Chip bottom filling glue device
By designing a chip bottom filler device including a rubber filling table, a lifting mechanism, a transmission mechanism and a discharge rubber filling needle, the problems of slow glue filling speed, poor continuity and easy bubbles and holes in the prior art are solved, and a more efficient and continuous rubber filling process is achieved, extending the service life of the chip.
Patent Information
- Application Number
- CN202111092223.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-09-17
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2041-09-17
AI Technical Summary
The existing chip bottom filling technology has a slow filling speed and poor continuity during the glue filling process, which is prone to bubbles and cavity generation, affecting the service life of the chip.
A chip bottom filler device is designed, including a rubber filling table, a lifting mechanism, a transmission mechanism, a slide rail mechanism and a row-type rubber filling needle. The lifting mechanism is driven to lift the rubber filling table through the transmission mechanism, and the telescopic mechanism is used to adjust the distance between the needle of the rubber filling needle and the chip to improve the continuity and efficiency of rubber filling.
By accelerating the glue filling flow, the continuity of glue filling is improved, the generation of bubbles and cavity is reduced, and the service life of the chip is extended.
Smart Images
Figure CN113658876B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of laboratory instruments and equipment, in particular to a chip bottom filling glue device. Background Art
[0002] With the rapid development of electronic products, the packaging density of electronic products is getting higher and higher, which makes BGA, QFN and other high-integration packaging forms used in various electronic products, especially in aviation, aerospace and other equipment with high reliability requirements. In actual use, electronic products are affected by various mechanical loads, such as bending, torsional deformation, random vibration, thermal shock, etc. This will lead to the failure of the interconnection solder joints in the circuit board. In order to improve the reliability of the interconnection solder joints, the current engineering field uses the method of filling glue at the bottom of the chip. In engineering, the bottom substitute filling is generally carried out by capillary action. The filling speed is slow during the filling process. Due to the use of a single needle, the continuity of the filling is poor, and bubbles and voids are easily generated, which affects the service life of the chip after filling. Summary of the invention
[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a chip bottom filling glue device.
[0004] The technical solution for achieving the purpose of the present invention is:
[0005] A chip bottom filling glue device comprises a base, one end of the base is provided with a transmission mechanism, the other end is provided with a filling workbench, one end of the filling workbench is movably connected to the base, the other end of the filling workbench is connected to a lifting mechanism arranged on the base, the base between the lifting mechanism and the transmission mechanism is also provided with a supporting baffle, a filling needle is arranged above the filling workbench and is connected to the supporting baffle through a telescopic mechanism, and the transmission mechanism provides power to the lifting mechanism so that the lifting mechanism pushes the filling workbench to rise and fall.
[0006] The glue filling workbench comprises a bottom plate, on which a positioning protrusion is provided. The assembled chip circuit board that needs to be filled with glue at the bottom is detachably fixed in the middle of the bottom plate and clamped on the positioning protrusion. The two sides of the circuit board are fixed to the bottom plate by a circuit board fixing mechanism. The three sides of the chip are respectively surrounded by glue filling baffles. The back side of each glue filling baffle is connected to one end of a baffle long rod through a hinge, and the other end of the baffle long rod is connected to a slider guide mechanism. The slider guide mechanism is fixed on the bottom plate, and the needle head of the glue filling needle is aligned with the side of the chip that is not surrounded.
[0007] The glue filling needle has a row-type glue filling needle.
[0008] The slider guide mechanism includes a guide plate, a slide seat is provided on the guide plate, a hinge structure is provided on the slide seat, the hinge structure is movably connected to one end of the baffle long rod, and the slide seat slides on the guide plate, and the baffle long rod is pulled through the hinge structure, thereby driving the glue-filled baffle to adjust the degree of close contact between the glue-filled baffle and the chip.
[0009] The hinge structure comprises a primary hinge structure and a secondary hinge structure. The primary hinge structure is arranged on the sliding seat, and the secondary hinge structure is arranged on the primary hinge structure.
[0010] The lifting mechanism comprises a screw groove fixed on the base, a screw shaft is arranged in the screw groove, a slider is arranged on the screw shaft, the slider is movably connected to one end of the supporting long rod, and the supporting long rod is movably connected to the bottom of the base plate of the glue filling workbench.
[0011] The transmission mechanism includes a stepper motor, the output shaft of the stepper motor is connected to the first transmission shaft through a coupling, the first transmission shaft is provided with a first bevel gear, the first bevel gear is connected to the second bevel gear, the second bevel gear is provided at one end of the second transmission shaft, the other end of the second transmission shaft is provided with a first spur gear, the first spur gear is connected to the second spur gear, and the second spur gear is connected to one end of the screw shaft of the lifting mechanism.
[0012] The telescopic mechanism includes a first telescopic plate and a second telescopic plate; one end of the first telescopic plate is connected to one end of the second telescopic plate by a tightening nut, and the other end of the second telescopic plate is slidably connected to the bracket of the glue filling needle, so that the bracket can slide on the second telescopic plate.
[0013] The present invention provides a chip bottom filling glue device, which first fixes the circuit board on the bottom plate of the workbench, and makes the filling baffle and the chip close together through the filling baffle, the baffle long rod and the slider guide mechanism, and drives the lead screw shaft to rotate through the transmission mechanism to move the slider, so that the workbench is raised and lowered; then the distance between the needle head of the filling needle and the chip to be filled with glue is adjusted through the telescopic mechanism, and then the filling needle bracket moves horizontally on the telescopic frame to make the filling more uniform. The filling platform can be restored to a horizontal position by controlling the reversal of the stepper motor, and the circuit board after filling can be disassembled to complete the entire filling process. In addition, the device uses the self-gravity of the filling glue to accelerate the flow rate of the bottom filling glue, thereby improving the filling efficiency of the chip. The use of arranged filling needles can improve the continuity of the filling glue and reduce the generation of bubbles and voids. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of a chip bottom filling glue device;
[0015] Figure 2 It is a structural schematic diagram of the glue filling workbench;
[0016] Figure 3 It is a structural schematic diagram of the slider guide mechanism;
[0017] Figure 4 It is a structural schematic diagram of the transmission mechanism;
[0018] Figure 5 It is a schematic diagram of the structure of the filling needle and the telescopic mechanism;
[0019] Figure 6 It is a structural schematic diagram of the lifting mechanism;
[0020] Figure 7 This is a schematic diagram of a row-type glue-filling needle;
[0021] In the figure: 1. base 2. lifting mechanism 3. transmission mechanism 4. support baffle 5. telescopic mechanism 6. glue filling needle 7. glue filling workbench 8. bottom plate 9. circuit board 10. chip 11. glue filling baffle 12. baffle long rod 13. slider guide mechanism 14. positioning protrusion 15. guide plate 16. slide seat 17. primary hinge structure 18. secondary hinge structure 19. stepper motor 20. coupling 21. first bevel gear 22. second bevel gear 23. first transmission shaft 24. second transmission shaft 25. first spur gear 26. second spur gear 27. first telescopic plate 28. tightening screw 29. second telescopic plate 30. slide groove 31. bracket 32. support long rod 33. screw groove 34. screw shaft 35. slider 36. row type glue filling needle. DETAILED DESCRIPTION
[0022] The present invention is further described below with reference to the accompanying drawings and embodiments, but the present invention is not limited thereto.
[0023] Example:
[0024] like Figure 1 As shown, a chip bottom filling glue device includes a base 1, one end of the base is provided with a transmission mechanism 3, and the other end is provided with a filling workbench 7, one end of the filling workbench 7 is movably connected to the base 1, and the other end of the filling workbench 7 is connected to a lifting mechanism 2 arranged on the base 1, and the base 1 between the lifting mechanism 2 and the transmission mechanism 3 is also provided with a supporting baffle 4, a filling needle 6 is arranged above the filling workbench 7 and is connected to the supporting baffle 4 through a telescopic mechanism 5, and the transmission mechanism 3 provides power for the lifting mechanism 2 so that the lifting mechanism 2 pushes the filling workbench 7 to rise and fall.
[0025] like Figure 2As shown, the glue filling workbench 7 includes a base plate 8, on which a positioning protrusion 14 is provided. The circuit board 9 of the assembled chip 10 that needs to be filled with glue at the bottom is detachably fixed in the middle of the base plate 8 and stuck on the positioning protrusion 14. The two sides of the circuit board 9 are fixed to the base plate 8 by a circuit board fixing mechanism. The three sides of the chip 10 are respectively surrounded by glue filling baffles 11. The back of each glue filling baffle 11 is connected to one end of a baffle long rod 12 through a hinge. The other end of the baffle long rod 12 is connected to a slider guide mechanism 13. The slider guide mechanism 13 is fixed to the base plate 8, and the needle head of the glue filling needle 6 is aligned with the side of the chip 10 that is not surrounded.
[0026] like Figure 7 As shown, the glue filling needle 6 has a row-type glue filling needle 36, which can improve the continuity of glue filling and reduce the generation of bubbles and voids.
[0027] like Figure 3 As shown, the slider guide mechanism 13 includes a guide plate 15, a slide seat 16 is provided on the guide plate 15, a hinge structure is provided on the slide seat 16, the hinge structure includes a primary hinge structure 17 and a secondary hinge structure 18, the primary hinge structure 17 is provided on the slide seat 16, the secondary hinge structure 18 is provided on the primary hinge structure 17, the secondary hinge structure 18 is movably connected to one end of the baffle long rod 12, and the baffle long rod 12 is pulled through the hinge structure by the sliding of the slide seat 16 on the guide plate 15, thereby driving the glue-filled baffle 11, adjusting the degree of close contact between the glue-filled baffle 11 and the chip 10, and when adjusted to a suitable position, the slide seat 16 is locked to the guide plate 15 using a locking nut.
[0028] like Figure 6 As shown, the lifting mechanism 2 includes a screw groove 33 fixed on the base 1, a screw shaft 34 is provided in the screw groove 33, a slider 35 is provided on the screw shaft 34, the slider 35 is movably connected to one end of the supporting long rod 32, and the supporting long rod 32 is movably connected to the bottom of the bottom plate 8 of the glue filling workbench 7.
[0029] like Figure 4 As shown, the transmission mechanism 3 includes a stepper motor 19, the output shaft of the stepper motor 19 is connected to the first transmission shaft 23 through a coupling 20, the first transmission shaft 23 is provided with a first bevel gear 21, the first bevel gear 21 is connected to the second bevel gear 22, the second bevel gear 22 is arranged at one end of the second transmission shaft 24, the other end of the second transmission shaft 24 is provided with a first spur gear 25, the first spur gear 25 is connected to the second spur gear 26, the second spur gear 26 is connected to one end of the screw shaft 34 of the lifting mechanism 2, and the screw shaft 34 is driven to rotate by the second spur gear 26, so that the slider 35 moves on the screw shaft 34 to lift the supporting long rod 32, and finally drives the lifting of the glue filling workbench 7.
[0030] The telescopic mechanism 5 includes a first telescopic plate 27 and a second telescopic plate 29; one end of the first telescopic plate 27 is connected to one end of the second telescopic plate 29 by a tightening nut 28, and the other end of the second telescopic plate 29 is slidably connected to a bracket 31 of the glue filling needle 6. A slide groove 30 is provided on the back of the bracket 31, and the slide groove 30 is used to move on the second telescopic plate 29, so that the glue filling needle 6 on the bracket 31 can slide on the second telescopic plate 29.
[0031] The method of using the above device is:
[0032] (1) First, place the circuit board 9 on the bottom plate 8 of the glue filling workbench 7, and clamp one end of the circuit board 9 on the positioning protrusion 14. After adjusting the position, tighten the four positioning screws of the circuit board fixing mechanism to fix the circuit board 9;
[0033] (2) Adjust the slider guide mechanism on the glue filling workbench 7, adjust the position of the glue filling baffle 11, so that the lower edge of the glue filling baffle 11 is close to the chip 10 and the circuit board 9. When it is adjusted to a suitable position, use the locking nut to lock the slide 16 on the guide plate 15 to fix the position of the glue filling baffle 11;
[0034] (3) Turn on the stepper motor 19 to make it rotate forward, and through the transmission structure, the screw shaft 34 rotates, so that the slider 35 on the screw shaft 34 moves to the left, so that the supporting long rod 32 pushes the glue filling workbench 7 to lift upward, and when the angle between the bottom plate 8 and the horizontal is 30-45 degrees, turn off the stepper motor;
[0035] (4) Adjust the first telescopic frame 27 and the second telescopic frame 29, and place the needle head 36 of the filling needle 6 close to the gap between the chip 10 and the circuit board 9. Tighten the tightening screw 28 at the connection between the first telescopic frame 27 and the second telescopic frame 29 to fix the position of the telescopic mechanism.
[0036] (5) Move the needle 36 of the filling needle 6 to one side of the chip 10, and then push the pusher of the filling needle 6 to start filling. During the filling process, move the bracket 31 back and forth to ensure uniform filling. When glue overflows near the needle 36 of the filling needle 6, stop filling.
[0037] (6) Turn on the stepper motor 19 and reverse it, so that the slider 35 on the screw shaft 34 moves to the right, and the supporting long rod 32 pushes the glue filling workbench 7 down. When the bottom plate 8 falls to the bottom, turn off the stepper motor 19, remove the circuit board 9, and complete the entire glue filling process.
Claims
1. A chip bottom filling glue device, characterized in that: The base comprises a base, one end of which is provided with a transmission mechanism, and the other end of which is provided with a glue filling workbench, one end of which is movably connected to the base, and the other end of which is connected to a lifting mechanism arranged on the base, and a supporting baffle is also arranged on the base between the lifting mechanism and the transmission mechanism, and a glue filling needle is arranged above the glue filling workbench and is connected to the supporting baffle through a telescopic mechanism, and the transmission mechanism provides power to the lifting mechanism so that the lifting mechanism drives the lifting of the glue filling workbench; The glue filling workbench comprises a bottom plate, a positioning protrusion is provided on the bottom plate, the assembled chip circuit board which needs to be filled with glue at the bottom is detachably fixed to the middle of the bottom plate and clamped on the positioning protrusion, the two sides of the circuit board are fixed to the bottom plate by a circuit board fixing mechanism, the three sides of the chip are respectively surrounded by glue filling baffles, the back of each glue filling baffle is connected to one end of a baffle long rod by a hinge, the other end of the baffle long rod is connected to a slider guide mechanism, the slider guide mechanism is fixed to the bottom plate, and the needle head of the glue filling needle is aligned with the side of the chip that is not surrounded; The lifting mechanism comprises a screw groove fixed on the base, a screw shaft is arranged in the screw groove, a slider is arranged on the screw shaft, the slider is movably connected to one end of the supporting long rod, and the supporting long rod is movably connected to the bottom of the base plate of the glue filling workbench.
2. A chip bottom filling glue device according to claim 1, characterized in that: The glue filling needle has a row-type glue filling needle.
3. A chip bottom filling glue device according to claim 1, characterized in that: The slider guide mechanism includes a guide plate, a slide seat is provided on the guide plate, a hinge structure is provided on the slide seat, the hinge structure is movably connected to one end of the baffle long rod, and the slide seat slides on the guide plate, and the baffle long rod is pulled through the hinge structure, thereby driving the glue-filled baffle to adjust the degree of close contact between the glue-filled baffle and the chip.
4. A chip bottom filling glue device according to claim 3, characterized in that: The hinge structure comprises a primary hinge structure and a secondary hinge structure. The primary hinge structure is arranged on the sliding seat, and the secondary hinge structure is arranged on the primary hinge structure.
5. The chip bottom filling glue device according to claim 1, characterized in that: The transmission mechanism includes a stepper motor, the output shaft of the stepper motor is connected to the first transmission shaft through a coupling, the first transmission shaft is provided with a first bevel gear, the first bevel gear is connected to the second bevel gear, the second bevel gear is provided at one end of the second transmission shaft, the other end of the second transmission shaft is provided with a first spur gear, the first spur gear is connected to the second spur gear, and the second spur gear is connected to one end of the screw shaft of the lifting mechanism.
6. A chip bottom filling glue device according to claim 1, characterized in that: The telescopic mechanism includes a first telescopic plate and a second telescopic plate; one end of the first telescopic plate is connected to one end of the second telescopic plate by a tightening nut, and the other end of the second telescopic plate is slidably connected to the bracket of the glue filling needle, so that the bracket can slide on the second telescopic plate.
7. The method for using the chip bottom filling glue device according to any one of claims 1 to 6, characterized in that: The steps include: (1) First, place the circuit board on the bottom plate of the filling workbench. One end of the circuit board is stuck on the positioning protrusion. After adjusting the position, tighten the four positioning screws of the circuit board fixing mechanism to fix the circuit board. (2) Adjust the slider guide mechanism on the glue filling workbench and adjust the position of the glue filling baffle so that the lower edge of the glue filling baffle is close to the chip and the circuit board. When it is adjusted to the appropriate position, use the locking nut to lock the slide on the guide plate to fix the position of the glue filling baffle; (3) Turn on the stepper motor to make it rotate forward, and through the transmission structure, the screw shaft rotates, so that the slider on the screw shaft moves to the left, and the supporting long rod pushes the glue filling workbench upward. When the angle between the bottom plate and the horizontal is 30-45 degrees, turn off the stepper motor; (4) Adjust the first telescopic frame and the second telescopic frame, so that the tip of the filling needle is close to the gap between the chip and the circuit board, and tighten the tightening screws at the connection between the first telescopic frame and the second telescopic frame to fix the position of the telescopic mechanism; (5) Move the tip of the filling needle to one side of the chip, and then push the pusher of the filling needle to start filling. During the filling process, move the bracket back and forth to ensure uniform filling. When glue overflows near the tip of the filling needle, stop filling. (6) Turn on the stepper motor and reverse it, so that the slider on the screw shaft moves to the right, and the supporting long rod pushes the filling workbench down. When the bottom plate falls to the bottom, turn off the stepper motor, remove the circuit board, and complete the entire filling process.
Citation Information
Patent Citations
Full-automatic glue dispenser
CN107398398A
Chip bottom glue filling device
CN216054580U