Modified lighting device with improved thermal properties
By using a support structure and inclined heat dissipation components in the design of LED modified lighting devices, the problems of heat density and light distribution in LED modification are solved, achieving efficient heat management and light distribution simulation, which is suitable for applications such as automotive headlights.
Patent Information
- Application Number
- CN202110495916.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-05-07
- Filing Date
- 2021-05-07
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2041-05-07
AI Technical Summary
Existing LED-modified lighting devices are insufficient in mimicking the light emission properties of halogen lamps and handling heat density. In particular, the large installation area and light-emitting area of LEDs lead to increased heat density, making it difficult to meet the requirements of automotive applications.
The support structure extends from the heat sink, including the mounting section and the inclined heat dissipation component. The LED light-emitting elements are arranged with a specific geometry, and the heat dissipation is effectively achieved by using metal materials, such as the support structure and heat dissipation component made of copper or aluminum. Combined with printed circuit boards and heat pipes, heat transfer and light distribution are optimized.
It effectively reduces the temperature of LEDs, improves the heat density problem, and can mimic the light distribution of halogen lamps, making it suitable for applications such as automotive headlights.
Smart Images

Figure CN113623608B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to: a lighting device including a support structure extending from a radiator and at least one first heat dissipation member for supporting the function of the radiator; a method of manufacturing the lighting device; and an automotive headlight including the lighting device. Background Technology
[0002] Lighting devices such as halogen lamps have been the standard light source for automotive headlights for many years. However, recent advancements in LED technology, with its new design possibilities and energy efficiency, have sparked interest in finding suitable replacements for halogen lamps based on LED technology, often referred to as LED-based alternatives.
[0003] Although LED retrofitting has become popular in recent years, its ability to mimic halogen lamps is not yet optimal. For example, when LED chips are used to mimic the light emission of halogen lamps not only in the near field but also in the far field, the different geometries of the halogen lamp (filament) and, for example, the light-emitting area of the LED chip (light-emitting surface) can cause difficulties.
[0004] In particular, compared to the surface area of, for example, the filament of a standard halogen lamp, the mounting area of the LED in current LED modifications and the corresponding luminous area of such current LED modifications are relatively large. This makes such LED modifications particularly unsuitable for applications such as automotive, because their light emission properties do not meet the corresponding requirements.
[0005] While the size problem of such a large light-emitting area can be solved by arranging the corresponding LEDs in a smaller volume, this method is hampered by heat density, which increases sharply as the distance between LEDs decreases. Summary of the Invention
[0006] Therefore, one object of the present invention is to provide a lighting device that, on the one hand, has an improved ability to mimic the light emission properties of a conventional halogen lamp, and on the other hand, has an improved ability to cope with high heat density. A further object of the present invention is to provide a method for manufacturing the lighting device.
[0007] According to a first aspect of the invention, a lighting device is provided, comprising: a support structure extending from a heat sink and including a mounting portion having a central mounting surface and first and second transverse mounting surfaces, wherein each of the first and second transverse mounting surfaces is adjacent to and forms an angle with the central mounting surface; a first arrangement of at least two light-emitting elements arranged along a mounting direction on the central mounting surface; a second arrangement of at least two light-emitting elements arranged along a mounting direction on the first transverse mounting surface; a third arrangement of at least two light-emitting elements arranged along a mounting direction on the second transverse mounting surface; and at least one first heat-dissipating member extending from an outer surface of the support structure, the support structure including a corresponding one of the first and second transverse mounting surfaces, the at least one first heat-dissipating member including an inclined surface inclined relative to the corresponding one of the first and second transverse mounting surfaces, such that the thickness of the at least one first heat-dissipating member increases in a direction away from the mounting portion.
[0008] According to a second aspect of the invention, a method of manufacturing such a lighting device is provided, the method comprising: providing a support structure extending from a heat sink and including a mounting portion having a central mounting surface and first and second lateral mounting surfaces, wherein each of the first and second lateral mounting surfaces is adjacent to and forms an angle with the central mounting surface; providing a first arrangement of at least two light-emitting elements arranged along a mounting direction on the central mounting surface; providing a second arrangement of at least two light-emitting elements arranged along a mounting direction on the first lateral mounting surface; providing a third arrangement of at least two light-emitting elements arranged along a mounting direction on the second lateral mounting surface; and providing at least one first heat-dissipating member extending from an outer surface of the support structure, the support structure including a corresponding one of the first and second lateral mounting surfaces, the at least one first heat-dissipating member including an inclined surface inclined relative to the corresponding one of the first and second lateral mounting surfaces, such that the thickness of the at least one first heat-dissipating member increases in a direction away from the mounting portion.
[0009] According to a third aspect of the invention, a car headlight is provided that includes a lighting device according to the first aspect.
[0010] Exemplary embodiments of the first, second, and third aspects of the present invention may have one or more of the properties described below.
[0011] In an exemplary embodiment, the heat sink is a component comprising metal or substantially composed of metal, wherein "substantially composed of" is to be understood as being primarily composed of such metal (at least 90% in the exemplary embodiment), and may include other materials (such as impurities). In an exemplary embodiment, the metal is copper and / or aluminum. In an exemplary embodiment, the heat sink is a passive heat exchanger that transfers heat generated by a respective arrangement of at least two light-emitting elements (which is transferred from the light-emitting elements to the heat sink, particularly via a support structure) away to, for example, a fluid medium (such as air).
[0012] In an exemplary embodiment, the first, second, and third light-emitting elements are light-emitting diodes (LEDs), particularly LED chips. Using LEDs is advantageous in terms of efficiency (the ratio of light output power to electrical power consumption), and therefore, for example, the color of the light can be suitably selected for a specific application.
[0013] In an exemplary embodiment, a support structure extending from the heat sink is configured to transfer heat from the LED to the heat sink, and for this purpose, in an exemplary embodiment, the support structure comprises or is substantially composed of metal, particularly copper or aluminum.
[0014] In an exemplary embodiment, the mounting portion is substantially a longitudinal member and has a substantially cubic shape. In an exemplary embodiment, the mounting portion, included by the support structure, comprises metal or is substantially composed of metal, particularly copper or aluminum. In an exemplary embodiment, forming an angle with the central mounting surface means that the first and second lateral mounting surfaces are arranged parallel to each other and form an angle of 90° ± 5° with the central mounting surface. In an exemplary embodiment, the first and second lateral mounting surfaces are therefore arranged opposite each other.
[0015] In an exemplary embodiment, at least one first heat dissipation member corresponds to or includes a separate member made of metal, particularly copper or aluminum. While in an alternative exemplary embodiment, at least one first heat dissipation member is integrally formed with the support structure, it is advantageous to provide at least one first heat dissipation member as a separate component because in this way, the first heat dissipation member can be advantageously designed according to heat dissipation requirements, i.e., it can be designed to optimally support and guide the heat generated by the first, second, and third arranged light-emitting elements away. In particular, by providing an inclined surface and having a thickness that increases in the direction away from the mounting portion, at least one first heat dissipation member not only advantageously supports the function of the heat sink in guiding the heat generated by the light-emitting elements away, but also allows the distribution of light emitted from the corresponding light-emitting elements to advantageously mimic the light distribution of the filament of a standard halogen lamp. In particular, this shape of the first heat dissipation member can avoid any necessary absorption of light emitted from the first, second, and third arranged light-emitting elements.
[0016] In an exemplary embodiment, the proximal edge of at least one first heat dissipation member is arranged substantially adjacent to a second or third arrangement of at least two light-emitting elements, which correspond to a respective one of the first and second lateral mounting surfaces included by the outer surface of the support structure from which the at least one first heat dissipation member extends. Note that the second or third arrangement of at least two light-emitting elements “arranged substantially adjacent” is to be understood as such that the proximal end can be arranged directly adjacent to the corresponding light-emitting element, or such that a small gap can exist between the corresponding light-emitting element and the proximal end. In an exemplary embodiment, the width of the gap is 0.1 to 3 mm, particularly 0.1 to 1 mm. Therefore, by arranging at least one first heat dissipation member near the light-emitting element, it may become advantageous to effectively guide the heat generated by the corresponding light-emitting element away. The function of at least one first heat dissipation member thus advantageously contributes to the effect of a heat sink, which is typically arranged relatively away from the light-emitting element (i.e., away from the heat source).
[0017] In an exemplary embodiment, at least one first heat dissipation component is mounted to direct contact with the support structure. For example, at least one first heat dissipation component can be connected to the support structure by applying solder paste. Alternatively, or additionally, in an exemplary embodiment, at least one first heat dissipation component is mounted to direct contact with the support structure using a pick-and-place process and / or a reflow process. Using such a process to mount at least one first heat dissipation component results in a combination of very accurate placement and a good thermal interface.
[0018] In an exemplary embodiment, the outer surface of at least one first heat dissipation member extending from its supporting structure includes a first surface portion and a second surface portion, the second surface portion being separated from the first surface portion by a step, wherein the second surface portion includes a corresponding one of a first and a second lateral mounting surface, and wherein the proximal edge of at least one first heat dissipation member is disposed on the second surface portion. Advantageously, the shape of the outer surface including the step (which can therefore be referred to as a "mounting step") supports precise and reliable mounting of at least one first heat dissipation member.
[0019] In an exemplary embodiment, an inclined surface extends from the proximal edge of at least one first heat dissipation member to the distal edge of at least one first heat dissipation member, wherein the at least one first heat dissipation member comprises a substantially triangular cross-section, wherein one angle of the triangular cross-section is formed by the proximal edge and a side of the triangular cross-section opposite to said angle forms the distal edge. Thus, in an exemplary embodiment, the substantially triangular cross-section is a cross-section of at least one first heat dissipation member perpendicular to the mounting direction. As previously stated, the mounting step is included on the outer surface of the support structure from which at least one first heat dissipation member extends. Therefore, "substantially triangular" should be understood to mean, in particular, that one side of the cross-section in contact with the outer surface of the support structure from which at least one first heat dissipation member extends may include a step corresponding to the mounting step between the first and second surface portions.
[0020] As a result, it is particularly advantageous to provide at least one first heat dissipation member, especially when combined with a specific geometry of the support structure and mounting portion (which has three corresponding mounting surfaces for the corresponding arrangement of the light-emitting elements). On the one hand, by having a specific shape with increased thickness away from the mounting portion, at least one first heat dissipation member supports and facilitates the function of arranging the light-emitting elements to mimic the light distribution of a conventional halogen lamp filament. On the other hand, by being located near the light-emitting elements, at least one first heat dissipation member advantageously supports the function of the heat sink in guiding the heat generated by the light-emitting elements away. At least one first heat dissipation member thus advantageously helps to solve the size problem of the conventional LED modification disclosed above. In other words, at least one first heat dissipation member advantageously allows the light-emitting elements to be arranged with a particularly small mutual distance, thereby facilitating the function of the corresponding arrangement to mimic the light distribution of a conventional halogen lamp filament.
[0021] In an exemplary embodiment, the support structure includes at least one mounting recess, and wherein at least one first heat dissipation member is a separate member at least partially received by the at least one mounting recess. As mentioned, providing at least one first heat dissipation member as a separate component enables advantageous flexibility in providing at least one first heat dissipation member according to the specific geometry of the arrangement of the light-emitting elements. In combination, the mounting recess of the support structure advantageously facilitates the precise and reliable mounting of at least one first heat dissipation member at the support structure.
[0022] In an exemplary embodiment, the mounting portion includes corresponding edge portions of first and second layers, which are insulated from each other and respectively configured for electrically connecting at least one of at least two light-emitting elements. For this purpose, in an exemplary embodiment, the first and second layers comprise or are substantially composed of a metallic material, such as a metal, metal mixture, or alloy, having good electrical and thermal conductivity, such as copper and / or aluminum. Thus, "substantially composed of" is to be understood as primarily composed of such a metal (e.g., at least 90%), and may include other materials (such as impurities). In an exemplary embodiment, the first and second layers are substantially planar layers (which may be bent once or multiple times depending on the application), arranged parallel to each other and adjacent to each other, and separated by an insulating layer comprising, for example, a dielectric insulating material. In an exemplary embodiment, a central mounting surface is formed by corresponding surfaces of the two edge portions of the first and second layers, and a first lateral mounting surface is particularly comprised only and / or entirely of the first layer, and a second lateral mounting surface is particularly comprised only and / or entirely of the second layer.
[0023] Providing a lateral mounting surface on a respective layer of the first and second layers advantageously allows for individual control of the respective arrangement of the light-emitting elements. Furthermore, by arranging all the light-emitting elements on a mounting surface comprised of a component consisting of or made of metallic material, the first and second layers further advantageously allow for the conduction of heat generated by the light-emitting elements away from them.
[0024] In an exemplary embodiment, the first and second layers each comprise a printed circuit board, particularly an insulating metal substrate. For example, the first and second layers may be formed from a double-sided or two single-sided insulating metal substrates (IMS), and in this case, the central mounting surface corresponds to the edge of a double-sided IMS or the respective adjacent edge of one of the two single-sided IMS. The use of printed circuit boards, particularly insulating metal substrates, advantageously allows for individual control of the respective light-emitting elements and advantageously facilitates heat transfer away from the light-emitting elements.
[0025] In an exemplary embodiment, the lighting device further includes a second heat dissipation member disposed between the first and second layers, particularly in direct mechanical contact with the first and second layers. For example, the second heat dissipation member may comprise or be composed of a foil of thermally conductive material, and may extend between the first and second layers to a heat sink to further support heat transfer away from the light-emitting element. In an exemplary embodiment, the second heat dissipation member includes a layer comprising carbon fibers, particularly a foil. In an exemplary embodiment, the second heat dissipation member extends at least partially between the first and second layers to a heat sink and is in direct contact with the heat sink.
[0026] In an exemplary embodiment, the lighting device further includes a third heat dissipation member arranged along an edge portion of a mounting portion opposite to the central mounting surface. Thus, the third heat dissipation member can extend toward and be directly connected to the heat sink. In an exemplary embodiment, the third heat dissipation member includes at least one heat pipe arranged along corresponding edge portions of the first and second layers. In an exemplary embodiment, at least one heat pipe is at least partially filled with a fluid, particularly water and / or air.
[0027] As a result, particularly when combined with a specific geometry of the lighting device (which includes three mounting surfaces for the corresponding arrangement of the light-emitting elements), the combination of at least one first, second, and third heat-dissipating member advantageously allows for the efficient conduction of heat away from the light-emitting elements, and thus advantageously allows for the close arrangement of the light-emitting elements and thus helps to solve the aforementioned size problems of conventional LED modifications. Consequently, the entirety of at least one first, second, and third heat-dissipating member advantageously utilizes the geometry given by the specific support structure, such that a heat transfer system is realized for this specific geometry (particularly including the first and second layers), which not only optimizes for heat conduction purposes but also advantageously promotes and supports the light distribution properties of the lighting device.
[0028] In an exemplary embodiment, the lighting device according to the first aspect is a light source (e.g., a lamp), configured for mounting to a lighting system, particularly an automotive headlight. Different lighting systems include, for example, projector systems, flashlights, etc. Configured in this way, the lighting device may further include, for example, a suitable socket for mounting the lighting device to such a lighting system.
[0029] According to the present invention, the features and exemplary embodiments of the invention described above may equivalently relate to different aspects. In particular, by disclosing features related to the lighting device according to the first aspect, corresponding features related to the method according to the second aspect or the automotive headlights according to the third aspect are also disclosed.
[0030] It should be understood that the embodiments of the present invention presented in this section are merely exemplary and not limiting.
[0031] Other features of the invention will become clear from the following detailed description taken in conjunction with the accompanying drawings. However, it should be understood that the drawings are for illustrative purposes only and are not intended to limit the invention; the definition of limitations should be sought in conjunction with the appended claims. It should be further understood that the drawings are not drawn to scale and are intended only to conceptually illustrate the structures and processes described herein. Attached Figure Description
[0032] Examples of the invention will now be described in detail with reference to the accompanying drawings, in which:
[0033] Figure 1 An exemplary illustration shows a headlight with a conventional halogen lamp.
[0034] Figure 2A An exemplary illustration shows a lighting device according to an embodiment of the present invention;
[0035] Figure 2B An exemplary illustration shows the following based on Figure 2A Details of the lighting fixtures;
[0036] Figure 2C An exemplary illustration is shown. Figure 2A The lighting fixture, in which the first heat dissipation component has been removed;
[0037] Figure 3 An exemplary illustration shows a portion of a lighting device according to an exemplary embodiment; and
[0038] Figure 4 A portion of a lighting device according to an exemplary embodiment is illustrated. Detailed Implementation
[0039] Figure 1 A headlight 100 with a reflector 120 is shown, to which an exemplary conventional H7 halogen lamp 110 is mounted. The filament 111 of the halogen lamp 110 is positioned at or near the focal point of the reflector 120 such that light 132 emitted from the filament 111 is reflected by the reflector 120 along a main illumination direction 150. A cover 121 may incorporate suitable optics to shape the reflected light and form light 133 exiting the headlight 100. The lamp 110 includes a socket 114 mounted to the reflector 120 via a mounting portion 116. Pins 117a and 117b extend from the socket 114 for electrical connection. A bulb 113 extends from a base portion 115 surrounding the filament 111 and terminates in a light-blocking portion 112 that blocks direct light from the filament 111.
[0040] Figure 2A , Figure 2B and Figure 2C A corresponding view of an exemplary lighting device 1 according to an exemplary embodiment of the present invention is shown. Thus, Figure 2A A three-dimensional view of a portion of the lighting device 1 is shown, wherein two first heat dissipation components 18a, 18b are mounted to corresponding mounting recesses 11a, 11b, and Figure 2C It shows Figure 2A A three-dimensional view of a portion of the lighting device 1, wherein heat dissipation components 18a and 18b have been removed. Figure 2B Detailed illustration Figure 2A and Figure 2C The mounting part 14 of the lighting device 1.
[0041] Lighting device 1 is an example of an LED (light-emitting diode) modification, for example, connected to a corresponding automotive headlight (not shown). Replacement Figure 1 The lighting device 1 includes a bulb 113 and a filament 111. It also includes a support structure 13 and arrangements 20, 21, and 22 of light-emitting diodes (LEDs), which are examples of light-emitting elements. The support structure 13 extends from a heat sink 10, which may include, be connected to, or correspond to a socket (not shown) for mounting the lighting device 1 to a headlight.
[0042] As from Figure 2B It can be deduced that the support structure 13 includes a mounting portion 14, which has a central mounting surface 14.2, a first transverse mounting surface 14.1, and a second transverse mounting surface 14.3. Thus, the first transverse mounting surface 14.1 and the second transverse mounting surface 14.3 are directly adjacent to the central mounting surface 14.2, and form an angle of 90°±5° with the central mounting surface 14.5, respectively. The first arrangement 21 of LEDs 21.1, 21.2, 21.3, 21.4, and 21.5 is arranged along the mounting direction 30 on the central mounting surface 14.2; the second arrangement 20 of LEDs 20.1, 20.2, 20.3, 20.4, and 20.5 is arranged along the mounting direction 30 on the first transverse mounting surface 14.1; and the third arrangement 22 of LEDs 22.1, 22.2, 22.3, 22.4, and 22.5 (only LED 22.5 is visible in the figure) is arranged along the mounting direction 30 on the second transverse mounting surface 14.3.
[0043] Return to Figure 2A The two first heat dissipation components 18a and 18b are installed into the corresponding mounting grooves 11a and 11b of the support structure 13 (see...). Figure 2C The first heat dissipation components 18a and 18b are therefore separate components made of copper in the exemplary embodiment. Providing separate first heat dissipation components of copper offers the advantage that such a material with particularly advantageous heat transfer capabilities can be used near the heat source (LED), while as a result, materials with lower (generally cheaper) heat transfer capabilities (such as aluminum) may be sufficient as the material for the heat sink 10.
[0044] As from Figure 2A It can be concluded that the first heat dissipation components 18a and 18b are located on the outer surfaces 11a.1, 11a.2, and 11a.3 of the supporting structure 13, respectively (see...). Figure 2CThe first heat dissipation member 18a, 18b extends from the first lateral mounting surface 14.1 and the second lateral mounting surface 14.3, respectively, and includes inclined surfaces 19a, 19b that are inclined relative to one of these surfaces (from which the corresponding first heat dissipation members 18a, 18b extend). Therefore, the thickness of at least one first heat dissipation member 18a, 18b increases along a direction 40 away from the mounting portion 14. In other words, for example, the inclined surface 19a extends from the proximal edge 19a.1 of the first heat dissipation member 18a to the distal edge 19a.2 of the first heat dissipation member 18a, which includes a substantially triangular cross-section, wherein one corner of the triangular cross-section is formed by the proximal edge 19a.1 and the distal edge 19a.2 is formed by one side of the triangular cross-section opposite to said corner. One side of the triangular cross-section of the first heat dissipation member 18a in contact with the support structure 13 thus matches in shape with the first surface portion 11a.1, the step 11a.2, and the second surface portion 11a.3. In this manner, the first heat dissipation component 18a is precisely and reliably mounted, thereby allowing the first heat dissipation component 18a to be arranged substantially adjacent to the second arrangement 20 of LEDs 20.1, 20.2, 20.3, 20.4 and 20.5 arranged on the first transverse mounting surface 14.1.
[0045] As a result, the first heat dissipation components 18a and 18b advantageously allow heat to be transferred away from the LEDs mounted to the mounting portion 14. For example, when the lighting device 1 operates without the first heat dissipation components 18a and 18b, the corresponding temperatures of the LEDs 20.1, 20.2, 20.3, 20.4, and 20.5 in the second arrangement 20 are 99.04°C, 110.41°C, 113.49°C, 111.38°C, and 97.56°C, respectively. When the first heat dissipation components 18a and 18b are mounted to the support structure 13, under the same operating conditions, these temperatures decrease to 92.96°C, 101.37°C, 103.75°C, 101.95°C, and 92.39°C. In other words, particularly, due to the first heat dissipation components 18a and 18b, the temperature of the central LED 20.3, which becomes the hottest during operation, is reduced by approximately 10°C. Therefore, the function of existing radiators can be advantageously improved by simply adding the first heat dissipation components 18a and 18b.
[0046] Return to Figure 2BThe mounting portion 14 includes corresponding edge portions of the first layer 13.1 and the second layer 13.2, which are insulated from each other by the dielectric insulating layer 17. The first layer 13.1 and the second layer 13.2 correspond to the insulating metal substrate (IMS) and respectively include additional layers 13.1a, 13.1b, 13.2a, and 13.2b, which can be used to provide corresponding polarities to suitably contact the LEDs of the LED arrangements 20, 21, and 22. Thus, the central mounting surface 14.2 is formed by the corresponding surfaces of the two edge portions of the first layer 13.1 and the second layer 13.2, the first lateral mounting surface 14.1 is completely included by the first layer 13.1, and the second lateral mounting surface 14.3 is completely included by the second layer 13.2.
[0047] like Figure 3 As shown, the construction of the support structure 13, including the first layer 13.1 and the second layer 13.2, advantageously allows for the insertion of an additional second heat dissipation member 15 in the form of carbon fiber foil between the first layer 13.1 and the second layer 13.2 of the support structure 13. In the case where it is exemplarily shown in the figures covering the top of layer 13.2, under the installation conditions of the lighting device 1, the second heat dissipation member 15 is inserted between the first layer 13.1 and the second layer 13.2. Further, in the case where it is exemplarily shown in the figures covering only a portion of the second layer 13.2, the second heat dissipation member 15 can extend further and can be mechanically connected, for example, to the heat sink 10 to further support heat transfer from the LED to the heat sink 10.
[0048] Figure 4 A third heat dissipation component 16 in the form of a heat pipe is shown. As shown, the heat pipe 16 is arranged along the edge portion of the mounting portion 14 opposite to the central mounting surface 14.2, i.e., along the corresponding edge portions 13.1c, 13.2c of the first layer 13.1 and the second layer 13.2 (the first layer 13.1 and its edge portion 13.1c are not shown for better viewing of the remaining portion). As further shown, the heat pipe 16 is mechanically and thermally connected to the radiator 10 to further support heat transfer. Although the heat pipe 16 may have a circular cross-section, in the exemplary embodiment, at least one outer surface of the heat pipe 16 in contact with the support structure 13 and / or the first layer 13.1 and / or the second layer 13.2 is flat. Thus, particularly advantageous thermal contact can be achieved between the heat pipe 16 and / or the support structure 13 and / or the first layer 13.1 and / or the second layer 13.2. For this purpose, for example, in the exemplary embodiment, the heat pipe 16 includes a triangular or polygonal cross-section.
[0049] lighting fixtures 1 heat sink 10 Mounting groove 11a, 11b External surfaces (first surface portion, step, second surface portion) 11a.1, 11a.2, 11a.3 Support structure 13 First layer 13.1 Second floor 13.2 Edge portions of the first and second layers 13.1c, 13.2c The other layers of the first and second layers 13.1a, 13.1b, 13.2a, 13.2b Installation Department 14 First horizontal mounting surface 14.1 Central mounting surface 14.2 Second lateral mounting surface 14.3 Second heat dissipation component 15 Third heat dissipation component 16 Dielectric insulating layer 17 First heat dissipation component 18a, 18b Inclined surface 19a, 19b The proximal edge of the first heat dissipation component 19a.1 The far edge of the first heat dissipation component 19a.2 Second arrangement of at least two light-emitting elements 20 The second arrangement of LEDs 20.1,20.2,20.3,20.4,20.5 First arrangement of at least two light-emitting elements 21 The first LED arrangement 21.1,21.2,21.3,21.4,21.5 A third arrangement of at least two light-emitting elements 22 The third arrangement of LEDs 22.1,22.2,22.3,22.4,22.5 Installation direction 30 Away from the installation department 40 Headlights 100 halogen lamp 110 filament 111 Light-blocking part 112 Light bulb 113 socket 114 base part 115 Installation section 116 pin 117a, 117b reflector 120 Cover 121 Light 132,133 Main lighting direction 150
Claims
1. A lighting device (1), comprising: - A support structure (13) extends from the heat sink (10) and includes a mounting portion (14) having a central mounting surface (14.2) and first and second lateral mounting surfaces (14.1, 14.3), wherein each of the first and second lateral mounting surfaces (14.1, 14.3) is adjacent to the central mounting surface (14.2) and forms an angle with the central mounting surface (14.1); - A first arrangement (21) of at least two light-emitting elements (21.1, ..., 21.5) arranged along the mounting direction (30) on the central mounting surface (14.2); - A second arrangement (20) of at least two light-emitting elements (20.1, ..., 20.5) arranged along the mounting direction (30) on the first transverse mounting surface (14.1); - A third arrangement (22) of at least two light-emitting elements (22.1, ..., 22.5) arranged along the mounting direction (30) on the second transverse mounting surface (14.3); and - At least one first heat dissipation member (18a, 18b) extends from the outer surface (11a.1, 11a.3) of the support structure (13), the support structure (13) including a corresponding one of the first and second lateral mounting surfaces (14.1, 14.3), the at least one first heat dissipation member (18a, 18b) including an inclined surface (19a, 19b) inclined relative to the corresponding one of the first and second lateral mounting surfaces (14.1, 14.3), such that the thickness of the at least one first heat dissipation member (18a, 18b) increases along a direction (40) away from the mounting portion (14). The at least one first heat dissipation component (18a, 18b) is a separate component.
2. The lighting device (1) according to claim 1, wherein the proximal edge (19a.1) of the at least one first heat dissipation member (18a, 18b) is arranged substantially adjacent to the second or third arrangement (20, 22) of at least two light-emitting elements corresponding to the respective one of the first and second lateral mounting surfaces (14.1, 14.3).
3. The lighting device (1) according to claim 2, wherein the outer surface (11a.1, 11a.3) of the support structure (13) from which the at least one first heat dissipation member (18a, 18b) extends includes a first surface portion (11a.1) and a second surface portion (11a.3), the second surface portion (11a.3) being separated from the first surface portion (11a.1) by a step (11a.2), wherein the second surface portion (11a.3) includes a corresponding one of the first and second lateral mounting surfaces (14.1, 14.3), and wherein the proximal edge (19a.1) of the at least one first heat dissipation member (18a, 18b) is disposed on the second surface portion (11a.3).
4. The lighting device (1) according to claim 3, wherein the inclined surfaces (19a, 19b) extend from the proximal edge (19a.1) of the at least one first heat dissipation member (18a, 18b) to the distal edge (19a.2) of the at least one first heat dissipation member (18a, 18b), wherein the at least one first heat dissipation member (18a, 18b) comprises a substantially triangular cross section, wherein one corner of the triangular cross section is formed by the proximal edge (19a.1) and the distal edge (19a.2) is formed on one side of the triangular cross section opposite to the one corner.
5. The lighting device (1) according to claim 1, wherein the support structure (13) includes at least one mounting groove (11a, 11b), and wherein the at least one first heat dissipation member (18a, 18b) is a separate member at least partially accommodated by the at least one mounting groove (11a, 11b).
6. The lighting device (1) according to claim 1, wherein the mounting portion (14) includes corresponding edge portions of the first and second layers (13.1, 13.2), the first and second layers (13.1, 13.2) being insulated from each other and respectively configured for electrically connecting at least one of the first, second and third arrangements (20, 21, 22) of at least two light-emitting elements.
7. The lighting device (1) according to claim 6, wherein the central mounting surface (14.2) is formed by corresponding surfaces of two edge portions of the first and second layers (13.1, 13.2), wherein the first lateral mounting surface (14.1) is included by the first layer (13.1), and wherein the second lateral mounting surface (14.2) is included by the second layer (13.2).
8. The lighting device (1) according to claim 7, wherein the first and second layers (13.1, 13.2) respectively comprise printed circuit boards.
9. The lighting device (1) according to claim 8, wherein the first and second layers (13.1, 13.2) respectively comprise an insulating metal substrate.
10. The lighting device (1) according to any one of claims 7-9, further comprising a second heat dissipation member (15) disposed between the first and second layers (13.1, 13.2).
11. The lighting device (1) according to claim 10, wherein the second heat dissipation member (15) comprises a layer containing carbon fiber.
12. The lighting device (1) according to claim 10, further comprising a third heat dissipation member (16) arranged along the edge portion of the mounting portion (14) opposite to the central mounting surface (14.2).
13. The lighting device (1) according to claim 12, wherein the third heat dissipation member (16) comprises at least one heat pipe arranged along the respective edge portions (13.2c) of the first and second layers (13.1, 13.2).
14. The lighting device (1) according to claim 1, wherein the first and second transverse mounting surfaces (14.1, 14.3) are arranged parallel to each other and form an angle of 90°±5° with the central mounting surface (14.2).
15. A method for manufacturing a lighting device (1) according to any one of claims 1 to 14, the method comprising: - Provide the support structure (13), the support structure (13) extending from the heat sink (10) and including the mounting portion (14) having the central mounting surface (14.2) and the first and second lateral mounting surfaces (14.1, 14.3), wherein each of the first and second lateral mounting surfaces (14.1, 14.3) is adjacent to the central mounting surface (14.2) and forms an angle with the central mounting surface (14.2); -The first arrangement (21) provides at least two light-emitting elements (21.1, ..., 21.5) arranged along the mounting direction (30) on the central mounting surface (14.2); - A second arrangement (20) is provided on the first transverse mounting surface (14.1) with at least two light-emitting elements (20.1, ..., 20.5) arranged along the mounting direction (30); - A third arrangement (22) providing at least two light-emitting elements (22.1, ..., 22.5) arranged along the mounting direction (30) on the second lateral mounting surface (14.3); and - Provide at least one first heat dissipation member (18a, 18b) extending from the outer surface (11a.1, 11a.3) of the support structure (13), the support structure (13) including a corresponding one of the first and second lateral mounting surfaces (14.1, 14.3), the at least one first heat dissipation member (18a, 18b) including the inclined surface (19a, 19b) inclined relative to the corresponding one of the first and second lateral mounting surfaces (14.1, 14.3), such that the thickness of the at least one first heat dissipation member (18a, 18b) increases along a direction (40) away from the mounting portion (14), the at least one first heat dissipation member (18a, 18b) being a separate member.
16. A car headlight comprising a lighting device (1) according to any one of claims 1 to 14.
Citation Information
Patent Citations
Support for light-emitting elements and lighting device
US20200084889A1