Semiconductor refrigeration device and system for refrigerated and heat-insulated carriages

Abstract

The invention discloses a semiconductor refrigeration device for a refrigerated and heat-insulated carriage and its system, comprising a heat dissipation module, a carriage wall module and a refrigeration module, wherein the heat dissipation module comprises a radiator, a water pump, a water pipe and a water-cooling plate to ensure the control of the hot end temperature, the circulation of cooling water and the heat dissipation; the carriage wall module comprises a carriage wall body, an outer skin, an inner skin and pre-buried iron, and provides a framework for the entire device to ensure convenient installation; the refrigeration module comprises a semiconductor refrigeration sheet and a cooling fin to play a cooling role; the radiator is located outside the carriage, the inner and outer skins are located on the carriage wall, the cooling fin is located inside the carriage, and the other parts are located inside the carriage wall. The water pump and the water-cooling plate are fixed to the carriage wall by fasteners, and the two ends of the semiconductor refrigeration sheet are directly in contact with the water-cooling plate and the cooling fin respectively to increase the heat exchange efficiency, and the semiconductor refrigeration sheet is energized to cool the carriage via the cooling fin, and the cooling capacity is adjusted by changing the current size and direction of the semiconductor refrigeration sheet to achieve the temperature control requirement.

Description

Technical Field

[0001] The present invention relates to the technical field of body refrigeration equipment, and in particular to a semiconductor refrigeration device for a refrigerated and heat-insulating carriage and a system thereof. Background Art

[0002] The consumption of frozen and refrigerated foods in my country maintains a steady and rapid growth. The competition in the industry is intensifying. The future refrigerated trucks will develop in the direction of cleanliness and intelligence. The environmental protection policy is promoting the development of new energy vehicles. However, most of the logistics refrigerated trucks on the market currently use traditional mechanical refrigeration methods, and new energy pure electric logistics vehicles have not yet adopted semiconductor refrigeration systems to refrigerate goods.

[0003] Traditional refrigeration devices have complex structures, large volumes, and many installation restrictions. When impact or vibration occurs, the refrigeration device is easily damaged and the refrigerant is easily leaked, which increases the maintenance cost and reduces the service life of the refrigeration device. Traditional mechanical refrigeration devices contain materials that pollute the environment, such as Freon and refrigerant. Semiconductor refrigeration is small in size, noiseless, pollution-free, and simple in structure. By changing the direction of DC input, it can effectively adjust the operating temperature and improve the stability and reliability of the refrigeration device. Summary of the invention

[0004] To this end, the present invention provides a semiconductor refrigeration device and system for a refrigerated and heat-insulated compartment to solve the current shortage of semiconductor refrigeration and refrigeration vehicles in short-distance transportation.

[0005] In order to achieve the above object, the technical solution of the present invention is as follows:

[0006] In the first aspect, the present invention provides a semiconductor refrigeration device for a refrigerated and heat-insulated compartment, characterized in that the device is divided into three parts: a heat dissipation module, a compartment wall and a refrigeration module. The heat dissipation module includes a radiator, a hot-end radiator air inlet water pump, a water pipe and a water-cooled plate. The radiator and the hot-end radiator air inlet are placed outside the compartment. The radiator is connected to the water pump and the water-cooled plate through a water pipe to produce a water-cooled circulation effect. The water pump and the water-cooled plate are fixed to the compartment wall through fasteners; the compartment wall module includes a compartment wall body, an outer skin, an inner skin and embedded iron, providing an overall framework of the device to ensure convenient installation; the refrigeration module includes a semiconductor refrigeration sheet and a heat dissipation fin, and the two ends of the semiconductor refrigeration sheet are directly in contact with the water-cooled plate and the heat dissipation fin respectively to increase heat dissipation and refrigeration efficiency.

[0007] As a preferred solution, the semiconductor refrigeration refrigeration plate in the carriage structure selects TEC1-12706T125 with a maximum operating voltage of 15.2V, a maximum current of 6A, a rated voltage of 12V, a rated current of 4A, and a power consumption of 48W.

[0008] Furthermore, polystyrene foam is filled in the compartment wall to achieve heat insulation performance.

[0009] Furthermore, the coolant in the water cooling plate, water pump, water pipe and radiator is selected to be ethylene glycol-water solution.

[0010] Furthermore, after the direction of the direct current of the semiconductor refrigeration plate is reversed, the original heat release end will be transformed into the cooling end, and the original cooling end will be transformed into the heat release end. The present invention transmits the temperature of each partition in the vehicle compartment to the electronic control unit through the temperature sensor, and adjusts the current direction or closes (opens) the semiconductor refrigeration plate through the program pre-set in the electronic control unit to achieve the effect of adjusting the temperature.

[0011] The semiconductor refrigeration device for a refrigerated and heat-insulated compartment provided by the present invention comprises a heat dissipation module, a compartment wall and a refrigeration module. The radiator in the heat dissipation module is in direct contact with the air inlet of the hot end radiator and is connected to a water pump and a water cooling plate through a water pipe to form a water-cooled heat dissipation circuit. The water cooling plate is in direct contact with one end of the semiconductor, and the other end of the semiconductor is in direct contact with the cooling fins.

[0012] The semiconductor refrigeration sheet is connected to the electronic control unit through a control circuit that can change the direction of current; the electronic control unit includes a cooling positive switch, a cooling negative switch, a heating negative switch and a heating positive switch; the control circuit includes a cooling mode and a heating mode: in the cooling mode: the electronic control unit turns on the cooling positive switch and the cooling negative switch, and turns off the heating negative switch and the heating positive switch, at which time the cold end of the semiconductor refrigeration sheet contacts the cooling fins, and the hot end contacts the water cooling plate, so as to cool the compartment;

[0013] The heating mode: control the cold positive switch and the cooling negative switch to be closed, and the heating negative switch and the heating positive switch to be opened. At this time, the current direction at both ends of the semiconductor refrigeration plate changes, the hot end contacts the cooling fins, and the cold end contacts the water cooling plate, and the car is heated and warmed up to ensure that the temperature inside the car is always within the set range.

[0014] In a second aspect, the present invention provides a semiconductor refrigeration system for a refrigerated and insulated compartment, characterized in that: the entire compartment wall contains multiple groups of refrigerated and insulated compartment semiconductor refrigeration devices as described above to enhance the refrigeration effect; the refrigeration module in each group of refrigerated and insulated compartment semiconductor refrigeration devices contains four semiconductor refrigeration plates connected in series, wherein the cold end of the semiconductor refrigeration plate cools the interior of the compartment through cooling fins, and the hot end of the semiconductor refrigeration plate dissipates heat by direct contact with a water cooling plate.

[0015] The advantages and beneficial effects of the present invention are as follows:

[0016] The present invention integrates semiconductor cooling chips into an integral type, connects four semiconductor cooling chips in series to concentrate the cooling capacity, and uses multiple sets of devices to quickly cool the air near the refrigerator. The opening positions are concentrated and will not affect the thermal bridge. The semiconductor cooling chip has the advantages of no noise, no pollution, low failure rate, high stability and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the internal structure of the semiconductor refrigeration device for a refrigerated and heat-insulating compartment of the present invention.

[0018] Figure 2 It is a schematic diagram of the appearance of the semiconductor refrigeration device for a refrigerated and heat-insulating compartment of the present invention.

[0019] Figure 3 It is a side view of the internal structure of the semiconductor refrigeration device for a refrigerated and heat-insulating compartment of the present invention.

[0020] Figure 4 This is a control block diagram of the semiconductor refrigeration device for a refrigerated and heat-insulated compartment of the present invention.

[0021] Figure 5 It is the schematic diagram of the control circuit in the control block diagram.

[0022] In the figure: 1, radiator, 2, hot end radiator air inlet, 3, outer skin, 4, embedded iron, 5, carriage wall, 6, water pump, 7, water pipe, 8, water cooling plate, 9, semiconductor cooling sheet, 10, inner skin, 11, cooling fin;

[0023] 201, cooling positive switch, 202, cooling negative switch, 203, heating negative switch, 204, heating positive switch, 205, battery, 206, semiconductor refrigeration material. DETAILED DESCRIPTION

[0024] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0025] like Figure 1-3As shown, the semiconductor refrigeration device for refrigerated and heat-insulated carriages of the present invention changes the traditional mechanical refrigeration method and adopts semiconductor refrigeration sheets 9 for refrigeration. The present invention is mainly divided into three parts: a heat dissipation module, a carriage wall module and a refrigeration module. The heat dissipation module includes a radiator 1, a hot end radiator air inlet 2, a water pump 6, a water pipe 7 and a water cooling plate 8. The radiator 1 and the hot end radiator air inlet 2 are placed outside the carriage. The hot end radiator air inlet 2 improves the heat dissipation efficiency of the radiator 1 by air cooling, and at the same time prevents the carriage wall 5 from directly contacting the radiator 1 to avoid the carriage When the wall 5 is overheated, the radiator 1 is connected to the water pump 6 and the water cooling plate 8 through the water pipe 7 to produce a water cooling circulation effect. The water pump 6 and the water cooling plate 8 are fixed to the carriage wall 5 by fasteners; the carriage wall module includes the carriage wall 4, the outer skin 3, the inner skin 10 and the embedded iron 4. The carriage wall 5 provides the framework of the entire device. At the same time, the embedded iron is arranged in the carriage wall 5 to facilitate the installation of the entire device; the refrigeration module includes a semiconductor refrigeration sheet 9 and a cooling fin 11. The two ends of the semiconductor refrigeration sheet 9 are directly in contact with the water cooling plate 8 and the cooling fin 11 respectively to increase the heat dissipation and cooling efficiency.

[0026] Ethylene glycol-water solution is used as coolant in the radiator 1, water pipe 7, water pump 6 and water cooling plate 8, polystyrene foam is selected in the compartment wall 5 to achieve heat insulation performance, and TEC1-12706T125 is selected as the semiconductor refrigeration refrigeration sheet.

[0027] like Figure 4-5 As shown, the semiconductor refrigeration sheet 9 is connected to a control circuit that can change the direction of its current. The temperature sensor transmits the temperature signal in the car to the electronic control unit. According to the program set in advance by the electronic control unit, the current direction at both ends of the semiconductor refrigeration material 9 and the switch can be automatically adjusted to achieve the effect of controlling the temperature.

[0028] The control circuit mainly includes two modes: cooling and heating. In cooling mode: the electronic control unit turns on the cooling positive switch 201 and the cooling negative switch 202, and turns off the heating negative switch 203 and the heating positive switch 204. At this time, the cold end of the semiconductor refrigeration plate 9 contacts the cooling fin 11, and the hot end contacts the water-cooled plate 8, so as to cool the car. In heating mode: the cold positive switch 201 and the cooling negative switch 202 are controlled to be closed, and the heating negative switch 203 and the heating positive switch 204 are turned on. At this time, the current direction at both ends of the semiconductor refrigeration plate 9 changes, the hot end contacts the cooling fin 11, and the cold end contacts the water-cooled plate 8, so as to heat and warm up the car to ensure that the temperature inside the car is always within the set range.

[0029] The semiconductor refrigeration device for refrigerated and insulated compartments provided by the present invention is described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements can be made to the present invention without departing from the principles of the present invention, and these improvements also fall within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor refrigeration device for a refrigerated and heat-insulating compartment, characterized in that: It includes three parts: heat dissipation module, compartment wall and refrigeration module; The heat dissipation module comprises a radiator (1), a radiator hot end air inlet (2), a water pump (6), a water pipe (7) and a water cooling plate (8); the radiator (1) and the radiator hot end air inlet (2) are placed outside the vehicle compartment, and the radiator (1) is connected to the water pump (6) and the water cooling plate (8) via the water pipe (7) to produce a water cooling circulation effect; the water pump (6) and the water cooling plate (8) are fixed to the vehicle compartment wall via a fastener; The water-cooling plate (8), water pump (6), water pipe (7) and radiator (1) all contain ethylene glycol-water solution for accelerating heat transfer; the radiator (1) is in direct contact with the air inlet (2) at the hot end of the radiator and is connected to the water pump (6) and the water-cooling plate (8) via the water pipe (7) to form a water-cooling heat dissipation circuit; The water cooling plate (8) and the cooling fins (11) are in direct contact with the semiconductor cooling plate (9), and copper is selected as the contact material for the contact surface between the water cooling plate (8) and the semiconductor cooling plate (9); The carriage wall is composed of a carriage wall body (5), an outer skin (3), an inner skin (10) and embedded iron (4), providing an overall framework for the semiconductor refrigeration device; Eight first angle aluminum pieces are provided in the compartment wall for fixing the heat dissipation module and the refrigeration module; two second angle aluminum pieces are provided at each end of the radiator (1) to fix the radiator (1) to the outer skin (3) by bolts, and the four second angle aluminum pieces together constitute the radiator hot end air inlet (2), and three steel plates are welded in the radiator hot end air inlet (2) to increase the structural strength; The refrigeration module comprises a plurality of semiconductor refrigeration sheets (9) and cooling fins (11). When the semiconductor refrigeration sheets (9) are powered on, the cold end absorbs heat through the cooling fins (11) to cool the interior of the vehicle compartment. The vehicle compartment wall is filled with selected polystyrene foam to achieve heat insulation performance. The embedded iron (4) is installed on the outer skin (3) of the vehicle compartment wall to facilitate the installation of the semiconductor refrigeration device. The semiconductor refrigeration plate (9) adopts an automatic control working mode according to the signal fed back to the electronic control unit by the temperature sensor; The semiconductor cooling sheet (9) is connected to an electric control unit via a control circuit capable of changing the direction of current; the electric control unit comprises a cooling positive switch (201), a cooling negative switch (202), a heating negative switch (203) and a heating positive switch (204); the control circuit comprises a cooling mode and a heating mode: In the cooling mode, the electronic control unit turns on the cooling positive switch (201) and the cooling negative switch (202), and turns off the heating negative switch (203) and the heating positive switch (204). At this time, the cold end of the semiconductor cooling plate (9) contacts the cooling fin (11), and the hot end contacts the water cooling plate (8), thereby cooling the interior of the vehicle; The heating mode: the cooling positive switch (201) and the cooling negative switch (202) are controlled to be closed, and the heating negative switch (203) and the heating positive switch (204) are turned on. At this time, the current direction at both ends of the semiconductor refrigeration plate (9) changes, the hot end contacts the cooling fins (11), and the cold end contacts the water cooling plate (8), and the vehicle compartment is heated and warmed up to ensure that the temperature inside the vehicle is always within the set range.

2. A semiconductor refrigeration system for a refrigerated and heat-insulated carriage, characterized in that: The entire compartment wall includes multiple groups of refrigerated compartment semiconductor refrigeration devices as described in claim 1 to enhance the refrigeration effect; the refrigeration module in each group of refrigerated compartment semiconductor refrigeration devices includes four semiconductor refrigeration plates (9) connected in series, wherein the cold end of the semiconductor refrigeration plate (9) cools the interior of the compartment through cooling fins (11), and the hot end of the semiconductor refrigeration plate (9) dissipates heat through direct contact with the water cooling plate (8).

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