Cutting device

Abstract

The present invention provides a cutting device that can determine whether a division intended line of a workpiece exists directly above a groove on a holding jig even if an operator does not specify a region including the groove on the holding jig. The cutting device includes a cutting unit having a spindle on which a cutting tool is mounted; a table base on which a plate-shaped holding jig having a groove into which the cutting tool is inserted is mounted on an upper portion; a camera configured to be positioned above the table base to take an image of the holding jig or a workpiece held by the holding jig; and a determination unit that determines whether a division intended line of the workpiece held by the holding jig exists directly above the groove, the determination unit having a storage section that stores information including a position of the groove of the holding jig; and an image acquisition section that causes the camera to take an image showing the groove of the holding jig based on the information stored in the storage section, and acquires the image of the region including the groove of the holding jig mounted on the table base.

Description

Technical Field

[0001] The present invention relates to a cutting device used when cutting a plate-shaped workpiece. Background Art

[0002] In packaging technologies such as CSP (Chip Size Package) and QFN (Quad Flat Non-leaded Package), multiple devices, typically integrated circuits, are sealed with resin to form a package substrate. This substrate is then divided along planned dividing lines (streets). This produces multiple packaged device chips, each containing a device.

[0003] When dividing the package substrate, a cutting device equipped with a ring-shaped cutting blade, for example, is used. This cutting blade is made by fixing fine abrasive grains such as diamond with a resin or other binder. The high-speed rotating cutting blade cuts into the package substrate along the predetermined dividing line, thereby cutting the package substrate into a plurality of packaged device chips.

[0004] However, when cutting a package substrate with a cutting tool, a specially designed plate-shaped holding jig (jig table) is often used to hold the package substrate (see, for example, Patent Document 1). The holding jig is provided with a groove (relief groove) and holes (suction holes). The groove is located in an area corresponding to the intended dividing line of the workpiece and is inserted into the lower end of the cutting tool. The holes are located in the multiple areas defined by the groove, allowing negative pressure from the suction source to act on the package substrate.

[0005] Therefore, if this holding jig is used, even if the cutting tool is cut into the package substrate to a sufficient depth to cut along the predetermined dividing line, the holding jig will not be damaged. In addition, after the package substrate is divided into multiple packaged device chips, the negative pressure applied from each hole also properly holds the packaged device chips.

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2011-114145

[0007] When using the aforementioned holding jig to cut a workpiece, it is crucial that the intended dividing line of the workpiece be positioned directly above the groove provided in the holding jig. Therefore, the workpiece on the holding jig is photographed using a camera included in the cutting device. The position of the intended dividing line is determined from the resulting image, and a check is performed to determine whether the intended dividing line matches the position of the groove pre-registered in the cutting device.

[0008] The position of the groove used for this determination is calculated, for example, from an image captured by a camera of an area designated by an operator on a holding jig. However, in a cutting device that calculates the position of the groove using this method, the operator must specify the area on the holding jig containing the groove each time the holding jig is replaced. Summary of the Invention

[0009] The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a cutting device capable of determining whether a planned dividing line of a workpiece exists right above a groove even if an operator does not specify an area including a groove on a holding jig.

[0010] According to one embodiment of the present invention, there is provided a cutting unit having a spindle for mounting a cutting tool; a worktable base having a plate-shaped holding jig mounted on an upper portion thereof, the holding jig having a groove and a hole, the groove being provided in an area corresponding to a plurality of predetermined dividing lines set on a workpiece and for inserting the cutting tool when the workpiece is cut by the cutting unit along the predetermined dividing lines, the hole being provided in each of a plurality of areas divided by the groove so as to cause negative pressure from a suction source to act; a camera being arranged above the worktable base for photographing the holding jig or the workpiece held by the holding jig to obtain an image; and a determination unit. , which determines whether the planned dividing line of the workpiece held by the holding jig is located directly above the groove, the determination unit comprising: a storage unit that stores information including the position of the groove of the holding jig; an image acquisition unit that, based on the information stored in the storage unit, causes the camera to capture an area of ​​the holding jig mounted on the worktable base including the groove to acquire an image showing the groove of the holding jig; and a determination unit that determines whether the planned dividing line of the workpiece held by the holding jig is located directly above the groove, based on the new information including the position of the groove determined by the image acquired by the image acquisition unit.

[0011] In one embodiment of the present invention, when a holding jig of the same type as the holding jig previously mounted on the worktable base is mounted on the worktable base, the image acquisition unit causes the camera to capture an image of a region including the groove of the holding jig newly mounted on the worktable base based on the information related to the previously mounted holding jig, thereby acquiring an image showing the groove of the holding jig, and the determination unit determines whether the planned dividing line of the workpiece held by the holding jig is located directly above the groove based on the new information including the position of the groove determined by the image acquired by the image acquisition unit.

[0012] Furthermore, in one embodiment of the present invention, the information related to a plurality of different holding jigs may be stored in the storage unit. When a holding jig of a different type from the holding jig previously mounted on the table base is mounted on the table base, the image acquisition unit causes the camera to capture an image of a region including the groove of the holding jig newly mounted on the table base based on the information related to the different type of holding jig, thereby acquiring an image showing the groove of the holding jig. The determination unit determines whether the planned dividing line of the workpiece held by the holding jig is located directly above the groove based on the new information including the position of the groove determined by the image acquired by the image acquisition unit.

[0013] A cutting device according to one embodiment of the present invention includes a determination unit having a storage unit and an image acquisition unit. The storage unit stores information including the position of a groove of a holding jig. The image acquisition unit, based on the information stored in the storage unit, causes a camera to capture an image of an area including the groove of a holding jig mounted on a table base, thereby capturing an image showing the groove of the holding jig. Therefore, even if an operator does not specify the area including the groove on the holding jig, the camera can capture the area including the groove based on the information stored in the storage unit. In other words, even if the operator does not specify the area including the groove on the holding jig, it is possible to determine whether a planned dividing line for a workpiece exists directly above the groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view showing a structural example of a cutting device.

[0015] Figure 2 (A) is a top view showing a structural example of a package substrate. Figure 2 (B) is a bottom view showing a structural example of a package substrate.

[0016] Figure 3 (A) is a top view showing a structural example of a chuck table, Figure 3 (B) is a cross-sectional view showing a structural example of the chuck table.

[0017] Figure 4 It is an exploded perspective view showing a structural example of a cutting unit.

[0018] Figure 5 This is a functional block diagram showing a part of the functional configuration of the control unit.

[0019] Figure 6 It is a cross-sectional view showing a state where a position specified by information in the storage unit is photographed by a camera.

[0020] Figure 7This is an example of an image obtained by photographing a position specified by the information in the storage unit using a camera.

[0021] Figure 8 (A) is a cross-sectional view showing a state in which a position specified by information in a storage unit is photographed by a camera while the package substrate is held in a holding jig. Figure 8 (B) is a cross-sectional view showing a state where a package substrate is cut.

[0022] Description of labels

[0023] 2: Cutting device; 4: Base; 4a: Opening; 6: Workbench moving mechanism; 8a: Workbench cover; 8b: Corrugated cover; 10: Chuck workbench; 12: Workbench base; 12a: Upper surface; 12b: First flow path; 12c: Second flow path; 14: Holding fixture; 14a: Holding surface; 14b: Lower surface; 14c: Groove; 14d: Hole (suction hole); 16a: Valve; 16b: Valve; 18: Suction source; 20: Support structure; 22: Cutting unit moving mechanism; 24: Y-axis guide rail; 26: Y-axis moving plate; 28: Screw shaft; 30: Z-axis guide rail; 32: Z-axis moving plate; 34: Screw shaft; 36: Z-axis pulse motor; 38: Cutting unit; 40: Spindle housing; 42: Spindle; 44: Cutter Tool mounting seat; 46: Flange portion; 48: Boss portion; 50: Cutting tool; 50a: Opening; 52: Fixing flange; 52a: Opening; 54: Fixing nut; 54a: Opening; 56: Camera (shooting unit); 58: Touch screen (input and output device); 60: Control unit (determination unit); 60a: Storage unit; 60b: Image acquisition unit; 60c: Information acquisition unit; 60d: Determination unit; 11: Package substrate (workpiece); 13: Frame; 13a: Front side; 13b: Back side; 15: Device area; 17: Remaining area; 19: Predetermined dividing line (interval); 21: Resin layer; 23: Carrier; 31a: Base line; 31b: Groove; A: Position; B: Position; C: Position; D: Position. DETAILED DESCRIPTION

[0024] Embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 2 is a perspective view showing a structural example of the cutting device 2 of this embodiment. Figure 1 , a portion of the structural elements of the cutting device 2 is represented by a functional block. In addition, the X-axis direction (front-back direction, machining feed direction), the Y-axis direction (left-right direction, indexing feed direction), and the Z-axis direction (up-down direction, cutting direction) used in the following description are perpendicular to each other.

[0025] like Figure 1As shown, the cutting device 2 has a base 4 that supports various structural elements. An opening 4a that is long in the X-axis direction is formed on the upper surface of the base 4. A ball screw-type worktable moving mechanism 6 is arranged in this opening 4a. The worktable moving mechanism 6 has an X-axis moving worktable (not shown) and moves the X-axis moving worktable along the X-axis direction. In addition, the worktable moving mechanism 6 and the upper portion of the X-axis moving worktable are covered by a worktable cover 8a and a corrugated cover 8b.

[0026] A chuck table 10 for holding a package substrate (workpiece) 11 is arranged on the X-axis moving table so as to be exposed upward from the table cover 8 a . Figure 2 (A) is a plan view showing a structural example of the package substrate 11 held by the chuck table 10. Figure 2 (B) is a bottom view showing a structural example of the package substrate 11 .

[0027] like Figure 2 (A) and Figure 2 As shown in FIG. 1B , the package substrate 11 includes a rectangular frame 13 formed in a plan view. The frame 13 is primarily composed of a metal such as 42 alloy (an alloy of iron and nickel) or copper, and has a plurality of device regions 15 (three device regions 15 in this embodiment) and a remaining region 17 surrounding each device region 15.

[0028] Each device area 15 is further divided into multiple areas (48 areas in this embodiment) by multiple predetermined dividing lines (intervals) 19 that intersect each other. Devices (device chips) such as IC (Integrated Circuit), LED (Light Emitting Diode), and MEMS (Micro Electro Mechanical Systems) are provided in each area (not shown).

[0029] A resin layer 21 is provided on the back surface 13b of the frame 13 to seal the plurality of devices. The resin layer 21 is formed to a predetermined thickness and, for example, slightly protrudes from the back surface 13b of the frame 13. The entire back surface 13b of each device region 15 is covered with the resin layer 21.

[0030] like Figure 2 As shown in FIG. 1A , multiple stages 23 corresponding to the respective devices are exposed on the front surface 13a of the housing 13. Multiple metal layers (not shown) are arranged around each stage 23 (in the region overlapping the planned dividing line 19 when viewed from above), each of which is insulated from each other by, for example, resin. Portions of each metal layer serve as electrodes for the encapsulated device chip.

[0031] The package substrate 11 is obtained by, for example, placing devices on each carrier 23 from the back side 13b of the frame 13 and connecting the electrodes of each device to a metal layer arranged around the carrier 23 using metal wires (not shown), and then sealing the back side 13b with a resin layer 21.

[0032] When the package substrate 11 is cut along the planned dividing lines 19, a plurality of packaged devices sealed with resin are formed. In addition, in this embodiment, a package substrate 11 having a rectangular shape in plan view is illustrated, but the shape, structure, size, material, etc. of the package substrate 11 are not limited.

[0033] like Figure 1 As shown, the chuck table 10 includes a table base 12 having multiple flow paths therein. The table base 12 is connected to a rotational drive source (not shown), such as a motor, and rotates about a rotation axis generally parallel to the Z-axis. Furthermore, the table base 12 moves along the X-axis along with the X-axis moving table via the table moving mechanism 6. A plate-shaped holding fixture 14 corresponding to the package substrate 11 is removably mounted on the upper surface 12a of the table base 12.

[0034] Figure 3 (A) is a top view showing a structural example of the chuck table 10 (particularly the holding jig 14). Figure 3 (B) is a cross-sectional view showing a structural example of the chuck table 10. Figure 3 In (B), some structural elements of the cutting device 2 are represented by functional blocks, etc. Figure 3 (A) and Figure 3 As shown in FIG. 1 (B), the holding jig 14 is a flat plate having a rectangular shape in a plan view, and its upper surface functions as a holding surface 14 a for holding the package substrate 11 .

[0035] A cutting tool 50 (see FIG. 1 ) to be described later is formed on the holding surface 14a side of the holding jig 14. Figure 1 ) is inserted into groove 14c. Groove 14c is provided at a position corresponding to the planned dividing line 19 of the package substrate 11, and the upper end of groove 14c opens onto the holding surface 14a. These grooves 14c divide the holding surface 14a side of the holding jig 14 into multiple areas corresponding to the divided package substrates 11 (i.e., the packaged device chips).

[0036] The width of the groove 14c is, for example, wider than the width of the planned dividing line 19 and the cutting tool 50, and the depth of the groove 14c (the distance between the bottom of the groove 14c and the holding surface 14a) is, for example, deeper than the maximum penetration depth of the cutting tool 50. Therefore, even if the cutting tool 50 penetrates sufficiently deeply when cutting the package substrate 11 along the planned dividing line 19, the holding jig 14 and the cutting tool 50 do not come into contact.

[0037] In each area of ​​the holding jig 14 divided by the groove 14c, a hole (suction hole) 14d is formed which passes through the holding jig 14 vertically and opens on the holding surface 14a. Figure 3 As shown in (B), one end side of the first flow path 12b is open at the central part (the area corresponding to the hole 14d) on the upper surface 12a side of the workbench base 12, and when the holding fixture 14 is placed on the upper surface 12a of the workbench base 12, each hole 14d is connected to the first flow path 12b.

[0038] The other end of the first flow path 12b is connected to a suction source 18, such as a vacuum pump, via a valve 16a. Therefore, when the package substrate 11 is overlapped with the holding surface 14a of the holding jig 14 placed on the upper surface 12a of the table base 12 and the valve 16a is opened, negative pressure from the suction source 18 is applied to the package substrate 11, allowing the package substrate 11 to be held by the chuck table 10.

[0039] One end of the second flow path 12c, used to attach the holding jig 14 to the table base 12, opens on the outer periphery of the table base 12. The other end of the second flow path 12c is connected to the suction source 18 via a valve 16b. Therefore, when the lower surface 14b of the holding jig 14 is brought into contact with the upper surface 12a of the table base 12 and the valve 16b is opened, negative pressure from the suction source 18 is applied to the lower surface 14b of the holding jig 14, thereby securing the holding jig 14 to the upper surface 12a of the table base 12.

[0040] Before opening valve 16a, the position of package substrate 11 relative to holding jig 14 is adjusted so that planned dividing line 19 of package substrate 11 is located directly above groove 14c. Furthermore, before opening valve 16b, holding jig 14 is positioned at a predetermined position on table base 12.

[0041] The holding jig 14 is preferably made of a soft material capable of suppressing vibrations of the package substrate 11 during processing. Examples of such materials include polyurethane rubber, nitrile rubber, ethylene rubber, butyl rubber, fluororubber, silicone rubber, isoprene rubber, butadiene rubber, acrylic rubber, and polysulfide rubber. However, the holding jig 14 may also be made of other materials.

[0042] like Figure 1As shown, a gate-shaped support structure 20 is disposed on the upper surface of the base 4 so as to span the opening 4a. A cutting unit moving mechanism 22 is provided on the upper front surface of the support structure 20. The cutting unit moving mechanism 22 includes a pair of Y-axis guide rails 24 disposed on the front surface of the support structure 20 and generally parallel to the Y-axis direction. A Y-axis moving plate 26 is mounted on the Y-axis guide rails 24 so as to be slidable along the Y-axis direction.

[0043] A nut (not shown) constituting a ball screw is provided on the back (rear surface) side of the Y-axis movable plate 26. A ball screw shaft 28, which is substantially parallel to the Y-axis guide rail 24, is rotatably screwed into the nut. A Y-axis pulse motor (not shown) is connected to one end of the ball screw shaft 28. When the ball screw shaft 28 is rotated by the Y-axis pulse motor, the Y-axis movable plate 26 moves in the Y-axis direction along the Y-axis guide rail 24.

[0044] A pair of Z-axis guide rails 30 are arranged on the front surface (front face) of the Y-axis moving plate 26, extending substantially parallel to the Z-axis direction. A Z-axis moving plate 32 is mounted on the Z-axis guide rails 30 so as to be slidable along the Z-axis direction. A nut (not shown) constituting a ball screw is provided on the back surface (rear face) of the Z-axis moving plate 32.

[0045] The nut is rotatably screwed into a lead screw shaft 34 that is substantially parallel to the Z-axis guide rail 30. A Z-axis pulse motor 36 is connected to one end of the lead screw shaft 34. When the lead screw shaft 34 is rotated by the Z-axis pulse motor 36, the Z-axis moving plate 32 moves in the Z-axis direction along the Z-axis guide rail 30.

[0046] A cutting unit 38 for cutting the package substrate 11 is provided below the Z-axis moving plate 32 . Figure 4 : is an exploded perspective view showing a structural example of the cutting unit 38. Figure 4 As shown, the cutting unit 38 has a spindle housing 40 that is cylindrical in design.

[0047] A spindle 42 serving as a rotation axis substantially parallel to the Y-axis direction is housed in the space inside the spindle housing 40. One end of the spindle 42 is exposed to the outside from one end of the spindle housing 40. A tool mounting seat 44 is fixed to one end of the spindle 42.

[0048] The tool mounting seat 44 includes a disc-shaped flange portion 46 and a cylindrical boss portion 48 protruding from the center of the flange portion 46. The cutting tool 50 is mounted on the tool mounting seat 44. Threads are formed on the outer peripheral surface of the boss portion 48 at the front end side.

[0049] The cutting blade 50 is formed by fixing abrasive grains such as diamond with a binder such as resin, and is annular with a pair of substantially flat circular side surfaces. An opening 50a is provided in the center of the cutting blade 50, extending from one side surface to the other side surface.

[0050] Therefore, the cutting tool 50 can be mounted on the tool mounting seat 44 by, for example, inserting the boss portion 48 of the tool mounting seat 44 into the opening 50a from one side surface of the cutting tool 50. Furthermore, when the cutting tool 50 is mounted on the tool mounting seat 44, one side surface of the cutting tool 50 contacts a portion of the flange portion 46.

[0051] When the cutting tool 50 is mounted on the tool mounting seat 44, an annular fixing flange 52 is mounted on the boss portion 48. An opening 52a is formed in the center of the fixing flange 52, and the boss portion 48 is inserted into the opening 52a. When the fixing flange 52 is mounted on the boss portion 48, the other side surface of the cutting tool 50 contacts a portion of the fixing flange 52.

[0052] With the fixing flange 52 attached to the boss 48, an annular fixing nut 54 is attached to the boss 48 from the front end. The fixing nut 54 has an opening 54a, and a thread groove corresponding to the thread of the boss 48 is formed on the inner circumference defining the opening 54a. When the fixing nut 54 is screwed into the boss 48 so that the fixing nut 54 contacts the fixing flange 52, the cutting tool 50 is clamped between the flange 46 of the tool mount 44 and the fixing flange 52.

[0053] like Figure 1 As shown, a camera (imaging unit) 56 is fixed to the lower portion of the Z-axis moving plate 32 (or the cutting unit 38). This camera 56 includes, for example, a two-dimensional optical sensor such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor sensitive to visible light, as well as an imaging sensor. This camera 56 is used to capture images of the holding surface 14a of the holding jig 14 mounted on the table base 12, or the upper surface of the package substrate 11 held by the holding jig 14.

[0054] Furthermore, if the Y-axis moving plate 26 of the cutting unit moving mechanism 22 is moved in the Y-axis direction, both the cutting unit 38 and the camera 56 are moved in the Y-axis direction. Furthermore, if the Z-axis moving plate 32 of the cutting unit moving mechanism 22 is moved in the Z-axis direction, both the cutting unit 38 and the camera 56 are moved in the Z-axis direction.

[0055] The top of the base 4 is covered by a cover (not shown) that can accommodate various components. A touch screen (input / output device) 58 serving as a user interface is located on the side of the cover. For example, various conditions applied when processing the package substrate 11 are input to the touch screen 58.

[0056] In addition, for example, an image captured by the camera 56 of the holding jig 14 or the package substrate 11 is displayed on the touch screen 58. Alternatively, a display device (output device) such as a liquid crystal display and an input device such as a keyboard or a mouse may be provided separately, replacing the touch screen 58 in which the display device (output device) and the input device are integrated.

[0057] Components such as the table moving mechanism 6, the rotation drive source connected to the table base 12, the valves 16a and 16b, the cutting unit moving mechanism 22, the cutting unit 38, the camera 56, and the touch screen 58 are connected to a control unit (determination unit) 60. The control unit 60 controls each of the above components according to a series of steps required for cutting the package substrate 11.

[0058] The control unit 60 is comprised of, for example, a computer including a processing device such as a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a hard disk drive or flash memory. The functions of the control unit 60 are realized by operating the processing device and the like according to software stored in the auxiliary storage device. However, the control unit 60 may also be implemented solely by hardware.

[0059] Figure 5 1 is a functional block diagram showing a part of the functional configuration of the control unit 60. Figure 5 As shown, the control unit 60 includes, for example, a storage unit 60a configured to pre-store information related to a plurality of different holding jigs 14 that may be mounted on the table base 12. The information related to the holding jig 14 stored in the storage unit 60a includes at least the position of the groove 14c provided in the holding jig 14.

[0060] For example, when the cutting machine 2 is shipped from the factory or initially started up, the design information for various holding jigs 14 is stored in the storage unit 60a. The control unit 60 of the cutting machine 2 uses the information stored in the storage unit 60a to confirm the exact position of the groove 14c of the holding jig 14 actually attached to the table base 12.

[0061] For example, when an operator or the like inputs the type of holding jig 14 actually mounted on the table base 12 into the touch screen 58, the image acquisition unit 60b of the control unit 60 requests the storage unit 60a for information related to the input type of holding jig 14. Upon receiving the information about the holding jig 14 from the storage unit 60a, the image acquisition unit 60b causes the camera 56 to capture an image of the area including the groove 14c of the holding jig 14 mounted on the table base 12 based on the received information.

[0062] Specifically, the image acquisition unit 60b adjusts the positional relationship between the chuck table 10 and the camera 56 so that the camera 56 can capture an image of the position specified by the information received from the storage unit 60a. In other words, the image acquisition unit 60b controls the operation of the table moving mechanism 6, the rotation drive source connected to the table base 12, the cutting unit moving mechanism 22, and the like to position the camera 56 directly above the position specified by the information in the storage unit 60a.

[0063] The image acquisition unit 60b then uses the camera 56 to capture the holding surface 14a of the holding jig 14 from above. This allows the acquisition of an image showing the groove 14c of the holding jig 14 actually mounted on the table base 12. The position of the table base 12 where the holding jig 14 is mounted is predetermined, and any positional deviation (mounting error) when the holding jig 14 is mounted on the table base 12 is suppressed to a certain extent (e.g., 1 mm or less).

[0064] Therefore, by using a camera 56 with a sufficiently large imageable range to capture an image of the position specified by the information stored in the storage unit 60a, an image showing the groove 14c can be obtained. The imageable range of the camera 56 is, for example, a rectangular area with a side of 1.5 mm to 5 mm, typically a rectangular area with a side of approximately 2.5 mm. However, there are no major limitations on the size and shape of the area that can be captured by the camera 56.

[0065] Figure 6 5 is a cross-sectional view showing a situation where the position specified by the information of the storage unit 60a is photographed by the camera 56. In this embodiment, first, the two positions A and B (which are the same as the positions A and B) specified by the information of the storage unit 60a are photographed in sequence by the camera 56. Figure 3 Thus, two images corresponding to one groove 14c can be obtained.

[0066] Next, after the table base 12 is rotated 90° about a rotation axis substantially parallel to the Z-axis direction, the two positions C and D (corresponding to the positions C and D) specified by the information in the storage unit 60a are sequentially detected by the camera 56. Figure 3Thus, two images corresponding to the other groove 14c can be obtained.

[0067] Figure 7 This is an example of an image obtained by photographing position A using camera 56. Figure 7 In the image, the reference line 31a passing through the position A and being substantially parallel to the X-axis direction is indicated by a single-dot chain line, and the edge of the groove 31b indicated by the information of the storage unit 60a is indicated by a dotted line. Figure 7 In the example shown in FIG. 1 , the position of groove 31b indicated by the information in storage unit 60a deviates from the actual position of groove 14c. Thus, the offset of holding jig 14 relative to table base 12 can be confirmed based on the image captured at the position specified by the information in storage unit 60a.

[0068] For example, the two images obtained by capturing images of positions A and B can confirm the offset of the holding jig 14 in a first direction (e.g., the Y-axis direction) and the offset in a rotational direction (θ direction) relative to the table base 12. Furthermore, the two images obtained by capturing images of positions C and D can confirm the offset of the holding jig 14 in a second direction (e.g., the X-axis direction) relative to the table base 12.

[0069] Furthermore, the information pre-stored in the storage unit 60a does not necessarily need to be the information obtained when the holding jig 14 was designed. For example, information related to the holding jig 14 may be extracted from an image captured by the camera 56 of an area designated by an operator on the holding jig 14, and stored in the storage unit 60a. Furthermore, the information related to the holding jig 14 stored in the storage unit 60a may include information such as the width of the groove 14c and the distance between adjacent grooves 14c.

[0070] After acquiring an image of the actually mounted holding jig 14, the information acquisition unit 60c of the control unit 60 extracts information related to the holding jig 14 from the image. For example, the information acquisition unit 60c applies edge detection or other methods to the image to calculate the position of the groove 14c, the width of the groove 14c, and the distance between adjacent grooves 14c. The information acquired by the information acquisition unit 60c is stored in the storage unit 60a.

[0071] In this embodiment, the information acquired by the information acquisition unit 60c (information related to the actually mounted holding jig 14) is replaced with the information previously stored in the storage unit 60a (information related to the same type of holding jig 14) and stored in the storage unit 60a. Thus, using the newly stored information related to the holding jig 14 in the storage unit 60a, it is possible to appropriately determine whether the planned dividing line 19 of the package substrate 11 is located directly above the groove 14c.

[0072] However, the difference between the information acquired by the information acquisition unit 60c and the information pre-stored in the storage unit 60a (i.e., information related to the positional offset of the groove 14c) may be stored in the storage unit 60a. In this case, by using this difference to correct the information pre-stored in the storage unit 60a, it is possible to appropriately determine whether the planned dividing line 19 of the package substrate 11 is located directly above the groove 14c.

[0073] When the package substrate 11 is held on the holding jig 14 of the chuck table 10 for cutting processing, the image acquisition unit 60b requests the storage unit 60a for information (newly stored information) about the holding jig 14. Upon receiving the information about the holding jig 14 from the storage unit 60a, the image acquisition unit 60b causes the camera 56 to capture an image of the region including the planned dividing line 19 of the package substrate 11 held by the holding jig 14 based on the received information.

[0074] Specifically, the image acquisition unit 60b adjusts the positional relationship between the chuck table 10 and the camera 56 so that the camera 56 can capture an image of the position specified by the information received from the storage unit 60a. In other words, the image acquisition unit 60b controls the operation of the table moving mechanism 6, the rotation drive source connected to the table base 12, the cutting unit moving mechanism 22, and the like to position the camera 56 directly above the position specified by the new information received from the storage unit 60a.

[0075] Then, the image acquisition unit 60b captures an image of a region of the package substrate 11 including the planned dividing line 19 from above using the camera 56. This allows acquisition of an image showing the planned dividing line 19 of the package substrate 11. Figure 8 (A) is a cross-sectional view showing a state where the position specified by the information in the storage unit 60 a is imaged by the camera 56 while the package substrate 11 is held by the holding jig 14 .

[0076] For example, after obtaining two images corresponding to one planned dividing line 19 by sequentially photographing positions A and B using the camera 56, the camera 56 sequentially photographs positions C and D using the camera 56 to obtain two images corresponding to another planned dividing line 19. However, the positions photographed by the camera 56 may be other than these.

[0077] After acquiring an image showing the planned dividing lines 19, the information acquisition unit 60c extracts information related to the planned dividing lines 19 from the image. For example, the information acquisition unit 60c applies edge detection or other methods to the image to calculate the position of the planned dividing lines 19, the width of the planned dividing lines 19, and the interval between adjacent planned dividing lines 19. The information related to the planned dividing lines 19 acquired by the information acquisition unit 60c is stored in the storage unit 60a.

[0078] Then, the determination unit 60d included in the control unit 60 compares the information related to the holding jig 14 with the information related to the planned dividing line 19, and determines whether the planned dividing line 19 of the package substrate 11 is located directly above the groove 14c. For example, if the actual position of the planned dividing line 19 is within a predetermined range relative to the position of the groove 14c indicated by the information stored in the storage unit 60a, the determination unit 60d determines that the planned dividing line 19 is located directly above the groove 14c.

[0079] When determining that the planned dividing line 19 exists right above the groove 14 c , the control unit 60 starts cutting the package substrate 11 . Figure 8 (B) is a cross-sectional view showing a cutting process of the package substrate 11. Figure 8 As shown in FIG. 5B , by causing the rotating cutting blade 50 to cut into the planned dividing lines 19 of the package substrate 11 , the package substrate 11 can be cut and divided into a plurality of package device chips.

[0080] On the other hand, if the actual position of the planned dividing line 19 is not within the specified range relative to the position of the groove 14c indicated by the information stored in the storage unit 60a, the determination unit 60d determines that the planned dividing line 19 is not located directly above the groove 14c. In this case, the determination result is displayed on the touch screen 58, for example. By confirming the determination result, the operator can take measures such as adjusting the position of the package substrate 11 relative to the holding jig 14.

[0081] As described above, the cutting device 2 of this embodiment includes a control unit (determination unit) 60, which has: a storage unit 60a, which stores information including the position of the groove 14c of the holding jig 14; and an image acquisition unit 60b, which, based on the information stored in the storage unit 60a, causes the camera 56 to photograph the area including the groove 14c of the holding jig 14 mounted on the workbench base 12 to obtain an image showing the groove 14c of the holding jig 14.

[0082] Therefore, even if the operator does not specify the area including the groove 14c on the holding jig 14, the camera 56 can capture an image of the area including the groove 14c on the holding jig 14 based on the information stored in the storage unit 60a. In other words, even if the operator does not specify the area including the groove 14c on the holding jig 14, it is possible to determine whether the planned dividing line 19 of the package substrate (workpiece) 11 exists directly above the groove 14c.

[0083] Furthermore, the storage unit 60a of the cutting device 2 of this embodiment stores information related to a plurality of different holding jigs 14. Therefore, even when a holding jig 14 of a different type than the holding jig 14 previously attached to the table base 12 is attached to the table base 12, the image acquisition unit 60b, based on the information related to the different type of holding jig 14, causes the camera 56 to capture an image of the region including the groove 14c of the holding jig 14 newly attached to the table base 12, thereby acquiring an image showing the groove 14c of the holding jig 14.

[0084] Then, the determination unit 60d can determine whether the planned dividing line 19 of the package substrate (workpiece) 11 held by the holding jig 14 exists directly above the groove 14c based on the new information including the position of the groove 14c determined by the image acquired by the image acquisition unit 60b.

[0085] Of course, even when a holding jig 14 of the same type as the holding jig 14 previously attached to the table base 12 is attached to the table base 12, the same procedure is used for determination. Specifically, the image acquisition unit 60b uses information related to the previously attached holding jig 14 to cause the camera 56 to capture an image of the area including the groove 14c of the holding jig 14 newly attached to the table base 12, thereby acquiring an image showing the groove 14c of the holding jig 14.

[0086] Then, based on the new information including the position of groove 14c determined by the image acquired by image acquisition unit 60b, determination unit 60d determines whether planned dividing line 19 of package substrate (workpiece) 11 held by the holding jig is directly above groove 14c. In this case, it is sufficient to store information related to at least one holding jig 14 in storage unit 60a.

[0087] The present invention is not limited to the above-described embodiments and can be implemented with various modifications. For example, in the cutting apparatus 2 described above, an operator inputs the type of holding jig 14 actually attached to the table base 12 into the touch screen 58. However, the control unit 60 itself can also detect the type of holding jig 14 attached to the table base 12. For example, by using the camera 56 to confirm the position of the groove 14c, which varies depending on the type of holding jig 14, the control unit 60 can determine the type of holding jig 14 without relying on the operator.

[0088] In addition, the structures, methods, and the like of the above-described embodiment and modified examples can be implemented with modifications within the scope not departing from the purpose of the present invention.

Claims

1. A cutting device comprising: a cutting unit having a spindle for mounting a cutting tool; A table base having a plate-shaped holding jig mounted on its upper portion, the holding jig having a groove and a hole, the groove being provided in areas corresponding to a plurality of predetermined dividing lines set on the workpiece and for inserting the cutting tool when the cutting unit cuts the workpiece along the predetermined dividing lines, and the hole being provided in each of the plurality of areas divided by the groove so as to allow negative pressure from the suction source to act; a camera disposed above the table base for photographing the holding jig and the workpiece held by the holding jig to obtain an image; and a determination unit for determining whether the predetermined dividing line of the workpiece held by the holding jig is located directly above the groove; The determination unit has: a storage unit that stores information obtained when the holding jig is designed, wherein the storage unit stores information including the position of the groove of the holding jig at the time of shipment or initial startup; an image acquisition unit that causes the camera to capture an image of a region including the groove of the holding jig mounted on the table base based on the information stored in the storage unit, thereby acquiring an image showing the groove of the holding jig; as well as A determination unit determines whether the planned dividing line of the workpiece held by the holding jig is located right above the groove based on new information including the position of the groove determined by the image acquired by the image acquisition unit.

2. The cutting device according to claim 1, wherein When a holding jig of the same type as the holding jig previously mounted on the workbench base is mounted on the workbench base, the image acquisition unit causes the camera to capture an area including the groove of the holding jig newly mounted on the workbench base based on information related to the previously mounted holding jig, thereby acquiring an image showing the groove of the holding jig. The determination unit determines whether the planned dividing line of the workpiece held by the holding jig is located directly above the groove based on new information including the position of the groove determined by the image acquired by the image acquisition unit.

3. The cutting device according to claim 1, wherein: The storage unit stores information related to a plurality of different holding jigs. When a holding jig of a different type from the holding jig previously mounted on the workbench base is mounted on the workbench base, the image acquisition unit causes the camera to capture an image of a region including the groove of the holding jig newly mounted on the workbench base based on information related to the different type of holding jig, thereby acquiring an image showing the groove of the holding jig. The determination unit determines whether the planned dividing line of the workpiece held by the holding jig is located directly above the groove based on new information including the position of the groove determined by the image acquired by the image acquisition unit.

Images