A power drive device with both heat dissipation and vibration damping functions

Abstract

A power driving device with both heat dissipation and vibration damping functions, comprising a power driving printed circuit board, a flexible heat-conducting film, a mounting substrate, a lower support pressing plate, a heat-conducting insulating pad I, a heat-conducting insulating pad II, a power device, a phase-change base heat pipe heat storage plate, and a shock absorber; the power driving printed circuit board is welded on the power device and supported by connecting pillars located at the four corners; one equivalent end of the flexible heat-conducting film is pressed between the power device and the phase-change base heat pipe heat storage plate, and the other end is connected between the lower support pressing plate and the mounting substrate through the lower support pressing plate; the shock absorber is installed between the phase-change base heat pipe heat storage plate and the mounting substrate. The present invention provides a driving device that can not only achieve heat dissipation but also has good environmental adaptability, enabling the power driving device to transfer the generated heat outward, and at the same time, the structure has anti-vibration and anti-shock capabilities.

Description

Technical Field

[0001] The present invention belongs to the technical field of automatic control, and particularly relates to a driving device that can dissipate heat for a motor power driving device and can also damp the entire driving assembly. Background Art

[0002] With the development of motor technology and the application market, the miniaturization and integration design of motors have become the trend of technological development. Integrating devices such as driving and control with the motor structure body can achieve the integration, miniaturization, and light weight of products.

[0003] With the rapid development of electronics and power technology in terms of high integration, high reliability, and high performance, it has become possible to realize the integrated design of control, driving devices, and the motor mechanism body.

[0004] The power driving device consists of three major parts: a power driving printed circuit board, power devices, and a heat sink. The power driving printed circuit board integrates a power amplification circuit, a collection circuit, a sensing circuit, etc., and is used to receive control command signals and drive the motor to operate. As the core component, the power device is composed of multiple groups of switching devices to achieve AC-DC current conversion, and is usually a device with relatively high heat generation.

[0005] Since the power driving device has a large power and high heat generation, the heat generation of the device must be considered. Usually, the traditional method is to attach the power device to the wall (case) for heat dissipation, and the wall (case) serves as the heat sink.

[0006] However, motors are widely used in high-vibration and high-overload applications such as airplanes, high-speed trains, and weapons. The electronic components and power device bonding wires in the power driving device have poor resistance to vibration, shock, and other environmental conditions. Traditional power driving devices are mostly independent products with independent external structures, separated from the motor, and the two are connected by cables. In high-vibration and high-overload applications, vibration damping devices (such as rubber or springs) are added to the outer wall (case) surface of the power driving device.

[0007] If the driving assembly and the motor are integrally designed, the vibration damping and heat dissipation of the driving assembly are urgent problems to be solved. It is necessary to achieve both good heat dissipation and vibration damping and shock resistance for the driving assembly. However, to achieve vibration damping, displacement is required to absorb energy, and to have good heat dissipation conditions, the power device needs to be closely attached to the heat dissipation housing to reduce the thermal resistance, and there is a certain contradiction between the two.

[0008] After consulting a lot of information, there is currently no good method that can simultaneously achieve vibration reduction of power devices to adapt to the characteristics of the mechanical environment and meet the problem of heat transfer under high power load. Usually in industrial applications, integrated design drive components are often placed close to heat sinks to solve the heat dissipation problem, without considering the vibration reduction of components. Or a few low-power products only focus on vibration reduction without considering the heat generation problem. There is no good measure to achieve that the drive components can maintain good heat dissipation conditions and make the product have anti-vibration performance. Summary of the invention

[0009] The present invention proposes a driving device solution that has both heat dissipation and vibration reduction functions. The heat dissipation conditions of the power driving device are fully considered, and the product can have anti-vibration and anti-impact performance, which can greatly improve the environmental adaptability of the product and expand the application occasions of the product.

[0010] Working principle: A power drive device with both heat dissipation and vibration reduction functions, characterized in that it includes a power drive printed circuit board, a flexible thermally conductive film, a mounting substrate, a lower supporting pressure plate, a thermally conductive insulating pad I, a thermally conductive insulating pad II, a power device, a phase change-based heat-spreading heat storage plate, and a vibration damper; the power drive printed circuit board is welded on the power device and supported by connecting pillars located at the four corners; the thermally conductive insulating pad I is located between the power device and the flexible thermally conductive belt; one end of the flexible thermally conductive belt is pressed between the thermally conductive insulating pad I and the phase change-based heat-spreading heat storage plate, and the other end is connected between the lower supporting pressure plate and the thermally conductive insulating pad II through the lower supporting pressure plate; the flexible thermally conductive belt is attached with glue on both sides of the mounting parts at both ends for connection; the thermally conductive insulating pad II is located between the flexible thermally conductive belt and the mounting substrate; the vibration damper is installed between the phase change-based heat-spreading heat storage plate and the mounting substrate.

[0011] Furthermore, the flexible thermally conductive film and / or the phase change-based heat-spreading and heat-storing plate and / or the vibration damper conduct or store the heat of the power device to achieve heat transfer.

[0012] Furthermore, the flexible thermally conductive film is a flexible graphite / graphene thermally conductive film, which is stacked in a single layer or multiple layers to achieve outward transfer of heat generated by the power device.

[0013] Furthermore, the flexible thermally conductive film is formed by stacking single-layer flexible thermally conductive films, the number of the single-layer flexible thermally conductive films is between 5 and 15 layers, and glue is attached to both sides of the thermally conductive films and bonded together.

[0014] Furthermore, the flexible thermal conductive belt is wrapped in four directions of the phase change-based heat-spreading and heat storage plate, and an independent heat conduction loop is formed in each direction; the flexible thermal conductive belt is wrapped with a layer of polyimide film on both sides of the uncrimped parts.

[0015] Furthermore, the phase change base heat pipe heat storage plate contains two cavity structures, namely the heat pipe cavity located above the phase change base heat pipe heat storage plate and the heat storage plate cavity located below the phase change base heat pipe heat storage plate; the acetone circulation loop in the heat pipe cavity quickly realizes the uniform distribution of heat to the heat conduction film, and the heat absorption is realized through the paraffin-based phase change material in the heat storage plate cavity, realizing the internal storage of a large amount of heat generated by the power device in a short time.

[0016] Furthermore, the shock absorber is a shock absorber structure with a limit structure, which is composed of a limit tightening screw and a shock absorption pad. The limit tightening screw passes through the middle of the shock absorption pad. The shock absorber plays a role in supporting the driving component, and at the same time, shock-absorbs the phase change base heat pipe heat storage plate together with other components of the power driving device.

[0017] Furthermore, the shock absorption pad is composed of two independent "T"-shaped shock absorption rubber pads, which are respectively connected to the phase change base heat pipe heat storage plate from both sides of the upper and lower surfaces of the phase change base heat pipe heat storage plate. There is a gap between the two shock absorption pads and they do not contact each other; the limit tightening screw is a stepped shaft structure, and its end is provided with a threaded section. The stepped structure plays a limiting role to ensure that the shock absorption pad has a certain compression amount after the screw is tightened, so as to have a certain pre-compression stiffness, and at the same time, the limit step structure will not crush the shock absorption pad due to excessive tightening of the screw.

[0018] Furthermore, the mounting substrate is a motor housing or other outer housing.

[0019] Advantages of the present invention:

[0020] (1) The present invention solves the deficiencies of the prior art and provides a driving device that can not only dissipate heat but also has good environmental adaptability. It can realize the outward transmission of the heat generated by the power driving device, and at the same time, the structure is resistant to vibration and impact.

[0021] (2) The present invention can realize the integrated design of the driving device and the motor body, improve the product integration, and solve the problems of large product weight, large occupied volume and space.

[0022] (3) The present invention uses a flexible graphite / graphene heat conduction film for heat transfer, and the heat conduction film adopts a single-layer or multi-layer stacking method.

[0023] (4) The heat conduction system of the present invention adopts a multi-loop heat conduction belt (graphene heat conduction mold) multi-directional heat transfer path design, which is beneficial to reducing the thermal resistance and enhancing the heat conduction effect. It is more beneficial to achieve the effects of light weight, low stiffness and high thermal conductivity.

[0024] (5) The driving device can conduct or store the heat of the power device through three heat transfer paths: flexible graphite / graphene heat conduction film, heat pipe heat storage plate, and metal shock absorber, maximizing the heat transfer.

[0025] (6) Through the acetone circulation circuit inside the heat pipe, heat can be quickly and evenly distributed to the heat conduction film. The heat absorption is achieved through the paraffin-based phase change material of the heat storage plate, realizing the internal storage of a large amount of heat generated by the power device in a short time.

[0026] (7) The shock absorber is installed between the heat pipe and the outer casing. By integrating shock absorption design inside, the problem of mechanical adaptability of electrical and electronic products is solved.

[0027] (8) Compared with the existing domestic and foreign solutions, this technical solution can enable the product to have both good heat dissipation conditions and better adaptability to the mechanical environment conditions, greatly improving the product reliability, as well as the application fields of the product. Moreover, the basic technology is relatively mature and easy to implement. Description of the Drawings

[0028] Figure 1 Schematic diagram of the composition of the drive device;

[0029] Figure 2 Partially enlarged view of the drive device;

[0030] Figure 3 Schematic diagram of the drive assembly;

[0031] Figure 4 Composition diagram of the multi-loop heat conduction system;

[0032] Figure 5 Schematic diagram of the structure of the flexible heat conduction belt;

[0033] Figure 6 Schematic diagram of the structure of the phase change-based heat pipe heat storage plate;

[0034] Figure 7 Schematic diagram of the principle of the shock absorption structure solution;

[0035] Among them, 1 - power drive printed circuit board, 2 - flexible heat conduction belt, 3 - mounting substrate (or housing), 4 - lower support pressure plate, 5 - heat conduction insulation pad I, 6 heat conduction insulation pad II, 7 - power device, 8 - phase change-based heat pipe heat storage plate, 9 - shock absorber, 9a - limit tightening screw, 9b - shock absorption pad. Detailed Implementation Modes

[0036] Except for the embodiments described below, the present invention can also have other embodiments or be implemented in different ways. Therefore, it should be understood that the present invention is not limited to the detailed situations of the structures of the components described in the following specification or shown in the drawings. When only one embodiment is introduced here, the claims are not limited to that embodiment.

[0037] A power driving device with both heat dissipation and vibration damping functions, comprising a power driving printed circuit board 1, a flexible heat conducting belt 2, a mounting substrate 3, a lower support pressing plate 4, a heat conducting insulating pad I 5, a heat conducting insulating pad II 6, a power device 7, a phase change base heat pipe heat storage plate 8, and a shock absorber 9;

[0038] The power driving printed circuit board 1 is welded on the power device 7 and supported by connecting pillars at four corners; the heat conducting insulating pad I 5 is located between the power device 7 and the flexible heat conducting belt 2; one end of the flexible heat conducting belt 2 is pressed between the heat conducting insulating pad I 5 and the phase change base heat pipe heat storage plate 8, and the other end is connected between the lower support pressing plate 4 and the heat conducting insulating pad II 6 through the lower support pressing plate 4; the flexible heat conducting belt 2 is attached with glue on both sides of the installation parts at both ends for connection; the heat conducting insulating pad II 6 is located between the flexible heat conducting belt 2 and the mounting substrate 3; the shock absorber 9 is installed between the phase change base heat pipe heat storage plate 8 and the mounting substrate 3. As Figure 1 、 Figure 2 and Figure 3 shown.

[0039] The flexible heat conducting belt 2 and / or the phase change base heat pipe heat storage plate 8 and / or the shock absorber 9 conduct or store the heat of the power device 7 to maximize heat transfer.

[0040] The flexible heat conducting belt 2 is a flexible graphite / graphene heat conducting film, which adopts a single-layer or multi-layer stacking method to minimize the heat transfer link, reduce the contact thermal resistance, and realize the outward transfer of the heat generated by the power device 7.

[0041] The flexible heat conducting belt 2 is composed of a single-layer flexible heat conducting film stacked, and the number of the single-layer flexible heat conducting films is between 5 and 15 layers. The two sides of the heat conducting film are attached with glue, and the heat conducting films are bonded together by a reasonable process method.

[0042] The flexible heat conducting belt 2 wraps around the phase change base heat pipe heat storage plate 8 in four directions, and each direction forms an independent heat conducting loop. As Figure 3 、 Figure 4 shown. The flexible heat conducting belt 2 is wrapped with a layer of polyimide film on both the front and back sides of the non-crimped part to play a role in protection and preventing foreign matters. As Figure 5 shown

[0043] The phase change base heat pipe heat storage plate 8 contains two cavity structures, a heat pipe cavity located above the phase change base heat pipe heat storage plate 8 and a heat storage plate cavity located below the phase change base heat pipe heat storage plate 8; the acetone circulation loop in the heat pipe cavity quickly realizes the uniform distribution of heat to the heat conducting film, and the heat absorption is realized through the paraffin-based phase change material in the heat storage plate cavity, realizing the internal storage of a large amount of heat generated by the power device in a short time. As Figure 6 shown.

[0044] The shock absorber 9 is a shock absorber structure with a limit structure, and the shock absorption design is integrated inside. It is composed of a limit tightening screw 9a and a shock absorption pad 9b. The limit tightening screw 9a passes through the middle of the shock absorption pad 9b and is tightened on the mounting substrate 3. The shock absorber 9 plays a role in supporting the drive assembly, and at the same time, dampens the phase change base heat sink plate 8 and other components of the entire power drive device together, solving the mechanical adaptability problem of electrical and electronic products, such as Figure 7 shown.

[0045] The shock absorption pad 9b is composed of two independent "T"-shaped structural shock absorption rubber pads, which are respectively connected to the phase change base heat sink plate 8 from both sides of the upper and lower surfaces of the phase change base heat sink plate 8. There is a gap between the two shock absorption pads 9b and they do not contact each other. The structural dimensions of the shock absorption pad 9b can be reasonably adjusted according to the specific load weight and structure to achieve a satisfactory shock absorption effect. The limit tightening screw 9a has a stepped shaft structure, and its end is provided with a threaded section. The stepped structure plays a limiting role to ensure that the shock absorption pad 9b has a certain compression amount after the screw is tightened, so as to have a certain pre-compression stiffness. At the same time, the limit step structure will not crush the shock absorption pad 9b due to excessive tightening of the screw.

[0046] The power drive device adopts a loop heat conduction belt design, which is beneficial to reducing the thermal resistance and enhancing the heat conduction effect. The two ends of the multi-loop flexible heat conduction belt 2 are of special-shaped structures, ensuring that the multi-loop heat conduction does not overlap with each other. By adopting a multi-directional heat transfer path, the effects of light weight, low stiffness, and high thermal conductivity are achieved. The flexible heat conduction belt 2 and the mounting substrate 3 can also adopt other suitable mounting forms. Such as Figure 4 shown.

[0047] The phase change base heat sink plate 8 can have other shapes according to the needs of the structural layout. The shock absorber 9 can be installed at other positions on the phase change base heat sink plate 8 and connected to the mounting substrate 3.

[0048] The mounting substrate 3 can be a motor housing or other shaped housings.

[0049] For the method proposed in the above-mentioned present invention, various improvements can also be made without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the appended claims.

Claims

1. A power drive device with both heat dissipation and vibration damping functions, characterized in that, It includes a power drive printed circuit board, a flexible heat-conducting film, a mounting substrate, a lower support pressing plate, a heat-conducting insulating pad I, a heat-conducting insulating pad II, a power device, a phase-change base heat pipe heat storage plate, and a shock absorber; the power drive printed circuit board is welded on the power device and supported by connecting pillars located at the four corners; the heat-conducting insulating pad I is located between the power device and the flexible heat-conducting belt; one end of the flexible heat-conducting belt is pressed between the heat-conducting insulating pad I and the phase-change base heat pipe heat storage plate, and the other end is connected between the lower support pressing plate and the heat-conducting insulating pad II through the lower support pressing plate; the flexible heat-conducting belt is attached with glue on both sides of the installation parts at both ends for connection; the heat-conducting insulating pad II is located between the flexible heat-conducting belt and the mounting substrate; the shock absorber is installed between the phase-change base heat pipe heat storage plate and the mounting substrate; the flexible heat-conducting film and / or the phase-change base heat pipe heat storage plate and / or the shock absorber conduct or store the heat of the power device to achieve heat transfer; the flexible heat-conducting film is a flexible graphite / graphene heat-conducting film, and is adopted in a single-layer or multi-layer stacking manner to realize the outward transfer of heat generated by the power device. The flexible heat-conducting film is formed by stacking single-layer flexible heat-conducting films, and the number of the single-layer flexible heat-conducting films is between 5 and 15 layers. Glue is attached to both sides of the heat-conducting film and bonded together; the flexible heat-conducting belt wraps around the phase-change base heat pipe heat storage plate in four directions, and an independent heat-conducting loop is formed in each direction; the flexible heat-conducting belt is wrapped with a layer of polyimide film on both the front and back sides at the non-crimped part.

2. The power driving device according to claim 1, characterized in that, The phase-change base heat pipe heat storage plate contains two cavity structures, a heat pipe cavity located above the phase-change base heat pipe heat storage plate and a heat storage plate cavity located below the phase-change base heat pipe heat storage plate; the acetone circulation loop in the heat pipe cavity quickly realizes the uniform distribution of heat to the heat-conducting film, and the heat absorption is realized through the paraffin-based phase-change material in the heat storage plate cavity to realize the internal storage of a large amount of heat generated by the power device in a short time.

3. The power driving device according to claim 1, wherein, The shock absorber is a shock absorber structure with a limiting structure, which is composed of a limiting tightening screw and a shock-absorbing pad. The limiting tightening screw passes through the middle of the shock-absorbing pad. The shock absorber plays a role in supporting the driving assembly, and at the same time dampens the phase-change base heat pipe heat storage plate together with other components of the power drive device.

4. The power driving device according to claim 3, wherein The shock-absorbing pad is composed of two independent "T"-shaped shock-absorbing rubber pads, which are connected to the phase-change base heat pipe heat storage plate from both sides of the upper and lower surfaces of the phase-change base heat pipe heat storage plate respectively. There is a gap between the two shock-absorbing pads and they do not contact each other; the limiting tightening screw is a stepped shaft structure, and its end is provided with a threaded section. The stepped structure plays a limiting role to ensure that the shock-absorbing pad has a certain compression amount and a certain pre-compression stiffness after the screw is tightened, and at the same time the limiting stepped structure will not crush the shock-absorbing pad due to excessive tightening of the screw.

5. The power driving device according to claim 4, characterized in that The mounting substrate is a motor housing or other external housing.

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