Deflection stress equalized fpc module and electronic device

Abstract

The application discloses a kind of deflection stress equalization FPC module and electronic device, it is related to electronic circuit technical field;The FPC module includes: first wiring terminal, first circuit is distributed on it;Second wiring terminal, second circuit is distributed on it;And, at least 3 bridge units of side-by-side arrangement connecting first wiring terminal and second wiring terminal, third circuit is distributed on it, first circuit and second circuit are connected by third circuit;Wherein, at least 3 bridge units are used to be formed by reverse bending, staggered polygonal three-dimensional support structure.Formed by the bridge unit of three-dimensional support structure, its fulcrum center is located in the center of three-dimensional support structure, it is favorable to realize the equalization of deflection stress in each direction of FPC, weaken the stress of FPC to some extent, can reduce the development difficulty of deflection control, improve the linear relationship of deflection degree and control parameter, guarantee the reliability and stability of FPC deflection control.

Description

Technical Field

[0001] This invention belongs to the field of electronic circuit technology, and in particular relates to an FPC module and electronic device with deflection stress equalization. Background Technology

[0002] FPC (Flexible Printed Circuit Board), also known as flexible circuit board, is a highly reliable and flexible printed circuit board made of a series of thin film materials such as polyimide or polyester film as the substrate. It is characterized by high wiring density, light weight and thin thickness, and is widely used in many fields such as automotive electronics, consumer electronics, home appliances, and industrial equipment.

[0003] To meet the miniaturization and micro-miniaturization demands of electronic devices, the requirements for flexible printed circuit boards (FPCs) have expanded beyond just bending resistance to include more precise control. For example, in a micro-gimbal system for a camera module, a C-shaped FPC is placed beneath the camera module to support it. Electromagnetic coils are then used to deflect the camera module in multiple directions. Because the bending point of the FPC is on one side, the internal stresses within the FPC that the camera module must overcome vary depending on the direction of deflection. This makes designing the control parameters for the deflection in multiple directions challenging and makes it difficult to achieve a linear relationship between the degree of deflection and the control parameters. Summary of the Invention

[0004] In view of this, one objective of the present invention is to propose an FPC module with balanced deflection stress, so as to solve the problem that in the current technology, the stress in different directions of the FPC is different during the deflection process, which makes the development of deflection control difficult and results in poor reliability and stability.

[0005] In some illustrative embodiments, the deflection stress-balanced FPC module includes: a first terminal with a first circuit distributed thereon; a second terminal with a second circuit distributed thereon; and at least three bridging units arranged side by side connecting the first terminal and the second terminal, each with a third circuit distributed thereon, wherein the first circuit and the second circuit are connected through the third circuit; wherein the at least three bridging units are used to form a polygonal three-dimensional support structure by reverse bending and staggering.

[0006] In some alternative embodiments, the sum of the widths of the bridging units is not greater than the minimum width of the first terminal and the second terminal.

[0007] In some alternative embodiments, the sum of the widths of the bridging units is not greater than 1 / 2 of the minimum width of the first terminal and the second terminal.

[0008] In some alternative embodiments, the at least three bridging units are used to form a rectangular three-dimensional support structure by reverse bending and staggering.

[0009] In some alternative embodiments, the at least three bridging units arranged side by side specifically include at least three bridging units that are spaced apart and / or connected together.

[0010] In some alternative embodiments, when the number of bridging units is even, the bridging units are distributed in a left-right mirror image on both sides of the centerline in the width direction of the first terminal or the second terminal.

[0011] In some alternative embodiments, when the number of bridging units is odd, there is one first bridging unit and an even number of second bridging units. The first bridging unit is located on the centerline of the width direction of the first terminal or the second terminal, and the second bridging units are distributed on both sides of the first bridging unit in a mirror image.

[0012] In some alternative embodiments, the at least three bridging units are reverse-bent to form a three-dimensional support structure of successively intersecting polygons or to form a three-dimensional support structure of mirrored intersecting polygons.

[0013] In some alternative embodiments, the first terminal, the second terminal, and the bridging unit are integrated into one unit.

[0014] In some alternative embodiments, the first circuit, the second circuit, and the third circuit are integrally formed by one or more of the following methods: sputtering, chemical etching, mechanical engraving, laser engraving, vapor deposition, chemical vapor deposition, physical vapor deposition, direct writing, printing, coating.

[0015] Another object of the present invention is to provide an electronic device to solve the problems existing in the prior art.

[0016] In some illustrative embodiments, the electronic device includes a deflection stress-equalized FPC module as described in any one of the preceding embodiments.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] In this embodiment of the invention, by designing the FPC as a bridging unit with multiple interlaced polygonal three-dimensional support structures, the center of its fulcrum is located at the center of the three-dimensional support structure. This facilitates the balance of deflection stress in all directions of the FPC and reduces the stress of the FPC to a certain extent. This reduces the development difficulty of deflection control, improves the linear relationship between the degree of deflection and the control parameters, and ensures the reliability and stability of FPC deflection control. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the planar structure of an example of an FPC module with deflection stress equalization in this invention.

[0020] Figure 2 This is a schematic diagram of the elevation structure of an example of an FPC module with balanced deflection stress in this invention.

[0021] Figure 3 This is a three-dimensional structural schematic diagram of an example of an FPC module with deflection stress equalization in this invention.

[0022] Figure 4 This is a schematic diagram of the planar structure of Example 2 of the FPC module with deflection stress equalization in this invention;

[0023] Figure 5 This is a three-dimensional structural schematic diagram of Example 3 of the FPC module with deflection stress equalization in this invention. Detailed Implementation

[0024] The following description and accompanying drawings fully illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Some portions and features of some embodiments may be included in or replace portions and features of other embodiments. The scope of embodiments of the invention includes the entire scope of the claims and all available equivalents thereof. In this document, these embodiments of the invention may be referred to individually or collectively with the term "invention," which is merely for convenience and is not intended to automatically limit the scope of the application to any single invention or inventive concept if more than one invention is disclosed.

[0025] It should be noted that, where there is no conflict, the various technical features in the embodiments of the present invention can be combined with each other.

[0026] This invention discloses an FPC module with deflection stress equalization, specifically, as shown in the embodiments of the present invention. Figure 1-5 As shown, Figure 1 This is a schematic diagram of the planar structure of an example of an FPC module with deflection stress equalization in this invention. Figure 2 This is a schematic diagram of the elevation structure of an example of an FPC module with balanced deflection stress in this invention. Figure 3 This is a three-dimensional structural schematic diagram of an example of an FPC module with deflection stress equalization in this invention.

[0027] Figure 4This is a schematic diagram of the planar structure of Example 2 of the FPC module with deflection stress equalization in this invention; Figure 5 This is a three-dimensional structural diagram of Example 3 of the deflection stress balancing FPC module of the present invention. The deflection stress balancing FPC module includes: a first terminal 1 with a first circuit 101 distributed thereon; a second terminal 2 with a second circuit 102 distributed thereon; and at least three bridging units 3 arranged side-by-side connecting the first terminal 1 and the second terminal 2, each with a third circuit 103 distributed thereon, wherein the first circuit 101 and the second circuit 102 are connected through the third circuit 103; wherein the at least three bridging units 3 are used to form a polygonal three-dimensional support structure by reverse bending and staggering.

[0028] In this embodiment of the invention, reverse bending refers to a bending structure with the opposite bending direction, such as three bridging units 3 arranged in sequence, namely, the first bridging unit 31, the second bridging unit 32, and the third bridging unit 33; wherein the bending direction of the first bridging unit is upward, the bending direction of the second bridging unit is downward, and the bending direction of the third bridging unit is upward; or, the bending direction of the first bridging unit 31 is downward, the bending direction of the second bridging unit 32 is upward, and the bending direction of the third bridging unit 33 is downward.

[0029] For example, four bridging units arranged in sequence: first bridging unit 31, second bridging unit 32, third bridging unit 33, and fourth bridging unit 34; wherein the bending direction of the first bridging unit 31 is upward, the bending direction of the second bridging unit 32 is downward, the bending direction of the third bridging unit 33 is upward, and the bending direction of the fourth bridging unit 34 is downward; or, the bending direction of the first bridging unit is upward, the bending direction of the second bridging unit is downward, the bending direction of the third bridging unit is downward, and the bending direction of the fourth bridging unit is upward.

[0030] The polygonal three-dimensional support structure formed by the reverse bending and interlacing of bridging units in this embodiment of the invention specifically refers to the fact that the bridging units are arranged side by side along the width direction of the first terminal 1 or the second terminal 2 and are not on the same plane. Therefore, the polygonal support structure formed by them is also not located on the same plane. A spatial three-dimensional support structure is formed by interlacing and complementing each other.

[0031] In the embodiments of the present invention, the width direction of the first terminal 1 or the second terminal 2 refers to the direction perpendicular to the connection direction of the first terminal 1, the bridging unit 3, and the second terminal 2, while the connection direction of the first terminal 1, the bridging unit 3, and the second terminal 2 is the length direction, which is applicable to the orientation identification of the first terminal 1, the bridging unit 3, and the second terminal 2 in the embodiments of the present invention.

[0032] In some embodiments of the present invention, the polygon has no fewer than four sides, such as a quadrilateral, pentagon, or hexagon. The polygon's graphic structure can be regular or irregular, as long as it satisfies the requirement of a horizontal support structure on the top and bottom surfaces.

[0033] Preferably, the polygonal structures formed by the bridging units after bending in the embodiments of the present invention can be the same or different, as long as they can satisfy the horizontal support structure of the top and bottom surfaces; for example, the first bridging unit can form a quadrilateral structure, the second bridging unit can form a hexagonal structure, and the third bridging unit can form a quadrilateral structure; preferably, the three-dimensional support structure formed by each bridging unit in the embodiments of the present invention is a regular cube, so as to promote the balance of deflection stress in all directions of the FPC.

[0034] In this embodiment of the invention, by designing the FPC as a bridging unit with multiple interlaced polygonal three-dimensional support structures, the center of its fulcrum is located at the center of the three-dimensional support structure. This facilitates the balance of deflection stress in all directions of the FPC and reduces the stress of the FPC to a certain extent. This reduces the development difficulty of deflection control, improves the linear relationship between the degree of deflection and the control parameters, and ensures the reliability and stability of FPC deflection control.

[0035] In some embodiments, the sum of the widths of the bridging units 3 is not greater than the minimum width of the first terminal 1 and the second terminal 2. In this embodiment, by reducing the width of the bridging units 3, the internal stress of the bridging units 3 can be reduced, thereby further reducing the internal stress of the FPC module during deflection. Preferably, the sum of the widths of the bridging portions 3 is not greater than half the minimum width of the first terminal 1 and the second terminal 2.

[0036] In some embodiments of the present invention, the bridging units 3 are intersected by reverse bending to form a rectangular three-dimensional support structure, i.e., the bending points form 90° right angles. In this embodiment, by designing the FPC as a rectangular three-dimensional support structure, the support structure of the FPC module can be made more stable.

[0037] Furthermore, in this embodiment of the invention, the bridging units 3 are intersected by reverse bending to form a square three-dimensional support structure. In this embodiment, the square three-dimensional support structure has sides of equal length and structural stress at approximately the same position. Preferably, the center point of the formed square three-dimensional support structure is pierced by the centerline of the bridging unit 3 in the width direction. The square three-dimensional support structure formed in this embodiment can further improve the stress balance during FPC deflection and is easier to control and develop.

[0038] In some embodiments, the at least three bridging units arranged side by side specifically include at least three bridging units that are spaced apart and / or connected (adjacent). In this embodiment, the bridging units can be spaced apart from each other; preferably, the bridging units are spaced at equal intervals; in other embodiments, the bridging units can also be connected, for example, closely arranged bridging units. Alternatively, some bridging units can be spaced apart, and some bridging units can be connected.

[0039] For example, there are three bridging units arranged in sequence, namely a first bridging unit, a second bridging unit, and a third bridging unit; wherein the first bridging unit and the second bridging unit are arranged at intervals, and the second bridging unit and the third bridging unit are connected.

[0040] For example, there are four bridging units arranged in sequence, namely a first bridging unit, a second bridging unit, a third bridging unit, and a fourth bridging unit; wherein the first bridging unit and the second bridging unit are connected to each other, the third bridging unit and the fourth bridging unit are connected to each other, and the second bridging unit and the third bridging unit are spaced apart.

[0041] Preferably, the number of bridging units in the embodiments of the present invention can be either even or odd;

[0042] When the number of bridging units is even, the bridging units can be distributed in a mirror image on both sides of the centerline in the width direction of the first terminal or the second terminal; in this embodiment, the mirror image arrangement is beneficial to improving the force balance during the FPC deflection process.

[0043] For example, there are four bridging units arranged in sequence, namely the first bridging unit, the second bridging unit, the third bridging unit, and the fourth bridging unit; wherein the first bridging unit and the second bridging unit form one group, and the third bridging unit and the fourth bridging unit form another group, and the two groups are distributed in a mirror image on both sides of the centerline in the width direction of the first terminal or the second terminal.

[0044] When the number of bridging units is odd, there is one first bridging unit and an even number of second bridging units. The first bridging unit is located on the centerline of the width direction of the first or second terminal, and the second bridging units are distributed on both sides of the first bridging unit in a mirror image. In this embodiment, the mirror image arrangement helps to improve the force balance during the FPC deflection process.

[0045] For example, there are three bridging units arranged in sequence, namely a first bridging unit, a second bridging unit, and a third bridging unit; wherein, the second bridging unit is disposed on the centerline of the width direction of the first terminal or the second terminal, and the first bridging unit and the third bridging unit are distributed on both sides of the second bridging unit in a mirror image.

[0046] In some embodiments, the at least three bridging units are reverse-bent to form a three-dimensional support structure of sequentially interlaced polygons or a three-dimensional support structure of mirror-interlaced polygons.

[0047] The structure comprises a series of interlaced polygonal support units, for example, three bridging units arranged in sequence: a first bridging unit, a second bridging unit, and a third bridging unit. The first bridging unit is used for forward bending, the second bridging unit adjacent to the first bridging unit is used for reverse bending, and the third bridging unit adjacent to the second bridging unit is used for forward bending. The same applies to four or more bridging units.

[0048] The three-dimensional support structure forming a mirrored, interlaced polygon refers to a structure that is mirror-symmetrical about the centerline of the width direction of the first or second terminal. For example, it may have three bridging units arranged in sequence: a first bridging unit, a second bridging unit, and a third bridging unit. The second bridging unit is positioned on the centerline of the width direction of the first or second terminal, and the first and third bridging units are mirror-distributed on either side of the second bridging unit. The first and third bridging units are used for forward bending, while the second bridging unit is used for reverse bending. Another example is a structure with four bridging units arranged in sequence: a first bridging unit, a second bridging unit, a third bridging unit, and a fourth bridging unit. The first and second bridging units form one group, and the third and fourth bridging units form another group, with the two groups mirror-distributed on either side of the centerline of the width direction of the first or second terminal. The first and fourth bridging units are used for forward bending, while the second and third bridging units are used for reverse bending.

[0049] In some embodiments of the present invention, the first terminal 1, the second terminal 2, and the bridging portion 3 may be an integral structure. For example, an integrally structured substrate may be selected, which has the same overall structure as the first terminal, the second terminal, and the bridging portion. The substrate in the embodiments of the present invention may be a flexible substrate, and is not limited to PI, PET, PVC, PU, ​​PC, PP, PA, CPI (transparent PI), etc.

[0050] In other embodiments, the first terminal, the second terminal, and the bridging portion can also be connected by means of bonding, clamping, or other methods.

[0051] In some embodiments of the present invention, the first terminal 1, the second terminal 2, and the bridging portion 3 are multi-layer structures, such as a three-layer structure of substrate, circuit, and substrate (covering film); in other embodiments, they may also be multi-layer circuit structures, such as a five-layer structure of substrate (covering film), circuit, substrate, circuit, and substrate (covering film); other multi-layer structures will not be described in detail here.

[0052] In some embodiments, one or more of the first terminal 1, the second terminal 2, and the bridging portion 3 may be structurally reinforced by means of reinforcing plates, for example, reinforcing plates may be provided on the first terminal 1 and the second terminal 2.

[0053] In some embodiments of the present invention, the first ribbon electrode, the second ribbon electrode, and the clustered circuit are integrally formed by one or more of the following methods: sputtering, chemical etching, mechanical engraving, laser engraving, evaporation, chemical vapor deposition, physical vapor deposition, direct writing, printing, coating, etc. The first ribbon electrode, the second ribbon electrode, and the clustered circuit can be selected from elemental or alloy materials such as copper, silver, gold, nickel, tin, and aluminum, conductive metal oxides (such as ITO indium tin oxide), liquid metal, and conductive inks using metal nanowires or metal particles as conductive fillers. The liquid metal can be a liquid metal paste doped with conductive fillers.

[0054] This invention also discloses an electronic device comprising the deflection stress equalization FPC module described in any of the preceding embodiments. Specifically, the electronic device is not limited to a gimbal module used for deflection control.

[0055] Those skilled in the art will also understand that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments herein can be implemented as electronic hardware, computer software, or a combination thereof. To clearly illustrate the interchangeability between hardware and software, the various illustrative components, blocks, modules, circuits, and steps described above are generally described in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art can implement the described functionality in alternative ways for each specific application; however, such implementation decisions should not be construed as departing from the scope of this disclosure.

Claims

1. A deflection stress balancing FPC module, characterized in that, include: The first terminal has a first circuit distributed on it; The second terminal has a second circuit distributed on it; In addition, at least three bridging units arranged side by side, connecting the first terminal and the second terminal, are provided with a third circuit, and the first circuit and the second circuit are connected through the third circuit; The at least three bridging units are used to form a three-dimensional support structure of polygons that are sequentially intersected or mirror-intersected by reverse bending; the reverse bending refers to the bending direction of one bridging unit being opposite to the bending direction of other bridging units.

2. The FPC module with deflection stress equalization according to claim 1, characterized in that, The sum of the widths of the bridging units is not greater than the minimum width of the first terminal and the second terminal.

3. The FPC module with deflection stress equalization according to claim 2, characterized in that, The sum of the widths of the bridging units is no greater than 1 / 2 of the minimum width of the first terminal and the second terminal.

4. The FPC module with deflection stress equalization according to claim 1, characterized in that, The at least three bridging units are used to form a rectangular three-dimensional support structure by reverse bending and interlacing.

5. The FPC module with deflection stress equalization according to claim 1, characterized in that, The at least three bridging units arranged side by side specifically include: At least three bridging units with spacing and / or connection settings.

6. The FPC module with deflection stress equalization according to claim 5, characterized in that, When the number of bridging units is even, the bridging units are distributed in a mirror image on both sides of the centerline in the width direction of the first terminal or the second terminal. When the number of bridging units is odd, there is one first bridging unit and an even number of second bridging units. The first bridging unit is located on the centerline of the width direction of the first terminal or the second terminal, and the second bridging units are distributed on both sides of the first bridging unit in a mirror image.

7. The FPC module with deflection stress equalization according to claim 1, characterized in that, The first terminal, the second terminal, and the bridging unit are integrated into one structure.

8. The FPC module with deflection stress equalization according to claim 7, characterized in that, The first circuit, the second circuit, and the third circuit are integrally formed by one or more of the following methods: sputtering, chemical etching, mechanical engraving, laser engraving, vapor deposition, chemical vapor deposition, physical vapor deposition, direct writing, printing, coating.

9. An electronic device, characterized in that, The FPC module with deflection stress equalization as described in any one of claims 1-8.

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