Braided circuit board and method for manufacturing the same

Abstract

The present invention provides a woven circuit board, comprising: a carrier, the carrier is an insulating material, in a sheet shape, and has a first surface and a second surface; a conductor, the conductor is arranged on the first surface; an insulating wire, the insulating wire penetrates the carrier from the second surface, and the insulating wire passes through the conductor at the first surface and then bends and penetrates the carrier to reach the second surface, so that the conductor is located between the insulating wire and the carrier. The present invention also provides a method for manufacturing a woven circuit board, comprising: sewing the first surface and the second surface of a sheet-shaped, insulating material carrier using insulating wire and conductor; arranging the conductor on the first surface of the carrier; the insulating wire penetrates the carrier from the second surface to the first surface and then crosses the conductor to form a cross shape to press the conductor toward the carrier, and the insulating wire retreats to the second surface, and after the insulating wire moves a certain distance, this step is repeated; to form a carrier layer with conductors. Accordingly, weaving is performed according to the circuit diagram without etching, thereby saving conductor costs and eliminating etching processes.

Description

Technical Field

[0001] The invention relates to the field of circuit boards, and in particular to a braided circuit board.

[0002] The invention relates to the field of circuit board manufacturing, and in particular to a method for manufacturing a braided circuit board. Background Art

[0003] The existing copper clad laminate (CCL) technology is to laminate prepreg (PP) and conductor (such as copper foil) sheets in different layers, and then press them in a vacuum press to form a substrate, and then further etch them according to the circuit shape of the printed circuit board (PCB) to finally obtain the required circuit board pattern. In the process of forming the printed circuit board circuit, most of the conductor components are etched and lost. At the same time, the cutting process after the copper clad laminate is pressed will also cause loss of copper foil, resulting in great waste. Summary of the invention

[0004] The technical problem to be solved by the present invention is: how to reduce the waste of conductors in the process of manufacturing circuit boards.

[0005] In order to solve the above technical problems, the present invention provides a braided circuit board, which aims to reduce the waste of conductors in the process of manufacturing the circuit board. The structure of the circuit board provided by the present invention can avoid the waste of conductors (such as copper, gold, etc.).

[0006] In order to achieve the above object, the present invention provides a braided circuit board, comprising:

[0007] A carrier, the carrier is an insulating material, in a sheet shape, and has a first surface and a second surface;

[0008] A conductor, the conductor is arranged on the first surface;

[0009] The insulating wire penetrates the carrier from the second surface, passes through the conductive wire at the first surface, is bent, and then penetrates the carrier to reach the second surface, so that the conductive wire is located between the insulating wire and the carrier.

[0010] Preferably, the carrier is electronic glass fiber cloth or prepreg, and the prepreg is formed by coating electronic glass fiber cloth with glue and drying it.

[0011] Preferably, the insulating wire is electronic glass fiber sewing thread;

[0012] The conductive wire is a metal sewing wire, and the material is one or more selected from copper, silver, nickel, or gold, or one or more selected from alloys of copper, silver, nickel, or gold.

[0013] Preferably, the carrier with the conductive wires and the insulated wires sewn thereon is defined as a carrier layer with the conductive wires, and the first and second surfaces of the carrier layer with the conductive wires are coated with an insulating glue, dried, heated, pressed and cured, or covered with a semi-cured sheet and heated, pressed and cured.

[0014] Preferably, the carrier with wires and insulated wires sewn thereon is defined as a carrier layer with wires, and the number of the carrier layers with wires is at least two. At least two layers of the carrier layers with wires are stacked, and insulating glue is applied between two adjacent layers of the carrier layers with wires and on the outermost first and second surfaces of all the stacked carrier layers with wires, and then dried, heated, pressed and cured, or covered with a semi-cured sheet and heated, pressed and cured.

[0015] In order to solve the above technical problems, the present invention provides a method for manufacturing a braided circuit board, the purpose of which is to manufacture a circuit board with the above structure.

[0016] In order to achieve the above object, the present invention also provides a method for manufacturing a braided circuit board, comprising:

[0017] Sewing is performed on the first and second sides of a sheet-like, insulating material carrier using insulating threads and conductive wires,

[0018] Arranging a conductive line on a first side of the carrier,

[0019] The insulated wire penetrates the carrier from the second side to the first side and then crosses the wire to form a cross shape to press the wire toward the carrier. The insulated wire then returns to the second side. After the insulated wire moves a certain distance, this step is repeated.

[0020] Used to form a carrier layer with conductive lines.

[0021] Preferably, a computer-controlled sewing machine is used for sewing, and the pattern of the circuit diagram is input into the computer;

[0022] Using electronic glass fiber cloth or prepreg as a carrier, wherein the prepreg is formed by coating the electronic glass fiber cloth with glue and drying it;

[0023] Electronic glass fiber sewing thread is used as the insulating thread and is set at the upper needle of the sewing machine;

[0024] A metal sewing thread selected from one or more of copper, silver, nickel, or gold, or one or more of their alloys is used as a guide wire and is arranged at the lower shuttle of the sewing machine;

[0025] The sewing machine drives the carrier to move according to the pattern of the circuit diagram, and the upper needle drives the insulated wire. The upper needle penetrates the carrier from the second side to the first side and can be withdrawn to the second side. The lower shuttle outputs the wire to form a coil when the upper needle withdraws, and the wire is sewn on the carrier by the insulated wire, and finally forms a wire pattern of the circuit diagram;

[0026] The individual conductors of the carrier layer are sewn according to the conductor paths in the respective circuit diagrams to form the carrier layer with the conductors.

[0027] Preferably, the electronic glass fiber cloth is woven using electronic glass fibers as warp and weft.

[0028] Preferably, insulating glue is coated on both sides of the carrier layer with the conductors, and then dried, heated, pressed and cured in a hot press, or covered with a prepreg, and then heated, pressed and cured in a hot press.

[0029] Preferably, at least two carrier layers with conductive wires are stacked, and insulating glue is applied between two adjacent carrier layers with conductive wires and on the outermost sides of all the stacked carrier layers with conductive wires, and then dried, heated, pressed and cured in a hot press, or covered with a semi-cured sheet and then heated, pressed and cured in a hot press.

[0030] Compared with the prior art, the present invention provides a woven circuit board, comprising: a carrier, the carrier is an insulating material, in a sheet shape, having a first surface and a second surface; a conductor, the conductor is arranged on the first surface; an insulating wire, the insulating wire penetrates the carrier from the second surface, and the insulating wire passes through the conductor at the first surface and then bends and penetrates the carrier to reach the second surface, so that the conductor is located between the insulating wire and the carrier. The present invention also provides a method for manufacturing a woven circuit board, comprising: sewing the first surface and the second surface of a sheet-shaped, insulating material carrier using insulating wire and conductor; arranging the conductor on the first surface of the carrier; the insulating wire penetrates the carrier from the second surface to the first surface and then crosses the conductor to form a cross shape to press the conductor toward the carrier, the insulating wire retreats to the second surface, and after the insulating wire moves a certain distance, this step is repeated; to form a carrier layer with conductors. Accordingly, the technical effect that can be achieved by the present invention is that weaving is performed according to the circuit diagram without etching, thereby saving conductor costs and eliminating etching processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic structural diagram of a carrier layer with conductive wires of a braided circuit board provided by the present invention is shown.

[0032] Figure 2 A schematic structural diagram of a first embodiment of a braided circuit board provided by the present invention is shown.

[0033] Figure 3A schematic structural diagram of a second embodiment of a braided circuit board provided by the present invention is shown.

[0034] Description of reference numerals:

[0035] 1 Carrier

[0036] 11 Page 1

[0037] 12 Side 2

[0038] 2 Wires

[0039] 3 Insulated wire

[0040] 4 Carrier layer with conductors

[0041] 41 Page 1

[0042] 42 Side 2

[0043] 411 The first outermost side

[0044] 42n The second outermost side

[0045] 5a Glue

[0046] 5b Prepreg. DETAILED DESCRIPTION

[0047] The specific implementation modes of the present invention are described in detail below with reference to the accompanying drawings.

[0048] See also Figure 1 As shown, the braided circuit board provided by the present invention comprises: a carrier 1, which is an insulating material, in a sheet shape, and has a first surface 11 and a second surface 12. A conductor 2, which is arranged on the first surface 11. An insulating wire 3, which penetrates the carrier 1 from the second surface 12, and the insulating wire 3 passes through the conductor 2 at the first surface 11, then bends and penetrates the carrier 1 to reach the second surface 12, so that the conductor 2 is located between the insulating wire 3 and the carrier 1. Figure 1 As shown, in order to show the positional relationship between the conductor 2, the carrier 1, and the insulating wire 3, a decomposition display is performed. In practice, the insulating wire 3 is as shown in FIG. Figure 1 By slightly tightening the structure shown, the wire 2 can be fixed on the first surface 11 of the carrier 1 .

[0049] The carrier 1 is electronic glass fiber cloth.

[0050] Alternatively, the carrier 1 is a prepreg, which is formed by coating an electronic glass fiber cloth with glue and drying it.

[0051] The insulating wire 3 is electronic glass fiber sewing wire.

[0052] The conductor 2 is a metal sewing thread, and its material is one or more selected from copper, silver, nickel, or gold, or one or more selected from alloys of copper, silver, nickel, or gold.

[0053] See also Figure 2 As shown, the carrier 1 sewn with the conductor 2 and the insulating wire 3 is defined as the carrier layer 4 with the conductor. On the first surface 41 and the second surface 42 of the carrier layer 4 with the conductor, an insulating glue 5a is applied, dried, heated, pressed and cured, or covered with a prepreg 5b for heating, pressing and curing. The insulating glue 5a and the prepreg 5b act as insulators to insulate the outer surface of the conductor 2 from the non-exposed part.

[0054] See also Figure 3 As shown, the carrier 1 sewn with the conductor 2 and the insulating wire 3 is defined as a carrier layer 4 with the conductor, and the number of the carrier layers 4 with the conductor is at least two. Figure 3 The figure shows that the number of layers is 2 (n layers), at least two carrier layers 4 with conductive wires are stacked, and between two adjacent carrier layers 4 with conductive wires and on the outermost first surface 411 and the outermost second surface 42n of all the stacked carrier layers 4 with conductive wires, an insulating glue 5a is applied, dried, heated, pressed and cured, or covered with a semi-cured sheet 5b and heated, pressed and cured.

[0055] See also Figure 1 As shown, the manufacturing method of the braided circuit board provided by the present invention comprises the following steps.

[0056] Insulating threads 3 and conductive threads 2 are sewn onto a first surface 11 and a second surface 12 of a sheet-like carrier 1 made of insulating material.

[0057] Conductors 2 are arranged on a first side 11 of the carrier 1 .

[0058] The insulating wire 3 penetrates the carrier 1 from the second surface 12 to the first surface 11 and then crosses the wire 2 to form a cross shape to press the wire toward the carrier 1. The insulating wire 3 then retreats to the second surface 12. After the insulating wire 3 moves a certain distance, this step is repeated.

[0059] Used to form a carrier layer 4 with conductive lines.

[0060] See also Figure 1 As shown, a computer-controlled sewing machine is used for sewing, and the pattern of the circuit diagram is input into the computer.

[0061] Electronic glass fiber cloth or prepreg is used as a carrier, wherein the prepreg is formed by coating the electronic glass fiber cloth with glue and drying it.

[0062] Electronic glass fiber sewing thread is used as the insulating thread and is set at the upper needle of the sewing machine.

[0063] A metal sewing thread formed by selecting one or more of copper, silver, nickel, or gold or selecting one or more of their alloys is used as a guide wire and is arranged at the lower shuttle of the sewing machine.

[0064] The sewing machine drives the carrier 1 to move according to the pattern of the circuit diagram, and the upper needle drives the insulating wire 3. The upper needle penetrates the carrier from the second side 12 to the first side 11 and can retreat to the second side 12. The lower shuttle outputs the conductor 2 to form a coil when the upper needle retreats, and the conductor is sewn onto the carrier by the insulating wire, finally forming the conductor pattern of the circuit diagram.

[0065] The individual conductors 2 of the carrier layer are sewn according to the conductor paths in the respective circuit diagrams, so as to form the carrier layer 4 with the conductors.

[0066] Electronic glass fiber cloth is woven with electronic glass fiber as warp and weft.

[0067] An insulating glue 5a is coated on both sides of the carrier layer 4 with the conductors, and then dried, heated, pressed and cured in a hot press, or covered with a prepreg 5b and then heated, pressed and cured in a hot press.

[0068] At least two carrier layers 4 with conductive wires are stacked, and insulating glue 5a is applied between two adjacent carrier layers 4 with conductive wires and on the outermost sides 411, 42n of all the stacked carrier layers with conductive wires, and then dried, heated, pressed and cured in a hot press, or covered with a semi-cured sheet 5b and then heated, pressed and cured in a hot press.

[0069] The above is a specific embodiment of the braided circuit board and the manufacturing method thereof provided by the present invention. Accordingly, the technical effect that can be achieved by the present invention is that the conductor etching process and conductor cutting in the printed circuit board process are eliminated, the circuit board manufacturing process is shortened, a large amount of cost is saved, and the waste of conductors (including precious metals such as copper and gold) is avoided, and the generation of pollutants such as etching waste liquid is also avoided.

[0070] The above specific embodiments and accompanying drawings are only used to illustrate the technical solutions and technical effects of the present invention, and are not used to limit the present invention. Any person skilled in the art who is familiar with the technology can modify or change the above embodiments within the scope of the claims without violating the technical principles and spirit of the present invention, and all of them belong to the scope of protection of the present invention.

Claims

1. A braided circuit board, characterized in that: Include: A carrier, wherein the carrier is an insulating material, and the carrier is an electronic glass fiber cloth or a prepreg, and is in a sheet shape, and has a first surface and a second surface; A conductor wire is arranged on the first surface, the conductor wire is a sewing thread, and the conductor wire is output through a lower shuttle of a sewing machine; The insulating thread is a sewing thread, which is driven by the upper needle of the sewing machine. The sewing machine drives the carrier to move according to the pattern of the circuit diagram. The upper needle drives the insulating thread. The upper needle penetrates the carrier from the second side to the first side and can be withdrawn to the second side. The wire output by the lower shuttle is located in the coil formed when the upper needle is withdrawn, so that the wire is located between the insulating thread and the carrier.

2. The braided circuit board according to claim 1, characterized in that: The semi-cured sheet is formed by coating electronic glass fiber cloth with glue and drying it.

3. The braided circuit board according to claim 1, characterized in that: The insulating thread is electronic glass fiber sewing thread; The conductive wire is a metal sewing wire, and the material is one or more selected from copper, silver, nickel, or gold, or one or more selected from alloys of copper, silver, nickel, or gold.

4. The braided circuit board according to claim 1, characterized in that: The carrier sewn with conductive wires and insulated wires is defined as a carrier layer with conductive wires. On the first and second surfaces of the carrier layer with conductive wires, insulating glue is coated, dried, heated, pressed and cured, or covered with a semi-cured sheet and heated, pressed and cured.

5. The braided circuit board according to claim 1, characterized in that: The carrier sewn with conductive wires and insulated wires is defined as a carrier layer with conductive wires, and the number of carrier layers with conductive wires is at least two. At least two carrier layers with conductive wires are stacked, and insulating glue is applied between two adjacent carrier layers with conductive wires and on the outermost first and second surfaces of all stacked carrier layers with conductive wires, and then dried, heated, pressed and cured, or covered with a semi-cured sheet and heated, pressed and cured.

6. A method for manufacturing a braided circuit board, characterized in that: Include: Using electronic glass fiber cloth or prepreg as a carrier, using insulating wire and conducting wire to sew on the first side and the second side of the carrier of sheet-like insulating material; The sewing is done using a computer-controlled sewing machine, and the pattern of the circuit diagram is input into the computer; The wire is arranged at the lower shuttle of the sewing machine, and the wire is arranged on the first side of the carrier; The insulating thread is arranged at the upper needle of the sewing machine. The sewing machine drives the carrier to move according to the pattern of the circuit diagram. The upper needle drives the insulating thread. The upper needle penetrates the carrier from the second side to the first side and can be withdrawn to the second side. The lower shuttle outputs the conductor to form a coil when the upper needle withdraws. The conductor is sewn on the carrier by the insulating thread. After the insulating thread moves a certain distance, this step is repeated. Finally, the conductor pattern of the circuit diagram is formed. Used to form a carrier layer with conductive lines.

7. The method for manufacturing a braided circuit board according to claim 6, characterized in that: The prepreg comprises electronic glass fiber cloth coated with glue and dried; Electronic glass fiber sewing thread is used as the insulating thread; A metal sewing thread formed by one or more selected from copper, silver, nickel, or gold, or one or more selected from an alloy of copper, silver, nickel, or gold is used as the conductor; The individual conductors of the carrier layer are sewn according to the conductor paths in the respective circuit diagrams to form the carrier layer with the conductors.

8. The method for manufacturing a braided circuit board according to claim 7, characterized in that: Electronic glass fiber cloth is woven with electronic glass fiber as warp and weft.

9. The method for manufacturing a braided circuit board according to claim 6, characterized in that: Insulating glue is coated on both sides of the carrier layer with the conductors, and the layers are dried, heated, pressed and cured in a hot press, or covered with a prepreg, and heated, pressed and cured in a hot press.

10. The method for manufacturing a braided circuit board according to claim 6, characterized in that: At least two carrier layers with conductive wires are stacked, and insulating glue is applied between two adjacent carrier layers with conductive wires and on the outermost sides of all stacked carrier layers with conductive wires, and then dried, heated, pressed and cured in a hot press, or covered with a semi-cured sheet and heated, pressed and cured in a hot press.

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