Prevent material dripping during material injection

Abstract

An injection device for injecting a material is disclosed. The injection device includes a tank for storing the material. The injection device further includes a head body having a surface for contacting a substrate and an opening portion, the opening portion opening at the surface for discharging the material in fluid communication with the tank. The injection device further includes a member connected to the opening portion, wherein the member allows gas to flow into and out of the opening portion.

Description

Background Art

[0001] The present disclosure relates generally to material injection technology, and more particularly, to injection devices, methods, and material injection systems for injecting materials.

[0002] In recent years, the demand for higher density packaging is increasing. Fine pitch interconnection with solder bumps is a key technology to achieve high density packaging for 2.5D or 3D and mobile applications. As solder bump size becomes smaller for fine pitch applications, the control of solder interconnect properties affects chip package interaction (CPI) and electromigration (EM) performance. Summary of the invention

[0003] From a first aspect, the present invention provides an injection device for injecting materials, the device comprising: a tank for storing materials; a head body having a surface for contacting a substrate and an opening portion opening at the surface, the opening portion being used to discharge the material connected to the tank fluid; and at least one member connected to the opening portion, the at least one member allowing gas to flow into and out of the opening portion.

[0004] From another aspect, the present invention provides a method for injecting material, the method comprising: placing an injection device onto a substrate, the injection device comprising a tank for storing material; a head body having a surface in contact with the substrate and an opening portion opening at the surface and covered by the substrate; and at least one member connected to the opening portion, the at least one member allowing gas to flow therethrough; discharging the material from the opening portion; and while introducing gas into the opening portion through the at least one member, conveying the material filled in the opening portion to the tank of the injection device.

[0005] From another aspect, the present invention provides a material injection system for injecting material, the system comprising: a platform for receiving a substrate; an injection device, the injection device comprising: a container, the container being used to store material; a head body, the head body having a surface for contacting the substrate on the platform and an opening portion opening at the surface, the opening portion being used to discharge the material connected to the container fluid; and at least one member connected to the opening portion, the at least one member allowing gas to flow into and out of the opening portion; a position controller, which is configured to control the relative position of the injection device relative to the substrate on the platform; and a flow controller, which is configured to control the flow of the material.

[0006] According to an embodiment of the present invention, there is provided an injection device for injecting a material. The injection device comprises a tank for storing a material. The injection device further comprises a head body having a surface for contacting a substrate and an opening portion opening at the surface, the opening portion being used to discharge the material in fluid communication with the container. The injection device further comprises at least one member connected to the opening portion, wherein the at least one member allows gas to flow into and out of the opening portion.

[0007] According to the injection device of the embodiment of the present invention, since at least one member is configured to allow gas to flow into and out of the opening portion so as to discharge the material even when the opening portion is covered by the substrate, the space of the opening portion can be smoothly and easily vacated by transferring the material into the box while bringing the gas into the opening portion via the at least one member. Therefore, the material can be prevented from dripping from the opening portion of the injection device without reducing the processing productivity.

[0008] In a preferred embodiment, the opening has the form of a slit, and each of the at least one member is connected to the opening at a position away from the middle of the slit. Since the slit-like opening covers a wide area of ​​the substrate in one scan, processing productivity can be improved.

[0009] In a preferred embodiment, the at least one member comprises a second tank equipped with a valve for opening and closing a passage between the second tank and the outside. Thus, the transfer of material can be smoothly performed to fill or empty the opening portion. Moreover, the at least one member can be used with almost the same lifespan as the injection device. Furthermore, it is not necessary to form a hole with the risk of being blocked by material.

[0010] In a specific embodiment, the head body includes a first connection channel connected to the tank and a second connection channel connected to the second tank. The opening portion has a first end connected to the first connection channel and a second end connected to the second connection channel.

[0011] In other preferred embodiments, each of the at least one member comprises a porous member that allows the gas to flow through the porous member while being separated from the material. Thus, a mechanism for preventing the material from dripping from the opening while retaining the material in the opening can be provided in a simple manner. Since the opening can be simply filled or emptied by transferring the material only in the opening, the material transfer time can be shortened.

[0012] In yet other preferred embodiments, each of the at least one member comprises one or more holes opened at the head body, the one or more holes allowing the gas to flow therethrough. Thus, a mechanism for preventing material from dripping from the opening can be provided in a simple manner at low cost. Since the opening can be simply filled or emptied by transferring material only in the opening, the material transfer time can be shortened.

[0013] In a specific embodiment, the tank is equipped with a switch element. The switch element is configured to open or close and is connected to the surrounding environment, a positive pressure line or a vacuum line according to the operating state. In a specific embodiment, the injection device is configured to scan on the substrate, wherein the opening portion is covered by the substrate and filled with the material. In a specific embodiment, the injection device is configured to be lifted from the substrate in response to completing the transfer of the material from the opening portion to the tank and the tank being sealed or vacuumed.

[0014] In a preferred embodiment, the material is molten solder, the injection device is an injection molded solder (IMS) head and the molten solder is injected into a hole or cavity formed at the surface of the substrate. Since the material is molten solder, the injection device is usually operated at high temperature. Therefore, the way to prevent the material from dripping from the opening will be limited. The injection device according to an embodiment of the present invention realizes a practical solution to avoid molten solder dripping from the opening when the available methods are limited. In addition, compared with the case where the solder solidifies before the injection device moves from the substrate, the reduction in expected processing productivity is minimized due to the rapid and smooth transfer of the material to the tank.

[0015] According to other embodiments of the present invention, a method for injecting a material is provided. The method includes placing an injection device onto a substrate. The injection device includes: a tank for storing a material; a head body having a surface in contact with the substrate and an opening portion opened at the surface and covered by the substrate; and at least one member connected to the opening portion. The at least one member allows gas to flow therethrough. The method also includes discharging material from the opening portion. The method also includes conveying the material filled in the opening portion to the tank of the injection device while bringing the gas into the opening portion through the at least one member.

[0016] According to the method of an embodiment of the present invention, since the material in the opening is transported to the tank while the gas is brought into the opening via at least one component, the space in the opening can be vacated smoothly and easily, thereby avoiding the material from dripping from the opening of the injection device without reducing the process productivity.

[0017] In a specific embodiment, the method further includes sealing the tank with a closing switch element or vacuuming the tank with a vacuum cleaner, wherein the switch element opens at least partially in response to the material being transferred from the opening portion to the tank. The method also includes lifting the injection device from the substrate in response to the tank being sealed or vacuumed. The injection device can be smoothly retracted even if there is a slight level difference between the surface of the substrate and the position where the injection device is retracted to wait for the substrate to be replaced.

[0018] According to other embodiments of the present invention, a material injection system for injecting material is provided. The material injection system includes: a platform for receiving a substrate; an injection device; a position controller; and a flow controller. The injection device includes a tank for storing material. The injection device also includes a head body, which has a surface for contacting the substrate on the platform and an opening portion opened at the surface, and the opening portion is used to discharge the material in fluid communication with the tank. The injection device further includes at least one member connected to the opening portion. The at least one member allows gas to flow into and out of the opening portion. The position controller is configured to control the relative position of the injection device relative to the substrate on the platform. The flow controller is configured to control the flow of the material.

[0019] According to the material injection system of the embodiment of the present invention, since at least one component of the injection device is configured to allow gas to flow into and out of the opening, the space of the opening can be vacated by transporting the material to the tank while the gas is brought into the opening through the at least one component. Therefore, the material can be prevented from dripping from the opening of the injection device without reducing the processing productivity.

[0020] In a specific embodiment, the position controller is further configured to place the injection device on the substrate. The flow controller is also configured to discharge material from the opening portion of the injection device. The flow controller is further configured to transport the material filled in the opening portion to the tank of the injection device while bringing the gas into the opening portion via the at least one member.

[0021] In a specific embodiment, the position controller is further configured to lift the injection device from the substrate in response to the tank being sealed or vacuumed. The position controller is also configured to move the injection device out of the substrate in response to the injection device being lifted. The position controller is also configured to move the injection device to a new substrate in response to a new substrate being placed on the platform. In a specific embodiment, the material injection system further includes a positive pressure line configured to be connected to the tank of the injection device. The positive pressure line provides pressure to push the material stored in the tank to the opening portion during scanning of the injection device.

[0022] Additional features and advantages are realized through the techniques of the present invention.Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The subject matter regarded as the present invention is particularly pointed out and clearly claimed in the claims at the end of the specification. The above and other features and advantages of the present invention will become apparent from the following detailed description in conjunction with the accompanying drawings. Note that the sizes and relative positions of the elements and layers in the drawings are not necessarily drawn to scale. Some of these elements or layers are arbitrarily enlarged and positioned to improve the readability of the drawings.

[0024] Figure 1A , Figure 1B and Figure 1C A cross-sectional view and a bottom view of an IMS (Injection Molded Soldering) head for injecting molten solder into a target substrate according to an exemplary embodiment of the present invention are shown. The present invention will now be described by way of example only with reference to a preferred embodiment as illustrated in the following drawings:

[0025] Figure 2A , 2B 2C show cross-sectional views of an IMS head in each step of an IMS process according to an exemplary embodiment of the present invention.

[0026] Figure 3A , 3B 3C and 3C show other cross-sectional views of the IMS head in each step of the IMS process according to an exemplary embodiment of the present invention.

[0027] Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E and Figure 4F A bottom view of an IMS head in each step of an IMS process according to an exemplary embodiment of the present invention is shown.

[0028] Figure 5A and 5B An example of a use case of an IMS process using an IMS head according to one or more specific embodiments of the present invention is presented.

[0029] Figure 6 A schematic diagram of an IMS system including an IMS head for injecting molten solder according to an exemplary embodiment of the present invention is shown.

[0030] Fig. 7A , Figure 7B and Figure 7CA cross-sectional view and a bottom view of an IMS head for injecting molten solder according to other exemplary embodiments of the present invention are shown.

[0031] Fig. 8A , Figure 8B and Figure 8C A cross-sectional view showing an IMS head in each step of an IMS process according to another exemplary embodiment of the present invention.

[0032] Fig. 9A , 9B 9C show other cross-sectional views of the IMS head in each step of the IMS process according to another exemplary embodiment of the present invention.

[0033] Fig. 10A , Fig. 10B and Fig. 10C A view showing a related IMS head for injecting molten solder is shown.

[0034] Fig.11A and Fig. 11B A cross-sectional view of a related IMS head is shown at each step of the related IMS process. DETAILED DESCRIPTION

[0035] Hereinafter, the present invention will be described with reference to specific embodiments, but those skilled in the art will appreciate that the embodiments described below are mentioned only by way of example and are not intended to limit the scope of the present invention.

[0036] One or more embodiments of the present invention relate to an injection device, method, and material injection system for injecting a material into a substrate.

[0037] In the following, reference is made to a series of Figure 1A , Figure 1B and Figure 1C , an injection device according to an exemplary embodiment of the present invention is described, wherein the material to be injected by the injection device is molten solder and the substrate to be injected with the material is a semiconductor, glass or organic substrate having one or more holes or cavities at the surface of the substrate (as part of the substrate itself or a temporary member placed on the substrate, such as a resist mask). Therefore, the injection equipment according to the exemplary embodiment of the present invention to be described below is an IMS (injection molding soldering) head 10 for an IMS process. However, the injection device is not limited to the IMS head 10, and any injection device for injecting any liquid or paste material into a target substrate can be conceived.

[0038] In some embodiments, the IMS can be used for bumps and filling materials. The injection device can be scanned on the substrate, and molten solder can be injected from the opening of the injection device formed under the tank to fill the cavity or hole formed at the surface of the substrate. IMS technology has various advantages, including flexibility of solder composition, fine pitch capability, green technology and low-cost process. The flexibility of the composition even at very fine pitches and small sizes will result in desired mechanical properties and EM resistance.

[0039] In some embodiments, the solder may solidify before the injection device moves from the substrate. For example, an injection head having a nozzle for supplying molten solder may contact a mask having an opening disposed on the substrate. After the supply operation is completed, the injection head may be forced to cool by heat transfer from a cooling unit through a heater unit that has stopped operating. When the injection head moves upward, the molten solder in the cooled injection head does not droop from the nozzle.

[0040] Figure 1A , 1B 1C show views of an IMS head 10 for injecting molten solder onto a target substrate. Figure 1A and Figure 1B The cross-sectional views of the IMS head 10 viewed from different sides are shown respectively. Figure 1C A bottom view of the IMS head 10 is shown. Note that Figure 1A The cross-sectional view shown in Figure 1B The cross section indicated by "B" in the other cross-sectional view shown in FIG. It should also be noted that Figure 1B The cross-sectional view shown in corresponds to Figure 1A The cross section indicated by “A” in the cross-sectional view shown in .

[0041] like Figure 1A and 1B As shown in , the IMS head 10 includes: a first tank 20 for storing molten solder; a head body 30, which is used to contact the above-mentioned target substrate and inject the molten solder into the above-mentioned target substrate; and a second tank 40 for at least temporarily storing the molten solder. The head body 30 can be formed below the two tanks 20 and 40. Note that the IMS head 10 can include appropriate heating members such as heating wires and thermocouples at appropriate locations. The heating component is used to control the temperature of the IMS head 10, and accordingly control the temperature and state of the solder retained in the IMS head 10. Therefore, during the operation of the IMS process, the solder retained in the IMS head 10 is molten solder.

[0042] The head body 30 has a bottom surface 30a for contacting the target substrate, and an opening 30b, which is open at the bottom surface 30a, for discharging the molten solder in fluid communication with the first tank 20. In a specific embodiment, during scanning, the bottom surface 30a of the head body 30 is pressed against the target substrate. The head body 30 and the tanks 20, 40 can be made of a rigid metal material such as stainless steel. The head body 30 can include a buffer layer at the bottom surface 30a to absorb the pressure on the target substrate to a certain extent. The buffer layer can be made of an elastic material such as rubber with heat resistance.

[0043] The first tank 20 has an internal space 20a in which molten solder is stored. The second tank 40 also has an internal space 40a for storing molten solder. One of these tanks 20, 40 (in the described embodiment, the first tank 20) ​​can be connected to an external solder supply. The internal space 20a of the first tank 20 and the internal space 40a of the second tank 40 are fluidly connected to each other through a flow channel 12 formed in the IMS head 10.

[0044] One flow path 12 has an opening 12b corresponding to the opening 30b opened in the bottom surface 30a, a first connection passage 12a connected to the first tank 20 and the opening 12b, and a second connection passage 12c connected to the second tank 40 and the opening 12b.

[0045] like Figure 1C As shown, in the described embodiment, the opening portion 12b (and the opening 30b) has the form of a slit (long, straight, narrow opening) that can extend along the bottom surface 30a in one direction. The width of the slit-shaped opening portion 12b can be, but is not limited to, in the range of 0.2mm to 5.0mm.

[0046] In some embodiments, a slit-like opening shape may be used to improve process productivity. The slit-like opening shape may cover a wide area of ​​the substrate in a single scan. In some embodiments, the implantation device may be moved out of a substrate on the platform and then the next substrate may be placed on the platform.

[0047] The first tank 20 and the second tank 40 are connected to the opening 12b at positions away from the middle M of the slit. Figure 1B and Figure 1CIn the embodiment described in the figure, the opening portion 12b may have a first end R connected to the first connection channel 12a and a second end L connected to the second connection channel 12c, the first connection channel 12a is further connected to the first tank 20, and the second connection channel 12c is further connected to the second tank 40. In the present embodiment, the first connection channel 12a and the second connection channel 12c have a tubular shape and extend perpendicular to the bottom surface 30a. The size of the first connection channel 12a and the second connection channel 12c is not limited and may be greater than the width of the opening portion 12b.

[0048] The first tank 20 may be equipped with a first opening and closing valve 22 as a switching element for opening and closing a passage between the first tank 20 and the outside of the IMS head 10. The first opening and closing valve 22 may be connected to the top of the first tank 20. The first opening and closing valve 22 may be configured to be opened or closed and connected to the ambient environment or the positive pressure line in a manner depending on the operating state of the IMS process.

[0049] In some embodiments, in order to avoid dripping of material, a vacuum function may be employed. For example, a fluid discharge device (such as a solder bump formation device using an IMS method) may discharge fluid without cooling the head, and adjust the pressure to be added to the fluid to prevent excess fluid from leaking from the nozzle, and switch positive and negative pressures to achieve this. A short slit may help prevent dripping.

[0050] The second tank 40 may be equipped with a second opening and closing valve 42 for opening and closing a passage between the second tank 40 and the outside of the IMS head 10. The second opening and closing valve 42 may be connected to the top of the second tank 40. The second opening and closing valve 42 may be configured to be opened or closed and connected to the ambient environment or the positive pressure line in a manner depending on the operating state of the IMS process.

[0051] The second opening and closing valve 42 allows gas such as air and inert gas (for example, nitrogen, rare gas such as argon) to flow into and out of the second tank 40. The gas flowing into the internal space 40a of the second tank 40 through the second opening and closing valve 42 can further flow into the second connecting flow path 12c, the opening 12b, and the first connecting flow path 12a, pushing the molten solder back to the first tank 20, even when the opening 30b (opening 12b) is covered by the target substrate.

[0052] exist Figure 1A , Figure 1B and Figure 1C In the embodiment described in , therefore, the second tank 40 equipped with the second opening and closing valve 42 is used as a member connected to the opening portion 12b, and in particular, allows gas to flow into and out of the opening portion 12b when the molten solder is transferred between the opening portion 12b and the first tank 20.

[0053] Figure 1A , Figure 1B and Figure 1C The IMS head 10 shown in the figure can be configured to scan on the target substrate, wherein the opening 12b is covered by the surface of the target substrate and is filled with molten solder. During the scanning or contact of the IMS head 10 on the target substrate, the molten solder is retained in the opening 12b and in the two tanks 20, 40. The molten solder is injected from the opening 12b into the hole or cavity formed on the surface of the target substrate. In addition, the IMS head 10 can be configured to be lifted from the target substrate so as to replace the target substrate with a new target substrate. During the rise of the IMS head 10, the molten solder has moved to the first tank 20 and no molten solder is left in the opening 12b. There are only gases such as air and inert gas in the opening 12b. If necessary, the first opening and closing valve 22 can be connected to a vacuum (negative pressure) line to perform a vacuum function to keep the solder in the first tank 20 of the IMS head 10.

[0054] Note that the IMS head 10 may further include other slit openings at the bottom surface 30a for evacuating air in holes or cavities formed at the surface of the target substrate 000000000000000. It is preferred when the size of the holes or cavities is fine.

[0055] refer to Figure 2A , Figure 2B and Figure 2C , Figure 3A , Figure 3B and Figure 3C as well as Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E and Figure 4F A series of IMS processes using the IMS head 10 according to an exemplary embodiment of the present invention are described.

[0056] Figure 2A , 2B and 2C and Figure 3A , 3B 3C show cross-sectional views of the IMS head 10 in each step of the IMS process. Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E and Figure 4F The bottom view of the IMS head 10 is shown in each step of the IMS process. It should be noted that Figure 4A , Figure 4B and Figure 4C The bottom views shown in Figure 2A , Figure 2B and Figure 2CA cross-sectional view of an IMS head 10 is shown in FIG. Figure 4D , Figure 4E and Figure 4F The bottom views shown in FIG. Figure 3A , Figure 3B and Figure 3C A cross-sectional view of an IMS head 10 is shown in FIG.

[0057] like Figure 2A and Figure 4A As shown, the IMS process may include a step of initiating the IMS process when the IMS head 10 is lifted above the target substrate 1. In the step of starting the IMS process, a predetermined amount of molten solder 14 is stored in the first tank 20. When all the solder 14 exists in the first tank 20 and the first connecting channel 12a, the first opening and closing valve 22 is closed. In addition, the second opening and closing valve 42 may also be opened and closed in this step.

[0058] The molten solder 14 is a solder material that can have any suitable composition. In one or more embodiments, any lead-free solder alloy can be used, including binary, ternary and quaternary systems of one or more elements selected from the group including tin, bismuth, silver, indium, antimony, copper, zinc, nickel, aluminum, manganese and palladium. Such lead-free solder alloys may include Bi-Sn, Sn-Ag, Sn-Ag-Bi, Sn-Ag-Cu, Sn-Cu alloys, just to name a few. With a high degree of freedom about the composition, any composition suitable for ridges or fillings can be selected.

[0059] In the initial step, the position of the top surface of the molten solder 14 drops by the weight of the solder 14 itself, and the void pressure in the first tank 20 decreases until the pressure at the bottom surface of the molten solder 14 is equal to the atmospheric pressure. The molten solder 14 may at least partially enter the first connection channel 12a. Note that the stop position of the bottom surface of the molten solder 14 may be controlled by the volume of the solder and the size of the IMS head 10.

[0060] In other embodiments, the stop position can also be controlled by adding a vacuum function. When the vacuum function is adopted, the first on-off valve 22 connected to the first tank 20 is opened and connected to the vacuum line.

[0061] like Figure 2B and Figure 4B As shown, the IMS process may further include a step of placing the IMS head 10 on the target substrate 1 so that the bottom surface 30a of the head body 30 contacts the surface of the target substrate 1 and the opening portion 12b opened at the bottom surface 30a is covered by the surface of the target substrate 1. The IMS head 10 is pushed onto the target substrate 1 by an appropriate pressure. The states of the first opening and closing valve 22 and the second opening and closing valve 42 may be the same as those in the step of starting the IMS process.

[0062] like Figure 2C and Figure 4C As shown, the IMS process may further include the step of supplying the molten solder 14 from the first tank 20 to the opening 12b of the head body 30. In the process of supplying the molten solder 14 to the opening 12b, the first on-off valve 22 and the second on-off valve 42 are opened, and an inactive gas (e.g., nitrogen) flows from the positive pressure line through the first on-off valve 22 into the first tank 20, and the molten solder 14 retained in the first tank 20 is pressed into the first connecting channel 12a, the opening 12b, the second connecting channel 12c, and the second tank 40 in sequence. In this step, the IMS head 10 can be pushed to the target substrate 1 by appropriate pressure. Figure 4C As shown, the opening 12b of the IMS head 10 is completely filled with the molten solder 14. Since the second tank 40 equipped with the second opening and closing valve 42 in fluid communication with the opening 12b allows gas to flow therethrough, the second opening and closing valve 42 opened in this operating state discharges the gas flowing out of the opening 12b to the surrounding environment during the delivery of the molten solder 14. The gap in the second tank 40 helps prevent the molten solder from reaching the second opening and closing valve 42.

[0063] After the opening 12b of the IMS head 10 is filled with the molten solder 14, the first opening and closing valve 22 and the second opening and closing valve 42 are opened to connect to the surrounding environment, so that the liquid levels of the molten solder 14 in the first tank 20 and the second tank 40 are equal. However, it is noted that the positions or levels of the liquid levels of the molten solder 14 in the first tank 20 and the second tank 40 do not need to be equal.

[0064] like Figure 3A and Figure 4D As shown, the IMS process may further include a step of discharging the molten solder 14 from the opening 12b (and the opening 30b) of the IMS head 10 to the target substrate 1 while scanning the IMS head 10 on the target substrate 1 in a horizontal plane. In the process of discharging the molten solder 14 from the opening 12b, the first opening and closing valve 22 and the second opening and closing valve 42 are opened and connected to the positive pressure pipeline, and pressure is applied to the two upper surfaces of the molten solder 14 in the first tank 20 and the second tank 40. After the IMS scan of the target substrate 1 on the platform is completed, the first opening and closing valve 22 and the second opening and closing valve 42 are opened, and the first opening and closing valve 22 and the second opening and closing valve 42 are connected to the surrounding environment.

[0065] like Figure 3B and Figure 4EAs shown, the IMS process may further include a step of transferring the molten solder 14 filled in the opening portion 12b to the first tank 20 of the IMS head 10 while bringing the gas into the opening portion 12b through the second tank 40 and the second opening and closing valve 42. In the step of transferring the molten solder 14 to the first tank 20, the first opening and closing valve 22 is opened and connected to the surrounding environment, and the second opening and closing valve 42 is opened and connected to the positive pressure line. The molten solder 14 in the second tank 40 is pushed back into the first tank 20 through a flow path 12, and at the same time, the gas in the gap of the internal space 20a of the first tank 20 is released to the outside of the IMS head 10 through the first opening and closing valve 22. In this step, the IMS head 10 can be pushed to the target substrate 1 by appropriate pressure.

[0066] Alternatively, the first opening and closing valve 22 is opened and connected to the negative pressure line, and the second opening and closing valve 42 is opened and connected to the surrounding environment. In this case, while the gas is introduced into the internal space 40a of the second tank 40 through the second opening and closing valve 42, the molten solder 14 in the second tank 40 is sucked into the first tank 20 through one flow path 12. In this case, a negative pressure line is included.

[0067] like Figure 3C and Figure 4F As shown, after the transfer of the molten solder 14 to the first tank 20 is completed, the space of the opening portion 12b becomes empty. The IMS process may include the following steps: when the molten solder 14 has been transferred from the opening portion 12b to the first tank 20, the first tank 20 is sealed with the first opening and closing valve 22 closed. If a vacuum is included to keep all the molten solder 14 in the first tank 20 and the first connecting channel 12a, the first opening and closing valve 22 is connected to a sack back line. Therefore, alternatively, the IMS process may include a step of evacuating the first tank 20 with the first opening and closing valve 22 at least partially opened and connected to a vacuum line.

[0068] The IMS process then returns to Figure 2A and Figure 4A Refer again to the steps shown in Figure 2A and Figure 4A The IMS process may further include the step of lifting the IMS head 10 from the target substrate 1 when the first tank 20 is sealed or vacuumed. During the lifting of the IMS head 10, the target substrate 1 is replaced with a new target substrate by moving the IMS head 10 out of the target substrate 1; and the IMS head 10 is moved to the new target substrate.

[0069] In the following, reference Figure 5A and Figure 5B , describes the use of an IMS process using the IMS head 10 according to one or more specific embodiments of the present invention.

[0070] Figure 5A The use of an IMS process for manufacturing solder bumps using the IMS head 10 is shown. Figure 5A FIG. 2 shows an example of a target substrate 1A to be injected with molten solder. Figure 5A As shown, the target substrate 1A includes a base organic substrate 2 and a plurality of electrodes 3 formed on the surface of the base organic substrate 2 and a solder resist 4 covering the base organic substrate 2 with openings aligned with the electrodes 3. The target substrate 1A also has a resist mask 5 having openings aligned with the electrodes 3.

[0071] like Figure 5A As shown, by scanning the IMS head 10 on the target substrate 1A, the solder bump 6 is formed in the opening 6a of the resist mask 5. After the solder bump 6 is formed, the resist mask 5 can be peeled off from the target substrate 1A. Therefore, the resist mask 5 is a temporary member. Then, the solder bump 6 can be optionally subjected to reflow. Note that Figure 5A In the embodiment, the target substrate 1A is described as an organic substrate such as a laminate or a PCB (printed circuit board). However, the target substrate 1A for manufacturing solder bumps is not limited to an organic-based substrate. In other embodiments, semiconductor substrates (e.g., silicon chips or wafers) may also be considered.

[0072] Figure 5B A further use case of the IMS process for filling a through hole formed through a target substrate 1 is shown. Figure 5A 1B shows another example of a target substrate 1B to be injected with molten solder. Figure 5B As shown, the target substrate 1B includes a plurality of stacked substrate layers 7a, 7b, 7c, 7d, and 7e and a plurality of interlayer adhesives 8a, 8b, 8c, and 8d formed between the stacked substrate layers 7a, 7b, 7c, 7d, and 7e. A plurality of through holes 9a are formed through one or more substrate layers 7 of the target substrate 1B.

[0073] like Figure 5B As shown, by scanning the IMS head 10 on the target substrate 1B, a plurality of solder paths 9 are formed in the through holes 6a of the stacked substrate layers 7b, 7c, 7d and 7e. Figure 5B In the embodiment, the target substrate 1B is described as a semiconductor-based substrate. However, the target substrate 1B for fabricating through holes is not limited to a semiconductor-based substrate. In other embodiments, glass-based substrates may also be considered.

[0074] See also Figure 5A and 5B , the target substrate 1 for a specific IMS is described, but the target substrate 1 for the IMS process of the embodiment of the present invention is not limited. As the target substrate 1, any substrate can be used.

[0075] refer to Figure 6 , an IMS system 100 including an IMS head 10 for injecting molten solder according to an exemplary embodiment of the present invention is described. Figure 6 As shown, the IMS system 100 includes: a platform 102 for receiving a target substrate 1; an IMS head 10 as shown in FIG. 1 ; a position controller 110 for controlling the relative position of the IMS head 10 with respect to the target substrate 1 on the platform 102; a flow controller 120 configured to control the flow of molten solder; and a solder supply device 130 for supplying molten solder to the IMS head 10 (its first tank 20). Figure 6 The IMS head 10 shown in FIG. 1 includes a heating element 16 controlled by an appropriate thermal controller. The heating element 16 may be disposed adjacent each of the tanks 20, 40. The IMS head 10 is heated to an operating temperature above the melting temperature of the solder (e.g., 230 degrees Celsius for Su-3.0Ag-0.5Cu (SAC305) solder).

[0076] In a specific embodiment, the platform 102 may include Figure 6 The target substrate 1 shown in FIG. is fitted into a recess therein. The workbench 102 may have a heating component for heating the target substrate 1 to an appropriate temperature. There is usually a small gap 102a between the target substrate 1 and the upper surface of the platform 102, and the IMS head 10 retracts on the small gap 102a. In addition, there is usually a small height difference between the upper surface of the target substrate 1 and the upper surface of the platform 102. Since the diameter of the hole or cavity can be in the range of 50-200 microns, it is difficult to fully eliminate the height difference compared with the diameter of the hole or cavity. Therefore, in order to make the IMS head 10 retreat to the upper surface of the platform 102 outside the target substrate 1, the IMS head 10 is raised before crossing the gap and the step. Generally, the molten solder in the IMS head 10 is likely to drip from the opening 12b onto the surface of the target substrate 1 and drip into the small gap 102a between the target substrate 1 and the platform 102.

[0077] like Figure 6As shown, the IMS system 100 may further include actuators 112X, 112Y, 112Z, which are provided to the IMS head 10 to move the IMS head 10 along the corresponding guides of the three axes 114X, 114Y, 114Z. The actuator used as the actuator 112 may include a motor, a hydraulic cylinder, etc. The position controller 110 is connected to the actuators 112X, 112Y, 112Z through signal lines, and the position controller 110 is configured to control the relative position of the IMS head 10 relative to the target substrate 1 on the platform 102 by sending signals to the actuators 112X, 112Y, 112Z, so that the IMS head 10 moves appropriately along the guides 114X, 114Y, 114Z. Scanning, lifting, lowering and movement of the IMS head 10 are performed by using actuators 112X, 112Y, 112Z and corresponding guides of predetermined axes 114X, 114Y, 114Z and appropriate encoders.

[0078] like Figure 6 As shown, the IMS head 10 is connected to the first on-off valve 22 and the second on-off valve 42 .

[0079] The first on-off valve 22 may be connected to a three-way valve 24 that selects a port connected to the ambient environment 27 or a port connected to the positive pressure line 28 according to a signal transmitted from the flow controller 120. The positive pressure line 28 is configured to be connected to the first tank 20 of the IMS head 10. The positive pressure line 28 may be connected to a pressure pump and provide pressure to push the molten solder stored in the first tank 20 to the opening portion 12b (thus discharging it to the outside of the IMS head 10) during scanning of the IMS head 10. In the process of supplying the molten solder to the opening portion 12b, the positive pressure line 28 may also provide pressure to push the molten solder stored in the first tank 20 to the second tank 40 via the opening portion 12b.

[0080] In a preferred embodiment adopting the vacuum function, there is another three-way valve 26, which further selects a port connected to the positive pressure line 28 or a port connected to the vacuum (negative pressure) line 29 according to a signal transmitted from the flow controller 120. The vacuum line 29 is configured to be connected to the first tank 20 of the IMS head 10. The vacuum line 29 can be connected to a decompression device, and provide negative pressure to evacuate the gas in the first tank 20 and maintain the molten solder stored in the first tank 20 during the lifting of the IMS head 10. In addition, in the case where the vacuum function is not required, if possible, omitting the vacuum (negative pressure) line 29, the three-way valve 26, and other accompanying equipment for providing negative pressure can reduce costs.

[0081] The second on-off valve 42 may be connected to a three-way valve 44 that selects a port connected to the ambient environment 45 or a port connected to the positive pressure line 46 according to a signal transmitted from the flow controller 120. The positive pressure line 46 is configured to be connected to the second tank 40 of the IMS head 10. The positive pressure line 46 may be connected to a pressure pump and provide pressure to push the molten solder stored in the second tank 40 to the opening portion 12b (thus discharging it to the outside of the IMS head 10) during scanning of the IMS head 10. The positive pressure line 46 may also provide pressure to push the molten solder stored in the second tank 40 back to the first tank 20 through the opening portion 12b during the transfer of the molten solder between the tanks 20, 40.

[0082] The position controller 110 places the IMS head 10 on the target substrate 1. The position controller 110 is also configured to lift the IMS head 10 from the target substrate 1 in response to the first tank 20 being sealed or vacuumed. The position controller 110 is also configured to move the IMS head 10 out of the target substrate 1 in response to the IMS head 10 being lifted. The position controller 110 is also configured to move the IMS head 10 to a new substrate 1 in response to a new substrate 1 being placed on the platform 102.

[0083] The flow controller 120 is configured to supply the molten solder from the first tank 20 to the opening 12b of the IMS head 10. The flow controller 120 is configured to discharge the molten solder from the opening 12b of the IMS head 10. The flow controller 120 is configured to transfer the molten solder filled in the opening 12b to the first tank 20 of the IMS head 10 while bringing gas into the opening 12b through the second tank 40 and the second opening and closing valve 42 so as to vacate the space of the opening 12b.

[0084] The solder supply device 130 is configured to supply molten solder to the IMS head 10 (first tank 20). When the amount of molten solder remaining in the IMS head 10 is lower than a predetermined threshold, the solder supply device 130 supplies the molten solder to the IMS head 10 (first tank 20) ​​until the amount exceeds the predetermined threshold.

[0085] As described above, it has been described that the IMS head 10 is moved relative to the target substrate 1 fixed on the platform 102 by using the actuator 112 and the guide 114. However, the manner of controlling the relative position of the IMS head 10 relative to the target substrate 1 on the platform is not limited. In other embodiments, the platform 102 can be moved relative to the fixed IMS head 10 by using appropriate actuators and guides.

[0086] As described above, all solder is described as being held in the first tank 20 and the first connecting channel 12a during the lifting of the IMS head 10. However, the tank used to accumulate molten solder during non-scanning operations is not limited to the first tank 20. In other embodiments, the second tank 40 may be used to accumulate molten solder during the lifting of the IMS head 10.

[0087] As described above, the IMS head 10 according to the exemplary embodiment has been described as having two tanks 20, 40. However, the number of tanks in the IMS head 10 is not limited to two. In other embodiments, the IMS head 10 may have a single tank as will be described later, or may have three or more tanks. It should also be noted that the IMS head 10 has been described as having only major components. However, it should be noted that there are other components and / or structures for using the IMS head 10 as an injection head for an IMS process.

[0088] In the following, reference Fig. 7A , Figure 7B and Figure 7C The series describes an injection device according to other exemplary embodiments of the present invention, wherein the injection device is an IMS head 50 for an IMS process.

[0089] Fig. 7A , 7B 7C show views of an IMS head 50 for injecting molten solder into a target substrate. Figure 1A , Figure 1B and Figure 1C similar, Fig. 7A and Figure 7B A cross-sectional view of an IMS head 50 is shown, and Figure 7C A bottom view of the IMS head 50 is shown. Note that Fig. 7A The cross-sectional view shown in Figure 7B The cross section indicated by "B" in Figure 7B The cross-sectional view shown in Fig. 7A Note that because the IMS head 50 has a similar structure and function to the aforementioned IMS head 10 , the description will focus on the differences from the IMS head 10 .

[0090] like Fig. 7A and Figure 7B As shown, the IMS head 50 includes: a tank 60 for storing molten solder; a head body 70 that contacts the target substrate and injects the molten solder into the target substrate, and a plurality of porous material components 80 (two porous material components 80a, 80b in this embodiment) that separate gas from the molten solder and circulate the gas. The head body 70 may be formed below the tank 60. Similar to the previous embodiment, the IMS head 50 may include an appropriate heating member configured to control the temperature of the IMS head 10.

[0091] The head body 70 has a bottom surface 70 a for contacting a target substrate and an opening 70 b opened at the bottom surface 70 a for discharging molten solder in fluid communication with the tank 60 .

[0092] The tank 60 has an inner space 60 a storing molten solder. The inner space 60 a of the tank 60 and the two porous members 80 a , 80 b are connected to each other through a flow channel 52 formed in the IMS head 50 .

[0093] The flow channel 52 has an opening 52b corresponding to the opening 70b opened in the bottom surface 70a; a first connecting channel 52a connected to the tank 60 and the opening 52b; and two second connecting channels 52c and 52d connected to the opening 52b and the two porous members 80a and 80b, respectively. Figure 7C As shown, in this embodiment, the opening 52b (and the opening 70b) are formed in a slit shape. The tank 60 is connected to the opening 52b at a position in the middle M of the slit. The porous material parts 80a and 80b are connected to the opening 52b at a position away from the middle M of the slit. Figure 7B and Figure 7C In the embodiment described in , the first connection channel 72a is connected to the middle M. The opening 52b has a first end R connected to one second connection channel 72c further connected to one porous member 80a, and a second end L connected to another second connection channel 72d further connected to another porous member 80b.

[0094] The tank 60 may be equipped with an on-off valve 62 for opening and closing a passage between the tank 60 and the outside of the IMS head 50. The on-off valve 62 may be configured to be connected to the ambient environment, a positive pressure line, or a vacuum (negative pressure) line in a manner depending on the operating state of the IMS process.

[0095] Each porous member 80 may include a porous membrane 82 covering the second connecting passage 52c / 52d, a porous ceramic 84 formed on the porous membrane 82, and a cap member 86 having an opening 88, a closed porous membrane 82 and a porous ceramic 84 and fixing them to the head body 70. Porous membrane 82 and porous ceramic 84 are permeable for gases such as inert gases (e.g., nitrogen, argon), and therefore allow gas to flow into the second connecting passage 52c / 52d. In addition, it is also possible to make the gas flowing into the second connecting flow path 52c / 52d by porous member 80 flow into opening 52b and the first connecting flow path 72a when opening 70b (opening 52b) is covered by the target substrate, and push the molten solder back to the tank 60. In a specific embodiment, porous member 80 (especially porous membrane 82) can be a consumable product and can be frequently replaced as appropriate. Therefore, preferably, porous member 80 is removable and replaceable.

[0096] Therefore, in Fig. 7A , Figure 7B and Figure 7C In the embodiment described in the figure, the two porous members 80a, 80b are used as members connected to the opening 52b, and allow gas to flow into and out of the opening 52b, especially when the molten solder is transferred between the opening 52b and the first tank 60. In addition, the position of the porous material member 80 is not limited to Fig. 7A , 7B 7C shows the upper surface of the head body 70. The porous member 80 may be located on one side of the head body 70.

[0097] Fig. 7A , Figure 7B and Figure 7C The IMS head 50 shown in the figure can be configured to scan on the target substrate, wherein the opening 52b is covered by the target substrate and filled with molten solder. During the scanning or contact of the IMS head 50 on the target substrate, the molten solder is retained in the opening 52b and the tank 60. The molten solder is injected from the opening 52b into the hole or cavity formed on the surface of the target substrate. In addition, the IMS head 50 can be configured to be lifted from the target substrate so as to replace the target substrate with a new target substrate. During the lifting of the IMS head 50, the molten solder has moved to the tank 60 and no molten solder is left in the opening 52b.

[0098] refer to Fig. 8A , Figure 8B and Figure 8C as well as Fig. 9A , Fig. 9B and Fig. 9C The series describes an IMS process using an IMS head 50 according to another exemplary embodiment of the present invention. Fig. 8A , Figure 8B and Figure 8C as well as Fig. 9A , Fig. 9B and Fig. 9C Cross-sectional views of the IMS head 50 are shown at each step of the IMS process.

[0099] like Fig. 8A As shown, the IMS process may include a step of starting the IMS process with the IMS head 50 lifted onto the target substrate 1. In the step of starting the IMS process, when all the solder exists in the tank 60 and the first connection channel 52a, the on-off valve 62 is closed. In other embodiments, the on-off valve 62 that adopts a vacuum function and is connected to the box is opened and connected to the vacuum line.

[0100] like Figure 8B As shown, the IMS process may further include a step of placing the IMS head 50 onto the target substrate 1 so that the bottom surface 70a of the head body 70 contacts the target substrate 1 and the opening portion 52b opened at the bottom surface 70a is covered by the target substrate 1. The IMS head 50 is pushed onto the target substrate 1 with appropriate pressure. The state of the opening and closing valve 62 may be the same as the step of initiating the IMS process.

[0101] like Figure 8C As shown, the IMS process may further include a step of supplying the molten solder 54 from the tank 60 to the opening 52b of the head body 70. In the process of supplying the molten solder 54 to the opening 52b, the on-off valve 62 is opened, and the inactive gas flows from the positive pressure line to the tank 60 via the on-off valve 62, and the molten solder 54 contained in the tank 60 is pressed into the first connecting channel 52a, the opening 52b, and the two second connecting channels 52c and 52d in sequence. The opening 52b of the IMS head 50 is completely filled with the molten solder 54. Since the porous material components 80a and 80b connected to the opening 52b allow gas to flow, the porous material components 80a and 80b discharge the gas flowing out of the opening 52b to the surrounding environment when the molten solder 54 is transferred. After the opening 52b of the IMS head 50 is completely filled with the molten solder 54, the on-off valve 62 can be opened and connected to the surrounding environment.

[0102] like Fig. 9A As shown, the IMS process may further include a step of discharging the molten solder 54 from the opening 52b (opening 70b) of the IMS head 50 to the target substrate 1 while scanning the IMS head 50 on the target substrate 1 in a horizontal plane. In the process of discharging the molten solder 54 from the opening 52b, the on-off valve 62 is opened and connected to the positive pressure line to apply pressure to the upper surface of the molten solder 54 in the tank 60. After the IMS scan is completed, the on-off valve 62 is opened and connected to the surrounding environment.

[0103] like Fig. 9BAs shown, the IMS process may further include a step of transferring the molten solder 54 filled in the opening 52b to the tank 60 of the IMS head 50 while bringing the gas into the opening 52b through the porous members 80a, 80b. In the step of transferring the molten solder 54 to the tank 60, the opening and closing valve 62 is opened and connected to the vacuum (negative pressure) line. The solder in the flow channel 52 is attracted and returned to the tank 60 through the flow channel 52, and the gas in the gap of the internal space 60a of the tank 60 is released to the outside of the IMS head 50 through the opening and closing valve 62.

[0104] like Fig. 9C As shown, after the transfer of the molten solder 54 to the tank 60 is completed, the space of the opening portion 52b becomes empty. The IMS process may include the step of sealing the tank 60 with the opening and closing valve 62 closed in response to the transfer of the molten solder from the opening portion 52b to the tank 60. Alternatively, the IMS process may include the step of evacuating the tank 60 with the opening and closing valve 62 at least partially opened and connected to a vacuum line.

[0105] The IMS process then returns to Fig. 8A Refer again to the steps shown in Fig. 8A The IMS process may further include the step of lifting the IMS head 50 from the target substrate 1 in response to the can 60 being sealed or vacuumed. During the lifting of the IMS head 50, the target substrate 1 is exchanged with the new target substrate by moving the IMS head 50 out of the target substrate 1, replacing the target substrate 1 with a new target substrate, and moving the IMS head 50 onto the new target substrate.

[0106] The IMS head 50 according to another exemplary embodiment has been described as having one tank 60 and two porous members 80a, 80b. However, the number of tanks in the IMS head 50 is not limited to one. In other embodiments, the IMS head 10 may have two or more tanks. In addition, the number of porous members 80 is not limited to two. In other embodiments, the IMS head 10 may have or three or more porous members 80. For example, the IMS head may include one tank and one porous member, and the opening portion has a first end R connected to one connection channel further connected to one tank and a second end L connected to another connection channel further connected to one porous member 80.

[0107] In addition, the IMS head 50 according to another exemplary embodiment has been described as having porous members 80a, 80b as members that allow gas to flow through. However, in other embodiments, instead of using the porous member 80, a simpler member (such as one or more small holes) can be formed at the position where the porous member 80 has been described in the aforementioned embodiment (for example, the top or side of the head body 70). In the present embodiment, the gas is sucked into the opening portion 52a through one or more small holes. Preferably, such small holes can prevent molten solder from passing through the hole. Such one or more holes can be used as a member connected to the opening portion 52b and allowing gas to flow into and out of the opening portion 52b, especially when the molten solder is transferred between the opening portion 52b and the first tank 60. Note that in other embodiments, the IMS head 50 may have a heating member surrounding one or more small holes to prevent the small holes from being blocked.

[0108] In still other embodiments, instead of forming one or more small holes at the top surface of the head body 70, a concave can extending from the end of the opening portion 52b and connected to the outside of the head body 70 may be formed in the buffer layer on the surface of the head body 70. In this case, a hole is opened on one side of the head body 70 (e.g., the edge of the buffer layer). It is expected that such a can is closed when the IMS head 50 is pushed on the target substrate 1 by an appropriate pressure, and is opened when the pressure of the IMS head 50 pushing on the target substrate 1 is weakened. Such a can can play the role of a member connected to the opening portion 52b and allowing gas to flow into and out of the opening portion 52b.

[0109] In still other embodiments, instead of using the porous member 80, an extension tube equipped with an on-off valve at one end thereof may be attached to the position where the porous member 80 has been described as being located in the above-mentioned embodiment. The extension tube may be connected to the second connecting channel 52c / 52d further connected to the opening portion 52b. The extension tube may have a predetermined length as long as the volume of the void in the extension tube is maintained so that the molten solder does not reach the on-off valve even when pressure is applied during scanning. Such an extension tube may be used as a member connected to the opening portion 52b and allowing gas to flow into and out of the opening portion 52b.

[0110] Refer to a series of Fig. 10A , 10B and 10C and Fig.11A and 11B , describing a related IMS head for injecting molten solder and a related IMS process.

[0111] Fig. 10A , 10B10C and 10C show views of a related IMS head 500. The related IMS head 500 includes a tank 510 for storing molten solder and a head body 520 for contacting a target substrate. The head body 520 has a bottom surface 520a for contacting a target substrate and a slit opening 520b opened at the bottom surface 520a. The tank 510 has an inner space 510a for storing molten solder. The inner space 510a of the tank 510 is in fluid communication with the slit opening 520b.

[0112] Fig.11A and Fig. 11B 1 shows a cross-sectional view of the related IMS head 500 in each step of the related IMS process. During the scanning or contact of the related IMS head 500 on the target substrate 530, the molten solder 540 is maintained in the slit opening 500a and the inner space 510a of the tank 510. In order to scan the next substrate, the IMS head 500 is raised and the next substrate is placed on the platform. However, as Fig. 11B As shown, during the raising of the IMS head 500, the molten solder 540 still exists in the slit opening portion 500a, and a part of the molten solder in the IMS head 500 will drip from the slit opening 500a, as shown in FIG. Fig. 11B 540a is depicted in FIG. 5. To avoid this, a vacuum function may be employed. However, when the slit shape is wide and long, the molten solder 14 will drip even with a sack back function.

[0113] With respect to the related IMS head, since at least one member is configured to allow gas to flow into and out of the opening portion of the head body for discharging molten solder, the space of the opening portion can be smoothly and easily vacated by transferring the molten solder into the tank while bringing gas into the opening portion via the at least one member. Therefore, dripping of the molten solder from the opening portion of the IMS head can be avoided without reducing the processing productivity.

[0114] Since the transfer of the molten solder from the opening portion to the tank can be performed quickly and smoothly even compared to the case where the molten solder solidifies before the IMS head moves, it is expected that the reduction in process productivity is minimized. The solidification of the molten solder will take a relatively long time, which is several minutes empirically, because the entire IMS head having a large heat capacity is also heated to the operating temperature.

[0115] In a preferred embodiment, the opening portion has a slit form, and each of the at least one member is connected to the opening portion at a position away from the middle of the slit, because the slit-shaped opening covers a wide area of ​​the substrate in one scan, the processing productivity can be improved.

[0116] In the above, an injection device, a method, and a material injection system for injecting a material onto a substrate have been described, wherein the material to be injected by the injection device is molten solder, and the injection device is an IMS head 10 or 50 for an IMS process. Despite the above-mentioned features of the injection device, the method and the material injection system are preferred for the IMS process because the injection device for IMS is generally operated at a high temperature. Under such high temperature conditions (for example, Su-3.0Ag-0.5Cu (SAC305) lead-free solder has a melting point of 217 degrees Celsius (solidus temperature) and the IMS head is heated to about 230 degrees Celsius when SAC305 is used), the way to prevent the material from dripping from the opening portion will be limited. The injection device, method, and material injection system according to one or more embodiments of the present invention implement a practical solution to avoid dripping of molten solder from the opening portion during the IMS process.

[0117] However, the injection apparatus, method and material injection system are not limited to the aforementioned IMS head, IMS process and IMS system, and any injection apparatus, method and material injection system for injecting any liquid or paste material into a target substrate is contemplated. Such fluids or pastes may include molten plastics, conductive pastes, which may include a suspension of conductive particulate material in a background fluid material, to name a few.

[0118] Having described advantages achieved with respect to one or more specific embodiments according to the present invention, it should be understood that some embodiments may not have these potential advantages and that these potential advantages are not necessarily included in all embodiments.

[0119] The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that when the terms "comprises" and / or "comprising" are used in this specification, they specify the presence of the features, steps, layers, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, layers, elements, parts and / or combinations thereof.

[0120] The corresponding structures, materials, acts, and equivalents of all means or step plus function elements (if any) in the following claims are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of one or more aspects of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed.

[0121] Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope of the described embodiments. The terms used herein are selected to best explain the principles of the embodiments, the practical application or technical improvement over technology found in the marketplace, or to enable those of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. An injection device for injecting a material, the device comprising: Tanks, for storing materials; a head body having a surface for contacting with a substrate and an opening portion opened at the surface, the opening portion being used to discharge the material in fluid communication with the tank; as well as at least one member connected to the opening, the at least one member allowing gas to flow into and out of the opening, Wherein, the at least one member includes a second tank, and the second tank is equipped with a valve for opening and closing a passage between the second tank and the outside.

2. The injection device according to claim 1, wherein: The opening portion has a slit form, and each of the at least one member is connected to the opening portion at a position away from a middle of the slit.

3. The injection device according to claim 2, wherein: The head body includes a first connection channel connected to the tank and a second connection channel connected to the second tank, and the opening portion has a first end connected to the first connection channel and a second end connected to the second connection channel.

4. The injection device according to claim 2, wherein: Each of the at least one member includes a porous member that allows the gas to flow therethrough while separating the gas from the material.

5. The injection device according to claim 4, wherein: The at least one component includes two components, and the head body includes a first connecting channel respectively connected to the tank and two second connecting channels respectively connected to the two components, the first connecting channel is connected to the middle of the opening portion, and the opening portion has a first end and a second end respectively connected to the two second connecting channels.

6. The injection device according to claim 2, wherein: Each of the at least one member includes one or more holes opened at the head body, the one or more holes allowing the gas to flow through the one or more holes.

7. The injection device according to claim 2, wherein: The tank is equipped with a switch element which is configured to be opened or closed and connected to the surrounding environment, a positive pressure line or a vacuum line according to the operating state.

8. The injection device according to claim 2, wherein: The injection device is configured to be scanned on the substrate, and the opening is covered by the substrate and filled with the material.

9. The injection device according to claim 2, wherein: The injection device is configured to be lifted from the base in response to completing the delivery of the material from the opening to the tank and sealing or vacuuming the tank.

10. The injection device according to claim 2, wherein: The material is molten solder, the injection device is an injection molding soldering (IMS) head and the molten solder is injected into a hole or cavity formed at a surface of the substrate.

11. A method for injecting a material, the method comprising: placing an injection device on a substrate, the injection device comprising a tank for storing a material; a head body having a surface in contact with the substrate and an opening portion opened at the surface and covered by the substrate; and at least one member connected to the opening portion, the at least one member allowing gas to flow therethrough, wherein the at least one member includes a second tank provided with a valve for opening and closing a passage between the second tank and the outside, the gas being brought into the opening portion through the valve and the second tank; discharging the material from the opening; and While introducing gas into the opening portion through the at least one member, the material filled in the opening portion is transported to the tank of the injection device.

12. The method according to claim 11, wherein: The opening portion has a slit form, and each of the at least one member is connected to the opening portion at a position away from a middle of the slit.

13. The method according to claim 12, wherein: Each of the at least one member includes a porous member that allows the gas to flow therethrough while separating the gas from the material, the gas entering into the opening portion through the porous member.

14. The method according to claim 12, wherein: The member includes one or more holes opened at the head body, the one or more holes allowing the gas to flow therethrough, and the gas is introduced into the opening portion through the one or more holes.

15. The method according to claim 12, wherein: The method further comprises: sealing the canister when the switch element is closed or evacuating the canister when the switch element is open in response at least in part to the transfer of material from the opening to the canister; and In response to the can being sealed or evacuated, the injection device is lifted from the base.

16. The method according to claim 12, wherein: The material is molten solder, injecting the material is an injection molding soldering (IMS) process and the molten solder is filled in holes or cavities formed at the surface of the substrate.

17. A material injection system for injecting a material, the system comprising: a platform for receiving a substrate; An injection device, the injection device comprising: Tanks, for storing materials; a head body having a surface in contact with the substrate on the platform and an opening opened on the surface for discharging the material in fluid communication with the tank; and at least one member connected to the opening portion, the at least one member allowing gas to flow into and out of the opening portion, wherein the at least one member includes a second tank equipped with a valve for opening and closing a passage between the second tank and the outside; a position controller for controlling the relative position of the injection device with respect to the substrate on the platform; and A flow controller is configured to control the flow of the material.

18. The material injection system of claim 17, wherein: The opening portion has a slit form, and each of the at least one member is connected to the opening portion at a position away from a middle of the slit.

19. The material injection system of claim 18, wherein: The position controller is further configured to place the injection device onto the substrate, and the flow controller is further configured to discharge the material from the opening portion of the injection device and transport the material filled in the opening portion to the tank of the injection device while introducing the gas into the opening portion via the at least one member.

20. The material injection system of claim 18, wherein: The position controller is further configured to lift the injection device from the substrate in response to the tank being sealed or vacuumed, move the injection device out of the substrate in response to lifting the injection device, and move the injection device onto a new substrate in response to placing a new substrate on the platform.

21. The material injection system of claim 18, wherein: The material injection system further comprises: A positive pressure line is configured to be connected to the tank of the injection device, and during a scan of the injection device, the positive pressure line provides pressure to push the material stored in the tank to the opening.

22. The material injection system of claim 18, wherein: The material is molten solder, the material injection system is an injection molding solder (IMS) system, and the molten solder is filled in a hole or a cavity formed at a surface of the substrate.

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