Roll-up circuit board
By providing reinforcement members higher than the height of the patterned metal layer between the patterned metal layer, the flexibility strength of the flexible carrier is increased, and the problem of the exposed surface of the patterned part being crushed during winding is solved, ensuring that the circuit substrate can be detected by the optical sensing part.
Patent Information
- Application Number
- CN202010355756.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-04-13
- Filing Date
- 2020-04-29
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2040-04-29
AI Technical Summary
When winding up the circuit substrate, the exposed surface of the patterned metal layer is easily crushed, resulting in the optical sensor being unable to detect and cause defective products.
A reinforcement member is provided between the first pattern part and the second pattern part of the patterned metal layer, and the height of the reinforcement member is not lower than the height of the pattern part to increase the flexural strength of the flexible carrier and avoid being crushed on the exposed surface.
By increasing the flexural strength, the compression of the exposed surface of the pattern part during winding is avoided, and the circuit board can be detected by the optical sensor.
Smart Images

Figure CN113543467B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a roll-up circuit substrate, in particular to a roll-up circuit substrate with at least one reinforcing piece arranged between two pattern parts of a patterned metal layer. Background Art
[0002] In the process of manufacturing circuit substrates, in order to detect whether multiple circuits or solder resist layers on the carrier board are abnormal, alignment marks are usually set on the carrier board for optical sensing elements to align and perform subsequent detection.
[0003] Since the carrier is flexible, when the circuit substrate is rolled up, the carrier may touch the alignment mark, causing the optical sensor to be unable to identify the alignment mark, thereby causing the circuit substrate to be judged as a defective product. Summary of the invention
[0004] The main purpose of the present invention is to set a reinforcement member between the first pattern portion and the second pattern portion of the patterned metal layer, and the height of the reinforcement member is not lower than the height of the first pattern portion and the second pattern portion. The reinforcement member is used to increase the flexural strength of the flexible carrier located below the reinforcement member to prevent the exposed surfaces of the first pattern portion and the second pattern portion from being crushed and unable to be detected by the optical sensor when the roll-up circuit substrate is rolled up.
[0005] A roll-up circuit substrate of the present invention comprises a flexible carrier, a patterned metal layer and at least one reinforcing member, wherein the flexible carrier has a first surface and a second surface, the patterned metal layer is arranged on the first surface, the patterned metal layer at least comprises a first pattern portion and a second pattern portion, the first pattern portion comprises a first base portion and a first conductive portion, the first conductive portion is arranged on the first base portion, the first base portion and the first conductive portion are made of different materials, the first pattern portion is selected from an alignment mark or a conductive circuit, the first pattern portion has a first height, and the second pattern portion has a first height. The second pattern portion includes a second base and a second conductive portion, the second conductive portion is arranged on the second base, the second base and the second conductive portion are made of different materials, the second pattern portion is selected from another alignment mark, the second pattern portion has a second height, a first gap is provided between the first pattern portion and the second pattern portion, and the first gap is not less than 50 microns, the reinforcement is arranged on the first surface, and the reinforcement is located between the first pattern portion and the second pattern portion, the reinforcement has a third height, and the third height is not lower than the first height and the second height.
[0006] Furthermore, the reinforcing member includes a third base and a pressure-bearing portion, the pressure-bearing portion is located on the third base, and the third base and the pressure-bearing portion are made of different materials.
[0007] Furthermore, a virtual longitudinal axis passes through the first pattern portion, the reinforcement and the second pattern portion, the first pattern portion has a first boundary and a second boundary, the reinforcement has a fifth boundary and a sixth boundary, and along a direction perpendicular to the virtual longitudinal axis, a first width between the first boundary and the second boundary is not greater than a third width from the fifth boundary to the sixth boundary.
[0008] Further, a first virtual straight line is extended along the first boundary, the first virtual straight line passes through the reinforcing piece, and the first end portion of the reinforcing piece protrudes from the first virtual straight line.
[0009] Furthermore, the second pattern portion has a third boundary and a fourth boundary, the second width between the third boundary and the fourth boundary is not greater than the third width, and the first virtual straight line passes through the third boundary of the second pattern portion.
[0010] Further, a second virtual straight line is extended along the second boundary, the second virtual straight line passes through the reinforcing piece, and the second end portion of the reinforcing piece protrudes from the second virtual straight line.
[0011] Furthermore, the second virtual straight line passes through the fourth boundary of the second pattern portion.
[0012] Further, a first virtual straight line is extended along the first boundary, and the first virtual straight line passes through the fifth boundary of the reinforcement piece.
[0013] Further, a second virtual straight line is extended along the second boundary, and the second virtual straight line passes through the sixth boundary of the reinforcement piece.
[0014] Furthermore, the second pattern portion has a third boundary and a fourth boundary, and the first virtual straight line passes through the third boundary of the second pattern portion.
[0015] Furthermore, the second virtual straight line passes through the fourth boundary of the second pattern portion.
[0016] Furthermore, the second pattern portion has a third boundary and a fourth boundary, and a second width between the third boundary and the fourth boundary is not less than the first width between the first boundary and the second boundary of the first pattern portion.
[0017] Furthermore, the second width is greater than the first width.
[0018] Furthermore, the second width of the second pattern portion is equal to the third width of the reinforcement piece.
[0019] Furthermore, a virtual longitudinal axis passes through the first pattern portion, the reinforcement and the second pattern portion, the first pattern portion has a first boundary and a second boundary, a first virtual straight line extends along the first boundary, the first virtual straight line passes through the reinforcement, and the first end of the reinforcement protrudes from the first virtual straight line.
[0020] Furthermore, a virtual longitudinal axis passes through the first pattern portion, the reinforcement and the second pattern portion, the first pattern portion has a first boundary and a second boundary, the reinforcement has a fifth boundary and a sixth boundary, a first virtual straight line extends along the first boundary, and the first virtual straight line passes through the fifth boundary of the reinforcement.
[0021] Furthermore, a virtual horizontal axis passes through the first pattern portion, the reinforcement and the second pattern portion, the first pattern portion has a first boundary and a second boundary, a third virtual straight line extends along the first boundary, the third virtual straight line passes through the reinforcement, and the first end of the reinforcement protrudes from the third virtual straight line.
[0022] Further, a fourth virtual straight line is extended along the second boundary, the fourth virtual straight line passes through the reinforcing piece, and the second end portion of the reinforcing piece protrudes from the fourth virtual straight line.
[0023] Furthermore, the first gap is not less than 70 microns, and the roll-up circuit substrate includes two reinforcement pieces, each of which is adjacent to the first pattern portion and the second pattern portion, respectively, and along a direction of the virtual longitudinal axis, there is a second gap between the reinforcement piece adjacent to the first pattern portion and the first pattern portion, and the second gap is not greater than 35 microns.
[0024] Furthermore, along another direction of the virtual longitudinal axis, a third gap exists between the reinforcing piece and the second pattern portion adjacent to the second pattern portion, and the third gap is no greater than 35 micrometers.
[0025] The present invention increases the flexural strength of the flexible carrier by using the reinforcing member, and by having the third height of the reinforcing member not lower than the first height of the first pattern portion and the second height of the second pattern portion, so that when the flexible carrier is rolled up, the exposed surfaces of the first pattern portion and the second pattern portion can be prevented from being crushed and unable to be detected by the optical sensor. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:
[0027] Figure 1 A schematic top view of a roll-up circuit substrate according to an embodiment of the present invention is shown;
[0028] Figure 2AA partial cross-sectional schematic diagram of a roll-up circuit substrate according to an embodiment of the present invention is shown;
[0029] Figure 2B A partial cross-sectional schematic diagram of a roll-up circuit substrate according to another embodiment of the present invention is shown;
[0030] Figures 3 to 9 Schematic top views of the patterned metal layer and the reinforcing member of the roll-up circuit substrate according to multiple embodiments of the present invention are shown.
[0031]
Explanation of symbols
[0032] 100: flexible carrier 110: first surface
[0033] 120: second surface 200: patterned metal layer
[0034] 210: first pattern portion 210a: first boundary
[0035] 210b: second boundary 211: first base
[0036] 212: first conductive portion 220: second pattern portion
[0037] 220a: third boundary 220b: fourth boundary
[0038] 221: second base portion 222: second connecting portion
[0039] 300: Reinforcement 300a: Fifth boundary
[0040] 300b: sixth boundary 300c: first end
[0041] 300d: second end portion 310: third base portion
[0042] 320: Pressure receiving portion D1: First width
[0043] D2: Second width D3: Third width
[0044] G1: First gap G2: Second gap
[0045] G3: Third gap H1: First height
[0046] H2: Second height H3: Third height
[0047] Y: virtual longitudinal axis Y1: first virtual straight line
[0048] Y2: Second virtual straight line X: Virtual horizontal axis
[0049] X1: The third virtual straight line X2: The fourth virtual straight line DETAILED DESCRIPTION
[0050] See also Figure 1 and Figure 2A , which is an embodiment of the present invention, please refer to Figure 2B , which is another embodiment of the present invention, a roll-up circuit substrate can be rolled up by a reel (not shown), the roll-up circuit substrate includes a flexible carrier 100, a patterned metal layer 200 and at least one reinforcement 300, the flexible carrier 100 has a first surface 110 and a second surface 120, the patterned metal layer 200 is disposed on the first surface 110, the patterned metal layer 200 at least includes a first pattern portion 210 and a second pattern portion 220, the first pattern portion 210 is selected from an alignment mark or a conductive line, and the second pattern portion 220 is selected from another alignment mark.
[0051] See also Figure 2A and Figure 2B In the present embodiment, the patterned metal layer 200 is formed by a metal plate (not shown) through a patterning process (such as an etching process) and a bonding layer process (such as electroplating, coating or printing processes). In the present embodiment, the bonding layer is a tin layer, but the present invention does not limit the formation method or material of the patterned metal layer 200.
[0052] See also Figure 1 , Figure 2A and Figure 2B The first pattern portion 210 includes a first base portion 211 and a first conductive portion 212. The first conductive portion 212 is disposed on the first base portion 211. The first base portion 211 and the first conductive portion 212 are made of different materials. The second pattern portion 220 includes a second base portion 221 and a second conductive portion 222. The second conductive portion 222 is disposed on the second base portion 221. The second base portion 221 and the second conductive portion 222 are made of different materials. In this embodiment, the first base portion 211 and the second base portion 221 are made by an etching process. The material of the first base portion 211 and the second base portion 221 is copper. The first conductive portion 212 and the second conductive portion 222 are made by an electroplating process. The material of the first conductive portion 212 and the second conductive portion 222 is tin. The first pattern portion 210 has a first height H1, and the second pattern portion 220 has a second height H2. Please refer to Figure 2A , Figure 2B and Figure 3 A first gap G1 is defined between the first pattern portion 210 and the second pattern portion 220 , and the first gap G1 is not less than 50 micrometers.
[0053] See also Figure 1 , Figure 2A and Figure 2BThe reinforcing member 300 is disposed on the first surface 110 and is located between the first pattern portion 210 and the second pattern portion 220. Figure 2A , two reinforcing members 300 are disposed between the first pattern portion 210 and the second pattern portion 220, or, refer to Figure 2B A reinforcing piece 300 is disposed between the first pattern portion 210 and the second pattern portion 220, but the present invention does not limit the number of the reinforcing pieces 300. The reinforcing piece 300 is used to increase the flexural strength of the flexible carrier 100 located below the reinforcing piece 300 to prevent the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 from being crushed and unable to be detected by the optical sensor when the roll-up circuit substrate is rolled up.
[0054] See also Figure 1 and Figure 2A Preferably, when the first gap G1 is not less than 70 micrometers, the roll-up circuit substrate includes two reinforcing members 300 , and each of the reinforcing members 300 is adjacent to the first pattern portion 210 and the second pattern portion 220 .
[0055] See also Figure 2A and Figure 3 , along one direction of the virtual longitudinal axis Y, there is a second gap G2 between the reinforcing piece 300 and the first pattern portion 210 adjacent to the first pattern portion 210, and the second gap G2 is not greater than 35 microns. Preferably, along another direction of the virtual longitudinal axis Y, there is a third gap G3 between the reinforcing piece 300 and the second pattern portion 220 adjacent to the second pattern portion 220, and the third gap G3 is not greater than 35 microns.
[0056] See also Figure 1 and Figure 2A The reinforcing member 300 has a third height H3, and the third height H3 is not lower than the first height H1 and the second height H2. The reinforcing member 300 can prevent the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 from being crushed and unable to be detected by the optical sensor when the roll-up circuit substrate is rolled up.
[0057] See also Figure 1 , Figure 2A and Figure 2BIn the present embodiment, the reinforcing piece 300 is formed by the metal plate through the patterning process and the bonding layer process. The reinforcing piece 300 includes a third base 310 and a pressure-bearing portion 320. The pressure-bearing portion 320 is located on the third base 310. The third base 310 and the pressure-bearing portion 320 are made of different materials. In the present embodiment, the third base 310 is made of copper, and the pressure-bearing portion 320 is made of tin. However, in different embodiments, the reinforcing piece 300 may be made of a non-metallic material, or the reinforcing piece 300 may be made of a single material, that is, the third base 310 and the pressure-bearing portion 320 are integrated.
[0058] For the embodiments of the patterned metal layer 200 and the reinforcing member 300 of the present invention, please refer to Figures 3 to 9 .
[0059] See also Figure 3 , which is a first embodiment of the patterned metal layer 200 and the reinforcing member 300. In this embodiment, the first pattern portion 210 is an alignment mark, and the second pattern portion 220 is another alignment mark. The appearance of the first pattern portion 210 and the second pattern portion 220 are substantially the same. The first pattern portion 210 and the second pattern portion 220 are symmetrically arranged on both sides of the reinforcing member 300, but the present invention is not limited thereto. The virtual longitudinal axis Y passes through the first pattern portion 210, the reinforcing member 300 and the second pattern portion 220. 0 has a first boundary 210a and a second boundary 210b, the second pattern portion 220 has a third boundary 220a and a fourth boundary 220b, the reinforcing piece 300 has a fifth boundary 300a and a sixth boundary 300b, and along a direction perpendicular to the virtual longitudinal axis Y, a first width D1 between the first boundary 210a and the second boundary 210b is not greater than a third width D3 between the fifth boundary 300a and the sixth boundary 300b, and a second width D2 between the third boundary 220a and the fourth boundary 220b is not greater than the third width D3.
[0060] See also Figure 3 A first virtual straight line Y1 is extended along the first boundary 210a of the first pattern portion 210, the first virtual straight line Y1 passes through the reinforcing piece 300 and the third boundary 220a of the second pattern portion 220, and the first end 300c of the reinforcing piece 300 protrudes from the first virtual straight line Y1. More preferably, a second virtual straight line Y2 is extended along the second boundary 210b, the second virtual straight line Y2 passes through the reinforcing piece 300 and the fourth boundary 220b of the second pattern portion 220, and the second end 300d of the reinforcing piece 300 protrudes from the second virtual straight line Y2.
[0061] See also Figure 4, which is a second embodiment of the patterned metal layer 200 and the reinforcing member 300. The difference between the second embodiment and the first embodiment is that the first virtual straight line Y1 passes through the fifth boundary 300a of the reinforcing member 300 and the third boundary 220a of the second pattern portion 220, and the second virtual straight line Y2 passes through the sixth boundary 300b of the reinforcing member 300 and the fourth boundary 220b of the second pattern portion 220, that is, the third width D3 of the reinforcing member 300 is substantially equal to the first width D1 of the first pattern portion 210 and the second width D2 of the second pattern portion 220. Similarly, the reinforcing member 300 can increase the flexural strength of the flexible carrier 100 located below the reinforcing member 300, and can prevent the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 from being crushed and unable to be detected by the optical sensor when the roll-up circuit substrate is rolled up.
[0062] See also Figure 5 , which is a third embodiment of the patterned metal layer 200 and the reinforcement 300. The difference between the second pattern portion 220 and the first embodiment is that the second pattern portion 220 is a circular mark. Along the direction perpendicular to the virtual longitudinal axis Y, the second width D2 between the third boundary 220a and the fourth boundary 220b of the second pattern portion 220 is not less than the first width D1 between the first boundary 210a and the second boundary of the first pattern portion 210. In the present embodiment, the second width D2 is greater than the first width D1. Preferably, the second width D2 of the second pattern portion 220 is substantially equal to the third width D3 of the reinforcement 300.
[0063] See also Figure 6 , which is a fourth embodiment of the patterned metal layer 200 and the reinforcing member 300 , and the difference between the fourth embodiment and the third embodiment is that the first pattern portion 210 is a rectangular mark.
[0064] See also Figure 7 , which is a fifth embodiment of the patterned metal layer 200 and the reinforcement 300, and the difference between the fifth embodiment and the first embodiment is that the first pattern portion 210 is a square mark, and the first width D1 of the first pattern portion 210 is greater than the second width D2 of the second pattern portion 220, the first virtual straight line Y1 extending along the first boundary 210a of the first pattern portion 210 passes through the reinforcement 300, and the first end portion 300c of the reinforcement 300 protrudes from the first virtual straight line Y1.
[0065] See also Figure 8 , which is a sixth embodiment of the patterned metal layer 200 and the reinforcing member 300 , and the difference between the sixth embodiment and the fifth embodiment is that the first virtual straight line Y1 passes through the fifth boundary 300 a of the reinforcing member 300 .
[0066] See also Fig. 9 , which is the seventh embodiment of the patterned metal layer 200 and the reinforcement 300, and the difference between the seventh embodiment and the first embodiment is that the virtual horizontal axis X passes through the first pattern portion 210, the reinforcement 300 and the second pattern portion 220, the first pattern portion 210 has the first boundary 210a and the second boundary 210b, a third virtual straight line X1 is extended along the first boundary 210a, the third virtual straight line X1 passes through the reinforcement 300, and the first end 300c of the reinforcement 300 protrudes from the third virtual straight line X1, preferably, a fourth virtual straight line X2 is extended along the second boundary 210b, the fourth virtual straight line X2 passes through the reinforcement 300, and the second end 300d of the reinforcement 300 protrudes from the fourth virtual straight line X2.
[0067] In the present invention, the reinforcing member 300 is used to increase the flexural strength of the flexible carrier 100 below the first pattern portion 210 and the second pattern portion 220, and the third height H3 of the reinforcing member 300 is not lower than the first height H1 of the first pattern portion 210 and the second height H2 of the second pattern portion 220, so that when the flexible carrier 100 is rolled up, the exposed surfaces of the first pattern portion 210 and the second pattern portion 220 can be prevented from being crushed and unable to be detected by the optical sensor.
[0068] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of the technical solution of the present invention.
Claims
1. A roll-up circuit substrate, characterized in that: Include: A flexible carrier having a first surface and a second surface; A patterned metal layer is disposed on the first surface, and the patterned metal layer at least comprises: A first pattern portion, comprising a first base portion and a first conductive portion, the first conductive portion being disposed on the first base portion, the first base portion and the first conductive portion being made of different materials, the first pattern portion being selected from an alignment mark or a conductive circuit, the first pattern portion having a first height, a virtual longitudinal axis passing through the first pattern portion, and the first pattern portion having a first boundary and a second boundary; and A second pattern portion, comprising a second base portion and a second conductive portion, the second conductive portion being disposed on the second base portion, the second base portion and the second conductive portion being made of different materials, the second pattern portion being selected from another alignment mark, the second pattern portion having a second height, a first gap being provided between the first pattern portion and the second pattern portion, the first gap being not less than 50 micrometers, and the virtual longitudinal axis passing through the second pattern portion; and At least one reinforcing member, the reinforcing member includes a third base and a pressure-bearing portion, the pressure-bearing portion is located on the third base, the third base and the pressure-bearing portion are made of different materials, the reinforcing member is arranged on the first surface, and the reinforcing member is located between the first pattern portion and the second pattern portion, the reinforcing member has a third height, the third height is not lower than the first height and the second height, the virtual longitudinal axis passes through the reinforcing member, the reinforcing member has a fifth boundary and a sixth boundary, and along the direction perpendicular to the virtual longitudinal axis, the first width between the first boundary and the second boundary is not greater than the third width from the fifth boundary to the sixth boundary.
2. The roll-up circuit substrate according to claim 1, characterized in that: A first virtual straight line is extended along the first boundary, the first virtual straight line passes through the reinforcing piece, and the first end portion of the reinforcing piece protrudes from the first virtual straight line.
3. The roll-up circuit substrate according to claim 2, characterized in that: The second pattern portion has a third boundary and a fourth boundary. The second width between the third boundary and the fourth boundary is not greater than the third width. The first virtual straight line passes through the third boundary of the second pattern portion.
4. The roll-up circuit substrate according to claim 3, characterized in that: A second virtual straight line is extended along the second boundary, the second virtual straight line passes through the reinforcing piece, and the second end portion of the reinforcing piece protrudes from the second virtual straight line.
5. The roll-up circuit substrate according to claim 4, characterized in that: The second virtual straight line passes through the fourth boundary of the second pattern portion.
6. The roll-up circuit substrate according to claim 1, characterized in that: A first virtual straight line is extended along the first boundary, and the first virtual straight line passes through the fifth boundary of the reinforcing member.
7. The roll-up circuit substrate according to claim 6, characterized in that: A second virtual straight line is extended along the second boundary, and the second virtual straight line passes through the sixth boundary of the reinforcing member.
8. The roll-up circuit substrate according to claim 7, characterized in that: The second pattern portion has a third boundary and a fourth boundary, and the first virtual straight line passes through the third boundary of the second pattern portion.
9. The roll-up circuit substrate according to claim 8, characterized in that: The second virtual straight line passes through the fourth boundary of the second pattern portion.
10. The roll-up circuit substrate according to claim 1, characterized in that: The second pattern portion has a third boundary and a fourth boundary, and a second width between the third boundary and the fourth boundary, and the second width is not less than the first width between the first boundary and the second boundary of the first pattern portion.
11. The roll-up circuit substrate according to claim 10, characterized in that: The second width is greater than the first width.
12. The roll-up circuit substrate according to claim 11, characterized in that: The second width of the second pattern portion is equal to the third width of the reinforcing piece.
13. A roll-up circuit substrate, characterized in that: Include: A flexible carrier having a first surface and a second surface; A patterned metal layer is disposed on the first surface, and the patterned metal layer at least comprises: A first pattern portion, comprising a first base portion and a first conductive portion, the first conductive portion being disposed on the first base portion, the first base portion and the first conductive portion being made of different materials, the first pattern portion being selected from an alignment mark or a conductive circuit, the first pattern portion having a first height, a virtual longitudinal axis passing through the first pattern portion, and the first pattern portion having a first boundary and a second boundary; and A second pattern portion, comprising a second base portion and a second conductive portion, the second conductive portion being disposed on the second base portion, the second base portion and the second conductive portion being made of different materials, the second pattern portion being selected from another alignment mark, the second pattern portion having a second height, a first gap being provided between the first pattern portion and the second pattern portion, the first gap being not less than 50 micrometers, and the virtual longitudinal axis passing through the second pattern portion; and At least one reinforcing member, the reinforcing member includes a third base and a pressure-bearing portion, the pressure-bearing portion is located on the third base, the third base and the pressure-bearing portion are made of different materials, the reinforcing member is arranged on the first surface, and the reinforcing member is located between the first pattern portion and the second pattern portion, the reinforcing member has a third height, the third height is not lower than the first height and the second height, the virtual longitudinal axis passes through the reinforcing member, a first virtual straight line is extended along the first boundary, the first virtual straight line passes through the reinforcing member, and the first end of the reinforcing member protrudes from the first virtual straight line.
14. A roll-up circuit substrate, characterized in that: Include: A flexible carrier having a first surface and a second surface; A patterned metal layer is disposed on the first surface, and the patterned metal layer at least comprises: A first pattern portion, comprising a first base portion and a first conductive portion, the first conductive portion being disposed on the first base portion, the first base portion and the first conductive portion being made of different materials, the first pattern portion being selected from an alignment mark or a conductive circuit, the first pattern portion having a first height, a virtual longitudinal axis passing through the first pattern portion, and the first pattern portion having a first boundary and a second boundary; and A second pattern portion, comprising a second base portion and a second conductive portion, the second conductive portion being disposed on the second base portion, the second base portion and the second conductive portion being made of different materials, the second pattern portion being selected from another alignment mark, the second pattern portion having a second height, a first gap being provided between the first pattern portion and the second pattern portion, the first gap being not less than 50 micrometers, and the virtual longitudinal axis passing through the second pattern portion; and At least one reinforcing member, the reinforcing member includes a third base and a pressure-bearing portion, the pressure-bearing portion is located on the third base, the third base and the pressure-bearing portion are made of different materials, the reinforcing member is arranged on the first surface, and the reinforcing member is located between the first pattern portion and the second pattern portion, the reinforcing member has a third height, the third height is not lower than the first height and the second height, a virtual longitudinal axis passes through the reinforcing member, the reinforcing member has a fifth boundary and a sixth boundary, a first virtual straight line extends along the first boundary, and the first virtual straight line passes through the fifth boundary of the reinforcing member.
15. A roll-up circuit substrate, characterized in that: Include: A flexible carrier having a first surface and a second surface; A patterned metal layer is disposed on the first surface, and the patterned metal layer at least comprises: A first pattern portion, comprising a first base portion and a first conductive portion, the first conductive portion being disposed on the first base portion, the first base portion and the first conductive portion being made of different materials, the first pattern portion being selected from an alignment mark or a conductive circuit, the first pattern portion having a first height, a virtual horizontal axis passing through the first pattern portion, and the first pattern portion having a first boundary and a second boundary; and A second pattern portion, comprising a second base portion and a second conductive portion, the second conductive portion being disposed on the second base portion, the second base portion and the second conductive portion being made of different materials, the second pattern portion being selected from another alignment mark, the second pattern portion having a second height, a first gap being provided between the first pattern portion and the second pattern portion, the first gap being not less than 50 micrometers, and the virtual horizontal axis passing through the second pattern portion; and At least one reinforcing member, the reinforcing member includes a third base and a pressure-bearing portion, the pressure-bearing portion is located on the third base, the third base and the pressure-bearing portion are made of different materials, the reinforcing member is arranged on the first surface, and the reinforcing member is located between the first pattern portion and the second pattern portion, the reinforcing member has a third height, the third height is not lower than the first height and the second height, a virtual horizontal axis passes through the reinforcing member, a third virtual straight line is extended along the first boundary, the third virtual straight line passes through the reinforcing member, and the first end of the reinforcing member protrudes from the third virtual straight line.
16. The roll-up circuit substrate according to claim 15, characterized in that: A fourth virtual straight line is extended along the second boundary, the fourth virtual straight line passes through the reinforcing piece, and the second end portion of the reinforcing piece protrudes from the fourth virtual straight line.
17. A roll-up circuit substrate, characterized in that: Include: A flexible carrier having a first surface and a second surface; A patterned metal layer is disposed on the first surface, and the patterned metal layer at least comprises: A first pattern portion, comprising a first base portion and a first conductive portion, wherein the first conductive portion is disposed on the first base portion, the first base portion and the first conductive portion are made of different materials, the first pattern portion is selected from an alignment mark or a conductive circuit, and the first pattern portion has a first height; and A second pattern portion, comprising a second base portion and a second conductive portion, wherein the second conductive portion is disposed on the second base portion, the second base portion and the second conductive portion are made of different materials, the second pattern portion is selected from another alignment mark, the second pattern portion has a second height, and a first gap is provided between the first pattern portion and the second pattern portion, and the first gap is not less than 70 micrometers; and Two reinforcing members, the reinforcing member includes a third base and a pressure-bearing portion, the pressure-bearing portion is located on the third base, the third base and the pressure-bearing portion are made of different materials, the reinforcing member is arranged on the first surface, and the reinforcing member is located between the first pattern portion and the second pattern portion, each of the reinforcing members is adjacent to the first pattern portion and the second pattern portion respectively, the reinforcing member has a third height, the third height is not lower than the first height and the second height, and along one direction of the virtual longitudinal axis, there is a second gap between the reinforcing member adjacent to the first pattern portion and the first pattern portion, and the second gap is not greater than 35 microns.
18. The roll-up circuit substrate according to claim 17, characterized in that: Along another direction of the virtual longitudinal axis, a third gap exists between the reinforcing piece and the second pattern portion adjacent to the second pattern portion, and the third gap is no greater than 35 micrometers.
Citation Information
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