Wafer inspection equipment

By using a driving mechanism to drive the photoelectric sensor to move between the initial and detection positions on both sides of the flat side in the wafer detection device, the problem of unstable detection results and inability to adapt to wafers of different sizes in the prior art is solved, and the different Accurate detection and stability of size wafers.

CN113885090BActive Publication Date: 2025-01-10上海广川科技有限公司

Patent Information

Application Number
CN202111002062.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-08-30
Publication Date
2025-01-10
Estimated Expiration
2041-08-30

AI Technical Summary

Technical Problem

The existing wafer detection devices are prone to misjudgment under the influence of the environment and cannot adapt to different types of wafer storage devices, resulting in unstable detection results and inability to correspond to wafers of different sizes.

Method used

A detection component including a base, linear slide rail, a driving mechanism, a photoelectric sensor and a connecting rod is designed. The photoelectric sensor is driven to move back and forth between the initial and detection positions on both sides of the flat side through the driving mechanism, and adjust the distance to suit wafer boxes and wafers of different sizes.

Benefits of technology

Accurate detection of wafers of different sizes is achieved, the stability and adaptability of detection is improved, and the flexibility of wafer boxes and wafers of different opening sizes is able to flexibly deal with wafers.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a wafer detection device, wherein one end of a first / second connecting rod is jointly pivoted to a movable end of a driving mechanism, and the other end is correspondingly pivoted to one end of a third / fourth connecting rod, the other end of the third / fourth connecting rod is fixedly connected to the first / second slider and the first / second photoelectric sensor, the first / second slider is slidably connected to a linear slide rail, the driving mechanism drives the movable end to move vertically forward and backward relative to the linear slide rail, and drives the first / second connecting rod, the third / fourth connecting rod and the first / second slider, and links the first / second photoelectric sensor to move back and forth between the corresponding first / second initial position and the corresponding first / second detection position, thereby realizing a change in the distance between the first photoelectric sensor and the second photoelectric sensor, so as to flexibly correspond to the detection of wafers of different sizes in wafer boxes with different opening sizes.
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Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more specifically, to a wafer detection device. Background Art

[0002] Before cutting, the silicon rod will be determined by X-Ray diffraction or parallel light diffraction to determine the crystallization direction of the surface, and marked with a flat edge (Flat), and then cut into wafers. The flat edge plays a positioning role in IC manufacturing, processing and handling equipment. The transmission of wafers between various stations in various IC (integrated circuit) equipment is the basis for the normal operation of the equipment. During the production process, the wafer needs to be moved between different production sites. Therefore, the wafer is often placed in a wafer box to facilitate the transportation of the wafer to a specific production station. Whether the wafer exists in a certain station is a prerequisite for ensuring that the wafer can be accurately transmitted. At present, various IC devices rely on various manipulators to transfer wafers, and whether the wafer is at a certain station is determined by the manipulator. The station itself does not have a wafer in-situ detection function.

[0003] The wafer detection device in the prior art uses a reflective sensor to emit light at a certain angle to the wafer, and then receives the reflected light from the edge of the wafer to confirm whether there is a wafer. Although this solution can correspond to different types of wafer storage devices, it is affected by the environment, such as the presence of wafers at the workstation, and the detection result is often misjudged as no wafer, and there is a problem of unstable detection results. It is also possible to use a through-beam sensor to emit light on one side of the wafer and receive light on the other side of the wafer to determine whether there is a wafer by shading the wafer. Although this solution can accurately detect whether there is a wafer in the wafer storage device, it cannot correspond to different types of wafer storage devices.

[0004] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Summary of the invention

[0005] The purpose of the present invention is to overcome the above-mentioned defects in the prior art and to provide a wafer detection device to achieve accurate detection of wafers of different sizes.

[0006] To achieve the above-mentioned purpose, the present invention provides a wafer detection device, characterized in that it includes: a wafer box, one side of which is provided with an opening, the wafer is horizontally arranged in the wafer box from the opening, and the flat edge is adjacent to the opening; a detection component, including a base, a linear slide rail, a driving mechanism, a first / second photoelectric sensor, a first / second slider, a first / second connecting rod, and a third / fourth connecting rod, the linear slide rail and the driving mechanism are fixedly connected to the base, and the linear slide rail is perpendicular to the active end of the driving mechanism, the first / second photoelectric sensors, the first / second sliders, the first / second connecting rods, and the third / fourth connecting rods are symmetrically arranged relative to the active end of the driving mechanism, and one end of the first / second connecting rod is jointly pivotally connected to the active end of the driving mechanism end, and the other end corresponds to one end of the third / fourth connecting rod, the other end of the third / fourth connecting rod is distributed and fixedly connected to the first / second slider and the first / second photoelectric sensor, the first / second slider is slidably connected to the linear slide rail, the driving mechanism drives the movable end to move vertically forward and backward relative to the linear slide rail, and drives the first / second connecting rod, transmits the third / fourth connecting rod, the first / second slider, and links the first / second photoelectric sensor to move back and forth between the corresponding first / second initial position and the corresponding first / second detection position; wherein the first / second detection positions corresponding to the first / second photoelectric sensors are arranged on both sides of the flat edge, and the flat edges on the same side are separated by the first / second preset margins.

[0007] Preferably, the opening has two opposite sides, and the flat edges on the same side are separated by a first spacing and a second spacing, the first spacing is greater than the first preset margin, and the second spacing is greater than the second preset margin.

[0008] Preferably, the first preset margin is equal to the second preset margin, and the first spacing is equal to the second spacing.

[0009] Preferably, it also includes a control unit, which is electrically connected to the driving mechanism and the photoelectric sensor, and provides a first signal and a second signal to the driving mechanism; wherein the driving mechanism receives the first signal or the second signal, drives the movable end to move vertically backward or forward relative to the linear slide rail, and drives the first / second connecting rod, and transmits the third / fourth connecting rod, the first / second slider and the first / second photoelectric sensor to move from the corresponding first / second detection position to the corresponding first / second initial position, or move from the corresponding first / second initial position to the corresponding first / second detection position.

[0010] Preferably, it also includes a manipulator, and the base is fixedly connected to the manipulator; wherein,

[0011] The opening runs through the top to the bottom of the wafer box, and a plurality of wafers are stacked in the wafer box from top to bottom from the opening, and each of the wafers has a flat edge and the same diameter. The control unit provides a third / fourth signal to the robot, and the robot receives the third signal and moves up and down relative to each wafer and drives the detection component to move synchronously, and receives the fourth signal and moves forward and backward relative to each wafer and drives the detection component to move synchronously.

[0012] Preferably, the diameter of the wafer includes one of 2 inches, 3 inches, 4 inches, 6 inches, 8 inches and 12 inches.

[0013] Preferably, the first photoelectric sensor or the second photoelectric sensor emits light, and the second photoelectric sensor or the first photoelectric sensor receives the light.

[0014] Preferably, the first photoelectric sensor and the second photoelectric sensor are both provided with a light emitting element and a light receiving element, the light emitting element emits light, the light is emitted to the wafer, and is reflected to the corresponding light receiving element.

[0015] Preferably, it also includes an end effector, which is opposite to the detection component and fixedly connected to the manipulator; the first / second photoelectric sensors are respectively located at the corresponding first / second initial positions, and the control unit also provides a fifth signal to the manipulator, and the manipulator receives the fifth signal and drives the end effector and the detection component to rotate 180° relative to the manipulator, driving the end effector or the detection component to be adjacent to the opening.

[0016] The driving mechanism includes a telescopic cylinder, an air inlet pipe and an air outlet pipe. Compressed gas is connected from the air inlet pipe to the air inlet of the telescopic cylinder and pushes the movable end forward, or is discharged from the exhaust port of the telescopic cylinder to the air outlet pipe and pulls the movable end backward.

[0017] It can be seen from the above technical scheme that the present invention drives the movable end to move vertically forward and backward relative to the linear slide rail through a driving mechanism, and drives the first / second connecting rod, the third / fourth connecting rod, the first / second slider and the first / second photoelectric sensor, and the first / second photoelectric sensor moves back and forth between the corresponding first / second initial position and the corresponding first / second detection position respectively; the first / second detection positions corresponding to the first / second photoelectric sensors are respectively arranged on both sides of the flat edge, and the flat edges on the same side are separated by the first / second preset margins, thereby realizing the distance change between the first photoelectric sensor and the second photoelectric sensor, so as to flexibly correspond to the detection of wafers of different sizes in wafer boxes with different opening sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic structural diagram of an initial state of a detection component of a wafer detection device according to an embodiment of the present invention is shown;

[0020] Figure 2 A structural schematic diagram showing a detection state of a detection component of a wafer detection device according to an embodiment of the present invention is shown;

[0021] Figure 3 A schematic diagram of a wafer inspection device according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0022] To make the content of the present invention more clear and understandable, the content of the present invention is further described below in conjunction with the accompanying drawings of the specification. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0023] It should be noted that in the following specific embodiments, when describing the embodiments of the present invention in detail, in order to clearly represent the structure of the present invention for the convenience of explanation, the structures in the accompanying drawings are not drawn according to general proportions, and are partially enlarged, deformed and simplified. Therefore, it should be avoided to understand this as a limitation of the present invention.

[0024] In order to make the purpose, technical scheme and advantages of the present invention clearer, the following further combines Figure 1 and Figure 2 To explain, Figure 1 As shown, a wafer inspection device of the present invention includes a wafer box and an inspection component.

[0025] A wafer box has an opening on one side, and the wafer is horizontally placed in the wafer box from the opening, and the flat edge is adjacent to the opening. In this embodiment, the opening runs from the top to the bottom of the wafer box, and a plurality of wafers are stacked from top to bottom in the wafer box from the opening, and each of the wafers has a flat edge and the same diameter. In another embodiment, the wafer is placed on a workbench, and the placement method and position of the wafer are not limited, and are mainly based on specific needs.

[0026] The detection assembly includes a base, a linear slide rail, a driving mechanism, a first / second photoelectric sensor, a first / second slider (not shown), a first / second connecting rod, and a third / fourth connecting rod.

[0027] In which, the linear slide rail and the driving mechanism are fixedly connected to the base, and the linear slide rail is perpendicular to the movable end of the driving mechanism, the first / second photoelectric sensors, the first / second sliders, the first / second connecting rods and the third / fourth connecting rods are symmetrically arranged relative to the movable end of the driving mechanism, and the third / fourth connecting rods are perpendicular to the linear slide rail, one end of the first / second connecting rod is pivotally connected to the movable end of the driving mechanism at an angle, and the other end is correspondingly fixedly connected to one end of the third / fourth connecting rod, the other end of the third / fourth connecting rod is fixedly connected to the first / second slider and the first / second photoelectric sensor, the first / second sliders are slidably connected to the linear slide rail, the driving mechanism drives the movable end to move forward and backward vertically relative to the linear slide rail, and drives the first / second connecting rod, transmits the third / fourth connecting rod and the first / second slider, and links the first / second photoelectric sensor to move back and forth between the corresponding first / second initial position and the corresponding first / second detection position respectively.

[0028] Specifically, Figure 1 and Figure 2 As shown, the first / second connecting rods and the third / fourth connecting rods are symmetrically arranged with respect to the movable end of the driving mechanism, the third / fourth connecting rods are perpendicular to the linear slide rail, one end of the first / second connecting rods is pivotally connected to the movable end of the driving mechanism at an angle, the angle is greater than or equal to 0° and less than or equal to 180°, the first / second connecting rods are connected to the movable end of the driving mechanism to form a Y shape, and the first / second connecting rods push the corresponding third / fourth connecting rods to move linearly along the linear slide rail. The driving mechanism drives the movable end to move forward and backward vertically relative to the linear slide rail, and drives the third / fourth connecting rods to transmit the first / second slider, and links the first / second photoelectric sensor to move back and forth between the corresponding first / second initial position and the corresponding first / second detection position, respectively. The first / second detection positions corresponding to the first / second photoelectric sensor are respectively arranged on both sides of the flat edge, and the flat edges on the same side are separated by the first / second preset margins to achieve the distance change between the first / second photoelectric sensors.

[0029] In the same wafer box, each of the wafers has a flat edge and has the same diameter. The diameter of the wafer includes one of 2 inches, 3 inches, 4 inches, 6 inches, 8 inches and 12 inches. The flat edge of each wafer is adjacent to the opening. The first / second detection positions corresponding to the first / second photoelectric sensors are respectively arranged on both sides of the flat edge, and the flat edges on the same side are separated by a first / second preset margin. The opening has two opposite sides, and the flat edges on the same side are separated by a first spacing and a second spacing. The first spacing is greater than the first preset margin, and the second spacing is greater than the second preset margin. The first spacing is greater than the first preset margin, and the second spacing is greater than the second preset margin.

[0030] Specifically, the first / second photoelectric sensors are respectively located at the corresponding first / second detection positions, and are respectively adjacent to the flat edge on the same side, and are correspondingly separated by the first / second preset margins, and are respectively arranged between the opening and the gap between the wafers. The wafer sizes between different wafer boxes are different, and therefore, the flat edge sizes are also different. Therefore, the distance between the first / second photoelectric sensors is adjusted by the driving mechanism to achieve the fixation of the first / second preset margins, so as to flexibly correspond to the detection of wafers of different sizes.

[0031] The driving mechanism and the photoelectric sensor are electrically connected via a control unit, and a first signal and a second signal are provided to the driving mechanism.

[0032] Specifically, the driving mechanism receives the first signal or the second signal, drives the movable end to move vertically backward or forward relative to the linear slide rail, and drives the first / second connecting rod, and transmits the third / fourth connecting rod, the first / second slider and the first / second photoelectric sensor. The first / second photoelectric sensor moves from the corresponding first / second detection position to the corresponding first / second initial position, or moves from the corresponding first / second initial position to the corresponding first / second detection position.

[0033] The first photoelectric sensor or the second photoelectric sensor emits light, and the second photoelectric sensor or the first photoelectric sensor receives the light; or, the first photoelectric sensor and the second photoelectric sensor are both provided with a light emitting element and a light receiving element, and the light emitting element emits light, and the light is emitted to the wafer and reflected to the corresponding light receiving element. By setting the first / second photoelectric sensors on opposite sides, the determination of the presence / absence of the wafer is realized.

[0034] In this embodiment, the base is fixedly connected to the robot, the opening runs through the top to the bottom of the wafer box, and a plurality of wafers are stacked in the wafer box from top to bottom from the opening, and each of the wafers has a flat edge and the same diameter. The control unit provides a third / fourth signal to the robot, and the robot receives the third signal and moves up and down relative to each wafer and drives the detection component to move synchronously. The robot receives the fourth signal and moves forward and backward relative to each wafer and drives the detection component to move synchronously, thereby realizing the determination of the presence / absence of wafers at different positions in the same wafer box.

[0035] In one embodiment, the end effector is opposite to the detection component and is fixedly connected to the manipulator, the first / second photoelectric sensors are respectively located at the corresponding first / second initial positions, the control unit also provides a fifth signal to the manipulator, the manipulator receives the fifth signal, and drives the end effector and the detection component to rotate 180° relative to the manipulator, driving the end effector or the detection component to be adjacent to the opening. The end effector is used to transfer each wafer into the wafer box, and when the wafer box is full of wafers, the manipulator receives the fifth signal, and drives the end effector and the detection component to rotate 180° relative to the manipulator, driving the end effector away from the opening and the detection component to be adjacent to the opening.

[0036] In this embodiment, the driving mechanism includes a telescopic cylinder, an air inlet pipe and an air outlet pipe. The compressed gas is connected from the air inlet pipe to the air inlet of the telescopic cylinder and pushes the movable end forward, or is discharged from the exhaust port of the telescopic cylinder to the air outlet pipe and pulls the movable end backward.

[0037] The compressed gas may be compressed air or compressed nitrogen, which depends on actual needs and is not limited here.

[0038] The above-described embodiments are only preferred embodiments of the present invention, and the embodiments are not intended to limit the patent protection scope of the present invention. Therefore, any equivalent structural changes made using the description and drawings of the present invention should also be included in the protection scope of the present invention.

[0039] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer inspection device, characterized in that: include: A detection assembly, comprising a base, a linear slide, a driving mechanism, a first / second photoelectric sensor, a first / second slider, a first / second connecting rod, and a third / fourth connecting rod, wherein the linear slide and the driving mechanism are fixedly connected to the base, and the linear slide is perpendicular to the movable end of the driving mechanism, the first / second photoelectric sensors, the first / second sliders, the first / second connecting rods and the third / fourth connecting rods are symmetrically arranged relative to the movable end of the driving mechanism, and the third / fourth connecting rods are perpendicular to the linear slide, one end of the first / second connecting rod is pivotally connected to the movable end of the driving mechanism at an angle, and the other end is correspondingly fixedly connected to one end of the third / fourth connecting rod, the other end of the third / fourth connecting rod is fixedly connected to the first / second slider and the first / second photoelectric sensor, the first / second slider is slidably connected to the linear slide, the driving mechanism drives the movable end to move forward and backward vertically relative to the linear slide, and drives the first / second connecting rod, and transmits the third / fourth connecting rod and the first / second slider, and links the first / second photoelectric sensor to move back and forth between the corresponding first / second initial position and the corresponding first / second detection position respectively; A control unit and a manipulator, wherein the base is fixedly connected to the manipulator, the control unit provides a third / fourth signal to the manipulator, the manipulator receives the third signal and moves up and down relative to each wafer and drives the detection component to move synchronously, and receives the fourth signal and moves forward and backward relative to each wafer and drives the detection component to move synchronously; wherein, The angle is greater than or equal to 0° and less than or equal to 180°.

2. The wafer inspection device according to claim 1, characterized in that: The first / second detection positions corresponding to the first / second photoelectric sensors are arranged on both sides of the flat edge, and the flat edges on the same side are separated by a first / second preset margin; the opening has two opposite sides, and the flat edges on the same side are separated by a first spacing and a second spacing, the first spacing is greater than the first preset margin, and the second spacing is greater than the second preset margin.

3. The wafer inspection device according to claim 2, characterized in that: The first preset margin is equal to the second preset margin, and the first spacing is equal to the second spacing.

4. The wafer inspection device according to claim 1, characterized in that: The control unit is electrically connected to the driving mechanism and the photoelectric sensor, and provides a first signal and a second signal to the driving mechanism; wherein, The driving mechanism receives the first signal or the second signal, drives the movable end to move back or forward vertically relative to the linear slide rail, drives the first / second connecting rod, and transmits the third / fourth connecting rod, the first / second slider and the first / second photoelectric sensor. The first / second photoelectric sensor moves from the corresponding first / second detection position to the corresponding first / second initial position, or moves from the corresponding first / second initial position to the corresponding first / second detection position.

5. The wafer inspection device according to claim 2, characterized in that: The opening runs through from the top to the bottom of the wafer box, and a plurality of wafers are stacked in the wafer box from top to bottom through the opening, and each of the wafers has a flat edge and the same diameter.

6. The wafer inspection device according to claim 5, characterized in that: The diameter of the wafer includes one of 2 inches, 3 inches, 4 inches, 6 inches, 8 inches and 12 inches.

7. The wafer inspection device according to claim 1, characterized in that: The first photoelectric sensor or the second photoelectric sensor emits light, and the second photoelectric sensor or the first photoelectric sensor receives the light.

8. The wafer inspection device according to claim 1, characterized in that: The first photoelectric sensor and the second photoelectric sensor are both provided with a light emitting element and a light receiving element. The light emitting element emits light, and the light is emitted to the wafer and reflected to the corresponding light receiving element.

9. The wafer inspection device according to claim 5, characterized in that: It also includes an end effector, which is opposite to the detection component and fixedly connected to the manipulator; the first / second photoelectric sensors are respectively located at the corresponding first / second initial positions, and the control unit also provides a fifth signal to the manipulator, and the manipulator receives the fifth signal and drives the end effector and the detection component to rotate 180° relative to the manipulator, driving the end effector or the detection component to be adjacent to the opening.

10. The wafer inspection device according to claim 1, characterized in that: The driving mechanism includes a telescopic cylinder, an air inlet pipe and an air outlet pipe. Compressed gas is connected from the air inlet pipe to the air inlet of the telescopic cylinder and pushes the movable end forward, or is discharged from the exhaust port of the telescopic cylinder to the air outlet pipe and pulls the movable end backward.

Citation Information

Patent Citations

  • Wafer detection device

    CN217133393U

  • Wafer alignment device

    JP2010074108A

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