Electronic structure with a transformer

Abstract

An electronic structure includes a circuit board. Among them, a plurality of electronic devices and a transformer are arranged on the circuit board. The transformer includes a first coil, a second coil, and a magnetic body. Wherein, a package body containing an insulating material encapsulates at least a part of the outer surface of the first coil, at least a part of the outer surface of the second coil, and a plurality of electronic devices for electrically isolating the plurality of electronic devices from the transformer.

Description

Technical Field

[0001] The present invention relates to an electronic structure, and particularly to an electronic structure having a transformer. Background Art

[0002] Electronic structures with different power domains usually require a transformer to isolate the voltages of different power domains so that the electronic devices in one power domain are not affected by the voltages in another power domain. However, an electronic structure having a transformer requires a large space to accommodate the transformer and the electronic devices of different power domains. In addition, the design process of an electronic structure having a transformer is complex and expensive, and as the size of the power module becomes smaller and smaller, abnormal voltages are easily caused due to the short distance between the transformer and the electronic devices.

[0003] Therefore, the industry needs a better solution to solve the above problems. Summary of the Invention

[0004] An object of the present invention is to provide an electronic structure including a plurality of electronic devices and a transformer, wherein a package body containing an insulating material encapsulates the plurality of electronic devices and the transformer to increase the insulation between the plurality of electronic devices and the voltage of the transformer.

[0005] An object of the present invention is to reduce the volume of the electronic structure by using a conductive pattern of a circuit board to form a first coil and a second coil of a transformer.

[0006] An object of the present invention is to reduce the volume of the electronic structure by using a flexible printed circuit board (FPCB) to form a first coil and a second coil of a transformer.

[0007] An embodiment of the present invention discloses an electronic structure, wherein the electronic structure includes: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, wherein the transformer includes a first coil, a second coil, and a magnetic body, wherein the magnetic body includes a first part disposed in a first hollow portion of the first coil and a second part disposed in a second hollow portion of the second coil to form the transformer, and wherein a package body containing an insulating material encapsulates at least a part of the outer surface of the first coil, at least a part of the outer surface of the second coil, and the plurality of electronic devices.

[0008] In one embodiment, the package body includes resin.

[0009] In one embodiment, the package body includes epoxy resin.

[0010] In one embodiment, the package body encapsulates the entire outer surface of the first coil.

[0011] In one embodiment, the encapsulation body encapsulates the entire outer surface of the second coil.

[0012] In one embodiment, the encapsulation body encapsulates at least a part of the outer surface of the magnetic body.

[0013] In one embodiment, the encapsulation body encapsulates the entire outer surface of the magnetic main body.

[0014] In one embodiment, each of the first coil and the second coil is formed by a corresponding conductive pattern of a plurality of conductive layers of a circuit board.

[0015] In one embodiment, the first coil includes a first plurality of conductive patterns on the upper surface of the circuit board, and the second coil includes a second plurality of conductive patterns on the upper surface of the circuit board, wherein the encapsulation body encapsulates the first plurality of conductive patterns and the second plurality of conductive patterns.

[0016] In one embodiment, the first coil includes a first plurality of conductive patterns on the upper surface of the circuit board and a second plurality of conductive patterns on the lower surface of the circuit board, wherein the encapsulation body encapsulates the first plurality of conductive patterns and the second plurality of conductive patterns.

[0017] In one embodiment, the first coil includes a first plurality of conductive patterns on the upper surface of the circuit board, a second plurality of conductive patterns on an intermediate layer of the circuit board, and a third plurality of conductive patterns on the lower surface of the circuit board, wherein the encapsulation body encapsulates the first plurality of conductive patterns, the second plurality of conductive patterns, and the third plurality of conductive patterns.

[0018] In one embodiment, the circuit board includes a plurality of conductive patterns on the circuit board to electrically connect the first coil and an electronic device.

[0019] In one embodiment, the circuit board includes a BT (Bismaleimide Triazine) substrate, a metal substrate, or a ceramic substrate.

[0020] In one embodiment, the circuit board is a multilayer circuit board, wherein the first coil includes corresponding conductive patterns on each conductive layer of the multilayer circuit board, and wherein the encapsulation body encapsulates the corresponding conductive patterns on each conductive layer.

[0021] In one embodiment, the circuit board is a multilayer circuit board, wherein the second coil includes corresponding conductive patterns on each conductive layer of the multilayer circuit board, and wherein the encapsulation body encapsulates the corresponding conductive patterns on each conductive layer.

[0022] In one embodiment, the plurality of electronic devices are embedded in the multilayer circuit board.

[0023] In one embodiment, a part of the first coil is disposed above the circuit board, and another part of the first coil is disposed below the circuit board.

[0024] In one embodiment, the first coil is disposed above the circuit board, and a third coil is disposed below the circuit board, wherein the first coil is electrically connected to the third coil through a conductive pattern of the circuit board.

[0025] In one embodiment, each of the first coil and the second coil is respectively disposed in a through hole of the circuit board.

[0026] In one embodiment, each of the first coil and the second coil is disposed in a recess of the circuit board.

[0027] In one embodiment, each of the first coil and the second coil is disposed in a recess of the circuit board.

[0028] In one embodiment, the plurality of electronic devices includes an IC.

[0029] In one embodiment, an electronic structure is disclosed, which includes: a circuit board, wherein a plurality of electronic devices and a transformer are disposed on the circuit board, wherein the transformer includes a first coil, a second coil and a magnetic body, wherein the magnetic body includes a first part disposed in a first hollow part of the first coil and a second part disposed in a second hollow part of the second coil for forming the transformer, and each of the first coil and the second coil is formed by corresponding conductive patterns of the circuit board.

[0030] In one embodiment, the circuit board is a multi-layer circuit board, wherein the first coil includes corresponding conductive patterns on each conductive layer of the multi-layer circuit board.

[0031] In one embodiment, an electronic structure is disclosed, which includes: a flexible printed circuit board, wherein a first coil, a second coil and a magnetic body are disposed on the flexible printed circuit board to form a transformer, wherein the magnetic body includes a first part disposed in a first hollow part of the first coil and a second part disposed in a second hollow part of the second coil to form the transformer.

[0032] In one embodiment, each of the first coil and the second coil is formed by corresponding conductive patterns of the flexible printed circuit board.

[0033] In one embodiment, the electronic structure further includes a plurality of electronic devices disposed on the flexible printed circuit board, wherein an encapsulation body containing an insulating material encapsulates at least a part of the outer surface of the first coil, at least a part of the outer surface of the second coil, and the plurality of electronic devices.

[0034] In one embodiment, each of the first coil and the second coil is formed by a corresponding wire.

[0035] In one embodiment, a transformer is disclosed, which includes a flexible printed circuit board and a magnetic body. A first coil and a second coil are formed by a plurality of conductive patterns of the flexible printed circuit board. The magnetic body includes a first part disposed in a first hollow portion of the first coil and a second part disposed in a second hollow portion of the second coil to form the transformer.

[0036] To make the above and other features and advantages of the present invention more obvious and understandable, specific embodiments are hereinafter given and described in detail in conjunction with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0038] Figure 1A is a top view of an electronic structure according to an embodiment of the present invention;

[0039] Figure 1B is according to an embodiment of the present invention Figure 1A a bottom view of the electronic structure in.

[0040] Figure 1C is a side cross-sectional view of an electronic structure according to an embodiment of the present invention;

[0041] Figure 1D is a side view of an electronic structure according to an embodiment of the present invention;

[0042] Figure 1E is a side view of an electronic structure according to an embodiment of the present invention;

[0043] Figure 1F is a side view of an electronic structure according to an embodiment of the present invention;

[0044] Figure 1G is a side view of an electronic structure according to an embodiment of the present invention;

[0045] Figure 1His a side view of an electronic structure according to an embodiment of the present invention;

[0046] Figure 1I is a side view of an electronic structure according to an embodiment of the present invention;

[0047] Figure 2A shows a transverse side view of an electronic structure according to an embodiment of the present invention;

[0048] Figure 2B shows a side view of an electronic structure according to an embodiment of the present invention.

[0049] Description of reference numerals: 101 - circuit board; 102 - transformer; 103 - electronic device; 102a - first coil; 102b - second coil; 102c - magnetic body; R - resistor; C - capacitor; 104 - electrode; 104a - conductive post; 104b - lead frame; 104c - metal bump; 105 - package; 107 - conductive pattern; g1, g2 - gap; 108 - flexible printed circuit board; 108a, 108b - conductive pattern; T - thickness. Detailed Description

[0050] Figure 1A is a top view of an electronic structure according to an embodiment of the present invention. Figure 1B is Figure 1A a bottom view of the electronic structure in Figure 1C is Figure 1A a side view of the electronic structure in Figure 1A - 1C As shown, the electronic structure includes: a circuit board 101, wherein a plurality of electronic devices 103 and a transformer 102 are disposed on the circuit board 101, wherein the transformer 102 includes a first coil 102a, a second coil 102b, and a magnetic body 102c, wherein the magnetic body 102c includes a first part disposed in a first hollow portion of the first coil 102a and a second part disposed in a second hollow portion of the second coil 102b to form the transformer 102, wherein the package 105 encapsulates at least a part of the outer surface of the first coil 102a, at least a part of the outer surface of the second coil 102b, and a plurality of electronic devices 103, wherein the package 105 can electrically isolate the plurality of electronic devices from the transformer 102 and increase the structural strength of the electronic structure.

[0051] In one embodiment, the package 105 includes a resin

[0052] In one embodiment, the package 105 includes epoxy resin.

[0053] In one embodiment, the package 105 is integrally formed and has a single body.

[0054] In one embodiment, the encapsulant 105 encapsulates the entire outer surface of the first coil 102a.

[0055] In one embodiment, the encapsulant 105 encapsulates the entire outer surface of the second coil 102b

[0056] In one embodiment, the encapsulant 105 also encapsulates at least a portion of the outer surface of the magnetic body 102c.

[0057] In one embodiment, each of the first coil 102a and the second coil 102b is formed by a corresponding conductive pattern 107 in a plurality of conductive layers of the circuit board 101, as Figure 1C shown.

[0058] In one embodiment, the circuit board 101 is a single-layer PCB, wherein the conductive pattern 107 is on the upper surface or the lower surface of the circuit board 101.

[0059] In one embodiment, the circuit board 101 is a double-layer PCB, wherein the conductive pattern 107 is on the upper surface and the lower surface of the circuit board 101.

[0060] In one embodiment, the circuit board 101 is a multi-layer PCB, wherein the conductive pattern 107 is on the upper surface, at least one intermediate conductive layer and the lower surface of the circuit board 101.

[0061] In one embodiment, at least a portion of the magnetic body 102c is disposed in a via hole of the circuit board 101.

[0062] In one embodiment, the first coil 102a includes a first plurality of conductive patterns on the upper surface of the circuit board 101, and the second coil 102b includes a second plurality of conductive patterns on the upper surface of the circuit board 101, wherein the encapsulant 105 encapsulates the first plurality of conductive patterns and the second plurality of conductive patterns.

[0063] In one embodiment, the first coil 102a includes a first plurality of conductive patterns on the upper surface of the circuit board 101 and a second plurality of conductive patterns on the lower surface of the circuit board 101, wherein the encapsulant 105 encapsulates the first plurality of conductive patterns and the second plurality of conductive patterns.

[0064] In one embodiment, the first coil 102a includes a first plurality of conductive patterns on the upper surface of the circuit board 101, a second plurality of conductive patterns on an intermediate layer of the circuit board 101, and a third plurality of conductive patterns on the lower surface of the circuit board 101, wherein the encapsulant 105 encapsulates the first plurality of conductive patterns, the second plurality of conductive patterns and the third plurality of conductive patterns.

[0065] In one embodiment, the circuit board 101 further includes a plurality of conductive patterns to electrically connect the first coil 102a to at least one of the plurality of electronic devices 103.

[0066] In one embodiment, the circuit board includes a BT substrate, a metal substrate or a ceramic substrate.

[0067] In one embodiment, the width W of the circuit board 101 is 33 mm, the length L of the circuit board 101 is 18 mm, and compared with a conventional power module, the size of the circuit board 101 is reduced by 34%.

[0068] In one embodiment, the circuit board 101 is a multi-layer circuit board, wherein the first coil 102a includes corresponding conductive patterns on each layer of the multi-layer circuit board 101, and the encapsulation 105 covers the corresponding conductive patterns on each layer.

[0069] In one embodiment, the second coil 102b includes corresponding conductive patterns on each layer of the multi-layer circuit board 101, and the encapsulation 105 covers the corresponding conductive patterns on each layer.

[0070] In one embodiment, a plurality of electronic devices 103 are embedded inside the circuit board 101.

[0071] In one embodiment, the circuit board 101 is a multi-layer circuit board, wherein a plurality of electronic devices 103 are embedded inside the multi-layer circuit board.

[0072] In one embodiment, each of the first coil 102a and the second coil 102b is formed by a wire, as Figure 1G shown.

[0073] In one embodiment, the circuit board 101 includes a conductive pattern 107 on the circuit board 101 to electrically connect the first coil 102a, the second coil 102b and the plurality of electronic devices 103.

[0074] In one embodiment, a part of the first coil 102a is disposed above the upper surface of the circuit board 101, and another part of the first coil 102a is disposed below the lower surface of the circuit board 101.

[0075] In one embodiment, the first coil 102a is disposed above the circuit board, and a third coil is disposed below the circuit board 101, wherein the first coil 102a is electrically connected to the third coil through the conductive pattern of the circuit board 101. In one embodiment, each of the first coil 102a and the third coil is formed by a corresponding wire. In one embodiment, each of the first coil 102a and the third coil is formed by a corresponding insulated wire (such as an enameled wire).

[0076] In one embodiment, the magnetic body 102c is disposed in a through hole of the circuit board 101.

[0077] In one embodiment, each of the first coil 102a and the second coil 102b is respectively disposed in a through hole of the circuit board 101.

[0078] In one embodiment, each of the first coil 102a and the second coil 102b is respectively disposed in a recess of the circuit board 101.

[0079] In one embodiment, the plurality of electronic devices 103 include at least one active element, such as an IC or a diode, and at least one passive element, such as a resistor R, a capacitor C, or an inductor, as Figure 1G shown.

[0080] In one embodiment, the plurality of electronic devices 103 are disposed on the upper surface and / or the lower surface of the circuit board 101.

[0081] In one embodiment, at least a portion of the plurality of electronic devices 103 is embedded inside the circuit board 101, as Figure 1F shown.

[0082] In one embodiment, the plurality of electronic devices 103 are completely embedded inside the circuit board 101.

[0083] In one embodiment, the plurality of electronic devices 103 include active elements.

[0084] In one embodiment, the plurality of electronic devices 103 include passive elements.

[0085] In one embodiment, as Figure 1C shown, the plurality of electronic devices 103 include an IC.

[0086] In one embodiment, as Figure 1C shown, the plurality of electronic devices 103 include a MOSFET.

[0087] In one embodiment, the plurality of electronic devices 103 include a diode, as Figure 1C shown.

[0088] In one embodiment, the plurality of electronic devices 103 include a resistor R, as Figure 1C shown.

[0089] In one embodiment, the plurality of electronic devices 103 include a capacitor C, as Figure 1C shown.

[0090] In one embodiment, the plurality of electronic devices 103 includes an inductor.

[0091] In one embodiment, a plurality of electrodes 104 are disposed on the circuit board 101 for electrical connection to an external circuit.

[0092] In one embodiment, each of the plurality of electrodes 104 is a surface mount pad on the circuit board 101.

[0093] In one embodiment, a portion of the package 105 is disposed above the upper surface of the circuit board 101, and another portion of the package 105 is disposed below the lower surface of the circuit board 101.

[0094] In one embodiment, each of the plurality of electrodes 104 is a conductive pin or a conductive post 104a disposed on the lower surface of the circuit board 101 for electrical connection to an external circuit, as Figure 1C shown. Note that the conductive pin or the conductive post 104a can conduct a large current, and the conductive pin or the conductive post 104a can be surface-mounted on an external substrate.

[0095] In one embodiment, each of the plurality of electrodes 104 is a lead frame 104b disposed on the circuit board 101 for electrical connection to an external circuit, as Figure 1D shown. Note that the lead frame 104b can conduct a large current.

[0096] In one embodiment, each of the plurality of electrodes 104 is a stacked metal bump 104c disposed on the circuit board 101 for electrical connection to an external circuit, as Figure 1E shown. Note that the stacked metal bump 104c can conduct a large current.

[0097] In one embodiment, the package 105 encapsulates at least a portion of the magnetic body 102c.

[0098] In one embodiment, the package 105 encapsulates the entire magnetic body 102c, as Figure 1E shown.

[0099] In one embodiment, a portion of the magnetic body 102c of the transformer 102 is disposed above the upper surface of the package 105, and another portion of the magnetic body 102c of the transformer 102 is disposed below the lower surface of the package 105, as Figure 1G shown.

[0100] In one embodiment, the first coil 102a is disposed in a first through hole of the circuit board 101.

[0101] In one embodiment, the second coil is disposed in a second through hole of the circuit board 101.

[0102] In one embodiment, the first coil 102a is disposed in a first groove of the circuit board 101.

[0103] In one embodiment, the second coil 102b is disposed in a second groove of the circuit board 101.

[0104] In one embodiment, the circuit board 101 includes one of the following: a PCB, a BT substrate, a metal substrate, or a ceramic substrate.

[0105] In one embodiment, the electronic structure includes a multi-layer circuit board, and the multi-layer circuit board includes a plurality of conductive patterns for forming the first coil 102a and the second coil 102b.

[0106] In one embodiment, a plurality of electronic devices 103 are embedded inside the multi-layer circuit board 101.

[0107] In one embodiment, each of the first coil 102a and the second coil 102b is formed by a wire, as Figure 1G shown.

[0108] In one embodiment, each of the first coil 102a and the second coil 102b is a pre-wound coil.

[0109] In one embodiment, the wire is an insulated wire. In one embodiment, the wire is a round wire. In one embodiment, the wire is a flat wire. In one embodiment, each of the first coil 102a and the second coil 102b is formed by an enameled wire.

[0110] In one embodiment, each of the first coil 102a and the second coil 102b is disposed in a through-hole of the circuit board 101.

[0111] In one embodiment, each of the first coil 102a and the second coil 102b is disposed in a recess of the circuit board 101.

[0112] In one embodiment, the plurality of electronic devices include an IC of a MOSFET.

[0113] In one embodiment, Figure 1G at least a part of the plurality of electronic devices 103 in Figure 1H is included at least a part of which is embedded in the circuit board, as shown

[0114] Figure 1G In one embodiment, Figure 1H the plurality of electronic devices 103 in

[0115] In one embodiment, at least one of the plurality of electronic devices 103 is electrically coupled to the first coil 102a; at least one of the plurality of electronic devices 103 is electrically coupled to the second coil 102b.

[0116] In one embodiment, the plurality of electronic devices 103 may include active components and passive components, such as resistors, capacitors or inductors, wherein the active components may include at least one of the following devices: an optocoupler, a Gan (Gallium-nitride)-based HB (half bridge), an ACF ((advanced adaptive digital) controller, an SR (synchronous rectifier) controller or a MOSFET, as Figure 1I shown.

[0117] In one embodiment, an optocoupler, a Gan (Gallium-nitride)-based HB (half bridge), and an ACF ((advanced adaptive digital) controller are electrically coupled to the first coil 102a; an SR (synchronous rectifier) controller and a MOSFET are electrically coupled to the second coil 102b, as Figure 1I shown.

[0118] In one embodiment, the package 105 encapsulates a portion of the outer surface of the plurality of electronic devices 103, a portion of the outer surface of the first coil 102a, and a portion of the outer surface of the second coil 102b, as Figure 1I shown.

[0119] In one embodiment, the package 105 may be made of a molding compound, and the package 105 may have two portions on two opposite sides of the magnetic body 102c, as Figure 1I shown. In one embodiment, the molding compound includes a resin. In one embodiment, the molding compound includes an epoxy resin.

[0120] In one embodiment, the magnetic body 102c and the package 105 may be separated by a gap g1, as Figure 1I shown.

[0121] In one embodiment, as Figure 1I shown, the magnetic body 102c and the package 105 may be separated by a gap g2.

[0122] In one embodiment, as Figure 1I shown, the magnetic body 102c and the package 105 may be separated by gaps g1 and g2.

[0123] In one embodiment, the thickness T of the package 105, as Figure 1I shown, is not greater than 10 millimeters. In one embodiment, the thickness T of the package 105 is 8.6 mm.

[0124] In one embodiment, as Figure 2A shown, the transformer 102 may be formed on a flexible printed circuit board 108, wherein each of the first coil 102a and the second coil 102b may be formed by corresponding conductive patterns 108a, 108b of the flexible printed circuit board 108, wherein the magnetic body 102c includes a first part disposed in a first hollow portion of the first coil 102a and a second part disposed in a second hollow portion of the second coil 102b for forming the transformer 102, wherein the transformer 102 formed on the flexible printed circuit board 108 may be disposed on the circuit board 101 as an integrated component, and wherein the flexible printed circuit board 108 is electrically connected to the circuit board 101.

[0125] In one embodiment, as Figure 2A shown, a transformer may be formed on a flexible printed circuit board 108, wherein each of the first coil 102a and the second coil 102b is formed by corresponding conductive patterns 108a, 108b of the flexible printed circuit board 108, wherein the magnetic body 102c includes a first part for forming the transformer 102 disposed in a first hollow portion of the first coil 102a and a second part disposed in a second hollow portion of the second coil 102b.

[0126] In one embodiment, a plurality of electronic devices 103 may be disposed on the flexible printed circuit board 108.

[0127] In one embodiment, the package 105 is disposed on the flexible printed circuit board 108 to encapsulate at least a portion of the outer surface of the first coil 102a, at least a portion of the outer surface of the second coil 102b, and the plurality of coils. The electronic device 103 is used to electrically isolate the plurality of electronic devices 103 from the transformer 102.

[0128] In one embodiment, the package 105 encapsulates at least a portion of the magnetic body 102c of the transformer 102.

[0129] In one embodiment, the package 105 encapsulates the entire magnetic body 102c of the transformer 102.

[0130] In one embodiment, the flexible printed circuit board 108 is a multi-layer circuit board, wherein the first coil 102a includes corresponding conductive patterns 108a on each layer of the multi-layer flexible printed circuit board 101, and wherein the package 105 encapsulates the corresponding conductive patterns 108a on each layer of the multi-layer flexible printed circuit board 101.

[0131] In one embodiment, as Figure 1C shown, wherein the electronic structure includes: a circuit board 101a, wherein a plurality of electronic devices 103 and a transformer 102 are disposed on the circuit board 101, wherein the transformer 102 includes a first coil 102a, a second coil 102b, and a magnetic body 102c, wherein the magnetic body 102c includes a first portion disposed in a first hollow portion of the first coil 102a and a second portion disposed in a second hollow portion of the second coil 102b for forming the transformer 102, and wherein each of the first coil 102a and the second coil 102b is formed by a corresponding conductive pattern of a plurality of conductive layers of the circuit board 101a.

[0132] In one embodiment, as shown in FIGS. 2A and Figure 2B shown, wherein the transformer 102 includes: a first coil 102a, a second coil 102b, and a magnetic body 102c, wherein the first coil 102a and the second coil 102b are respectively disposed on a flexible printed circuit board 108, and wherein the magnetic body 102c includes a first portion disposed in a first hollow portion of the first coil 102a and a second portion disposed in a second hollow portion of the second coil 102b for forming the transformer 102.

[0133] In one embodiment, each of the first coil 102a and the second coil 102b is formed by a corresponding conductive pattern of the flexible printed circuit board 108, as Figure 2A shown.

[0134] In one embodiment, each of the first coil 102a and the second coil 102b is formed by a corresponding wire, as Figure 2B shown.

[0135] In one embodiment, the flexible printed circuit board 108 includes a plurality of conductive patterns to electrically connect the second coil 102b to at least a portion of the plurality of electronic devices 103.

[0136] In one embodiment, the first coil 102a includes a first plurality of conductive patterns on an upper surface of the flexible printed circuit board 108 and a second plurality of conductive patterns on a lower surface of the flexible printed circuit board 108, wherein the encapsulant 105 encapsulates the first plurality of conductive patterns and the second plurality of conductive patterns.

[0137] In one embodiment, the flexible printed circuit board 108 includes a plurality of conductive patterns to electrically connect the first coil 102a to at least a portion of the plurality of electronic devices 103.

[0138] In one embodiment, as Figure 2A and Figure 2BAs shown, the electronic structure includes a transformer 102 formed on a flexible printed circuit board 108 and a plurality of electronic devices 103 disposed on the flexible printed circuit board 108. The transformer 102a includes a first coil 102a, a second coil 102b, and a magnetic body 102c. The encapsulation body 105 encapsulates at least a part of the outer surface of the first coil 102a, at least a part of the outer surface of the second coil 102b, and the plurality of electronic devices 103. The plurality of electronic devices 103 are used to electrically isolate the plurality of electronic devices 103 from the transformer 102.

[0139] In one embodiment, each of the first coil 102a and the second coil 102b is formed by a corresponding conductive pattern of the flexible printed circuit board 101, as Figure 2A shown.

[0140] In one embodiment, each of the first coil 102a and the second coil 102b is formed by a corresponding wire, as Figure 2B shown.

[0141] In one embodiment, the encapsulation body 105 encapsulates the entire outer surface of the first coil 102a and the entire outer surface of the second coil 102b.

[0142] In one embodiment, the encapsulation body 105 encapsulates the entire outer surface of the magnetic body 102c of the transformer 102 formed on the flexible printed circuit board 108.

[0143] In one embodiment, the flexible printed circuit board 108 includes a plurality of conductive patterns 107 to electrically connect the first coil 102a to at least a part of the plurality of electronic devices 103.

[0144] In one embodiment, the flexible printed circuit board 108 includes a plurality of conductive patterns 107 to electrically connect the second coil 102b to at least a part of the plurality of electronic devices 103.

[0145] In one embodiment, the first coil 102a includes a first plurality of conductive patterns on the upper surface of the flexible printed circuit board 108 and a second plurality of conductive patterns on the lower surface of the flexible printed circuit board 108. The encapsulation body 105 encapsulates the first plurality of conductive patterns and the second plurality of conductive patterns.

[0146] In one embodiment, a transformer is disclosed, as Figure 2AAs shown, the transformer 102 includes: a flexible printed circuit board 108, wherein the first coil 102a and the second coil 102b are formed by corresponding conductive patterns of the flexible printed circuit board 108, and the magnetic body 102c includes: a first part for forming the transformer 102 is disposed in the first hollow portion of the first coil 102a, and a second part is disposed in the second hollow portion of the second coil 102b.

[0147] In one embodiment, the first coil 102a includes a first plurality of conductive patterns on the upper surface of the flexible printed circuit board 108 and a second plurality of conductive patterns on the lower surface of the flexible printed circuit board 108, and the encapsulation body 105 encapsulates the first plurality of conductive patterns and the second plurality of conductive patterns.

[0148] In one embodiment, the outer surfaces of the first coil 102 and the second coil 102b are completely encapsulated in the encapsulation body 105.

[0149] In one embodiment, the first coil 102a includes a first plurality of conductive patterns on the upper surface of the flexible printed circuit board 108 and a second plurality of conductive patterns on the lower surface of the flexible printed circuit board 108, and the encapsulation body 105 encapsulates the first plurality of conductive patterns and the second plurality of conductive patterns.

[0150] In one embodiment, the flexible printed circuit board 108 includes a plurality of conductive patterns 107 on the circuit board 101 to electrically connect the first coil 102a and the plurality of electronic devices 103.

[0151] In one embodiment, the flexible printed circuit board 108 includes a plurality of electrodes 104 for electrically connecting to an external circuit.

[0152] Although the present invention has been described with reference to the above embodiments, it is obvious to those of ordinary skill in the art that the described embodiments can be modified without departing from the spirit of the present invention. Therefore, the scope of the present invention will be defined by the appended claims rather than by the detailed description above.

Claims

1. An electronic structure, comprising a circuit board, characterized in that, A plurality of electronic devices and a transformer are disposed on the circuit board. The transformer includes a first coil, a second coil, and a magnetic body. The magnetic body includes a first portion disposed in a first hollow portion of the first coil and a second portion disposed in a second hollow portion of the second coil to form the transformer. The first portion of the magnetic body and the second portion of the magnetic body are disposed in a through hole of the circuit board, and the first portion of the magnetic body is located above the second portion of the magnetic body. An encapsulation body containing an insulating material encapsulates at least a portion of the outer surface of the first coil, at least a portion of the outer surface of the second coil, and the plurality of electronic devices.

2. The electronic structure according to claim 1, wherein The encapsulation body encapsulates the entire outer surface of the first coil.

3. The electronic structure according to claim 1, wherein The encapsulation body encapsulates the entire outer surface of the second coil.

4. The electronic structure according to claim 1, wherein The encapsulation body encapsulates at least a portion of the outer surface of the magnetic body.

5. The electronic structure according to claim 1, characterized in that, The encapsulation body encapsulates the entire outer surface of the magnetic body.

6. The electronic structure according to claim 1, wherein, The first coil is formed by a first plurality of conductive patterns of the circuit board.

7. The electronic structure according to claim 6, characterized in that, The second coil is formed by a second plurality of conductive patterns of the circuit board.

8. The electronic structure according to claim 6, characterized in that, The first coil includes a conductive pattern on the upper surface of the circuit board and a conductive pattern on the lower surface of the circuit board, and the encapsulation body encapsulates the plurality of conductive patterns.

9. The electronic structure according to claim 7, wherein The second coil includes a conductive pattern on the upper surface of the circuit board and a conductive pattern on the lower surface of the circuit board, and the encapsulation body encapsulates the plurality of conductive patterns.

10. The electronic structure according to claim 6, characterized in that, The circuit board further includes a conductive pattern to electrically connect the first coil and at least one of the plurality of electronic devices.

11. The electronic structure according to claim 1, characterized in that, The circuit board includes one of the following: a PCB, a BT substrate, a metal substrate, or a ceramic substrate.

12. The electronic structure according to claim 6, characterized in that, The circuit board is a multi-layer circuit board, and the first coil includes corresponding conductive patterns on each conductive layer of the multi-layer circuit board.

13. The electronic structure according to claim 1, characterized in that, The plurality of electronic devices are embedded inside the circuit board.

14. The electronic structure according to claim 1, wherein Each of the first coil and the second coil is formed by a wire respectively.

15. An electronic structure, comprising: A circuit board, characterized in that a plurality of electronic devices and a transformer are disposed on the circuit board. The transformer includes a first coil, a second coil, and a magnetic body. The magnetic body includes a first portion disposed in a first hollow portion of the first coil and a second portion disposed in a second hollow portion of the second coil to form the transformer. The first portion of the magnetic body and the second portion of the magnetic body are disposed in a through hole of the circuit board, and the first portion of the magnetic body is located above the second portion of the magnetic body. Each of the first coil and the second coil is formed by corresponding conductive patterns of the circuit board respectively.

16. The electronic structure according to claim 15, characterized in that, The circuit board is a multi-layer circuit board, and the first coil includes corresponding conductive patterns on each conductive layer of the multi-layer circuit board.

17. An electronic structure, comprising: A flexible printed circuit board, characterized in that a first coil, a second coil and a magnetic body are arranged on the flexible printed circuit board to form a transformer, wherein the magnetic body includes a first part disposed in a first hollow portion of the first coil and a second part disposed in a second hollow portion of the second coil to form the transformer, wherein the first part of the magnetic body and the second part of the magnetic body are disposed in a through hole of the flexible printed circuit board, and the first part of the magnetic body is located above the second part of the magnetic body.

18. The electronic structure according to claim 17, wherein Each of the first coil and the second coil is formed by a corresponding conductive pattern of the flexible printed circuit board.

19. The electronic structure according to claim 17, wherein It further includes a plurality of electronic devices arranged on the flexible printed circuit board, wherein an encapsulation body containing an insulating material encapsulates at least a part of the outer surface of the first coil, at least a part of the outer surface of the second coil and the plurality of electronic devices.

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