An IPM module with integrated bootstrap circuit

Abstract

The invention discloses an IPM module with an integrated bootstrap circuit, comprising an IPM module body, wherein a control end power pin base island of the IPM module body is electrically connected with a bootstrap circuit through a bonding wire, wherein the bootstrap circuit mainly comprises a plurality of U / V / W phase P-side driving power base islands arranged in series and a bootstrap diode and a current limiting resistor arranged on the U / V / W phase P-side driving power base island, wherein the U / V / W phase P-side driving power base island is provided with an outwardly extending bonding wire, and the bootstrap diodes and the current limiting resistors on two adjacent U / V / W phase P-side driving power base islands are electrically connected through the bonding wire; an external bootstrap capacitor is connected to the U / V / W phase P-side driving power base island through a pin, the IPM module charges the bootstrap capacitor through the bootstrap diode and the current limiting resistor, and the bootstrap capacitor supplies power to the IPM module through the U / V / W phase P-side driving power base island carrying the bootstrap diode and the current limiting resistor.

Description

Technical Field

[0001] The invention relates to the field of intelligent power modules, and in particular to an IPM module with an integrated bootstrap circuit. Background Art

[0002] Intelligent Power Module, or IPM (Intelligent Power Module), not only integrates the power switch device IGBT and the drive circuit, but also has fault detection and protection functions such as undervoltage, overcurrent and overheating, and can output error signals to the CPU, so that in the event of a load accident or improper use of the system, the IPM itself can be protected from damage. IPM is winning an increasingly large market with its high reliability, low loss and low development cost, and is particularly suitable for frequency converters and various inverter power supplies that drive motors. It is an ideal power electronic device for variable frequency speed regulation, metallurgical machinery, electric traction, servo drive, and variable frequency home appliances.

[0003] The drive of a three-phase inverter circuit usually requires four mutually isolated control power supplies (three for P-side drive and one for N-side drive). At present, most IPM modules use a bootstrap circuit to reduce the isolated control power supply from four to one (N-side control power supply). The bootstrap circuit consists of a bootstrap diode, a bootstrap capacitor and a current limiting resistor. Most early IPM modules did not integrate a bootstrap circuit. When needed, a bootstrap diode, a bootstrap capacitor and a current limiting resistor were soldered on the circuit board. This simple module structure increases the difficulty and cost of use. Later IPM modules have integrated the bootstrap diode and the current limiting resistor inside the IC, but the current limiting resistor is difficult to quickly replace and adjust, and its adaptability is limited. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide an IPM module with an integrated bootstrap circuit that has a reasonable structure and a simple and reliable method for integrating a bootstrap diode and a current limiting resistor into an IPM module in view of the above-mentioned defects of the prior art. The bootstrap diode and the current limiting resistor can be flexibly matched according to the application scenario.

[0005] The objective of the present invention is to achieve the following technical solution: an IPM module with an integrated bootstrap circuit, comprising an IPM module body, a control end power pin base island of the IPM module body being electrically connected to a bootstrap circuit through a bonding wire, the bootstrap circuit mainly comprising a plurality of U / V / W phase P-side drive power base islands arranged in series and a bootstrap diode and a current limiting resistor arranged on the U / V / W phase P-side drive power base island, the U / V / W phase P-side drive power base island being provided with an outwardly extending bonding wire, and the bootstrap diodes and the current limiting resistors on two adjacent U / V / W phase P-side drive power base islands being electrically connected through a bonding wire; an external bootstrap capacitor is connected to the U / V / W phase P-side drive power base island through a pin, the IPM module charges the bootstrap capacitor through the bootstrap diode and the current limiting resistor, and the bootstrap capacitor supplies power to the drive chip drive pole of the IPM module through the U / V / W phase P-side drive power base island carrying the bootstrap diode and the current limiting resistor.

[0006] Furthermore, the bootstrap diode and the current-limiting resistor are formed by stacking a chip resistor and a diode in a bare crystal form, and the stacking area of ​​the chip resistor and the diode remains consistent during the stacking process or the stacking area gradually decreases from bottom to top.

[0007] Furthermore, the number of the U / V / W phase P-side driving power supply base islands is 3, and the chip resistors and diodes on the U / V / W phase P-side driving power supply base islands are fixedly connected to the corresponding U / V / W phase P-side driving power supply base islands by welding.

[0008] The beneficial technical effect of the present invention is that the present invention integrates the bootstrap diode and the current limiting resistor into the IPM module by stacking chips, and the structure is simple and reasonable, and easy to implement. The bootstrap diode and the current limiting resistor can be flexibly matched with the application occasions without special processing. The entire bootstrap circuit can be electrically interconnected through mature processes, and the overall reliability is strong. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the internal connection of the present invention;

[0010] Figure 2 It is a schematic diagram of the internal connection plane of the present invention;

[0011] Figure 3 This is a diagram of a new chip stacking structure used in this invention. DETAILED DESCRIPTION

[0012] In order to enable those skilled in the art to more clearly understand the objectives, technical solutions and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0013] In the description of the present invention, it is necessary to understand that the orientation or position relationship indicated by the terms such as "up", "down", "left", "right", "inside", "outside", "horizontal" and "vertical" is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention, rather than indicating or implying that the device or original referred to must have a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0014] like Figure 1-3 As shown, an IPM module with an integrated bootstrap circuit described in the present invention includes an IPM module body, a control end power pin base island 1 of the IPM module body is electrically connected to a bootstrap circuit through a bonding wire 2, the bootstrap circuit mainly includes a plurality of U / V / W phase P-side drive power base islands 3 arranged in series and a bootstrap diode and a current limiting resistor 4 arranged on the U / V / W phase P-side drive power base island 3, the U / V / W phase P-side drive power base island 3 is provided with a bonding wire 2 extending outward, and the bootstrap diodes and the current limiting resistors 4 on two adjacent U / V / W phase P-side drive power base islands 3 are electrically connected through the bonding wire 2; the U / V / W phase P-side drive power base island 3 is externally connected to a bootstrap capacitor through a pin, the IPM module charges the bootstrap capacitor through the bootstrap diode and the current limiting resistor 4, and the bootstrap capacitor supplies power to the drive chip drive pole of the IPM module through the U / V / W phase P-side drive power base island carrying the bootstrap diode and the current limiting resistor.

[0015] Reference Figure 1 As shown, the bootstrap diode and current-limiting resistor 4 are formed by stacking a chip resistor and a diode 5 in the form of a bare crystal. The selection of the diode and the resistor can be matched according to the actual application situation, and resistors of different resistance values ​​can be flexibly selected as the current-limiting resistor. The stacking area of ​​the chip resistor and the diode 5 is kept consistent during the stacking process, or the stacking area gradually decreases from bottom to top. The chips with large resistor and diode areas are placed at the bottom to improve the fault tolerance of the stack. After the resistor and diode chips are stacked, the top of the chip is interconnected with the IPM module drive power base island through lead interconnection to obtain power. The pins extending from the base island carrying the resistor and the diode are externally connected to the bootstrap capacitor, and the IPM module control power supply charges the bootstrap capacitor through the bootstrap diode and the current-limiting resistor. The base island carrying the resistor and the diode is connected to the IPM driver chip through bonding wires, and the bootstrap capacitor supplies power to the IPM driver chip drive pole through the base island carrying the resistor and the diode.

[0016] Reference Figure 1As shown, the number of the U / V / W phase P side driving power islands 3 is three, and the chip resistor and diode 5 on the U / V / W phase P side driving power island 3 are fixedly connected with the corresponding U / V / W phase P side driving power island 3 by welding. The present invention integrates the bootstrap diode and the current limiting resistor in the IPM bootstrap circuit into the IPM module in series. By stacking and welding the resistor and diode chips in the form of bare crystals to the lead frame island, and interconnecting with the driving power island through bonding wires, the bootstrap circuit directly draws power from the driving chip power supply. The bootstrap circuit only needs an external bootstrap capacitor, and the current limiting resistor can freely select the resistance value, which simplifies the peripheral circuit required for the operation of the IPM module.

[0017] The specific embodiments described herein are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. An IPM module with an integrated bootstrap circuit, comprising an IPM module body, characterized in that: A bootstrap circuit is electrically connected to the control-end power pin base island of the IPM module body through a bonding wire, and the bootstrap circuit mainly includes a plurality of U / V / W phase P-side drive power base islands arranged in series and a bootstrap diode and a current-limiting resistor arranged on the U / V / W phase P-side drive power base island, and the U / V / W phase P-side drive power base island is provided with a bonding wire extending outward, and the bootstrap diode and the current-limiting resistor on two adjacent U / V / W phase P-side drive power base islands are electrically connected through a bonding wire; an external bootstrap capacitor is connected to the U / V / W phase P-side drive power base island through a pin, and the IPM module charges the bootstrap capacitor through the bootstrap diode and the current-limiting resistor, and the bootstrap capacitor supplies power to the drive chip drive pole of the IPM module through the U / V / W phase P-side drive power base island carrying the bootstrap diode and the current-limiting resistor; The bootstrap diode and the current-limiting resistor are formed by stacking a chip resistor and a diode in a bare crystal form, and the stacking area of ​​the chip resistor and the diode remains consistent during the stacking process or the stacking area gradually decreases from bottom to top.

2. The IPM module with integrated bootstrap circuit according to claim 1, characterized in that: The number of the U / V / W phase P-side driving power supply base islands is 3, and the chip resistors and diodes on the U / V / W phase P-side driving power supply base islands are fixedly connected to the corresponding U / V / W phase P-side driving power supply base islands by welding.

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