Antenna preparation method, antenna, and electronic equipment

Abstract

The present invention provides an antenna preparation method and an antenna and electronic device, and specifically relates to the field of antennas. The method includes providing a substrate, the substrate including a first surface and a second surface arranged oppositely; using a PDS process to make a first circuit printing layer on the first surface and using a PDS process to make a second circuit printing layer on the second surface, the first circuit printing layer including a first microstrip line and a signal reflection surface, and the second circuit printing layer including a second microstrip line; providing an LCP film, the LCP film including a third surface and a fourth surface arranged oppositely; coating the third surface with a semi-cured material to form a cured layer, and using a PDS process to make a signal reflection layer on the fourth surface; stacking the cured layer and the second circuit printing layer and performing hot pressing and curing to connect the substrate and the LCP film as a whole to form an antenna board; and opening a through hole on the antenna board to connect the signal reflection surface and the signal reflection layer to complete the antenna preparation. This simplifies the existing antenna manufacturing process and further reduces the antenna production cost.

Description

Technical Field

[0001] The present invention relates to the field of antennas, and in particular to an antenna preparation method, an antenna, and an electronic device. Background Art

[0002] In the traditional antenna preparation process, the preparation of the antenna requires first using a synthetic resin glue (epoxy glue, acrylic glue) specially used for soft boards to press copper foil (aluminum foil) and polyester film together, and then curing at high temperature to form a substrate. Then, a layer of photosensitive film is applied to the metal surface of the substrate by rolling; or a layer of photosensitive wet film is printed on the metal surface of the substrate, and after drying, it is passed through an automatic continuous exposure machine, and the circuit diagram on the film is automatically transferred to the photosensitive film through automatic alignment exposure. The unexposed areas are washed away to reveal the circuit diagram covered by the photosensitive film, and then the exposed metal is etched away with an acid solution. Finally, the photosensitive film protecting the circuit is removed to expose the metal circuit to complete the antenna preparation. However, due to the numerous processes in the existing antenna preparation process and the complex manufacturing process, the production cost of the antenna is increased. Summary of the invention

[0003] In view of this, the present invention provides an antenna manufacturing method, an antenna, and an electronic device to solve the problem of high production cost caused by complex antenna manufacturing process in the prior art.

[0004] According to a first aspect, the present application provides an antenna preparation method, comprising: providing a substrate, the substrate comprising a first surface and a second surface arranged opposite to each other; using a PDS process to produce a first circuit printing layer on the first surface, and using a PDS process to produce a second circuit printing layer on the second surface, the first circuit printing layer comprising a first microstrip line and a signal reflection surface, the second circuit printing layer comprising a second microstrip line, a blind hole is provided between the first microstrip line and the second microstrip line, and the blind hole is used to connect the first microstrip line and the second microstrip line; providing an LCP film, the LCP film comprising a third surface and a fourth surface arranged opposite to each other; coating the third surface with a semi-cured material to form a cured layer, and using a PDS process to produce a signal reflection layer on the fourth surface, the semi-cured material comprising a semi-cured sheet; stacking the cured layer and the second circuit printing layer and performing hot pressing curing to connect the substrate and the LCP film as a whole to form an antenna board; opening a through hole on the antenna board to connect the signal reflection surface and the signal reflection layer to complete the antenna preparation.

[0005] Optionally, preparing the substrate includes the following steps: providing at least one layer of LCP film; and hot-pressing the LCP film to form the substrate.

[0006] Optionally, a first circuit printing layer is produced on the first surface using a PDS process, and a second circuit printing layer is produced on the second surface using a PDS process, prior to which the steps include: cleaning the surface of the substrate using a cleaning agent to obtain a cleaned substrate, wherein the cleaning agent includes at least one of the following: acetone, alcohol, and water; and removing contaminants on the surface of the cleaned substrate using plasma based on the cleaned substrate.

[0007] Optionally, the first circuit printing layer is produced on the first surface using the PDS process, and the second circuit printing layer is produced on the second surface using the PDS process, and further includes: providing a mold platform, placing the substrate on the mold platform, the mold platform including a positioning piece provided on the mold platform, the positioning piece being used to fix the substrate to prevent displacement of the substrate; using the PDS process to perform printing deposition on the substrate provided on the mold platform, removing the positioning piece to obtain a substrate provided with the first circuit printing layer and the second circuit printing layer; placing the substrate provided with the first circuit printing layer and the second circuit printing layer on a baking table for baking and curing to form the first microstrip line, the second microstrip line and the signal reflection surface.

[0008] Optionally, the hot pressing temperature is ≤400°C.

[0009] Optionally, the printing thickness of the first circuit printing layer, the second circuit printing layer and the signal reflection layer is 17um-19um.

[0010] According to a second aspect, the present application provides an antenna, including an antenna prepared according to the antenna preparation method described in the first aspect, wherein the antenna includes: an antenna body and a through hole opened on the antenna body, the antenna body includes a substrate and an LCP film, the substrate and the LCP film are connected as a whole; the substrate includes a first surface and a second surface arranged opposite to each other, and a blind hole for penetrating the first surface and the second surface, the first surface is provided with a first circuit printing layer made using a PDS process, and the second surface is provided with a second circuit printing layer made using a PDS process, the first circuit printing layer includes: a first microstrip line and a signal reflection surface, the second circuit printing layer includes a second microstrip line, the first microstrip line is connected to the second microstrip line through the blind hole; the LCP film includes a third surface and a fourth surface arranged opposite to each other; a solidified layer is provided on the third surface, the solidified layer is used to connect the substrate and the LCP film as a whole, and the fourth surface is provided with a signal reflection layer made using a PDS process; the through hole is used to connect the signal reflection surface of the substrate and the signal reflection layer of the LCP film.

[0011] Optionally, the first microstrip line and the second microstrip line both include connected patches and striplines.

[0012] Optionally, the shape of the patch includes at least one of the following: square, corner-truncated square, circular, and triangular, for example, an equilateral triangle.

[0013] According to a third aspect, the present application provides an electronic device, comprising a control board and the antenna described in the second aspect, wherein the control board is connected to the antenna, the antenna is used to transmit data information, and the control board is used to process the data information transmitted by the antenna.

[0014] The technical solution of the present invention has the following advantages:

[0015] The invention provides an antenna preparation method, which uses a PDS process to produce a first circuit printing layer and a second circuit printing layer on the upper and lower surfaces of a substrate, and sets a curing layer on one side of an LCP film, and uses a PDS process to produce a signal reflection layer on the other side, and then stacks the substrate and the LCP film, that is, the second circuit printing layer and the curing layer are stacked, and then uses a hot pressing curing process to connect the substrate and the LCP film into one, thereby simplifying the existing antenna manufacturing process and further reducing the antenna production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A flow chart of a method for preparing an antenna provided by an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of the structure of an antenna substrate provided by an embodiment of the present invention;

[0019] Figure 3 A flowchart of step S11 of the antenna manufacturing method provided in an embodiment of the present invention;

[0020] Figure 4 A schematic diagram of the structure of an antenna provided in an embodiment of the present invention;

[0021] Figure 5 A schematic diagram of the structure of an optional antenna provided in an embodiment of the present invention;

[0022] Figure 6 A schematic diagram of the structure of an optional antenna provided in an embodiment of the present invention;

[0023] Figure 7 A block diagram of an electronic device provided by an embodiment of the present invention.

[0024] Reference numerals:

[0025] 1-electronic device; 2-antenna; 3-control board; 10-substrate; 11-first microstrip line; 12-signal reflection surface; 13-cured layer; 14-LCP film; 15-signal reflection layer; 16-second microstrip line; 21-microstrip line or strip line. DETAILED DESCRIPTION

[0026] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can also be the internal connection of two components, it can be a wireless connection, or it can be a wired connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0030] It should also be noted that, in the prior art, the complexity of the antenna preparation process causes an increase in the antenna cost. In order to simplify the antenna preparation process to obtain higher antenna performance, so as to adapt to the communication requirements of 5G and UWB (Ultra WideBand), the present application provides an antenna preparation method, an antenna, and an electronic device using the antenna for signal transmission. The antenna preparation method can simplify the antenna preparation process, reduce the overall thickness of the antenna, and at the same time, improve the ability of the finished antenna or the electronic device provided with the antenna to transmit high-frequency signals. In addition, in the embodiment provided in the present application, the antenna is prepared by using the PDS (PBINTI NG Direct Structure) manufacturing process, through which the nano silver paste is transferred to the preset position of the substrate, and then cured to form an antenna. The antenna not only has a high output efficiency, but also uses the PDS process to reduce the antenna production cost.

[0031] Specifically, Figure 1 FIG. 1 is a flow chart of the antenna manufacturing method provided in this embodiment, and the steps of the antenna manufacturing method include:

[0032] S10, providing a substrate, wherein the substrate includes a first surface and a second surface that are oppositely disposed.

[0033] In this embodiment, the substrate is made of LCP (Liquid crystal polymer) material.

[0034] S11, using a PDS process to manufacture a first circuit printing layer on the first surface, and using a PDS process to manufacture a second circuit printing layer on the second surface.

[0035] The first printed circuit layer includes a first microstrip line and a signal reflection surface, and the second printed circuit layer includes a second microstrip line. A blind hole is provided between the first microstrip line and the second microstrip line, and the blind hole is used to connect the first microstrip line and the second microstrip line.

[0036] In this embodiment, the PDS process used is to apply conductive silver paste to the surface of the substrate, and then print the silver paste through multiple layers to form a conductive three-dimensional circuit, namely, the first microstrip line and the second microstrip line.

[0037] S12, providing an LCP film, wherein the LCP film includes a third surface and a fourth surface that are oppositely disposed.

[0038] S13, coating the semi-cured material on the third surface to form a cured layer, and using the PDS process to make a signal reflection layer on the fourth surface.

[0039] In this embodiment, a semi-cured material is coated on the third surface, and the semi-cured material includes a prepreg, wherein the prepreg has the function of resisting silver ion migration. Optionally, the semi-cured material can be a high-frequency functional glue.

[0040] S14, stacking the curing layer and the second circuit printing layer and performing heat pressing and curing, so that the substrate and the LCP film are connected as one, to form an antenna board.

[0041] S15, opening a through hole on the antenna board to connect the signal reflection surface and the signal reflection layer, thereby completing the antenna preparation.

[0042] The antenna preparation method provided in this embodiment uses the PDS process to produce the first circuit printing layer and the second circuit printing layer on the upper and lower surfaces of the substrate, and sets a curing layer on one side of the LCP film, and uses the PDS process to produce a signal reflection layer on the other side, then the substrate and the LCP film are stacked, and the second circuit printing layer and the curing layer are stacked, and then the substrate and the LCP film are connected as a whole using a hot pressing curing process, thereby simplifying the existing antenna manufacturing process and further reducing the antenna production cost.

[0043] In this embodiment, the provided substrate can be a pre-prepared substrate, for example: a substrate formed by high-temperature curing of a synthetic resin. Preferably, the substrate provided in this embodiment is an LCP film, LCP (Liquid crystal polymer). Due to the high-frequency characteristics and physical properties of the LCP material, its excellent dielectric properties, low thermal expansion coefficient, high strength, good flexibility and low moisture absorption rate, the applicant chooses to use LCP material as the substrate material in order to obtain better high-frequency and low-loss data transmission capabilities and improve product reliability and signal integrity. Furthermore, in order to reduce the thickness of the antenna and achieve flexibility in the layout of the antenna.

[0044] In this embodiment, in addition to using LCP material, the antenna also needs to make the LCP material into a film, and press the multi-layer LCP film into a substrate through a high-temperature hot pressing process. The user of the substrate made in this way can adjust the thickness of the substrate according to needs, thereby making the antenna preparation more flexible; after determining the substrate, it is necessary to use a laser to drill the substrate to obtain a through hole connecting the first surface and the second surface, and then fill the hole wall of the drilled substrate with slurry to obtain a blind hole connecting the first circuit printing layer and the second circuit printing layer, and then use the PDS process to print conductive silver paste at a preset position of the substrate, and perform filming, pad printing, and curing to form a metal circuit, i.e., the first circuit printing layer and the second circuit printing layer.

[0045] Optionally, in the process of preparing the antenna, the hot pressing temperature of the hot pressing process used is ≤400°C.

[0046] Optionally, in order to ensure the stability of signal transmission and the quality of the antenna, in the process of preparing the antenna, the printing thickness of the first circuit printing layer, the second circuit printing layer and the signal reflection layer is 17um-19um, preferably, the printing thickness is 18um.

[0047] Optionally, in order to reduce the thickness of the substrate and ensure the hardness of the substrate, e.g. Figure 2 As shown, the substrate 10 may be at least one layer of LCP film 101; the LCP film is hot pressed to form the substrate.

[0048] Optionally, before step S11, the surface of the substrate may be cleaned with a cleaning agent to obtain a cleaned substrate, wherein the cleaning agent includes at least one of acetone, alcohol, and water; and contaminants on the surface of the cleaned substrate are removed by plasma based on the cleaned substrate.

[0049] Optional, such as Figure 3 As shown, manufacturing the first circuit printing layer and the second circuit printing layer may also include the following steps:

[0050] S111, providing a mold platform, placing a substrate on the mold platform, wherein the mold platform includes a positioning member provided on the mold platform, and the positioning member is used to fix the substrate to prevent displacement of the substrate;

[0051] S112, performing printing deposition on the substrate disposed on the mold platform by using a PDS process, removing the positioning piece to obtain a substrate provided with a first circuit printing layer and a second circuit printing layer;

[0052] S113, placing the substrate provided with the first circuit printing layer and the second circuit printing layer on a baking table for baking and curing to form a first microstrip line, a second microstrip line and a signal reflection surface.

[0053] The antenna prepared using the preparation method provided in the above embodiment has a line width and / or line spacing of 20um-40um, and the surface roughness of the first microstrip line, the second microstrip line, the signal reflection layer and the signal reflection surface of the antenna is 20nm-0.4um. The first microstrip line and the second microstrip line both include connected patches and strip lines, wherein the shape of the patch includes at least one of the following: square, corner truncated square, circular, and equilateral triangle.

[0054] In this embodiment, the line width and line spacing are set to ensure the stability of signal transmission and prevent interference between signals. The surface roughness of the signal reflection layer and the signal reflection surface is controlled between 20nm-0.4um, which can ensure the quality of antenna signal transmission to the greatest extent.

[0055] Optionally, the substrate is composed of at least one layer of LCP film. In order to ensure the hardness of the antenna cost, the thickness of the substrate can be thinned by thinning the thickness of the LCP film layer by layer, thereby achieving the goal of reducing the cost of raw materials for antenna preparation while ensuring the quality of signal communication.

[0056] Optionally, the dielectric constant of the antenna is 2.9-3.16, and the expansion coefficient of the antenna is 5ppm / ℃-40ppm / ℃.

[0057] This embodiment provides an antenna such as Figure 4 As shown, the antenna includes: an antenna body and a through hole opened on the antenna body, the antenna body includes a substrate 10 and an LCP film 14, and the substrate and the LCP film 14 are connected as a whole; the substrate 10 includes a first surface and a second surface arranged oppositely, and a blind hole for penetrating the first surface and the second surface, the first surface is provided with a first circuit printing layer made by using a PDS process, and, the second surface is provided with a second circuit printing layer made by using a PDS process, the first circuit printing layer includes: a first microstrip line 11 and a signal reflection surface 12, the second circuit printing layer includes a second microstrip line 16, and the first microstrip line 11 is connected to the second microstrip line 16 through the blind hole; the LCP film 14 includes a third surface and a fourth surface arranged oppositely; a solidified layer 13 is provided on the third surface, and the solidified layer 13 is used to connect the substrate 10 and the LCP film 14 as a whole, and a signal reflection layer 15 made by using a PDS process is provided on the fourth surface; the through hole is used to connect the signal reflection surface 12 of the substrate and the signal reflection layer 15 of the LCP film.

[0058] This embodiment provides an antenna preparation method and antenna. The method aims to solve the problems of multiple process flows, complex production, and high cost in the traditional multi-layer flexible circuit board preparation process, and also solves the problems of increased power consumption and signal transmission loss in circuit board performance. The antenna provided in this embodiment is a multi-layer LCP film antenna, which is prepared using the PDS process. The antenna is prepared by combining Figure 5-6 In this embodiment, the base material used for the substrate is an LCP film, which not only meets the requirements related to high-performance microwave / UWB antennas, but also has the advantage of low cost and can be widely used in various practical scenarios.

[0059] Among them, the preparation method can be to pre-treat the surface of the substrate before the PDS process is used to print and deposit the conductive silver paste on the substrate 10, remove pollutants on the surface of the substrate 10, such as antioxidants, lubricants, release agents, anti-caking agents and its own polymer substrate, and then use acetone, alcohol and water to clean the surface of the substrate respectively. In order to ensure the cleanliness of the surface of the substrate 10, it is necessary to further use plasma for surface treatment. Secondly, the pre-treated substrate is placed on a special mold platform and the microstructure pattern and preset style are printed and deposited using the PDS process to form a microstrip line or strip line 21. Then, the substrate 10 is placed on a baking table for curing to form an electronic circuit. In order to further construct the antenna of the multi-layer board, an LCP film 14 can also be placed on the upper and lower sides of the formed LCP single-layer board antenna, and they are laminated together through high-temperature pressing. The surface and hole wall plug silver paste are formed by drilling, cleaning, and PDS process, and then the metal circuit is formed by film, pad printing, and curing, which are accumulated in sequence to finally form a glue-free LCP multi-layer board antenna. Optionally, in order to ensure stable transmission between signals and meet the requirements of the manufacturing process, the line width and line spacing between the antenna microstrip lines can be between 20μm and 40μm, and to ensure stable data transmission, the surface roughness of the metal layer of the antenna line can be between 20nm and 0.4μm. Due to the micro-roughness of the substrate surface, the antenna transmission signal will be unstable, so it is necessary to increase the number of circuit printing times and increase the curing time to increase the thickness of the silver paste film.

[0060] Optionally, the sheet resistance method can be used to ensure the excellent characteristics of the silver paste thin film resistance of its substrate with good precision and small resistance temperature coefficient. Through the automation of PDS process equipment such as substrate loading, cleaning, printing, thermal balance, curing and cooling, automatic loading and unloading, process sequencing and control of variables such as reactor pressure, gas flow and substrate temperature are provided to obtain product throughput and film quality, thereby improving product quality and reducing production costs through batch processing.

[0061] Optionally, in order to ensure the stability and barrier performance of data transmission of the antenna provided in this embodiment, the dielectric constant of the substrate is ∈r=2.9-3.16, and the dielectric loss tangent is tanδ=0.002-0.004.

[0062] Optionally, substrates of different thicknesses can have LCP substrates with different melting temperatures to achieve different substrate configurations. The antenna provided in this embodiment uses an LCP substrate characterized by ∈r (dielectric constant) = 3.1, tanδ (dielectric loss tangent) = 0.004, a thickness of 203um and a silver paste layer thickness of 18um. The double layers of the substrate are patterned and routed, and the 18um silver paste layer, 51um high melting point (about 315°C) core LCP layer and 102um core LCP layer are stacked from top to bottom with a 50um low melting point (about 290°C) bonding LCP layer and an 18um silver paste GND layer to pattern and measure the pattern, wherein the semi-cured functional material layer is an LCP film, a Low-Dk high-frequency functional glue or a semi-cured functional material with anti-silver ion migration function.

[0063] Optionally, in this embodiment, the microstrip antenna adopts a patch structure and a stripline to form an antenna component, the stripline adopts a conductor backed coplanar waveguide (CBCPW) structure, and the patch can adopt a square, corner truncated square, circular, triangular (for example, equilateral triangle) and other structures. Through antenna technologies such as folded antenna, bent line structure, capacitor loading, short-circuit pin loading, etc., the antenna can achieve good characteristics such as miniaturization, broadband, and lightweight.

[0064] Optionally, in order to solve the problem that the signal width of the coplanar waveguide and the microstrip line of the same impedance is sometimes difficult to match, when designing the antenna of this embodiment, a T-slot structure is introduced at the end of the strip line to adjust the impedance transformation of the strip line, and the different effects of the long side and the short side on different impedances are eliminated to eliminate the influence of feeding and the influence of slight impedance mismatch.

[0065] Optionally, the impedance mismatch phenomenon can be solved by designing a PDS silver paste plugging process between the stripline and the microstrip line through a laser via.

[0066] Optionally, since the substrate is composed of an LCP film, the substrate is easily deformed. In order to ensure that the relatively thin substrate can remain flat and not move during circuit printing, positioning holes need to be provided on the printing table.

[0067] This embodiment also provides an electronic device, such as Figure 7 As shown, the antenna used in the electronic device 1 is manufactured by the antenna preparation method provided in the above embodiment. Specifically, the electronic device 1 includes: a control board 3 and an antenna 2, the control board 3 is connected to the antenna 2, the antenna is used to transmit data information, and the control board is used to process the data information transmitted by the antenna.

[0068] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A method for preparing an antenna, characterized in that: The steps include: Providing at least one layer of LCP film, and hot-pressing the LCP film to form a substrate, wherein the substrate includes a first surface and a second surface disposed opposite to each other; A first circuit printing layer is manufactured on the first surface by using a PDS process, and a second circuit printing layer is manufactured on the second surface by using a PDS process, and a mold platform is provided, the substrate is placed on the mold platform, the mold platform includes a positioning piece provided on the mold platform, and the positioning piece is used to fix the substrate; the substrate provided on the mold platform is printed and deposited by using the PDS process, and the positioning piece is removed to obtain a substrate provided with the first circuit printing layer and the second circuit printing layer; Placing the substrate provided with the first circuit printing layer and the second circuit printing layer on a baking table for baking and curing to form the first microstrip line, the second microstrip line and the signal reflection surface; wherein the first circuit printing layer includes the first microstrip line and the signal reflection surface, the second circuit printing layer includes the second microstrip line, a blind hole is provided between the first microstrip line and the second microstrip line, and the blind hole is used to connect the first microstrip line and the second microstrip line; Providing an LCP film, wherein the LCP film includes a third surface and a fourth surface disposed opposite to each other; Coating a semi-cured material on the third surface to form a cured layer, and using a PDS process to make a signal reflection layer on the fourth surface, wherein the semi-cured material includes a prepreg; The curing layer and the second circuit printing layer are stacked and cured by heat pressing, so that the substrate and the LCP film are connected as one body to form an antenna board; A through hole is opened on the antenna board to connect the signal reflection surface and the signal reflection layer, thereby completing the antenna preparation; The hot pressing temperature is ≤400° C., and the printing thickness of the first circuit printing layer, the second circuit printing layer and the signal reflection layer is 17 um-19 um.

2. The antenna preparation method according to claim 1, characterized in that: The method of using the PDS process to manufacture a first circuit printing layer on the first surface and the method of using the PDS process to manufacture a second circuit printing layer on the second surface comprises: Using a cleaning agent to clean the surface of the substrate to obtain a cleaned substrate, the cleaning agent comprising at least one of the following: acetone, alcohol, and water; Based on the cleaned substrate, plasma is used to remove pollutants on the surface of the cleaned substrate.

3. An antenna, characterized in that: An antenna prepared by the antenna preparation method according to any one of claims 1 to 2, the antenna comprising: an antenna body and a through hole provided on the antenna body, the antenna body comprising a substrate and an LCP film, the substrate and the LCP film being connected as one body; The substrate comprises a first surface and a second surface arranged opposite to each other, and a blind hole for penetrating the first surface and the second surface, the first surface is provided with a first circuit printing layer made by using a PDS process, and the second surface is provided with a second circuit printing layer made by using a PDS process, the first circuit printing layer comprises a first microstrip line and a signal reflection surface, the second circuit printing layer comprises a second microstrip line, and the first microstrip line is connected to the second microstrip line through the blind hole; The LCP film comprises a third surface and a fourth surface arranged opposite to each other; a solidified layer is arranged on the third surface, and the solidified layer is used to connect the substrate and the LCP film as a whole; and a signal reflection layer made by using a PDS process is arranged on the fourth surface; The through hole is used to connect the signal reflection surface of the substrate and the signal reflection layer of the LCP film.

4. The antenna according to claim 3, characterized in that: The first microstrip line and the second microstrip line each include a connected patch and a stripline.

5. The antenna according to claim 4, characterized in that: The shape of the patch includes at least one of the following: square, corner-truncated square, circular, and triangular.

6. An electronic device, characterized in that: include: A control board and an antenna as described in any one of claims 3 to 5, wherein the control board is connected to the antenna, the antenna is used to transmit data information, and the control board is used to process the data information transmitted by the antenna.

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