Vapor Chamber and Electronic Devices

Abstract

The embodiment of the present application discloses a temperature averaging plate and an electronic device, the temperature averaging plate comprises: a first cover plate close to a heat source, and a second cover plate far from the heat source, the first cover plate and the second cover plate are arranged to form a cavity, the cavity is divided into at least a first cavity and a second cavity, wherein the cross-sectional dimensions of the first cavity and the second cavity are different, a first liquid absorbent core is arranged in the first cavity, one end of the first liquid absorbent core is connected to the first cover plate, and the other end is connected to the second cover plate; a second liquid absorbent core is arranged in the second cavity, and the second liquid absorbent core is parallel to the first cover plate; wherein the first liquid absorbent core and the second liquid absorbent core are connected, and the first cavity and the second cavity are connected. The temperature averaging plate combining serial structure and parallel structure can support irregular structure, so that the internal structure of the liquid absorbent core can be flexibly adjusted according to the shape of the product heat source, thereby improving the temperature averaging performance of the temperature averaging plate.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of electronic equipment, and in particular to a temperature homogenizing plate and electronic equipment. Background Art

[0002] Electronic products such as mobile phones, tablets, notebooks, etc., generate heat when working. If this heat is not dissipated in time, it will accumulate inside the electronic products, causing the temperature of the electronic products to rise, thus affecting the performance and user experience of the electronic products. In severe cases, it will cause the electronic products to malfunction and be damaged. Therefore, the industry has been continuously developing various heat dissipation solutions for electronic products to solve the heat dissipation problem of electronic products.

[0003] At present, Vapor Chamber (VC) is used for heat dissipation in electronic products. Vapor Chamber is a vacuum chamber with a microstructured inner wall and a working medium (i.e., working medium). Figure 1 As shown, it includes: a first cover plate 101, a liquid absorbent core 104 and a second cover plate 102, wherein the second liquid absorbent core 104 is parallel to the first cover plate 101, and the second liquid absorbent core 104 covers the first cover plate 101, and the cavity between the second liquid absorbent core 104 and the second cover plate 102 is a steam cavity, and the second liquid absorbent core 104 and the steam cavity are a serial structure.

[0004] However, the temperature homogenizing plate usually needs to be provided with a supporting structure between the liquid wick and the second cover plate, which makes the product thicker. As the thickness continues to decrease, the production cost will become increasingly higher, and there will be bottlenecks in thermal performance. Summary of the invention

[0005] The embodiments of the present application provide a temperature vapor chamber and an electronic device, which solve the problems of high cost and single structure of the temperature vapor chamber.

[0006] To achieve the above-mentioned purpose, the present application adopts the following technical scheme: In the first aspect of the present application, a temperature equalizing plate is provided, including: a first cover plate close to a heat source, and a second cover plate far away from the heat source, the first cover plate and the second cover plate are arranged to form a cavity, the cavity is divided into at least a first cavity and a second cavity, the cross-sectional dimensions of the first cavity and the second cavity are different, a first liquid absorbent core is arranged in the first cavity, one end of the first liquid absorbent core is connected to the first cover plate, and the other end is connected to the second cover plate; a second liquid absorbent core is arranged in the second cavity, and the second liquid absorbent core is parallel to the first cover plate; wherein, the first liquid absorbent core and the second liquid absorbent core are connected, and the first cavity and the second cavity are communicated. Therefore, the temperature equalizing plate can be divided into at least two parts, the liquid wick of one part of the temperature equalizing plate adopts a serial structure, and the liquid wick of another part of the temperature equalizing plate adopts a parallel structure; the embodiment of the present application adopts a temperature equalizing plate that combines a serial structure and a parallel structure, which can support irregular structures, so that the internal structure of the liquid wick can be flexibly adjusted according to the shape of the product heat source, thereby improving the temperature equalization performance of the temperature equalizing plate, and the cross-sectional height of the temperature equalizing plate with a parallel structure is lower, which is conducive to product miniaturization.

[0007] In an optional implementation, the cross-sectional heights of the first cavity and the second cavity are different, so that the cross-sectional height of the portion of the temperature vaporizer close to the heat source can be increased to improve the temperature equalization performance of the temperature vaporizer close to the heat source.

[0008] In an optional implementation, the cross-sectional widths of the first cavity and the second cavity are different, so that the cross-sectional width of the portion of the temperature vaporizer close to the heat source can be increased to improve the temperature equalization performance of the temperature vaporizer close to the heat source.

[0009] In an optional implementation, the first liquid wick is multiple and the multiple first liquid wicks are arranged in parallel. Thus, the first liquid wick can divide the first cavity into multiple steam cavities, and the first liquid wick and the steam cavity are in parallel structure, which improves the heat transfer performance of the temperature averaging plate. At the same time, since no support column is required, the cross-sectional height of the temperature averaging plate is reduced.

[0010] In an optional implementation, the second absorbent core is one, and the second absorbent core covers the first cover plate. Thus, the cavity between the second absorbent core and the second cover plate is a steam cavity, the second absorbent core and the steam cavity are a serial structure, and the second absorbent core is one, which can be made into an irregular shape, and has better adaptability.

[0011] In an optional implementation, a support column is further provided between the second cover plate and the second liquid absorbent core, and the support column is used to support the second cover plate, thereby improving the stability of the temperature equalizing plate.

[0012] In an optional implementation, the support column and the second cover plate are integrally formed, thereby making the connection between the support column and the second cover plate more stable.

[0013] In an optional implementation, the support column is a protrusion disposed on the second liquid absorbent core, and the support column and the second liquid absorbent core are integrally formed. Thus, the support column can not only be used to support the second cover plate, but also can serve as a liquid absorbent core, the connection between the support column and the second liquid absorbent core is more stable, and when the support column adopts the same structure as the liquid absorbent core, the heat transfer performance of the temperature equalizing plate can be improved.

[0014] In an optional implementation, the cross section of the support column is circular, rectangular or irregular in shape. Thus, the support column can be made into a variety of shapes.

[0015] In an optional implementation, a third liquid wick is further provided in the second cavity, and the third liquid wick is connected to the first liquid wick, thereby further improving the heat dissipation performance of the temperature distribution plate.

[0016] In an optional implementation, the third liquid absorbent core is made of the same material as the first liquid absorbent core and the second liquid absorbent core, thereby improving product consistency and simplifying the process.

[0017] In an optional implementation, the first liquid absorbent core and the second liquid absorbent core are made of copper, titanium, alloy, non-metal or composite material. Thus, the first liquid absorbent core and the second liquid absorbent core have many material choices and low process difficulty.

[0018] In an optional implementation, the first absorbent core and the second absorbent core adopt a capillary structure, and the capillary structure is formed by at least one of the following methods: weaving, sintering, and etching. Therefore, the molding process of the first absorbent core and the second absorbent core is flexible, and the most suitable process can be selected.

[0019] In an optional implementation, the cross-sectional shape of the first cavity is a rectangle. Thus, the first cavity adopts a regular shape with a uniform cross-sectional width, so that the first wicks can be evenly arranged at equal distances, thereby avoiding the condensation area being unable to reflux when the pressure difference between the first cavity and the outside is large, or the steam cavity being blocked and the steam being unable to reflux, resulting in a significant decline in thermal performance.

[0020] In an optional implementation, the cross-sectional shape of the second cavity is a regular polygon, a circle or an irregular shape. Thus, the second cavity can be in an irregular shape to meet the heat dissipation requirements of an irregularly shaped heat source.

[0021] In an optional implementation, the first cover plate and the second cover plate are made of metal, non-metal, or multi-layer composite material. Thus, the material selection of the first cover plate and the second cover plate is more flexible and suitable for different products.

[0022] In an optional implementation, the cavity is further divided into: a third cavity, a third liquid absorbent core is arranged in the third cavity, one end of the third liquid absorbent core is connected to the first cover plate, and the other end is connected to the second cover plate; or, the third liquid absorbent core is parallel to the first cover plate; wherein the third liquid absorbent core is connected to the first liquid absorbent core and the second liquid absorbent core, and the third cavity is connected to the first cavity and the second cavity. Thus, the structure of the temperature equalization plate is more flexible, so that the internal structure of the liquid absorbent core can be flexibly adjusted according to the shape of the product heat source, thereby improving the temperature equalization performance of the temperature equalization plate.

[0023] In a second aspect of the present application, an electronic device is provided, comprising a heat source and a temperature averaging plate as described above, wherein the temperature averaging plate and the heat source are heat-conductive. Thus, the temperature averaging plate adopts the above structure, has better heat averaging performance, has a low cross-sectional height, and can be made into an irregular shape, and can be used to dissipate heat from an irregular heat source.

[0024] In an optional implementation, the electronic device further comprises a housing, and the temperature averaging plate is heat-conductive with the housing, so that the temperature averaging plate can be attached to the housing to improve the heat averaging performance of the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of a temperature equalizing plate;

[0026] Figure 2 A schematic diagram of the structure of a temperature homogenizing plate provided in an embodiment of the present application;

[0027] Figure 2a for Figure 2 MM cross-sectional view of the middle temperature plate;

[0028] Figure 3 A schematic diagram of the structure of another temperature homogenizing plate provided in an embodiment of the present application;

[0029] Figure 3a for Figure 3 AA cross-sectional view of the middle temperature plate;

[0030] Figure 3b for Figure 3 BB cross-section view of the middle temperature plate;

[0031] Figure 3c for Figure 3 CC cross-sectional view of the middle temperature plate;

[0032] Figure 3d for Figure 3 DD cross-sectional view of the middle temperature plate;

[0033] Figure 4 A schematic diagram of the structure of another temperature homogenizing plate provided in an embodiment of the present application;

[0034] Figure 4a A schematic diagram of the structure of another temperature homogenizing plate provided in an embodiment of the present application;

[0035] Figure 4b A schematic diagram of the structure of another temperature homogenizing plate provided in an embodiment of the present application;

[0036] Figure 4c A schematic diagram of the structure of another temperature homogenizing plate provided in an embodiment of the present application;

[0037] Figure 5 A schematic diagram of the structure of another temperature homogenizing plate provided in an embodiment of the present application;

[0038] Figure 6 A schematic diagram of the structure of another temperature homogenizing plate provided in an embodiment of the present application;

[0039] Figure 6a for Figure 6 AA cross-sectional view of the middle temperature plate;

[0040] Figure 6b for Figure 6 BB cross-section view of the middle temperature plate;

[0041] Figure 7 A schematic diagram of the structure of another temperature homogenizing plate provided in an embodiment of the present application;

[0042] Figure 8 A schematic diagram of the structure of another temperature equalizing plate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0043] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0044] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0045] In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the changes in the orientation of the components in the drawings.

[0046] Vapor Chamber (VC): Also known as a vapor chamber, it is a vacuum chamber with a microstructure on the inner wall and injected with a working fluid. The working principle of the vapor chamber is roughly the same as that of a heat pipe, which specifically includes four main steps: conduction, evaporation, convection, and condensation. When the heat generated by the heat source enters the vapor chamber through heat conduction, the working fluid near the heat source in the vapor chamber will quickly vaporize after absorbing the heat, and take away a large amount of heat at the same time. Reusing the latent heat of steam, when the steam in the vapor chamber diffuses from the high-pressure area to the low-pressure area (i.e., the low-temperature area), when the steam contacts the inner wall with a lower temperature, it will quickly condense into a liquid and release heat energy; the working fluid condensed into a liquid returns to the heat source through the capillary force of the microstructure (capillary structure), thereby completing a heat conduction cycle and forming a two-way circulation system in which the working fluid vapor and liquid coexist. At present, the commonly used material for vapor chambers is copper, and the working fluid inside is pure water.

[0047] Capillary structure: Since the liquid surface has surface tension, when the infiltrated liquid is in the capillary pore, its liquid surface is concave, so the liquid surface will exert a pulling force on the liquid below, causing the liquid to move upward along the wall of the capillary pore. This causes the capillary phenomenon. The capillary structure can include multiple capillaries or fine grooves similar to capillaries. In this way, when the liquid working medium enters the capillary pores or fine grooves in the capillary structure, it will flow to the other end of the capillary pore through capillary action, completing the transfer and return of the working medium.

[0048] The embodiment of the present application provides a temperature equalizing plate. The temperature equalizing plate can be applied to electronic devices, such as mobile phones, tablet computers, laptop computers, and related modules, structural parts, functional parts, etc. with heat dissipation functions. The electronic device includes a working module and a heat dissipation module, and the heat dissipation module includes a temperature equalizing plate, which is used to dissipate heat from the working module. The heat transfer performance and stability of the electronic device with the temperature equalizing plate provided by the present application are significantly improved, and the requirements of lightweight and large-area and large-span design are also met.

[0049] Figure 2 A schematic diagram of the structure of a temperature equalizing plate provided in an embodiment of the present application. Figure 2a for Figure 2 MM cross-sectional view of the middle temperature plate. Figure 2 , Figure 2a As shown, the temperature homogenizing plate comprises: a first cover plate 101 close to the heat source, and a second cover plate 102 far away from the heat source, wherein the first cover plate 101 and the second cover plate 102 are arranged to form a cavity.

[0050] The temperature homogenizing plate is, for example, of a special shape, and the cavity is at least divided into a first cavity 100 and a second cavity 200 .

[0051] The embodiment of the present application does not limit the cross-sectional shape of the first cavity 100 and the second cavity 200. In some embodiments of the present application, such as Figure 2 , Figure 2a As shown, the cross-sectional shapes of the first cavity 100 and the second cavity 200 are both rectangular, and the cross-sectional widths of the first cavity 100 and the second cavity 200 are different. Among them, the cross-sectional width of the second cavity 200 is greater than the cross-sectional width of the first cavity 100.

[0052] Therefore, the first cavity 100 adopts a regular shape with a uniform cross-sectional width, so that the first liquid absorption core can be evenly arranged at equal distances, avoiding the condensation area being unable to reflux when the pressure difference between the first cavity and the outside is large, or the steam cavity being blocked and the steam being unable to reflux, resulting in a significant decline in thermal performance.

[0053] In other embodiments of the present application, the cross-sectional shape of the second cavity can also be other regular polygonal, circular or irregular shapes. Thus, the second cavity can adopt an irregular shape to meet the heat dissipation requirements of irregularly shaped heat sources.

[0054] The temperature absorbing plate further includes, for example, a second liquid wick 104. The second liquid wick 104 adopts a capillary structure, and the capillary structure is filled with a cooling medium, such as deionized water, methanol, acetone, etc. The heat dissipation of the temperature absorbing plate can be achieved through the gas-liquid two-phase change of the working medium. The specific heat dissipation principle and heat dissipation path are as described above.

[0055] The capillary structure may or may not be connected to the inner surface of the shell. The capillary structure is a porous medium made of metal. Specifically, the material of the capillary structure is copper or copper alloy, and the capillary structure may be, for example, one or more of a copper mesh, copper fiber, copper powder or foam copper. Titanium or other non-metallic materials may also be used. The copper mesh may be combined with the surfaces opposite to the first cover plate 101 and the second cover plate 102 by sintering, heat welding or cold pressing, and the copper mesh may be fixed to the inner surface of the shell by sintering, heat welding or cold pressing to prevent the position of the copper mesh from changing during use, thereby ensuring the stability of the product. Alternatively, the copper mesh may be placed in a sealed cavity without any connection processing, thereby avoiding the impact of sintering, heat welding or cold pressing on the shell, thereby ensuring the structural stability of the shell.

[0056] In some embodiments, the sealed cavity of the temperature homogenizer is provided with an opening connected to the outside. The opening may be a liquid injection port or a vacuum port. A cooling medium is injected into the sealed cavity through the opening, and the sealed cavity is vacuumed through the opening, and then the opening is sealed so that the sealed cavity is in a vacuum negative pressure state. When the inside of the sealed cavity is evacuated, the injected cooling medium is in a negative pressure state. Once the cooling medium is heated in the evaporation zone, vaporization will occur. The volume of the vaporized cooling medium increases and fills the entire cavity. In the cooling area, the gaseous cooling medium dissipates heat and liquefies into a liquid cooling medium. The liquefied cooling medium returns to the evaporation area with the help of the capillary structure. In this way, a heat transfer cycle is formed in the sealed cavity.

[0057] The specific structure of the temperature equalizing plate is not limited in the embodiments of the present application. In some embodiments of the present application, the second liquid wick 104 and the steam chamber adopt a serial structure.

[0058] The temperature equalizing plate adopts a serial structure and has a flexible shape, but a single structure. When the cross-sectional height is small, the process difficulty of setting the second liquid absorption core 104 and the steam chamber increases.

[0059] To this end, the present application also provides a temperature homogenizing plate. Figure 3 A schematic diagram of the structure of another temperature homogenizing plate provided in an embodiment of the present application; Figure 3a for Figure 3 AA cross-sectional view of the middle temperature plate; Figure 3b for Figure 3 BB cross-section view of the middle temperature plate; Figure 3c for Figure 3 CC cross-sectional view of the middle temperature plate; Figure 3d for Figure 3 DD cross-sectional view of the middle temperature plate. Figure 3 , Figure 3a , Figure 3b , Figure 3c , Figure 3d As shown, the temperature homogenizing plate comprises: a first cover plate 101 close to the heat source, and a second cover plate 102 far away from the heat source, wherein the first cover plate 101 and the second cover plate 102 are arranged to form a cavity.

[0060] The temperature homogenizing plate is at least divided into a first cavity 100 and a second cavity 200. The cross-sectional dimensions of the first cavity 100 and the second cavity 200 are different. It should be noted that the cross-sectional dimensions may be different in cross-sectional width or in cross-sectional height.

[0061] In some embodiments of the present application, the cross-sectional widths of the first cavity 100 and the second cavity 200 are different. Figure 3As shown, the cross-sectional width of the first cavity 100 is greater than the cross-sectional width of the second cavity 200 . Of course, the cross-sectional width of the second cavity 200 may also be greater than the cross-sectional width of the first cavity 100 .

[0062] In other embodiments of the present application, Figure 4b As shown, the cross-sectional heights of the first cavity 100 and the second cavity 200 are different. Figure 4b As shown, the cross-sectional height of the first cavity 100 is greater than the cross-sectional height of the second cavity 200. Of course, it can also be as shown in FIG. Figure 4c As shown, the cross-sectional height of the second cavity 200 is greater than the cross-sectional height of the first cavity 100, all of which belong to the protection scope of the present application.

[0063] like Figure 3c As shown, a first liquid absorbent core 103 is disposed in the first cavity 100 , one end of the first liquid absorbent core 103 is connected to the first cover plate 101 , and the other end of the first liquid absorbent core 103 is connected to the second cover plate 102 .

[0064] There are multiple first absorbent cores 103, which are arranged in parallel and divide the first cavity 100 into multiple first steam chambers. The first absorbent cores 103 and the first steam chambers in the first cavity 100 are in parallel structure.

[0065] like Figure 3d As shown, a second absorbent core 104 is disposed in the second cavity 200 , and the second absorbent core 104 is parallel to the first cover plate 101 .

[0066] A second absorbent core 104 is disposed in the second cavity 200, and the second absorbent core 104 covers the first cover plate 101. The cavity between the second absorbent core 104 and the second upper cover plate constitutes the second steam cavity. The second absorbent core 104 and the second steam cavity in the second cavity 200 adopt a serial structure.

[0067] like Figure 3 , Figure 3a , Figure 3b As shown, the first absorbent core 103 is connected to the second absorbent core 104 , and the first cavity 100 is connected to the second cavity 200 .

[0068] During operation, when the heat generated by the heat source enters the temperature averaging plate through heat conduction, the working fluid near the heat source in the temperature averaging plate will quickly vaporize after absorbing the heat, taking away a large amount of heat at the same time. Then, by utilizing the latent heat of steam, when the steam in the temperature averaging plate diffuses from the high-pressure area near the first cover plate 101 to the low-pressure area near the second cover plate 102, the steam will quickly condense into liquid and release heat energy when it contacts the inner wall of the second cover plate 102 with a lower temperature; the working fluid condensed into liquid returns to the heat source through the capillary force of the first liquid absorbent core 103 and the second liquid absorbent core 104, thereby completing a heat conduction cycle and forming a two-way circulation system in which the working fluid coexists in vapor and liquid phases.

[0069] In addition, since the first liquid absorbent core 103 and the second liquid absorbent core 104 are connected, the first cavity 100 and the second cavity 200 are connected, so that steam can flow in the first cavity 100 and the second cavity 200, and when the liquid working medium in the first liquid absorbent core 103 or the second liquid absorbent core 104 is reduced, under the action of capillary force, the liquid in the second liquid absorbent core 104 and the first liquid absorbent core 103 can be transferred to each other, further improving the heat uniformity performance.

[0070] The heat spreader provided in the embodiment of the present application can be designed into an irregular shape according to the product structure. Some areas adopt a parallel structure, which is simple in structure, high in heat dissipation efficiency, and low in cross-sectional height. Some areas adopt a serial structure, and the heat spreader with a serial structure can be made into an irregular shape. The heat spreader adopts a structure combining a serial structure and a parallel structure, which can support an irregular structure, and has better heat transfer performance while achieving thinning, thereby achieving a thin heat spreader and improving the heat transfer performance of electronic equipment.

[0071] In addition, if Figure 4 , Figure 4a , Figure 5 As shown, support columns (105-1, 105-2) are further provided between the second cover plate 102 and the second absorbent core 104, and the support columns (105-1, 105-2) are used to support the second cover plate 102. Thus, by providing the support columns, the strength of the internal wall structure is ensured, and the stability of the temperature equalizing plate is improved.

[0072] The present application does not limit the structure of the support column. In some embodiments of the present application, such as Figure 4 As shown, the support column 105-1 is integrally formed with the second cover plate 102. Thus, the stability of the connection between the support column 105-1 and the second cover plate 102 is improved, and the safety performance of the temperature homogenizing plate is improved.

[0073] In other embodiments of the present application, Figure 4a As shown, the support column 105 - 1 is formed by stamping the second cover plate 102 .

[0074] In other embodiments of the present application, Figure 5 As shown, the support column 105-2 is a protrusion disposed on the second liquid absorbent core 104, and the support column 105-2 is integrally formed with the second liquid absorbent core 104. Therefore, the support column 105-2 can not only be used to support the second cover plate, but also can be used as a liquid absorbent core, which not only makes the connection between the support column 105-2 and the second liquid absorbent core more stable, but also when the support column 105-2 adopts the same structure as the liquid absorbent core, the heat uniformity performance of the temperature homogenizing plate can be improved.

[0075] The cross section of the support column is circular, rectangular or irregular in shape, so that the design of the support column is more flexible.

[0076] In some embodiments of the present application, Figure 6 , Figure 6a , Figure 6b As shown, the temperature homogenizing plate comprises: a first cover plate 101 close to the heat source, and a second cover plate 102 far away from the heat source, wherein the first cover plate 101 and the second cover plate 102 are arranged to form a cavity.

[0077] The temperature homogenizing plate is at least divided into a first cavity 100 and a second cavity 200 , wherein the first cavity 100 is disposed close to a heat source, and wherein the cross-sectional widths of the first cavity 100 and the second cavity 200 are different.

[0078] like Figure 3c As shown, a first liquid absorbent core 103 is disposed in the first cavity 100 , one end of the first liquid absorbent core 103 is connected to the first cover plate 101 , and the other end of the first liquid absorbent core 103 is connected to the second cover plate 102 .

[0079] There are multiple first absorbent cores 103, which are arranged in parallel and divide the first cavity 100 into multiple first steam chambers. The first absorbent cores 103 and the first steam chambers in the first cavity 100 are in parallel structure.

[0080] like Figure 3d As shown, a second absorbent core 104 is disposed in the second cavity 200 , and the second absorbent core 104 is parallel to the first cover plate 101 .

[0081] A second absorbent core 104 is disposed in the second cavity 200, and the second absorbent core 104 covers the first cover plate 101. The cavity between the second absorbent core 104 and the second upper cover plate constitutes the second steam cavity. The second absorbent core 104 and the second steam cavity in the second cavity 200 adopt a serial structure.

[0082] The second cavity 200 is further provided with a third wick 300, and the third wick 300 is connected to the first wick 103. Thus, the third wick 300 can connect the first wick 103 and the second wick 104, so that the heat in the first cavity can be better transferred to the second cavity, further improving the heat distribution performance of the temperature distribution plate.

[0083] The third absorbent core 300 may have the same structure as the first absorbent core 103 and the second absorbent core 104. The third absorbent core 300 may have a powder strip, powder wall or woven structure, thereby improving product consistency and simplifying the manufacturing process.

[0084] The embodiment of the present application does not limit the material of the above-mentioned absorbent core, and the materials of the first absorbent core 103 and the second absorbent core 104 are, for example, copper, titanium, alloy, non-metal or composite material. Therefore, the material selection of the first absorbent core and the second absorbent core is more, and the process difficulty is relatively low.

[0085] The first absorbent core 103 and the second absorbent core 104 adopt a capillary structure, and the capillary structure is formed by at least one of the following methods: weaving, sintering, and groove cutting. Therefore, the molding process of the first absorbent core and the second absorbent core is flexible, and the most suitable process can be selected.

[0086] For example, the capillary structure may be composed of particles such as copper powder / nickel powder / titanium powder, and may be sintered / electroplated / sprayed / glued onto the first cover plate 101. Of course, the capillary structure may also be sintered as a whole and then removed by secondary processing.

[0087] The thickness of the temperature balancing plate is, for example, less than or equal to 0.3 mm. The first cover plate 101 and the second cover plate 102 can be manufactured by etching, stamping, or other processes.

[0088] In the above embodiment, the cross-sectional width of the first cavity 100 is smaller than the cross-sectional width of the second cavity 200, the first absorbent core 103 adopts a parallel structure, and the second absorbent core 104 adopts a serial structure. In other embodiments of the present application, Figure 7 As shown, the cross-sectional width of the first cavity 100 is smaller than the cross-sectional width of the second cavity 200 , the first liquid absorbent core 103 adopts a serial structure, and the second liquid absorbent core 104 adopts a parallel structure.

[0089] In addition, the temperature plate can be divided into more than two cavities. Figure 8 As shown, the temperature homogenizing plate comprises: a first cover plate 101 close to the heat source, and a second cover plate 102 far away from the heat source, wherein the first cover plate 101 and the second cover plate 102 are arranged to form a cavity.

[0090] The temperature homogenizing plate is at least divided into a first cavity 100 , a second cavity 200 and a third cavity 400 .

[0091] like Figure 8 As shown, a first liquid absorbent core 103 is disposed in the first cavity 100 , one end of the first liquid absorbent core 103 is connected to the first cover plate 101 , and the other end of the first liquid absorbent core 103 is connected to the second cover plate 102 .

[0092] There are multiple first absorbent cores 103, which are arranged in parallel and divide the first cavity 100 into multiple first steam chambers. The first absorbent cores 103 and the first steam chambers in the first cavity 100 are in parallel structure.

[0093] A second absorbent core 104 is disposed in the second cavity 200 , and the second absorbent core 104 is parallel to the first cover plate 101 .

[0094] A second absorbent core 104 is disposed in the second cavity 200, and the second absorbent core 104 covers the first cover plate 101. The cavity between the second absorbent core 104 and the second upper cover plate constitutes the second steam cavity. The second absorbent core 104 and the second steam cavity in the second cavity 200 adopt a serial structure.

[0095] The third absorbent core 106 is disposed in the third cavity 400, and the third absorbent core 106 has the same structure as the second absorbent core 104. The third absorbent core is connected to the first absorbent core and the second absorbent core, and the third cavity is connected to the first cavity and the second cavity.

[0096] Of course, in other embodiments of the present application, the third liquid absorbent core may adopt a parallel structure, which all fall within the protection scope of the present application.

[0097] Therefore, the embodiment of the present application divides the temperature equalizing plate into multiple parts, including at least two internal structures, so that the structure of the temperature equalizing plate is more flexible, so that the internal structure of the liquid absorption core can be flexibly adjusted according to the shape of the product heat source, thereby improving the temperature equalization performance of the temperature equalizing plate.

[0098] The embodiment of the present application also provides an electronic device, comprising a heat source and a temperature averaging plate as described above, wherein the temperature averaging plate and the heat source have heat conduction. Therefore, the temperature averaging plate adopts the above structure, has better heat averaging performance, has a low cross-sectional height, and can be made into an irregular shape, and can be used to dissipate heat from an irregular heat source.

[0099] In some embodiments of the present application, the electronic device further comprises a housing, and the temperature averaging plate is heat-conductive with the housing, so that the temperature averaging plate can be attached to the housing, thereby improving the heat averaging performance of the housing.

[0100] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A temperature equalizing plate, characterized in that: include: A first cover plate close to a heat source, and a second cover plate far away from the heat source, the first cover plate and the second cover plate are arranged to form a cavity, the cavity is divided into at least a first cavity and a second cavity, wherein the cross-sectional dimensions of the first cavity and the second cavity are different, a first absorbent core is arranged in the first cavity, one end of the first absorbent core is connected to the first cover plate, and the other end is connected to the second cover plate, the first absorbent core is used to divide the first cavity into a plurality of first steam chambers; a second absorbent core is arranged in the second cavity, the second absorbent core is parallel to the first cover plate, and a second steam chamber is arranged between the second absorbent core and the second cover plate; wherein the first absorbent core and the second absorbent core are connected, and the first steam chamber and the second steam chamber are communicated.

2. The temperature equalizing plate according to claim 1, characterized in that: The first cavity and the second cavity have different cross-sectional heights.

3. The temperature equalizing plate according to claim 1 or 2, characterized in that: The first cavity and the second cavity have different cross-sectional widths.

4. The temperature equalizing plate according to claim 1 or 2, characterized in that: There are a plurality of the first liquid absorbent cores, and the plurality of the first liquid absorbent cores are arranged in parallel.

5. The temperature equalizing plate according to claim 1 or 2, characterized in that: There is one second liquid absorbent core, and the second liquid absorbent core covers the first cover plate.

6. The temperature equalizing plate according to claim 1 or 2, characterized in that: A support column is further provided between the second cover plate and the second liquid absorbent core, and the support column is used to support the second cover plate.

7. The temperature equalizing plate according to claim 6, characterized in that: The support column and the second cover plate are integrally formed.

8. The temperature equalizing plate according to claim 6, characterized in that: The support column is a protrusion arranged on the second liquid absorbent core, and the support column and the second liquid absorbent core are formed in one piece.

9. The temperature equalizing plate according to claim 6, characterized in that: The cross section of the support column is circular, rectangular or irregular.

10. The temperature equalizing plate according to any one of claims 1-2 or 7-9, characterized in that: A third liquid absorbent core is also disposed in the second cavity, and the third liquid absorbent core is connected to the first liquid absorbent core.

11. The temperature homogenizing plate according to claim 10, characterized in that: The third absorbent core is made of the same material as the first absorbent core and the second absorbent core.

12. The temperature equalizing plate according to any one of claims 1-2, 7-9 or 11, characterized in that: The first liquid absorbent core and the second liquid absorbent core are made of copper, titanium, alloy or non-metal.

13. The temperature equalizing plate according to any one of claims 1-2, 7-9 or 11, characterized in that: The first liquid absorbent core and the second liquid absorbent core adopt a capillary structure, and the capillary structure is formed by at least one of the following methods: weaving, sintering, and etching.

14. The temperature equalizing plate according to any one of claims 1-2, 7-9 or 11, characterized in that: The cross-sectional shape of the first cavity is a rectangle.

15. The temperature equalizing plate according to any one of claims 1-2, 7-9 or 11, characterized in that: The cross-sectional shape of the second cavity is a regular polygon, a circle or an irregular shape.

16. The temperature equalizing plate according to any one of claims 1-2, 7-9 or 11, characterized in that: The first cover plate and the second cover plate are made of metal or non-metal.

17. The temperature homogenizing plate according to any one of claims 1-2, 7-9 or 11, characterized in that: The cavity is further divided into: a third cavity, in which a third liquid absorbent core is arranged, one end of the third liquid absorbent core is connected to the first cover plate, and the other end is connected to the second cover plate; or, the third liquid absorbent core is parallel to the first cover plate; wherein, the third liquid absorbent core is connected to the first liquid absorbent core and the second liquid absorbent core, and the third cavity is communicated with the first cavity and the second cavity.

18. An electronic device, characterized in that: The invention comprises a heat source and a temperature evaporating plate according to any one of claims 1 to 17, wherein the temperature evaporating plate and the heat source are heat-conductive.

19. The electronic device according to claim 18, characterized in that: It also includes a shell, and the temperature averaging plate is heat-conductive with the shell.

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