Insulator leakage current analysis system and method

Abstract

The present invention discloses an insulator leakage current analysis system and method, wherein the analysis system includes a microprocessor MCU and a power module, the signal acquisition end of the microprocessor MCU is connected to an acquisition circuit, the acquisition circuit is used to obtain the insulator sensing signal of the signal collector, the microprocessor MCU is provided with a memory and a register, the communication end of the microprocessor MCU is connected to a wireless communication module for communicating with a handheld terminal; the timing end of the microprocessor MCU is connected to a timer. The analysis method is set based on the analysis system to realize the detection of the surface of the insulator string, data processing, signal transmission and other functions. The working performance of the insulator is guaranteed and the reliability of its work is improved.

Description

Technical Field

[0001] The invention relates to the technical field of insulator flashover, in particular to an insulator leakage current analysis system and method. Background Art

[0002] In my country, a large number of insulators are used in power supply lines, especially in railway systems and substations. Therefore, the working condition of insulators is directly related to the safety of power supply lines. It is of great significance to provide the operating conditions of high-voltage insulators for power supply lines.

[0003] Among them, insulators often flash during use (discharge on the surface of the insulating item). When the insulator flashes severely, it will cause the substation to trip. After the tripping phenomenon occurs, even if the circuit breaker can be reclosed, it will still affect electricity consumption.

[0004] In order to avoid substation tripping caused by insulator flashing, the method of regular cleaning of insulators is currently widely adopted. Taking the Beijing-Shanghai High-Speed ​​Railway as an example, heavily polluted areas are cleaned manually twice a year; general sections are cleaned manually once every three years and flushed with water once a year. Although this cleaning frequency is much higher than the requirements of the railway standard, it still cannot effectively prevent the occurrence of insulator flashing.

[0005] Due to the lack of effective data, systems and methods to support it, insulators in lightly polluted areas are cleaned when they are relatively clean, resulting in a large waste of maintenance costs; in heavily polluted areas, the cleaning frequency is insufficient and the cleaning quality does not meet the requirements.

[0006] Based on the above defects, it is necessary to detect the serious flashover on the surface of the insulator, and develop a control system based on the detection technology to carry out reasonable detection and analysis, so as to formulate a reasonable and well-founded cleaning plan and carry out targeted cleaning. Summary of the invention

[0007] In view of the above problems, the present invention provides an insulator leakage current analysis system and method. The insulator leakage current analysis system is designed to detect dust on the surface of the insulator in real time, and analyze the detection data in a microprocessor for uploading to a handheld terminal.

[0008] In order to achieve the above object, the specific technical solution adopted by the present invention is as follows:

[0009] An insulator leakage current analysis system, the key technology of which is: comprising a microprocessor MCU and a power module, the signal acquisition end of the microprocessor MCU is connected to an acquisition circuit, the acquisition circuit is used for the signal collector to obtain the insulator sensing signal, the microprocessor MCU is provided with a memory and a register, the communication end of the microprocessor MCU is connected to a wireless communication module for communicating with a handheld terminal; the timing end of the microprocessor MCU is connected to a timer;

[0010] The power module includes a low-power conversion unit, the power supply end of the low-power conversion unit is connected to a solar panel and a backup battery, the microprocessor MCU power control end and the power input end are both connected to the low-power conversion unit, and the low-power conversion unit is connected to the acquisition circuit.

[0011] Through the above design, an analysis system is established, the acquisition circuit is designed and connected to the microprocessor, and the insulator induction signal collected by the acquisition circuit is acquired, analyzed and sent by connecting to the microprocessor and various devices set in the microprocessor. In addition, a low-power conversion unit is designed to reasonably power the entire analysis process, save electricity, ensure the working time and life of the acquisition system, and reduce the number of maintenance times.

[0012] According to a further technical solution, the acquisition circuit includes a current sampling module, a signal amplification module, a waveform flip module, and an analog-to-digital conversion module; the sampling input end of the current sampling module is used to obtain the insulator induction signal, and the sampling output end of the current sampling module is connected to the signal acquisition end of the microprocessor MCU after passing through the signal amplification module, the waveform flip module and the analog-to-digital conversion module; the power drive end of the low-power conversion module is connected to the analog-to-digital conversion module, and the power output end of the low-power conversion module is connected to the current sampling module, the signal amplification module, the waveform flip module, the analog-to-digital conversion module, and the microprocessor MCU.

[0013] According to the principle of electromagnetic induction, the magnetic core generates a weak current, and the current signal is sampled and obtained using the magnetic core. After sampling, amplification, waveform inversion, and mode conversion, it is transmitted to the microprocessor to realize current signal acquisition.

[0014] In a further technical solution, the current sampling module includes an operational amplifier U14, the inverting input terminal of the operational amplifier U14 is grounded via a resistor R2 and a sampling resistor R28, the common end of the resistor R2 and the sampling resistor R28 serves as the sampling input terminal of the current sampling module, the non-inverting input terminal of the operational amplifier U14 is grounded via a resistor R1, the output terminal of the operational amplifier U14 is connected to the inverting input terminal of the operational amplifier U14 via a resistor R33, the output terminal of the operational amplifier U14 is connected to one end of a capacitor C11, and the other end of the capacitor C11 serves as the sampling output terminal of the current sampling module;

[0015] The signal amplification module includes an operational amplifier U13, the positive phase of the operational amplifier U13 is connected to one end of the resistor R22 via a resistor R23, the other end of the resistor R22 serves as an amplification input end of the signal amplification module, the amplification input end of the signal amplification module is used to be connected to the sampling output end of the current sampling module, the common end of the resistor R23 and the resistor R22 is grounded via a capacitor C39, the inverting input end of the operational amplifier U13 is grounded via a resistor R25, the output end of the operational amplifier U13 is connected to the inverting input end of the operational amplifier U13 via a resistor R26, the output end of the operational amplifier U13 is connected to one end of the capacitor C2, and the other end of the capacitor C2 serves as the amplification output end of the signal amplification module.

[0016] With the above scheme, R28 is a sampling resistor, which can be adjusted to adjust the current. The ratio of R33 and R2 is the amplification factor, and C1 is a filter capacitor to filter out the DC bias voltage. After the above acquisition circuit, the discharge signal of the insulator leakage current sampling ferromagnetic core can be converted into a weak current signal. And the size of the sampling resistor can be set and adjusted according to the environment of the insulator to accurately obtain weak current.

[0017] Since the discharge on the surface of the insulator is small, the sampling current generated by the ferromagnetic core is also very small. Therefore, after amplification by the above-mentioned signal amplification module, an electrical signal that is easier to process can be obtained.

[0018] A further technical solution is that the waveform flip module includes a comparator U15, an operational amplifier U1 and an analog switch chip U11, the non-phase input terminal of the comparator U15 is connected to one end of the resistor R24, the other end of the resistor R24 ​​and one end of the resistor R31 and one end of the resistor R18 are common ends of the three, and the common end serves as the waveform signal input end of the waveform flip module; a reversely connected diode D2 and a diode D1 are connected in parallel between the non-phase input terminal and the inverting input terminal of the comparator U15, the inverting input terminal of the comparator U15 is grounded, the output terminal of the comparator U15 is connected to the high-level power supply terminal of the comparator U15 via a resistor R17, and the output terminal of the comparator U15 is connected to the digital input terminal of the analog switch chip U11 via a resistor R32. The control input end is connected, the first normally open switch input end NO1 of the analog switch chip U11 is connected to the other end of the resistor R31, the non-inverting input end of the operational amplifier U1 is grounded, the inverting input end of the operational amplifier U1 is connected to the other end of the resistor R18, and the inverting input end of the operational amplifier U1 is also grounded via a capacitor C3, the output end of the operational amplifier U1 is connected to the inverting input end of the operational amplifier U1 via a resistor R19 and a capacitor C4 connected in parallel, the output end of the operational amplifier U1 is connected to the first normally closed switch input end of the analog switch chip U11 via a resistor R30, and the signal output end of the analog switch chip U11 serves as the waveform signal output end of the waveform flip module, which is used to connect the analog signal input end of the analog-to-digital conversion module.

[0019] The above flip circuit is used to flip the waveform of the negative axis side of the collected sinusoidal waveform to the positive axis side, and the sinusoidal wave is transformed into a "mantou wave" to facilitate subsequent signal processing and comparison. For smaller currents, it can be ignored. For larger peak currents, further processing is required due to possible error collection and other factors. Making the processed signals all positive can effectively simplify the processing steps and content.

[0020] A further technical solution is: the analog-to-digital conversion module includes an analog-to-digital conversion chip U3 and an operational amplifier U4, and the model of the analog-to-digital conversion chip U3 is AD7091R_5;

[0021] The non-phase input terminal of the operational amplifier U4 serves as the analog signal input terminal of the analog-to-digital conversion module, and is used to be connected to the waveform signal output terminal of the waveform flip module. The output terminal of the operational amplifier U4 is connected to the inverting input terminal of the operational amplifier U4. The output terminal of the operational amplifier U4 is grounded via a resistor R15 and a capacitor C23. The common terminal of the resistor R15 and the capacitor C23 is connected to the non-phase input terminal of the operational amplifier U4 via a resistor R74. The common terminal of the resistor R74 and the capacitor C23 is connected to the first signal input terminal VIN0 of the analog-to-digital conversion chip U3. The digital output terminal of the analog-to-digital conversion chip U3 serves as the digital signal output terminal of the analog-to-digital conversion module, and is used to be connected to the microprocessor MCU. The fourth signal input terminal VIN4 of the analog-to-digital conversion chip U3 is connected to the power drive terminal of the low-power conversion module.

[0022] By adopting the above scheme, the sampled analog signal can be digitally converted to data that can be recognized by the microprocessor, which is convenient for subsequent signal analysis.

[0023] A further technical solution is: the waveform signal output end of the waveform flip module is also connected to a window module, the window module includes a comparator U10A, a comparator U10B and a window reference value setting chip U9, and the model of the window reference value setting chip U9 is LTC1662CMS8;

[0024] The reference signal input terminal of the window reference value setting chip U9 is used to obtain the reference setting signal of the microprocessor MCU. The reference terminal REF of the window reference value setting chip U9 is connected to a reference voltage output chip U25, and the model of the reference voltage output chip U25 is REF3325AIDCKR;

[0025] The reference signal high level output terminal of the window reference value setting chip U9 is connected to the inverting input terminal of the comparator U10A, the non-inverting input terminal of the comparator U10A is connected to the waveform signal output terminal of the waveform flip module, and the output terminal of the comparator U10A is connected to the window high level feedback input terminal of the microprocessor MCU;

[0026] The reference signal low level output terminal of the window reference value setting chip U9 is connected to the inverting input terminal of the comparator U10B, the non-inverting input terminal of the comparator U10B is connected to the waveform signal output terminal of the waveform flip module, and the output terminal of the comparator U10B is connected to the window low level feedback input terminal of the microprocessor MCU.

[0027] The window module is used to compare and analyze the obtained steamed bun waveform data, and the microprocessor gives a threshold to the window module to obtain a setting signal of the threshold interval and feed it back to the microprocessor.

[0028] A further technical solution is: the low power conversion module includes a micro power management chip U18 and a low power supply chip U17, the micro power management chip U18 model is bq25504, and the low power supply chip U17 model is TPS61220;

[0029] The pin VIN_DC of the micro-power management chip U18 is grounded via capacitors C62 and C61, and the pin VIN_DC of the micro-power management chip U18 is grounded via resistors R40, R42, and R44. The pin VIN_DC of the micro-power management chip U18 is used to connect the solar panel and the backup battery; the pin VSTOR end of the micro-power management chip U18 serves as the power driving end of the low-power conversion module;

[0030] The pin VSTOR end of the micro-power management chip U18 is also connected to the pin VIN of the low-power power supply chip U17 via a resistor R36, and the pin L of the low-power power supply chip U17 is also connected to the pin VIN of the low-power power supply chip U17 via a capacitor L4. The pin VIN of the low-power power supply chip U17 is grounded via a capacitor C59, and the pin VOUT of the low-power power supply chip U17 is grounded via a capacitor C53. The pin VOUT of the low-power power supply chip U17 serves as the power output end of the low-power conversion module.

[0031] By adopting the above steps, the solar cell panel and the backup battery arranged on the insulator are used to power and drive the entire circuit. When the solar cell panel is insufficient in power, the backup battery is used to supply power, which effectively saves power and prolongs the service life.

[0032] An insulator leakage current analysis method, the key technology of which is:

[0033] Parameter presetting: Set the power consumption mode of the low power conversion unit: standby mode, working mode, sleep mode, stop mode; set the trigger threshold of the insulator induction signal corresponding to the switch from sleep mode to working mode; set the insulator induction signal collection period T and the number of collections n in the insulator induction signal collection period in the working mode; set the communication wake-up time t2 in the standby mode;

[0034] Establish the connection relationship of the insulator leakage current analysis system and enter the steps of the insulator leakage current analysis method:

[0035] S1, the microprocessor MCU enters the standby mode and starts the countdown of the standby mode communication wake-up time. After the standby mode communication wake-up time t2 is reached, the microprocessor MCU obtains the wake-up command sent by the handheld terminal, and the microprocessor MCU controls the wireless communication module to establish a communication connection with the handheld terminal;

[0036] S2, the microprocessor MCU generates an insulator sensing signal trigger threshold;

[0037] S3, the microprocessor MCU obtains the insulator sensing signal of the signal collector. When the insulator sensing signal exceeds the insulator sensing signal triggering threshold, the microprocessor MCU is triggered to enter the working mode. According to the insulator sensing signal acquisition period T and the number of acquisitions within the insulator sensing signal acquisition period, n Start collecting insulator induction signals to obtain working mode collection data;

[0038] S4, the microprocessor MCU compares and calculates the data collected in the working mode to obtain the sensing calculation data set of the current collection cycle;

[0039] The induction calculation data set includes at least the maximum induction value Vmax, the minimum induction value Vmin, and the induction energy value QUOTE , induction peak value Vmax-Vmin, induction average value V;

[0040] S5, the microprocessor MCU compares the induction calculation data set of the current acquisition cycle and the previous acquisition cycle to obtain the insulator flashover judgment result; and saves the insulator flashover judgment result in the memory and register;

[0041] If the induction calculation data set of the current cycle exceeds the induction calculation data set of the previous week, it is determined that the insulator is in a flashover prone state, otherwise the insulator is not in a flashover prone state;

[0042] S6, the microprocessor MCU controls the wireless communication module to send the insulator flashover judgment result in the memory and the register to the handheld terminal, and then enters the sleep mode;

[0043] S7. After the microprocessor MCU obtains the sleep interrupt signal, it enters the shutdown mode and counts down the shutdown mode setting time; after the shutdown mode countdown time is reached, it returns to step S3.

[0044] Through the above steps, the microprocessor MCU establishes a communication connection with the handheld terminal, wakes up by countdown, and combines the acquired insulator sensing signal and the generated insulator sensing signal trigger threshold to obtain whether the insulator string has a flashover phenomenon or risk. The insulator flashover judgment result is sent to the remote handheld terminal through communication. The handheld terminal can be any device that can realize communication, such as a smart phone, a computer, etc.

[0045] In a further technical solution, the insulator induction signal trigger threshold comprises an initial insulator induction signal trigger threshold and a correction insulator induction signal trigger threshold;

[0046] When the microprocessor MCU generates the initial insulator induction signal triggering threshold, the initial insulator induction signal triggering threshold induction generation time t1 is preset; after the step S2, the microprocessor MCU starts to acquire the insulator induction signal collected by the acquisition circuit, and controls the timer to start the initial trigger induction triggering threshold generation timing, and after the timer timing reaches the insulator induction signal triggering threshold induction generation time t1, the signal range of all insulator induction signals within the initial insulator induction signal triggering threshold induction generation time t1 is set to be generated as the initial insulator induction signal triggering threshold;

[0047] When the microprocessor MCU generates the correction insulator induction signal trigger threshold:

[0048] If a high peak signal appears in the data collected in the working mode in the previous collection cycle T, the insulator induction signal triggering upper limit threshold TH_H and the insulator induction signal triggering lower limit threshold TH_L in the corrected insulator induction signal triggering threshold of the current collection cycle are increased by a multiple of X1 relative to the corrected insulator induction signal triggering threshold of the previous cycle;

[0049] If a valley-peak signal appears in the working mode collected data within the previous collection cycle T, the insulator induction signal trigger upper limit threshold TH_H and the insulator induction signal trigger lower limit threshold TH_L in the corrected insulator induction signal trigger threshold of the current collection cycle are reduced by a factor of X1 relative to the corrected insulator induction signal trigger threshold of the previous cycle.

[0050] In the above scheme, the trigger threshold of the insulator induction signal is generated after real-time collection according to the on-site installation environment, and a correction link is also set to adaptively correct the trigger threshold of the insulator induction signal, improve the authenticity of the insulator needing cleaning, and improve the reliability of the entire circuit and analysis system. The whole system is highly adaptable and can be used in various insulator string installation environments.

[0051] A further technical solution is:

[0052] When the microprocessor MCU is in standby mode:

[0053] When entering standby mode, the microprocessor MCU is in a low power state; the memory and registers inside the microprocessor MCU are in a low power state; the acquisition circuit is in a low power state; the wireless communication module connected to the microprocessor MCU is in a low power state; the timer connected to the microprocessor MCU is in a working state;

[0054] When entering the standby mode and exceeding the standby mode communication wake-up time t2, the wireless communication module connected to the microprocessor MCU is in a working state; the timer connected to the microprocessor MCU is in a working state; the memory and register inside the microprocessor MCU are in a low power consumption state; the acquisition circuit is in a low power consumption state;

[0055] When the wireless communication module establishes a communication connection with the handheld terminal, the acquisition circuit and the microprocessor MCU are in working state; the wireless communication module is in working state; the memory and register are in low power consumption state;

[0056] When the microprocessor MCU is in working mode;

[0057] The microprocessor MCU, acquisition circuit, wireless communication module, timer, memory and register are all in working state;

[0058] When the microprocessor MCU is in sleep mode;

[0059] The acquisition circuit, wireless communication module, timer, memory and register are all in a low power consumption state;

[0060] When the microprocessor MCU (K) is in sleep mode, if any peak insulator sensing signal is received, the microprocessor MCU (K) is awakened by the peak insulator sensing signal and jumps to step S3;

[0061] When the microprocessor MCU is in stop mode;

[0062] The acquisition circuit, wireless communication module and timer are in a low power consumption state; the memory and register are in a working state.

[0063] It can be seen from the above scheme that under different mode environments, the internal operation of the microprocessor MCU is rationally designed, which reasonably utilizes the electrical energy and effectively saves the electrical energy.

[0064] The beneficial effects of the present invention are as follows: by designing an insulator leakage current analysis system, the acquisition circuit is designed and connected to a microprocessor, and the insulator sensing signal is uploaded to the microprocessor MCU in real time, and internal comparison analysis and transmission are realized through the microprocessor MCU. A low-power conversion unit is designed to reasonably power the entire analysis process, save electric energy, ensure the working time and service life of the acquisition system, and reduce the number of maintenance times. In addition, in combination with the insulator leakage current analysis method, the awakening of the entire system, the production of the trigger threshold of the insulator sensing signal, and the analysis and calculation of the insulator sensing signal are all reasonably decomposed into steps, so that the microprocessor MCU can run smoothly. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1 It is a system structure block diagram of the present invention;

[0066] Figure 2 It is the circuit diagram of the current sampling module in the acquisition circuit;

[0067] Figure 3 It is the circuit diagram of the signal amplification module in the acquisition circuit;

[0068] Figure 4 It is the circuit diagram of the waveform flip module in the acquisition circuit; Figure 5 It is the circuit diagram of the analog-to-digital conversion module in the acquisition circuit;

[0069] Figure 6 It is the layout circuit diagram of the microprocessor MCU in the acquisition circuit;

[0070] Figure 7 It is the circuit diagram of the low power conversion module in the acquisition circuit;

[0071] Figure 8 It is the circuit diagram of the window module in the acquisition circuit;

[0072] Fig. 9 It is a flow chart of the steps of the insulator leakage current analysis method;

[0073] Fig.10 It is a schematic diagram of the three-dimensional structure of the signal collector;

[0074] Fig.11 This is a schematic diagram of the three-dimensional structure of the signal collector installation;

[0075] Fig.12 This is the front view of the signal collector;

[0076] Fig.13 yes Fig.12 Schematic diagram of the cross section of AA;

[0077] Fig.14 yes Fig.13 A magnified schematic diagram of B;

[0078] Fig.15 It is a schematic diagram of the three-dimensional structure of the collector shell;

[0079] Fig.16 It is a schematic diagram of the three-dimensional structure of the ferromagnetic core shell;

[0080] Fig.17 It is a schematic diagram of the three-dimensional structure of the circuit chamber shell. DETAILED DESCRIPTION

[0081] The specific implementation manner and working principle of the present invention are further described in detail below with reference to the accompanying drawings.

[0082] An insulator leakage current analysis system, combined with Figure 1 It can be seen that the microprocessor MCU K and the power module D are included. The signal acquisition end of the microprocessor MCU K is connected to the acquisition circuit 4, which is used to obtain the insulator sensing signal of the signal collector. The microprocessor MCU K is provided with a memory and a register. The communication end of the microprocessor MCU K is connected to the wireless communication module W for communicating with the handheld terminal; the timing end of the microprocessor MCU K is connected to the timer;

[0083] In this embodiment, combined with Figure 1 It can also be seen that the power module D includes a low-power conversion unit D1, the power end of the low-power conversion unit D1 is connected to the solar panel D2 and the backup battery D3, the power control end and the power input end of the microprocessor MCU K are connected to the low-power conversion unit D1, and the low-power conversion unit D1 is connected to the acquisition circuit 4.

[0084] In this embodiment, the backup battery D3 is a capacitor battery.

[0085] See also Figure 1 It can also be seen that the acquisition circuit 4 includes a current sampling module 41, a signal amplification module 42, a waveform flip module 43, and an analog-to-digital conversion module 44;

[0086] The sampling input end of the current sampling module 41 is used to obtain the insulator induction signal, and the sampling output end of the current sampling module 41 is connected to the signal acquisition end of the microprocessor MCU K after passing through the signal amplification module 42, the waveform flip module 43 and the analog-to-digital conversion module 44;

[0087] The power driving end of the low power conversion module D1 is connected to the analog-to-digital conversion module 44, and the power output end of the low power conversion module D1 is connected to the current sampling module 41, the signal amplification module 42, the waveform flip module 43, the analog-to-digital conversion module 44, and the microprocessor MCU K.

[0088] In this embodiment, see Figure 2 The current sampling module 41 includes an operational amplifier U14, the inverting input terminal of the operational amplifier U14 is grounded via a resistor R2 and a sampling resistor R28, the common end of the resistor R2 and the sampling resistor R28 is used as the sampling input terminal of the current sampling module 41, the non-inverting input terminal of the operational amplifier U14 is grounded via a resistor R1, the output terminal of the operational amplifier U14 is connected to the inverting input terminal of the operational amplifier U14 via a resistor R33, the output terminal of the operational amplifier U14 is connected to one end of the capacitor C11, and the current sampling module 41 is connected to the sampling input terminal of the current sampling module 41. Figure 2 and Figure 1 It can be seen that the other end of the capacitor C11 serves as a sampling output end of the current sampling module 41 .

[0089] See also Figure 3 The signal amplification module 42 includes an operational amplifier U13, the positive phase of the operational amplifier U13 is connected to one end of the resistor R22 via a resistor R23, the other end of the resistor R22 is used as the amplification input end of the signal amplification module 42, the amplification input end of the signal amplification module 42 is used to connect to the sampling output end of the current sampling module 41, the common end of the resistor R23 and the resistor R22 is grounded via a capacitor C39, the inverting input end of the operational amplifier U13 is grounded via a resistor R25, the output end of the operational amplifier U13 is connected to the inverting input end of the operational amplifier U13 via a resistor R26, and the output end of the operational amplifier U13 is connected to one end of the capacitor C2. In this embodiment, combined with Figure 1 and Figure 3 It can be seen that the other end of the capacitor C2 serves as an amplification output end of the signal amplification module 42 .

[0090] See also Figure 4 The waveform flip module 43 includes a comparator U15, an operational amplifier U1 and an analog switch chip U11. The positive input terminal of the comparator U15 is connected to one end of the resistor R24, and the other end of the resistor R24, one end of the resistor R31 and one end of the resistor R18 are common terminals of the three, and the common terminal serves as the waveform signal input terminal of the waveform flip module 43; a diode D2 and a diode D1 connected in reverse are connected in parallel between the positive input terminal and the inverting input terminal of the comparator U15, the inverting input terminal of the comparator U15 is grounded, the output terminal of the comparator U15 is connected to the high-level power supply terminal of the comparator U15 via the resistor R17, and the output terminal of the comparator U15 is connected to the digital control input terminal of the analog switch chip U11 via the resistor R32. The first normally open switch input terminal NO1 of the analog switch chip U11 is connected to the other end of the resistor R31, the non-inverting input terminal of the operational amplifier U1 is grounded, the inverting input terminal of the operational amplifier U1 is connected to the other end of the resistor R18, the inverting input terminal of the operational amplifier U1 is also grounded via the capacitor C3, the output terminal of the operational amplifier U1 is connected to the inverting input terminal of the operational amplifier U1 via the resistor R19 and the capacitor C4 connected in parallel, the output terminal of the operational amplifier U1 is connected to the first normally closed switch input terminal of the analog switch chip U11 via the resistor R30, and the signal output terminal of the analog switch chip U11 serves as the waveform signal output terminal of the waveform flip module 43, which is used to connect the analog signal input terminal of the analog-to-digital conversion module 44.

[0091] See also Figure 5It can be seen that the analog-to-digital conversion module 44 includes an analog-to-digital conversion chip U3 and an operational amplifier U4. The model of the analog-to-digital conversion chip U3 is AD7091R_5; the positive phase input terminal of the operational amplifier U4 is used as the analog signal input terminal of the analog-to-digital conversion module 44, and is used to connect with the waveform signal output terminal of the waveform flip module 43. The output terminal of the operational amplifier U4 is connected to the negative phase input terminal of the operational amplifier U4. The output terminal of the operational amplifier U4 is grounded via a resistor R15 and a capacitor C23. The common terminal of the resistor R15 and the capacitor C23 is connected to the positive phase input terminal of the operational amplifier U4 via a resistor R74. The common terminal of the resistor R74 and the capacitor C23 is connected to the first signal input terminal VIN0 of the analog-to-digital conversion chip U3. The digital output terminal of the analog-to-digital conversion chip U3 is used as the digital signal output terminal of the analog-to-digital conversion module 44, and is used to connect with the microprocessor MCU K, see Figure 6 and Figure 5 The fourth signal input terminal VIN4 of the analog-to-digital conversion chip U3 is connected to the power driving terminal of the low power conversion module D1.

[0092] See also Figure 1 It can be seen that the waveform signal output end of the waveform flip module 43 is also connected to a window module 47 .

[0093] In this embodiment, see Figure 8 , the window module 47 includes a comparator U10A, a comparator U10B and a window reference value setting chip U9. In the present embodiment, the model of the window reference value setting chip U9 is LTC1662CMS8; the reference signal input terminal of the window reference value setting chip U9 is used to obtain the reference setting signal of the microprocessor MCU K, and the reference terminal REF of the window reference value setting chip U9 is connected to the reference voltage output chip U25. In the present embodiment, the model of the reference voltage output chip U25 is REF3325AIDCKR; the reference signal high level output terminal of the window reference value setting chip U9 is connected to the inverting input terminal of the comparator U10A, and the non-inverting input terminal of the comparator U10A is connected to the waveform signal output terminal of the waveform flip module 43. In the present embodiment, the output terminal of the comparator U10A is connected to the window high level feedback input terminal of the microprocessor MCU K;

[0094] The reference signal low level output terminal of the window reference value setting chip U9 is connected to the inverting input terminal of the comparator U10B, the non-inverting input terminal of the comparator U10B is connected to the waveform signal output terminal of the waveform flip module 43, and the output terminal of the comparator U10B is connected to the window low level feedback input terminal of the microprocessor MCU K.

[0095] See also Figure 7It can be seen that the low power conversion module D1 includes a micro power management chip U18 and a low power supply chip U17. In this embodiment, the micro power management chip U18 is bq25504. In this embodiment, the low power supply chip U17 is TPS61220;

[0096] Pin VIN_DC of the micro-power management chip U18 is grounded via capacitor C62 and capacitor C61, and pin VIN_DC of the micro-power management chip U18 is grounded via resistor R40, resistor R42, and resistor R44. Pin VIN_DC of the micro-power management chip U18 is used to connect the solar panel D2 and the backup battery D3; pin VSTOR of the micro-power management chip U18 serves as the power driving end of the low-power conversion module D1; pin VSTOR of the micro-power management chip U18 is also connected to pin VIN of the low-power power supply chip U17 via resistor R36, pin L of the low-power power supply chip U17 is also connected to pin VIN of the low-power power supply chip U17 via capacitor L4, pin VIN of the low-power power supply chip U17 is grounded via capacitor C59, pin VOUT of the low-power power supply chip U17 is grounded via capacitor C53, and pin VOUT of the low-power power supply chip U17 serves as the power output end of the low-power conversion module D1.

[0097] An insulator leakage current analysis method, firstly presetting parameters: setting the power consumption mode of a low power conversion unit D1: standby mode, working mode, sleep mode, stop mode; setting the insulator induction signal triggering threshold corresponding to the switch from sleep mode to working mode; setting the insulator induction signal collection period T and the number of collection times n in the insulator induction signal collection period in the working mode; setting the communication wake-up time t2 of the standby mode;

[0098] As this embodiment, the insulator induction signal collection period T is 2h, and the number of collection times is 12 times within 2 hours;

[0099] In this embodiment, the standby mode communication wake-up time t2 is 30s;

[0100] To establish the connection relationship of the insulator leakage current analysis system, refer to Figure 1 , steps to enter the insulator leakage current analysis method:

[0101] S1, the microprocessor MCU K enters the standby mode and starts the countdown for the communication wake-up in the standby mode. After the communication wake-up time of 30s is reached, the microprocessor MCU K obtains the wake-up instruction issued by the handheld terminal, and the microprocessor MCU K controls the wireless communication module W to establish a communication connection with the handheld terminal;

[0102] In this embodiment, when the microprocessor MCU K is in standby mode:

[0103] When entering the standby mode, the microprocessor MCU K is in a low power state; the memory and registers inside the microprocessor MCU K are in a low power state; the acquisition circuit 4 is in a low power state; the wireless communication module W connected to the microprocessor MCU K is in a low power state; the timer connected to the microprocessor MCU K is in a working state;

[0104] S2, microprocessor MCU K generates insulator induction signal trigger threshold;

[0105] S3, the microprocessor MCU K obtains the insulator sensing signal of the signal collector. When the insulator sensing signal exceeds the insulator sensing signal triggering threshold, the microprocessor MCU K is triggered and enters the working mode. According to the insulator sensing signal acquisition period T and the number of acquisitions within the insulator sensing signal acquisition period, the microprocessor MCU K is triggered and enters the working mode. n Start collecting insulator induction signals to obtain working mode collection data;

[0106] S4, the microprocessor MCU K compares and calculates the data collected in the working mode to obtain the sensing calculation data set of the current collection cycle;

[0107] The induction calculation data set includes at least the maximum induction value Vmax , minimum induction value Vmin 、Induction energy value QUOTE , peak-to-peak induction Vmax - Vmin , Sensing average value V ;

[0108] S5, the microprocessor MCU K compares the induction calculation data set of the current acquisition cycle and the previous acquisition cycle to obtain the insulator flashover judgment result; and saves the insulator flashover judgment result in the memory and the register;

[0109] If the induction calculation data set of the current cycle exceeds the induction calculation data set of the previous week, it is determined that the insulator is in a flashover prone state, otherwise the insulator is not in a flashover prone state;

[0110] When entering the standby mode and exceeding the standby mode communication wake-up time t2, the wireless communication module W connected to the microprocessor MCU K is in a working state; the timer connected to the microprocessor MCU K is in a working state; the memory and register inside the microprocessor MCU K are in a low power consumption state; the acquisition circuit 4 is in a low power consumption state;

[0111] When the wireless communication module W establishes a communication connection with the handheld terminal, the acquisition circuit 4 and the microprocessor MCU K are in working state; the wireless communication module W is in working state; the memory and the register are in low power consumption state;

[0112] When the microprocessor MCU K is in working mode;

[0113] The microprocessor MCU K, the acquisition circuit 4, the wireless communication module W, the timer, the memory and the register are all in working state;

[0114] S6, the microprocessor MCU K controls the wireless communication module W to send the insulator flashover judgment results in the memory and register to the handheld terminal, and then enters the sleep mode;

[0115] In this embodiment, when the microprocessor MCU K is in sleep mode;

[0116] The acquisition circuit 4, the wireless communication module W, the timer, the memory and the register are all in a low power consumption state;

[0117] When the microprocessor MCU (K) is in sleep mode, if any peak insulator sensing signal is received, the microprocessor MCU (K) is awakened by the peak insulator sensing signal and jumps to step S3;

[0118] S7. After the microprocessor MCU K obtains the sleep interrupt signal, it enters the shutdown mode and performs shutdown mode setting. After the shutdown mode setting is completed, it returns to step S3.

[0119] In this embodiment, when the microprocessor MCU K is in stop mode, the acquisition circuit 4, the wireless communication module W, and the timer are in low power consumption state, and the memory and register are in working state.

[0120] In this embodiment, the insulator induction signal trigger threshold includes an initial insulator induction signal trigger threshold and a correction insulator induction signal trigger threshold.

[0121] When the microprocessor MCU K generates the initial insulator induction signal triggering threshold, the initial insulator induction signal triggering threshold induction generation time t1 is preset; after the step S2, the microprocessor MCU K starts to obtain the insulator induction signal collected by the acquisition circuit 4, and controls the timer to start the initial trigger induction triggering threshold generation timing, and after the timer timing reaches the insulator induction signal triggering threshold induction generation time t1, the initial insulator induction signal triggering threshold is generated;

[0122] In this embodiment, the initial insulator induction signal trigger threshold induction generation time t1 and the insulator induction signal acquisition period T are equal, and are both set to 2 hours.

[0123] When the microprocessor MCU K generates a correction insulator induction signal triggering threshold:

[0124] If a high peak signal appears in the working mode acquisition data within the previous insulator induction signal acquisition cycle T, the insulator induction signal trigger upper limit threshold TH_H and the insulator induction signal trigger lower limit threshold TH_L in the corrected insulator induction signal trigger threshold of the current acquisition cycle are increased by a multiple of X1 relative to the corrected insulator induction signal trigger threshold of the previous cycle;

[0125] If a valley-peak signal appears in the working mode collection data within the previous insulator induction signal collection cycle T, the insulator induction signal trigger upper limit threshold TH_H and the insulator induction signal trigger lower limit threshold TH_L in the corrected insulator induction signal trigger threshold of the current collection cycle are reduced by a factor of X1 relative to the corrected insulator induction signal trigger threshold of the previous cycle.

[0126] In this embodiment, X1 is set to 0.2.

[0127] In this embodiment, see Fig.10 and 11 It can be seen that the signal collector 2 is installed on the surface of the insulator 1. A ferromagnetic core 3 is arranged inside the signal collector 2. The ferromagnetic core 3 is used to connect with the collection circuit 4 and obtain the induced current. In this embodiment, the induced current is the insulator induced signal.

[0128] from Figure 1 and Fig.13 , Fig.14 It can be seen that the signal collector 2 includes two collector shells 5 symmetrically arranged on the outer wall of the insulator 1. The two collector shells 5 are hinged after being buckled into the outer wall of the insulator 1. Each collector shell 5 includes an upper cover, a lower cover, and an outer circular side wall that are connected. The three and the outer wall of the insulator 1 surround to form a collection chamber Q.

[0129] In this embodiment, see Fig.15 A snap-fitting ear is provided at the end of the collector housing 5 .

[0130] In this embodiment, see Figure 1 One end of the two collector housings 5 ​​is not hinged by a hinge, and the other end is fastened by bolts and nuts.

[0131] In this embodiment, the signal collector 2 is installed on one side of the lifting ring end of the insulator 1. In order to adapt to the lifting ring structure of the insulator 1, after the bottom of the collector housing 5 of the signal collector 2 is buckled, its bottom abuts against the surface of the insulator 1, thereby improving the sealing of the signal collector 2.

[0132] In this embodiment, see Fig.14 , 16and 17, a semicircular ferromagnetic core housing 6 and a semicircular circuit chamber housing 7 are disposed in the collection chamber Q of each collector housing 5;

[0133] Combination Figure 15-17 It can be seen that the size and shape of the ferromagnetic core housing 6 and the circuit chamber housing 7 are adapted to the collector housing 5 .

[0134] See also Fig.13 and Fig.14 The bottom of the ferromagnetic core shell 6 is fixed on the upper cover of the collector shell 5, the top of the ferromagnetic core shell 6 is open and abuts against the bottom of the circuit chamber shell 7, the inner circular side wall of the ferromagnetic core shell 6 abuts against the outer wall of the insulator 1, the end of the ferromagnetic core shell 6 is open and abuts against the end cover of the collector shell 5, and the ferromagnetic core 3 is detachably placed inside the ferromagnetic core shell 6.

[0135] See also Fig.14 The top cover of the circuit chamber housing 7 is abutted against the upper cover of the collector housing 5, the collection circuit 4 is arranged inside the circuit chamber housing 7, a circuit cavity through hole is provided at the end of the circuit chamber housing 7, the end of the circuit chamber housing 7 is abutted against the end cover of the collector housing 5, at least one PCB circuit board 8 and a backup battery D3 are arranged inside the circuit chamber housing 7, and the collection circuit 4 is arranged on the PCB circuit board 8.

[0136] In this embodiment, a waterproof gasket is further provided on the top cover surface side of the circuit chamber housing 7 to improve the sealing performance of the circuit chamber.

[0137] It should be pointed out that the above description is not a limitation of the present invention, and the present invention is not limited to the above examples. Changes, modifications, additions or substitutions made by ordinary technicians in this technical field within the essential scope of the present invention should also fall within the scope of protection of the present invention.

Claims

1. An insulator leakage current analysis method, characterized in that: Establishing a connection relationship of an insulator leakage analysis system, comprising a microprocessor MCU (K) and a power module (D), wherein a signal acquisition end of the microprocessor MCU (K) is connected to an acquisition circuit (4), the acquisition circuit (4) is used to obtain an insulator sensing signal, a memory and a register are provided inside the microprocessor MCU (K), a communication end of the microprocessor MCU (K) is connected to a wireless communication module (W), used to communicate with a handheld terminal; and a timing end of the microprocessor MCU (K) is connected to a timer; The power module (D) comprises a low power conversion unit (D1), the power supply end of the low power conversion unit (D1) is connected to a solar panel (D2) and a backup battery (D3), the power supply control end and the power supply input end of the microprocessor MCU (K) are both connected to the low power conversion unit (D1), and the low power conversion unit (D1) is connected to the acquisition circuit (4); Parameter presetting: Set the power consumption mode of the low power conversion unit (D1): standby mode, working mode, sleep mode, stop mode; set the insulator induction signal trigger threshold corresponding to the transition from sleep mode to working mode; set the insulator induction signal acquisition period T and the number of acquisitions n within the insulator induction signal acquisition period in the working mode; set the communication wake-up time t2 in the standby mode; Steps to enter the insulator leakage current analysis method: S1, the microprocessor MCU (K) enters the standby mode and starts the countdown for the communication wake-up in the standby mode. After the communication wake-up time t2 in the standby mode is reached, the microprocessor MCU (K) obtains the wake-up instruction sent by the handheld terminal, and then the microprocessor MCU (K) controls the wireless communication module (W) to establish a communication connection with the handheld terminal; S2, microprocessor MCU (K) generates insulator induction signal trigger threshold; S3, the microprocessor MCU (K) obtains the insulator sensing signal. When the insulator sensing signal exceeds the insulator sensing signal triggering threshold, the microprocessor MCU (K) is triggered and enters the working mode. According to the insulator sensing signal acquisition period T and the number of acquisitions within the insulator sensing signal acquisition period, the insulator sensing signal acquisition period is set to the value of the insulator sensing signal. n Start collecting insulator induction signals to obtain working mode collection data; S4, the microprocessor MCU (K) compares and calculates the data collected in the working mode to obtain the sensing calculation data set of the current collection cycle; The induction calculation data set includes at least the induction maximum value Vmax, the induction minimum value Vmin, and the induction energy value , induction peak value Vmax-Vmin, induction average value V; S5, the microprocessor MCU (K) compares the induction calculation data set of the current acquisition cycle and the previous acquisition cycle to obtain the insulator flashover judgment result; and saves the insulator flashover judgment result in the memory and register; If the induction calculation data set of the current cycle exceeds the induction calculation data set of the previous week, it is determined that the insulator is in a flashover prone state, otherwise the insulator is not in a flashover prone state; S6, the microprocessor MCU (K) controls the wireless communication module (W) to send the insulator flashover judgment result in the memory and the register to the handheld terminal, and then enters the sleep mode; When the microprocessor MCU (K) is in sleep mode, if any peak insulator sensing signal is received, the microprocessor MCU (K) is awakened by the peak insulator sensing signal and jumps to step S3; S7, after the microprocessor MCU (K) obtains the sleep interrupt signal, it enters the shutdown mode and counts down the shutdown mode setting time; after the shutdown mode countdown time is reached, it returns to step S3; When the microprocessor MCU (K) is in standby mode: When entering the standby mode, the microprocessor MCU (K) is in a low power consumption state; the memory and register inside the microprocessor MCU (K) are in a low power consumption state; the acquisition circuit (4) is in a low power consumption state; the wireless communication module (W) connected to the microprocessor MCU (K) is in a low power consumption state; and the timer connected to the microprocessor MCU (K) is in a working state; When entering the standby mode and exceeding the standby mode communication wake-up time t2, the wireless communication module (W) connected to the microprocessor MCU (K) is in a working state; the timer connected to the microprocessor MCU (K) is in a working state; the memory and register inside the microprocessor MCU (K) are in a low power consumption state; and the acquisition circuit (4) is in a low power consumption state; When the wireless communication module (W) establishes a communication connection with the handheld terminal, the acquisition circuit (4) and the microprocessor MCU (K) are in a working state; the wireless communication module (W) is in a working state; and the memory and register are in a low power consumption state; When the microprocessor MCU (K) is in working mode; The microprocessor MCU (K), the acquisition circuit (4), the wireless communication module (W), the timer, the memory and the register are all in working state; When the microprocessor MCU (K) is in sleep mode; The acquisition circuit (4), wireless communication module (W), timer, memory and register are all in a low power consumption state; When the microprocessor MCU (K) is in stop mode; The acquisition circuit (4), the wireless communication module (W), and the timer are in a low power consumption state; and the memory and the register are in a working state.

2. The insulator leakage current analysis method according to claim 1, characterized in that: The insulator induction signal trigger threshold comprises an initial insulator induction signal trigger threshold and a correction insulator induction signal trigger threshold; When the microprocessor MCU (K) generates the initial insulator induction signal triggering threshold, the initial insulator induction signal triggering threshold induction generation time t1 is preset; after entering step S2, the microprocessor MCU (K) starts to acquire the insulator induction signal collected by the collection circuit (4), and controls the timer to start the initial trigger induction triggering threshold generation timing, and after the timer timing reaches the insulator induction signal triggering threshold induction generation time t1, the initial insulator induction signal triggering threshold is generated; When the microprocessor MCU (K) generates the correction insulator induction signal triggering threshold: If a high peak signal appears in the data collected in the working mode in the previous collection cycle T, the insulator induction signal triggering upper limit threshold TH_H and the insulator induction signal triggering lower limit threshold TH_L in the corrected insulator induction signal triggering threshold of the current collection cycle are increased by a multiple of X1 relative to the corrected insulator induction signal triggering threshold of the previous cycle; If a valley-peak signal appears in the working mode collected data within the previous collection cycle T, the insulator induction signal trigger upper limit threshold TH_H and the insulator induction signal trigger lower limit threshold TH_L in the corrected insulator induction signal trigger threshold of the current collection cycle are reduced by a factor of X1 relative to the corrected insulator induction signal trigger threshold of the previous cycle.

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