Photosensitive chips, photosensitive components, camera modules and electronic equipment

Abstract

The present invention relates to a photosensitive chip, a photosensitive component, a camera module and an electronic device, wherein the camera module comprises: a lens; a photosensitive chip, wherein the photosensitive chip has a chip body, an electrical connection portion and a pad; the chip body is opposite to the lens and is used to receive light projected from the lens for imaging; the electrical connection portion is arranged on the chip body and is used to connect with a processing unit plug-in; the pad is arranged on the electrical connection portion and is electrically connected to the chip body; the pad can be electrically connected to the processing unit after the electrical connection portion is plug-connected with the processing unit. In the present invention, the electrical connection between the photosensitive chip and the processing unit can be achieved by plugging, so that the assembly of the camera module is simple and convenient, the production process is reduced, and the assembly efficiency of the camera module is improved. At the same time, such a setting can also reduce the material cost of the camera module and improve competitiveness.

Description

Technical Field

[0001] The present invention relates to the field of imaging technology, and in particular to a photosensitive chip, a photosensitive component, a camera module and an electronic device. Background Art

[0002] like Figure 1 As shown, the camera module 10a is an important element for taking photos of electronic devices such as mobile phones, wherein the processing unit 20a of the electronic device can control the operation of the camera module 10a. The camera module 10a has a lens 1a, a photosensitive chip 3a and a substrate 3a, wherein the lens 1a and the photosensitive chip 3a are both arranged on the substrate 3a, and the photosensitive chip 3a is opposite to the substrate 3a, and is used to receive the light projected from the lens 1a for imaging.

[0003] In actual products, the substrate 3a is usually a PCB board, etc., and the photosensitive chip 3a is electrically connected to the processing unit 20a through the substrate 3a. Figure 1 As shown, the photosensitive chip 3a has a photosensitive surface 21a and a bottom surface 22a which are arranged opposite to each other, wherein the bottom surface 22a is connected to the substrate 3a, and the photosensitive surface 21a is opposite to the lens 1a to receive the light projected from the lens 1a for imaging. A first pad 23a is provided on the photosensitive surface 21a, a second pad 31a and a third pad 32a are provided on the substrate 3a, and the processing unit 20a has a fourth pad 201a, wherein the first pad 33a and the second pad 31a are electrically connected through a gold wire 4a, and the third pad 32a and the fourth pad 201a are electrically connected through a conductive lead 30a. This assembly method is complicated to operate and has a high cost. Summary of the invention

[0004] Based on this, it is necessary to provide a photosensitive chip, a photosensitive component, a camera module and an electronic device to address the problem that the assembly method of the photosensitive chip in the existing camera module is complicated and has high production costs by electrically connecting the photosensitive chip to the processor through a circuit board.

[0005] A photosensitive chip includes: a chip body for receiving light for imaging; an electrical connection portion, arranged on the chip body, for plugging and connecting with a processing unit; a solder pad, arranged on the electrical connection portion and electrically connected to the chip body; the solder pad can be electrically connected to the processing unit after the electrical connection portion is plugged and connected with the processing unit.

[0006] When the camera module uses the photosensitive chip provided by the present invention, the electrical connection between the photosensitive chip and the processing unit can be achieved by plugging, without the need to first electrically connect the photosensitive chip and the circuit board through a gold wire as in the prior art, and then electrically connect the circuit board and the processing unit through a conductive wire to achieve the electrical connection between the photosensitive chip and the processing unit. This can make the assembly of the camera module simple and convenient, reduce the production process, and improve the assembly efficiency of the camera module. At the same time, such a setting can also reduce the material cost of the camera module and improve competitiveness.

[0007] Furthermore, the pad is a gold finger; and / or the connecting part is provided with a groove, and the pad is embedded in the groove, so that the electrode pin pad can be more firmly arranged on the electrical connecting part of the connecting part, and the pad can also be protected by the electrical connecting part, effectively preventing the pad from being hit by foreign objects.

[0008] Furthermore, the chip body has a photosensitive surface, a bottom surface opposite to the photosensitive surface, and side surfaces respectively intersecting with the bottom surface and the photosensitive surface; wherein the photosensitive surface is used to receive light for imaging, and the electrical connection portion is arranged on the side surface. Such an arrangement can reduce the size of the photosensitive chip in the optical axis direction of the camera module, which is conducive to the miniaturization and thinning of the electronic equipment.

[0009] Further, the electrical connection part has an upper bearing surface and a lower bearing surface disposed opposite to each other, and the pad is disposed on the upper bearing surface and / or the lower bearing surface; wherein, in the direction from the photosensitive surface to the bottom surface, the upper bearing surface and the lower bearing surface are disposed in sequence; there is a height difference between the upper bearing surface and the photosensitive surface, so that a first step structure is formed between the electrical connection part and the chip body, and / or there is a height difference between the lower bearing surface and the bottom surface, so that a second step structure is formed between the electrical connection part and the chip body. In the present invention, the first step structure and the second step structure can provide abutment and clamping positions for the photosensitive chip, making the installation of the photosensitive chip more secure.

[0010] A photosensitive component includes: a carrier plate; a photosensitive chip, which is arranged on the carrier plate and the photosensitive chip is as described in any one of the above items.

[0011] Furthermore, the carrier plate has an object side surface and an image side surface arranged opposite to each other, and a avoidance hole is provided on the carrier plate, and the avoidance hole extends from the object side surface to the image side surface; the photosensitive chip is arranged on the image side surface, and the chip body is opposite to the avoidance hole so as to receive light from the avoidance hole. This arrangement allows elements such as filters to be set on the object side surface of the upper surface of the substrate carrier plate, which can reduce the arrangement of camera module components to a certain extent.

[0012] Furthermore, a first bump and a second bump are provided on the image side of the carrier board, and the electrical connection portion is located between the first bump and the second bump and abuts against the first bump and the second bump respectively; and / or a third bump is provided on the image side of the carrier board, and the third bump abuts against the surface of the chip body away from the electrical connection portion. This arrangement can make the connection between the photosensitive chip and the carrier board more secure.

[0013] Furthermore, the camera module further comprises: a reinforcing bottom plate, which is arranged on the surface of the photosensitive chip away from the carrier plate; and a reinforcing side plate, which is arranged between the reinforcing bottom plate and the carrier plate and surrounds the outer side of the chip body. The reinforcing bottom plate and the reinforcing side plate can provide protection for the photosensitive chip to prevent the photosensitive chip from being hit by foreign objects.

[0014] Furthermore, the reinforcing bottom plate and the reinforcing side plates are integrally formed to facilitate production and assembly.

[0015] A camera module comprises: a lens; a photosensitive component connected to the lens and used to receive light projected from the lens to form an image, wherein the photosensitive component is as described in any one of the above items. This makes the assembly of the camera module simple and convenient, improves the assembly efficiency of the camera module, and at the same time, this arrangement can also reduce the material cost of the camera module and improve its competitiveness.

[0016] An electronic device comprises the camera module as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the cooperation between the existing camera module and the processing unit;

[0018] Figure 2 A schematic diagram of a module of an electronic device provided by the present invention;

[0019] Figure 3 A schematic diagram of a camera module of an electronic device provided by the present invention;

[0020] Figure 4 An exploded schematic diagram of a camera module of an electronic device provided by the present invention;

[0021] Figure 5 A cross-sectional schematic diagram of a camera module of an electronic device provided by the present invention;

[0022] Figure 6 for Figure 5 A partial enlarged schematic diagram of the middle A area;

[0023] Figure 7 A schematic diagram of the structure of the photosensitive chip of the camera module provided by the present invention;

[0024] Figure 8 A partial schematic diagram of a processing unit of an electronic device provided by the present invention;

[0025] Fig. 9 A schematic diagram of the structure of a carrier plate of a camera module provided by the present invention;

[0026] Fig.10 A schematic diagram of the cooperation between the reinforced bottom plate and the reinforced side plate of the camera module provided by the present invention;

[0027] Fig.11 A schematic structural diagram of a photosensitive chip of a camera module provided in another embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific implementation disclosed below.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0031] like Figure 2 As shown, in this embodiment, the electronic device 100 includes a camera module 10 and a processing unit 20 electrically connected to the camera module 10, wherein the camera module 10 is used to take pictures, and the processing unit 20 can control the camera module 10. In addition, in this embodiment, the electronic device 100 can be a terminal product such as a mobile phone or a tablet computer.

[0032] like Figures 3 to 5 As shown, in this embodiment, the camera module 10 includes a lens assembly 10b and a photosensitive assembly 10c, wherein the photosensitive assembly 10c is connected to the lens assembly 10b for receiving light projected from the lens assembly 10b for imaging.

[0033] like Figure 3As shown, in this embodiment, the lens assembly 10b includes a lens 1 and a bracket 2, and the photosensitive assembly 10c includes a photosensitive chip 3 and a carrier board 4. The lens 1 is arranged on the bracket 2, and the bracket 2 is connected to the carrier board 4. The photosensitive chip 3 is arranged on the carrier board 4 and is opposite to the lens 1 to receive the light projected from the lens 1 for imaging.

[0034] Specifically, Figure 5 and Figure 6 As shown, in this embodiment, the carrier plate 4 has an object side surface 41 and an image side surface 42 that are disposed opposite to each other. In addition, a avoidance hole 43 is also disposed on the carrier plate 4, wherein the avoidance hole 43 runs through from the object side surface 41 to the image side surface 42. The photosensitive chip 3 is disposed on the image side surface 42 of the carrier plate 4, wherein the photosensitive chip 3 has a chip body 31, and the chip body 31 is opposite to the avoidance hole 43, and is used to receive light from the avoidance hole 43 for imaging.

[0035] like Figure 6 and Figure 7 As shown, in this embodiment, the chip body 31 has a photosensitive surface 311 and a bottom surface 312 disposed opposite to each other, and a side surface 313 respectively intersecting the photosensitive surface 311 and the bottom surface 312. Among them, the photosensitive surface 311 has a photosensitive area 314 and a connecting area 315, and the connecting area 315 is located outside the photosensitive area 314. The connecting area 315 is connected to the image side surface 42 of the carrier plate 4 by gluing or the like, and the photosensitive area 314 is exposed from the avoidance hole 43 to receive light, so that the chip body 31 can form an image.

[0036] like Figure 5 As shown, the bracket 2 has a first surface 21 and a second surface 22 that are arranged opposite to each other, and a light hole 23 is also arranged on the bracket 2, wherein the light hole 23 runs through the first surface 21 to the second surface 22. In this embodiment, the first surface 21 of the bracket 2 is connected to the object side surface 41 of the carrier plate 4 by bonding or the like, the light hole 23 is connected to the avoidance hole 43, the lens 1 is arranged on the second surface 22 of the bracket 2, and the light projected from the lens 1 passes through the light hole 23 and the avoidance hole 43 in sequence and then propagates to the photosensitive area 314 of the chip body 31.

[0037] In this embodiment, the lens 1 includes a lens barrel and a lens disposed in the lens barrel, wherein the lens barrel is connected to the bracket 2 by bonding or the like. It is understandable that in some embodiments, the lens barrel may also be integrally formed with the bracket 2, that is, in this case, the bracket 2 is not disposed in the camera module 10, and the lens 1 is directly disposed on the carrier plate 4.

[0038] like Figure 4 and Figure 5As shown, in this embodiment, the camera module 10 further includes a filter 5, which is disposed between the lens 1 and the photosensitive chip 3 and is used to filter out stray light directed toward the photosensitive chip 3. In this embodiment, the filter 5 is disposed on the object side surface 41 of the carrier plate 4 and is located in the light hole 23 of the bracket 2.

[0039] like Figure 5 and Figure 7 As shown, in the present embodiment, the photosensitive chip 3 includes, in addition to the chip body 31, an electrical connection portion 32 connected to the chip body 31, and a solder pad 33 arranged on the electrical connection portion 32, wherein the electrical connection portion 32 is arranged on a side surface 313 of the chip body 31, and the solder pad 33 is electrically connected to the chip body 31.

[0040] In this embodiment, the electrical connection portion 32 can be plug-connected with the processing unit 20, wherein after the electrical connection portion 32 and the processing unit 20 are plugged together, the pad 33 is electrically connected to the corresponding pin of the processing unit 20. In this way, the data and electrical signal transmission between the processing unit 20 and the photosensitive chip 3 can be realized, so that the processing unit 20 can control the photosensitive chip 3 and receive the image formed by the photosensitive chip 3 for corresponding processing.

[0041] In this embodiment, the electrical connection between the photosensitive chip 3 and the processing unit 20 can be achieved by plugging, without the need to first electrically connect the photosensitive chip 3 and the circuit board through gold wires and then electrically connect the circuit board and the processing unit 20 through conductive wires as in the prior art to achieve the electrical connection between the photosensitive chip 3 and the processing unit 20. This makes the assembly of the camera module 10 simple and convenient, improves the assembly efficiency of the camera module 10, and at the same time, such a setting can also reduce the material cost of the camera module 10 and improve competitiveness.

[0042] like Figure 7 As shown, in this embodiment, the electrical connection part 32 is a block structure, having an upper bearing surface 321 and a lower bearing surface 322 arranged opposite to each other. In the direction from the photosensitive surface 311 to the bottom surface 312, the upper bearing surface 321 and the lower bearing surface 322 are arranged in sequence. In this embodiment, the pad 33 is a gold finger, and the number of gold fingers is multiple. These gold fingers are all arranged on the upper bearing surface 321, and form a plug structure 101 with the electrical connection part 32. Figure 8 As shown, the processing unit 20 is provided with a socket structure 201 that can cooperate with the plug structure 101, and corresponding pins are provided in the socket structure 201. When the plug structure 101 is plugged into the socket structure 201, the pad 33 is electrically connected to the pin of the processing unit 20.

[0043] like Figure 6As shown, in this embodiment, a groove 323 is provided on the upper bearing surface 321, and the pad 33 is embedded in the groove 323, so that the pad 33 can be more firmly arranged on the electrical connection portion 32. At the same time, the pad 33 can also be protected by the electrical connection portion 32, effectively preventing the pad 33 from being hit by foreign objects. In addition, in order to facilitate the plugging of the plug structure 101 and the socket structure 201, in this embodiment, the electrical connection portion 32 protrudes from the bearing plate 4.

[0044] It is understandable that in some embodiments, the pad 33 may also be arranged with other pins, for example, the pad 33 may be a metal spring arranged on the electrical connection portion 32. At the same time, the pad 33 may also be arranged on the lower bearing surface 322, or the pad 33 may be arranged on the lower bearing surface 322 and the upper bearing surface 321 respectively. In addition, in some embodiments, the electrical connection portion 32 and the pad 33 may form a socket structure 201, and the processing unit 20 may be provided with a plug structure 101.

[0045] like Fig. 9 As shown, in the present embodiment, a first bump 44 and a second bump 45 are provided on the image side surface 42 of the carrier plate 4, the first bump 44 and the second bump 45 are arranged at intervals, and the electrical connection portion 32 is arranged between the first bump 44 and the second bump 45, and respectively abuts against the first bump 44 and the second bump 45, so that the connection between the photosensitive chip 3 and the carrier plate 4 can be more firmly established.

[0046] like Fig. 9 As shown, in this embodiment, a third bump 46 is further provided on the image side surface 42 of the carrier plate 4, and the third bump 46 abuts against the surface of the chip body 31 away from the electrical connection portion 32, so that the connection between the photosensitive chip 3 and the carrier plate 4 can be more secure.

[0047] In addition, in order to further improve the firmness of the connection between the photosensitive chip 3 and the carrier board 4 , at least one of the first bump 44 and the second bump 45 also abuts against the surface of the chip body 31 close to the electrical connection portion 32 .

[0048] like Figure 6 and 7 As shown, in this embodiment, the height of the upper bearing surface 321 relative to the bottom surface 312 is less than the height of the photosensitive surface 311 relative to the bottom surface 312, so that there is a height difference between the upper bearing surface 321 and the photosensitive surface 311, thereby forming a first step structure between the electrical connection portion 32 and the chip body 31, which is more conducive to the first bump 44 and / or the second bump 45 abutting against the chip body 31. At this time, Figure 6 and Fig. 9As shown, a fourth protrusion 47 is also provided on the bottom surface 42 of the supporting plate 4. The fourth protrusion 47 is arranged between the first protrusion 44 and the second protrusion 45, and the height of the fourth protrusion 47 relative to the bottom surface 42 is equal to the height difference between the upper supporting surface 321 and the photosensitive surface 311, so that when the photosensitive surface 311 is attached to the bottom surface 42, the upper supporting surface 321 is attached to the surface of the fourth protrusion 47 away from the bottom surface 42.

[0049] It is understandable that in some embodiments, the height of the upper bearing surface 321 relative to the bottom surface 312 may be greater than the height of the photosensitive surface 311 relative to the bottom surface 312, so that a first step structure is formed between the electrical connection portion 32 and the chip body 31. At this time, the surface of the electrical connection portion 32 for contacting with the chip body 31 can be in contact with the bearing plate 4 by appropriately setting the size of the bearing plate 4.

[0050] like Figure 4 , Figure 5 as well as Fig.10 As shown, in this embodiment, the camera module 10 further includes a reinforcing bottom plate 6 and a reinforcing side plate 7, wherein the reinforcing bottom plate 6 is arranged on the surface of the chip body 31 away from the carrier plate 4, and the reinforcing side plate 7 is arranged between the reinforcing bottom plate 6 and the carrier plate 4 and surrounds the outer side of the chip body 31. In this way, the chip body 31 is surrounded by the carrier plate 4, the reinforcing bottom plate 6 and the reinforcing side plate 7, thereby preventing the chip body 31 from being scratched by foreign objects. In addition, the connection strength between the photosensitive chip 3 and the carrier plate 4 can also be improved by the arrangement of the reinforcing bottom plate 6 and the reinforcing side plate 7.

[0051] In this embodiment, the reinforcing side plate 7 can be integrally formed with the reinforcing bottom plate 6. Of course, in some embodiments, the reinforcing side plate 7 can also be integrally formed with the bearing plate 4. In this case, for the convenience of production, the first protrusion 44 and the second protrusion 45 can also be part of the reinforcing side plate 7.

[0052] In this embodiment, before being assembled with the photosensitive chip 3, the reinforcing base plate 6 and the carrying plate 4 are hinged together, which can improve the assembly efficiency among the reinforcing base plate 6, the carrying plate 4 and the photosensitive chip 3 to a certain extent.

[0053] In order to make the photosensitive chip 3 more firmly arranged, Figure 6As shown, in this embodiment, the height of the lower bearing surface 322 relative to the photosensitive surface 311 is less than the height of the bottom surface 312 relative to the photosensitive surface 311, so that there is a height difference between the lower bearing surface 322 and the bottom surface 312, thereby forming a second step structure between the electrical connection portion 32 and the chip body 31. At this time, a fifth bump 61 is also provided on the reinforcing bottom plate 6, and the surface of the chip body 31 that is connected to the electrical connection portion 32 abuts on the fifth bump 61. Among them, since the reinforcing side plate 7 can be integrally formed with the reinforcing bottom plate 6, for the convenience of production, the fifth bump 61 can also be a part of the reinforcing side plate 7.

[0054] Understandable, such as Fig.11 As shown, in some embodiments, the height of the lower bearing surface 322 relative to the photosensitive surface 311 may be greater than the height of the bottom surface 312 relative to the photosensitive surface 311, so that there is a height difference between the lower bearing surface 322 and the bottom surface 312, thereby forming a second step structure between the electrical connection portion 32 and the chip body 31. At this time, the surface of the electrical connection portion 32 used to connect with the chip body 31 can be abutted against the reinforcing bottom plate 6 by appropriately setting the size of the reinforcing bottom plate 6.

[0055] like Figure 3 and Figure 4 As shown, in this embodiment, the camera module 10 further includes a shielding shell 8, wherein the shielding shell 8 can be a metal shell such as copper. In this embodiment, the shielding shell 8 is a shell structure with an opening at one end, and an opening 81 is provided on the side wall of the shielding shell 8. The reinforcing bottom plate 6, the bearing plate 4, and the chip body 31 of the photosensitive chip 3 are all arranged in the shielding shell 8, and the electrical connection part 32 of the photosensitive chip 3 extends out of the shielding shell 8 from the opening 81.

[0056] In this embodiment, the carrier plate 4 may be made of hard plastic or other materials, and the carrier plate 4 is mainly used to support the photosensitive chip 3, the bracket 2 and the lens 1. Therefore, in some embodiments, the carrier plate 4 may not be provided with the light-through hole 23, and the photosensitive chip 3 is arranged on the object side surface 41 of the carrier plate 4. In addition, in some embodiments, when the chip body 31 of the photosensitive chip 3 is large in size, the bracket 2 may also be directly arranged on the chip body 31, that is, the carrier plate 4 may be omitted, and the chip body 31 may be directly used to support the bracket 2 and the lens 1.

[0057] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A photosensitive component, characterized in that: include: A carrying plate having an object side surface and an image side surface disposed opposite to each other, wherein a avoidance hole is disposed on the carrying plate, and the avoidance hole extends from the object side surface to the image side surface; A photosensitive chip is arranged on the carrier board, and the photosensitive chip includes: A chip body, used for receiving light for imaging, the chip body having a photosensitive surface, a bottom surface arranged opposite to the photosensitive surface, and side surfaces respectively intersecting the bottom surface and the photosensitive surface, the photosensitive surface is used for receiving light for imaging, the photosensitive chip is arranged on the image side surface, and the chip body is opposite to the avoidance hole so as to receive light from the avoidance hole; An electrical connection portion is arranged on the chip body and is used for plugging and connecting with the processing unit, the electrical connection portion protrudes from the carrier board, the electrical connection portion is arranged on the side of the chip body, the electrical connection portion has an upper bearing surface and a lower bearing surface arranged opposite to each other, and the pad is arranged on the upper bearing surface and / or the lower bearing surface, wherein in the direction from the photosensitive surface to the bottom surface, the upper bearing surface and the lower bearing surface are arranged in sequence; there is a height difference between the upper bearing surface and the photosensitive surface, so that a first step structure is formed between the electrical connection portion and the chip body, and / or there is a height difference between the lower bearing surface and the bottom surface, so that a second step structure is formed between the electrical connection portion and the chip body; A pad is arranged on the electrical connection part, the electrical connection part is provided with a groove, the pad is embedded in the groove and is electrically connected to the chip body, and the pad can be electrically connected to the processing unit after the electrical connection part is plug-connected with the processing unit; A first bump and a second bump are spaced apart on the image side surface of the carrier plate, the electrical connection portion is located between the first bump and the second bump, and abuts against the first bump and the second bump respectively, and at least one of the first bump and the second bump also abuts against the surface of the chip body close to the electrical connection portion.

2. The photosensitive component according to claim 1, characterized in that: The pad is a gold finger.

3. The photosensitive component according to claim 1, characterized in that: A third bump is further disposed on the image side of the carrier plate, and the third bump abuts against a surface of the chip body away from the electrical connection portion.

4. The photosensitive component according to claim 1, characterized in that: The photosensitive component also includes: A reinforcing bottom plate, the reinforcing bottom plate being arranged on a surface of the photosensitive chip away from the carrying plate; A reinforcing side plate is arranged between the reinforcing bottom plate and the carrying plate and surrounds the outer side of the chip body.

5. The photosensitive component according to claim 4, characterized in that: The reinforcing bottom plate and the reinforcing side plates are integrally formed.

6. A camera module, characterized in that: include: Lens; A photosensitive component connected to the lens and used to receive the light projected from the lens for imaging, wherein the photosensitive component is as described in any one of claims 1-5.

7. An electronic device, characterized in that: Comprising the camera module as described in claim 6.

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