A device and method for detecting abnormal operation of diamond wire of a slicer

Abstract

The present invention provides a device for detecting abnormal operation of diamond wires of a slicer, which is used to detect the state of the diamond wire wound on the axial direction of the sheave during the cutting process. The device is located at the end of the sheave on at least one side of the sheave, away from the sheave and facing the direction of the diamond wire. The device has a detection unit for monitoring the non-bow state of the diamond wire when it is pressed and cut by a silicon rod; a fixing unit for fixing the detection unit; wherein the detection unit is tilted by the fixing unit according to a set angle with the length direction of the diamond wire placed between the sheaves and close to the silicon rod. The present invention also proposes a method for detecting abnormal operation of diamond wires of a slicer. The present invention can quickly detect the abnormal state of the diamond wire jumping during the cutting process and issue a warning in time with high accuracy, reducing the number of diamond wire abnormal operation occurrences, ensuring cutting quality, and improving the silicon wafer qualification rate.

Description

Technical Field

[0001] The present invention belongs to the technical field of solar silicon wafer cutting, and in particular relates to a device and method for detecting abnormal operation of diamond wires of a slicer. Background Art

[0002] When silicon rods are cut with a multi-wire slicer, the silicon wafer fragmentation rate is relatively high. The main reason is the breakage of the diamond wire during the cutting process. The breakage of the diamond wire exacerbates the silicon wafer fragmentation rate. Among them, the proportion of wire breakage caused by wire jump is particularly high during the cutting process. The main reasons are that wire jumps are caused by debris falling into the wire mesh during the cutting process and insufficient steel wire cutting capacity. After the wire jump, the employees failed to discover and deal with it in time. The jumped steel wire continued to participate in the cutting, resulting in insufficient steel wire cutting capacity and wire breakage, resulting in a high amount of single crystal silicon wafer fragments and serious silicon rod losses.

[0003] Therefore, how to promptly detect technical problems of abnormal diamond wire operation during the cutting process is the key to avoiding diamond wire breakage, improving cutting quality and production efficiency, and reducing production costs. Summary of the Invention

[0004] The purpose of the present invention is to provide a detection device and a detection method for judging abnormal operation of diamond wire during cutting, which has a simple structure, is easy to operate and has high accuracy, especially for detecting when the diamond wire jumps, thereby solving the technical problem in the prior art that abnormal operation of the diamond wire during cutting cannot be detected in time.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A device for detecting abnormal working of diamond wire of a slicer, used for detecting the state of the diamond wire wound on the axis of a sheave during cutting, is disposed at the sheave seat at the end of at least one sheave, away from the sheave and facing the direction of the diamond wire, and has the following features:

[0007] A detection unit for monitoring the non-bow state of the diamond wire when it is pressed and cut by the silicon rod;

[0008] a fixing unit for fixing the detection unit;

[0009] The detection unit is tilted by the fixing unit at a set angle to the length direction of the diamond wire placed between the sheaves and close to the silicon rod.

[0010] Furthermore, the angle range is 30-60°.

[0011] Furthermore, the angle is 45°.

[0012] Furthermore, the detection unit has a processor, an infrared transmitter or an infrared receiver arranged at one end of the fixing unit, and the infrared receiver or the infrared transmitter correspondingly arranged at the other end of the fixing unit, and the processor is connected to the infrared receiver.

[0013] Furthermore, the fixing unit has a mounting plate and a fixing frame, the mounting plate is coaxially arranged with the sheave seat; the fixing frame is placed on the side of the mounting plate away from the sheave and one end is fixed on the mounting plate, and the infrared transmitter or the infrared receiver is arranged at the other end of the fixing frame.

[0014] Furthermore, an arc hole is provided on the mounting plate, and the fixing frame is rotatably arranged along the arc hole with the center of the mounting plate as the center of the circle; the angle of the arc hole is 30-60°.

[0015] Furthermore, the fixing unit also includes a positioning frame and an adjusting frame, and the positioning frame and the adjusting frame are arranged on the same side of the fixing frame; one end of the adjusting frame is connected to the fixing frame, and the other end slides along the length direction of the positioning frame; one end of the positioning frame is fixed on the mounting plate, and the other end is embedded in a groove arranged on the outer edge of the mounting plate and opening outward.

[0016] A method for detecting abnormal operation of a diamond wire of a slicer, comprising: adopting a detection device as described in any of the above items to detect the situation in which the diamond wire is in a non-bow state when being pressed and cut by the silicon rod during the cutting process; wherein the detection unit is tilted by the fixing unit at a set angle to the length direction of the diamond wire placed between the groove wheels and close to the silicon rod side.

[0017] Furthermore, when the diamond wire works abnormally, the signals of the infrared transmitter or infrared receiver placed at one end of the fixed unit and the corresponding infrared receiver or infrared transmitter set at the other end of the fixed unit are blocked by the diamond wire of the jumper, and the processor sends a warning signal after receiving the blocking information transmitted by the infrared receiver.

[0018] Furthermore, when the diamond wire works normally, the infrared transmitter or infrared receiver placed at one end of the fixing unit is connected to the infrared receiver or infrared transmitter correspondingly arranged at the other end of the fixing unit, and the processor does not issue a warning signal.

[0019] Compared with the existing technology, the detection device and detection method designed in the present invention can quickly detect the abnormal state of diamond wire jumper during the cutting process and issue a warning in time with high accuracy, thereby avoiding the frequency of diamond wire jumper. At the same time, it also reduces the risk of diamond wire breakage, ensures cutting quality, improves the qualified rate of silicon wafers, improves production efficiency, and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a detection device on a single-side sheave according to an embodiment of the present invention;

[0021] Figure 2 1 is a top view of a detection device on a single-side sheave according to an embodiment of the present invention;

[0022] Figure 3 2. It is a top view of a detection device on a single-side sheave according to another embodiment of the present invention;

[0023] Figure 4 This is a schematic structural diagram of a detection device on a double-sided sheave according to an embodiment of the present invention;

[0024] Figure 5 1 is a top view of a detection device on a double-sided sheave according to an embodiment of the present invention;

[0025] Figure 6 It is a top view of a detection device on a double-sided sheave according to another embodiment of the present invention.

[0026] In the picture:

[0027] 100, detection unit 110, infrared transmitter 120, infrared receiver

[0028] 130, processor 140, display screen 200, fixing unit

[0029] 210, mounting plate 211, arc hole 212, groove

[0030] 220, fixed frame 230, positioning frame 240, adjustment frame

[0031] 300, sheave 400, sheave seat 500, silicon rod

[0032] 600, Diamond Wire DETAILED DESCRIPTION

[0033] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] This embodiment provides a device for detecting abnormal working of diamond wire of a slicer. Figure 1As shown, a detection device is provided on the sheave seat 400 at the end of either sheave 300, away from the sheave 300 and facing the diamond wire 600, for detecting the working state of the diamond wire 600 wound axially around the sheave during cutting. Specifically, the detection device comprises a single detection unit 100, which includes a detection unit 100 for monitoring the non-bowed state of the diamond wire 600 when being pressed and cut by the silicon rod 500, and a fixing unit 200 for fixing the detection unit 100. The detection unit 100 is tilted by the fixing unit 200 at a set angle relative to the length of the diamond wire 600 positioned between the sheaves 300 and near the silicon rod 500. In other words, the detection unit 100 is tilted vertically upward and obliquely inward, with the angle θ ranging from 30° to 60°, preferably 45°. When the angle θ between the detection unit 100 and the vertical axis of the groove wheel 300 is 45°, the state of the diamond wire 600 jumping during the cutting process can be accurately measured, so that an alarm can be issued in time, and then the machine can be stopped to adjust the jumping diamond wire 600 and reinstall it into the corresponding wire groove, thereby avoiding the possibility of wire breakage, minimizing the risk of wire breakage, and reducing the amount of debris.

[0035] Specifically, the detection unit 100 includes a processor 130, an infrared transmitter 110 or an infrared receiver 120 disposed at one end of the fixing unit 200, and an infrared receiver 120 or an infrared transmitter 110 correspondingly disposed at the other end of the fixing unit 200. The processor 130 is signal-connected to the infrared receiver 120. In other words, the detection units 100 are disposed at both ends of the same single-sided sheave 300 and are positioned in alignment, both being perpendicular to the length direction of the horizontally disposed diamond wire 600. If the infrared transmitter 110 is mounted on the left fixing unit 200, then the infrared receiver 120 is mounted on the right fixing unit 200. Figure 2 If the left fixing unit 200 is installed with the infrared receiver 120, the right fixing unit 200 is installed with the infrared transmitter 110, as shown Figure 3 Regardless of the arrangement structure, the output end of the infrared transmitter 110 is signal-connected to the input end of the infrared receiver 120, and the output end of the infrared receiver 120 is signal-connected to the input end of the external processor 130. The output end of the processor 130 is connected to the input end of the display screen 140 of the slicer. The processor 130 is placed inside the display screen 140, and an alarm light is provided on the display screen 140.

[0036] During the cutting process, the diamond wire 600 is subjected to the weight of the silicon rod 500 itself and the speed of downward movement, causing the taut diamond wire 600 to form a bow state. The bow-shaped diamond wire 600 is pressed to run back and forth, so that it always forms an upward cutting force on the silicon rod 500; during the cutting process, the diamond wire 600 is affected by the friction vibration between the silicon rod 500, the vibration of the slicer operation and the shaking caused by its own reciprocating motion, and it is easy to jump out of the wire groove to the blunt edge outside the wire groove, and then jump wire occurs. Since the blunt edge of the wire groove is mostly flat, the diamond wire 600 is in a horizontal straight line state outside the wire groove and keeps slipping, affecting the cutting effect.

[0037] When the diamond wire 600 works abnormally and jumps, the signals of the infrared transmitter 110 or the infrared receiver 120 placed at one end of the fixed unit 200 and the corresponding infrared receiver 120 or the infrared transmitter 110 set at the other end of the fixed unit 200 are blocked by the diamond wire 600 of the jumper, that is, the infrared transmitter 110 is blocked by the horizontal straight diamond wire 600, so that its signal to the infrared receiver 120 is blocked, and the infrared receiver 120 cannot receive the infrared light path. The infrared receiver 120 then sends an infrared light path blocking information to the processor 130. After receiving the blocking information, the processor 130 can know that the diamond wire 600 has jumped. The processor 130 transmits the blocking information to the alarm light on the slicer display screen 140 and indicates a warning through the indication of the alarm light. The on-site operator can know that a jump has occurred from the alarm light on the display screen 140, stop the machine for jump processing, retract the jumper diamond wire 600 into the wire groove, and then continue cutting. According to the wire bow characteristics of the diamond wire 600 of the jumper, the detection unit 100 is set to perform infrared monitoring on the horizontal straight jumper, which can timely and accurately monitor the abnormal working conditions of the diamond wire 600, so that the jumper condition can be grasped at the first time, and the jumper problem can be handled to avoid serious damage to the diamond wire 600 and resulting in wire breakage, thereby minimizing the loss of silicon rods, reducing production costs, and improving cutting quality and silicon wafer qualification rate.

[0038] When the diamond wire 600 is working normally and no wire jump occurs, the infrared transmitter 110 or infrared receiver 120 placed at one end of the fixed unit 200 is normally connected to the infrared receiver 120 or infrared transmitter 110 correspondingly set at the other end of the fixed unit 200, the processor 130 does not issue a warning signal, and cutting proceeds normally.

[0039] In this embodiment, the infrared emitter 110 or infrared receiver 120 in the detection unit 100 is vertically upward and tilted diagonally inward. That is, the angle θ between the infrared emitter 110 or infrared receiver 120 and the vertical axis of the sheave 300 ranges from 30° to 60°. This is because when the angle θ is greater than 60°, the infrared emitter 110 or infrared receiver 120 is blocked by the silicon wafer or silicon rod, making it impossible to monitor the working status of the diamond wire 600. If the angle θ is less than 30°, the monitored diamond wire 600 is too close to the sheave 300, making it impossible to determine whether the bow shape of the diamond wire 600 is caused by a jumper wire, thus affecting monitoring accuracy. Preferably, when the angle θ between the infrared transmitter 110 or the infrared receiver 120 and the vertical axis of the groove wheel 300 is 45°, the line segment of the diamond wire 600 monitored by it is near the cutting contact area with the silicon rod 500, and can fully reflect the real-time state of the wire bow of the diamond wire 600. The measured accuracy is high and is not affected by other lines of sight. Once the diamond wire 600 appears in a horizontal straight shape, the infrared transmitter 110 or the infrared receiver 120 cooperates with the infrared receiver 120 or the infrared transmitter 110 to capture and collect information in time, and pass the jumper information to the processor 130, which is reflected on the display screen 140 and a warning is issued in time with high accuracy, thereby avoiding the number of abnormal working conditions of the diamond wire 600, ensuring the cutting quality, and improving the silicon wafer qualification rate.

[0040] like Figure 1 As shown, the fixing unit 200 comprises a mounting plate 210 and a fixing bracket 220. The mounting plate 210 is coaxially fixed to the sheave seat 400. The diameter of the mounting plate 200 can be the same as or different from the diameter of the sheave seat 400, as long as the fixing bracket 220 is long enough to secure the infrared emitter 110 or infrared receiver 120. In this embodiment, the mounting plate 210 and the sheave seat 400 have the same diameter, which reduces variations in process parameters and facilitates processing. The fixing bracket 220 is positioned on the side of the mounting plate 210 away from the sheave 300, with one end fixed to the center of the mounting plate 210. The infrared emitter 110 or infrared receiver 120 is positioned at the other end of the fixing bracket 220. The end of the fixing bracket 220 away from the axis of the mounting plate 210 is provided with a mounting slot for securing the infrared emitter 110 or infrared receiver 120, aligning the infrared emitter 110 or infrared receiver 120 perpendicularly to the length of the diamond wire 600.

[0041] Furthermore, in order to ensure the consistency of the angle θ between the infrared transmitter 110 or the infrared receiver 120 and the vertical axis of the groove wheel 300, an arc hole 211 is provided on the mounting plate 210. The arc hole 211 is consistent with the quadrant position of the fixing bracket 220, that is, the angle of the arc hole 211 is consistent with the rotatable angle of the fixing bracket 220, both of which are 30-60°. The fixing bracket 220 is connected to the arc hole 211 by a screw. The fixing bracket 220 is rotated along the arc hole 211 with the center point of its connection with the mounting plate 210 as the center of the circle to adjust the angle θ between the infrared transmitter 110 or the infrared receiver 120 and the vertical axis of the groove wheel 300, so that the position of the fixing bracket 220 can be tracked, thereby ensuring the consistency of the position of the fixing bracket 220 placed at both ends of the groove wheel 300.

[0042] At the same time, in order to ensure that the infrared transmitter 110 or the infrared receiver 120 does not shake during the monitoring process, increase the stability of the installation of the infrared transmitter 110 or the infrared receiver 120 and the fixing bracket 220, and improve the accuracy of monitoring, the fixing unit 200 also includes a positioning bracket 230 and an adjustment bracket 240, and the positioning bracket 230 and the adjustment bracket 240 are both arranged on the same side as the fixing bracket 220.

[0043] The positioning frame 230 is provided with a slide, one end of which is fixed to the mounting plate 210, and the other end is engaged in a groove 212 provided on the outer edge of the mounting plate 210 and opening outward. In this embodiment, the positioning frame 230 is arranged horizontally and is placed on the horizontal axis of the mounting plate 210. Of course, the positioning frame 230 can also be arranged at other positions on the mounting plate 210, as long as it can stably cooperate with the adjustment frame 240 to more stably fix the fixing frame 220 to the mounting plate 210. The provision of the groove 212 can further ensure the stability of the horizontal installation position of the positioning frame 230. One end of the adjustment frame 240 is connected to the connecting screw of the fixed frame 220 and the arc hole 211, and the other end slides along the length direction of the positioning frame 230. One end of the adjustment frame 240 pushes the fixed frame 220 to rotate the fixed frame 220 along the arc hole 211, and the other end slides on the positioning frame 230 to find the best matching connection point for supporting the fixed frame 220, so that the fixed frame 220, the positioning frame 230 and the adjustment frame 240 form a stable triangle, thereby ensuring the installation strength of the fixed frame 220, and further ensuring the stability of the installation of the infrared transmitter 110 or the infrared receiver 120, ensuring accurate jumper monitoring without omissions, and maximizing the accuracy of abnormal monitoring of the diamond wire 600, reducing the risk of wire breakage, and improving the sensitivity of the detection unit 100. At the same time, the overall structure of the fixed unit 200 is simple, tightly matched, easy to adjust and control, and the entire structure is easy to process and does not require additional settings, which can fully ensure the installation strength of the infrared transmitter 110 or the infrared receiver 120.

[0044] Furthermore, the detection device can also be provided with detection units 100 at both ends of the double-sided sheave 300, that is, there are two sets of detection units 100, and the detection units 100 are symmetrically arranged relative to the central axis of the silicon rod length, such as Figure 4 As shown. Preferably, an infrared transmitter 110 or an infrared receiver 120 is installed on either side of the fixed unit 200 of the sheaves 300, and an infrared receiver 120 or an infrared transmitter 110 is installed on the other side of the fixed unit 200. The processor 130 is connected to the infrared receiver 120 by signal. In other words, if the left fixed unit 200 of the two sheaves 300 is installed with the infrared transmitter 110, then the right fixed unit 200 is installed with the infrared receiver 120. Figure 5 If the left fixing unit 200 is installed with the infrared receiver 120, the right fixing unit 200 is installed with the infrared transmitter 110, as shown Figure 6 As shown in the figure, the position, structure, and working process of the double-sided detection unit 100 are identical to those of the single-sided detection unit 100 and will not be described in detail here. The double-sided detection unit 100 can detect abnormal conditions of the diamond wire jumpers on both sides of the silicon ingot. Any detection unit 100 that detects a diamond wire anomaly will issue a warning, further improving accuracy. Promptly identifying and resolving diamond wire jumper issues can reduce their frequency and further reduce the risk of diamond wire breakage, ensuring cutting quality and improving production efficiency.

[0045] A method for detecting abnormal operation of a diamond wire in a slicer is disclosed. The method employs the aforementioned detection device to detect when the diamond wire 600 becomes non-bowed when pressed against a silicon rod 500 during the cutting process. The detection unit 100 is tilted by the fixing unit 200 at a set angle relative to the length of the diamond wire 600 positioned between the sheaves 300 and proximal to the silicon rod 500. Specifically, the detection unit 100 is tilted vertically upward and obliquely inward, with the angle θ ranging from 30-60°, preferably 45°. When the angle between the detection unit 100 and the vertical axis of the sheave 300 is 45°, the jumper state of the diamond wire 600 during the cutting process can be accurately detected, thereby providing a timely alarm and allowing the machine to be stopped to adjust the jumper and reinstall the diamond wire 600 into its corresponding slot, thereby avoiding the possibility of wire breakage, minimizing the risk of wire breakage, and reducing the amount of debris.

[0046] Specifically, the infrared transmitter 110 or the infrared receiver 120 is installed on the fixing bracket 220 at one end of the fixing unit 200, and the infrared receiver 120 or the infrared transmitter 110 is installed on the fixing bracket 220 at the other end accordingly. The infrared transmitter 110 and the infrared receiver 120 are both located in the mounting groove on one side away from the axis of the mounting plate 210 and are both positioned vertically toward the length direction of the diamond wire 600.

[0047] Then, one end of the adjustment frame 240 connected to the fixing frame 220 is adjusted to push the fixing frame 220 so that the fixing frame 220 rotates along the arc hole 211. The other end of the adjustment frame 240 slides on the positioning frame 230 to find the best matching connection point for supporting the fixing frame 220. The angle between the fixing frame 220 and the vertical axis of the mounting plate 210 is 45 degrees, which means that the fixing frame 220 is set at the central axis position of the arc hole 211, so that the fixing frame 220 with the infrared transmitter 110 or the infrared receiver 120 is firmly fixed on the mounting plate 220.

[0048] During cutting, the diamond wire 600 is subjected to the weight of the silicon rod 500 itself and the speed of downward movement, causing the taut diamond wire 600 to form a bow state. The bow-shaped diamond wire 600 is pressed to run back and forth, so that it always forms an upward cutting force on the silicon rod 500. During the cutting process, the diamond wire 600 is affected by the friction vibration between the silicon rod 500, the vibration of the slicer operation and the shaking caused by its own reciprocating motion, and it is easy to jump out of the wire groove to the blunt edge outside the wire groove, and then jump wire occurs. Since the blunt edge of the wire groove is mostly flat, the diamond wire 600 is in a horizontal straight line state outside the wire groove and keeps slipping, affecting the cutting effect.

[0049] Furthermore, when the diamond wire 600 works abnormally and jumps, the signals of the infrared transmitter 110 or the infrared receiver 120 placed at one end of the fixed unit 200 and the corresponding infrared receiver 120 or the infrared transmitter 110 set at the other end of the fixed unit 200 are blocked by the diamond wire 600 of the jumper, that is, the infrared transmitter 110 is blocked by the horizontal straight diamond wire 600, so that its signal to the infrared receiver 120 is blocked, and the infrared receiver 120 cannot receive the infrared light path. The infrared receiver 120 sends an infrared light path blocked information to the processor 130. After receiving the blocking information, the processor 130 can know that the diamond wire 600 has jumped. The processor 130 transmits the blocked information to the alarm light in the slicer display screen 140, and indicates a warning through the indication of the alarm light. The on-site operator can know that a jump has occurred from the alarm light on the display screen 140, stop the machine for jump processing, retract the jumper diamond wire 600 into the wire groove, and then continue cutting. According to the wire bow characteristics of the diamond wire 600 of the jumper, the detection unit 100 is set to perform infrared monitoring on the horizontal straight jumper, which can timely and accurately monitor the abnormal working conditions of the diamond wire 600, so that the jumper condition can be grasped at the first time, and the jumper problem can be handled to avoid serious damage to the diamond wire 600 and resulting in wire breakage, thereby minimizing the loss of silicon rods, reducing production costs, and improving cutting quality and silicon wafer qualification rate.

[0050] Furthermore, when the diamond wire 600 is working normally and no wire jump occurs, the infrared transmitter 110 or infrared receiver 120 placed at one end of the fixed unit 200 is normally connected to the infrared receiver 120 or infrared transmitter 110 correspondingly set at the other end of the fixed unit 200, the processor 130 does not issue a warning signal, and cutting proceeds normally.

[0051] Compared with the existing technology, the detection device and detection method designed in the present invention can quickly detect the abnormal state of diamond wire jumper during the cutting process and issue a warning in time with high accuracy, thereby avoiding the frequency of diamond wire jumper. At the same time, it also reduces the risk of diamond wire breakage, ensures cutting quality, improves the qualified rate of silicon wafers, improves production efficiency, and reduces production costs.

[0052] The above embodiments of the present invention are described in detail. The contents described are only preferred embodiments of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A device for detecting abnormal working of diamond wire of a slicer, used for detecting the state of the diamond wire wound on the axis of a sheave during cutting, characterized in that: The sheave seat at the end of at least one side of the sheave is away from the sheave and is arranged in the direction of the diamond wire, and has: A detection unit for monitoring the non-bow state of the diamond wire when it is pressed and cut by the silicon rod; a fixing unit for fixing the detection unit; The detection unit is tilted by the fixing unit at a set angle to the length direction of the diamond wire placed between the sheaves and close to the silicon rod; The angle range is 30-60°; The detection unit includes an infrared transmitter or an infrared receiver arranged at one end of the fixing unit, and the infrared receiver or the infrared transmitter correspondingly arranged at the other end of the fixing unit; The fixing unit has a mounting plate and a fixing frame, the mounting plate is coaxially arranged with the sheave seat; the fixing frame is placed on the side of the mounting plate away from the sheave and one end is fixed on the mounting plate, and the infrared transmitter or the infrared receiver is arranged at the other end of the fixing frame.

2. The device for detecting abnormal working of diamond wire of a slicer according to claim 1, characterized in that: The angle is 45°.

3. A device for detecting abnormal working of diamond wire of a slicer according to any one of claims 1 to 2, characterized in that: The detection unit further includes a processor connected to the infrared receiver.

4. The device for detecting abnormal working of diamond wire of a slicer according to claim 3, characterized in that: An arc hole is provided on the mounting plate, and the fixing frame is rotatably arranged along the arc hole with the center of the mounting plate as the center of the circle; the angle of the arc hole is 30-60 degrees.

5. The device for detecting abnormal working of diamond wire of a slicer according to claim 4, characterized in that: The fixing unit also includes a positioning frame and an adjusting frame, and the positioning frame and the adjusting frame are arranged on the same side of the fixing frame; one end of the adjusting frame is connected to the fixing frame, and the other end slides along the length direction of the positioning frame; one end of the positioning frame is fixed on the mounting plate, and the other end is clamped in a groove arranged on the outer edge of the mounting plate and the opening is arranged outward.

6. A method for detecting abnormal operation of diamond wire of a slicer, characterized in that: By adopting the detection device according to any one of claims 1 to 5, the situation in which the diamond wire is in a non-bow state when being pressed and cut by the silicon rod during the cutting process is detected; wherein the detection unit is tilted by the fixing unit according to a set angle and the length direction of the diamond wire placed between the groove wheels and close to the side of the silicon rod.

7. The method for detecting abnormal operation of diamond wire of a slicer according to claim 6, characterized in that: When the diamond wire works abnormally, the signals of the infrared transmitter or infrared receiver placed at one end of the fixed unit and the corresponding infrared receiver or infrared transmitter set at the other end of the fixed unit are blocked by the diamond wire of the jumper, and the processor of the detection unit sends a warning signal after receiving the blocking information transmitted by the infrared receiver.

8. The method for detecting abnormal operation of diamond wire of a slicer according to claim 7, characterized in that: When the diamond wire works normally, the infrared transmitter or infrared receiver at one end of the fixing unit is connected to the infrared receiver or infrared transmitter at the other end of the fixing unit, and the processor does not issue a warning signal.

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