An adaptive heat storage high thermal conductivity module locking device

Abstract

The present invention provides an adaptive heat storage high thermal conductivity module locking device, comprising a locking strip and a pressure rod, wherein the locking strip comprises a wedge block A, a wedge block B, and a wedge block C connected in sequence, and grooves with two ends through them for installing the pressure rod are provided on the opposite side walls of the wedge block A, the wedge block B, and the wedge block C; the wedge block A, the wedge block B, and the wedge block C are provided with temperature-controlled deformation cavities inside, and the temperature-controlled deformation cavities are filled with phase change materials. On the basis of satisfying the locking module installation function, the present invention can also adaptively handle the application requirements of short-term high heat shock and high thermal conductivity in electronic equipment.

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation structure technology for electronic equipment, and in particular to an adaptive heat storage high thermal conductivity module locking device. Background Art

[0002] As electronic devices develop towards high performance and high integration, the heat transfer efficiency of their structures will directly affect the temperature rise of components within the electronic devices, and thus determine the lifespan and reliability of the electronic devices.

[0003] Currently, most modules in electronic devices are installed in the form of field replaceable modules (LRM), and the typical heat transfer path is components > printed circuit boards / module cold plates > guide rails > chassis > ambient air. The link of printed circuit boards / module cold plates > guide rails is the bottleneck of heat transfer in electronic equipment. In the link of printed circuit boards / module cold plates > guide rails, a locking strip device is usually used for locking installation. The traditional locking strip structure only serves the function of locking the module, and has limited thermal conductivity, which greatly limits the transfer and dissipation of heat in electronic equipment. For electronic equipment with complex working conditions and high heat, there is an urgent need for short-term heat storage and high thermal conductivity. The existing locking strip structure is difficult to meet this application requirement. Summary of the invention

[0004] In view of this, an embodiment of the present disclosure provides an adaptive heat storage high thermal conductivity module locking device, which, in addition to the function of locking the module installation, can also meet the application requirements of being able to adaptively handle short-term high heat shock and high thermal conductivity performance in electronic equipment.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A self-adaptive heat storage high thermal conductivity module locking device comprises a locking strip and a pressure rod, wherein the locking strip comprises a wedge block A, a wedge block B, and a wedge block C connected in sequence, and grooves with two ends penetrating therethrough for installing the pressure rod are provided on the opposite side walls of the wedge block A, the wedge block B, and the wedge block C; temperature-controlled deformation cavities are provided inside the wedge block A, the wedge block B, and the wedge block C, and phase change materials are filled in the temperature-controlled deformation cavities.

[0007] Furthermore, the width of the groove is 0.25-0.5 mm larger than the diameter of the pressure rod.

[0008] Furthermore, the phase change temperature of the phase change material is in the range of 45-60° C., and the phase change volume expansion coefficient is not less than 3%.

[0009] Furthermore, the center offsets of the groove opening positions on the wedge block A and the wedge block C and the groove opening position on the wedge block B are 0.25-0.5 mm respectively.

[0010] Furthermore, the openings of the temperature-controlled deformation chamber are respectively opened on the upper bottom surfaces of the trapezoidal structures of the wedge block A, the wedge block B, and the wedge block C.

[0011] Furthermore, the cavity opening of the temperature-controlled deformation cavity is covered with a memory alloy layer.

[0012] Furthermore, the memory alloy layer is wavy at room temperature.

[0013] Furthermore, it also includes an upper limit plate and a lower limit plate, which are respectively installed at both ends of the locking strip to limit the pressure rod.

[0014] Furthermore, an elastic spring is provided between the lower limit plate and the bottom of the wedge block C.

[0015] Furthermore, a locking screw is included, through which the upper limit plate is fixed to the top of the wedge block A and a locking force is provided.

[0016] The present invention provides an adaptive heat storage high thermal conductivity module locking device, which not only ensures the locking function during module installation, but also can meet the application requirements of adaptively processing short-term high heat shock and high thermal conductivity in electronic equipment, and has reasonable structural design, comprehensive functions and excellent performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A structural view of a device assembly in one embodiment of the present invention;

[0019] Figure 2 A side view of the device assembly structure in one embodiment of the present invention;

[0020] Figure 3 Another side view of the device assembly structure in one embodiment of the present invention;

[0021] Figure 4 A cross-sectional view of a wedge block A part in one embodiment of the present invention;

[0022] Figure 5 for Figure 4 Partial 1-1 view of the middle wedge block A part;

[0023] Figure 6A cross-sectional view of a wedge block B part in one embodiment of the present invention;

[0024] Figure 7 A cross-sectional view of a wedge block C part in one embodiment of the present invention;

[0025] Figure 8 It is a top view of the end surface of the device assembly structure in one embodiment of the present invention. DETAILED DESCRIPTION

[0026] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0027] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure.

[0028] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0029] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present disclosure. The drawings only show components related to the present disclosure rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0030] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0031] Reference Figure 1-Figure 8 , the present invention is described in further detail.

[0032] like Figure 1 As shown, an embodiment of the present disclosure provides an adaptive heat storage high thermal conductivity module locking device, including a locking strip and a pressure rod 4, wherein the locking strip includes a wedge block A1, a wedge block B2, and a wedge block C3 connected in sequence, and also includes an upper limit plate 5, an elastic spring 6, a lower limit plate 7, and a locking screw 8.

[0033] like Figure 2 and Figure 3 As shown, the wedge block A1, wedge block B2, and wedge block C3 are wedge-shaped structures with trapezoidal side surfaces, and grooves 10 with two ends through them for installing the pressure rod 4 are provided on the opposite side walls; the wedge blocks A1, wedge blocks B2, and wedge blocks C3 are provided with temperature-controlled deformation chambers 9 inside, and the temperature-controlled deformation chambers 9 are filled with phase change materials 11. In this embodiment, compared with the setting in the traditional structure that the cavity for installing the pressure rod is provided at the center of the surface of the locking strip, the present embodiment provides grooves on the two opposite side walls of the locking strip for installing the pressure rod, and at the same time, temperature-controlled deformation chambers 9 are provided inside the wedge blocks A1, wedge blocks B2, and wedge blocks C3. The pressure rod 4 causes the wedge blocks A1, wedge blocks B2, and wedge blocks C3 to produce positional offsets to realize the basic locking function of the locking strip, and the phase change material 11 of the temperature-controlled deformation chamber 9 absorbs heat and changes phase to realize the adaptive heat storage function during short-term high heat shock. The phase change material 11 absorbs heat and undergoes phase change, and the phase change of the phase change material 11 in the temperature-controlled deformation cavity 9 undergoes volume expansion, thereby filling the locking gap to achieve high thermal conductivity of the locking strip for heat transfer.

[0034] In practical applications, in order to facilitate the adjustment operation of the pressure rod in the groove, in a preferred implementation manner of this embodiment, the width of the groove 10 is 0.25-0.5 mm larger than the diameter of the pressure rod 4, so that the wedge blocks A1, B2, and C3 can ensure that the pressure rod 4 has sufficient adjustment space within the restricted range of the groove 10 during the locking process.

[0035] The phase change temperature of the phase change material 11 is in the range of 45-60°C, and the phase change volume expansion coefficient is not less than 3%. The phase change material 11 absorbs and stores heat in this temperature range. After the phase change, the volume expands to fill the locking gap, achieving high thermal conductivity and heat transfer performance.

[0036] In the installation structure of the locking strip, the trapezoidal installation structure of the wedge block A and the wedge block C is in opposite directions to the trapezoidal installation structure of the wedge block B. Therefore, the center offsets of the groove opening positions on the wedge block A and the wedge block C and the groove opening positions on the wedge block B are 0.25-0.5 mm, respectively, so that the locking strip can provide sufficient locking offset requirements for the wedge block A1, the wedge block B2, and the wedge block C3 during the locking process.

[0037] like Figure 4-Figure 7 As shown, the openings of the temperature-controlled deformation cavity 9 are respectively opened on the upper bottom surfaces of the trapezoidal structures of the wedge block A1, the wedge block B2, and the wedge block C3. Since the upper bottom surface is the side where the heat transfer gap is generated when the wedge block A1, the wedge block B2, and the wedge block C3 of the locking strip are locked, the openings of the temperature-controlled deformation cavity 9 are respectively opened on their respective upper bottom surfaces, so that when the phase change material 11 undergoes phase change and generates volume expansion, the heat transfer gap is filled through the opening of the upper bottom surface, thereby ensuring its high thermal conductivity.

[0038] In a preferred implementation of this embodiment, the cavity opening of the temperature-controlled deformation cavity 9 is covered with a memory alloy layer 12, which is used to seal the phase change material 11 in the temperature-controlled deformation cavity 9. Figure 5 As shown, the memory alloy layer 12 is wavy at room temperature. When the phase change material 11 undergoes phase change transformation from solidification to liquefaction, its volume is relatively reduced and increased. Correspondingly, the memory alloy layer 12 needs to have a surface area that can be reduced and increased during sealing. Therefore, the wavy design is used to form the surface area adjustable function of the memory alloy layer 12.

[0039] The locking device of this embodiment also includes an upper limit plate 5 and a lower limit plate 7, which are respectively installed at the two ends of the locking strip to limit the pressure rod 4. An elastic spring 6 is also provided between the lower limit plate 7 and the bottom of the wedge block C3 to provide a reaction force during the locking and loosening of the locking strip, which is helpful for disassembly. A locking screw 8 is also included. Figure 8 As shown, the upper limit plate 5 is fixed to the top of the wedge block A1 by the locking screw 8 and provides a locking force.

[0040] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An adaptive heat storage high thermal conductivity module locking device, comprising a locking strip and a pressure rod, wherein the locking strip comprises a wedge block A, a wedge block B, and a wedge block C connected in sequence, characterized in that: The wedge blocks A, B and C are provided with grooves with two ends through them for installing the pressure rods on the opposite side walls; the wedge blocks A, B and C are provided with temperature-controlled deformation cavities inside, and the temperature-controlled deformation cavities are filled with phase change materials; The width of the groove is 0.25-0.5 mm larger than the diameter of the pressure rod; The phase change temperature of the phase change material is in the range of 45-60°C, and the phase change volume expansion coefficient is not less than 3%; The center offsets of the groove opening positions on the wedge block A and the wedge block C and the groove opening position on the wedge block B are 0.25-0.5 mm respectively; The openings of the temperature-controlled deformation chamber are respectively opened on the upper bottom surfaces of the trapezoidal structures of the wedge block A, the wedge block B, and the wedge block C; The cavity opening of the temperature-controlled deformation cavity is covered with a memory alloy layer; the memory alloy layer is wavy at room temperature; It also includes an upper limit plate and a lower limit plate, which are respectively installed at both ends of the locking strip to limit the pressure rod; it also includes a locking screw, through which the upper limit plate is fixed to the top of the wedge block A and provides a locking force.

2. The adaptive heat storage high thermal conductivity module locking device according to claim 1 is characterized in that: An elastic spring is also provided between the lower limit plate and the bottom of the wedge block C.

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