Flexible Printed Circuit Board Assemblies

Abstract

The present invention provides a printed circuit board assembly (1), comprising (i) a flexible printed circuit board (100) that is at least partially folded and (ii) a support member (200) that is at least partially folded, wherein: the flexible printed circuit board (100) that is at least partially folded comprises a first PCB area (110) and a second PCB area (120), wherein at least a portion of the second PCB area (120) is configured to be folded on at least a portion of the first PCB area (110); and the support member (200) that is at least partially folded is configured to support the flexible printed circuit board (100) that is at least partially folded. at least a portion of the at least partially folded support member (200), wherein the at least partially folded support member (200) includes a first support member area (210) and a second support member area (220), wherein at least a portion of the second support member area (220) is constructed to be folded on at least a portion of the first support member area (210), wherein at least a portion of the at least partially folded flexible printed circuit board (100) is constructed between the first support member area (210) and the second support member area (220), wherein the at least partially folded support member (200) is constructed to keep the at least partially folded flexible printed circuit board (100) folded.

Description

Technical Field

[0001] The invention relates to a printed circuit board assembly, a module comprising such a printed circuit board assembly and a functional unit comprising such a printed circuit board assembly. The invention also relates to a method for producing a printed circuit board assembly. Background Art

[0002] Flexible printed circuit boards are known in the art. For example, US2017 / 0241624 describes a light module for an autonomous vehicle, comprising: a metal device representing the ground, and an assembly comprising a flexible printed circuit board containing an electronic circuit and at least one support plate, the assembly being placed on the surface of the metal device, wherein the flexible board comprises: a first board segment, which carries at least one electronic component of the electronic circuit on a first face, and is in contact with the support plate through a second face opposite to the first face, so that the first board segment is rigidified, characterized in that the flexible board comprises a second board segment, which comprises at least one conductive trace located on the first face, and which is defined by a single fold relative to the first board segment, the fold causing the second board segment to contact the support plate and causing the conductive trace to form a ground connection.

[0003] US2015 / 0282304A1 discloses a flexible printed circuit having a bend, the flexible printed circuit comprising: a flexible printed circuit layer including metal traces; and a bend retaining structure attached to the flexible printed circuit layer at the bend and retaining the flexible printed circuit layer in a bent configuration to maintain the bend.

[0004] EP1247690A2 discloses an accessory consisting of a housing in which a plurality of LEDs (light emitting diodes) mounted on a PCB (printed circuit board) are arranged. The PCB has a spring mount and is secured by a latch. The lampshade glass has a surface profile that provides uniform light distribution and is secured in place by legs having pointed tips that clip into holes in the PCB. Summary of the invention

[0005] In many commercial LED lighting products, the LEDs require a substrate on which the LEDs are soldered. The most common substrates are printed circuit boards (PCBs) of the composite epoxy material (CEMx), glass fiber reinforced epoxy (FRx), or metal core PCB (MC-PCB / IMS) types. A recent trend is flexible printed circuit boards ("FPCs"), which typically include inexpensive polyimide films in the lighting industry. These FPCs can be connected to rigid substrates to provide a so-called L2 module structure, which can be more easily integrated with luminaires, similar to modules built with rigid substrates.

[0006] The main embodiments of L2 modules known so far seem to use metal substrates, usually extruded aluminum, or aluminum stamped from a plate or roll, although other rigid materials can theoretically be used. These components are manufactured roughly in two process sequences. In the first process sequence, the rigid substrate is first assembled with the FPC by glue. This process uses a curing step under compression, so the substrate must be flat and then SMT assembly ("surface mount technology", a method for attaching surface mounted devices such as LEDs to the surface of a PCB) must be performed with the LED. The result is very similar to a standard PCB, which provides limited opportunities to reduce costs below the level of traditional substrates. In the second sequence, the LEDs are assembled onto the FPC multi-board by the SMT process. The FPC multi-board is divided into individual flexible LED strips. In most cases, double-sided pressure-sensitive adhesive is used, which is then assembled with a rigid substrate. Assembly can be done using a flat rigid substrate, or using a shaped substrate such as extruded or stamped aluminum. The use of a shaped substrate can provide additional functions, such as increased rigidity, or the possibility of local gripping or clamping the FPC.

[0007] The most common (polyimide) FPCs have low tracking indices (expressed by Comparative Tracking Index “CTI” and Proof Tracking Index “PTI”), which may require larger creepage distances, especially if the module requires high voltage functionality. This increases the size and cost of the module.

[0008] The use of molded substrates increases the opportunity to add functionality or reduce costs, but the use of pressure-sensitive adhesives has some disadvantages. For example, pressure-sensitive adhesives are not considered to guarantee a permanent connection, which makes it difficult to gain approval. Pressure-sensitive adhesives are sensitive to permanent strain (think of the strain transferred from the lamp wires to the module connector) and may loosen. In addition, pressure-sensitive adhesives also reduce the cost of the module. The price is actually in the same order as the FPC itself. As an alternative to pressure bonding, the use of wet glue to assemble the FPC+LEDs to the molded substrate does not seem to have been explored. However, it is foreseeable that the use of glue may cause problems with keeping the glue away from the LED and curing the glue without applying pressure.

[0009] Aluminum is often preferred as a rigid substrate due to its better thermal conductivity. However, the substrate also needs to provide functions such as mechanical fixing, which requires the base to become larger. This may increase the cost of the substrate without taking advantage of the thermal properties of aluminum.

[0010] Therefore, one aspect of the present invention is to provide an alternative printed circuit board assembly, which preferably further at least partially eliminates one or more of the above-mentioned disadvantages. In a further aspect, the present invention provides a module comprising a printed circuit board assembly and a functional unit comprising a printed circuit board assembly, which preferably further at least partially eliminates one or more of the above-mentioned disadvantages. In another aspect, the present invention further provides a method for producing a printed circuit board assembly, which method preferably further at least partially eliminates one or more of the above-mentioned disadvantages.

[0011] It may be an object of the present invention to overcome or ameliorate at least one disadvantage of the prior art, or to provide a useful alternative.

[0012] Thus, in a first aspect, the present invention provides a printed circuit board ("PCB") assembly comprising a (at least partially) folded flexible printed circuit board. The assembly also comprises, in particular, a (at least partially) folded support. The (at least partially folded) flexible printed circuit board comprises a first PCB area and a second PCB area, in particular wherein at least part of the second PCB area is configured to be folded over at least part of the first PCB area.

[0013] The (at least partially) folded support is in particular configured to support at least part of the (at least partially) folded flexible printed circuit board. The (at least partially) folded support shoulder may (therefore) comprise a first support area and a second support area, in particular wherein at least part of the second support area is configured to be folded over at least part of the first support area. In an embodiment, at least part of the folded printed circuit is (at least partially) configured between the first support area and the second support area. In addition, the (at least partially) folded support may be configured to maintain the (at least partially) folded flexible printed circuit board folded.

[0014] The (at least part of) first PCB area (configured to be folded on the (at least part of) second PCB area) and the (at least part of) second PCB area can be configured in particular to be parallel. The flexible PCB (also indicated herein as "FPC") is configured in particular to be folded onto itself. As a result, the creepage distance (the shortest distance between two conductive elements along the surface of the PCB (insulating material)) can be increased (compared to prior art components) without increasing the overall size of the component. At the same time, increased heat dissipation can be obtained without increasing the size of the component. In addition, the component (as well as the module and functional unit of the present invention) in particular allows the application of higher voltages.

[0015] Further, the combination of the folded FPC and the thin support member can be rolled or pressed into a shape after assembling the FPC in a manner that no longer requires the use of glue or pressure sensitive adhesive. The assembly is less sensitive to electrostatic discharge (ESD) than known assemblies.

[0016] Yet another advantage of the invention is the separation of the heat spreading function and the mechanical properties. The assembly of the flexible printed circuit board and the (clamping) support can be mounted on a second support made of a cheaper (but rigid) material and shaped so as to allow easy assembly of the component itself and easy final assembly within a functional unit (such as a luminaire).

[0017] Therefore, a specific aspect of the present invention is the folding of a flexible PCB. Therefore, the present invention also provides a (at least partially) folded flexible printed circuit board itself, in particular comprising a first PCB area and a second PCB area, wherein at least part of the second PCB area is configured to be folded over at least part of the first PCB area. The flexible printed circuit board may also include in particular functional components (see below) that are functionally coupled to the flexible printed circuit board.

[0018] Flexible PCBs are known to the skilled person. A flexible PCB comprises in particular an insulating base and a conductive trace / conductive pattern provided at the base (optionally covered by another insulating layer). The conductive trace (or conductive pattern) has in particular a mixed function of heat dissipation and electrical connection. Based on a folded configuration, at least part of the conductive trace can be arranged between the insulating base of the second PCB area (at least part) and the insulating base of the first PCB area (at least part). Based on this configuration of the FPC, the creepage distance is increased while the conductive trace can be configured to extend almost over the entire length (and / or width) of the folded portion of the FCP, thereby providing increased heat dissipation via the conductive material without requiring a large printed circuit board assembly or a large module size.

[0019] The flexible printed circuit board can have any shape. In a specific embodiment, the FPC can have an elongated shape. Therefore, the FPC can have a longitudinal FPC axis. In an embodiment, the FPC is folded in a direction (substantially) perpendicular to the FPC axis. Therefore, at least part of the axis of the folded FPC and the axis of the FPC can overlap. The second PCB area can be constructed at the terminal (end) of the FPC. In an embodiment, the first PCB area can be constructed at the other terminal (end) of the FPC. In this construction, the FPC is folded in particular at the terminal (along the FPC axis) of one FPC. In an embodiment, substantially the entire second PCB area can be folded over the entire first PCB area. In an embodiment, the flexible printed circuit board is folded once. In another embodiment, the flexible printed circuit board is folded twice. The FPC can be folded multiple times. In an embodiment, multiple foldings can further increase the creepage distance and / or help fix the FPC on the substrate.

[0020] Thus, in an embodiment, the at least partially folded flexible printed circuit board may comprise a stack of layers, in particular wherein at least part of the second PCB area is constructed to be folded several times over at least part of the PCB area. In particular, all layers (a layer comprising at least part of the first PCB area and a plurality of layers comprising at least part of the second PCB area folded several times) are constructed parallel to each other.

[0021] In another specific embodiment, the FPC is folded (once or, for example, multiple times) at both terminals of the FPC (along the FPC axis). Therefore, the flexible printed circuit board may include two or more second PCB areas, especially arranged at the two terminals of the FPC (along the FPC axis). Additionally or alternatively, at least part of the multiple second PCB areas can be arranged at the same terminal of the FPC. In other embodiments, the multiple second PCB areas can be arranged at multiple positions, especially at the terminals and / or outer edges of the FPC. For example, three (or four) second PCB areas can be arranged at three (or four) positions distributed on the outer edge of the FPC. In a specific embodiment, at least part of the corresponding second PCB area is constructed to be folded on at least part of the first PCB area.

[0022] Here, in embodiments the term “second PCB area” may (therefore) in particular relate to a plurality of (different) second PCB areas.

[0023] Polyimide-based materials are commonly used for FPC. Flexible printed circuit boards may (also) particularly include polyimide-based flexible printed circuit boards. FPCs particularly allow folding without breaking. The flexible printed circuit board may, for example, have a thickness of at least 10 μm, for example a thickness of at least 15 μm, and in particular a thickness of at least 25 μm. In a further embodiment, the thickness (of the FPC) is equal to or less than 400 μm, for example equal to or less than 300 μm, or even more particularly equal to or less than 200 μm. In an embodiment, the thickness is equal to or less than 150 μm. In particular, the thickness as described above, in particular in combination with a polyimide material, may allow the FPC to be folded into particularly sharp creases. Here, the thickness of the flexible printed circuit board may also be represented by the term "first thickness". In one embodiment, the first thickness of the flexible printed circuit board is selected from the range 10-250 μm, in particular 15-200 μm, for example 15-150 μm.

[0024] The at least partially folded FPC is not necessarily folded over the total length of the (at least partially) folded FPC. In an embodiment, the folded FPC may, for example, be folded only over 10% of the length. In a further embodiment, at least 20% of the total length of the (at least partially) folded flexible printed circuit board is folded. In a further embodiment, at least 50% of the total length of the folded FPC is folded, for example at least 75% or almost 100% of the (at least partially) total length of the folded FPC is folded. Here, the percentage of the total length that is folded may particularly relate to the percentage of the total length of the at least partially folded flexible printed circuit board in which the first PCB area is folded on the second PCB area. Therefore, if almost 100% of the total length of the folded FPC is folded, this may mean that the second PCB area is constructed to be substantially completely oriented toward the entire first PCB area. It may particularly relate to a construction in which the folded flexible printed circuit board comprises at least two layers (the second PCB area folded on the first PCB area), substantially covering the total length of the folded FCB. Therefore, the total length of the folded flexible printed circuit board is approximately half of the total length of the flexible printed circuit board (before folding). In certain embodiments, the total length of the second PCB area (in total) may be substantially the same as the total length of the first PCB area (along the FPC axis). It should be understood that in embodiments comprising a second PCB area folded multiple times on the first PCB area, the total length of the second PCB area (in total) may be greater than the total length of the first PCB area, and in particular the total length of the folded flexible printed circuit board may be less than half the total length of the (unfolded) flexible printed circuit board.

[0025] In an embodiment, folding the FPC at the location of the conductive traces may be undesirable. Therefore, the conductive traces may be constructed in particular (only) at the first PCB area. However, in further embodiments, the second PCB area may also include conductive traces. Therefore, heat diffusion may be further improved. In a specific embodiment, the conductive traces constructed at the second PCB area (at least in part), which are constructed to be folded over the first PCB area (at least in part), may be constructed to have the same potential (voltage) as the tracks at the first PCB area that they may face. In particular, the facing tracks are constructed to have substantially the same potential.

[0026] In a further embodiment, the FPC may comprise a functional component, in particular functionally coupled to the FPC. The functional component may, for example, comprise a light source, a sensor or, for example, an actuator, etc. In an embodiment, the functional component comprises a solid-state light source, such as an LED (light emitting diode). The terms "functional component", "light source", "solid-state light source", etc. may particularly relate to a plurality of (different) functional components, (solid-state) light sources, etc., respectively. The flexible printed circuit board particularly comprises a plurality of functional components. In one embodiment, the flexible printed circuit board comprises an array of solid-state light sources, such as an array of LEDs. The solid-state light source emits solid-state light source light. Preferably, less than 20% of the solid-state light source light is blocked by the partially folded flexible printed circuit board and / or the at least partially folded support. More preferably, less than 10% of the solid-state light source is blocked by the at least partially folded flexible printed circuit board and / or the at least partially folded support. Most preferably, less than 5% of the solid-state light source light is blocked by the at least partially folded flexible printed circuit board and / or the at least partially folded support.

[0027] In further embodiments, the printed circuit board may include or may be a solid state lighting lighting arrangement.

[0028] In a further embodiment, the solid state light source emits solid state light source light. The solid state light source is preferably white light. The white light preferably has a color temperature in the range of 2000 to 8000 K. The white light preferably has a color rendering index (CRI) of at least 80.

[0029] In further embodiments, the functional component may be configured at the first PCB area, wherein at least a portion of the first PCB area and at least a portion of the second PCB area are configured in parallel.

[0030] In further embodiments, a functional component may be constructed at a first PCB area, wherein at least a portion of the first PCB area and at least a portion of the second PCB area are constructed to be parallel and in such a manner that at least two surface sections of the at least partially folded flexible PCB, in particular, at least two surface sections of the same surface of the at least partially folded flexible PCB, are in thermal and / or mechanical contact with each other.

[0031] In further embodiments, at least a portion of the first support region and at least a portion of the second support region may be configured to be parallel.

[0032] In further embodiments, the at least partially folded flexible printed circuit board may be configured to fold onto itself.

[0033] In a further embodiment, the at least partially folded flexible PCB has a first major PCB surface and a second major PCB surface opposite the first major PCB surface, and the functional components can be arranged on the first major surface of the at least partially folded flexible PCB. Preferably, at least a portion of the first support member area and at least a portion of the second support member area can be configured to be parallel. Preferably, at least a portion of the first major PCB surface can face another portion of the first major PCB surface.

[0034] In a further embodiment, the at least partially folded flexible PCB may have a folded portion. Preferably, the at least partially folded flexible PCB may provide a folded portion in such a way that at least two surface sections of the at least partially folded flexible PCB, in particular at least two surface sections of the same surface of the at least partially folded flexible PCB, contact each other.

[0035] In further embodiments, the at least partially folded flexible printed circuit board may include one or more (sharp) PCB folding lines. The (sharp) PCB folding lines may divide the at least partially folded flexible printed circuit board into a first PCB area and (multiple) second PCB areas.

[0036] In further embodiments, the at least partially folded support may comprise one or more (sharp) support folding lines. The (sharp) support folding lines may divide the at least partially folded support into a first support region and second support region(s).

[0037] In further embodiments, the (average) distance between the first PCB area and the second PCB area may be less than 5 mm, in particular less than 3 mm, such as 1 or 0.1 mm. The effect obtained is a compact PCB assembly.

[0038] In further embodiments, the (solid state) light source may be in thermal contact (via (the (first PCB area) of the at least partially folded flexible printed circuit board)) with the at least partially folded support (the first support area).

[0039] In a further embodiment, the (solid-state) light source may be in thermal contact with the component support (via the at least partially folded flexible printed circuit board (first PCB area)) (and via the at least partially folded support (first support area)). In a further embodiment, the functional component is constructed at the first PCB area and is a solid-state light source.

[0040] The functional component can be functionally connected to the conductive traces of the flexible printed circuit board in particular, and can be connected to another electrical component via the conductive traces. The functional component can be connected to an electrical periphery, such as a power supply, a driver, a transformer, etc., for example, via conductive traces. The electrical periphery can be arranged in particular outside the flexible printed circuit board. Therefore, the FPC can also include a connector for connecting to the electrical periphery. For example, these connectors can be arranged at one or more ends of the folded FPC. In addition, in an embodiment, the FPC may include a connector end known in the art. In an embodiment, the FPC connector end can be connected to another connector constructed at the component support (see below), for example, using a ZIF connector type or an edge card connector type.

[0041] In an embodiment, the functional component is constructed in the first PCB area (and in particular is functionally connected to one of the conductive traces). The functional component is in particular at least partially not covered by the flexible printed circuit board. Furthermore, in a further embodiment, the functional component is at least partially not covered by the support (in particular not covered by the second support area). In an embodiment, the second PCB area is not (constructed) folded in the position of the first PCB area including the functional component. In a further embodiment, the second PCB area comprises an opening, which can be arranged on the functional component (when folded in the position of the first PCB area including the functional component). The opening may, for example, comprise a through hole or a groove in an edge (of the flexible printed circuit board, in particular in the second PCB area).

[0042] Therefore, in an embodiment, the flexible printed circuit board, in particular the second PCB area, comprises an opening constructed on the functional component. The functional component is in particular at least partially not covered by the flexible printed circuit board ((n) or support). Such an opening, in particular in the FPC, can also be advantageously used during the method of manufacturing the assembly. The combination of the functional unit and the opening can, for example, facilitate some automatic alignment of the second PCB area on the first PCB area during folding (see below). The term "opening" can relate to a plurality of (different) openings. The flexible printed circuit board can in particular include a plurality of (different) openings, which are configured to be arranged on a plurality of functional components, for example on an LED array.

[0043] In a particular embodiment, the at least partially folded flexible printed circuit board can be connected to the support as described above, for example by glue, tape or other connecting elements such as screws. However, in a particular embodiment, the at least partially folded flexible printed circuit board is clamped to the support, in particular to further reduce costs.

[0044] Therefore, in an embodiment, the (at least partially folded) flexible printed circuit board is configured to be combined with the (at least partially folded) support to provide a printed circuit board assembly. The support is particularly configured to clamp the folded circuit board. The FCP and the support can be particularly configured to be similar, in particular at least partially consistent. In addition, in an embodiment, the at least partially folded support is configured to support at least part of the FPC. In addition, in particular at least part of the second support area is configured to be folded on at least part of the first support area of ​​the support, wherein at least part of the at least partially folded flexible printed circuit board is constructed between the first support area and the second support area. Due to this configuration, the support can hold (or fix) the flexible PCB (between the first support area and the second support area). The at least partially folded support can maintain the at least partially folded FPC in a constant position.

[0045] The at least partially folded support is further particularly configured to maintain the at least partially folded flexible printed circuit board folded. Based on this configuration, the folded FPC is particularly prevented from translating along the axis of the FPC. The FPC is particularly configured to be immovable relative to the support in the assembly. However, in an embodiment, the FPC can (still) (only) translate in a direction perpendicular (or transverse) to the axis of the FPC. In other embodiments, the support and the FPC can (both) be folded (or pass through the axis) in a direction parallel to the longitudinal axis of the PCB. Therefore, in a specific embodiment, the FPC can (optionally) translate in a direction parallel to the FPC axis, or even transverse to the FPC axis. In another embodiment, the flexible printed circuit board is fixed in the printed circuit board assembly.

[0046] In order to further minimize the movement of the FPC relative to the support, the support and the FPC can be folded at multiple positions of the FPC (and the support), such as two (especially relative) positions. Therefore, in an embodiment, the support includes multiple second support areas. In particular, each of the second support areas is (also) constructed at the terminal or outer edge of the support. At least part of the corresponding second support area can be configured to be folded on at least part of the first support area, wherein at least part of the at least partially folded flexible printed circuit board is constructed between the first support area and the second support area.

[0047] In this context, the term "second support region" may therefore also refer to a plurality of second support regions.

[0048] In a particular embodiment, the second support region may also provide an optical function. The second support region may, for example, be reflective. The second support region may include a minimum reflectivity (ratio of the radiant flux reflected by the surface to the incident radiant flux) of at least 80%, in particular at least 85%, for example at least 90%.

[0049] In order to allow the support to be folded, the support may in particular include a plastically deformable material. In particular, the plastically deformable material may be formed in a specific shape during processing and continuously maintain the shape. Therefore, the deformable material of the support can be folded and can be continuously used to clamp or fix the flexible printed circuit board. The plastically deformable material may in particular be selected to allow it to be extruded or acted into a shape that allows it to clamp the second PCB part and the first PCB part together. The plastically deformable material may also be in particular selected as a thermally conductive material to allow heat diffusion. In an embodiment, the deformable material is selected to have a thermal conductivity of at least 200W-mK, for example at least 250W-mK, in particular at least 300W-mK. In an embodiment, the support may include aluminum. In an alternative embodiment, the support includes copper. The support may also in particular have a (second) support thickness (perpendicular to the support length) equal to or greater than 50μm, for example equal to or greater than 75μm, in particular equal to or greater than 100μm. The second thickness is in particular less than 2mm, for example less than 1mm. The second thickness may be, for example, equal to or less than 750 μm, in particular equal to or less than 500 μm. The second thickness is in particular selected from the range of 100-500 μm. The range of the second thickness as described herein may provide a preferred flexibility for clamping the flexible printed circuit board. It may further allow plastic deformation without breaking. For cost-saving reasons, its thickness may in particular not exceed the thickness described herein. Here, the thickness of the support is in particular referred to as the "second thickness" to distinguish it from the first thickness of the flexible printed circuit board.

[0050] The printed circuit board can in particular be configured to be easily mounted in the component support. The component support can be comprised by the functional unit described herein. Additionally or alternatively, a combination of the printed circuit board and the component support can be mounted in the functional unit.

[0051] In an embodiment, the printed circuit board assembly and the assembly support may include complementary fastening elements, which are configured to mount the printed circuit board assembly on the assembly support. The fastening elements may be particularly configured to fasten the printed circuit board assembly to the assembly support. In a further embodiment, the assembly support may be configured to slide the printed circuit board assembly to the assembly support, or to fix the printed circuit board to the assembly support. In yet another embodiment, the assembly support may include fastening elements, which are configured to slide and / or rotatably receive the printed circuit board assembly. The printed circuit board assembly may particularly include threads or sliding elements to connect with the fastening elements of the assembly support. The assembly support may be particularly configured to carry a printed circuit board and to couple the printed circuit board to the assembly support.

[0052] In a particular embodiment, the assembly support comprises a resilient element for (reversibly) mounting the printed circuit board on the assembly support. The resilient element may, for example, comprise a spring element and / or a clip fastener. The assembly support, in particular the resilient element, is in particular configured for fixing the printed circuit board assembly to the assembly support, in particular to a support region of the assembly support.

[0053] Therefore, the present invention also provides a module, which includes a printed circuit board assembly and an assembly support as described herein. The assembly support includes a support area and in particular a plurality of elastic elements. In an embodiment, the support area (alone) can define a bearing position for carrying the printed circuit board assembly. In a further embodiment, the support area and the elastic element (together) define a bearing position for carrying the printed circuit board assembly. In an embodiment, the elastic element is configured to hold the printed circuit board assembly and the assembly support together. The elastic element can be particularly configured to provide a (elastic) force, forcing the printed circuit board to abut against the assembly support, in particular against the support area. In a further embodiment, the elastic element is configured to press the printed circuit board assembly against the assembly support area.

[0054] The assembly support may also be configured as a heat sink for heat generated at the printed circuit board assembly. In addition, the assembly support may be configured to provide robustness / rigidity to the module. In an embodiment, the assembly support, for example, comprises steel, in particular made of steel. In a further embodiment, the assembly support comprises aluminum, in particular made of aluminum. In yet another embodiment, the assembly support comprises a plastic support. The assembly support is in particular made of a material that is cheaper than the support material. In an embodiment, the assembly support is made of a single material. The assembly support may be formed, for example, by pressing, rolling, punching, extrusion or, for example, injection molding. Therefore, an embodiment of the assembly support may include a single piece. Therefore, in a particular embodiment, the assembly support comprises steel, and the assembly support is a single piece. The assembly support may also in particular have an assembly support thickness equal to or greater than 100 μm, for example equal to or greater than 250 μm. The thickness of the assembly support may in particular be less than 5 mm, for example less than 2 mm. In an embodiment, the assembly support thickness may in particular be equal to or less than 1 mm. However, thicker assembly supports may also be used.

[0055] The module and / or the component support can also be configured to be installed in a functional unit. Therefore, the module can also include a first mechanical fixing element for fixing to a second mechanical fixing element of the functional unit. In a further embodiment, the component support can include a first mechanical fixing element for fixing to a second mechanical fixing element of the functional unit. The first mechanical fixing element and the second mechanical fixing element are in particular complementary. The first mechanical fixing element can, for example, include an opening for accommodating a second mechanical fixing element including a protrusion or a hook. The first and second mechanical fixing elements can further be configured to be rotationally connected and, for example, define a bayonet mounting together. Additionally or alternatively, the first mechanical fixing element and the second mechanical fixing element (both) include an opening configured to receive a pin or plug for connecting the first mechanical fixing element and the second mechanical fixing element. In a further embodiment, one of the first and second mechanical fixing elements includes a pin for snapping the respective fixing element into the other fixing element.

[0056] In this context, the terms “first mechanical fixing element” and “second mechanical fixing element” may relate in particular to a plurality of (different) (first and second) mechanical fixing elements.

[0057] In a further aspect, the present invention provides a functional unit comprising a housing and a flexible printed circuit board. In particular, the functional unit comprises a housing and a printed circuit board assembly as described herein. In an embodiment, the functional unit may comprise a lighting device. In a further embodiment, the functional unit comprises a camera or, for example, a medical device. The functional unit, in particular the lighting device, may in particular comprise a lamp. In an embodiment, the printed circuit board assembly comprises a solid-state light source as described herein.

[0058] The housing can be configured in particular to shield the electronically conductive components of the printed circuit board assembly. The printed circuit board assembly is in particular (substantially completely) surrounded by the housing. However, in embodiments, the housing can include openings, for example, in order to be able to reach functional components. In particular, the printed circuit board assembly is at least partially surrounded by the housing.

[0059] As described above, the modules described herein may include a component support and may be (directly) connected to a housing described herein, while in other embodiments the component support may consist of the housing and the printed circuit board described herein may be connected to the component support of the housing.

[0060] Therefore, in further embodiments, at least a portion of the housing is configured as a component support.

[0061] In a further embodiment, the functional unit further comprises a second mechanical fixing element, in particular wherein the second mechanical fixing element is functionally coupled to the housing. The second mechanical fixing element may be part of the housing. The second mechanical fixing element may also be indirectly coupled to the housing, for example during installation of the module in the housing. Thus, the functional unit may in particular comprise a module (comprising the first mechanical fixing element), wherein the first mechanical fixing element of the module and the second mechanical fixing element of the functional unit are configured to hold the module and the housing together.

[0062] In a particular embodiment, the at least partially folded support or at least the second support area can be part of the shell, or can be defined by the shell. In an embodiment, at least part of the shell is configured as the at least partially folded support, or at least the second support area. In addition, at least part of the shell can be configured as the first support area. The at least partially folded support, in particular the second support area, can, for example, be pressed into or punched out of the shell and / or can be configured during forming, for example, by pressing into the shell. Therefore, the first support area and the second support area can be at least part of the shell, or can define at least part of the shell.

[0063] Therefore, in a specific embodiment, the present invention provides a functional unit comprising a housing and an at least partially folded flexible printed circuit board, in particular wherein the at least partially folded flexible printed circuit board comprises a first PCB area and a second PCB area, wherein at least part of the second PCB area is configured to be folded over at least part of the first PCB area. In particular, the housing can be configured to support at least part of the at least partially folded flexible printed circuit board, wherein the housing comprises a first support member area and a second support member area, wherein at least part of the second support member area is configured to be folded over at least part of the first support member area, wherein at least part of the at least partially folded flexible printed circuit board is configured between the first support member area and the second support member area, and wherein the housing is configured to keep the at least partially folded flexible printed circuit board folded.

[0064] In particular, the flexible printed circuit board comprises a functional component which is functionally coupled to the flexible printed circuit board, in particular wherein the functional component is at least partially not covered by the flexible printed circuit board or the second support area. The flexible printed circuit board is in particular at least partially surrounded by the housing.

[0065] In another aspect, the present invention further provides a method for manufacturing a printed circuit board assembly, in particular a printed circuit board assembly as described herein. The method comprises: providing a flexible printed circuit board and a support, wherein the flexible printed circuit board comprises a first PCB area and a second PCB area, and wherein the support comprises a first support area and a second support area, in particular wherein the support comprises a plastically deformable material. The method further comprises in particular a folding phase, wherein the folding phase in particular comprises PCB folding and support folding.

[0066] According to an embodiment, the method for producing a printed circuit board assembly also includes functionally coupling a functional component to an at least partially folded flexible printed circuit board, so that the functional component is not covered by the at least partially folded flexible printed circuit board, nor is it covered by an at least partially folded support; wherein the functional component is constructed in the first PCB area and includes a solid-state light source.

[0067] PCB folding particularly comprises: folding at least part of the second PCB area on at least part of the first PCB area to provide an at least partially folded flexible printed circuit board, in particular, wherein at least part of the first PCB area and at least part of the second PCB area are constructed in parallel. Support folding particularly comprises: folding at least part of the second support member area on at least part of the first support member area to provide an at least partially folded support, in particular, wherein at least part of the at least partially folded flexible printed circuit board is constructed between the first support member area and the second support member area, and in particular wherein at least part of the first support member area and at least part of the second support member area are constructed in parallel. In an embodiment, PCB folding may precede support folding. In a further embodiment, support member folding may be combined with PCB folding. In particular, support member folding comprises PCB folding.

[0068] In a further embodiment, the flexible printed circuit board comprises a plurality of second PCB regions, in particular the support member (also) comprises a plurality of second support member regions. Thus, in an embodiment, the PCB folding may comprise folding at least part of the plurality of second PCB regions on at least part of the first PCB region (to provide an at least partially folded flexible printed circuit board, in particular wherein at least part of the plurality of first PCB regions and at least part of the second PCB region are constructed in parallel. Furthermore, in an embodiment, the support member folding stage may comprise folding at least part of the plurality of second support member regions onto at least part of the first support member region to provide at least partially folded support, in particular wherein at least part of the at least partially folded flexible printed circuit board is constructed between the first support member region and the second support member region, and in particular wherein at least part of the first support member region and at least part of the second support member region are constructed in parallel. In an embodiment, the plurality of second support member regions and the plurality of second PCB regions may also be folded in sequential steps (repeating the PCB folding before the support folding, or comprising repeated support folding of the PCB folding).

[0069] In an embodiment, the at least partially folded support (provided) comprises a metal, in particular an aluminum plate. In a further embodiment, the support comprises a metal, in particular an aluminum, U-shaped profile. The folding may in particular comprise pressing and / or rolling. In a continuous assembly process, in particular the folding may comprise rolling. During the combined or continuous folding, the FPC is at least partially clamped between the second support area and the first support area.

[0070] The terms "upstream" and "downstream" relate to the arrangement of items or features relative to the propagation of light from a light generating device (here in particular a light source), wherein, relative to a first position in a light beam from the light generating device, a second position in the light beam close to the light generating device is "upstream" and a third position in the light beam away from the light generating device is "downstream".

[0071] The lighting device can be applied or partially applied in, for example, office lighting systems, home application systems, store lighting systems, household lighting systems, accent lighting systems, spotlight systems, theater lighting systems, fiber optic application systems, projection systems, self-luminous display systems, pixel display systems, segmented display systems, warning sign systems, medical lighting application systems, indicator sign systems, decorative lighting systems, portable systems, automotive applications, (outdoor) road lighting systems, urban lighting systems, greenhouse lighting systems, horticultural lighting or LCD backlighting.

[0072] As mentioned above, the lighting unit can be used as a backlight unit in an LCD display device. Therefore, the present invention also provides an LCD display device, which includes a lighting unit as defined herein, configured as a backlight unit. The present invention also provides a liquid crystal display device including a backlight unit on the other hand, wherein the backlight unit includes one or more lighting devices defined herein.

[0073] Preferably, the light source is a light source that emits (light source light) at least a wavelength selected from the range of 200-490 nm during operation, in particular a light source that emits at least a wavelength selected from the range of 400-490 nm during operation, more particularly in the range of 440-490 nm. The light may be partly used for wavelength converter nanoparticles (see below). Thus, in a particular embodiment, the light source is configured to generate blue light.

[0074] The term "light source" may refer to semiconductor light emitting devices, such as light emitting diodes (LEDs), resonant cavity light emitting diodes (RCLEDs), vertical cavity laser diodes (VCSELs), edge emitting lasers, etc. The term "light source" may also refer to organic light emitting diodes, such as passive matrix (MMOLED) or active matrix (AMOLED). In a specific embodiment, the light source includes a solid-state light source (such as an LED or a laser diode). In one embodiment, the light source includes an LED (light emitting diode). The term LED may also refer to a plurality of LEDs. In addition, the term "light source" may also refer to a so-called chip-on-board (COB) light source in an embodiment. The term "COB" refers in particular to an LED chip in the form of a semiconductor chip, which is neither packaged nor connected, but is directly mounted on a substrate, such as a PCB. Therefore, a plurality of semiconductor light sources may be constructed on the same substrate.

[0075] In an embodiment, COB is a plurality of LED chips constructed together as a single lighting module. The term "light source" may also refer to a plurality of (substantially the same (or different)) light sources, such as a 2-2000 solid-state light source. In an embodiment, the light source may include one or more micro-optical elements (micro-lens arrays), downstream of a single solid-state light source, such as an LED, or downstream of a plurality of solid-state light sources (e.g., shared by a plurality of LEDs). In an embodiment, the light source may include an LED with on-chip optical elements. In an embodiment, the light source includes a pixelated single LED (with or without optical elements) (on-chip beam control is provided in an embodiment).

[0076] The phrase "different light sources" or "multiple different light sources" and similar phrases may refer to multiple solid-state light sources selected from at least two different bins in embodiments. Similarly, the phrase "same light source" or "multiple same light sources" and similar phrases may refer to multiple solid-state light sources selected from the same bin in embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings in which corresponding reference characters indicate corresponding parts, and in which:

[0078] Figure 1 An embodiment of a printed circuit board assembly of the present invention is schematically depicted;

[0079] Figure 2 An embodiment of the module is schematically described; and

[0080] Figure 3 The functional units according to the invention are schematically depicted.

[0081] The schematic diagrams are not necessarily drawn to scale. DETAILED DESCRIPTION

[0082] Figure 1 An embodiment of a printed circuit board assembly 1 is schematically depicted. The printed circuit board assembly 1 comprises an at least partially folded flexible printed circuit board 100 and an at least partially folded support 200. The at least partially folded flexible printed circuit board 100, also referred to herein as "FPC" 100, may in particular be based on polyimide. The FCB comprises a first PCB area 110 and a second PCB area 120, wherein at least a portion of the second PCB area 120 is configured to be folded over at least a portion of the first PCB area 110. The assembly 1 may comprise exactly one first PCB area 110 folded over the second PCB area 120. The assembly 1 may also comprise a plurality of second PCB areas 120. Figure 1The embodiment shown in FIG. 1 , for example, includes two second PCB regions 120; a first second PCB region 120 located on the right side of the figure and another second PCB region 120 located on the left side of the figure; both are folded over the first PCB region 110. The second PCB region 120 is particularly configured at the end of the FPC 100. In an embodiment (not depicted), only one end (or edge) includes the second PCB region 120.

[0083] The at least partially folding support member 200 is configured to support at least a portion of the at least partially folded flexible printed circuit board 100 . Figure 1 The at least partially folded support 200 in the embodiment includes a first support region 210 and two second support regions 220. At least part of the second support region 220 is (configured) folded (at least partially) over the first support region 210. Thus (at least part of) the at least partially folded flexible printed circuit board 100 is configured between the first support region 210 and the second support region 220. In this way, the folded support 200 keeps the at least partially folded flexible printed circuit board 100 folded.

[0084] Figure 1 The embodiment in the embodiment further comprises a functional component 300, in particular a solid-state light source 310, which is functionally coupled to the flexible printed circuit board 100, in particular to the conductive traces 150 of the FPC 100. In order not to block any source light emitted by the solid-state light source 310, the functional component 300 is at least partially not covered by the flexible printed circuit board 100 or the support 200. Therefore, the flexible printed circuit board 100 comprises an opening 130 constructed on the functional component 300.

[0085] In the figure, a first thickness h1 of the FPC 100 and a second thickness h2 of the support 200 are also depicted. In an embodiment, the first thickness h1 is selected from the range of 100-500 μm. The second thickness h2 can in particular be selected from the range of 100-500 μm. Furthermore, in order to produce the assembly 1, the support 200 can in particular comprise a plastically deformable material comprising aluminum or copper.

[0086] The configuration of the printed circuit board assembly 1 can advantageously provide an increased creepage distance 160, which is the shortest length connecting two conductive elements to each other on the surface of the FPC 100. Figure 1In the embodiment of the present invention, the creepage distance 160 is particularly the distance between the conductive traces 150 of the FPC 100 and the second support member area 120. If the second support member area 120 is not conductive, the creepage distance 160 will be further increased. However, the conductive clamping support 200 can now also provide shielding around the solid-state light source 310, which provides enhanced protection against ESD (electrostatic discharge) damage through processing. Therefore, by folding the second PCB area 120 on the first PCB area, the conductive traces 150 are shielded to a larger range compared to the unfolded flexible printed circuit board, and the creepage distance 160 is extended. At the same time, the conductive traces 150 of the FPC 100 can be further extended from the solid-state light source 310 (closer to the support member 200), thereby expanding the heat dissipation capacity of the FPC 100.

[0087] The printed circuit board assembly 1 can be manufactured by a method for manufacturing a printed circuit board assembly 1 (of the present invention). In the method, a flexible printed circuit board 100 and a support 200 are provided, in particular wherein the support 200 comprises a plastically deformable material. The flexible printed circuit board 100 may comprise a first PCB area 110 and (at least one) second PCB area 120, and the support 200 may comprise a first support area 210 and (at least one) second support area 220. The method also comprises a folded flexible printed circuit board 100 and a folded support 200.

[0088] During PCB folding, at least a portion of the second PCB region 120 is folded over at least a portion of the first PCB region 110 to provide an at least partially folded flexible printed circuit board 100. During support folding, at least a portion of the second support region 220 is folded over at least a portion of the first support region 210 to provide an at least partially folded support 200, wherein at least a portion of the at least partially folded flexible printed circuit board 100 is constructed between the first support region 210 and the second support region 220. In an embodiment, PCB 100 is folded first and support 200 is then folded. However, in a particular embodiment, the folding of support 200 and PCB 100 is performed simultaneously.

[0089] like Figure 1 As shown, the functional component 300 is configured at the first PCB area 110 , wherein at least a portion of the first PCB area 110 and at least a portion of the second PCB area 120 are configured to be parallel.

[0090] like Figure 1 As shown, the at least partially folded flexible printed circuit board 100 is configured to be folded onto itself.

[0091] like Figure 1As shown, the at least partially folded flexible PCB 100 has a first main PCB surface and a second main PCB surface, opposite to the first main PCB surface. The functional component 300 is arranged on the first main surface of the at least partially folded flexible PCB 100.

[0092] like Figure 1 As shown, the (solid state) light source 310 may be in thermal contact with at least part of the first support area 210 of the folded support 200 via the first PCB area 110 of the at least partly folded flexible printed circuit board 100 .

[0093] like Figure 1 As shown, in further embodiments, the (solid state) light source 310 may be in thermal contact with the assembly support 400 via the first PCB area 110 of the at least partially folded flexible printed circuit board 100 and the first support area 210 of the at least partially folded support 200 .

[0094] exist Figure 2 In FIG. 1 , an embodiment of a module 10 according to the present invention is depicted. The module 10 comprises Figure 1 The printed circuit board assembly 1 and the assembly support 400 are shown. The assembly support 400 includes a support area 410 and a plurality of elastic elements 420, which together define a support position 430 for supporting the printed circuit board assembly 1. The elastic elements 420 are configured to press the printed circuit board assembly 1 at the assembly support 400.

[0095] In an embodiment, the assembly support 400 may comprise steel or another metal, in particular to provide a heat dissipation function for the module.The assembly support 400 is in particular made of one piece of (raw) material and may be a single-piece body.

[0096] Furthermore, in the module 10, the printed circuit board assembly 1 in particular can provide a first step towards heat spreading while minimizing the use of more expensive materials such as aluminum. The assembly support 400 can provide further heat conduction as well as additional functionality.

[0097] Figure 2 Two first mechanical fixing elements 440 of the module 10 are further schematically depicted. In the depicted embodiment, the first mechanical fixing elements 440 comprise openings or punchings. Thus, the first mechanical fixing elements can be fixed, for example, to the functional unit 1000 (see Figure 3 ) of the second mechanical fixing element 1040, for example, comprises a protrusion that can match the opening of the first mechanical fixing element 440, in particular a spring-like element.

[0098] Figure 3An embodiment of a functional unit 1000 described herein is schematically depicted. The functional unit 1000 comprises a housing 1010 and a printed circuit board assembly 1. In the depicted embodiment, the functional unit 1000 comprises a luminaire, the printed circuit board assembly 1 comprising a solid-state light source 310. The housing 1010 in particular at least partially surrounds the printed circuit board assembly 1.

[0099] In an embodiment, Figure 1 The printed circuit board assembly 1 shown can be coupled to a housing 1010 of a functional unit 1000. Thus, the housing can include an assembly support 400. In particular, at least a portion of the housing 1010 can thus be configured as an assembly support 400. In further embodiments, as Figure 2 The module 10 shown can be coupled to a housing 1010 of a functional unit 1000. In this embodiment, the functional unit 1000 also includes, in particular, a second mechanical fixing element 1040, wherein the second mechanical fixing element 1040 is functionally coupled to the housing 1010. Figure 3 , a pair of second mechanical fixing elements 1040 are schematically depicted, comprising plugs or clickable elements connected to the housing 100 and mating with the first mechanical fixing 440 of the module 10. Thus, the first mechanical fixing element 440 of the module 10 and the second mechanical fixing element 1040 of the functional unit 1000 are configured to hold the module 10 and the housing 1010 together.

[0100] The term "majority" refers to two or more. Those skilled in the art will understand the terms "substantially" or "substantially" and similar terms herein. The terms "substantially" or "substantially" may also include embodiments with "completely", "completely", "all", etc. Therefore, in an embodiment, the adjectives substantially or substantially may also be deleted. Where applicable, the term "substantially" or the term "substantially" may also relate to 90% or higher, such as 95% or higher, in particular 99% or higher, even more in particular 99.5% or higher, including 100%.

[0101] The term "comprising" also includes wherein the term "comprising" means "consisting of.

[0102] The term "and / or" particularly relates to one or more of the items mentioned before and after "and / or". For example, the phrase "item 1 and / or item 2" and similar phrases may relate to one or more of item 1 and item 2. The term "comprising" may in one embodiment mean "consisting of" but in another embodiment may also mean "comprising at least the defined species and optionally one or more other species".

[0103] Furthermore, the terms "first", "second", "third", etc. in the specification and claims are used to distinguish similar elements and not necessarily to describe a sequential or chronological order. It should be understood that the terms so used are interchangeable under appropriate circumstances, and that the embodiments of the invention described herein are capable of operation in sequences other than those described or illustrated herein.

[0104] Among other things, the device, apparatus or system may be described during operation. It will be clear to those skilled in the art that the present invention is not limited to methods of operation or devices, apparatus or systems in operation.

[0105] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims.

[0106] In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.

[0107] The use of the verb "comprise" and its conjugations does not exclude the presence of elements or steps other than those stated in the claims. Unless the context clearly requires otherwise, throughout the specification and claims, the words "comprises" and the like are to be interpreted in an inclusive sense rather than in an exclusive or exhaustive sense; that is, in the sense of "including but not limited to".

[0108] The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.

[0109] The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In a device claim, an apparatus claim or a system claim enumerating several means, several of these means may be embodied by one and the same item of hardware. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

[0110] The present invention also provides a control system that can control a device, an appliance or a system, or can perform the method or process described herein. In addition, the present invention also provides a computer program product that, when running on a computer functionally coupled to the device, an appliance or a system, or a computer composed of the device, an appliance or a system, controls one or more controllable elements of the device, an appliance or a system.

[0111] The present invention also applies to a device, apparatus or system comprising one or more characterizing features described in the specification and / or shown in the drawings. The present invention also relates to a method or process comprising one or more characterizing features described in the specification and / or shown in the drawings.

[0112] The various aspects discussed in this patent can be combined to provide additional advantages. In addition, those skilled in the art will appreciate that the embodiments can be combined, and more than two embodiments can also be combined. In addition, some features can form the basis of one or more partition applications.

Claims

1. A printed circuit board assembly (1), comprising (i) a flexible printed circuit board (100) which is at least partially folded, and (ii) a support member (200) which is at least partially folded, wherein: The at least partially folded flexible printed circuit board (100) comprises a first PCB area (110) and a second PCB area (120), wherein at least a portion of the second PCB area (120) is configured to be folded over at least a portion of the first PCB area (110); The at least partially folded support member (200) is configured to support at least a portion of the at least partially folded flexible printed circuit board (100), wherein the at least partially folded support member (200) comprises a first support member region (210) and a second support member region (220), wherein at least a portion of the second support member region (220) is configured to be folded on at least a portion of the first support member region (210), wherein at least a portion of the at least partially folded flexible printed circuit board (100) is configured between the first support member region (210) and the second support member region (220), and wherein the at least partially folded support member (200) is configured to maintain the at least partially folded flexible printed circuit board (100) folded, The printed circuit board assembly (1) further comprises a functional component (300) functionally coupled to the at least partially folded flexible printed circuit board (100), wherein the functional component (300) is not covered by the at least partially folded flexible printed circuit board (100) and is not covered by the at least partially folded support member (200), The functional component (300) is constructed at the first PCB area and is a solid-state light source (310).

2. The printed circuit board assembly (1) according to claim 1, wherein at least a portion of the first PCB area (110) and at least a portion of the second PCB area (120) are configured to be parallel.

3. The printed circuit board assembly (1) according to claim 2, wherein: The at least partially folded flexible printed circuit board (100) is configured to be folded onto itself.

4. The printed circuit board assembly (1) according to any one of the preceding claims 2 to 3, wherein the flexible printed circuit board (100) comprises an opening (130) configured above the functional component (300).

5. The printed circuit board assembly (1) according to any one of the preceding claims 1 to 3, wherein the flexible printed circuit board (100) comprises a polyimide-based flexible printed circuit board (100), and wherein the flexible printed circuit board (100) has a first thickness (h1) selected from the range of 15 to 200 μm.

6. The printed circuit board assembly (1) according to any one of the preceding claims 1 to 3, wherein the support member (200) has a second thickness (h2) selected from the range of 100 to 500 μm, wherein the support member (200) comprises a plastically deformable material, and wherein the support member (200) comprises aluminum or copper.

7. The printed circuit board assembly (1) according to any one of the preceding claims 1 to 3, wherein the flexible printed circuit board (100) comprises a plurality of second PCB areas (120), wherein at least a portion of each of the second PCB areas (120) is configured to be folded over at least a portion of the first PCB area (110).

8. The printed circuit board assembly (1) according to any one of the preceding claims 1 to 3, wherein the support (200) comprises a plurality of second support areas (220), wherein: At least a portion of the corresponding second support member area (220) is constructed to be folded over at least a portion of the first support member area (210), and at least a portion of the at least partially folded flexible printed circuit board (100) is constructed between the first support member area (210) and the second support member area (220).

9. A module (10) comprising (i) a printed circuit board assembly (1) according to any one of the preceding claims 1 to 8, and (ii) an assembly support (400), wherein: The component support (400) comprises a support region (410) and a plurality of elastic elements (420), wherein the support region (410) and the elastic elements (420) define a bearing position (430) for bearing the printed circuit board assembly (1), and wherein the elastic elements (420) are configured to hold the printed circuit board assembly (1) and the component support (400) together.

10. The module (10) of claim 9, wherein the elastic element (420) is configured to press the printed circuit board assembly (1) against the support area (410), wherein the assembly support (400) comprises steel, and wherein the assembly support (400) is a single-piece body.

11. The module (10) according to any of the preceding claims 9 to 10, further comprising a first mechanical fixing element (440) for fixing to a second mechanical fixing element (1040) of the functional unit (1000).

12. A functional unit (1000) comprising (i) a housing (1010) and (ii) a printed circuit board assembly (1) according to any one of the preceding claims 1 to 8, wherein the printed circuit board assembly (1) is at least partially surrounded by the housing (1010), and wherein the functional unit (1000) comprises an illuminator.

13. The functional unit (1000) according to claim 12, wherein at least a portion of the housing (1010) is configured as an assembly support (400) according to any of the preceding claims 9 to 10.

14. The functional unit (1000) according to claim 12, further comprising a second mechanical fixing element (1040) according to claim 11, wherein the second mechanical fixing element (1040) is functionally coupled to the housing (1010), wherein the functional unit (1000) comprises a module (10) according to claim 11, wherein the first mechanical fixing element (440) of the module (10) and the second mechanical fixing element (1040) of the functional unit (1000) are configured to hold the module (10) together with the housing (1010).

15. A method for producing a printed circuit board assembly (1), the method comprising: Providing (i) a flexible printed circuit board (100) and (ii) a support member (200), wherein the flexible printed circuit board (100) comprises a first PCB region (110) and a second PCB region (120), and wherein the support member (200) comprises a first support member region (210) and a second support member region (220), wherein the support member (200) comprises a deformable material; The folding phase includes: - PCB folding, comprising folding at least part of the second PCB area (120) over at least part of the first PCB area (110) to provide an at least partially folded flexible printed circuit board (100); and - support folding, comprising folding at least part of the second support area (220) onto at least part of the first support area (210) to provide an at least partially folded support (200), wherein at least part of the at least partially folded flexible printed circuit board (100) is constructed between the first support area (210) and the second support area (220); wherein the PCB folding precedes the support folding, or wherein the support folding includes the PCB folding; Functionally coupling a functional component (300) to the at least partially folded flexible printed circuit board (100) such that the functional component (300) is not covered by the at least partially folded flexible printed circuit board (100) and is not covered by the at least partially folded support member (200); and The functional component (300) is constructed at the first PCB area (110) and comprises a solid-state light source.

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