of the limiting mechanism 11 is disposed toward the assembly space S1 and is capable of performing reciprocating linear motion toward the assembly space S1.

[0101] In some embodiments, a plurality of the limiting mechanisms 11 surround the assembly space S1 .

[0102] In some embodiments, a plurality of the limiting mechanisms 11 surround the assembly space S1 in a centrosymmetric manner.

[0103] exist Figure 6 and Figure 7 In some embodiments, the limiting mechanism 11 includes a first limiting unit 111 , and the limiting end 110 of the first limiting unit 111 has a groove 1111 , and the groove 1111 is used to accommodate the limited portion 510 of the cover plate gasket element 50 .

[0104] Continue as Figure 6 As shown, in some embodiments, the limiting mechanism 11 includes a second limiting unit 112 located above the first limiting unit 111, and the limiting end 110 of the second limiting unit 112 extends toward the first limiting unit 111 to form a pressing limiting portion 1112.

[0105] The tube shell component 70 includes a placement area 710 and a non-placement area 720710, such as Figure 8 As shown, the non-placing area 720710 is used to be pressed by the pressing limit portion 1112 after the tube shell component 70 is placed on the cover plate component 60, and the placing area 710 is used to place the tube shell gasket component 80.

[0106] In the embodiment of the present application, the tube shell component 70 is pressed by pressing the limiting portion 1112, so that the cover gasket component 50, the cover component 60 and the tube shell component 70 in the assembly space S1 can be fixed on the assembly space S1, effectively preventing the position deviation during the assembly process of the ceramic coated chip and improving the reliability of assembly.

[0107] In some embodiments, the pressing limiter 1112 is an elastic mechanism. For example, the pressing limiter 1112 can be a probe.

[0108] Continue as Figure 6 As shown, in some embodiments, the limiting mechanism 11 further includes a first driving unit 113 for driving the first limiting unit 111 to move and a second driving unit 114 for driving the second limiting unit 112 to move.

[0109] Then as Fig. 9 As shown, in some embodiments, the assembly platform device 10 further includes at least one clamping member installation mechanism 12;

[0110] The clamp installation mechanism 12 is used to receive the clamps provided by the clamp supply device 30 and transport them to the assembly space S1 to clamp the cover plate gasket element 50, the cover plate element 60, the tube shell element 70 and the tube shell gasket element 80 together.

[0111] Continue as Fig. 9 As shown, in some embodiments, the carrying end 121 of the clamp installation mechanism 12 is disposed toward the assembly space S1 and is capable of performing reciprocating linear motion toward the assembly space S1.

[0112] like Fig.10 As shown, in some embodiments, the assembly platform device 10 further includes a first lifting mechanism 13 , and the first lifting mechanism 13 is used to adjust the positions of the plurality of limiting mechanisms 11 .

[0113] Then as Fig.11 , Fig.12 , Fig.13 and Fig.14 As shown, in some embodiments, the component supply device 20 includes:

[0114] The first feeding mechanism 21, such as Fig.12 and Fig.13 As shown, it includes a first loading platform 211, a first robot arm 213 and a flipping mechanism 212, wherein the first robot arm 213 is used to grab the tube shell component 70 from the first loading platform 211 and transport it to the flipping mechanism 212 for flipping, and then transport the flipped tube shell component 70 to the assembly space S1.

[0115] In the present application, since the first loading mechanism 21 is used to store the tube and shell components 70, the first loading mechanism 21 is also called a tube and shell component loading mechanism.

[0116] The first material placement platform 211 may be a rectangular platform for accommodating the tube shell component 70. In some other embodiments, the first material placement platform 211 may also be a non-rectangular platform. It should be understood that in the embodiment of the present application, the tube shell component 70 may be placed in the first blister tray, and the first blister tray may be placed on the first material placement platform 211.

[0117] The moving end of the first robotic arm 213 is provided with a robotic arm, which is in the shape of a pliers and is used to clamp an object. In some other embodiments, the robotic arm may also be in a non-pliers shape.

[0118] The flipping mechanism 212 includes an electric clamp and a rotating cylinder, wherein the electric clamp is used to clamp the tube shell component 70 transported from the first mechanical arm 213; and the rotating cylinder is used to drive the electric clamp to rotate.

[0119] The operation of the first feeding mechanism 21 may be implemented in the following exemplary manner:

[0120] The first robotic arm 213 grabs the tube and shell component 70 from the first blister tray, transports it to the top of the flipping mechanism 212, and adjusts the angle of the tube and shell component 70. After the first robotic arm 213 adjusts the angle (the standard of the adjusted angle here is parallel to the horizontal direction of the flipping mechanism 212), the electric clamp grabs the tube and shell component 70 from the first robotic arm 213, and the rotating cylinder drives the electric clamp to rotate and flip it. Then the first robotic arm 213 sucks the flipped tube and shell component 70 from the electric clamp and transports it to the assembly space S1.

[0121] In some embodiments, the component supply device 20 further includes:

[0122] The second feeding mechanism 22, such as Fig.14As shown, it includes a first material storage mechanism 221, a second material storage mechanism 222, a third material storage mechanism 223 and a second mechanical arm 224, wherein the second mechanical arm 224 is used for:

[0123] Grab the cover plate gasket element 50 from the first material storage mechanism 221 and transport it to the assembly space S1;

[0124] Grab the cover plate element 60 from the second material storage mechanism 222 and transport it to the assembly space S1;

[0125] The tube case gasket element 80 is grabbed from the third material receiving mechanism 223 and transported to the assembly space S1.

[0126] It should be understood that the first container mechanism 221 is used to store the cover plate gasket element 50 ; the second container mechanism 222 is used to store the cover plate element 60 ; and the third container mechanism 223 is used to store the tube shell gasket element 80 .

[0127] The first material storage mechanism 221, the second material storage mechanism 222 and the third material storage mechanism 223 are respectively provided with a second lifting mechanism 225 and four material storage columns 226. Fig.15 As shown, the four material containing columns 226 form a circle to form a containing space inside, and a second lifting mechanism 225 is provided at the bottom of the containing space.

[0128] The operation of the second feeding mechanism 22 may be implemented in the following exemplary manner:

[0129] The second robot arm 224 first grabs the cover plate gasket component 50 from the first material storage mechanism 221 and transports it to the assembly space S1, then grabs the cover plate component 60 from the second material storage mechanism 222 and transports it to the assembly space S1, and then grabs the tube shell gasket component 80 from the third material storage mechanism 223 and transports it to the assembly space S1.

[0130] Continue as Fig.14 As shown, in some embodiments, the second feeding mechanism 22 further includes:

[0131] A first standby material storage mechanism 227 corresponding to the first material storage mechanism 221;

[0132] A second standby material containing mechanism 228 corresponding to the second material containing mechanism 222;

[0133] A third backup material storage mechanism 229 corresponding to the third material storage mechanism 223 .

[0134] The first standby material storage mechanism 227, the second standby material storage mechanism 228 and the third standby material storage mechanism 229 may have the same structure as the first material storage mechanism 221, the second material storage mechanism 222 and the third material storage mechanism 223, and are respectively provided with a second lifting mechanism 225 and four material storage columns 226. The four material storage columns 226 are surrounded in a circle to form a storage space inside, and the second lifting mechanism 225 is provided at the bottom of the storage space.

[0135] In the present application, since the first material containing mechanism 221 and the first spare material containing mechanism 227 are used to store the cover gasket element 50, and the cover gasket element 50 is grasped and transported to the assembly space S1 by the second robot arm 224, the combination of the first material containing mechanism 221, the first spare material containing mechanism 227 and the second robot arm 224 is called a cover gasket element loading mechanism.

[0136] Since the second material storage mechanism 222 and the second standby material storage mechanism 228 are used to store the cover element 60, and the cover element 60 is grasped and transported to the assembly space S1 by the second robot arm 224, the combination of the second material storage mechanism 222, the second standby material storage mechanism 228 and the second robot arm 224 is called a cover element loading mechanism.

[0137] Since the third material containing mechanism 223 and the third spare material containing mechanism 229 are used to store the tube shell gasket element 80, and the tube shell gasket element 80 is grasped and transported to the assembly space S1 by the second robot arm 224, the combination of the third material containing mechanism 223, the third spare material containing mechanism 229 and the second robot arm 224 is called a tube shell gasket element loading mechanism.

[0138] Then as Fig.16 As shown, in some embodiments, the clamping member supply device 30 includes:

[0139] A second material placement platform 31 and a third robotic arm 32 , wherein the third robotic arm 32 is used to grab the clamping parts from the second material placement platform 31 and transport them to the assembly platform device 10 .

[0140] The second material placement platform 31 may be a rectangular platform for accommodating the clamping member. In some other embodiments, the second material placement platform 31 may also be a non-rectangular platform. It should be understood that in the embodiment of the present application, the clamping member may be placed in the second blister tray, and the second blister tray may be placed on the second material placement platform 31.

[0141] Then as Fig.17As shown, in some technical solutions, the unloading device 40 includes a material receiving platform 41 and a material receiving machine 42, wherein the material receiving machine 42 is used to provide a material receiving tray placed on the material receiving platform 41; the material receiving tray is used to receive the target component transported from the assembly space S1.

[0142] The material receiving machine 42 includes an empty material frame, a full material frame and a transmission mechanism. The empty material frame is used to store an empty material receiving tray; the full material frame is used to store a material receiving tray filled with target components; and the transmission mechanism is used to transmit the material receiving tray.

[0143] <Method for melting and sealing ceramic coated chips>

[0144] The present invention also provides a method for melting and sealing to produce ceramic coated chips. The method for melting and sealing to produce ceramic coated chips comprises:

[0145] Providing clamping parts to the assembly platform device through a clamping part supply device;

[0146] The distance between the multiple limiting mechanisms of the assembly platform device is adjusted to form an assembly space; this is to enable the assembly space to match the cover plate gasket element transported in later, and the cover plate gasket element is limited in the assembly space by the multiple limiting mechanisms;

[0147] Transporting the cover plate gasket element to the assembly space through the element supply device and placing it in the assembly space;

[0148] The cover plate element is transported to the assembly space by the element supply device and is stacked on the cover plate gasket element;

[0149] The tube shell component is transported to the assembly space by the component supply device and stacked on the cover plate component;

[0150] The tube shell gasket element is transported to the assembly space by the element supply device, and is stacked on the tube shell element;

[0151] After obtaining the clamping member, the assembly platform device clamps the stacked cover plate gasket element, cover plate element, tube shell element, and tube shell gasket element to form a target assembly; the target assembly is used to produce ceramic coated chips in the sealing step;

[0152] The target component assembled from the assembly platform device is received by the unloading device.

[0153] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation modes, and they can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A device for sealing and producing ceramic coated chips, characterized in that: include: An assembly platform device is used to stack the cover plate gasket element, the cover plate element, the tube shell element and the tube shell gasket element in order from bottom to top in the assembly space, and then clamp them by a clamp to form a target assembly, and the target assembly is used to produce a ceramic coated chip in the sealing step; A component supply device, used for conveying cover plate gasket components, cover plate components, tube shell components, and tube shell gasket components to the assembly platform device; A clamping member supply device, used for providing clamping members for the assembly platform device; A material unloading device, used for receiving the target component assembled from the assembly platform device; Wherein, the assembly platform device includes a plurality of limiting mechanisms; The assembly space is formed between a plurality of limiting mechanisms, and the plurality of limiting mechanisms surround the assembly space in a centrally symmetrical manner; The distances between the plurality of limiting mechanisms can be adjusted so that the assembly space matches the cover plate gasket element.

2. The device for sealing and producing ceramic coated chips according to claim 1, characterized in that: The limiting end of the limiting mechanism is arranged toward the assembling space and can perform reciprocating linear motion toward the assembling space.

3. The device for sealing and producing ceramic coated chips according to claim 2, characterized in that: The limiting mechanism includes a first limiting unit, a second limiting unit, a first driving unit and a second driving unit.

4. The device for sealing and producing ceramic coated chips according to claim 1, characterized in that: The assembly platform device also includes at least one clamping member installation mechanism; The clamping member installation mechanism is used to receive the clamping members provided by the clamping member supply device and transport them to the assembly space to clamp the cover plate gasket element, the cover plate element, the tube shell element and the tube shell gasket element together.

5. The device for sealing and producing ceramic coated chips according to claim 1, characterized in that: The component supply device includes a first loading mechanism, which includes a first loading platform, a first robotic arm and a flipping mechanism, wherein the first robotic arm is used to grab the tube shell components from the first loading platform and transport them to the flipping mechanism for flipping, and then transport the flipped tube shell components to the assembly space.

6. The device for sealing and producing ceramic coated chips according to claim 5, characterized in that: The component supply device also includes: The second feeding mechanism comprises a first material containing mechanism, a second material containing mechanism, a third material containing mechanism and a second mechanical arm, wherein the second mechanical arm is used for: Grab the cover plate gasket element from the first material storage mechanism and transport it to the assembly space; Grab the cover plate element from the second material storage mechanism and transport it to the assembly space; The tube shell gasket element is grasped from the third material receiving mechanism and transported to the assembly space.

7. The device for sealing and producing ceramic coated chips according to claim 6, characterized in that: The second feeding mechanism also includes: A first standby material containing mechanism corresponding to the first material containing mechanism; A second standby material containing mechanism corresponding to the second material containing mechanism; A third backup material containing mechanism corresponding to the third material containing mechanism.

8. The device for sealing and producing ceramic coated chips according to claim 1, characterized in that: The clamping member supply device comprises: A second material placement platform and a third robotic arm, wherein the third robotic arm is used to grab the clamping piece from the second material placement platform and transport it to the assembly platform device.

9. The device for sealing and producing ceramic coated chips according to claim 1, characterized in that: The material unloading device includes a material receiving platform and a material receiving machine, wherein the material receiving machine is used to provide a material receiving tray placed on the material receiving platform; and the material receiving tray is used to receive the target component transported from the assembly space.

10. A method for producing ceramic coated chips by melting and sealing, characterized in that: include: Providing clamping parts to the assembly platform device through a clamping part supply device; Adjusting the distances between the plurality of limiting mechanisms of the assembly platform device to form an assembly space; Transporting the cover plate gasket element to the assembly space through the element supply device and placing it in the assembly space; The cover plate element is transported to the assembly space by the element supply device and is stacked on the cover plate gasket element; The tube shell component is transported to the assembly space by the component supply device and stacked on the cover plate component; The tube shell gasket element is transported to the assembly space by the element supply device, and is stacked on the tube shell element; After obtaining the clamping member, the assembly platform device clamps the stacked cover plate gasket element, cover plate element, tube shell element, and tube shell gasket element to form a target assembly; the target assembly is used to produce ceramic coated chips in the sealing step; The target component assembled from the assembly platform device is received by the unloading device.

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