Adhesion and detachment device, automatic adhesion and detachment system and adhesion and detachment method for wireless electrostatic chuck

Abstract

The present invention relates to an adhesion / detachment device, an automatic adhesion / detachment system and an adhesion / detachment method for a wireless electrostatic chuck, which are used for automatically bonding a wireless electrostatic carrier plate with a thinned substrate and automatically detaching them after bonding. The system comprises a machine body, at least one transfer device, at least one baking device, at least one pre-alignment device and at least one adhesion / detachment device. The adhesion / detachment device includes a carrier plate electrostatic generation group for adsorbing a wireless electrostatic carrier plate and a substrate transfer group for adsorbing a thinned substrate. The substrate transfer group can linearly displace relative to the carrier plate electrostatic generation group, so that the substrate transfer group can drive the thinned substrate to be pressed against the surface of the wireless electrostatic carrier plate of the carrier plate electrostatic generation group. Thus, the carrier plate electrostatic generation group can be driven to generate an electrostatic power field on the wireless electrostatic carrier plate to bond the thinned substrate, thereby improving the bonding efficiency and meeting the requirements of high-precision processes to meet the needs of automatic production of thinned substrates.

Description

Technical Field

[0001] The present invention belongs to an automatic bonding technology for electrostatic chucks, and more specifically, it refers to a bonding and de-bonding device, an automatic bonding and de-bonding system, and a bonding and de-bonding method for a wireless electrostatic chuck, so as to enable the electrostatic chuck to perform automatic bonding and dissociation with a thinned substrate such as a wafer, improve work efficiency, reduce bonding failures and substrate breakage, and thus improve the process automation of the thinned substrate. Background Art

[0002] In recent years, due to the miniaturization development of semiconductor processes, such as memory and power devices, their miniaturization has been moving towards smaller sizes, higher performance, and lower costs. In order to make the chip area smaller, the semiconductor industry has adopted a design solution to change the original horizontally deployed chip design into a vertically stacked manner, that is, the so-called 3D IC stacked packaging. Since 3D IC stacked packaging is stacked vertically, the Through-Silicon Via (TSV) technology is required to physically and electrically connect the functional chips in the IC package. Therefore, the thickness of the silicon wafer will be compressed to less than 100 microns. In addition, recently, the camera quality of smart phones is comparable to that of professional single-lens reflex cameras. One of the key factors for the significant improvement in the imaging quality of smart phone camera lenses is the introduction of ultra-thin blue glass filters into the mobile phone camera lenses, which can absorb excess infrared light and restore the true color of the object.

[0003] When these thinned substrates, whether they are thinned wafers for 3D ICs or ultra-thin filters for lenses, have a thickness less than 200μm, 100μm, or even less than 50μm, and the surface area is larger, such as 8 inches, 12 inches or more in semiconductor processes. The thinned substrate will become very soft and elastic, and thus warping will occur. However, in the production of thinned substrates such as silicon wafers or glass sheets, processes such as polishing, cleaning, multi-layer coating, etching, and cutting are required. Since the ultra-thin substrate will be uneven and stressed due to warping during the process, it will cause process defects such as uneven thickness during coating. Moreover, the thinned substrate cannot be effectively focused during inspection due to warping, resulting in detection errors or delayed detection time, which directly affects the detection of defective products. Furthermore, there are also problems such as low storage capacity, fragility, and vulnerability during the transportation and assembly of the thinned substrate. Therefore, the warping problem of the thinned substrate has a significant adverse impact on the process reliability, resulting in increased process costs and defect rates.

[0004] In order to enable the thinned substrate to enter the process while maintaining flatness, a temporary bonding process is currently adopted for the thinned substrate to strengthen the tensile strength of the thinned substrate. The temporary bonding process mainly uses a bonding material of multiple layers of polymers to reversibly mount the thinned substrate onto a carrier. However, after the process, peeling is required. Thus, the yield of the thinned substrate itself must be maintained both during bonding and peeling. At the same time, the bonding material used after bonding must also address the mismatch in the coefficient of thermal expansion (CTE) between the bonding material and the material to be bonded, maintain the internal stress of the thinned wafer, and maintain the surface smoothness of the front / back of the wafer, as well as the acid and alkali problems of the bonding material in the process environment. These are all the problems faced in the temporary bonding process.

[0005] The latest improvement method currently is to use a wireless electrostatic chuck (E-Chuck or Supporter) to bond the thinned substrate and then supply the thinned substrate for process operations. However, currently, the wireless electrostatic chuck bonds the thinned substrate manually. The manual bonding and peeling device pivotally mounts a substrate carrier that can be selectively covered on one side of an electrostatic force generating base. In use, the staff first places the thinned substrate on the electrostatic force generating base, and then rotates the upper substrate carrier downward manually and covers it on the electrostatic force generating base to adsorb the thinned substrate using the substrate carrier. After that, the staff places the wireless electrostatic chuck on the electrostatic force generator and rotates and covers the substrate carrier again to press the thinned substrate onto the opposite surface of the wireless electrostatic chuck. Finally, the conduction is started to generate a static electric field between the wireless electrostatic chuck and the thinned substrate, so that the thinned substrate can be bonded to the wireless electrostatic chuck. When dissociating the wireless electrostatic chuck from the thinned substrate, the reverse operation is performed. The wireless electrostatic chuck with the thinned substrate bonded is placed on the electrostatic force generating base, and then the substrate carrier is covered above the thinned substrate. After the electrostatic force generating base starts dissociation and releases the electric field of the wireless electrostatic chuck, the upper substrate carrier can adsorb the thinned substrate and lift it upward, thereby separating the wireless electrostatic chuck from the thinned substrate.

[0006] However, such a manual operation method is not only extremely slow, but also because the relative bonding surfaces of the wireless electrostatic chuck and the thinned substrate cannot be ensured to be clean and dry under the personnel environment operation, resulting in bonding failure, and thus the bonding operation needs to be performed again. Moreover, there may even be problems such as cracking or fragmentation due to misalignment, slippage, or uneven pressing. Therefore, its bonding efficiency is extremely poor. Furthermore, since the manual operation is carried out manually, it is difficult to accurately align the wireless electrostatic chuck and the thinned substrate during bonding. For semiconductor processes with high requirements for miniaturization and high precision, it is difficult to be directly applied to high-precision processes and can only be used in occasions with low precision requirements such as transmission and storage.

[0007] In other words, since the existing wireless electrostatic carrier plate bonds the thinned substrate manually, there are not only problems of poor efficiency and high failure rate, but also possible cracking or fragmentation may occur. At the same time, it cannot meet the requirements of high-precision processes. How to solve the above problems is expected by the industry and is also the technical problem to be solved by the present invention.

[0008] Therefore, the inventor of the present invention deeply explored the problems faced by the existing wireless electrostatic carrier plate when bonding the thinned substrate, and through the requirements of technological development in recent years, after continuous efforts in improvement and trial production, finally successfully developed a bonding and detachment device, an automatic bonding and detachment system, and a bonding and detachment method for a wireless electrostatic chuck, so as to overcome the disadvantages and inconveniences caused by the existing manual operation. Summary of the Invention

[0009] Therefore, the main object of the present invention is to provide a bonding and detachment device for a wireless electrostatic chuck, which can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracking or fragmentation.

[0010] Furthermore, the secondary main object of the present invention is to provide an automatic bonding and detachment system for a wireless electrostatic chuck, so that after automatic cleaning, baking, and pre-alignment, it can meet the requirements of high-precision processes and perform automatic bonding to meet the needs of automated production of thinned substrates.

[0011] Moreover, another main object of the present invention is to provide a bonding and detachment method for a wireless electrostatic chuck, which can quickly and accurately automatically bond a wireless electrostatic carrier plate and a thinned substrate, so that the wireless electrostatic carrier plate can bond the thinned substrate and be applied to subsequent processes, greatly improving the process yield of the thinned substrate, reducing costs, and increasing profits.

[0012] Based on this, the present creation mainly uses the following technical means to specifically achieve the above-mentioned objects and effects:

[0013] The present creation provides a bonding and detachment device for a wireless electrostatic chuck, which is used for bonding or dissociating a wireless electrostatic carrier plate and a thinned substrate. The bottom surface of the wireless electrostatic carrier plate has electrodes for generating or releasing an electrostatic power field. The bonding and detachment device includes:

[0014] A frame;

[0015] A carrier plate electrostatic generation group, which is arranged on the frame. The carrier plate electrostatic generation group has a working plane for selectively fixing the wireless electrostatic carrier plate, and the working plane has electrodes corresponding to contacting the positive and negative electrodes of the wireless electrostatic carrier plate. Moreover, the working plane can position the wireless electrostatic carrier plate or the thinned substrate in a correct position;

[0016] A substrate transfer group is provided on the frame and opposite to the carrier plate static electricity generation group, so that the substrate transfer group can adsorb a thinned substrate with a correct position and displace relative to the carrier plate static electricity generation group;

[0017] Thereby, after the substrate transfer group drives the thinned substrate to be pressed against the wireless static electricity carrier plate, it can drive the carrier plate static electricity generation group to generate an electrostatic power field on the wireless static electricity carrier plate to bond the thinned substrate.

[0018] The present invention further provides an automatic bonding and debonding system for a wireless electrostatic chuck, which is used for the automatic bonding of a wireless electrostatic carrier plate and a thinned substrate and the automatic debonding after bonding. The bottom surface of the wireless electrostatic carrier plate has a conductive pole for generating or releasing an electrostatic power field, and there is a positioning notch for determining the orientation on the periphery of the wireless electrostatic carrier plate and the thinned substrate. The automatic bonding and debonding system includes:

[0019] A machine body, which includes at least one substrate feeding interface and at least one carrier plate feeding interface;

[0020] At least one baking device is provided on the machine body, and the at least one baking device includes at least one substrate baking group for baking the thinned substrate and at least one carrier plate baking group for baking the wireless electrostatic carrier plate;

[0021] At least one pre-alignment device is provided on the machine body for the wireless electrostatic carrier plate and the thinned substrate to pre-determine the specified orientation by using the positioning notch;

[0022] At least one bonding and debonding device, the bonding and debonding device includes a carrier plate static electricity generation group for adsorbing a wireless electrostatic carrier plate and a substrate transfer group for adsorbing a thinned substrate. The substrate transfer group can linearly displace relative to the carrier plate static electricity generation group, so that the substrate transfer group can drive the thinned substrate to be correspondingly pressed against the surface of the wireless electrostatic carrier plate of the carrier plate static electricity generation group to drive or release the wireless electrostatic carrier plate to generate an electrostatic power field, so that the wireless electrostatic carrier plate and the thinned substrate can be bonded or debonded in the same specified orientation; and

[0023] At least one transmission device is provided on the machine body, and the at least one transmission device can clamp the thinned substrate or the wireless electrostatic carrier plate and move between the substrate baking group and the carrier plate baking group of the baking device corresponding to the substrate feeding interface and the carrier plate feeding interface, the pre-alignment device and the bonding and debonding device.

[0024] The present invention further provides a bonding and debonding method for a wireless electrostatic chuck, which is used for the automatic bonding of a wireless electrostatic carrier plate and a thinned substrate and the automatic debonding after bonding. The bottom surface of the wireless electrostatic carrier plate has a conductive pole for generating an electrostatic power field, and there is a design for determining a specified orientation on the periphery of the wireless electrostatic carrier plate and the thinned substrate. The steps include:

[0025] A step of providing a wireless electrostatic carrier and a step of thinning a substrate;

[0026] A step of baking the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate respectively to keep the surfaces dry;

[0027] A step of pre-aligning the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate respectively in a specified orientation;

[0028] A step of fixing the above-mentioned electrostatic-free carrier and the above-mentioned thinned substrate respectively in the same specified orientation on two opposite surfaces;

[0029] A step of making the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate disposed on the two surfaces fit together in a linear relative displacement manner;

[0030] A step of generating an electrostatic force field between the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate that can be adhesively bonded to each other; and

[0031] A step of taking out the above-mentioned wireless electrostatic carrier adhered with the above-mentioned thinned substrate.

[0032] Thus, through the specific implementation of the above technical means, the present invention uses an adhesive and detachment device to enable a wireless electrostatic carrier to automatically bond a thinned substrate, which can greatly reduce the bonding failure rate and reduce the occurrence of cracks or fragments. After automatic cleaning, baking, and pre-alignment, it can meet the high-precision process requirements and perform automated bonding to meet the requirements of automated production of thinned substrates, enabling the wireless electrostatic carrier to bond the thinned substrate to be applied in subsequent processes, which can greatly improve the process yield of the thinned substrate, reduce costs, increase profits, improve its added value, and further improve its economic benefits.

[0033] To enable those skilled in the art to further understand the composition, features, and other purposes of the present invention, the following are preferred embodiments of the present invention, which are described in detail with reference to the drawings as follows, and at the same time enable those skilled in the art to implement them specifically. Brief Description of the Drawings

[0034] Figure 1 : Schematic diagram of the architecture of the automatic adhesive and detachment system for the wireless electrostatic chuck of the present invention.

[0035] Figure 2 : Schematic diagram of the operation of the automatic adhesive and detachment system for the wireless electrostatic chuck of the present invention.

[0036] Figure 3 : Schematic diagram of the appearance of the adhesive and detachment device for the wireless electrostatic chuck of the present invention.

[0037] Figure 4 : Schematic diagram of the side view plane of the adhesive and detachment device for the wireless electrostatic chuck of the present invention.

[0038] Figure 5 : Schematic external view of the carrier electrostatic generation group in the sticking and releasing device for wireless electrostatic chucks of the present invention.

[0039] Figure 6 : Schematic partial top-down plan view of the carrier electrostatic generation group in the sticking and releasing device for wireless electrostatic chucks of the present invention.

[0040] Figure 7 : Schematic side plan view of the carrier electrostatic generation group in the sticking and releasing device for wireless electrostatic chucks of the present invention.

[0041] Figure 8 : Schematic side action view of the carrier electrostatic generation group in the sticking and releasing device for wireless electrostatic chucks of the present invention.

[0042] Figure 9 : Schematic side action view of the other side of the carrier electrostatic generation group in the sticking and releasing device for wireless electrostatic chucks of the present invention.

[0043] Figure 10 : Schematic external view of the substrate transfer group in the sticking and releasing device for wireless electrostatic chucks of the present invention.

[0044] Figure 11 : Schematic partial bottom-up plan view of the substrate transfer group in the sticking and releasing device for wireless electrostatic chucks of the present invention.

[0045] Figure 12 : Schematic flow architecture view of the sticking and releasing method for wireless electrostatic chucks of the present invention.

[0046] List of reference numerals: 100 - wireless electrostatic carrier; 101 - positioning notch; 105 - guiding electrode; 200 - thinned substrate; 201 - positioning notch; 10 - body; 15 - slide rail mechanism; 16 - substrate loading and unloading interface; 18 - carrier loading and unloading interface; 20 - transmission device; 30 - baking device; 31 - substrate baking group; 32 - carrier baking device; 38 - cleaning device; 40 - pre - alignment device; 45 - temporary storage material interface; 50 - adhesion and detachment device; 51 - lower frame; 52 - upper frame; 60 - carrier plate static electricity generation group; 61 - main frame plate; 62 - ejector; 620 - detection element; 63 - guiding electrode; 64 - adsorbing member; 65 - side wing plate; 66 - guide post; 660 - fixed guide post; 661 - inclined guide surface; 665 - movable guide post; 666 - inclined guide surface; 67 - touch detection group; 670 - touch projection; 675 - guiding projection; 68 - optical detection group; 680 - optoelectronic element; 69 - air blowing unit; 690 - jet nozzle; 70 - driving member; 80 - substrate transfer group; 81 - frame base; 810 - detection element; 82 - lifting mechanism; 83 - adsorbing member; 830 - surface adsorbing member; 835 - edge adsorbing member; 85 - optical detection group; 850 - optoelectronic element; 86 - anti - falling member. Detailed Description of the Invention

[0047] The present invention relates to an adhesion and detachment device, an automatic adhesion and detachment system, and an adhesion and detachment method for a wireless electrostatic chuck. In the specific embodiments and components of the present invention illustrated with the accompanying drawings, all references to front and back, left and right, top and bottom, upper and lower, and horizontal and vertical are only for convenience of description, and do not limit the present invention, nor restrict its components to any position or spatial direction. The dimensions specified in the drawings and the specification can be changed according to the design and requirements of the specific embodiments of the present invention without departing from the scope of the patent application of the present invention.

[0048] The automatic adhesion and detachment system of the present invention for a wireless electrostatic chuck is as Figure 1 shown, and is used for the automatic adhesion of a wireless electrostatic carrier (100) and a thinned substrate (200) and the automatic detachment after adhesion. The thinned substrate (200) can be a semiconductor wafer, a glass sheet, or a plastic sheet. The automatic adhesion and detachment system includes a body (10), at least one transmission device (20), at least one baking device (30), at least one pre - alignment device (40), and at least one adhesion and detachment device (50).

[0049] For the detailed composition of the preferred embodiment of the automatic adhesion and detachment system, please further refer to Figure 1 、 Figure 2As shown, at least one substrate loading / unloading interface (port) (16) and at least one carrier loading / unloading interface (18) are provided on the body (10). In some embodiments, the substrate loading / unloading interface (16) and the carrier loading / unloading interface (18) can be the loading / unloading interfaces of a typical SEMI-standard wafer transfer cassette [FOUP], which are used for the automatic loading / unloading of the wireless electrostatic carrier (100) and the thinned substrate (200). Moreover, the aforementioned transfer device (20) can be used to grasp the wireless electrostatic carrier (100) or the thinned substrate (200) and move and place them between the body (10) at each substrate loading / unloading interface (16) or carrier loading / unloading interface (18) and the baking device (30), the pre-alignment device (40), and the adhesion / removal device (50). Also, the at least one transfer device (20) can be a linear, six-axis, or seven-axis robotic arm to improve the freedom and flexibility of grasping and moving the wireless electrostatic carrier (100) or the thinned substrate (200). In some embodiments, a slide rail mechanism (15) is provided on the body (10), and the at least one transfer device (20) can slide on the slide rail mechanism (15), so that the transfer device (20) can selectively slide on the slide rail mechanism (15), thereby increasing the movement range of the at least one transfer device (20);

[0050] Furthermore, the at least one baking device (30) is disposed inside the machine body (10) at a position where the transfer device (20) can move the wireless electrostatic carrier (100) or the thinned substrate (200). The baking device (30) may include at least one substrate baking group (31) for accommodating one or more thinned substrates (200) for baking and at least one carrier baking device (35) for accommodating one or more wireless electrostatic carriers (100), respectively for drying the moisture on the surfaces of the thinned substrate (200) and the wireless electrostatic carrier (100). In some embodiments, a cleaning device (38) may be provided on one side of the machine body (10) corresponding to the carrier loading / unloading interface (18) for cleaning the wireless electrostatic carrier (100) before baking to ensure the cleanliness of the surface of the wireless electrostatic carrier (100). The cleaning device (38) may be a rinsing, wiping or non-contact particle removal technique. Also, the at least one pre-aligning device (40) is disposed inside the machine body (10) at a position where the transfer device (20) can move the wireless electrostatic carrier (100) or the thinned substrate (200). After the wireless electrostatic carrier (100) or the thinned substrate (200) is placed, the pre-aligning device (40) can rotate, and by using a detection unit on the at least one pre-aligning device (40), such as an optical detector such as a CCD module (not shown in the figure), the positioning cuts (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200) (such as the Notch of a wafer, a V-shaped positioning cut or a flat cut edge) are found, so that the wireless electrostatic carrier (100) and the thinned substrate (200) can enter the at least one bonding / detaching device (50) in a specified orientation, and the wireless electrostatic carrier (100) and the thinned substrate (200) can be bonded to each other in the same specified orientation. According to some embodiments, at least one temporary storage material interface (45) is provided on the machine body (10) for temporarily storing the wireless electrostatic carrier (100) or the thinned substrate (200) for the preparatory bonding operation to improve the efficiency of the automatic operation;

[0051] As for, the at least one bonding / detaching device (50) is disposed inside the machine body (10) at a position where the transfer device (20) can move the wireless electrostatic carrier (100) or the thinned substrate (200), such as Figure 3 、 Figure 4As shown, and the at least one adhesion / detachment device (50) includes a carrier plate static electricity generation group (60) for adsorbing the wireless static electricity carrier plate (100) with one of relative displacements and a substrate transfer group (80) for adsorbing the thinned substrate (200). Moreover, the adhesion / detachment device (50) has a frame that can be fixed to the machine body (10), and the frame includes a lower frame (51) and an upper frame (52). Among them, the carrier plate static electricity generation group (60) is arranged at the top of the lower frame (51), and the substrate transfer group (80) is arranged above the upper frame (52) corresponding to the carrier plate static electricity generation group (60) by a lifting mechanism (82), so that the substrate transfer group (80) can suck the thinned substrate (200) relative to the carrier plate static electricity generation group (60) or drive the thinned substrate (200) to be correspondingly pressed against the surface of the wireless static electricity carrier plate (100) on the top surface of the carrier plate static electricity generation group (60);

[0052] And the aforementioned carrier plate static electricity generation group (60) is as Figure 5 , Figure 6 , Figure 7 shown. It has a main frame plate (61) and side wing plates (65) pivotally arranged at both side edges of the main frame plate (61). Moreover, the main frame plate (61) and the side wing plates (65) on both sides have a working plane for the wireless static electricity carrier plate (100) to be placed flat. And a detection element (610) is arranged on the main frame plate (61) of the working plane to detect whether the wireless static electricity carrier plate (100) or the thinned substrate (200) exists. In addition, a ejecting member (62) is arranged inside the main frame plate (61). The ejecting member (62) can be displaced between the working plane and a higher receiving plane (as Figure 8 shown), which is convenient for the gripper of the transfer device (20) such as a robotic arm to penetrate and place or pick up the wireless static electricity carrier plate (100) or the thinned substrate (200). The ejecting member (62) can be composed of at least three ejecting rods that can be lifted synchronously or composed of a liftable top plate. Moreover, a telescopic cylinder (70) is arranged between the central part of the outer bottom edge of the two side wing plates (65) different from the main frame plate (61) and the lower frame (51) to selectively drive the outer edge of the side wing plate (65) to incline downward. The different outer edges of the two side wing plates (65) can be selectively driven to incline downward (as Figure 9As shown in the figure, it is used to drive the wireless electrostatic carrier (100) and the bonded thinned substrate (200) to be peeled off relatively from the outer edge. Moreover, suction accessories (64) [such as vacuum suction cups] corresponding to the bottom surface of the wireless electrostatic carrier (100) are respectively provided on the main frame plate (61) and the side wing plates (65), for selectively fixing the wireless electrostatic carrier (100) on the working planes of the main frame plate (61) and the side wing plates (65). And the main frame plate (61) has two or a multiple of two conductive poles (63), for corresponding to the positive and negative conductive poles (105) on the bottom surface of the wireless electrostatic carrier (100), to provide electricity so that an electrostatic power field can be generated or dissociated on the surface of the wireless electrostatic carrier (100) relative to the thinned substrate (200), for enabling the wireless electrostatic carrier (100) to be adhesively bonded or dissociated with the thinned substrate (200). Also, a guiding group (66) is provided on the side wing plates (65) on both sides. The guiding group (66) includes at least two fixed guide posts (660) and at least one movable guide post (665) surrounding the outer peripheral edge of the wireless electrostatic carrier (100). In the present invention, two fixed guide posts (660) and two movable guide posts (665) are taken as the main embodiments. Wherein the at least one movable guide post (665) can push the wireless electrostatic carrier (100) to the correct horizontal position for positioning with respect to the at least one fixed guide post (660). Moreover, an inclined guiding edge (661, 666) is formed on the peripheral edges of the tops of the at least one fixed guide post (660) and the at least one movable guide post (665), so that when the ejector member (62) descends, the wireless electrostatic carrier (100) or the thinned substrate (200) can be guided to the correct range on the working plane. Moreover, a touch detection group (67) and an optical detection group (68) are respectively provided on the carrier electrostatic generation group (60) corresponding to the outer peripheral edge of the wireless electrostatic carrier (100). Wherein the touch detection group (67) includes at least two touch convex posts (670) that can be telescoped and surround the outer peripheral edge of the wireless electrostatic carrier (100) and at least one guiding and correcting convex post (675) that can move back and forth. Wherein the guiding and correcting convex post (675) can correspond to the positioning notches (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200), so that the guiding and correcting convex post (675) can use the positioning notches (101, 201) of the wireless electrostatic carrier (100) or the thinned substrate (200) to rotate and correct with its axis as the center, and further used to trigger an alarm when the wireless electrostatic carrier (100) or the thinned substrate (200) is not properly positioned and touches any one of the touch convex posts (670). As for the optical detection group (68), it includes at least three optoelectronic elements (680) surrounding the outer peripheral edge of the wireless electrostatic carrier (100), for triggering an alarm when the wireless electrostatic carrier (100) or the thinned substrate (200) is not properly positioned and shields any one of the optoelectronic elements (680), to ensure the accurate alignment of the wireless electrostatic carrier (100) and the thinned substrate (200). Another example is Figure 9As shown, the electrostatic generation group (60) of the carrier plate is respectively provided with a blowing unit (69) at the corresponding two side wing plates (65) of the lower frame. The blowing unit (69) has a jet nozzle (690) extending from the outer peripheral edge of the corresponding wireless electrostatic carrier plate (100) towards the axial center direction, which is used to blow high-speed gas when the wireless electrostatic carrier plate (100) starts dissociation and is driven by the two side wing plates (65) to peel off from the thinned substrate (200), so that the wireless electrostatic carrier plate (100) and the thinned substrate (200) can be effectively separated;

[0053] Also, the aforementioned substrate transfer group (80) is as Figure 10 , Figure 11 shown. It is composed of a frame base (81) that can selectively adsorb the thinned substrate (200). The frame base (81) can be linearly driven up and down by a lifting mechanism (82) to drive the thinned substrate (200) to selectively press against the lower wireless electrostatic carrier plate (100). Also, a detection element (810) is provided on the surface of the frame base (81) to detect whether the thinned substrate (200) exists. And the frame base (81) has an adsorption surface, and there are multiple adsorbing members (83) on the adsorption surface of the frame base (81), which can include surface adsorbing members (830) within the range corresponding to the thinned substrate (200) or edge adsorbing members (835) near the edge of the thinned substrate (200). Among them, the surface adsorbing members (830) can apply the adsorption technology of Bernoulli's law to reduce the possible damage to the thinned substrate (200) during the adsorption process. Furthermore, an optical detection group (85) is provided at the outer peripheral edge corresponding to the thinned substrate (200) of the substrate transfer group (80). The optical detection group (85) includes at least three optoelectronic elements (850) surrounding the outer peripheral edge of the thinned substrate (200), which are used to trigger an alarm when the thinned substrate (200) is not properly placed and blocks any one of the optoelectronic elements (850) to ensure the accurate alignment of the thinned substrate (200). According to some embodiments, a selectively retractable anti-falling member (86) can be provided on the periphery of the substrate transfer group (80), and the range surrounded when it extends is smaller than the outer diameter of the thinned substrate (200). When the thinned substrate (200) enters the adsorption surface of the substrate transfer group (80), the anti-falling member (86) can be extended to prevent the thinned substrate (200) from falling due to ineffective adsorption, and it can retract after confirming that the thinned substrate (200) is effectively adsorbed by the substrate transfer group (80). According to some embodiments, the substrate transfer group (80) can be a robotic arm that can clamp the thinned substrate (200) relative to the electrostatic generation group (60) of the carrier plate;

[0054] Thus, an automatic adhesion and dissociation system is formed that can automatically bond and automatically dissociate the wireless electrostatic carrier plate (100) and the thinned substrate (200).

[0055] Also, as Figure 12The figure shows a flowchart of an automatic adhesion and detachment method for a wireless electrostatic chuck, which is used for the automatic adhesion between a wireless electrostatic carrier (100) and a thinned substrate (200) and the automatic detachment after adhesion. The thinned substrate (200) can be a semiconductor wafer, a glass sheet, or a plastic sheet. The bottom surface of the wireless electrostatic carrier (100) has a guide electrode (105) for generating an electrostatic power field by conduction, and a positioning notch (101, 201) for determining the orientation is provided at the peripheries of the wireless electrostatic carrier (100) and the thinned substrate (200). The process steps of the adhesion and detachment method include providing a wireless electrostatic carrier and a thinned substrate; baking the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate respectively to keep their surfaces dry; pre-aligning the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate in a specified orientation respectively; fixing the above-mentioned non-electrostatic carrier and the above-mentioned thinned substrate in the same specified orientation on two opposite surfaces respectively; making the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate disposed on the two surfaces above fit in a linear relative displacement manner; making the above-mentioned wireless electrostatic carrier generate an electrostatic power field that can mutually adhere to the above-mentioned thinned substrate; and taking out the above-mentioned wireless electrostatic carrier adhered with the above-mentioned thinned substrate, etc. For the preferred embodiment of the adhesion and detachment method of the present invention, please refer to Figure 1 、 Figure 2 、 Figure 3 as disclosed;

[0056] The step of providing a wireless electrostatic carrier and a thinned substrate: One of the transfer devices (20) on the body (10) of the automatic adhesion and detachment system obtains a wireless electrostatic carrier (100) from the carrier loading and unloading interface (18), and another transfer device (20) obtains a wireless electrostatic carrier (100) from the substrate loading and unloading interface (16);

[0057] The step of baking the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate respectively to keep their surfaces dry: After obtaining the above-mentioned wireless electrostatic carrier (100) and thinned substrate (200) respectively, one of the transfer devices (20) can place the wireless electrostatic carrier (100) into the carrier baking group (35) of the corresponding baking device (30), and another transfer device (20) can place the thinned substrate (200) into the substrate baking group (31) of the corresponding baking device (30), and bake them respectively to keep their surfaces dry;

[0058] A step of pre-aligning the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate in a specified orientation respectively: After completing the baking and drying operations of the above-mentioned wireless electrostatic carrier (100) and the above-mentioned thinned substrate (200), the at least one transfer device (20) transfers the wireless electrostatic carrier (100) and the thinned substrate (200) to the corresponding pre-aligning device (40) respectively, so that the wireless electrostatic carrier (100) and the thinned substrate (200) can be positioned in the same specified orientation by using their positioning notches (101, 201), so that the wireless electrostatic carrier (100) and the thinned substrate (200) can be completely overlapped and adhered in the same specified orientation, so as to facilitate subsequent process processing;

[0059] A step of fixing the above-mentioned electrostatic-free carrier and the above-mentioned thinned substrate on two opposite surfaces in the same specified orientation respectively: And after completing the foregoing pre-alignment, as shown in Figure 5 The transfer device (20) first places the thinned substrate (200) on the working planes of the main frame plate (61) and the side wing plate (65) of the carrier plate electrostatic generation group (60), and uses its guiding group (66) to guide the thinned substrate (200) to the correct position on the working plane of the carrier plate electrostatic generation group (60), and through the touch detection group (67) and the optical detection group (68), after ensuring that the wireless electrostatic carrier (100) is accurately positioned in a specified orientation, the substrate transfer group (80) can be lowered, and the thinned substrate (200) can be adsorbed at the correct position on the adsorption plane by using the adsorbing member (83) of the substrate transfer group (80), and then the substrate transfer group (80) is raised to synchronously bring the thinned substrate (200) away from the working plane of the carrier plate electrostatic generation group (60). Immediately afterwards, the transfer device (20) places the wireless electrostatic carrier (100) on the working planes of the main frame plate (61) and the side wing plate (65) of the carrier plate electrostatic generation group (60), and uses its guiding group (66) to guide the wireless electrostatic carrier (100) to the correct position on the working plane of the carrier plate electrostatic generation group (60), and through the touch detection group (67) and the optical detection group (68), after ensuring that the wireless electrostatic carrier (100) is accurately positioned in a specified orientation, the carrier plate electrostatic generation group (60) can use the adsorbing member (64) to fix the wireless electrostatic carrier (100), so that the thinned substrate (200) and the wireless electrostatic carrier (100) can be opposite in the same specified orientation;

[0060] A step of adhering the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate placed on the two foregoing surfaces in a linear relative displacement manner: When the wireless electrostatic carrier (100) and the thinned substrate (200) are fixed on opposite surfaces in the same specified orientation, as shown in Figure 3 、 Figure 4As shown, the substrate transfer group (80) drives the thinned substrate (200) to linearly displace relative to the wireless electrostatic carrier plate (100) of the carrier plate electrostatic generation group (60), so that the thinned substrate (200) can be attached to the surface of the wireless electrostatic carrier plate (100) in the same specified orientation, and the outer peripheral edges of the two completely overlap;

[0061] A step of making the above-mentioned wireless electrostatic carrier plate generate an electrostatic force field that can be mutually adhered to the above-mentioned thinned substrate: after the above-mentioned wireless electrostatic carrier plate (100) and the above-mentioned thinned substrate (200) are attached, the carrier plate electrostatic generation group (60) can be electrically connected to the above-mentioned wireless electrostatic carrier plate (100), so that the above-mentioned wireless electrostatic carrier plate (100) can generate an electrostatic force field relative to the above-mentioned thinned substrate (200), and complete the work of electrostatically adhering the above-mentioned wireless electrostatic carrier plate (100) to the above-mentioned thinned substrate (200); and

[0062] A step of taking out the above-mentioned wireless electrostatic carrier plate adhered with the above-mentioned thinned substrate: finally, after the above-mentioned wireless electrostatic carrier plate (100) and the above-mentioned thinned substrate (200) are adhered, the substrate transfer group (80) and the carrier plate electrostatic generation group (60) can be relatively separated in a linear displacement manner, and one of the transfer devices (20) is used to take out the wireless electrostatic carrier plate (100) adhered with the thinned substrate (200), and store it in the corresponding substrate loading and unloading interface (16) or carrier plate loading and unloading interface (18) in sequence, and complete the entire adhesion operation for subsequent process applications.

[0063] According to some embodiments, before the above-mentioned wireless electrostatic carrier plate (100) and the above-mentioned thinned substrate (200) perform the baking action, a step of cleaning the surface of the above-mentioned wireless electrostatic carrier plate can be added, which is rinsed or wiped with a cleaning agent, or the particles on the adhering surface of the above-mentioned wireless electrostatic carrier plate (100) are removed in a non-contact manner to improve the effectiveness of its adhesion.

[0064] Furthermore, the bonded thinned substrate (200) and the wireless electrostatic carrier (100) can also be dissociated. The wireless electrostatic carrier (100) bonded with the thinned substrate (200) is placed into the carrier electrostatic generation group (60) through the transfer device (20) for adsorption and fixation, and the substrate transfer group (80) is linearly displaced and adsorbed and fixed on the surface of the thinned substrate (200) on the side different from the wireless electrostatic carrier (100). Then, the carrier electrostatic generation group (60) releases the electrostatic field of the wireless electrostatic carrier (100), so that the static electricity of the wireless electrostatic carrier (100) is released. Furthermore, the thinned substrate (200) can be dissociated, and the substrate transfer group (80) drives the thinned substrate (200) and the wireless electrostatic carrier (100) to be relatively separated in a reverse displacement. Finally, the wireless electrostatic carrier (100) and the thinned substrate (200) are respectively placed into the corresponding carrier loading and unloading interfaces (18) and substrate loading and unloading interfaces (16) by the relative transfer device (20). According to some embodiments, as Figure 9 shown, after the static electricity of the wireless electrostatic carrier (100) is released, the outer periphery of the wireless electrostatic carrier (100) can be driven downward, so that the outer periphery of the wireless electrostatic carrier (100) can be pre-peeled relative to the thinned substrate (200) to generate an opening, and high-speed gas is blown into the wireless electrostatic carrier (100) from the outer periphery of the wireless electrostatic carrier (100) through the injection nozzle (690) of a jet unit (69), so that the wireless electrostatic carrier (100) and the thinned substrate (200) can be effectively separated.

[0065] As can be seen from the above, the bonding and detachment device, automatic bonding and detachment system, and bonding and detachment method for a wireless electrostatic chuck of the present invention can improve the bonding efficiency, greatly reduce the bonding failure rate, reduce the occurrence of cracks or fragments, and can supply high-precision process requirements after automatic cleaning, baking, and pre-alignment, and perform automatic bonding to meet the requirements of the automatic production of thinned substrates, so that the wireless electrostatic carrier can bond the thinned substrate and can be applied to subsequent processes, which can greatly improve the process yield of the thinned substrate, and can reduce costs and increase profits.

Claims

1. A sticking and detaching device for a wireless electrostatic chuck, used for the adhesion or dissociation of a wireless electrostatic carrier plate and a thinned substrate, wherein the bottom surface of the wireless electrostatic carrier plate has electrodes for generating or dissociating an electrostatic power field, Characterized in that, The sticking and detaching device includes: A frame; A carrier plate electrostatic generation group, which is arranged on the frame. The carrier plate electrostatic generation group has a working plane for selectively fixing the wireless electrostatic carrier plate, and the working plane has electrodes corresponding to contact the positive and negative electrodes of the wireless electrostatic carrier plate. Moreover, the working plane can position the wireless electrostatic carrier plate or the thinned substrate at a correct position; A substrate transfer group, which is arranged on the frame and opposite to the carrier plate electrostatic generation group, so that the substrate transfer group can adsorb a thinned substrate with a correct position and displace relative to the carrier plate electrostatic generation group; Thus, after the substrate transfer group drives the thinned substrate to be pressed against the wireless electrostatic carrier plate, it can drive the carrier plate electrostatic generation group to generate an electrostatic power field on the wireless electrostatic carrier plate to bond the thinned substrate; Wherein, a guide post group is arranged on the working plane. The guide post group includes at least two fixed guide posts surrounding the outer periphery of the wireless electrostatic carrier plate to limit the lateral position of the carrier plate and at least one movable guide post that can push the wireless electrostatic carrier plate to engage with the fixed guide posts, so that the wireless electrostatic carrier plate or the thinned substrate is positioned at a correct position on the working plane.

2. The sticking and detaching device for a wireless electrostatic chuck according to claim 1, Characterized in that, The working plane is composed of a main frame plate and wing plates pivotally arranged on both side edges of the main frame plate, and one end of the two wing plates different from the main frame plate can selectively move downward.

3. The sticking and detaching device for a wireless electrostatic chuck according to claim 2, Characterized in that, The carrier plate electrostatic generation group is respectively provided with a blowing unit at positions corresponding to the two wing plates. The blowing unit has a jet nozzle extending from the outer periphery of the wireless electrostatic carrier plate towards the axis direction, for blowing high-speed gas to effectively separate the wireless electrostatic carrier plate and the thinned substrate.

4. The sticking and detaching device for a wireless electrostatic chuck according to claim 1, Characterized in that, The substrate transfer group has a frame base, and there are a plurality of suction attachments on the surface of the frame base, which include surface suction attachments within the range corresponding to the thinned substrate or edge suction attachments near the edge of the thinned substrate. Among them, the surface suction attachments use the adsorption technology of Bernoulli's law.

5. An automatic sticking and detaching system for a wireless electrostatic chuck, which includes the sticking and detaching device according to claim 1. The automatic sticking and detaching system is used for the automatic adhesion of a wireless electrostatic carrier plate and a thinned substrate and the automatic dissociation after adhesion. The bottom surface of the wireless electrostatic carrier plate has electrodes for generating an electrostatic power field, and there is a positioning notch for determining the orientation on the peripheries of the wireless electrostatic carrier plate and the thinned substrate, Characterized in that, The automatic sticking and detaching system includes: A machine body, which includes at least one substrate feeding interface and at least one carrier plate feeding interface; At least one baking device, which is arranged on the machine body, and the at least one baking device includes at least one substrate baking group for baking the thinned substrate and at least one carrier plate baking group for baking the wireless electrostatic carrier plate; At least one pre-aligning device, which is provided on the body and is used for the wireless electrostatic carrier and the thinned substrate to pre-determine the specified orientation by using the positioning notch; At least one sticking and detaching device according to claim 1, which drives or releases the wireless electrostatic carrier to generate an electrostatic power field, so that the wireless electrostatic carrier and the thinned substrate can be stuck or detached in the same specified orientation; And At least one transfer device, which is provided on the body, and the at least one transfer device can clamp the thinned substrate or the wireless electrostatic carrier and move between the substrate baking group and the carrier baking group of the baking device corresponding to the substrate feeding interface and the carrier feeding interface, the pre-aligning device and the sticking and detaching device.

6. The automatic sticking and detaching system for a wireless electrostatic chuck according to claim 5, wherein, a cleaning device is provided on the body, and the cleaning device is within the grasping and moving range of the transfer device and is used for selectively cleaning the bonding surface of the wireless electrostatic carrier or the thinned substrate.

7. The automatic sticking and detaching system for a wireless electrostatic chuck according to claim 5, wherein, a slide rail mechanism is provided on the body, and the at least one transfer device can slide on the slide rail mechanism, which can increase the moving range of the at least one transfer device.

8. A sticking and detaching method for a wireless electrostatic chuck, which is used for the automatic sticking of a wireless electrostatic carrier and a thinned substrate and the automatic detachment after sticking. It is realized by the automatic sticking and detaching system of claim 5. The bottom surface of the wireless electrostatic carrier has a conductive pole for generating an electrostatic power field, and the peripheries of the wireless electrostatic carrier and the thinned substrate have designs for determining a specified orientation, wherein, its steps include: a step of providing a wireless electrostatic carrier and a thinned substrate; a step of baking the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate respectively to keep the surfaces dry; a step of pre-aligning the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate in the specified orientation respectively; a step of fixing the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate in the above-mentioned specified orientation on two opposite surfaces respectively; a step of making the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate placed on the two surfaces fit in a linear relative displacement manner; a step of making the wireless electrostatic carrier generate an electrostatic power field capable of mutually sticking to the thinned substrate relative to the thinned substrate; and a step of taking out the wireless electrostatic carrier bonded with the above-mentioned thinned substrate.

9. The sticking and detaching method for a wireless electrostatic chuck according to claim 8, wherein, before the step of "baking the above-mentioned wireless electrostatic carrier and the above-mentioned thinned substrate respectively to keep the surfaces dry", a step of cleaning the surface of the wireless electrostatic carrier is added to improve the effectiveness of its sticking.

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