An electronic tag and preparation method thereof, and a cable with an electronic tag and application thereof

Abstract

The present invention discloses an electronic tag and a preparation method thereof, and a cable with an electronic tag and its application. The electronic tag comprises: a flexible circuit board layer, a chip, a polyamide polymer material layer and an aluminum foil layer; the polyamide polymer material layer is provided with a chip receiving hole corresponding to the position of the chip, the chip is received in the receiving hole, one side of the chip is bonded to the flexible circuit board layer, and the other side of the chip is bonded to the aluminum foil layer; one end of the aluminum foil layer is bent and wrapped around one end of the polyamide polymer material layer, the bent end of the aluminum foil is in the same plane as the flexible circuit board layer, and there is a gap of a preset width between the bent end of the aluminum foil and the end of the flexible circuit board layer. The present invention solves the problem of poor signal stability of electronic tags in the prior art.

Description

Technical Field

[0001] The invention relates to an electronic tag and a preparation method thereof, and a cable with the electronic tag and applications thereof. Background Art

[0002] Cables are usually made of several or several groups of wires (at least two wires in each group) twisted together like ropes. Each group of wires is insulated from each other and often twisted around a center. The entire outer layer is covered with a highly insulating coating. The cable has the characteristics of being powered inside and insulated outside. Due to the variety of specifications and functions of cables, manufacturers need to mark the cables to facilitate buyers and users to understand the relevant performance and parameters of the product in advance. Cables in the prior art are usually marked by inkjet coding. Summary of the invention

[0003] In view of the technical defects and technical drawbacks in the prior art, the embodiments of the present invention provide an electronic tag and a preparation method thereof, and a cable with an electronic tag and applications thereof.

[0004] As one aspect of an embodiment of the present invention, it relates to an electronic tag, comprising: a flexible circuit board layer, a chip, a polyamide polymer material layer and an aluminum foil layer;

[0005] The polyamide polymer material layer is respectively bonded to the flexible circuit board layer and the aluminum foil layer;

[0006] The polyamide polymer material layer is provided with a chip receiving hole at a position corresponding to the chip, the chip is received in the receiving hole, one side of the chip is attached to the flexible circuit board layer, and the other side of the chip is attached to the aluminum foil layer;

[0007] One end of the aluminum foil layer is bent and wraps one end of the polyamide polymer material layer. The bent end of the aluminum foil is in the same plane as the flexible circuit board layer, and there is a gap of a preset width between the bent end of the aluminum foil and the end of the flexible circuit board layer.

[0008] In one or some optional embodiments, in the electronic tag, the width of the gap between the bent end of the aluminum foil and the end of the flexible circuit board layer is 0.03 mm to 0.1 mm.

[0009] In one or some optional embodiments, in the electronic tag, the polyamide polymer material layer has a high temperature resistance greater than 200°C, a twisting resistance greater than 30 degrees, a bending resistance greater than 30 degrees, and a load-bearing capacity greater than 50KG.

[0010] In one or some optional embodiments, in the electronic tag, the thickness of the aluminum foil is 0.03 mm to 0.1 mm.

[0011] In one or some optional embodiments, the electronic tag further includes: a thermoplastic polyester layer; and the flexible circuit board layer is bonded to the thermoplastic polyester layer away from the chip.

[0012] In one or some optional embodiments, in the electronic tag, the thermoplastic polyester layer is provided with an identity mark of the electronic tag.

[0013] In one or some optional embodiments, the electronic tag further comprises a release film, and a side of the aluminum foil away from the chip is attached to the release film.

[0014] In one or some optional embodiments, in the electronic tag, the thermoplastic polyester layer, the flexible circuit board layer, the polyamide polymer material layer and the aluminum foil are respectively bonded by adhesives.

[0015] In one or some optional embodiments, in the electronic tag, the adhesive has a high temperature resistance greater than 200°C.

[0016] As another aspect of an embodiment of the present invention, it relates to a method for preparing the above-mentioned electronic tag, comprising:

[0017] Die-cutting the polyamide polymer material layer to obtain a chip receiving hole;

[0018] Laminating the flexible circuit board layer after laminating the chip with the polyamide polymer material layer, and accommodating the chip in the chip accommodating hole;

[0019] The aluminum foil is attached to the polyamide polymer material layer, and one end of the aluminum foil is bent until the end of the polyamide polymer material layer is attached to the aluminum foil, and the bent end of the aluminum foil is in the same plane as the polyamide polymer material layer, and there is a gap of a preset width between the end of the flexible circuit board layer and the aluminum foil.

[0020] In one or some optional embodiments, the method for preparing the electronic tag further includes: laminating a side of the flexible circuit board layer away from the chip to a thermoplastic polyester layer.

[0021] In one or some optional embodiments, the method for preparing the electronic tag, before laminating the flexible circuit board layer after laminating the chip with the polyamide polymer material layer, further comprises:

[0022] Attaching glue to the flexible circuit board layer after bonding the chip; and,

[0023] The polyamide polymer material layer is subjected to adhesive bonding.

[0024] In one or some optional embodiments, the method for preparing the electronic tag, before attaching the aluminum foil to the polyamide polymer material layer, further comprises:

[0025] Attaching glue to the aluminum foil; and,

[0026] The aluminum foil is bonded to the release film.

[0027] In one or some optional embodiments, the method for preparing the electronic label further includes: die-cutting the bonded electronic label.

[0028] As a third aspect of an embodiment of the present invention, it relates to a cable with an electronic tag, on which a plurality of the above-mentioned electronic tags are arranged at preset intervals.

[0029] In one or some optional embodiments, the electronic tag is arranged between the outer sheath of the cable and the armor layer of the cable.

[0030] As a fourth aspect of the embodiments of the present invention, it relates to an application of the above-mentioned electronic tag in a cable.

[0031] The embodiments of the present invention achieve at least the following technical effects:

[0032] The electronic tag provided by the embodiment of the present invention adopts a multi-layer structure of aluminum foil with an end of a bending structure, and a gap of preset width is set between the bent end of the aluminum foil and the end of the flexible circuit board. Due to the metal properties of the aluminum foil, a coupling magnetic field is generated between the aluminum foil and the flexible circuit board through the gap, and the signal frequency deviation is compensated by coupling. The signal frequency of the electronic tag is more stable. Compared with the electronic tags in the prior art, the signal sensitivity and signal stability of the electronic tag are enhanced, and the transmission capacity of the electronic tag is also more stable; and the various layers of the electronic tag are made of flexible materials, so that the electronic tag has good anti-bending performance and high tensile strength, so that it can be better suitable for application scenarios of cable identification.

[0033] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structure described in the written description, claims, and drawings.

[0034] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0036] Figure 1 A schematic diagram of the structure of an electronic tag provided by an embodiment of the present invention;

[0037] Figure 2 A schematic flow chart of a method for preparing an electronic tag provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0038] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0039] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0040] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] The inventor of the present invention has found that the electronic tags in the prior art usually directly adopt a simple layered structure. When in use, the signal of the electronic tag is deviated (the signal deviation range is about 2 MHz). This signal frequency deviation directly affects the signal stability and transmission capacity of the electronic tag. In addition, the electronic tags in the prior art have poor anti-bending ability. Since the material of the dielectric layer in the prior art is prone to bending and deformation, patterns and cracks are prone to appear on the surface of the dielectric layer, causing the signal frequency of the electronic tag to drift, affecting the signal stability of the electronic tag. Therefore, the labels in the prior art cannot be well applied as cable labels. In order to at least partially solve the technical problems existing in the prior art, the inventor has made the present invention, and provides a cable labeling machine and a cable labeling method, a cable manufacturing system and a cable manufacturing method through specific implementation methods.

[0043] Example 1

[0044] Reference Figure 1 As shown, an embodiment of the present invention provides an electronic tag, comprising: a flexible circuit board layer 1, a chip 2, a polyamide polymer material layer 3 and an aluminum foil layer 4;

[0045] The polyamide polymer material layer 3 is respectively attached to the flexible circuit board layer 1 and the aluminum foil layer 4;

[0046] The polyamide polymer material layer 3 is provided with a chip receiving hole at a position corresponding to the chip 2, the chip 2 is received in the receiving hole, one side of the chip 2 is attached to the flexible circuit board layer 1, and the other side is attached to the aluminum foil layer 4;

[0047] One end of the aluminum foil layer 4 is bent and wrapped around one end of the polyamide polymer material layer 3 . The bent end of the aluminum foil is in the same plane as the flexible circuit board layer 1 , and there is a gap of a preset width between the bent end of the aluminum foil and the end of the flexible circuit board layer 1 .

[0048] The electronic tag provided by the embodiment of the present invention adopts a multi-layer structure of aluminum foil with an end of a bending structure, and a gap of preset width is set between the bent end of the aluminum foil and the end of the flexible circuit board. Due to the metal properties of the aluminum foil, a coupling magnetic field is generated between the aluminum foil and the flexible circuit board through the gap, and the signal frequency deviation is compensated by coupling. The signal frequency of the electronic tag is more stable. Compared with the electronic tags in the prior art, the signal sensitivity and signal stability of the electronic tag are enhanced, and the transmission capacity of the electronic tag is also more stable; and the various layers of the electronic tag are made of flexible materials, so that the electronic tag has good anti-bending performance and high tensile strength, so that it can be better suitable for application scenarios of cable identification.

[0049] In one embodiment, in the electronic tag, the width of the gap between the bent end of the aluminum foil layer 4 and the end of the flexible circuit board layer 1 may be 0.03 mm to 0.1 mm.

[0050] In the embodiment of the present invention, if the width of the gap between the aluminum foil layer 4 and the flexible circuit board layer 1 is too small, the production requirements cannot be met, the production process requirements are higher, the production cost is increased, and the coupling effect between the aluminum foil layer 4 and the flexible circuit board layer 1 cannot be achieved. The inventor of the present invention has concluded through experiments that setting the width of the above-mentioned gap between 0.03mm and 0.1mm can better achieve the coupling effect between the aluminum foil layer 4 and the flexible circuit board layer 1 and achieve the stability of the electronic tag signal frequency.

[0051] In one embodiment, the polyamide polymer material layer 3 in the electronic tag has a high temperature resistance greater than 200° C., a twisting resistance greater than 30 degrees, a bending resistance greater than 30 degrees, and a load-bearing capacity greater than 50 kg.

[0052] In the embodiment of the present invention, a polyamide polymer material layer is used to replace the dielectric layer of the electronic tag in the prior art. Since the polyamide polymer material is a material with a polyamide polymer compound as the main component, the polyamide polymer compound may include polyimide. Polyimide is an engineering material that has been widely used in the fields of aviation, electronics, nano, separation membranes, lasers, etc., and is outstanding in performance and synthesis. Since the electronic tag of the present invention can be used for the identification of armored cables, the inventor of the present invention selects the polyamide polymer material layer according to the production situation and use environment of the armored cable, wherein the polyamide polymer material needs to be synthesized by modulation in a certain proportion, and it has excellent physical and mechanical properties, such as high temperature resistance, high toughness, high tensile strength, low linear expansion coefficient, adjustable elastic modulus, extremely small thermal shrinkage and flame retardancy, good self-lubrication and strong radiation resistance, and excellent electrical properties and chemical stability. For the composited electronic tag, it can withstand greater external pressure, the signal frequency of the electronic tag is not easy to change, and the material is resistant to high temperature >200℃. The use of this material has a lower dielectric constant and will not affect the performance and consistency of the electronic tag. At the same time, due to the excellent electrical properties and chemical stability of the material, the service life and stability of the electronic tag are further guaranteed.

[0053] In one embodiment, the thickness of the aluminum foil layer 4 in the electronic tag is 0.03 mm to 0.1 mm.

[0054] In the embodiment of the present invention, the aluminum foil layer 4 is used as an anti-metal label layer, which is mainly used to isolate the electronic tag from the environment behind it and improve the sensitivity of the electronic tag, so as to ensure the consistency of the performance of the electronic tag. If the thickness of the aluminum foil layer 4 is too large, it will affect the performance of the electronic tag. If the thickness of the aluminum foil layer 4 is too thin, the aluminum foil is prone to wrinkles when bent or twisted, and the electronic tag may have a signal frequency drift, which will also affect the signal performance of the electronic tag. Based on this, the inventor of the present invention has found through experiments that setting the thickness of the aluminum foil layer 4 to between 0.03mm and 0.1mm can not only ensure the signal performance of the electronic tag, but also prevent the aluminum foil from wrinkling during the use of the electronic tag, thereby affecting the performance of the electronic tag.

[0055] In one embodiment, referring to Figure 1 As shown, the electronic tag may also include: a thermoplastic polyester layer 5;

[0056] A side of the flexible circuit board layer 1 away from the chip 2 is bonded to the thermoplastic polyester layer 5 .

[0057] In a specific embodiment, the thermoplastic polyester layer 5 is provided with an electronic tag identification mark. For example, the electronic tag manufacturer identification mark and the electronic tag identification (ID) information may be printed on the side of the thermoplastic polyester layer 5 away from the chip 2 .

[0058] In one embodiment, referring to Figure 1 As shown, the electronic tag may further include a release film 6 , and a side of the aluminum foil away from the chip 2 is attached to the release film 6 .

[0059] The electronic tag provided in the embodiment of the present invention is rolled up by the release film 6 before being attached to the area to be marked, so that the electronic tag can be easily stored and transported, and multiple electronic tags attached to the release film 6 can also be easily rolled up to form a roll.

[0060] In one embodiment, referring to Figure 1 As shown, in the electronic tag, the thermoplastic polyester layer 5, the flexible circuit board layer 1, the polyamide polymer material layer 3 and the aluminum foil are respectively bonded by adhesive 7.

[0061] In a specific embodiment, the adhesive 7 has a high temperature resistance greater than 200°C.

[0062] In the embodiment of the present invention, the multi-layer structure of the electronic tag is bonded together by a high temperature resistant adhesive 7, so that the electronic tag can be better adapted to a high temperature environment during use, thereby improving the temperature tolerance of the electronic tag.

[0063] In one embodiment, the chip 2 in the electronic tag includes a temperature sensor module and an RFID module. Since the cable itself in the prior art cannot detect temperature, a special temperature measuring tool is required to read the temperature of the cable outer sheath during the use of the cable. In the embodiment of the present invention, by integrating the temperature sensor module in the chip 2, the automatic temperature measurement of the cable can be realized, and the use temperature of the cable can be easily obtained through the label reader, making the electronic tag more suitable for the application scenario of cable identification.

[0064] Example 2

[0065] Based on the same inventive concept, Figure 2 As shown, the embodiment of the present invention also provides a method for preparing an electronic tag, which includes:

[0066] S101: die-cutting the polyamide polymer material layer 3 to obtain a chip receiving hole;

[0067] S102: Laminating the flexible circuit board layer 1 after laminating the chip 2 with the polyamide polymer material layer 3, and accommodating the chip 2 in the chip accommodating hole;

[0068] S103: attaching the aluminum foil to the polyamide polymer material layer 3, and bending one end of the aluminum foil until the end of the polyamide polymer material layer 3 is attached to the aluminum foil, and the bent end of the aluminum foil is in the same plane as the flexible circuit board layer 1, and there is a gap of a preset width between the bent end of the aluminum foil and the end of the flexible circuit board layer 1.

[0069] The method for preparing the above-mentioned electronic tag provided in the embodiment of the present invention can obtain the electronic tag described in the above-mentioned embodiment 1. The principle of solving the problem by this method is similar to that of the above-mentioned electronic tag. Therefore, the implementation of this method can refer to the specific implementation method of the electronic tag in the above-mentioned embodiment 1, and the repeated parts will not be repeated.

[0070] In the preparation method of the electronic tag provided in the embodiment of the present invention, the flexible circuit board layer 1 and the polyamide polymer material layer 3 are first compounded, and the chip 2 on the flexible circuit board is aligned with the hole for accommodating the chip 2 in the polyamide polymer material layer 3, which is helpful to ensure the correct installation position of the chip 2 and prevent the chip 2 from being misplaced, causing the chip 2 to be crushed or damaged during the production process.

[0071] In the preparation method of the electronic tag provided by the embodiment of the present invention, when the aluminum foil and the polyamide polymer material layer 3 are compounded, a preset length is reserved at one end of the aluminum foil layer 4. In the actual preparation process, the reserved portion of the aluminum foil layer 4 can be bent by bending. In the bending process, since the production line length of the bending equipment is long enough, the reserved portion of the aluminum foil layer 4 can be bent continuously little by little in the bending equipment, so that the bent portion can be attached to the end of the polyamide polymer material layer 3, and the bent plane portion can be in the same plane with the flexible circuit board layer 1, and there is a gap of preset width between the end of the aluminum foil and the end of the flexible circuit board layer 1.

[0072] In one embodiment, the method for preparing the electronic tag may further include: laminating a side of the flexible circuit board layer 1 away from the chip 2 to a thermoplastic polyester layer 5 .

[0073] In the embodiment of the present invention, the implementation method of bonding the flexible circuit board layer 1 and the thermoplastic polyester layer 5 after bonding the chip 2 can refer to the specific implementation method in the prior art, and is not specifically limited in the embodiment of the present invention.

[0074] In one embodiment, in the method for preparing the electronic tag, before laminating the flexible circuit board layer 1 after laminating the chip 2 with the polyamide polymer material layer 3, the following steps may also be included:

[0075] Attaching glue to the flexible circuit board layer 1 after bonding the chip 2; and,

[0076] The polyamide polymer material layer 3 is coated with glue.

[0077] In the embodiment of the present invention, the implementation method of attaching glue to the flexible circuit board layer 1 and the polyamide polymer material layer 3 after the chip 2 is bonded can refer to the specific implementation method in the prior art, and is not specifically limited in the embodiment of the present invention.

[0078] In one embodiment, the method for preparing the electronic tag may further include, before laminating the aluminum foil to the polyamide polymer material layer 3:

[0079] Attaching glue to the aluminum foil; and,

[0080] The aluminum foil is bonded to the release film 6 .

[0081] In the embodiment of the present invention, the implementation method of attaching glue to the aluminum foil and bonding the aluminum foil and the release film 6 can refer to the specific implementation method in the prior art, and is not specifically limited in the embodiment of the present invention.

[0082] In one embodiment, the method for preparing the electronic label may further include: die-cutting the bonded electronic label.

[0083] In the embodiment of the present invention, the implementation method of die-cutting the electronic label can refer to the specific implementation method of die-cutting the electronic label in the prior art, and is not specifically limited in the embodiment of the present invention.

[0084] Example 3

[0085] Based on the same inventive concept, an embodiment of the present invention further provides a cable with an electronic tag, on which a plurality of electronic tags according to Embodiment 1 are arranged at preset intervals.

[0086] The principle of solving the problem by the cable with electronic tag provided in the embodiment of the present invention is similar to that of the aforementioned electronic tag, so the implementation of the method can refer to the specific implementation method of the electronic tag in the aforementioned embodiment 1, and the repeated parts will not be repeated.

[0087] In one embodiment, the electronic tag is disposed between the armor layer of the cable and the outer sheath of the cable.

[0088] In the embodiment of the present invention, the armor layer of the cable may refer to the galvanized steel tape layer of the armored cable, and of course it may also be other armored protective layers. Those skilled in the art may select it according to actual production needs, and in the embodiment of the present invention, no specific limitation is made to this; the material of the outer sheath of the cable may be polyvinyl chloride or halogen-free low-smoke polyolefins and other materials. Of course, those skilled in the art may select the outer sheath of suitable materials according to actual production needs, and in the embodiment of the present invention, no specific limitation is made to this.

[0089] In the embodiment of the present invention, electronic tags are set at preset intervals to achieve fixed-length installation of tags, and the cable length can be measured by reading the electronic tags. Moreover, since the chip 2 of the electronic tag can be integrated with a temperature sensor, the cable temperature can also be measured. In the embodiment of the present invention, when labeling the electronic tags, it can be done in a cable labeling machine, and each electronic tag can be attached to the same position of the cable by the cable labeling machine, so as to facilitate the reading of the electronic tags.

[0090] Example 4

[0091] Based on the same inventive concept, an embodiment of the present invention further provides an application of the electronic tag described in the above embodiment 1 in a cable.

[0092] The principle of solving the problem by the cable with electronic tag provided in the embodiment of the present invention is similar to that of the aforementioned electronic tag, so the implementation of the method can refer to the specific implementation method of the electronic tag in the aforementioned embodiment 1, and the repeated parts will not be repeated.

[0093] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0094] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electronic tag, characterized in that: include: Flexible circuit board layer, chip, polyamide polymer material layer and aluminum foil layer; The polyamide polymer material layer is respectively bonded to the flexible circuit board layer and the aluminum foil layer; The polyamide polymer material layer is provided with a chip receiving hole at a position corresponding to the chip, the chip is received in the receiving hole, one side of the chip is attached to the flexible circuit board layer, and the other side of the chip is attached to the aluminum foil layer; One end of the aluminum foil layer is bent and wrapped around one end of the polyamide polymer material layer, the bent end of the aluminum foil is in the same plane as the flexible circuit board layer, and there is a gap of a preset width between the bent end of the aluminum foil and the end of the flexible circuit board layer; The width of the gap between the bent end of the aluminum foil and the end of the flexible circuit board layer is 0.03 mm to 0.1 mm; The polyamide polymer material layer has a high temperature resistance greater than 200°C, a distortion resistance greater than 30°C, a bending resistance greater than 30°C, and a load-bearing capacity greater than 50KG; The thickness of the aluminum foil is 0.03 mm to 0.1 mm.

2. The electronic tag according to claim 1, characterized in that: Also includes: Thermoplastic polyester layer; the side of the flexible circuit board layer away from the chip is bonded to the thermoplastic polyester layer.

3. The electronic tag according to claim 2, characterized in that: The thermoplastic polyester layer is provided with an identity mark of an electronic tag.

4. The electronic tag according to claim 3, characterized in that: A release film is also included, and a side of the aluminum foil away from the chip is attached to the release film.

5. The electronic tag according to claim 4, characterized in that: The thermoplastic polyester layer, the flexible circuit board layer, the polyamide polymer material layer and the aluminum foil are respectively bonded together by adhesive.

6. The electronic tag according to claim 5, characterized in that: The adhesive has a high temperature resistance of greater than 200°C.

7. A method for preparing an electronic tag according to any one of claims 1 to 6, characterized in that: include: Die-cutting the polyamide polymer material layer to obtain a chip receiving hole; Laminating the flexible circuit board layer after laminating the chip with the polyamide polymer material layer, and accommodating the chip in the chip accommodating hole; Laminating an aluminum foil to the polyamide polymer material layer, and bending one end of the aluminum foil until the end of the polyamide polymer material layer is laminated to the aluminum foil, and the bent end of the aluminum foil is in the same plane as the flexible circuit board layer, and there is a gap of a preset width between the bent end of the aluminum foil and the end of the flexible circuit board layer; The width of the gap between the bent end of the aluminum foil and the end of the flexible circuit board layer is 0.03 mm to 0.1 mm; The polyamide polymer material layer has a high temperature resistance greater than 200°C, a distortion resistance greater than 30°C, a bending resistance greater than 30°C, and a load-bearing capacity greater than 50KG; The thickness of the aluminum foil is 0.03 mm to 0.1 mm.

8. The method for preparing an electronic tag according to claim 7, characterized in that: Also includes: The side of the flexible circuit board layer away from the chip is laminated to the thermoplastic polyester layer.

9. The method for preparing an electronic tag according to claim 7, characterized in that: Before laminating the flexible circuit board layer after laminating the chip with the polyamide polymer material layer, the method further comprises: Attaching glue to the flexible circuit board layer after bonding the chip; and, The polyamide polymer material layer is subjected to adhesive bonding.

10. The method for preparing an electronic tag according to claim 7, characterized in that: Before laminating the aluminum foil to the polyamide polymer material layer, the method further comprises: Attaching glue to the aluminum foil; and, The aluminum foil is bonded to the release film.

11. The method for preparing an electronic tag according to claim 7, characterized in that: Also includes: The bonded electronic labels are die-cut.

12. A cable with an electronic label, characterized in that: A plurality of electronic tags according to any one of claims 1 to 6 are arranged on the cable at preset intervals.

13. The cable according to claim 12, characterized in that The electronic tag is arranged between the outer sheath of the cable and the armor layer of the cable.

14. Use of the electronic tag according to any one of claims 1 to 6 in a cable.

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