A vertical wafer probe card

By designing a vertical wafer probe card containing specific structural elements, the problems of cumbersome assembly and unstable contact of existing probe cards are solved, higher test stability and yield are achieved, and assembly efficiency is improved.

CN113253101BActive Publication Date: 2025-01-24SHENZHEN DOUGATE TECH CO LTD
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Patent Information

Application Number
CN202110665784.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-06-16
Publication Date
2025-01-24
Estimated Expiration
2041-06-16

AI Technical Summary

Technical Problem

The existing vertical probe cards are cumbersome to assemble and have low efficiency. The contact between the test probe and the electrode of the test chip is not stable enough, which is prone to poor contact, affecting the product test yield.

Method used

A vertical wafer probe card is designed, including a bottom plate, a middle plate, a top plate, test probes and an insulating fixing piece. Through specific structural designs, such as limiting protrusions, grooves, through holes and arc-shaped elastic connecting rods, stable contact of the test probes and avoidance of short circuits are ensured.

Benefits of technology

It effectively avoids the problem of poor contact, improves test stability and reliability, improves product test yield, simplifies the structure and assembly process, and improves assembly efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the field of probe card technology, and discloses a vertical wafer probe card, which is detachably arranged on the upper end wall of a limiting protrusion through an insulating fixing sheet, the limiting protrusion is penetrated through a through groove, and the limiting protrusion is detachably embedded in the limiting groove. The insulating fixing sheet plays an effective role in preventing a test probe from passing through a top plate. When the test probe is pressed down on a contact, a stable contact is formed by the elastic force generated by the bending of an arc-shaped elastic connecting rod, effectively avoiding possible poor contact problems. The insulating fixing sheet allows the arc-shaped elastic connecting rods on the test probe to bend in the same direction, which can effectively avoid the problem of short circuit caused by contact between adjacent test probes, effectively improving the test stability and reliability of the vertical probe card, and improving the product test yield. The card has a simple structure, is convenient and quick to assemble, has high assembly precision, effectively improves efficiency, and has strong practicality.
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Description

Technical Field

[0001] The present invention relates to the technical field of probe cards, and in particular to a vertical wafer probe card. Background Art

[0002] A probe card is a fixture used to perform electrical testing on LSI (Large Scale Integrated Circuit) chips on a wafer during the wafer testing process in the LSI (Large Scale Integrated Circuit) manufacturing process. The probe card docks on a wafer prober to serve as a connector between the LSI chip electrodes and the LSI tester (as a measuring machine). The needles of the probe card contact the LSI chip electrodes to perform electrical testing for pass / fail testing. The wafer testing process is very important and highly dependent on the reliability of the probe card.

[0003] However, the existing vertical probe cards have the problems of cumbersome assembly and low efficiency, and the contact between the test probes and the test chip electrodes is not stable enough, which is prone to poor contact and affects the product test yield, and further improvement is needed. Summary of the invention

[0004] The main purpose of the present invention is to propose a vertical wafer probe card, which aims to solve the technical problems that the existing vertical probe card has complicated assembly, low efficiency, and the contact between the test probe and the test chip electrode is not stable enough, which is prone to poor contact and affects the product test yield.

[0005] To achieve the above-mentioned purpose, the vertical wafer probe card proposed in the present invention includes a bottom plate, an intermediate plate, a top plate, a test probe and an insulating fixing plate, wherein the intermediate plate is arranged between the bottom plate and the top plate, and the top plate is detachably arranged on the upper end wall of the intermediate plate, and the bottom plate is detachably arranged on the lower end wall of the intermediate plate, the upper end wall of the bottom plate is convexly provided with a limiting protrusion, the upper end wall of the limiting protrusion is concavely provided with a groove, the bottom of the groove is concavely provided with a plurality of first through holes arranged in a matrix, the upper end wall of the intermediate plate is concavely provided with a through groove, the inner side wall of the top plate is concavely provided with a limiting groove matched with the limiting protrusion, and the insulating fixing plate and the limiting groove are The bottom is respectively recessed with a plurality of second through holes and a third through hole corresponding to the first through hole, the middle of the test probe is provided with an arc-shaped elastic connecting rod, and the upper end of the arc-shaped elastic connecting rod can be abutted against the lower end wall of the second through hole, the test probes are respectively fixed in the second through holes, the insulating fixing sheet is detachably arranged on the upper end wall of the limiting protrusion, the limiting protrusion is penetrated through the through groove, and the limiting protrusion is detachably embedded in the limiting groove, the lower end of the test probe is respectively movably penetrated through the first through hole, and the upper end of the test probe is respectively movably penetrated through the third through hole.

[0006] Furthermore, it also includes a first positioning pin and a second positioning pin, the outer diameter of the first positioning pin is larger than the outer diameter of the second positioning pin, and the two sides of the top plate, the middle plate and the bottom plate are respectively recessed with a first positioning hole and a second positioning hole that are compatible with the first positioning pin and the second positioning pin, and the first positioning pin and the second positioning pin are respectively and detachably embedded in the first positioning hole and the second positioning hole.

[0007] Furthermore, it also includes a third positioning pin and a fourth positioning pin, the outer diameter of the third positioning pin is larger than the outer diameter of the fourth positioning pin, the upper end wall of the limiting protrusion and the two ends of the insulating fixing plate are respectively recessed with a third positioning hole and a fourth positioning hole that are compatible with the third positioning pin and the fourth positioning pin, and the third positioning pin and the fourth positioning pin are respectively and detachably embedded in the third positioning hole and the fourth positioning hole in turn.

[0008] Furthermore, it also includes a first fastening bolt, the lower end wall of the bottom plate is recessed with a plurality of first countersunk holes along the circumferential direction, the middle plate and the top plate are respectively recessed with a plurality of first threaded holes and fourth through holes corresponding to the first countersunk holes one by one, the first fastening bolts are respectively passed through the first countersunk holes in sequence and screwed into the first threaded holes, and the upper ends of the first fastening bolts are respectively embedded in the fourth through holes.

[0009] Furthermore, it also includes a second fastening bolt, the upper end wall of the top plate is recessed with a plurality of second countersunk holes along the circumferential direction, the middle plate and the bottom plate are respectively recessed with a plurality of second threaded holes and a fifth through hole corresponding one to one with the second countersunk holes, the second fastening bolts are respectively passed through the second countersunk holes in sequence and screwed into the second threaded holes, and the lower ends of the second fastening bolts are respectively embedded in the fifth through holes.

[0010] Furthermore, a plurality of third countersunk holes are recessed on the lower end wall of the bottom plate along the circumferential direction, and a plurality of sixth through holes corresponding to the third countersunk holes are recessed on the middle plate and the top plate respectively.

[0011] Furthermore, the top plate and the bottom plate are both made of ceramic material.

[0012] Furthermore, the middle plate is made of stainless steel.

[0013] Furthermore, the test probe is made of rhenium tungsten, tungsten or beryllium copper.

[0014] Furthermore, the insulating fixing sheet is formed of polyimide organic polymer material.

[0015] The technical solution of the present invention has the following beneficial effects: the technical solution of the present invention is that a limiting protrusion is convexly provided on the upper end wall of the bottom plate, a groove is concavely provided on the upper end wall of the limiting protrusion, a plurality of first through holes arranged in a matrix are concavely provided on the bottom of the groove, a through groove is concavely provided on the upper end wall of the middle plate, a limiting groove is concavely provided on the inner side wall of the top plate to match the limiting protrusion, a plurality of second through holes and a third through hole corresponding to the first through hole are respectively concavely provided on the bottom of the insulating fixing plate and the limiting groove, an arc-shaped elastic connecting rod is provided in the middle of the test probe, the test probes are respectively fixed in the second through hole, the insulating fixing plate is detachably provided on the upper end wall of the limiting protrusion, the limiting protrusion is penetrated in the through groove, and the limiting protrusion is detachably embedded in the limiting groove. The lower ends of the test probes are movably arranged in the first through-hole arrangement, and the upper ends of the test probes are movably arranged in the third through-hole arrangement. The insulating fixing sheet effectively prevents the test probes from passing through the top plate. When the test probes are pressed down on the contacts, stable contact is formed by the elastic force generated by the bending of the arc-shaped elastic connecting rods, thereby effectively avoiding possible poor contact problems. The insulating fixing sheet enables the arc-shaped elastic connecting rods on the test probes to bend in the same direction, thereby effectively avoiding the problem of short circuits caused by contact between adjacent test probes, thereby effectively improving the test stability and reliability of the vertical probe card and improving the product test yield. The card has a simple structure, is convenient and quick to assemble, has high assembly precision, effectively improves efficiency, and is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the overall structure of a vertical wafer probe card proposed by the present invention;

[0018] Figure 2 A schematic diagram of the overall structure of a vertical wafer probe card proposed by the present invention from another perspective;

[0019] Figure 3 A schematic diagram of the exploded structure of a vertical wafer probe card proposed by the present invention;

[0020] Figure 4 Another exploded structural schematic diagram of a vertical wafer probe card proposed by the present invention;

[0021] Figure 5 A schematic diagram of a partially exploded structure of a vertical wafer probe card proposed by the present invention;

[0022] Figure 6 A partial structural schematic diagram of a vertical wafer probe card proposed by the present invention;

[0023] Figure 7 It is another partial structural schematic diagram of a vertical wafer probe card proposed by the present invention;

[0024] Figure 8 The present invention provides a schematic structural diagram of a test probe of a vertical wafer probe card.

[0025] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0028] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0029] The invention provides a vertical wafer probe card.

[0030] like Figures 1 to 8As shown, in one embodiment of the present invention, the vertical wafer probe card includes a bottom plate 101, an intermediate plate 102, a top plate 103, a test probe 104 and an insulating fixing plate 105, wherein the intermediate plate 102 is arranged between the bottom plate 101 and the top plate 103, and the top plate 103 is detachably arranged on the upper end wall of the intermediate plate 102, and the bottom plate 101 is detachably arranged on the lower end wall of the intermediate plate 102. The upper end wall is provided with a limiting protrusion 1011, the upper end wall of the limiting protrusion 1011 is provided with a groove 1012, the bottom of the groove 1012 is provided with a plurality of first through holes 1013 arranged in a matrix, the upper end wall of the intermediate plate 102 is provided with a through groove 1021, the inner side wall of the top plate 103 is provided with a limiting groove 1031 adapted to the limiting protrusion 1011, the insulating fixing sheet 105 and the bottom part of the limiting groove 1031 are provided with a plurality of first through holes 1013 arranged in a matrix, the upper end wall of the intermediate plate 102 is provided with a through groove 1021, the inner side wall of the top plate 103 is provided with a limiting groove 1031 adapted to the limiting protrusion 1011, and the insulating fixing sheet 105 and the bottom part of the limiting groove 1031 are provided with a plurality of first through holes 1013 arranged in a matrix ... A plurality of second through holes (not shown) and a third through hole 1032 corresponding to the first through hole 1013 are respectively provided, and an arc-shaped elastic connecting rod 1041 is provided in the middle of the test probe 104, and the upper end of the arc-shaped elastic connecting rod 1014 can be abutted against the lower end wall of the second through hole, and the test probes 104 are respectively fixed in the second through holes, and the insulating fixing sheet 105 is detachably arranged on the upper end wall of the limiting protrusion 1011, and the arc-shaped elastic connecting rod 1041 can be movably arranged in the groove 1012, the limiting protrusion 1011 is penetrated in the through groove 1021, and the limiting protrusion 1011 is detachably embedded in the limiting groove, the lower end of the test probe 104 is movably penetrated in the first through hole 1013, and the upper end of the test probe 104 is movably penetrated in the third through hole 1032.

[0031] Specifically, it also includes a first positioning pin 106 and a second positioning pin 107. The outer diameter of the first positioning pin 106 is larger than the outer diameter of the second positioning pin 107. The top plate 103, the middle plate 102 and the bottom plate 101 have two sides respectively recessed with a first positioning hole 108 and a second positioning hole 109 that are compatible with the first positioning pin 106 and the second positioning pin 107. The first positioning pin 106 and the second positioning pin 107 are respectively and detachably embedded in the first positioning hole 108 and the second positioning hole 109.

[0032] Specifically, it also includes a third positioning pin (not shown) and a fourth positioning pin (not shown), the outer diameter of the third positioning pin is larger than the outer diameter of the fourth positioning pin, the upper end wall of the limiting protrusion 1011 and the two ends of the insulating fixing plate 105 are respectively recessed with a third positioning hole 1014 and a fourth positioning hole 1015 that are compatible with the third positioning pin and the fourth positioning pin, and the third positioning pin and the fourth positioning pin are respectively and detachably embedded in the third positioning hole 1014 and the fourth positioning hole 1015 in sequence.

[0033] Specifically, it also includes a first fastening bolt 110, and the lower end wall of the bottom plate 101 is recessed with a plurality of first countersunk holes 1016 along the circumferential direction, and the middle plate 102 and the top plate 103 are respectively recessed with a plurality of first threaded holes 1022 and fourth through holes 1033 corresponding to the first countersunk holes 1013 one by one, and the first fastening bolts 110 are respectively passed through the first countersunk holes 1016 in sequence and screwed into the first threaded holes 1022, and the upper ends of the first fastening bolts 110 are respectively embedded in the fourth through holes 1033.

[0034] Specifically, it also includes a second fastening bolt 111, and the upper end wall of the top plate 103 is recessed with a plurality of second countersunk holes 1034 along the circumferential direction, and the middle plate 102 and the bottom plate 101 are respectively recessed with a plurality of second threaded holes 1023 and a fifth through hole 1017 corresponding to the second countersunk holes 1034 one by one, and the second fastening bolts 111 are respectively passed through the second countersunk holes 1034 in sequence and screwed into the second threaded holes 1023, and the lower ends of the second fastening bolts 111 are respectively embedded in the fifth through holes 1017.

[0035] Specifically, a plurality of third countersunk holes 1018 are recessed on the lower end wall of the bottom plate 101 along the circumferential direction, and a plurality of sixth through holes 112 corresponding to the third countersunk holes 1018 are recessed on the middle plate 102 and the top plate 103 respectively.

[0036] Specifically, the top plate 103 and the bottom plate 101 are both made of ceramic material and have good insulation performance.

[0037] Specifically, the middle plate 102 is made of stainless steel.

[0038] Specifically, the test probe 104 is made of rhenium tungsten or tungsten or beryllium copper, which has the advantages of good hardness / fatigue resistance and good stability, and is suitable for long-term testing.

[0039] Specifically, the insulating fixing sheet 105 is formed of polyimide organic polymer material and has high insulation performance.

[0040] Specifically, the present invention is provided with a limiting protrusion through the upper end wall of the bottom plate, a groove is recessed on the upper end wall of the limiting protrusion, a plurality of first through holes arranged in a matrix are recessed on the bottom of the groove, a through groove is recessed on the upper end wall of the middle plate, a limiting groove matched with the limiting protrusion is recessed on the inner side wall of the top plate, a plurality of second through holes and a third through hole corresponding to the first through hole are recessed on the bottom of the insulating fixing plate and the limiting groove, an arc-shaped elastic connecting rod is provided in the middle of the test probe, the test probes are respectively fixed in the second through holes, the insulating fixing plate is detachably arranged on the upper end wall of the limiting protrusion, the limiting protrusion is penetrated in the through groove, and the limiting protrusion is detachably embedded in the limiting groove, and the lower end part of the test probe The test probes are movably inserted in the first through-hole arrangement, and the upper ends of the test probes are movably inserted in the third through-hole arrangements. The insulating fixing sheet effectively prevents the test probes from passing through the top plate. When the test probes are pressed down on the contacts, stable contact is formed by the elastic force generated by the bending of the arc-shaped elastic connecting rods, thereby effectively avoiding possible poor contact problems. The insulating fixing sheet enables the arc-shaped elastic connecting rods on the test probes to bend in the same direction, thereby effectively avoiding the problem of short circuits caused by contact between adjacent test probes, thereby effectively improving the test stability and reliability of the vertical probe card and improving the product test yield. The structure is simple, the assembly is convenient and quick, the assembly precision is high, the efficiency is effectively improved, and the practicability is strong.

[0041] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A vertical wafer probe card, characterized in that: The invention comprises a bottom plate, an intermediate plate, a top plate, a test probe and an insulating fixing sheet, wherein the intermediate plate is arranged between the bottom plate and the top plate, and the top plate is detachably arranged on the upper end wall of the intermediate plate, and the bottom plate is detachably arranged on the lower end wall of the intermediate plate, the upper end wall of the bottom plate is convexly provided with a limiting protrusion, the upper end wall of the limiting protrusion is concavely provided with a groove, the bottom of the groove is concavely provided with a plurality of first through holes arranged in a matrix, the upper end wall of the intermediate plate is concavely provided with a through groove, the inner side wall of the top plate is concavely provided with a limiting groove matched with the limiting protrusion, and the bottoms of the insulating fixing sheet and the limiting groove are respectively concavely provided with a plurality of first through holes arranged in a matrix. The second through hole and the third through hole corresponding to the first through hole, the middle of the test probe is provided with an arc-shaped elastic connecting rod, and the upper end of the arc-shaped elastic connecting rod is abutted against the lower end wall of the second through hole, the test probes are respectively fixed in the second through holes, the insulating fixing sheet is detachably arranged on the upper end wall of the limiting protrusion, the limiting protrusion is penetrated in the through groove, and the limiting protrusion is detachably embedded in the limiting groove, the lower end of the test probe is respectively movably penetrated in the first through hole, and the upper end of the test probe is respectively movably penetrated in the third through hole; The vertical wafer probe card further includes a first positioning pin and a second positioning pin, the outer diameter of the first positioning pin is larger than the outer diameter of the second positioning pin, and the top plate, the middle plate and the bottom plate are respectively provided with a first positioning hole and a second positioning hole adapted to the first positioning pin and the second positioning pin on both sides, and the first positioning pin and the second positioning pin are respectively and detachably embedded in the first positioning hole and the second positioning hole in sequence; The vertical wafer probe card also includes a third positioning pin and a fourth positioning pin. The outer diameter of the third positioning pin is larger than the outer diameter of the fourth positioning pin. The upper end wall of the limiting protrusion and the two ends of the insulating fixing plate are respectively recessed with a third positioning hole and a fourth positioning hole that are compatible with the third positioning pin and the fourth positioning pin. The third positioning pin and the fourth positioning pin are respectively and detachably embedded in the third positioning hole and the fourth positioning hole.

2. The vertical wafer probe card according to claim 1, characterized in that: It also includes a first fastening bolt, the lower end wall of the bottom plate is recessed with a plurality of first countersunk holes along the circumferential direction, the middle plate and the top plate are respectively recessed with a plurality of first threaded holes and fourth through holes corresponding to the first countersunk holes one by one, the first fastening bolts are respectively passed through the first countersunk holes in sequence and screwed into the first threaded holes, and the upper ends of the first fastening bolts are respectively embedded in the fourth through holes.

3. The vertical wafer probe card according to claim 1, characterized in that: It also includes a second fastening bolt, the upper end wall of the top plate is recessed with a plurality of second countersunk holes along the circumferential direction, the middle plate and the bottom plate are respectively recessed with a plurality of second threaded holes and a fifth through hole corresponding one to one with the second countersunk holes, the second fastening bolts are respectively passed through the second countersunk holes in sequence and screwed into the second threaded holes, and the lower ends of the second fastening bolts are respectively embedded in the fifth through holes.

4. The vertical wafer probe card according to claim 1, characterized in that: The lower end wall of the bottom plate is recessed with a plurality of third countersunk holes along the circumferential direction, and the middle plate and the top plate are respectively recessed with a plurality of sixth through holes corresponding to the third countersunk holes.

5. The vertical wafer probe card according to claim 1, characterized in that: The top plate and the bottom plate are both made of ceramic material.

6. The vertical wafer probe card according to claim 1, characterized in that: The middle plate is made of stainless steel.

7. The vertical wafer probe card according to claim 1, characterized in that: The test probe is made of rhenium tungsten, tungsten or beryllium copper.

8. The vertical wafer probe card according to claim 1, characterized in that: The insulating fixing sheet is formed of polyimide organic polymer material.

Citation Information

Patent Citations

  • Vertical wafer probe card

    CN217181120U