Method for manufacturing pattern plate for plating and wiring substrate

Abstract

The pattern plate for plating is configured to transfer a transfer pattern formed by plating to a substrate. The pattern plate for plating comprises: a substrate, and a plurality of transfer parts arranged on the substrate. The plurality of transfer parts respectively have a transfer surface configured to form a transfer pattern by plating. The plurality of transfer parts are arranged on the substrate so as to be electrically independent of each other. The pattern plate for plating can stabilize the quality of the thinned conductive pattern.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a pattern plate for plating and a wiring substrate. Background Art

[0002] For example, when manufacturing a substrate with a conductor layer pattern, a method of forming a conductive pattern by subjecting a substrate to electrolytic plating is known (see, for example, Patent Document 1).

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: JP Patent No. 4798439 Summary of the invention

[0006] The pattern plate for plating is configured to transfer a transfer pattern formed by plating to a substrate. The pattern plate for plating comprises: a substrate, and a plurality of transfer parts arranged on the substrate. The plurality of transfer parts respectively have a transfer surface configured to form a transfer pattern by plating. The plurality of transfer parts are arranged on the substrate so as to be electrically independent of each other.

[0007] This plating pattern plate can stabilize the quality of a thinned conductive pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a plan view of the touch panel according to Embodiment 1.

[0009] Figure 2 It is a top view of the pattern plate for plating which concerns on Embodiment 1.

[0010] Figure 3 This is a partial cross-sectional view of the pattern plate for plating according to the first embodiment.

[0011] Figure 4 It is a figure which shows the manufacturing method of the pattern plate for plating which concerns on Embodiment 1.

[0012] Figure 5 It is a figure which shows the manufacturing method of the wiring board involved in Embodiment 1.

[0013] Fig. 6A This is a diagram showing a table showing conditions and evaluation results of Examples 1 to 7 and Comparative Examples of the pattern plate for plating according to the first embodiment.

[0014] Figure 6B It is a partial cross-sectional view of another pattern plate for plating according to the first embodiment.

[0015] Figure 7 It is a partial cross-sectional view of the pattern plate for plating involved in Embodiment 2.

[0016] Figure 8 It is a figure which shows the manufacturing method of the pattern plate for plating which concerns on Embodiment 2.

[0017] Fig. 9 This is a diagram showing a method for manufacturing a wiring substrate according to the second embodiment.

[0018] Fig.10 This is a diagram showing another method for manufacturing the wiring substrate according to the second embodiment.

[0019] Fig.11 It is a partial cross-sectional view of the pattern plate for plating involved in Embodiment 3.

[0020] Fig.12 It is a figure which shows the manufacturing method of the pattern plate for plating which concerns on Embodiment 3.

[0021] Fig.13 It is a partial cross-sectional view of the pattern plate for plating involved in Embodiment 4.

[0022] Fig.14 It is a figure which shows the manufacturing method of the pattern plate for plating which concerns on Embodiment 4. DETAILED DESCRIPTION

[0023] Hereinafter, a pattern plate for plating according to one embodiment of the present disclosure will be described in detail with reference to the drawings.

[0024] In addition, the embodiments described below all represent a specific example of the present disclosure. The numerical values, shapes, materials, structural elements, configuration positions of structural elements, connection methods, processes, and the order of processes shown in the following embodiments are examples and are not intended to limit the present disclosure. In addition, among the structural elements in the following embodiments, the structural elements not recorded in the independent claims representing the highest concept are described as arbitrary structural elements.

[0025] (Implementation Method 1)

[0026] [1-1 Touch Panel]

[0027] Figure 1 FIG. 2 is a plan view showing a schematic structure of a touch panel 300 according to Embodiment 1. Figure 1 In the diagram, a direction parallel to one side of the touch panel 300 is defined as an X-axis direction, and a direction perpendicular to the X-axis direction and parallel to the other side of the touch panel 300 is defined as a Y-axis direction.

[0028] like Figure 1As shown, the touch panel 300 is a capacitive touch panel and includes a wiring substrate 301 . The wiring substrate 301 includes a substrate 302 , a conductive pattern 310 arranged on one main surface of the substrate 302 , and a conductive pattern 320 arranged on the other main surface of the substrate 302 .

[0029] The conductive pattern 310 includes: a plurality of electrodes 311 arranged in parallel with each other, and a plurality of lead wirings 312 respectively led out from the plurality of electrodes 311. Specifically, the plurality of electrodes 311 are respectively long along the X-axis direction and arranged along the Y-axis direction. Each electrode 311 and the lead wiring 312 corresponding to the electrode 311 are arranged on the substrate 302 so as to be electrically independent from other electrodes 311 and other lead wirings 312. In other words, one group of electrodes 311 and lead wiring 312 are electrically independent from other groups of electrodes 311 and lead wiring 312. The plurality of lead wirings 312 are electrically connected to a flexible wiring substrate 330 provided at one end of the substrate 302.

[0030] The conductive pattern 320 includes: a plurality of electrodes 321 arranged in parallel with each other, and a plurality of lead-out wirings 322 respectively led out from the plurality of electrodes 321. Specifically, the plurality of electrodes 321 are respectively long strips along the Y-axis direction and are arranged along the X-axis direction. The plurality of electrodes 321 are arranged in a direction orthogonal to the electrode 311. Each electrode 321 and the lead-out wiring 322 corresponding to the electrode 321 are arranged on the substrate 302 so as to be electrically independent from other electrodes 321 and other lead-out wirings 322. In other words, one group of electrodes 321 and lead-out wirings 322 are electrically independent from other groups of electrodes 321 and lead-out wirings 322. The plurality of lead-out wirings 322 are electrically connected to a flexible wiring substrate 330 arranged at one end of the substrate 302.

[0031] In the first embodiment, the touch panel 300 is exemplified in which the conductive pattern 310 is formed on one main surface of a substrate 302 and the conductive pattern 320 is formed on the other main surface, but the touch panel may also be formed in which the conductive pattern 310 is formed on the main surface of one substrate of two substrates and the conductive pattern 320 is formed on the main surface of the other substrate. In addition, the touch panel may also be formed in which the conductive pattern 310 is formed on one main surface of the substrate 302 and the conductive pattern 320 is formed on the conductive pattern 310 via an insulating layer.

[0032] [1-2 Pattern plate for plating]

[0033] The conductive pattern 310 is formed by a plating pattern plate. Next, the plating pattern plate will be described. The basic structure of the plating pattern plate used to form the conductive pattern 320 is the same as that of the plating pattern plate used to form the conductive pattern 310, so the description thereof will be omitted.

[0034] Figure 2 It is a plan view showing a schematic structure of the plating pattern plate 10 for forming the conductive pattern 310 according to Embodiment 1. When manufacturing the touch panel 300 , the plating pattern plate 10 is overlapped with one main surface of the substrate 302 . Figure 2 , the state where the pattern plate 10 for plating is developed on the substrate 302 is shown. Figure 2 In the X-axis direction, Figure 1 on the contrary.

[0035] like Figure 2 As shown, the plating pattern plate 10 includes a base material 20 , a plurality of transfer portions 30 , and a resin portion 40 .

[0036] The substrate 20 has a flat plate shape having main surfaces 20a and 20b on opposite sides. A plurality of transfer portions 30 are arranged on one main surface 20a of the substrate 20. The plurality of transfer portions 30 respectively have shapes corresponding to the plurality of groups of electrodes 311 and lead-out wirings 312 that form the conductive pattern 310. The plurality of transfer portions 30 are arranged on the main surface 20a of the substrate 20 to be electrically independent of each other. In other words, the plurality of transfer portions 30 are not in electrical contact with each other within the main surface 20a of the substrate 20. In embodiment 1, the plurality of transfer portions 30 are also not in physical contact with each other and are arranged in an island shape. The resin portion 40 is overlapped on the substrate 20 so as to be arranged in an area outside the transfer portion 30 when viewed from above.

[0037] Hereinafter, the pattern plate 10 for plating will be described in more detail. Figure 3 1 is a partial cross-sectional view showing a partial schematic structure of the pattern plate 10 for plating according to the first embodiment. Specifically, Figure 3 express Figure 2 The cross section of the plating pattern plate 10 taken along line III-III is shown.

[0038] like Figure 3 As shown, the pattern plate 10 for plating includes a substrate 20, a base metal 31, and a resin portion 40. The substrate 20 includes a layer 21 and a layer 22. The layer 21 is a supporting substrate for supporting the material constituting the pattern plate, and includes, for example, a metal plate, a glass plate, a film, etc. It is further preferred that the supporting substrate has light transmittance. In this case, a glass plate, a light transmittance film, etc. are used. The layer 22 is laminated in order to fix the base metal 31 on the main surface 21a of the layer 21. If the base metal 31 can be fixed, it can be any material but preferably has insulation, for example, including acrylic resin, epoxy resin, silicone resin, etc. In addition, it is preferred that the layer 22 further has light transmittance. A part of the base metal 31 is buried in the main surface 22a of the layer 22 constituting the main surface 20a of the substrate 20.

[0039] The base metal 31 has a transfer portion 30 and a pair of protrusions 32 protruding laterally from the two end edges of the lower portion of the transfer portion 30. The top surface of the transfer portion 30 is a transfer surface 33, which is exposed from the resin portion 40. On the transfer surface 33 of the transfer portion 30, a transfer pattern is formed by electroless plating. In other words, in the base metal 31, only the transfer portion 30 contributes to the formation of the transfer pattern. In embodiment 1, it is preferred that the thickness t1 of the transfer portion 30 is greater than 1μμm. Thereby, the peelability of the transfer pattern can be improved. However, the function of the transfer surface 33 to precipitate metal by plating can be fully reflected at a thickness of the transfer portion 30 of more than 0.1μm, so the thickness t1 of the transfer portion 30 can also be greater than 0.1μm.

[0040] In addition, the material of the base metal 31 can be any material as long as it is a metal that can form a transfer pattern by electroless plating, but in order to form the base metal 31 into a pattern, it is preferably a metal that can be formed by plating. As the material of the base metal 31, for example, an alloy of iron and nickel is given. In embodiment 1, the base metal 31 is formed by an alloy with a total content of iron and nickel of more than 80%. The alloy forming the base metal 31 may also contain impurities of less than 20%. It is more preferred that the base metal 31 is formed by an alloy with a total content of iron and nickel of more than 95%. In this case, the alloy forming the base metal 31 may also contain impurities of less than 5%.

[0041] The resin portion 40 is stacked on the layer 22 of the base material 20 so that the transfer surface 33 of the transfer portion 30 is exposed. The surface 40a of the resin portion 40 is arranged at a position higher than the transfer surface 33 of the transfer portion 30. In other words, the transfer surface 33 of the transfer portion 30 is recessed relative to the surface 40a of the resin portion 40. By recessing the transfer surface 33 relative to the surface 40a of the resin portion 40, it is possible to suppress the expansion of the line width when the transfer pattern is precipitated, and it is possible to form a thinner wiring with lower resistance. The resin portion 40 is formed by a photocurable resin having a releasable property. Specifically, the resin portion 40 is formed by a photocurable resin containing fluorine.

[0042] [1-3 Method for manufacturing pattern plate for plating]

[0043] Next, a method for manufacturing the pattern plate 10 for plating according to the first embodiment will be described. Figure 4 It is an explanatory diagram showing the flow of the method for manufacturing the pattern plate 10 for plating according to the first embodiment.

[0044] First, if Figure 4As shown, in the photolithography process, a patterning material 401 containing a photosensitive substance is stacked on an electroforming substrate 400. After stacking, the patterning material 401 is subjected to photolithography so as to form an opening 402 corresponding to the shape of the transfer portion 30. Here, the electroforming substrate 400 is formed of a metal having a conductivity that allows electrolytic plating. Specifically, the electroforming substrate 400 can also be formed of copper, stainless steel, nickel, etc. Furthermore, a component having a conductive thin film of ITO, copper, nickel, chromium, etc. formed on a glass or resin substrate can also be used as the electroforming substrate 400. In addition, the patterning material 401 can be any material that can be patterned by photolithography or the like. Specifically, polyimide that can be used repeatedly is exemplified.

[0045] Next, in the electroplating step, electroplating is performed on the electroforming substrate 400 and the patterning material 401 , thereby forming the base metal 31 in the opening 402 .

[0046] Next, in the transfer process, the base metal 31 is transferred to the substrate 20. Specifically, the base metal 31 is transferred to the layer 22 so that the protruding portion 32 of the base metal 31 is one surface with respect to the main surface 22a of the layer 22, that is, the main surface 20a of the substrate 20. Thus, a part of the base metal 31 is buried in the layer 22 of the substrate 20, and a part of the transferred portion 30 protrudes from the layer 22.

[0047] Next, in the resin portion forming step, a photocurable resin 410 as the resin portion 40 is applied to the base material 20 so as to cover the layer 22 and the base metal 31 .

[0048] Next, in the irradiation step, light (e.g., ultraviolet light: UV light) is irradiated to the base metal 31 through the substrate 20. As a result, a portion of the photocurable resin 410 is cured. In addition, the base metal 31 blocks the light. A portion 412 of the photocurable resin 410 that overlaps with the protrusion 32 of the base metal 31 has a thickness that allows light to enter from the outside, so the portion 412 is cured by the light. As a result, the region 411 of the photocurable resin 410 that overlaps with the transfer portion 30 is not cured because the light that is required to cure the region 411 does not reach the region 411, and the region 411 is left uncured.

[0049] Next, in the removal step, the photocurable resin 410 is washed with a solvent to remove the uncured region 411 of the photocurable resin 410. Thus, the remaining portion of the photocurable resin 410 becomes the resin portion 40. Thus, the pattern plate 10 for plating can be manufactured.

[0050] [1-4 Method for manufacturing wiring substrate]

[0051] Next, a method for manufacturing a wiring board using the plating pattern plate 10 according to the first embodiment will be described. Figure 5 It is an explanatory diagram showing the flow of the method for manufacturing the wiring substrate 301 according to the first embodiment.

[0052] like Figure 5 As shown in the figure, in the demolding treatment process, demolding treatment is performed on the transfer surface 33 of the transfer unit 30. Here, the demolding treatment refers to a treatment for improving the demolding property of the transfer pattern with respect to the transfer surface 33. Specifically, as the demolding treatment, a demolding layer 34 is formed by applying a demolding agent such as a thiazole-based demolding agent to the transfer surface 33. In addition, the demolding treatment may be a treatment for not only applying a demolding agent but also modifying the transfer surface 33 to improve the demolding property.

[0053] Next, in the first electroless plating process, the pattern plate 10 for plating having the release layer 34 is immersed in a plating solution containing nickel, and electroless plating is performed to form a transfer pattern 36 on the release layer 34. However, electroless plating may be performed instead of electroless plating to form the transfer pattern 36 on the release layer 34, in which case the first electroless plating process is a plating process. Thus, the transfer pattern 36 is formed above the transfer surface 33 of the transfer unit 30. That is, the transfer pattern 36 is formed on the transfer surface 33 of the transfer unit 30 via the release layer 34. The transfer pattern 36 becomes a thin film layer containing nickel, i.e., an electroless nickel film. In addition, by containing dimethylamine borane as a reducing agent in the plating solution during electroless plating, the transfer pattern 36 becomes a thin film layer containing nickel and boron, i.e., an electroless nickel film. In addition, if hypophosphite is included as a reducing agent in the plating solution during electroless plating, the transfer pattern 36 becomes a thin film layer containing nickel and phosphorus, that is, an electroless nickel film. In order to deposit these electroless nickel films on the transfer surface 33, the base metal 31 needs to be plating active with respect to the electroless plating solution. Specifically, a catalytic effect of oxidizing the reducing agent is required for the base metal 31. In the present disclosure, a preferred form of the base metal 31 required for both the plating deposition effect and the peeling property is found, which will be described in the embodiments described below.

[0054] Next, in the second electroless plating step, the plating pattern plate 10 having the transfer pattern 36 is immersed in a plating solution containing copper, for example, and electroless plating is performed to form a conductive pattern 37 on the transfer pattern 36. The material of the conductive pattern 37 may be a metal other than copper as long as it is a conductive metal that can be formed by electroless plating. As the material of the conductive pattern 37 other than copper, for example, gold, silver, etc. are cited. Copper, gold, and silver are metals with high conductivity, and therefore are preferably used as the material of the conductive pattern 37.

[0055] Next, in the first blackening process, a blackening layer 38 is formed on the conductive pattern 37. The blackening layer 38 can be formed, for example, by displacement plating of palladium, or by making the surface of the conductive pattern 37 concave and convex by etching or the like. In addition, when the conductive pattern 37 itself is black, the blackening layer 38 is not necessary.

[0056] Next, in the transfer process, the substrate 302 that becomes the wiring substrate 301 is crimped to the plating pattern plate 10 having the release layer 34, the transfer pattern 36, the conductive pattern 37, and the blackening layer 38. Here, the substrate 302 includes: a flat substrate 351, and a transfer resin layer 352 laminated on one main surface 351a of the substrate 351. The substrate 351 is formed by resin, glass, metal, etc. The transfer resin layer 352 is formed by a material having the property of fixing the conductive pattern 37 to be transferred. Specifically, the transfer resin layer 352 is formed by a thermosetting resin such as epoxy, a photocurable resin, a heat sealing material, etc. In addition, from the viewpoint of ease of manufacturing, the transfer resin layer 352 can be formed by a photocurable resin.

[0057] In the transfer process, when the substrate 302 is pressure-bonded to the pattern plate 10 for plating, the blackened layer 38 and the conductive pattern 37 are buried in the transfer resin layer 352 .

[0058] Next, in the demolding process, the substrate 302 is peeled off from the pattern plate 10 for plating. Thus, on the substrate 302, the blackened layer 38, the conductive pattern 37, and the transfer pattern 36 are integrated and fixed. During this demolding, the transfer pattern 36 is formed to be peelable from the transfer surface 33 of the base metal 31. Therefore, the transfer pattern 36 can be evenly peeled off from the transfer surface 33. Furthermore, since the release layer 34 is formed on the pattern plate 10 for plating, the transfer pattern 36 can be more evenly peeled off from the transfer surface 33. In other words, it is possible to suppress the transfer pattern 36 from remaining partially on the transfer surface 33. In addition, the resin portion 40 contains fluorine, so the resin portion 40 can be evenly peeled off from the substrate 302.

[0059] Next, in the second blackening process, a blackening layer 39 is formed on the transfer pattern 36. The blackening layer 39 can be formed, for example, by displacement plating of palladium, or by making the surface of the transfer pattern 36 concave and convex by etching or the like. In addition, when the transfer pattern 36 itself is black, the blackening layer 39 is not required. The wiring substrate 301 is manufactured through the above process.

[0060] [1-5 Examples]

[0061] Next, the peelability of the base metal 31 and the transfer metal (transfer pattern 36) involved in the embodiment is described. Here, the so-called transfer metal refers to an unpatterned solid film equivalent to the transfer pattern 36. In order to deposit pattern plating on the patterned base metal 31, it is useful to use electroless nickel plating. On the other hand, in order to deposit an electroless nickel film, the base metal 31 needs to be plating active relative to the electroless plating solution. Specifically, a catalytic effect of oxidizing the reducing agent is required for the base metal 31. In addition, the plated film that is precipitated at the same time needs to be able to be peeled off. Below, the preferred method of the base metal 31 required for taking into account both the plating deposition effect and the peelability, specifically, Examples 1 to 7 and Comparative Examples are described. Fig. 6A TABLE 1 is a table showing the conditions and evaluation results of Examples 1 to 7 and Comparative Examples. In Examples 1 to 7, Fe-Ni electrolytic plating films were deposited at a predetermined ratio on the Hall cell panels and used as the base metal 31. In the Comparative Example, SUS304 stainless steel foil was used as the base metal 31.

[0062] The base metal 31 involved in Example 1 is formed of an alloy having a total content of iron and nickel of more than 80% and a ratio of iron to nickel of 20 / 80. No release layer 34 is formed on the base metal 31 involved in Example 1, and the first electroless plating process is implemented by a plating solution containing nickel and phosphorus. As a result, the transferred metal is a thin film layer containing nickel and phosphorus. The temperature of the plating solution at this time is 70°C. The precipitation state of the transferred metal thus formed is evaluated. Fig. 6A In the figure, as the evaluation of the deposition state, "NG" indicates a level at which the electroless Ni film was not deposited as a uniform film, and "G" indicates a level at which the electroless Ni film was deposited as a uniform film.

[0063] In addition, after the transfer metal is formed, a transfer process and a demolding process are performed to evaluate the demolding property of the transfer metal. As an evaluation of the demolding property, "NG" indicates a state in which the transfer metal after the demolding process is not transferred to the substrate 302 even partially. In addition, "F" indicates a state in which the transfer metal after the demolding process is transferred to the substrate 302 as a whole, although unevenly. "G" indicates a state in which the transfer metal after the demolding process is transferred to the substrate 302 as a whole and roughly uniformly. "VG" indicates a state in which the transfer metal after the demolding process is transferred to the substrate 302 as a whole and uniformly. In addition, when the precipitation state is "NG", the transfer metal itself is not precipitated, so the demolding property evaluation is expressed as "NG".

[0064] The base metal 31 involved in Example 2 is formed of an alloy having a total content of iron and nickel of more than 80% and a ratio of iron to nickel of 20 / 80. A release layer 34 is formed on the base metal 31 involved in Example 2, and then a first electroless plating process is performed using a plating solution containing nickel and phosphorus. Thus, the transferred metal is a thin film layer containing nickel and phosphorus. The temperature of the plating solution at this time is 80°C. The precipitation state of the evaluation result of Example 2 is indicated as a grade of "G", and the release property is indicated as a grade of "G".

[0065] The base metal 31 involved in Example 3 is formed of an alloy having a total content of iron and nickel of more than 80% and a ratio of iron to nickel of 40 / 60. A release layer 34 is formed on the base metal 31 involved in Example 3, and then a first electroless plating process is performed using a plating solution containing nickel and phosphorus. Thus, the transferred metal is a thin film layer containing nickel and phosphorus. The temperature of the plating solution at this time is 80°C. The precipitation state of the evaluation result of Example 3 is indicated as a grade of "G", and the release property is indicated as a grade of "VG".

[0066] The base metal 31 involved in Example 4 is formed of an alloy having a total content of iron and nickel of more than 80% and a ratio of iron to nickel of 60 / 40. The release layer 34 is not formed on the base metal 31 involved in Example 4, and the first electroless plating process is implemented by a plating solution containing nickel and phosphorus. As a result, the transferred metal is a thin film layer containing nickel and phosphorus. The temperature of the plating solution at this time is 80°C. The precipitation state of the evaluation result of Example 4 is expressed as a grade of "G", and the release property is expressed as a grade of "VG".

[0067] The base metal 31 involved in Example 5 is formed of an alloy having a total content of iron and nickel of more than 80% and a ratio of iron to nickel of 60 / 40. A release layer 34 is formed on the base metal 31 involved in Example 5, and then a first electroless plating process is performed using a plating solution containing nickel and phosphorus. Thus, the transferred metal is a thin film layer containing nickel and phosphorus. The temperature of the plating solution at this time is 80°C. The precipitation state of the evaluation result of Example 5 is indicated as a grade of "G", and the release property is indicated as a grade of "VG".

[0068] The base metal 31 involved in Example 6 is formed of an alloy having a total content of iron and nickel of more than 80% and a ratio of iron to nickel of 60 / 40. The release layer 34 is not formed on the base metal 31 involved in Example 6, and the first electroless plating process is implemented by a plating solution containing nickel and boron. As a result, the transferred metal is a thin film layer containing nickel and boron. The temperature of the plating solution at this time is 75°C. The precipitation state of the evaluation result of Example 6 is expressed as a grade of "G", and the release property is expressed as a grade of "VG".

[0069] The base metal 31 involved in Example 7 is formed of an alloy having a total content of iron and nickel of more than 80% and a ratio of iron to nickel of 20 / 80. A release layer 34 is formed on the plating pattern plate 10 involved in Example 7, and then a first electroless plating process is performed by a plating solution containing nickel and boron. Thus, the transferred metal is a thin film layer containing nickel and boron. The temperature of the plating solution at this time is 75°C. The precipitation state of the evaluation result of Example 7 is indicated as a grade of "G", and the release property is indicated as a grade of "G".

[0070] The comparative example is different from the embodiments in that the base metal 31 is formed of stainless steel. The release layer 34 is not formed on the base metal 31 involved in the comparative example, and the first electroless plating process is performed using a plating solution containing nickel and phosphorus. The temperature of the plating solution at this time is 70°C. The evaluation results of the comparative example are expressed as "NG" for the precipitation state and "NG" for the release property.

[0071] Thus, in Examples 1 to 7, the transfer metal contains nickel, but the transfer metal that can be peeled off is not precipitated. A thinner oxide film is formed on the base metal 31 such as the Fe-Ni alloy, thereby reducing the adhesion of the electroless Ni film. However, in order to achieve the high catalytic effect of the Fe-Ni alloy on the reducing agent, an electroless Ni film based on self-oxidation-reduction is precipitated. As a result, it is believed that the precipitated electroless Ni film is hardly in close contact with the base metal 31, and peeling becomes easy. In the case of SUS, the oxide film is excessively attached to the surface, or it contains more metals that are inactive to plating than the Fe-Ni alloy, so the catalytic effect is low, and as a result, it is believed that the Ni-P plating film is difficult to precipitate. In particular, it can be seen that if the iron content in the base metal 31 is more than 20%, a certain degree of demolding property is exerted even if the demolding layer 34 is not present.

[0072] [1-6 effects, etc.]

[0073] As described above, the pattern plate 10 for plating involved in embodiment 1 is a pattern plate 10 for plating that is used to transfer the transfer pattern 36 formed by plating to a substrate 302 that becomes a wiring substrate 301, and comprises: a substrate 20; and a plurality of transfer portions 30 arranged on the substrate 20, that is, a plurality of transfer portions 30 for transferring the formed transfer pattern 36, and the plurality of transfer portions 30 are arranged on the substrate 20 so as to be electrically independent of each other.

[0074] Thus, on the substrate 20, the plurality of transfer parts 30 are configured to be electrically independent of each other, so even if a defect such as disconnection or short circuit occurs during the manufacture of the pattern plate 10 for plating, the location of the defect can be easily found through electrical inspections such as conduction inspections. On the other hand, when the plurality of transfer parts 30 are electrically connected to each other, the disconnection or short circuit of the transfer part 30 cannot be evaluated, and it is difficult to detect defects of the pattern plate 10 for plating.

[0075] The plating pattern plate 10 is used to transfer the transfer pattern 36 formed by plating to the substrate 302 serving as the wiring substrate 301 , and the plurality of transfer portions 30 are arranged on the light-transmitting base material 20 .

[0076] Thus, since the plurality of transfer portions 30 are disposed on the light-transmitting substrate 20 , when light is irradiated through the substrate 20 during the manufacture of the pattern plate 10 for plating, the plurality of transfer portions 30 themselves block the light.

[0077] For example, when a photoreactive resin (photocurable resin 410) is stacked on one side of a plurality of transfer sections 30 in the substrate 20 so as to cover the transfer sections 30, the photocurable resin 410 on each transfer section 30 does not react in order to shield the transfer sections 30 themselves from light. As a result, the uncured photocurable resin 410 can be easily removed in the subsequent process. Therefore, the transfer surface 33 that contributes to the transfer in each transfer section 30 can be reliably exposed from the photocurable resin 410. On each exposed transfer surface 33, a transfer pattern 36 is formed by electroless plating, and a conductive pattern 37 is further formed thereon. If each transfer surface 33 is reliably exposed, the transfer pattern 36 and the conductive pattern 37 can be formed with excellent precision, so that even if the conductive pattern 37 is thinned, the quality can be stabilized.

[0078] The plating pattern plate 10 involved in embodiment 1 is a plating pattern plate 10 used to transfer the transfer pattern 36 formed by plating to a substrate 302 serving as a wiring substrate 301, and comprises: a light-transmitting substrate 20; and a transfer portion 30 arranged on the substrate 20, i.e., a transfer portion 30 for transferring the formed transfer pattern 36.

[0079] Thus, since the transfer part 30 is provided on the light-transmitting substrate 20, when the pattern plate 10 for plating is manufactured, the transfer part 30 itself blocks the light. For example, when a photoreactive resin (photocurable resin 410) is stacked on the transfer part 30 side of the substrate 20 so as to cover the transfer part 30, since the transfer part 30 itself blocks the light, the photocurable resin 410 on the transfer part 30 does not react. Thus, the uncured photocurable resin 410 can be easily removed in the subsequent process. Therefore, the transfer surface 33 of the transfer part 30 that contributes to the transfer can be reliably exposed from the photocurable resin 410. On the exposed transfer surface 33, the transfer pattern 36 is formed by electroless plating, and the conductive pattern 37 is further formed thereon. If the transfer surface 33 is reliably exposed, the transfer pattern 36 and the conductive pattern 37 can be formed with excellent precision, so that even if the conductive pattern 37 is thinned, the quality can be stabilized.

[0080] Although thinner conductive patterns are desired, the quality of conductive patterns formed only by electrolytic plating is currently uneven.

[0081] By using the plating pattern plate 10 in the first embodiment, as described above, the quality of the thinned conductive pattern 37 can be stabilized.

[0082] The transfer portion 30 is formed of an alloy of iron and nickel.

[0083] Thus, it is possible to improve the peeling property of the transfer pattern 36 formed by electroless plating on the transfer portion 30. Therefore, the transfer pattern 36 can be uniformly peeled off from the transfer portion 30, thereby improving the quality of the transfer pattern 36. Thus, it is possible to stabilize the quality of the thinned conductive pattern 37 formed later on the transfer pattern 36.

[0084] Furthermore, the transfer portion 30 is formed by electroplating.

[0085] Thus, even in the case of the transfer portion 30 formed by electroplating, it is possible to improve the releasability from the transfer pattern 36 formed by plating on the transfer portion 30 .

[0086] Furthermore, the transfer portion 30 is formed of an alloy having a total content of iron and nickel of 80% or more.

[0087] This can further improve the releasability of the transfer pattern 36 formed on the transfer portion 30 by electroless plating.

[0088] Furthermore, the transfer portion 30 is formed of an alloy in which the ratio of the content of iron to the total content of iron and nickel is 20% or more.

[0089] Thereby, in the transfer portion 30 , the releasability with respect to the transfer pattern 36 formed on the transfer portion 30 by plating can be further improved.

[0090] The thickness of the transfer portion is 1 μm or more. However, as described above, the thickness of the transfer portion 30 may be 0.1 μm or more.

[0091] This can further improve the releasability of the transfer pattern 36 formed on the transfer portion 30 by electroless plating.

[0092] Furthermore, the plating pattern plate 10 includes a resin portion 40 disposed in a region other than the transfer portion 30 in a plan view, and the resin portion 40 contains fluorine.

[0093] Thereby, when the transfer pattern 36 is transferred, the peeling property from the substrate 302 overlapped with the resin portion 40 can be improved. Thereby, the quality of the transferred pattern 36 after the transfer can be maintained.

[0094] In addition, the manufacturing method of the wiring substrate 301 involved in embodiment 1 includes: a first electroless plating step, in which a transfer pattern 36 is formed by electroless plating in the transfer portion 30 of the pattern plate 10 for plating; a transfer step, in which the transfer pattern 36 is transferred to the substrate 302; and a second electroless plating step, in which a conductive pattern 37 is formed in the transfer pattern 36 by electroless plating.

[0095] Thus, as described above, the transfer portion 30 of the plating pattern plate 10, in which the transfer surface 33 is reliably exposed, forms the transfer pattern 36 by plating, so that the thinned transfer pattern 36 can be formed with high precision. In addition, the conductive pattern 37 is formed by electroless plating on the transfer pattern 36, so the precision of the conductive pattern 37 can also be improved. Therefore, even the thinned conductive pattern 37 can have stable quality.

[0096] Furthermore, before the first electroless plating step, a mold release treatment step of performing a mold release treatment on the transfer portion 30 is included.

[0097] Thus, the transfer pattern 36 can be reliably peeled from the transfer unit 30 via the release layer 34. Therefore, the transfer pattern 36 can be uniformly peeled from the transfer unit 30, and the quality of the transfer pattern 36 can be further improved.

[0098] In addition, the wiring substrate 301 is a wiring substrate for a touch panel.

[0099] Thus, even in a wiring substrate for a touch panel, the quality of the thinned conductive pattern 37 can be stabilized.

[0100] Figure 6BFIG. 1 is a partial cross-sectional view of another plating pattern plate 10F according to Embodiment 1. Figure 6B In, with Figure 3 The same reference numerals are used to designate the same parts of the plating pattern plate 10 shown. Figures 2 to 5 The transfer portion 30 of the pattern plate 10 for plating shown in the figure is provided with a transfer portion 90. When the thickness of the transfer portion is 1 μm or more, the transfer portion can be formed by a plurality of stacked metal layers. Figure 6B The transfer portion 90 of the illustrated pattern plate 10F for plating includes: a metal layer 91; and a metal layer 92 stacked on the metal layer 91 and supporting the metal layer 91. The metal layer 91 has a transfer surface 33 and contains iron and nickel. The metal layer 92 includes one or more layers. In the pattern plate 10F for plating, the metal layer 92 includes two layers 921 and 922 stacked on each other. For example, when the thickness of the transfer portion 30 is 3 μm, the metal layer 91 is formed by an alloy of iron and nickel constituting the transfer surface 33 and has a thickness of 0.2 μm, and the metal layer 92 is formed by nickel and has a thickness of 2.8 μm.

[0101] (Implementation Method 2)

[0102] [2-1 Pattern plate for plating]

[0103] Figure 7 1 is a partial cross-sectional view showing a partial schematic structure of a pattern plate 10A for plating according to Embodiment 2. Specifically, Figure 7 is with Figure 3 In the following description, the same reference numerals are given to the same parts as those in the first embodiment, and the description thereof may be omitted.

[0104] like Figure 7 As shown, the plating pattern plate 10A includes a substrate 20, a base metal 31, and an inorganic film 50. The inorganic film 50 covers the side surface of the transfer portion 30 of the base metal 31, the upper surface of the pair of protrusions 32, and the upper surface (main surface 20a) of the substrate 20 so that the transfer surface 33 of the base metal 31 is exposed. The inorganic film 50 is formed of an inorganic material that does not have conductivity. As the inorganic film 50, for example, a DLC (Diamond Like Carbon) film, a sputtered film, etc. are exemplified.

[0105] [2-2 Method for manufacturing pattern plate for plating]

[0106] Next, a method for manufacturing the pattern plate 10A for plating according to the second embodiment will be described. Figure 8 It is an explanatory diagram showing the flow of a method for manufacturing the pattern plate 10A for plating according to the second embodiment.

[0107] like Figure 8As shown, in the photolithography process, a patterning material 401 containing a photosensitive substance is stacked on an electroforming substrate 400. After stacking, the patterning material 401 is subjected to photolithography so as to form an opening 402 corresponding to the shape of the transfer portion 30. Here, the electroforming substrate 400 is formed of a metal having a conductivity that allows electrolytic plating. Specifically, it is copper, stainless steel, nickel, etc. In addition, the patterning material 401 can be any material that can be patterned by photolithography or the like. Specifically, polyimide that can be used repeatedly is exemplified.

[0108] Next, in the electroplating step, electroplating is performed on the electroforming substrate 400 and the patterning material 401 to form the base metal 31 in the opening 402 .

[0109] Next, in the transfer process, the base metal 31 is transferred to the substrate 20. Specifically, the base metal 31 is transferred to the layer 22 so that the protruding portion 32 of the base metal 31 is on the same side with respect to the main surface 22a of the layer 22, that is, the main surface 20a of the substrate. Thus, a part of the base metal 31 is buried in the layer 22 of the substrate 20, and a part of the transferred portion 30 protrudes from the layer 22.

[0110] Next, in a positive resist coating step, a positive resist 59 is coated on the substrate 20 so as to cover the layer 22 and the base metal 31. The positive resist 59 is a positive photosensitive material, and preferably has a releasable property.

[0111] Next, in the irradiation step, light (e.g., ultraviolet light: UV light) is irradiated to the base metal 31 through the substrate 20. At this time, since the base metal 31 blocks the light, the solubility of the portion of the positive resist 59 that receives the light increases. In other words, the solubility of the region 591 of the positive resist 59 that does not overlap with the transfer portion 30 increases, and the portion 592 that overlaps with the transfer portion 30 does not react.

[0112] Next, in the development step, the region 591 of the positive resist 59 where the solubility is enhanced is removed by a developing solution. Thus, only a portion 592 of the positive resist 59 which has not reacted remains on the transfer section 30 .

[0113] Next, in the inorganic film forming step, the inorganic film 50 is formed on the upper surface of the substrate 20 , the side surface of the base metal 31 , and the exposed upper surface of the positive resist 59 .

[0114] Next, in the removal step, the positive resist 59 is removed by peeling or grinding to expose the transfer surface 33 of the transfer portion 30. Thus, the plating pattern plate 10A is manufactured. In the plating pattern plate 10A involved in the second embodiment, the same effects as those of the plating pattern plate 10 involved in the first embodiment can be obtained.

[0115] [2-3 Method for manufacturing wiring substrate 1]

[0116] Next, a method 1 for manufacturing a wiring board using the plating pattern plate 10A according to the second embodiment will be described. Fig. 9 It is an explanatory diagram showing the flow of method 1 for manufacturing wiring board 301 according to the second embodiment.

[0117] like Fig. 9 As shown, in the mold release treatment step, the transfer surface 33 of the transfer unit 30 is subjected to a mold release treatment, and a mold release layer 34 is formed on the transfer surface 33 .

[0118] Next, in the first electroless plating step, the pattern plate 10A for plating having the release layer 34 is immersed in a plating solution containing nickel, and electroless plating is performed to form a transfer pattern 36 on the release layer 34. However, electroless plating may be performed instead of electrolytic plating to form the transfer pattern 36 on the release layer 34, in which case the first electroless plating step is a plating step. Thus, the transfer pattern 36 is formed above the transfer surface 33 of the transfer unit 30. That is, the transfer pattern 36 is formed on the transfer surface 33 of the transfer unit 30 via the release layer 34.

[0119] Next, in the second electroless plating step, the plating pattern plate 10A having the transfer pattern 36 is immersed in a plating solution containing copper, for example, and electroless plating is performed to form the conductive pattern 37 on the transfer pattern 36 .

[0120] Next, in a first blackening treatment step, a blackening layer 38 is formed on the conductive pattern 37 .

[0121] Next, in the transfer process, the substrate 302 that becomes the wiring substrate 301 is pressed against the plating pattern plate 10A having the release layer 34, the transfer pattern 36, the conductive pattern 37, and the black layer 38. In the transfer process, when the substrate 302 is pressed against the plating pattern plate 10A, the black layer 38 and the conductive pattern 37 are buried in the transfer resin layer 352.

[0122] Next, in the demolding process, the substrate 302 is peeled off from the pattern plate 10A for plating. Thus, on the substrate 302, the blackened layer 38, the conductive pattern 37 and the transfer pattern 36 are integrated and fixed. During the demolding, the transfer pattern 36 is a thin film layer containing nickel, so the transfer pattern 36 alone has a high demolding property. Therefore, the transfer pattern 36 can be evenly peeled off from the transfer surface 33. Furthermore, the demolding layer 34 is formed on the pattern plate 10A for plating, so that the transfer pattern 36 can be more evenly peeled off from the transfer surface 33. In other words, it is possible to suppress the transfer pattern 36 from remaining locally on the transfer surface 33.

[0123] Next, in the second blackening process, a blackening layer 39 is formed on the transfer pattern 36. Through the above process, the wiring substrate 301 can be manufactured. In the wiring substrate manufacturing method 1 according to the second embodiment, the same effects as those of the wiring substrate manufacturing method according to the first embodiment can be obtained.

[0124] [2-4 Method for manufacturing wiring substrate 2]

[0125] Next, another method 2 for manufacturing a wiring board using the plating pattern plate 10A according to the second embodiment will be described. Fig.10 It is an explanatory diagram showing the flow of method 2 for manufacturing wiring substrate 301 according to the second embodiment.

[0126] like Fig.10 As shown, in the mold release treatment step, the transfer surface 33 of the transfer unit 30 is subjected to a mold release treatment, and a mold release layer 34 is formed on the transfer surface 33 .

[0127] Next, in the first electroless plating step, the pattern plate 10A for plating having the release layer 34 is immersed in a plating solution containing nickel, and electroless plating is performed to form a transfer pattern 36 on the release layer 34. However, electrolytic plating may be performed instead of electroless plating to form the transfer pattern 36 on the release layer 34, in which case the first electroless plating step is a plating step. Thus, a transfer pattern 36a is formed above the transfer surface 33 of the transfer unit 30. That is, the transfer pattern 36a is formed on the transfer surface 33 of the transfer unit 30 via the release layer 34.

[0128] Next, in the first blackening treatment step, the blackening layer 38 a is formed on the transfer pattern 36 a .

[0129] Next, in the transfer process, the substrate 302 that becomes the wiring substrate 301 is pressed against the plating pattern plate 10A having the release layer 34, the transfer pattern 36a, and the black layer 38a. In the transfer process, when the substrate 302 is pressed against the plating pattern plate 10A, the black layer 38a and the transfer pattern 36a are buried in the transfer resin layer 352.

[0130] Next, in the demolding process, the substrate 302 is peeled off from the pattern plate 10A for plating. Thus, on the substrate 302, the blackened layer 38a and the transfer pattern 36a are integrated. During the demolding, the transfer pattern 36a is a thin film layer containing nickel, so the transfer pattern 36a alone has a high demolding property. Therefore, the transfer pattern 36a can be evenly peeled off from the transfer surface 33. Furthermore, since the demolding layer 34 is formed on the pattern plate 10A for plating, the transfer pattern 36a can be more evenly peeled off from the transfer surface 33. In other words, it is possible to suppress the transfer pattern 36a from remaining locally on the transfer surface 33.

[0131] Next, in the second electroless plating step, the substrate 302 having the transfer pattern 36a is immersed in a plating solution containing copper, for example, and electroless plating is performed to form a conductive pattern 37a on the transfer pattern 36a. In this way, the second electroless plating step may be performed after the transfer step.

[0132] Next, in the second blackening process, a blackening layer 39a is formed on the conductive pattern 37a. The wiring substrate 301A can be manufactured through the above process. In the manufacturing method 2 of the wiring substrate involved in the second embodiment, the same effects as the manufacturing method of the wiring substrate involved in the first embodiment can also be obtained.

[0133] (Implementation 3)

[0134] [3-1 Pattern plate for plating]

[0135] Fig.11 1 is a partial cross-sectional view showing a partial schematic structure of a plating pattern plate 10B according to Embodiment 3. Specifically, Fig.11 is with Figure 3 In the following description, the same reference numerals are given to the same parts as those in the first embodiment, and the description thereof may be omitted.

[0136] like Fig.11 As shown, the plating pattern plate 10B includes a substrate 20, a base metal 31b, a conductive film 47b, and a resin portion 40b.

[0137] The base metal 31b is different from the first and second embodiments, and does not have a protrusion 32, and is a transfer portion 30b as a whole. There is a conductive film 47b between the base metal 31b and the layer 22 of the substrate 20. The conductive film 47b covers the lower surface and the entire side of the base metal 31b. In addition, the base metal 31b, i.e., the transfer surface 33b of the transfer portion 30b, is exposed. The conductive film 47b can be formed by a metal having a conductivity that can be electrolytically plated. For example, copper, stainless steel, nickel, etc. are exemplified as the metal forming the conductive film 47b. There may also be a close-fitting layer between the conductive film 47b and the layer 22 to make the conductive film 47b and the layer 22 close to each other.

[0138] The resin portion 40b is stacked on the layer 22 of the base material 20 so that the transfer surface 33b of the transfer portion 30b is exposed. The surface 40ba of the resin portion 40b is arranged at a position higher than the transfer surface 33b of the transfer portion 30b. In other words, the transfer surface 33b of the transfer portion 30b is recessed relative to the surface 40ba of the resin portion 40b.

[0139] [3-2 Method for manufacturing pattern plate for plating]

[0140] Next, a method for manufacturing the pattern plate 10B for plating according to the third embodiment will be described. Fig.12 It is an explanatory diagram showing the flow of a method for manufacturing a pattern plate 10B for plating according to the third embodiment.

[0141] like Fig.12 As shown, in the imprinting process, the recessed portion 221 in which the base metal 31 b is buried is formed by imprinting the layer 22 of the base material 20 .

[0142] Next, in the film forming step, the conductive film 47b is formed by sputtering or electroless plating on the layer 22 of the base material 20. Thus, the upper surface of the layer 22 and the inner surface of the recess 221 are covered with the conductive film 47b.

[0143] Next, in the electrolytic plating step, electrolytic plating is performed on the base material 20 having the conductive film 47 b , so that the metal layer 331 b serving as the base metal 31 b is stacked on the layer 22 .

[0144] Next, in a polishing step, the metal layer 331b and the conductive film 47b are polished to expose the layer 22 of the substrate 20. Thus, the metal layer 331b becomes the base metal 31b.

[0145] Next, in the resin portion forming step, a photocurable resin 410 b to be the resin portion 40 b is applied to the base material 20 so as to cover the layer 22 and the base metal 31 b .

[0146] Next, in the irradiation step, light (e.g., ultraviolet light: UV light) is irradiated to the base metal 31b through the substrate 20. As a result, a portion of the photocurable resin 410b is cured. In addition, the base metal 31b blocks the light. In the region 411b of the photocurable resin 410b that overlaps with the base metal 31b, the light that cures the photocurable resin 410b does not reach, so the region 411b becomes uncured.

[0147] Next, in the removal process, the photocurable resin 410b is cleaned by a solvent, thereby removing the uncured area 411b of the photocurable resin 410b. Thus, the remaining part of the photocurable resin 410b is the resin portion 40b. Thus, the plating pattern plate 10B can be manufactured. In the plating pattern plate 10B involved in the third embodiment, the same effect as the plating pattern plate 10 involved in the first embodiment can also be obtained.

[0148] The function of the transfer surface 33b to deposit the transfer pattern by electroless plating is sufficient when the thickness of the portion including the transfer surface 33b of the transfer portion 30b is 0.1 μm or more. Therefore, the thickness of the transfer portion 30b is preferably 0.1 μm or more.

[0149] (Implementation 4)

[0150] [4-1 Pattern plate for plating]

[0151] Fig.13 1 is a partial cross-sectional view showing a partial schematic structure of a pattern plate 10C for plating according to Embodiment 4. Specifically, Fig.13 is with Figure 3 In the following description, the same reference numerals are given to the same parts as those in the first embodiment, and the description thereof may be omitted.

[0152] like Fig.13 As shown, the plating pattern plate 10C includes a substrate 20c, a base metal 31c, a conductive film 47c, and a resin portion 40c.

[0153] The base material 20c is a plate material having light translucency, and is formed of, for example, glass, light translucency resin, etc. The resin portion 40c is stacked on one main surface 20ca of the base material 20c.

[0154] The base metal 31c is different from the first and second embodiments, and does not have the protrusion 32, and becomes the transfer part 30c as a whole. There is a conductive film 47c between the base metal 31c and the resin part 40c. The conductive film 47c covers the lower surface and the entire side of the base metal 31c. In addition, the transfer surface 33c of the base metal 31c is exposed. The conductive film 47c can be formed by a metal having a conductivity that can be electrolytically plated. For example, copper, stainless steel, nickel, etc. are exemplified as the metal forming the conductive film 47c. There may also be a close-fitting layer between the conductive film 47c and the resin part 40c to closely fit the conductive film 47c and the resin part 40c.

[0155] The resin portion 40c is laminated on the base material 20c so that the transfer surface 33c of the transfer portion 30c is exposed. A surface 40ca of the resin portion 40c is arranged to be flush with the transfer surface 33c of the transfer portion 30c.

[0156] [4-2 Method for manufacturing pattern plate for plating]

[0157] Next, a method for manufacturing the pattern plate 10C for plating according to the fourth embodiment will be described. Fig.14 It is an explanatory diagram showing the flow of a method for manufacturing a pattern plate 10C for plating according to the fourth embodiment.

[0158] like Fig.14 As shown, in the imprinting step, the concave portion 401c in which the base metal 31c is buried is imprinted in the resin portion 40c stacked on one main surface 20ca of the base material 20c.

[0159] Next, in the film forming step, the resin portion 40c is subjected to sputtering or electroless plating to form a conductive film 47c. Thus, the conductive film 47c is formed on the upper surface (surface 40ca) of the resin portion 40c and the inner surface 401ca of the recess 401c, so that the upper surface (surface 40ca) of the resin portion 40c and the inner surface 401ca of the recess 401c are covered with the conductive film 47c.

[0160] Next, in the electrolytic plating step, electrolytic plating is performed on the base material 20c having the conductive film 47c and the resin portion 40c, so that the metal layer 331c serving as the base metal 31c is stacked on the conductive film 47c.

[0161] Next, in the grinding process, the metal layer 331c and the conductive film 47c are ground so that the resin portion 40c is exposed. Thus, the metal layer 331c becomes the base metal 31c. Thus, the plating pattern plate 10C can be manufactured. In the plating pattern plate 10C involved in the fourth embodiment, the same effect as the plating pattern plate 10 involved in the first embodiment can also be obtained.

[0162] [other]

[0163] As mentioned above, although the manufacturing method of the pattern plate for plating and the wiring board which concern on this disclosure was demonstrated based on each embodiment mentioned above, this disclosure is not limited to each embodiment mentioned above.

[0164] In addition, the present disclosure also includes various modifications that can be conceived by those skilled in the art to the embodiments, and embodiments that are realized by arbitrarily combining the structural elements and functions in the embodiments and various modifications without departing from the gist of the present disclosure.

[0165] A plating pattern plate involved in one embodiment of the present invention is a plating pattern plate used to transfer a transfer pattern formed by plating to a substrate that becomes a wiring substrate, and comprises: a substrate; and a plurality of transfer parts arranged on the substrate, that is, a plurality of transfer parts for transferring the formed transfer pattern, and the plurality of transfer parts are arranged on the substrate so as to be electrically independent of each other.

[0166] Thus, on the substrate 20, the plurality of transfer parts 30 are configured to be electrically independent of each other, so even if a disconnection or short circuit occurs during the manufacture of the plating pattern plate 10, the position of the defect can be easily found by electrical inspection. On the other hand, when the plurality of transfer parts 30 are electrically connected to each other, the disconnection or short circuit of the transfer part cannot be evaluated, and it is difficult to detect defects of the plating pattern plate 10.

[0167] Furthermore, the pattern plate for plating has a light-transmitting base material and a plurality of transfer portions.

[0168] Therefore, if light is irradiated from the substrate side during the manufacture of the pattern plate for plating, the multiple transfer parts themselves block the light. For example, when a photoreactive resin is stacked on the multiple transfer part sides in the substrate so as to cover each transfer part, since each transfer part itself blocks the light, the photoreactive resin on each transfer part does not react. As a result, the unreacted photoreactive resin can be easily removed in the subsequent process. Therefore, the transfer surface of each transfer part that helps transfer can be reliably exposed. On each exposed transfer surface, a transfer pattern is formed by plating, and a conductive pattern is further formed thereon. If each transfer surface is reliably exposed, the transfer pattern and the conductive pattern can be formed with excellent precision, so even if the conductive pattern is thinned, the quality can be stabilized.

[0169] A plating pattern plate according to one embodiment of the present disclosure is a plating pattern plate for transferring a transfer pattern formed by plating to a substrate serving as a wiring substrate, and comprises: a light-transmitting substrate; and a transfer portion provided on the substrate, i.e., a transfer portion for transferring the formed transfer pattern.

[0170] Therefore, since the transfer part is provided on the light-transmitting substrate, if light is irradiated from the substrate side during the manufacture of the pattern plate for plating, the transfer part itself blocks the light. For example, when a photoreactive resin is stacked on the transfer part side in the substrate so as to cover the transfer part, the photoreactive resin on the transfer part does not react because the transfer part itself blocks the light. Thus, the unreacted photoreactive resin can be easily removed in the subsequent process. Therefore, the transfer surface of the transfer part that helps the transfer can be reliably exposed. On the exposed transfer surface, a transfer pattern is formed by plating, and a conductive pattern is further formed thereon. If the transfer surface is reliably exposed, the transfer pattern and the conductive pattern can be formed with excellent precision, so even if the conductive pattern is thinned, the quality can be stabilized.

[0171] Furthermore, the transfer portion is formed of an alloy of iron and nickel.

[0172] Thus, the peelability of the transfer pattern formed by plating on the transfer portion can be improved. Therefore, the transfer pattern can be uniformly peeled off from the transfer portion, thereby improving the quality of the transfer pattern. Thus, the quality of the thinned conductive pattern formed on the transfer pattern later can be stabilized.

[0173] Furthermore, the transfer portion is formed by electroplating.

[0174] This can improve the releasability of the transfer pattern formed on the transfer portion by plating.

[0175] Furthermore, the transfer portion is formed of an alloy having a total content of iron and nickel of 80% or more.

[0176] Thereby, the releasability with respect to the transfer pattern formed by plating on the transfer portion can be further improved.

[0177] Furthermore, the ratio of the content of iron in the transfer portion to the total content of iron and nickel is 20% or more.

[0178] Thereby, the releasability with respect to the transfer pattern formed by plating on the transfer portion can be further improved.

[0179] Furthermore, the thickness of the transfer portion is 0.1 μm or more.

[0180] Thereby, the releasability with respect to the transfer pattern formed by plating on the transfer portion can be further improved.

[0181] Furthermore, the pattern plate for plating includes a resin portion disposed in a region other than the transfer portion in a plan view, and the resin portion contains fluorine.

[0182] Thereby, when the transfer pattern is transferred, the releasability from the member overlapped with the resin portion can be improved. Thereby, the quality of the transferred pattern after the transfer can be maintained.

[0183] Furthermore, a method for manufacturing a wiring board according to one aspect of the present disclosure includes a plating step of forming a transfer pattern by plating on a transfer portion of the plating pattern plate and a transfer step of transferring the transfer pattern to a substrate.

[0184] Thus, as described above, the transfer portion of the plating pattern plate whose transfer surface is reliably exposed forms a transfer pattern by plating, so that the thinned transfer pattern can be formed with high precision. In addition, if a conductive pattern is formed on the transfer pattern, the precision of the conductive pattern can also be improved. Therefore, even if the conductive pattern is thinned, the quality can be stabilized.

[0185] Furthermore, the method for manufacturing a wiring board includes a mold release treatment step of performing a mold release treatment on the transfer portion before the plating step.

[0186] Thus, the transfer pattern can be reliably peeled off from the transfer portion by the release layer. Therefore, the transfer pattern can be uniformly peeled off from the transfer portion, and the quality of the transfer pattern can be further improved.

[0187] In addition, the wiring substrate is a wiring substrate for a touch panel.

[0188] This makes it possible to stabilize the quality of the thinned conductive pattern of the wiring substrate, which is a wiring substrate for a touch panel.

[0189] Industrial Applicability

[0190] The present disclosure is useful in manufacturing a wiring substrate used for a touch panel or the like, for example.

[0191] -Explanation of symbols-

[0192] 10, 10A, 10B, 10C, 10F Patterned plates for plating

[0193] 20, 20c Base material

[0194] 21st floor

[0195] 22nd floor

[0196] 30, 30b, 30c transfer unit

[0197] 31, 31b, 31c Base metal

[0198] 32 Protrusion

[0199] 33, 33b, 33c Transfer surface

[0200] 34 Release layer

[0201] 36, 36a Transfer pattern

[0202] 37, 37a Conductive pattern

[0203] 38, 38a, 39, 39a Blackening layer

[0204] 40, 40b, 40c Resin part

[0205] 47b, 47c Conductive film

[0206] 50 Inorganic membrane

[0207] 59 positive photopolymer

[0208] 221 concavity

[0209] 300 Touch Panel

[0210] 301, 301A Wiring substrate

[0211] 302 substrate

[0212] 310 Conductive pattern

[0213] 311 Electrode

[0214] 312 Lead-out wiring

[0215] 320 Conductive Pattern

[0216] 321 Electrode

[0217] 322 Lead-out wiring

[0218] 330 Flexible wiring substrate

[0219] 331b, 331c metal layer

[0220] 351 Substrate

[0221] 352 transfer resin layer

[0222] 400 Electroforming substrate

[0223] 401 Patterned Materials

[0224] 401c recess

[0225] 402 Opening

[0226] 410, 410b Photocurable resin

[0227] 411, 411b zones

[0228] 591 area.

Claims

1. A pattern plate for plating, used for transferring a transfer pattern formed by plating to a substrate, the pattern plate for plating comprising: substrate; and A plurality of transfer parts are arranged on the substrate, The plurality of transfer parts each have a transfer surface configured to form the transfer pattern by plating, The plurality of transfer portions are arranged on the substrate so as to be electrically independent from each other.

2. The pattern plate for plating according to claim 1, in, The substrate is light-transmissive.

3. The pattern plate for plating according to claim 1 or 2, in, The transfer surfaces of the plurality of transfer portions contain iron and nickel.

4. The pattern plate for plating according to claim 3, in, The plurality of transfer portions are formed by electroplating.

5. The pattern plate for plating according to claim 3, in, The plurality of transfer portions include an alloy having a total content of iron and nickel of 80% or more.

6. The pattern plate for plating according to claim 5, in, In the plurality of transfer portions, a ratio of the iron to a total of the iron and the nickel is 20% or more.

7. The pattern plate for plating according to claim 1 or 2, in, The plurality of transfer portions have a thickness of 0.1 μm or more.

8. The pattern plate for plating according to claim 1 or 2, in, The plurality of transfer parts respectively include: a first metal layer having the transfer surface and containing iron and nickel; and The second metal layer includes one or more layers supporting the first metal layer.

9. The pattern plate for plating according to claim 1 or 2, in, The plating pattern plate further comprises: a resin portion arranged in a region other than the plurality of transfer portions in a plan view; The resin portion contains fluorine.

10. A method for manufacturing a wiring substrate, comprising: A step of preparing a pattern plate for plating according to any one of claims 1 to 9; A step of forming the transfer pattern on the transfer surfaces of the plurality of transfer portions of the pattern plate for plating by plating; and The step of transferring the transfer pattern to the substrate.

11. The method for manufacturing a wiring substrate according to claim 10, in, The step of forming the transfer pattern includes the step of forming the transfer pattern on the transfer surfaces of the plurality of transfer portions of the plating pattern plate by electroless plating.

12. The method for manufacturing a wiring substrate according to claim 10 or 11, in, The method for manufacturing a wiring substrate further includes the step of forming a conductive pattern on the transfer pattern by electroless plating.

13. The method for manufacturing a wiring substrate according to claim 10 or 11, in, Before the step of forming the transfer pattern, the method further includes subjecting the transfer surfaces of the plurality of transfer portions of the plating pattern plate to a mold release treatment.

14. The method for manufacturing a wiring substrate according to claim 10 or 11, in, The wiring substrate is a wiring substrate for a touch panel.

15. A pattern plate for plating, used for transferring a transfer pattern formed by plating to a substrate, the pattern plate for plating comprising: A light-transmitting substrate; and The transfer unit is disposed on the substrate. The transfer portion has a transfer surface configured to form the transfer pattern by plating, The transfer unit has: A first metal layer having the transfer surface and containing iron and nickel; and The second metal layer includes one or more layers supporting the first metal layer.

16. The pattern plate for plating according to claim 15, in, The transfer surface of the transfer portion contains iron and nickel.

17. The pattern plate for plating according to claim 15 or 16, in, The transfer portion is formed by electroplating.

18. The pattern plate for plating according to claim 15 or 16, in, The transfer portion includes an alloy having a total content of iron and nickel of 80% or more.

19. The pattern plate for plating according to claim 18, in, In the transfer portion, a ratio of the iron to a total of the iron and the nickel is 20% or more.

20. The pattern plate for plating according to claim 15 or 16, in, The transfer portion has a thickness of 0.1 μm or more.

21. The pattern plate for plating according to claim 15 or 16, in, The plating pattern plate further comprises: a resin portion arranged in a region other than the transfer portion in a plan view; The resin portion contains fluorine.

22. A method for manufacturing a wiring substrate, comprising: A step of preparing a pattern plate for plating according to any one of claims 15 to 21; A step of forming the transfer pattern on the transfer surface of the transfer portion of the pattern plate for plating by plating; and The step of transferring the transfer pattern to the substrate.

23. The method for manufacturing a wiring substrate according to claim 22, in, The step of forming the transfer pattern includes the step of forming the transfer pattern on the transfer surface of the transfer portion of the plating pattern plate by electroless plating.

24. The method for manufacturing a wiring substrate according to claim 22 or 23, in, The method for manufacturing a wiring substrate further includes the step of forming a conductive pattern on the transfer pattern by electroless plating.

25. The method for manufacturing a wiring substrate according to claim 22 or 23, in, Before the step of forming the transfer pattern, the method further includes subjecting the transfer surface of the transfer portion of the plating pattern plate to a mold release treatment.

26. The method for manufacturing a wiring substrate according to claim 24, in, The wiring substrate is a wiring substrate for a touch panel.

27. The method for manufacturing a wiring substrate according to claim 23, in, The wiring substrate is a wiring substrate for a touch panel.

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