Agitator, processing device equipped with the agitator, and method for manufacturing the agitator

Abstract

The present invention provides an agitator, a processing device equipped with the agitator, and a method for manufacturing the agitator. The agitator can reduce the influence of electric field shielding and improve mechanical strength. The agitator (16) for stirring the processing liquid in the processing tank (1) by moving in the processing tank (1) has a plurality of stirring beams (45) forming a honeycomb structure (40). The honeycomb structure (40) has a plurality of hexagonal through holes (50) formed by the plurality of stirring beams (45).

Description

Technical Field

[0001] The present invention relates to a stirrer used when processing the surface of a workpiece such as a wafer, a substrate, a panel, a processing device equipped with the stirrer, and a method for manufacturing the stirrer. Background Art

[0002] Fig.18 1 is a schematic diagram showing a conventional plating device. Fig.18 As shown, a plating device as an example of a processing device for processing a workpiece W includes: a plating tank 201 that holds a plating solution inside, an anode 202 arranged in the plating tank 201, an anode holder 203 that holds the anode 202, and a workpiece holder 204. The workpiece holder 204 is configured to hold a workpiece W such as a wafer or a substrate in a detachable manner and immerse the workpiece W in the plating solution in the plating tank 201.

[0003] The plating device further includes a stirrer 205 for stirring the plating solution in the plating tank 201. The stirrer 205 is arranged near the surface of the workpiece W held by the workpiece holder 204. The stirrer 205 is arranged vertically and stirs the plating solution by reciprocating in parallel with the surface of the workpiece W, so that sufficient metal ions can be uniformly supplied to the surface of the workpiece W during the plating process of the workpiece W.

[0004] The anode 202 is connected to the positive electrode of the power source 207 via the anode holder 203, and the workpiece W is connected to the negative electrode of the power source 207 via the workpiece holder 204. When a voltage is applied between the anode 202 and the workpiece W, current flows through the workpiece W, and a metal film is formed on the surface of the workpiece W.

[0005] The thickness of the metal film formed on the workpiece W by plating is affected by the strength of the electric field formed between the anode 202 and the workpiece W. The stirrer 205 is disposed between the anode 202 and the workpiece W, and thus the stirrer 205 reciprocates in the horizontal direction while shielding the electric field.

[0006] Patent Document 1: Japanese Patent Application Publication No. 2000-129496

[0007] Fig.19 Observed from the direction indicated by arrow A Fig.18 The stirrer 205 is shown in FIG. The stirrer 205 includes a plurality of stirring rods 208 extending in the vertical direction. Fig.19 The stirring rods 208 are moved back and forth in the direction indicated by the arrows while stirring the plating solution. In order to reduce the influence of electric field shielding, it is preferred that the width of each stirring rod 208 is as small as possible.

[0008] However, if the width of the stirring rod 208 is reduced, the mechanical strength of the stirrer 205 is reduced, and the stirring speed of the stirrer 205 cannot be increased. On the other hand, if the width of the stirring rod 208 is increased, the mechanical strength of the stirrer 205 is improved, but the influence of electric field shielding becomes larger, resulting in that the thickness of the metal film formed on the workpiece W is uneven. Summary of the invention

[0009] Therefore, the present invention provides a stirrer capable of reducing the influence of electric field shielding and improving mechanical strength. In addition, the present invention provides a processing device including such a stirrer.

[0010] In one embodiment, a stirrer is provided for stirring a treatment liquid in a treatment tank by moving in the treatment tank, wherein the stirrer includes a plurality of stirring beams forming a honeycomb structure, and the honeycomb structure has a plurality of hexagonal through holes formed by the plurality of stirring beams.

[0011] In one embodiment, each of the plurality of stirring beams is inclined with respect to a moving direction of the stirrer or is perpendicular to the moving direction of the stirrer.

[0012] In one embodiment, the plurality of hexagonal through holes are a plurality of regular hexagonal through holes.

[0013] In one embodiment, a ratio of a width of the stirring beam to an arrangement pitch of the plurality of hexagonal through holes is less than 10%.

[0014] In one embodiment, the stirring beam has a width of 0.5 mm to 3.0 mm.

[0015] In one embodiment, the arrangement pitch of the plurality of hexagonal through holes is 5 mm to 23 mm.

[0016] In one embodiment, an arrangement direction of the plurality of hexagonal through holes is inclined with respect to a moving direction of the stirrer.

[0017] In one embodiment, the movement of the agitator is reciprocating motion. If the angle of the arrangement direction of the plurality of hexagonal through holes relative to the reciprocating motion direction of the agitator is set to θ, the length of one stroke of the reciprocating motion of the agitator is set to T, the height of the hexagonal through holes is set to H, and n is set to a natural number, then tanθ is equal to n(H / 2) / T.

[0018] In one embodiment, a processing device is provided for processing a workpiece, the processing device comprising: a processing tank for retaining a processing liquid therein; a workpiece retaining rack for retaining the workpiece; the agitator; and an agitator driving device for moving the agitator, the agitator being arranged in the processing tank.

[0019] In one embodiment, a method for manufacturing the above-mentioned agitator is provided, wherein the above-mentioned agitator is used to stir the processing liquid in the processing tank by moving in the processing tank, wherein the manufacturing method of the above-mentioned agitator includes the following steps: storing the three-dimensional design data of the above-mentioned agitator in a storage device of a three-dimensional printer, and manufacturing the above-mentioned agitator based on the above-mentioned three-dimensional design data by the above-mentioned three-dimensional printer.

[0020] The stirrer having a honeycomb structure can achieve both high mechanical strength and low electric field shielding rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram showing an embodiment of a plating apparatus as an example of a processing apparatus.

[0022] Figure 2 It is a top view showing a reciprocating mechanism for causing the stirrer to reciprocate in the plating tank.

[0023] Figure 3 (a) to Figure 3 (d) means Figure 2 Schematic diagram of the agitator drive device shown.

[0024] Figure 4 Observed from the direction indicated by arrow B Figure 1 Diagram of the agitator shown.

[0025] Figure 5 It is a diagram showing the agitator at the end of its stroke.

[0026] Figure 6 This is an enlarged view of the honeycomb structure.

[0027] Figure 7 The stirrer and Fig.19 The table shows specific structural examples and performance of conventional agitators.

[0028] Figure 8 This is a table showing the relationship between the arrangement pitch of hexagonal through holes and the stirring intensity of the stirrer.

[0029] Fig. 9 Schematic diagram showing the flow of liquid generated by a stirring beam having triangular through holes.

[0030] Fig.10 This is a schematic diagram showing the flow of liquid generated by a stirring beam having a quadrilateral through hole.

[0031] Fig.11 This is a schematic diagram showing the flow of liquid generated by a stirring beam having a quadrilateral through hole.

[0032] Fig.12 Schematic diagram showing the flow of liquid generated by a stirring beam having hexagonal through holes.

[0033] Fig.13 It is a schematic diagram showing an example of a vertically elongated hexagonal through hole and a horizontally elongated hexagonal through hole.

[0034] Fig.14 This is a schematic diagram for explaining the movement trajectory of the hexagonal through-holes when the stirrer is reciprocated.

[0035] Fig.15 It is a front view showing another embodiment of the agitator.

[0036] Fig.16 It is to make Fig.15 The schematic diagram shown is a diagram for explaining the movement trajectory of the hexagonal through holes when the stirrer reciprocates.

[0037] Fig.17 It is a schematic diagram showing a 3D printer.

[0038] Fig.18 FIG. 1 is a schematic diagram of a conventional plating apparatus.

[0039] Fig.19 Observed from the direction indicated by arrow A Fig.18 Diagram of the agitator shown.

[0040] Explanation of the reference numerals: 1… plating tank; 2… anode; 4… anode holder; 8… workpiece holder; 12… overflow tank; 14… adjustment plate; 16… stirrer; 17… connecting rod; 18… power supply; 19… crank disk; 20… plating liquid circulation line; 25… reciprocating motion mechanism; 26… shaft; 27… stirrer holder; 28… shaft support; 29… stirrer drive device; 30… flange; 36… circulation pump; 37… constant temperature unit; 38… filter; 40… honeycomb structure; 45… stirring beam; 47… upper frame; 48… lower frame; 49… side frame; 50… hexagonal through hole; 60… 3D printer; 60a… storage device. DETAILED DESCRIPTION

[0041] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0042] Figure 1 1 is a schematic diagram showing an embodiment of a plating device as an example of a processing device. Figure 1As shown, a plating device as an example of a processing device for processing a workpiece includes: a plating tank (processing tank) 1, which holds a plating solution (processing solution) inside; an anode 2, which is arranged in the plating tank 1; an anode holder 4, which holds the anode 2; and a workpiece holder (holding device) 8, which is arranged in the plating tank 1. The workpiece holder 8 is configured to hold a workpiece W such as a wafer, a substrate, a panel, etc. in a detachable manner, and immerse the workpiece W in the plating solution in the plating tank 1. The plating device of this embodiment is an electroplating device that plates the surface of the workpiece W with a metal by passing an electric current through the plating solution. The metal plated on the surface of the workpiece W is, for example, copper (Cu), nickel (Ni), tin (Sn), Sn-Ag alloy, cobalt (Co) or gold (Au).

[0043] The anode 2 and the workpiece W are arranged vertically and face each other in the plating solution. The anode 2 is connected to the positive electrode of the power supply 18 via the anode holder 4, and the workpiece W is connected to the negative electrode of the power supply 18 via the workpiece holder 8. When a voltage is applied between the anode 2 and the workpiece W, a current flows through the workpiece W, and a metal film is formed on the surface of the workpiece W.

[0044] The plating device includes an overflow tank 12 adjacent to the plating tank 1. The plating solution in the plating tank 1 flows into the overflow tank 12 over the side wall of the plating tank 1. One end of the plating solution circulation line 20 is connected to the bottom of the overflow tank 12, and the other end of the plating solution circulation line 20 is connected to the bottom of the plating tank 1. A circulation pump 36, a constant temperature unit 37, and a filter 38 are installed in the plating solution circulation line 20.

[0045] The plating solution flows over the side wall of the plating tank 1 into the overflow tank 12 and returns from the overflow tank 12 to the plating tank 1 through the plating solution circulation line 20. Thus, the plating solution circulates between the plating tank 1 and the overflow tank 12 through the plating solution circulation line 20.

[0046] The plating device also includes: a regulation plate 14 for regulating the potential distribution on the workpiece W, and a stirrer 16 for stirring the plating solution in the plating tank 1. The regulation plate 14 is arranged between the stirrer 16 and the anode 2, and has an opening 14a for limiting the electric field in the plating solution. The stirrer 16 is arranged near the surface of the workpiece W held by the workpiece holder 8 in the plating tank 1. The distance between the surface of the workpiece W and the stirrer 16 is in the range of 3mm to 15mm. The distance between the surface of the workpiece W and the stirrer 16 is preferably less than 10mm, and more preferably less than 8mm. The stirrer 16 is arranged vertically, and stirs the plating solution by reciprocating in parallel with the surface of the workpiece W, so that sufficient metal ions can be uniformly supplied to the surface of the workpiece W during the plating process of the workpiece W.

[0047] Figure 21 is a top view showing a reciprocating mechanism 25 for reciprocating the stirrer 16 in the plating tank 1. The reciprocating mechanism 25 includes a shaft 26 extending in the horizontal direction, a stirrer holding portion 27 fixed to the shaft 26, a shaft support portion 28 supporting the shaft 26 so as to be movable in the longitudinal direction thereof, and a stirrer driving device 29 for reciprocating the shaft 26 and the stirrer 16 as a whole. The stirrer 16 is held by the stirrer holding portion 27. The shaft 26 has flange portions 30 located on both sides of the stirrer holding portion 27. The flange portions 30 prevent the plating solution from reaching the shaft support portion 28 along the shaft 26.

[0048] Figure 3 (a) to Figure 3 (d) means Figure 2 Schematic diagram of a stirrer driving device 29 shown in FIG. The shaft 26 is connected to the crank disk 19 via the connecting rod 17. The connecting rod 17 is eccentrically mounted on the crank disk 19. The crank disk 19 is connected to a motor not shown in the figure. If the motor rotates the crank disk 19 in the direction indicated by the arrow, the rotation of the crank disk 19 is converted into reciprocating motion by the connecting rod 17, and the shaft 26 connected to the connecting rod 17 reciprocates. The stirrer 16 connected to the shaft 26 reciprocates parallel to the surface of the workpiece W through the stirrer driving device 29, and stirs the plating solution near the surface of the workpiece W.

[0049] In the present embodiment, the stirrer reciprocates in the horizontal direction. However, in one embodiment, the stirrer may reciprocate in a direction inclined with respect to the horizontal direction, or may reciprocate in the vertical direction.

[0050] The agitator 16 is configured to cross the electric field formed between the anode 2 and the workpiece W. Therefore, the electric field shielding based on the agitator 16 will affect the uniformity of the film thickness. In particular, when the reciprocating agitator 16 is at the end of the stroke, the speed of the agitator 16 is 0. Therefore, the residence time of the agitator 16 at the end of the stroke is particularly long compared to other places. Such movement of the agitator 16 may reduce the uniformity of the film thickness. Therefore, in this embodiment, as described below, the agitator 16 has a structure that can reduce the influence of electric field shielding and can improve the mechanical strength of the agitator 16.

[0051] Figure 4 Observed from the direction indicated by arrow B Figure 1FIG. 1 is a diagram of the stirrer 16 shown in FIG. The stirrer 16 includes: a plurality of stirring beams 45 forming a honeycomb structure 40, an upper frame 47 connected to the uppermost end of the honeycomb structure 40, a lower frame 48 connected to the lowermost end of the honeycomb structure 40, and side frames 49 connected to both sides of the honeycomb structure 40. The upper frame 47 is connected to the stirring beam 45 located at the top among the plurality of stirring beams 45, and the lower frame 48 is connected to the stirring beam 45 located at the bottom among the plurality of stirring beams 45. The side frame 49 extends from the upper frame 47 to the lower frame 48. The upper frame 47 is formed by Figure 2 The stirrer holding portion 27 shown is held. Either or both of the side frame 49 and the lower frame 48 may be omitted.

[0052] The honeycomb structure 40 has a plurality of hexagonal through holes 50 formed by the stirring beams 45. These hexagonal through holes 50 are arranged side by side in the horizontal direction without gaps. That is, the hexagonal through holes 50 are arranged parallel to the direction of reciprocating motion of the stirrer 16. The hexagonal through holes 50 have the same shape and the same size.

[0053] picture Figure 4 As shown by the arrow, the stirrer 16 reciprocates in the horizontal direction. The width D1 of the stirrer 16 is smaller than the width D2 of the workpiece W, and the stroke length of the reciprocating motion of the stirrer 16 is greater than the value obtained by dividing the difference between the width D2 of the workpiece W and the width D1 of the stirrer 16 by 2. If the stroke length is such that Figure 5 As shown, the stirrer 16 can reciprocate so as to cross the entire surface of the workpiece W, and can stir the plating liquid near the entire surface of the workpiece W. Figure 5 The stirrer 16 is shown at the end of the stroke. However, the present invention is not limited to this embodiment. In one embodiment, the width D1 of the stirrer 16 may be the same as the width D2 of the workpiece W or larger than the width D2 of the workpiece W.

[0054] Figure 6 It is an enlarged view of the honeycomb structure 40. The stirring beam 45 forming the hexagonal through hole 50 has a specified width F. A plurality of hexagonal through holes 50 are arranged without gaps at a specified arrangement pitch P. The hexagonal through hole 50 is a through hole 50 having a hexagonal cross-section. The hexagon is composed of six vertices and six sides connecting adjacent vertices. In the present embodiment, the stirring beam 45 forming a hexagonal through hole 50 constitutes six straight edges, but as long as the plating solution can be stirred and the mechanical strength of the stirrer 16 can be ensured, the stirring beam 45 can also be slightly undulating or curved. In the present embodiment, the six stirring beams 45 forming the hexagonal through hole 50 have the same width F, but in one embodiment, as long as the mechanical strength of the stirrer 16 can be ensured, one or more of the six stirring beams 45 can also have a width different from that of the other stirring beams 45.

[0055] Figure 6 As shown, all the stirring beams 45 forming the hexagonal through hole 50 are not parallel to the direction of the reciprocating motion of the agitator 16 (the horizontal direction in the present embodiment). In other words, the stirring beams 45 forming the hexagonal through hole 50 are respectively inclined relative to the direction of the reciprocating motion of the agitator 16 (the horizontal direction in the present embodiment), or are perpendicular to the direction of the reciprocating motion of the agitator 16. More specifically, all the stirring beams 45 forming the hexagonal through hole 50 are greater than 0 degrees and less than 180 degrees relative to the direction of the reciprocating motion of the agitator 16. Therefore, all the six sides of the hexagon as the cross-sectional shape of the through hole 50 are greater than 0 degrees and less than 180 degrees relative to the direction of the reciprocating motion of the agitator 16.

[0056] The stirrer 16 having the honeycomb structure 40 and Fig.19 Compared with the conventional stirrer 205 shown in FIG. 1 , the mechanical strength can be improved. As a result, the width F of the stirring beam 45 constituting the stirrer 16 can be reduced, thereby reducing the shielding effect of the electric field formed between the anode 2 and the workpiece W. In addition, the stirrer 16 can be made lighter as a whole, and the stress applied to the stirrer 16 can be reduced. Figure 2 The load of the agitator drive 29 is shown.

[0057] Figure 7 16 of this embodiment. Fig.19 A table showing a specific configuration example and performance of a conventional agitator 205 is shown. Figure 7 The items shown in the table are the width of the stirring beam, the spacing of the stirring beams, the density of the stirring beams (width / spacing×100), the mechanical strength, and the electric field shielding rate. The width of the stirring beam is the width of the stirring beam when viewed from the front of the stirrer (refer to Figure 6 The reference symbol F), the arrangement spacing of the stirring beams is Fig.19 In the stirrer 205 of the embodiment, the arrangement spacing of adjacent stirring rods 208 is , and in the stirrer 16 of the present embodiment, the arrangement spacing of adjacent stirring rods 208 is Figure 6 The arrangement pitch P of the hexagonal through holes 50 shown in FIG. 1 is an indicator of the durability of the stress generated in the agitator when the agitator reciprocates, and is a relative value obtained through simulation. The electric field shielding rate is the ratio (R2 / R1) of the film thickness reduction amount R2 to the film thickness reduction reference amount R1 when the agitator is shielded by the electric field due to the agitator during a certain plating time, and the film thickness reduction reference amount R1 is calculated using Fig.19The film thickness reduction amount R1 is the amount of reduction in the film thickness of the workpiece due to electric field shielding when the conventional agitator 205 is used for plating, and the film thickness reduction amount R2 is the amount of reduction in the film thickness of the workpiece due to electric field shielding when the agitator 16 of this embodiment is used for plating. Both the film thickness reduction reference amount R1 and the film thickness reduction amount R2 are obtained through plating simulation.

[0058] Figure 7 The existing agitator shown is Fig.19 A conventional agitator 205 is shown. Figure 7 The honeycomb stirrers No. 1, No. 2, and No. 3 shown are stirrers 16 of this embodiment. Figure 7 As shown in the table, the three types of agitators 16 of this embodiment have a ratio of Fig.19 The conventional agitator 205 shown has high mechanical strength and has a lower density (less than 10%) of the agitator beam 45. As a result, the three types of agitators 16 of the present embodiment are Fig.19 Compared with the conventional stirrer 205 shown, higher mechanical strength can be achieved and lower electric field shielding rate can be achieved.

[0059] In addition, the honeycomb structure 40 can improve the mechanical strength of the stirrer 16, so the stirrer 16 can be made of a resin such as PEEK (polyetheretherketone) or PEI (polyetherimide) instead of the existing titanium (Ti). In one embodiment, the stirrer 16 can also be made of titanium (Ti). In this case, the stirrer 16 can also be made lighter as a whole. According to this embodiment, the stirrer 16 can be made lighter as a whole, so the stress on the stirrer 16 can be reduced. Figure 2 The load of the agitator drive 29 is shown.

[0060] From the viewpoint of ensuring the mechanical strength of the agitator 16 and reducing the electric field shielding rate, the lower limit of the width F of the agitator beam 45 is 0.5 mm, and the upper limit of the width F of the agitator beam 45 is 3.0 mm. From the viewpoint of reducing the electric field shielding rate, the upper limit of the width F of the agitator beam 45 is preferably 1.5 mm. The arrangement pitch P of the hexagonal through holes 50 forming the honeycomb structure 40 is 5.0 mm to 23 mm. If the arrangement pitch P exceeds 23 mm, the agitator 16 is prone to vibrate during the reciprocating motion of the agitator 16.

[0061] Generally, if the arrangement pitch of the hexagonal through holes 50 becomes smaller, the number of hexagonal through holes 50 formed in the stirrer 16 increases. As a result, the stirrer 16 can stir the plating solution using more stirring beams 45. However, if the arrangement pitch P is too small, the flow of the plating solution generated in one hexagonal through hole 50 is prone to collide. Specifically, the flow of the plating solution generated by the parallel movement of the upper oblique side and the lower oblique side of the hexagonal through hole 50 collides with each other, offsetting the stirring effect.

[0062] Figure 8 TABLE 1 is a table showing the relationship between the arrangement pitch P of the hexagonal through holes 50 and the stirring intensity of the stirrer 16. The stirring intensity is represented by the relative value of the average flow rate of the plating solution stirred by the reciprocating motion of the stirrer 16, and is obtained by fluid simulation under the condition that the width of the stirring beam 45 is limited to a certain range. Figure 8 As shown in the table, the stirring intensity increases with the decrease in the arrangement spacing of the hexagonal through holes 50, but is the largest near the arrangement spacing of 8 mm. If the arrangement spacing of the hexagonal through holes 50 is smaller than 8 mm, the stirring intensity decreases. According to the results of the fluid simulation, the arrangement spacing P of the hexagonal through holes 50 is preferably 5.0 mm to 13.5 mm, and more preferably 8.0 mm to 13.5 mm. The density of the hexagonal through holes 50 (width / arrangement spacing×100) is greater than 2% and less than 10%. From the viewpoint of ensuring the mechanical strength of the agitator 16 and reducing the electric field shielding rate, the density of the hexagonal through holes 50 is preferably in the range of 6% to 8%.

[0063] The honeycomb structure 40 of the present embodiment has a plurality of hexagonal through holes 50 formed by a stirring beam 45. Compared with a circle or other polygons, a hexagon can improve the overall mechanical strength of the agitator 16, and is advantageous in terms of improving the stirring intensity. Under the condition of the same area, a circle has a shorter perimeter than a polygon and has a higher strength. However, if a plurality of circles are arranged on a plane, the contact area between the circles is extremely small, and as a result, the overall mechanical strength of the agitator cannot be improved. Triangles can be arranged without gaps on a plane, and the contact area between the triangles is large, so the mechanical strength of the agitator is improved. The same is true for quadrilaterals.

[0064] However, if Fig. 9 As shown in FIG. 1 , the triangle has sides extending obliquely relative to the direction of the reciprocating motion of the stirrer. Since these sides are connected to each other, the flows of the plating solution squeezed out by these sides collide with each other. As a result, the stirring effect is reduced. Fig.10 As shown in FIG. 1 , the quadrilateral has no inclined sides, but has sides extending in the direction of the reciprocating motion of the agitator, so that the sides always block the electric field. As a result, a film with a small local thickness is formed on the workpiece. Fig.11As shown, it is also possible to consider a configuration in which the sides of the quadrilateral are inclined relative to the direction of the reciprocating motion of the stirrer, but in this case, the same Fig. 9 The same problem as described. According to the results of fluid simulation, Fig.11 The quadrilateral honeycomb structure 40 having hexagonal through holes 50 can achieve only about half the stirring intensity (average flow velocity) as compared to the honeycomb structure 40 having hexagonal through holes 50 .

[0065] Hexagons do not cause the above problems. Fig.12 As shown, the plating solution is obliquely squeezed out by the side S1 and the side S3, but due to the flow of the plating solution squeezed out by the side S2 located between the side S1 and the side S3, the upper and lower flows do not collide. In addition, all the sides constituting the hexagon are not parallel to the direction of the reciprocating motion of the stirrer 16, so the electric field is not always blocked. For these reasons, the stirrer 16 having the honeycomb structure 40 with the hexagonal through holes 50 can achieve improved mechanical strength, reduced electric field shielding rate, and improved stirring intensity.

[0066] The hexagonal through hole 50 of this embodiment is a regular hexagonal through hole with six sides of the same length. Fig.13 As shown, the hexagonal through hole 50 may also be a vertically elongated hexagonal through hole 50 or a horizontally elongated hexagonal through hole 50 .

[0067] Fig.14 Schematic diagram for explaining the movement trajectory of the hexagonal through-holes 50 when the stirrer 16 is reciprocated. In this embodiment, the hexagonal through-holes 50 of the honeycomb structure 40 are arranged in parallel with the reciprocating direction of the stirrer 16. Fig.14 It is understood that the density of the stirring beam 45 varies depending on the location of the stirrer 16 , and as a result, both the electric field shielding effect and the stirring intensity become non-uniform.

[0068] Therefore, in one embodiment, it is also possible to Fig.15 As shown, the arrangement direction of the hexagonal through holes 50 is inclined relative to the direction of the reciprocating motion of the agitator 16. In addition to the arrangement direction of the hexagonal through holes 50, Fig.15 The structure of the stirrer 16 shown is similar to Figure 4 The stirrers 16 shown are identical. Fig.16 It is to make Fig.15 FIG. 1 is a schematic diagram for explaining the movement trajectory of the hexagonal through holes 50 when the stirrer 16 reciprocates. Fig.16 As shown, the density non-uniformity of the stirring beam 45 is improved. As a result, the non-uniformity of both the electric field shielding effect and the stirring intensity of the entire stirrer 16 is improved.

[0069] exist Fig.16 In the embodiment shown, the arrangement direction of the hexagonal through holes 50 is inclined at an angle θ relative to the reciprocating direction of the stirrer 16. If the length of one stroke of the reciprocating motion of the stirrer 16 is T, the height of the hexagonal through holes 50 is H, and n is a natural number, the following equation holds.

[0070] tanθ=n(H / 2) / T (1)

[0071] If the arrangement direction of the hexagonal through holes 50 is inclined at such an angle θ, the density non-uniformity of the stirring beam 45 is improved during one reciprocating motion of the stirrer 16. As a result, the non-uniformity of the stirring intensity of the stirrer 16 as a whole is improved. However, if the angle θ is increased, the longitudinally extending sides of the hexagon (see Fig.12 S2) becomes tilted, so it may produce a reference Fig. 9 Therefore, it is preferable that the angle θ is as small as possible. According to fluid simulation, it is confirmed that the stirring performance of the stirrer 16 in the case of n=1 in the above formula (1) is not substantially reduced compared with the stirrer 16 in which the arrangement direction of the hexagonal through holes 50 is horizontal. Therefore, in the above formula (1), n ​​is preferably 1.

[0072] Reference Figure 4 and Fig.15 The agitator 16 of the illustrated embodiment can be manufactured by a three-dimensional printer (also called a 3D printer). Fig.17 3D printer 60 is a schematic diagram showing a 3D printer. 3D printer 60 includes a storage device 60a such as a hard disk drive or a solid state drive. 3D design data of agitator 16 is stored in the storage device 60a. 3D printer 60 produces agitator 16 based on the 3D data in the storage device 60a. As such a 3D printer 60, a known 3D printer can be used.

[0073] In one embodiment, reference Figure 4 and Fig.15 The agitator 16 of the described embodiment can also be manufactured by cutting.

[0074] Figure 1 The embodiment shown is a plating device that immerses the workpiece W in a vertical position in the plating solution in the plating tank 1, but the type of the plating device is not limited to Figure 1 In one embodiment, the plating apparatus may be of a type (so-called cup type) in which the workpiece is immersed in the plating solution in a plating tank in a horizontal or inclined posture.

[0075] In addition, the stirrer 16 of each embodiment described above is not limited to the plating device, and can also be applied to other wet processing devices using a processing liquid. For example, in a processing device having a processing tank for holding a processing liquid (such as a cleaning liquid) used in a pre-processing or post-processing of plating, the stirrer 16 of each embodiment described above can also be applied. The stirrer 16 described above can stir various processing liquids such as a cleaning liquid and a plating liquid to achieve uniform processing of a workpiece immersed in the processing liquid.

[0076] Furthermore, the movement of the agitator 16 is not limited to reciprocating motion. For example, the agitator drive device for moving the agitator 16 may be configured to rotate the agitator 16, or to move the agitator 16 along a predetermined track (e.g., a circular track), or to make the agitator 16 perform planetary motion. In the specific structure of the agitator drive device for making the agitator 16 perform such motion, known techniques can be used.

[0077] The above-mentioned embodiments are recorded for the purpose of enabling a person with common knowledge in the technical field to which the present invention belongs to implement the present invention. Various modifications of the above-mentioned embodiments are self-evident to those skilled in the art, and the technical concept of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, and can be interpreted as the widest scope of the technical concept defined by the claims.

Claims

1. A stirrer for stirring a plating solution in a plating tank by reciprocating in the plating tank, wherein: The stirrer has: a plurality of stirring beams forming a honeycomb configuration; and an upper frame connected to the uppermost end of the honeycomb structure, The honeycomb structure has a plurality of hexagonal through holes formed by the plurality of stirring beams, An arrangement direction of the plurality of hexagonal through holes is inclined relative to the upper frame and is inclined relative to a reciprocating motion direction of the agitator.

2. The agitator according to claim 1, wherein The plurality of stirring beams are respectively inclined relative to the reciprocating motion direction of the stirrer or are perpendicular to the reciprocating motion direction of the stirrer.

3. The agitator according to claim 1 or 2, wherein: The plurality of hexagonal through holes are a plurality of regular hexagonal through holes.

4. The agitator according to claim 1 or 2, wherein: The ratio of the width of the stirring beam to the arrangement spacing of the plurality of hexagonal through holes is less than 10%.

5. The agitator according to claim 1 or 2, wherein: The width of the stirring beam is 0.5 mm to 3.0 mm.

6. The agitator according to claim 1 or 2, wherein: The arrangement interval of the plurality of hexagonal through holes is 5 mm to 23 mm.

7. The agitator according to claim 1 or 2, wherein: An arrangement direction of the plurality of hexagonal through holes is inclined relative to a reciprocating motion direction of the agitator.

8. The agitator according to claim 7, wherein: If the angle of the arrangement direction of the multiple hexagonal through holes relative to the reciprocating motion direction of the agitator is set to θ, the length of one stroke of the reciprocating motion of the agitator is set to T, the height of the hexagonal through holes is set to H, and n is set to a natural number, then tanθ is equal to n(H / 2) / T.

9. A plating device for plating a workpiece, the plating device comprising: a plating tank for holding a plating solution therein; a workpiece holder that holds the workpiece; The stirrer according to any one of claims 1 to 8; and a stirrer drive device, which causes the stirrer to reciprocate, The stirrer is arranged in the plating tank.

10. A method for manufacturing a stirrer for stirring a plating solution in a plating tank by reciprocating in the plating tank, The manufacturing method of the stirrer comprises the following steps: storing three-dimensional design data of the stirrer in a storage device of a three-dimensional printer, and manufacturing the stirrer based on the three-dimensional design data by the three-dimensional printer; The stirrer is the stirrer according to any one of claims 1 to 8.

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