Handling Kit Housing System

Abstract

A process kit housing system includes: a surface for enclosing an interior volume, a first support structure including a first fin, a second support structure including a second fin, and a front interface for engaging the process kit housing system with a load port of a wafer processing system. The first fin and the second fin are sized and spaced to hold a process kit ring carrier and a process kit ring in the interior volume. Each process kit ring is secured to one of the process kit ring carriers. The process kit housing system enables a first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit housing system to the wafer processing system, and a second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system to the process kit housing system.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to apparatus and methods for replacing a process kit ring in a processing chamber, such as a processing chamber used in a wafer processing system, and more particularly to a housing for holding a process kit ring. Background Art

[0002] Semiconductor processing and other electronic component processing often utilizes platforms that utilize robotic arms to transport objects (such as wafers) between processing chambers, from storage areas (e.g., front-opening pods (FOUPs)) to processing chambers, from processing chambers to storage areas, and so forth. A processing system (such as a wafer processing system) includes one or more processing chambers for processing substrates. Gases may be used to etch substrates within the processing chambers (e.g., substrates may be etched while being electrostatically clamped and positioned within the etching chamber). One or more process rings may surround the substrates (e.g., to protect one or more portions of the processing chamber, the substrate, etc.). For example, an annular member (referred to as an edge ring or process ring) is positioned immediately outside the outer diameter of the substrate to protect the upper surface of a chuck (e.g., an electrostatic chuck) supporting the substrate from etching chemicals. Process rings are made from several different materials and can have various shapes, both of which affect process uniformity near the process rings. During processing, the process rings may change shape as they etch over time, which in turn can cause changes in process uniformity.

[0003] To address changes in process uniformity due to degradation of the process set ring, the process set ring is replaced on a scheduled basis. Conventionally, to replace the process set ring, an operator opens the process chamber to access the process set ring inside, manually removes and replaces the process set ring, and closes the process chamber. While the process chamber is open, the process chamber and the processing system may become contaminated with cells, hair, dust, etc. The process chamber and / or the processing system then undergo a revalidation procedure that can render the process chamber and / or the processing system inoperable for days to weeks. This impacts production line throughput, schedules, quality (e.g., in response to adding variables to the system), etc. Summary of the Invention

[0004] To provide a basic understanding of some aspects of the present disclosure, the following is a simplified summary of the present disclosure. This summary is not an extensive overview of the present disclosure. It is not intended to identify key or critical elements of the present disclosure, nor is it intended to delineate any scope of the specific embodiments of the present disclosure or any scope of the claims. Its sole purpose is to introduce some concepts of the present disclosure in a simplified form as a prelude to the more detailed description that will be presented later.

[0005] In one aspect of the present disclosure, a process kit housing system includes a plurality of surfaces to at least partially enclose an interior volume of the process kit housing system. The process kit housing system further includes a first support structure comprising a first plurality of substantially horizontal fins. The process kit housing system further includes a second support structure comprising a second plurality of substantially horizontal fins. The first plurality of substantially horizontal fins and the second plurality of substantially horizontal fins are sized and spaced to hold a plurality of process kit ring carriers and a plurality of process kit rings within the interior volume of the process kit housing system. Each of the plurality of process kit rings can be secured to one of the plurality of process kit ring carriers. The process kit housing system further includes a front interface coupled to one or more of the plurality of surfaces to engage the process kit housing system with a load port of a wafer processing system. The process kit housing system enables a first automated transfer of a first process kit ring carrier holding a first process kit ring from the process kit housing system to the wafer processing system, and a second automated transfer of a second process kit ring carrier holding a second process kit ring from the wafer processing system to the process kit housing system.

[0006] In another aspect of the present disclosure, a method includes coupling a front interface of a process kit housing system to a load port of a wafer processing system. The process kit housing system includes a plurality of process kit ring carriers and a plurality of process kit rings within an interior volume of the process kit housing system. The interior volume is enclosed by a plurality of surfaces of the process kit housing system, and the front interface is coupled to the plurality of surfaces. Each of the plurality of process kit rings is secured to one of the plurality of process kit ring carriers. Each of the plurality of process kit ring carriers is positioned on a corresponding first substantially horizontal fin of a first plurality of substantially horizontal fins of a first support structure and a corresponding second substantially horizontal fin of a second plurality of substantially horizontal fins of a second support structure. The method further includes utilizing a robotic arm to first automatically transfer the first process kit ring carrier securing the first process kit ring from the process kit housing system to the wafer processing system. The method further includes utilizing the robot or an additional robot to perform a second automated transfer of a second process kit ring carrier holding a used second process kit ring from the wafer handling system to the process kit housing system.

[0007] In another aspect of the present disclosure, a process kit housing system includes a plurality of surfaces that at least partially enclose an interior volume of the process kit housing system. The process kit housing system further includes a first support structure disposed within the interior volume. The process kit housing system further includes a second support structure disposed within the interior volume. The process kit housing system further includes an empty process kit ring carrier disposed on a first substantially horizontal fin of the first support structure and a second substantially horizontal fin of the second support structure. The process kit housing system further includes a plurality of process kit ring carriers disposed on respective substantially horizontal fins of the first and second support structures. The plurality of process kit ring carriers can be positioned above the empty process kit ring carrier in the process kit housing system. A corresponding process kit ring is secured to each of the plurality of process kit ring carriers. The process kit housing system further includes a placement witness wafer disposed on a third substantially horizontal fin of the first support structure and a fourth substantially horizontal fin of the second support structure. The placement verification wafer is positioned above the plurality of process kit ring carriers in the process kit housing system. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The present disclosure is illustrated by way of example (and not by way of limitation) in the figures of the accompanying drawings in which like reference numerals indicate similar components. It should be noted that different references in this disclosure to "an" or "one" embodiment are not necessarily to the same embodiment, and such references mean at least one.

[0009] Figure 1 A processing system according to an aspect of the present disclosure is depicted.

[0010] Figure 2A Depicted is a front view of a process kit housing system according to certain embodiment.

[0011] Figure 2B Depicted is a top view of a process kit housing system according to certain embodiment.

[0012] Figure 2C Depicted is a side view of a process kit housing system according to certain embodiment.

[0013] Figure 2D Depicted is a bottom view of a process kit housing system according to certain embodiment.

[0014] Figure 2E Depicted is a rear view of a process kit housing system according to certain embodiment.

[0015] Figure 2FDepicted are a support structure and retaining device for a process kit housing system according to a certain embodiment.

[0016] Figure 3A A cross-sectional view depicting contents on a fin of a support structure of a processing kit housing system according to certain embodiments.

[0017] Figure 3B Depicted is a cross-sectional view of a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit housing system, according to one embodiment.

[0018] Figure 3C Depicting a top view of a process kit ring carrier on a fin of a support structure of a process kit housing system according to certain embodiments.

[0019] Figure 3D Depicts a top view of a holding device and a process kit ring disposed on a fin of a support structure of a process kit housing system, according to one embodiment.

[0020] Figure 3E A top view of a retaining device for securing a process kit ring disposed on a fin of a support structure of a process kit housing system is depicted, according to one embodiment.

[0021] Figure 4A A cross-sectional view depicting contents on a fin of a support structure of a processing kit housing system according to certain embodiments.

[0022] Figure 4B Depicts a cross-sectional view of a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit housing system, according to certain embodiments.

[0023] Figure 4C Depicting a top view of a process kit ring carrier on a fin of a support structure of a process kit housing system according to certain embodiments.

[0024] Figure 4D Depicts a top view of a holding device and a process kit ring on a process kit ring carrier positioned on a fin of a support structure of a process kit housing system, according to one embodiment.

[0025] Figure 4E A top view of a holding device for securing a process kit ring disposed on a process kit ring carrier on a fin of a support structure of a process kit housing system is depicted, according to one embodiment.

[0026] Figures 4F to 4I A cross-sectional view depicting the contents and fins of a process kit housing system according to certain embodiment.

[0027] Figure 5 A method for process kit ring replacement in a process chamber is depicted according to a certain embodiment. DETAILED DESCRIPTION

[0028] Embodiments described herein relate to a process hood housing system. A process hood ring may surround portions of a substrate and / or substrate support assembly in a process chamber to protect components of the process chamber (e.g., to protect the substrate support assembly). As the substrate is etched by etching chemicals, the process hood ring may degrade over time. A degraded process hood ring results in processing non-uniformities (e.g., non-uniformities in processed substrates, inconsistencies in processing, etc.). To avoid non-uniformities, the process hood ring is periodically replaced. Conventionally, the process chamber is opened to replace the process hood ring. After being opened, the process chamber undergoes a lengthy revalidation process. The revalidation process impacts production line throughput, scheduling, quality, user time, energy usage, etc.

[0029] The apparatus, systems, and methods disclosed herein utilize a process kit housing system (e.g., a front-opening wafer pod (FOUP) configured to house one or more process kit rings) to enable automated replacement of process kit rings (e.g., without opening a process chamber). The process kit housing system may include multiple surfaces to at least partially enclose an interior volume of the process kit housing system. For example, the process kit housing system may include sidewalls, a top cover, a bottom surface, and a door. The process kit housing system may include a front interface (e.g., a door frame, etc.) to engage with a load port (e.g., a port of a factory interface) of a wafer handling system. The door may be attached to the front interface of the process kit housing system for transport, and the door may be removed to engage the front interface with the load port. The process kit housing system may include a first support structure including first approximately horizontal fins and a second support structure including second approximately horizontal fins. The first and second substantially horizontal fins may be sized and spaced to hold contents, such as one or more of: a process kit ring, an empty process kit ring carrier, a process kit ring disposed on a process kit ring carrier, a placed verification wafer, etc. The process kit housing system may enable automated transfer of contents (e.g., a new process kit ring secured on a process kit ring carrier, etc.) into a wafer processing system, and automated transfer of contents (e.g., a used process kit ring secured on a process kit ring carrier, etc.) from a wafer processing system to the process kit housing system.

[0030] The apparatus, system, and method disclosed herein offer advantages over conventional solutions. A process kit housing system can be coupled to a load port of a wafer processing system and enable replacement of a process kit ring without opening the process chamber and without subsequent process chamber revalidation. The load port can be configured to accept different types of housing systems, such as a front-opening pod (FOUP). The load port can be sealed to a front interface of the process kit housing system to prevent contamination from entering the wafer processing system (factory interface) and to prevent hazardous gases from exiting the wafer processing system (factory interface). The process kit housing system can include an empty process kit ring carrier that can be used by a wafer processing system robot to remove a used process kit ring from the wafer processing system and place it within the process kit housing system. The process kit housing system can include a process kit ring that can be used by a robot to replace a used process kit ring in the wafer processing system. The process kit housing system can include a placement verification wafer that can be used by the robot to verify the placement of the process kit ring. The process kit housing system enables removal of the process kit ring, replacement of the process kit ring, and verification of the placement of the process kit ring without opening any process chambers attached to the processing system and without undergoing conventional revalidation procedures for any process chambers. Utilizing the process kit housing system to replace the process kit ring has less impact on production line throughput, schedule, quality, user time, energy usage, etc. than conventional technical solutions.

[0031] Figure 1 A processing system 100 (e.g., a wafer processing system) according to one aspect of the present disclosure is depicted. The processing system 100 includes a factory interface 101 that includes a plurality of load ports 128 to which cassettes (e.g., FOUPs) 102 can be coupled for transferring wafers and / or other substrates into and out of the processing system 100. The factory interface can also include a process kit enclosure system 130 (e.g., a cassette, a FOUP, etc.) coupled to the load ports 128 for transferring contents 110, such as process kit rings, into and out of the processing system 100.

[0032] The load port 128 may include a front interface forming a vertical opening. The load port 128 may also have a horizontal surface. The FOUP may have a front interface forming a vertical opening. The front interface of the FOUP may be sized to engage with the front interface of the load port 128 (e.g., the vertical opening of the FOUP may be approximately the same size as the vertical opening of the load port 128). The FOUP may be placed on the horizontal surface of the load port 128, and the vertical opening of the FOUP may be aligned with the vertical opening of the load port 128. The front interface of the FOUP may be interconnected with the front interface of the load port 128 (e.g., the former may be clamped to, secured to, or sealed to the latter). The bottom panel of the FOUP (e.g., the bottom plate) may have features that engage with the horizontal surface of the load port 128 (e.g., loading features (such as recesses) that engage with load port kinematic pin features, load port datum pin gaps, and / or FOUP docking tray latch clamping features). The processing kit housing system 130 has a front interface that is also sized to engage with the front interface of the load port 128. The process kit housing system 130 can be placed on the horizontal surface of the load port 128 and the vertical opening of the process kit housing system 130 can be aligned with the vertical opening of the load port 128. The front interface of the process kit housing system 130 can be interconnected with the front interface of the load port 128. The process kit housing system 130 has a bottom plate with features for engaging the horizontal surface of the load port 128. The process kit housing system 130 can engage with the same load port 128 used for FOUPs and cassettes containing wafers.

[0033] The process kit housing system 130 can include one or more items of content 110 (e.g., one or more of a process kit ring, an empty process kit ring carrier, a process kit ring disposed on a process kit ring carrier, a placement verification wafer, etc.). For example, the process kit housing system 130 can be coupled to the factory interface 101 (e.g., the load port 128) to enable automated transfer of process kit rings on a process kit ring carrier into the processing system 100 for replacement of a used process kit ring.

[0034] The processing system 100 may also include first vacuum ports 103a, 103b coupling the factory interface 101 to respective degas chambers 104a, 104b. Second vacuum ports 105a, 105b may be coupled to the respective degas chambers 104a, 104b and disposed between the degas chambers 104a, 104b and a transfer chamber 106 to facilitate transfer of wafers and contents 110 (e.g., process kit rings) into the transfer chamber 106. In some embodiments, the processing system 100 includes and / or utilizes one or more degas chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 may include a single degas chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes a plurality of process chambers 107 (e.g., four process chambers 107, a size process chamber, etc.) disposed adjacent to and coupled to the transfer chamber. The processing chamber 107 is coupled to the transfer chamber 106 via a respective port 108 (such as a slit valve, etc.). In some embodiments, the factory interface 101 is at a higher pressure (e.g., atmospheric pressure) while the transfer chamber 106 is at a lower pressure. Each degas chamber 104 (e.g., a load lock chamber, a pressure chamber) may have a first door (e.g., a first vacuum port 103) for sealing the degas chamber 104 from the factory interface 101 and a second door (e.g., a second vacuum port 105) for sealing the degas chamber 104 from the transfer chamber 106. When the first door is open and the second door is closed, contents can be transferred from the factory interface 101 to the degas chamber 104. The first door can be closed, the pressure in the degas chamber 104 can be reduced to match that of the transfer chamber 106, the second door can be opened, and the contents can be transferred out of the degas chamber 104. A local center finder (LCF) device may be used to align the contents of the transfer chamber 106 (eg, before entering the processing chamber 107, after exiting the processing chamber 107).

[0035] The processing chamber 107 may include one or more of the following: an etch chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an annealing chamber, and the like. Some processing chambers 107, such as etch chambers, may include process rings (e.g., edge rings, handle rings, support rings, slip rings, quartz rings, and the like) therein that may occasionally need to be replaced. While conventional systems are associated with an operator disassembling the processing chamber to replace the process rings, the processing system 100 is configured to facilitate replacement of the process rings without requiring an operator to disassemble the processing chamber 107.

[0036] The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 may include a robotic arm and may be (or include) a selective adaptive assembly robotic arm (SCARA) robot, such as a 2-link SCARA robot, a 3-link SCARA robot, a 4-link SCARA robot, or the like. The factory interface robot 111 may include an end effector on one end of the robotic arm. The end effector may be configured to pick up and move specific objects, such as wafers. Alternatively, the end effector may be configured to move objects such as process set rings (edge ​​rings). The factory interface robot 111 may be configured to transfer objects between the cassette 102 (e.g., FOUP) and the stations 104a, 104b.

[0037] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 may include a robotic arm with an end effector at one end. The end effector may be configured to move specific objects, such as wafers. The transfer chamber robot 112 may be a SCARA robot, but in some embodiments may have fewer linkages and / or fewer degrees of freedom than the factory interface robot 111.

[0038] The controller 109 controls various aspects of the processing system 100. The controller 109 can be and / or include a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, or the like. The controller 109 can include one or more processing devices, which can be general-purpose processing devices such as a microprocessor, a central processing unit, or the like. More specifically, the processing device can be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that implements other instruction sets or a combination of instruction sets. The processing device can also be one or more special-purpose processing devices such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), a network processor, or the like. The controller 109 can include data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, a network interface, and / or other components. The controller 109 can execute instructions to perform any one or more of the methods or procedures described herein. The instructions may be stored on a computer-readable storage medium, which may include main memory, static memory, secondary storage, and / or processing devices (during execution of the instructions). In an embodiment, the controller 109 may receive signals from the factory interface robot 111 and the wafer transfer chamber robot 112 and send controls to the factory interface robot 111 and the wafer transfer chamber robot 112.

[0039] Figure 1The transfer of contents 110 (e.g., a process kit ring coupled to a process kit ring carrier) into a process chamber 107 is schematically depicted. In accordance with one aspect of the present disclosure, the contents 110 are removed from the process kit housing system 130 via a factory interface robot 111 located in the factory interface 101. The factory interface robot 111 transfers the contents 110 into the respective degassing chambers 104a, 104b via one of the first vacuum ports 103a, 103b. A transfer chamber robot 112 located in the transfer chamber 106 removes the contents 110 from one of the degassing chambers 104a, 104b via the second vacuum ports 105a or 105b. The transfer chamber robot 112 moves the contents 110 into the transfer chamber 106 where the contents 110 can be transferred to the process chamber 107 via the respective ports 108. Although not shown in FIG. 1 for clarity, the contents 110 are schematically depicted in FIG. Figure 1 Although not shown in FIG. 1 , the transfer of the contents 110 may include the transfer of a process kit ring disposed on a process kit ring carrier, the transfer of an empty process kit ring carrier, the transfer of a placed verification wafer, and the like.

[0040] Figure 1 An example of the transfer of contents 110 is depicted, however, other examples are also contemplated. For example, it is contemplated that the process kit housing system 130 can be coupled to the transfer chamber 106 (e.g., via a load port in the transfer chamber 106). The contents 110 can be loaded from the transfer chamber 106 into the process chamber 107 by a transfer chamber robot 112. Additionally, the contents 110 can be loaded into a substrate support pedestal (SSP). Additional SSPs can be positioned to communicate with the factory interface 101 opposite the depicted SSPs. It is contemplated that processed contents 110 (e.g., spent process kit rings) can be removed from the processing system 100 in a manner reverse to any of the methods described herein. When utilizing multiple processing kit housing systems 130 or a combination of processing kit housing systems 130 and SSPs, it is contemplated that one SSP or processing kit housing system 130 may be used for unprocessed contents 110 (e.g., new processing kit rings) while another SSP or processing kit housing system 130 may be used to receive processed contents 110 (e.g., used processing kit rings).

[0041] In some embodiments, a process kit ring secured to the upper surface of a process kit ring carrier may be stored in the process kit housing system 130, and the factory interface robot 111 may insert its end effector under the process kit ring carrier in the process kit housing system 130, lift the process kit ring carrier, and retract it from the process kit housing system 130 to transport the process kit ring secured to the process kit ring carrier on the robot within the processing system 100. In some embodiments, the process kit ring is stored within the process kit housing system 200 (e.g., not secured to the process kit ring carrier). The factory interface robot 111 may retrieve an empty process kit ring carrier from within the processing system 100 or the process kit housing system 130, and use the empty process kit ring carrier to remove the process kit ring from the process kit housing system 130 to transport the process kit ring secured to the process kit ring carrier within the processing system 100. In some embodiments, the factory interface robot 111 can remove a process kit ring from the process kit housing system 130 and transport the process kit ring within the processing system 100 without using a process kit ring carrier.

[0042] Figure 2A A front view of a process kit housing system 200 is depicted according to one embodiment. Figure 1 In the processing system 100 of FIG. 1 , the processing kit housing system 200 is used to securely hold the processing kit ring 242 and enable replacement of the processing kit ring 242 .

[0043] The process kit housing system 200 includes surfaces to at least partially enclose an interior volume 202 of the process kit housing system 200. The surfaces of the process kit housing system 200 that enclose the interior volume 202 may include one or more of the following: side walls 210 (e.g., right side wall 210A, left side wall 210B, etc.), a bottom surface 212, a bottom plate 214, a top cover 216, a door frame 250 (see FIG. Figure 2C ), and gate 252 (see Figure 2C ). The door 252 of the process kit housing system 200 may be removable. For example, the door 252 may be attached to the process kit housing system 200 for transport of the process kit housing system 200. The door 252 may be removed from the process kit housing system 200 to expose a front interface (e.g., door frame 250) of the process kit housing system 200, which is coupled to one or more surfaces of the process kit housing system 200 to connect the process kit housing system 200 to a wafer processing system (e.g., see FIG. Figure 1 is engaged with a load port of a processing system 100).

[0044] The process kit enclosure system 200 can conform to one or more FOUP standards (e.g., size, weight, interfaces, handling clearance, etc.). For example, the process kit enclosure system 200 can interface with the same load port of a wafer handling system as a substrate FOUP. The process kit enclosure system 200 can weigh less than 35 pounds (lb) to be lifted by one person. The process kit enclosure system 200 can conform to one or more Semiconductor Equipment and Materials International (SEMI) standards (e.g., utilizing a FOUP door according to SEMI E15.1, a load port access platform according to SEMI 47.1, sits on motion pins according to SEMI E57, etc.).

[0045] One or more support structures 230 may be included within the interior volume 202 of the processing kit housing system 200. In some embodiments, two support structures 230 are provided within the interior volume 202 to support the contents (e.g., Figure 1 In some embodiments, three support structures 230 are provided in the interior volume 202 to support the contents (e.g. Figure 1 110) (see, for example, Figure 4C to Figure 4E In some embodiments, four support structures 230 are provided in the interior volume 202 to support the contents (e.g. Figure 1 110) (see, for example, Figure 3C to Figure 3E ). Other numbers of support structures may also be used.

[0046] In some embodiments, the support structure 230 is a comb-like structure. The support structure 230 can be made of plastic (e.g., polyethylene), and reinforcing materials (e.g., carbon fiber filler, one or more vertical rods passing through the reinforcing material of the support structure, etc.) can be provided within the support structure 230. Each support structure 230 can include one or more fins 232 (e.g., nearly horizontal fins) to support the contents. Each item of content can be supported by two or more fins (e.g., fin 232A of support structure 230A and fin 232B of support structure 230B) that are nearly horizontal and nearly parallel to each other. The support structure 230 can support the contents so that the end effector on the robotic arm of the wafer processing system can be inserted under the contents, lift the contents, and retract the contents from the processing kit housing system 200.

[0047] In some embodiments, the processing kit housing system 200 may include two, three, or four support structures 230. The upper surface of the support structure 230 may be connected to the support structure 230 by a bridge bracket 234 (see FIG. Figure 2F) are coupled to each other. The lower surface of the support structure 230 can be coupled to the base plate 214. The upper surface of the fins 232 can include features (e.g., notches, recesses) to engage with a surface (e.g., a sidewall, a lower surface) of the process kit ring carrier 240 near the periphery. For example, the upper surface of each fin 232 can have a recess and the process kit ring carrier 240 can be positioned in the recess. In some embodiments, the fins 232 support the corners of the process kit ring carrier 240 (e.g., where its periphery changes from curved to flat).

[0048] The fins 232 of the support structure 230 can be sized and spaced to provide a gap between the upper surface of the process kit ring 242 and the lower surface of the fins 232 directly above the process kit ring 242, which allows for fin 232 recess height, robot arm droop and tolerances, and tolerances between fins.

[0049] The interior volume 202 of the process kit housing system 200 can include at least one process kit ring 242 (e.g., supported by corresponding fins 232 of the support structure 230) for automated transfer into a wafer processing system. A robotic arm can remove the process kit ring 242 from the process kit housing system 200 for automated transfer into a process chamber of the wafer processing system. The robotic arm can remove a used process kit ring from the process chamber for automated transfer into the process kit housing system 200.

[0050] The process kit ring 242 in the process kit housing system 200 can be secured to the upper surface of the process kit ring carrier 240. The robot can remove the process kit ring 242 from the process kit housing system 200 by inserting an end effector under the process kit ring carrier 240 in the process kit housing system 200, lifting the process kit ring carrier 240 and the process kit ring 242 (e.g., by contacting at least a portion of the upper surface of the end effector with at least a portion of the lower surface of the process kit ring carrier 240), and withdrawing the process kit ring carrier 240 with the process kit ring 242 secured to the upper surface of the process kit ring carrier 240. The spacing between the fins 232 of the support structure 230A and the fins 232 of the support structure 230B allows the end effector to enter the span from the fins 232 of the support structure 230A to the fins 232 of the support structure 230B and lift the contents without contacting the fins 232.

[0051] As described herein, the process kit ring 242 on the process kit ring carrier 240 may refer to one or more process kit rings disposed on the process kit ring carrier 240. For example, the process kit ring 242 may include two or more of the following disposed on the process kit ring carrier 240: an edge ring, a handle ring, a support ring, a slide ring, a quartz ring, and the like.

[0052] In some embodiments, the process kit ring 242 can be positioned directly on the fin 232, and a robot can retrieve the process kit ring carrier 240 (e.g., from within a wafer handling system) to lift the process kit ring 242. In some embodiments, the robot can lift the process kit ring 242 without using the process kit ring carrier 240. One or more process kit rings 242 can be positioned on each process kit ring carrier 240. For example, two or three process kit rings 242 can be nested within each other on the process kit ring carrier 240 (e.g., a first process kit ring having a first diameter, a second process kit ring having a second diameter sized to fit within the first process kit ring, and a third process kit ring having a third diameter sized to fit within the second process kit ring).

[0053] Each support structure 230 can include a plurality of fins 232 sized and spaced to retain the contents of the interior volume 202 of the process kit housing system 200. For example, one or more sets of substantially parallel fins 232 of the support structure 230 can support an empty process kit ring carrier 240 (e.g., a first set of substantially parallel fins 232 supports an empty process kit ring carrier 240A, and a second set of substantially parallel fins 232 supports an empty process kit ring carrier 240B). One or more sets of substantially parallel fins 232 of the support structure 230 can support a process kit ring carrier 240 having a process kit ring 242 secured thereto. In some embodiments, the support structure 230 supports one, two, three, four, five, six, seven, eight, or some other number of process kit ring carriers 240 having corresponding process kit rings 242 secured thereto. In some embodiments, the fins 232 of the support structure 230 support the same number of process kit ring carriers 240 as there are process chambers in the wafer processing system, with the process kit ring carriers 240 having corresponding process kit rings 242 secured thereto. For example, if the wafer processing system has six process chambers, the process kit housing system 200 may include six process kit rings 242 (e.g., secured thereto corresponding process kit ring carriers 240). If the wafer processing system has eight process chambers, the process kit housing system 200 may include eight process kit rings 242 (e.g., secured thereto corresponding process kit ring carriers 240).

[0054] A set of substantially parallel fins 232 of the support structure 230 can support a placement verification wafer 244 (e.g., a multi-function wafer). In some embodiments, the placement verification wafer 244 can be of a similar size to wafers handled by the processing system. The placement verification wafer 244 can be positioned on the set of substantially parallel fins 232 to enable automated transfer of the placement verification wafer 244 into the wafer processing system to verify the placement of the process ring assembly 242 within the wafer processing system. The fins used to support the placement verification wafer 244 can have different spacing and / or dimensions than the fins used to support the process assembly ring and / or process assembly ring carrier.

[0055] Each set of substantially parallel fins 232 can create a recess to support contents. Each of one or more lower recesses (e.g., the lowest recesses) of the process kit housing system 200 can support an empty process kit ring carrier 240. An upper recess (e.g., the top recess) of the process kit housing system 200 can support a placed verification wafer 244. Each of one or more intermediate recesses (e.g., above the empty process kit ring carrier 240 and below the placed verification wafer 244) can support the process kit ring carrier 240 supporting a process kit ring 242. One or more sets of substantially parallel fins 232 (e.g., recesses for the process kit ring 242 on the process kit ring carrier 240) can include a corresponding process kit ring orientation bracket. Each process kit ring orientation bracket can have one or more protrusions (e.g., pins) that engage with a flat portion of the interior surface of the process kit ring 242 to limit movement of the process kit ring 242 (e.g., rotation, movement in the x and y directions, etc.). One or more protrusions of the treatment set ring orientation bracket and one or more features of the treatment set ring carrier 240 (eg, pin contacts, recesses, etc.) may restrict movement of the treatment set ring 242 .

[0056] The robotic arms can remove contents (e.g., an empty process kit ring carrier 240, a process kit ring carrier 240 holding a process kit ring 242) from the lower recess and place used contents in the vacant lower recess to prevent contamination from used contents (e.g., a used process kit ring from a wafer handling system) from falling onto other contents (e.g., a new process kit ring 242, a placed verification wafer 244). For example, one or more robotic arms can remove an empty process kit ring carrier 240A from the first recess, remove a used process kit ring using the empty process kit ring carrier 240A, and replace the now full process kit ring carrier 240A and the supported used process kit ring in the first recess. The robot(s) can then remove a new process kit ring 242C secured to the process kit ring carrier 240C from a third recess above the first and second recesses, place the process kit ring 242C into the process chamber, and then replace the now empty process kit ring carrier 240C back into the third recess. This process can be repeated using the process kit ring carrier 240B, the process kit ring 242D, and the process kit ring carrier 240D for the next process kit ring replacement, and so on.

[0057] The upper section of the process kit housing system 200 may include clean process kit rings 242 and the lower section may include dirty process kit rings 242 and empty process kit ring carriers 240. In some embodiments, the process kit housing system 200 includes one or more object separators. The upper section and the lower section may be separated by a physical separator to prevent contamination. In some embodiments, the dirty process kit rings 242 may be inserted into the process kit housing system 200 below the clean process kit rings 242. In some embodiments, a first process kit housing system 200 may be used for dirty process kit rings 242 and empty process kit ring carriers 240, and a second process kit housing system 200 may be used for clean process kit rings 242.

[0058] One or more handles 222 can be coupled to respective surfaces of the process kit housing system 200 (e.g., an exterior surface, sidewall 210) for transporting the process kit housing system 200. For example, handle 222A can be coupled to sidewall 210A and handle 222B can be coupled to sidewall 210B. The handles 222 can be configured for manual lifting and transport of the process kit housing system 200. In some embodiments, an overhead transfer (OHT) flange is coupled to an exterior surface of the process kit housing system 200 (e.g., top cover 216) for transporting the process kit housing system 200.

[0059] The process kit housing system 200 may include an alignment feature 220 (e.g., coupled to or integral with the bottom surface 212). The alignment feature 220 may be used for robotic calibration. The alignment feature 220 may block a robotic wafer mapper. The alignment feature 220 may identify the process kit housing system 200 as not being a wafer housing system (e.g., not being a conventional FOUP carrying wafers). The alignment feature 220 may identify the process kit housing system 200 as a process kit housing system 200. The alignment feature may identify a specific process kit housing system 200 or the type of contents within the process kit housing system 200. For example, the alignment feature 220 may indicate that the process kit housing system 200 is supporting a process kit ring 242 disposed on a process kit ring carrier 240. In some embodiments, the alignment feature 220 is a simple label, peg, tab, or the like. The factory interface robot can be configured to perform wafer mapping on the contents of a FOUP to determine the number of wafers in the FOUP, the placement of the wafers, and the like. However, the process kit ring and process kit ring carrier may be in an undesirable position different from where the wafers are normally positioned. To perform wafer mapping, the robotic arm can move an end effector or other wafer mapper head to the bottom of the process kit housing system 200 to begin the wafer mapping process. However, the end effector and / or mapper head will encounter an alignment feature 220, which can terminate the wafer mapping process. The presence of the alignment feature 220 can provide a signal to the controller 109 indicating that the process kit housing system 200 is engaged to a load port rather than a conventional FOUP containing wafers. In some embodiments, the process kit housing system 200 includes an alignment feature 220 (e.g., a FOUP type identification feature mapped via an FI (front interface) robot) and / or an auto-calibration feature (e.g., an FI robot auto-calibration feature). The alignment feature 220 can be located near the door frame 250 , and the auto-calibration feature can protrude from a bottom surface near the center of the interior of the process kit housing system 200 (eg, near the bottom plate 214 ).

[0060] In some embodiments, one or more surfaces of the process kit housing system 200 may have a transparent window 218 that enables viewing of the process kit ring carrier 240 and the process kit ring 242. For example, the rear surface of the process kit housing system 200 may have a window 218 (e.g., see FIG. Figure 2A and Figure 2E ) and / or the top cover 216 of the processing kit housing system 200 may have a window 218 (e.g., see Figure 2B ). The window may enable an operator to visually inspect the contents of the process kit housing system to confirm, for example, that the process kit rings and / or process kit ring carriers are properly stored therein.

[0061] Contents entering the process kit housing system 200 from a wafer processing system may have corrosive materials thereon (e.g., hydrogen bromide (HBr)). The process kit housing system 200 may be sealed to the load port of the wafer processing system to prevent the corrosive materials from escaping from the wafer processing system and the process kit housing system 200. The process kit housing system 200 may be sealed to the load port of the wafer processing system for cleaning of the process kit housing system (e.g., decontamination of internal surfaces and features). Any electronic components associated with (e.g., disposed therein, coupled thereto) the process kit housing system (e.g., batteries, communications, sensors, microcontroller units (MCUs), etc.) may be sealed.

[0062] The material of the process kit housing system 200 may be compatible with corrosive substances (e.g., HBr). For example, the material of the process kit housing system 200 may include one or more of the following: polyethylene, acrylonitrile ethylene propylene diene monomer (AEPDM), ethylene propylene diene monomer (EPDM), perfluoroelastomer (FFKM) (e.g., ), fluoroelastomer materials (FKM) (e.g. ), and / or polytetrafluoroethylene (PTFE) (e.g. The process kit housing system 200 may have a purge port (e.g., in the base plate 214, etc.). The purge port may be used for nitrogen purge (e.g., N2 purge). For example, after the spent process kit ring 242 is transferred to the process kit housing system 200, the purge port may be used to remove contaminants from the process kit housing system 200 (e.g., nitrogen is transferred into the process kit housing system 200 to evacuate HBr from the process kit housing system 200, etc.). One or more first purge ports may be used to push gas into the process kit housing system 200, and one or more second purge ports may be used to remove gas from the process kit housing system 200. In some embodiments, the process kit housing system 200 does not have any purge ports.

[0063] The base plate 214 of the process kit housing system 200 may include features (eg, locating pins, mounting holes) to enable the lower surface of the support structure 230 to engage with the base plate 214 (eg, the bottom surface 212 may define corresponding holes for engaging the support structure 230 with the base plate 214).

[0064] The bottom plate 214 may include features (e.g., bearing surfaces) to allow the retaining device 260 (e.g., see Figure 2F ) can be engaged with (eg, rotatably coupled to) the base plate 214.

[0065] The base plate 214 may include features, such as mounting holes, to enable the bottom surface 212 of the process kit housing system 200 to engage with the base plate 214 .

[0066] The base plate 214 may include features (e.g., locating pins, mounting holes) to enable the door frame to engage with the base plate 214 (e.g., engaging the sidewalls of the door frame with the sidewalls of the base plate 214). The base plate 214 may include features (e.g., auto-teaching mounting holes, FOUP docking rail latching features, load port motion pin features, load port reference pin clearances, FOUP presence switch features, etc.) for docking the process kit enclosure system 200 to a wafer processing system (e.g., mounting the base plate 214 on a surface proximate a load port).

[0067] The front interface of the process kit housing system 200 may include a door frame 250 (see Figure 2C , Figure 2A The door frame 250 may not be shown. The door frame 250 may include features (e.g., recesses) to enable the door frame 250 to engage with the base plate 214. The door frame 250 may include features (e.g., threaded inserts, such as screws, that are inserted into channels through the door frame 250 to engage with the sidewalls 210) to enable the door frame 250 to engage with the sidewalls 210 of the process kit housing system 200. The door frame 250 may have features (e.g., sealed load port side clamping features, recesses for receiving clamps from the loading section) to enable the process kit housing system 200 to be sealed to the load port. The door frame 250 and / or the door 252 may include features to couple to each other.

[0068] The processing kit housing system 200 may include a surface to partially enclose the interior volume 202. A portion of the surface may form a housing assembly that is a rectangular prism (e.g., a cube) having a cutout for a transparent window 218 and features. The housing assembly may include a bottom surface 212, sidewalls 210A-210B, a front edge, a top edge, and a rear edge. The front edge of the housing assembly may engage with a door frame. The top edge of the housing assembly may couple with a top cover 216. The top edge of the housing assembly may have a cutout for inserting a support structure 230 into the interior volume 202. The rear edge of the housing assembly may couple with the window 218. The bottom surface 212 may include features (e.g., a pivot pin below a retaining device) for coupling to the retaining device 260. The bottom surface 212 may include features (e.g., a cutout) to allow the support structure 230 to be mounted to the base plate 214. The bottom surface 212 can be coupled to an alignment feature 220 (eg, an identification feature of the process kit housing system 200). In some embodiments, the alignment feature 220 and the bottom surface 212 are integral with one another.

[0069] Figure 2B Depicted is a top view of a process suite housing system 200 according to one embodiment.

[0070] The top cover 216 of the processing kit housing system 200 may include an upper surface and one or more flanges. The top cover 216 may include an offset docking flange for docking to a load port. The upper surface of the top cover 216 may have a window cutout for a transparent window 218. The upper surface of the top cover 216 may be coupled to the housing assembly by one or more fasteners (e.g., fixed thumbscrews). The retaining devices 260 may be higher than the top cover 216 and may be captured by features (e.g., small dimples) on the upper surface of the top cover 216. The bottom (e.g., the lower portion) of each retaining device 260 may be pinned to allow the retaining device 260 to rotate about the z-axis (e.g., and be removed for docking to a load port). Each retaining device 260 may have features (e.g., fins that are approximately horizontal) that prevent contents from escaping from the recess in the fins 232 of the support structure 230. There may be two retaining devices 260, each having an angled inclination (e.g., not 180 degrees). Features (eg, dimples) in the upper surface of the top cover 216 may be sized to receive retention features in a secured position (eg, first rotational state) or in an unsecured position (eg, second rotational state, removed, etc.).

[0071] In some embodiments, the top cover 216 has a docking position (e.g., a flange docked on the same side as the door frame) and a transport position (e.g., a flange docked on the same side as the rear window 218). Fasteners can be used to remove the top cover 216 in the first position and attach it in the second position. Features (e.g., dimples) in the top cover 216 in the transport position can only receive the retaining device 260 in the fixed position. Features (e.g., dimples) in the top cover 216 in the docking position can only receive the retaining device 260 in the unsecured position. In some embodiments, the fixed position is to rotate the retaining device 260 to secure the contents to the fins 232 of the support structure 230. In some embodiments, the unsecured position is to rotate the retaining device 260 so that the contents are not secured to the fins 232 of the support structure 230. In some embodiments, the unsecured position is when the retaining device 260 is removed from the interior volume 202 of the process kit housing system 200 (eg, the retaining device 260 is removed before attaching the top cover 216 in the docked position).

[0072] In some embodiments, the top cover 216 includes a transparent window 218 to provide viewing of the contents on the support structure. In some embodiments, the top cover 216 does not include a transparent window 218.

[0073] Figure 2CA side view of a process kit housing system 200 is depicted according to one embodiment. A door frame 250 can be coupled to the sidewall 210 and the bottom plate 214. A door 252 can be coupled to the door frame 250 for transporting the process kit housing system 200. The door 252 can be removed from the process kit housing system 200 to load the process kit housing system 200 with contents. The door 252 can be removed from the process kit housing system 200 to couple the process kit housing system 200 to a load port.

[0074] Figure 2D A bottom view of a process kit housing system 200 is depicted according to one embodiment. A base plate 214 can be disposed on the bottom of the process kit housing system 200. The base plate 214 can engage (e.g., have engaging features) with one or more features of a wafer handling system (e.g., kinematic pins, clamps, etc.) near a load port. The base plate 214 can be coupled to one or more load port presence sensors, load port coupling interfaces, recesses, etc.

[0075] Figure 2E A rear view of a process kit housing system 200 is depicted according to one embodiment. In some embodiments, a transparent window 218 is coupled to a rear edge of the housing assembly of the process kit housing system 200 to provide a view of the contents on the support structure 230. In some embodiments, the rear surface of the process kit housing system 200 does not include a transparent window 218 (e.g., the housing assembly may include a rear sidewall 210C instead of a rear edge).

[0076] Figure 2F Depicted are a support structure 230 and a holding device 260 of a process kit housing system 200 according to a certain embodiment.

[0077] The contents supported on the fins 232 of the support structure 230 can be restrained during transport. For example, one or more retaining devices 260 can secure each process kit ring 242 to a corresponding one of the process kit ring carriers 240 and can further secure each process kit ring carrier 240 within the process kit housing system 200 during transport of the process kit housing system 200. In response to the one or more retaining devices 260 being in a secured position, a locking feature (e.g., of the retaining device) can block engagement of the process kit housing system 200 with a load port of a wafer processing system. In response to the retaining device 260 being in an unsecured position (e.g., moved out of engagement with an upper surface of the contents), the locking feature can allow engagement of the process kit housing system 200 with a load port of a wafer processing system. In some embodiments, coupling the door 252 to the process kit housing system 200 can place the retaining device 260 in a secured position, while removing the door 252 from the process kit housing system 200 can place the retaining device 260 in an unsecured position. In some embodiments, to engage (e.g., engage, dock, etc.) the front interface 200 of the process kit housing system with the load port, the door 252 is removed, the top cover 216 is removed, the retaining device 260 is in an unsecured position (e.g., moved out, rotated), and the top cover 216 is attached in a docked position (e.g., rotated from an original shipping position). Without the top cover 216 in the docked position, the process kit housing system 200 may not dock, and without the retaining device 260 in the unsecured position, the top cover 216 may not be attached in the docked position. To transport the process kit housing system 200, the top cover 216 can be removed, the holding device 260 can be placed in a fixed position (e.g., inserted into the interior volume 202 and / or rotated), the top cover 216 can be attached in a transport position (e.g., if the holding device 260 is not in a fixed position, the top cover 216 may not be attached in a transport position), and the door 252 can be coupled to the process kit housing system 200 (e.g., when the top cover 216 is in the transport position, the door 252 may not be attached). The holding device 260 can be rotated to a fixed position to secure the process kit ring carrier 240. The holding device 260 can also be rotated to an unsecured position to unsecure each of the plurality of process kit ring carriers 240.

[0078] The processing set ring carrier 240 and the processing set ring 242 secured thereto may be held (eg, by one or more holding devices 260 ) to minimize movement of the processing set ring carrier 240 and the processing set ring 242 . The process kit ring carrier 240 and / or process kit ring 242 may be held by one or more of the following: friction; vacuum pads and pilot check valves; passive edge grips; passive self-alignment; semi-active edge grips (e.g., a comb or lever rotated by a person or machine, with a variable height adjustable comb to support variations in process kit ring size (e.g., predetermined or variable)); a holding device 260 actuated by the closing of the door 252; a lever coupling the clamp carrier and process kit ring 242 when the weight of the process kit ring carrier 240 causes the process kit ring carrier 240 to be seated; one or more pneumatic grippers; and / or a holding device 260 powered by a sensor-activated lever and actuator.

[0079] In some embodiments, the process kit housing system 200 (e.g., the support structure 230 and / or the holding device) can capture six degrees of freedom (e.g., x-translation, y-translation, z-translation, x-rotation, y-rotation, and z-rotation) of the process kit ring carrier 240 and / or the process kit ring 242. The process kit ring 242 can be constrained in x-translation, y-translation, and z-rotation by features of the process kit ring carrier 240 (e.g., buttons, extensions). The process kit ring 242 can be constrained in z-translation, x-rotation, and y-rotation by gravity. In response to the process kit ring 242 being effectively fully constrained on the upper surface of the process kit ring carrier 240 (e.g., by features of the process kit ring carrier 240 and gravity), the process kit housing system 200 (e.g., the support structure 230 and / or the holding device 260) can be used to support and constrain the process kit ring carrier 240.

[0080] The processing kit ring carrier 240 may have an outer periphery including two curved edges opposite to each other and two flat edges (eg, parallel edges, straight edges) substantially parallel to each other. The support structure 230 may support the processing kit ring carrier 240 at the flat edges.

[0081] In some embodiments, the holding device 260 can capture six degrees of freedom of the processing kit ring carrier 240 and the processing kit ring 242. In some embodiments, the support structure 230 and the holding device 260 can capture six degrees of freedom of the processing kit ring carrier 240 and the processing kit ring 242.

[0082] In some embodiments, the process kit housing system 200 includes a microcontroller and a battery to actively secure the contents to the support structure 230. For example, the microcontroller can place (e.g., rotate) the holding device 260 in a secured position (e.g., in response to an input that the process kit housing system 200 is to be transported) and in an unsecured position (e.g., in response to an input that the process kit housing system 200 is to be docked).

[0083] In some embodiments, the fins 262 of the holding device 260 can secure contents at different heights. For example, the fins 262 can secure an empty process kit ring carrier 240 to the first set of fins 232 of the support structure (e.g., during transport of the process kit housing system 200 to a load port), and the fins 262 can secure a used process kit ring to the process kit ring carrier 240 on the first set of fins 232 of the support structure (e.g., during transport of the process kit housing system 200 from a load port after one or more process kit rings have been replaced). For example, the fins 262 can be mass hooks that adjust for the different heights of contents on the fins 232 of the support structure 230.

[0084] Figure 3A A process kit housing system 300 (e.g., Figure 2A The support structure 330 (e.g., Figure 2A The fins 332 (eg, Figure 2A fins 232) on the contents (eg, processing kit ring carrier 340 (eg Figure 2A of the processing kit ring carrier 240) or place the verification wafer 344 (e.g. Figure 2A FIG2 is a cross-sectional view of a placement verification wafer 244 of FIG2. The fin 332 may form a recess and the contents may be disposed in the recess. In some embodiments, the upper surface of the contents includes an extension for coupling with a process assembly ring 342 (e.g., process assembly ring 242).

[0085] Figure 3B A cross-sectional view depicts a process kit ring 342 disposed on a process kit ring carrier 340 on a fin 332 of a support structure 330 of a process kit housing system 300, according to one embodiment. The process kit ring 342 can be constrained in x-translation, y-translation, and z-rotation by an extension of the process kit ring carrier 340. The process kit ring 342 can be constrained in z-translation, x-rotation, and y-rotation by gravity.

[0086] Figure 3CA top view depicts a process kit ring carrier 340 on a fin 332 of a support structure 330 of a process kit housing system 300 according to one embodiment. The process kit ring carrier 340 can be placed on the fin 332 manually or by a robotic arm. In some embodiments, the process kit housing system 300 can include four support structures 330, each including a corresponding fin 332.

[0087] Figure 3D A holding device 360 ​​(eg, Figure 2F FIG2 is a top view of a holding device 260 (e.g., a holding device 260) and a process kit ring carrier 340 disposed on fins 332 of a support structure 330 of a process kit housing system 300. The top surface of the process kit ring carrier 340 may have one or more extensions (e.g., one extension for each fin 332). The one or more extensions may capture the degrees of freedom of the process kit ring 342 (e.g., limit its movement).

[0088] Figure 3E A top view depicts a holding device 360 ​​securing a process kit ring 342 to a process kit ring carrier 340 disposed on fins 332 of a support structure 330 of a process kit housing system 300, according to one embodiment. The holding device 360 ​​can be rotated so that a lower surface of the holding device 360 ​​(e.g., a lower surface of a fin 362 of the holding device 360) is above contents on the fin 332. In some embodiments, the holding device 360 ​​contacts an upper surface of the contents on the fin 332. For example, the fin 362 of the holding device 360 ​​can contact an upper surface of the process kit ring 342. In some embodiments, the holding device 360 ​​is positioned above the contents to prevent the contents from falling off the fin 332. For example, the distance between the lower surface of the fin 362 of the holding device 360 ​​and the upper surface of the process kit ring 342 can be less than the height of an extension on the upper surface of the process kit ring carrier 340.

[0089] Figures 4A-4IDepicted are contents disposed on one or more fins 432 of a process kit housing system 400, according to one embodiment. In some embodiments, the contents (e.g., process kit ring carrier 440, placement verification wafer 444) have a flat bottom surface on a first plane and have one or more features (e.g., extensions, pads) extending from the first plane. For example, process kit ring carrier 440 may have one or more pads that wrap from one side surface of process kit ring carrier 440 to the bottom surface of process kit ring carrier 440. Each fin 432 may have a recess (e.g., a groove) to receive a feature (e.g., a pad) of process kit ring carrier 440. In some embodiments, only features of process kit ring carrier 440 engage fins 432 (e.g., the flat bottom surface of process kit ring carrier 440 does not engage fins 432). In some embodiments, the recesses of fins 432 (which receive pads of process kit ring carrier 440) restrict movement of process kit ring carrier 440 in the x- and y-directions.

[0090] Figure 4A Depicts a process kit housing system 400 (e.g., Figure 2A The support structure 430 (e.g., Figure 2A The fins 432 (eg, Figure 2A fin 232) on the contents (eg, processing kit ring carrier 440 (eg Figure 2A of the processing kit ring carrier 240) or place the verification wafer 444 (e.g. Figure 2A FIG2 is a cross-sectional view of a placement verification wafer 244 of FIG2. The fin 432 may form a first recess and the contents may be disposed in the first recess. The fin 432 may form a second recess to couple with a process assembly ring 442 (eg, process assembly ring 242).

[0091] Figure 4BA cross-sectional view depicts a process kit ring 442 positioned on a process kit ring carrier 440 on a fin 432 of a support structure 430 of a process kit housing system 400, according to one embodiment. The process kit ring 442 may be restrained in x-translation, y-translation, and z-rotation by a second recess in the fin 432 of the support structure 430. The process kit ring 442 may be restrained in z-translation, x-rotation, and y-rotation by gravity. The process kit ring carrier 440 may have a recess 452. The recess may correspond to an alignment feature of the process kit ring 442 (e.g., a flat interior sidewall surface or other alignment feature of the process kit ring 442). In some embodiments, the fin 432 may be sized and shaped (e.g., have corresponding features) to restrain the movement of the process kit ring 442. For example, the fin 432 may have a second recess sized to receive the process kit ring 442. In some embodiments, the treatment set ring orientation bracket may have one or more protrusions (eg, pins) that engage alignment features (eg, flat interior sidewall surfaces) of the treatment set ring 442 to limit movement of the treatment set ring 442 .

[0092] Figure 4C A top view depicts a process kit ring carrier 440 positioned on a fin 432 of a support structure 430 of a process kit housing system 400, according to one embodiment. The process kit ring carrier 440 can be placed on the fin 432 manually or by a robotic arm. In some embodiments, the process kit housing system 400 can include three support structures 430, each including a corresponding fin 432. In some embodiments, the fin 432 of each of the support structures 430 forms a first recess, and the fin 432 of one of the support structures 430 can form a second recess. The process kit ring carrier 800 can be positioned on one or more fins 894 (e.g., two fins, three fins, four fins, etc.).

[0093] Figure 4D A holding device 460 (eg, Figure 2F FIG4 is a top view of a holding device 260 (e.g., a holding device 260) and a process kit ring 442 on a process kit ring carrier 440 disposed on a fin 432 of a support structure 430 of a process kit housing system 400. A portion of the process kit ring 442 can be disposed within a second recess in the fin 432 of the support structure 430. The second recess formed by the fin 432 can capture a degree of freedom of the process kit ring 442 (e.g., limit its movement).

[0094] Figure 4EA top view depicts a holding device 460 securing a process kit ring 442 on a process kit ring carrier 440 disposed on fins 432 of a support structure 430 of a process kit housing system 400, according to one embodiment. In some embodiments, the holding device 460 can be rotated so that a lower surface of the holding device 460 (e.g., a lower surface of a fin 462 of the holding device 460) is above contents on the fin 432. In some embodiments, the holding device 460 contacts an upper surface of the contents on the fin 432. For example, the fin 462 of the holding device 460 can contact an upper surface of the process kit ring 442. In some embodiments, the holding device 460 is positioned above the contents to prevent the contents from falling off the fin 432. For example, the distance between the lower surface of the fin 462 of the holding device 460 and the upper surface of the process kit ring 442 can be less than the height required to remove the process kit ring 442 from the second recess. In some embodiments, the holding device 460 can be placed in an unsecured position (e.g., rotated, rotated and removed, etc.) to transfer the contents (e.g., the processing kit ring carrier 440 and / or the processing kit ring 442 on the processing kit ring carrier 440) into the processing system. In some embodiments, in response to a portion of the processing kit ring carrier 800 engaging the holding device 460, the holding device 460 can pivot to secure the processing kit ring carrier 800 and / or the processing kit ring 820.

[0095] Figure 4F-4I A cross-sectional view depicting the contents (e.g., the process kit ring carrier 440) and the fins 432 of the process kit housing system 400 according to one embodiment. In some embodiments, the holding device 460 can be a pivoting clamp. When the contents (e.g., the process kit carrier 440) are not on the fins 894, the center of gravity of the holding device 896 can cause the clamping portion of the holding device 896 to be oriented to receive the contents (e.g., the process kit ring carrier 440). Figure 4F and Figure 4H, the clamping portion of the holding device 896 can be oriented upward. After the contents (e.g., the processing kit ring carrier 440, with or without the processing kit ring 442 on the processing kit ring carrier 440) are lowered onto the fins 432, the processing kit ring carrier 440 can be engaged with the holding device 460 (e.g., via the clamping portion of the holding device 460) to cause the holding device 460 to pivot to a fixed position (e.g., with a first portion of the clamping portion of the holding device 460 above the processing kit ring carrier 440 and a second portion of the clamping portion of the holding device 460 below the processing kit ring carrier 440). In some embodiments, the clamping portion of the holding device 460 can be sized to receive one or more of: a verification wafer 444, a processing kit ring carrier 440, or a processing kit ring 442 (e.g., a processing kit ring 442 disposed on the processing kit ring carrier 440). The processing kit ring carrier 440 may have one or more features (e.g., pads, feet, etc.) that engage with each fin 432 (e.g., a recess in each fin 432). The one or more features may be the only portion of the processing kit ring carrier 440 that engages with the fins 432.

[0096] Figure 5 A method 500 for replacing a process chuck ring in a process chamber, according to one embodiment, is depicted. Although shown in a particular sequence or order, the order of the processes can be modified unless otherwise indicated. Therefore, the illustrated embodiments should be understood as examples only, and the illustrated processes can be performed in a different order, and some processes can be performed in parallel. Furthermore, one or more processes can be omitted in different embodiments. Therefore, not all processes are necessarily present in every embodiment.

[0097] The contents may be disposed within the interior volume of the process kit housing system. The contents may be disposed on fins of a support structure (e.g., a comb-like structure) disposed within the interior volume of the process kit housing system. The contents may include one or more of: a process kit ring carrier (e.g., empty or having a process kit ring disposed thereon), a process kit ring (e.g., disposed on a fin of the support structure, disposed on a process kit ring carrier), or a placement verification wafer. The contents may be manually loaded into the process kit housing system, or loading of the contents into the process kit housing system may be automated (e.g., using a robotic arm).

[0098] At block 502, contents can be secured within the process kit housing system by placing one or more retaining devices of the process kit housing system in a secure position. The retaining devices can be rotated to secure the contents to the fins of the support structure (e.g., features that prevent the contents from falling from the fins of the support structure or from passing through the fins of the support structure). For example, a top cover can be removed from the process kit housing system, the retaining device can be inserted into the interior volume of the process kit housing system so that the bottom of the retaining device engages with pins located at the bottom surface (and / or floor) of the interior surface, the retaining device can be rotated so that the fins of the retaining device are above the contents on the fins of the support structure, and the top cover can be reattached to the process kit housing system. The top cover may not be reattached unless the retaining device is rotated so that it is above the contents on the support structure (e.g., a retaining device that is not rotated may block attachment of the top cover, a retaining device in a secured position may align with a small dimple in the top cover, while a retaining device in an unsecured position may not align with the dimple).

[0099] At block 504, the process kit housing system can be transported to the wafer processing system. The process kit housing system can be transported manually using one or more handles. Transport of the process kit housing system can be automated using handles (e.g., sidewall handles, OHT, etc.). A cart with a mechanical fork can be used to pull the process kit housing system from the load port and / or place the process kit housing system onto the load port.

[0100] At block 506, the contents within the process kit housing system may be unsecured by placing one or more retaining devices of the process kit housing system in an unsecured position. In one embodiment, the top cover is removed, the retaining devices are rotated to an unsecured position (e.g., not over the contents on the support structure), removed from the interior volume, and the top cover is reattached.

[0101] At block 508, the front interface of the process kit housing system can be engaged with the load port of the wafer processing system. For example, a clamp can secure the door frame of the process kit housing system to the load port. The front interface of the process kit housing system and the load port can be sealed (e.g., hermetically sealed).

[0102] At block 510, the robot may remove a first process kit ring carrier from the process kit housing system. The first process kit ring carrier may be empty. The robot may remove the first process kit ring carrier from a lower recess (e.g., a bottom recess or a recess above a used process kit ring). The first process kit ring carrier may be the lowest empty process kit ring carrier in the process kit housing system. The robot may transfer the first process kit ring carrier to the wafer processing system.

[0103] A used process kit ring from a processing chamber of a wafer processing system may be placed on a first process kit ring carrier at block 512. Lift pins (e.g., process kit ring lift pins) in the processing chamber may lift the used process kit ring, a robot may position the first process kit ring carrier below the used process kit ring, and the lift pins may be lowered to place the used process kit ring on the first process kit ring carrier.

[0104] The robot may insert the used process kit ring secured to the first process kit ring carrier into the process kit housing system at block 514. The robot may place the used process kit ring secured to the first process kit ring carrier into the recess (e.g., the lower recess) from which the first process kit ring carrier was removed.

[0105] At block 516, the robot arm may remove a new process kit ring secured to the second process kit ring carrier from the process kit housing system. The new process kit ring secured to the second process kit ring carrier may be in an upper recess of the process kit housing system that is above a lower recess corresponding to the first process kit ring carrier. The new process kit ring secured to the second process kit ring carrier may be in the lowest recess of all new process kit rings in the process kit housing system (e.g., no new process kit ring is below the new process kit ring secured to the second process kit ring carrier).

[0106] A new process kit ring may be placed into the processing chamber at block 518. The robot may transfer the new process kit ring secured to the second process kit ring carrier into the processing chamber, lift pins (e.g., process kit ring lift pins) in the processing chamber may lift the new process kit ring off the second process kit ring carrier, the robot may retract the process kit ring carrier from the processing chamber, and the lift pins may lower the new process kit ring into position within the processing chamber.

[0107] The robot can insert the second process kit ring carrier (now empty) into the process kit housing system at block 520. The robot can insert the second process kit ring carrier into the same recess from which the new process kit ring secured to the second process kit ring carrier was removed.

[0108] At block 522, a placement verification wafer may be transferred from the process kit housing system to verify the placement of a new process ring in a processing chamber of the wafer processing system. The placement verification wafer may be placed in a recess above the used process kit ring. The placement verification wafer may be placed in the uppermost recess of the process kit housing system. The robotic arm may remove the placement verification wafer for use in verifying the placement of a new process ring.

[0109] Prior to causing the process kit housing system to be transported away from the wafer processing system, the contents are secured within the process kit housing system by placing one or more retaining devices of the process kit housing system in a secured position. In one embodiment, the top cover is removed, the retaining devices are placed into the interior volume, the retaining devices are rotated to a secured position (e.g., above the contents on the support structure), and the top cover is reattached. The front interface of the process kit housing system can be released from the load port of the wafer processing system (e.g., a clamp securing the door frame of the process kit housing system to the load port can be released). After the process kit housing system is released from the load port, the door of the process kit housing system can be attached to the door frame.

[0110] The above description sets forth several specific details, such as examples of specific systems, components, methods, and others, in order to provide a good understanding of several embodiments of the present disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure can be practiced without these specific details. In other cases, to avoid unnecessarily obscuring the present disclosure, well-known components or methods are not described in detail or are presented in a simple block diagram format. Therefore, the specific details set forth are merely illustrative. Specific implementations may differ from these illustrative details and still be considered within the scope of the present disclosure.

[0111] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the term "or" is intended to be inclusive rather than exclusive. When the terms "approximately" or "approximately" are used herein, they are intended to represent the accuracy of the nominal value presented to within ±10%.

[0112] Although the operations of the methods herein are shown and described in a particular order, the order of the operations of each method may be altered so that certain operations may be performed in a reverse order, or certain operations may be performed (at least partially) simultaneously with other operations. In another embodiment, instructions or sub-operations of different operations may be performed in an intermittent and / or alternating manner.

[0113] It will be understood that the above description is intended to be illustrative and not limiting. Many other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. The scope of the present disclosure should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. A processing kit housing system, comprising: a plurality of surfaces for at least partially enclosing an interior volume of the process kit housing system; a first support structure, the first support structure comprising a first plurality of substantially horizontal fins; a second support structure comprising a second plurality of substantially horizontal fins, wherein the first plurality of substantially horizontal fins and the second plurality of substantially horizontal fins are sized and spaced to hold a plurality of process kit ring carriers and a plurality of process kit rings within the interior volume of the process kit housing system, each of the plurality of process kit rings being secured to one of the plurality of process kit ring carriers; one or more retaining devices for securing each of the plurality of process kit rings to a corresponding one of the plurality of process kit ring carriers and further for securing each of the plurality of process kit ring carriers within the process kit housing system during transport of the process kit housing system; as well as a front interface coupled to one or more of the plurality of surfaces to engage the process kit housing system with a load port of a wafer processing system, wherein the process kit housing system enables a first automated transfer of a first process kit ring carrier holding a first process kit ring from the process kit housing system to the wafer processing system and a second automated transfer of a second process kit ring carrier holding a second process kit ring from the wafer processing system to the process kit housing system.

2. The process kit housing system of claim 1 , wherein the one or more retaining devices include a retaining device structure disposed in the interior volume and including a first retaining device fin, wherein the retaining device structure is configured to rotate between a first position and a second position, wherein the first retaining device fin in the first position is disposed above and secures the first process kit ring, and in the second position the first retaining device fin is outside a boundary of the first process kit ring, wherein in the first position the retaining device is aligned with and inserted into a recess formed by a top cover of the process kit housing system, and wherein in the second position the retaining device is not aligned with and blocked from being inserted into the recess formed by the top cover.

3. The processing kit housing system of claim 1, wherein: a locking feature blocking engagement of the process kit housing system with the loadport of the wafer handling system in response to the one or more holding devices being in a secured position; as well as The latching feature permits engagement of the process kit housing system with the loadport of the wafer processing system in response to the one or more holding devices being in an unsecured position.

4. The process kit housing system of claim 3, wherein the one or more holding devices are: can be rotated to the fixed position to fix each of the plurality of processing kit ring carriers; and The device may be rotated to the unsecured position to cause each of the plurality of process kit ring carriers to become unsecured.

5. The processing kit housing system of claim 1, further comprising: An alignment feature for blocking a mechanical wafer mapper and enabling identification of the process kit housing system as not a wafer housing system.

6. The process kit housing system of claim 1, further comprising: A transparent window is provided to enable viewing of the plurality of process kit ring carriers and the plurality of process kit rings.

7. The process kit housing system of claim 1, wherein the first support structure and the second support structure are configured to capture six degrees of freedom of the plurality of process kit ring carriers and the plurality of process kit rings.

8. The process kit housing system of claim 1, wherein the first support structure is a first comb-like structure and the second support structure is a second comb-like structure, the process kit housing system further comprising: an empty process kit ring carrier disposed on a first approximately horizontal fin of the first comb-like structure and a second approximately horizontal fin of the second comb-like structure; and The first process kit ring carrier is disposed on the third approximately horizontal fin of the first comb structure and the fourth approximately horizontal fin of the second comb structure, wherein the first process kit ring carrier is positioned above the empty process kit ring carrier in the process kit housing system and the first process kit ring is supported by the first process kit ring carrier.

9. The process kit housing system of claim 8, wherein the fifth nearly horizontal fin of the first comb structure and the sixth nearly horizontal fin of the second comb structure are sized to support a verification wafer, the process kit housing system further comprising: The placement verification wafer is placed on the fifth horizontal fin of the first comb structure and the sixth horizontal fin of the second comb structure to achieve a third automatic transfer of the placement verification wafer into the wafer processing system to verify the placement of the first processing set in the wafer processing system.

10. The process kit housing system of claim 1, further comprising at least one of the following: one or more side handles coupled to one or more exterior surfaces of the plurality of surfaces of the process kit housing system for transporting the process kit housing system; or An over the air transfer (OHT) flange is coupled to a first exterior surface of the plurality of surfaces for transport of the process kit housing system.

11. A method comprising the following steps: engaging a front interface of a process kit housing system with a load port of a wafer processing system, wherein the process kit housing system comprises a plurality of process kit ring carriers and a plurality of process kit rings within an interior volume of the process kit housing system, wherein the interior volume is enclosed by a plurality of surfaces of the process kit housing system, the front interface being coupled to the plurality of surfaces of the process kit housing system, wherein each of the plurality of process kit rings is secured to one of the plurality of process kit ring carriers, wherein each of the plurality of process kit ring carriers is placed on a corresponding first substantially horizontal fin of a first plurality of substantially horizontal fins of a first support structure and a corresponding second substantially horizontal fin of a second plurality of substantially horizontal fins of a second support structure; Using a robot arm to first automatically transfer a first process kit ring carrier holding a first process kit ring from the process kit housing system to the wafer processing system; and using the robot or an additional robot to perform a second automatic transfer of a second process kit ring carrier holding a used second process kit ring from the wafer handling system to the process kit housing system, Before the front interface of the process kit housing system is engaged with the load port, each of the plurality of process kit rings is fixed to a corresponding one of the plurality of process kit ring carriers within the process kit housing system by one or more holding devices of the process kit housing system during transportation of the process kit housing system.

12. The method of claim 11, wherein: The fixing comprises placing the one or more holding devices in a fixed position; Engaging the front interface of the processing kit housing system includes placing the one or more retaining devices in an unsecured position; The one or more retaining devices include a retaining device structure disposed in the interior volume and including a first retaining device fin; The retaining device structure is configured to rotate between a first position and a second position; The first retaining device fin in the first position is disposed above and secures the first process set ring, and the first retaining device fin in the second position is outside the boundary of the first process set ring; In the first position, the holding device is aligned with and inserted into a recess formed by a top cover of the processing kit housing system; as well as In the second position the retaining device is misaligned with the recess formed by the cover and is prevented from being inserted into the recess.

13. The method of claim 12, wherein: Placing the one or more holding devices in the fixed position includes blocking engagement of the process kit housing system with the load port of the wafer processing system via a locking feature of the process kit housing system; and Placing the one or more holding devices in the unsecured position includes allowing engagement of the process kit housing system with the loadport of the wafer processing system via the latching feature.

14. The method of claim 12, wherein: The one or more retaining devices have a first rotational state, the first rotational state providing the fixed position; and Placing the one or more holding devices in the unsecured position includes rotating the one or more holding devices to a second rotational state, the second rotational state providing the unsecured position.

15. The method of claim 11, wherein: The second automatic transfer of the second processing kit ring carrier comprises: Using the robot arm to move the second process kit ring carrier out of the process kit housing system; causing the used second process kit ring from a process chamber of the wafer processing system to be placed on the second process kit ring carrier; and inserting the used second process kit ring secured to the second process kit ring carrier into the process kit housing system using the robot arm; and The first automated transfer of the first processing kit ring carrier comprises: Using the robot arm to move the first process kit ring fixed to the first process kit ring carrier out of the process kit housing system; causing the first process kit ring to be placed in the process chamber; as well as The first process kit ring carrier is inserted into the process kit housing system using the robot arm.

16. The method of claim 15, wherein: The second process kit ring carrier is moved out of the first recess of the process kit housing system; the used second process kit ring secured to the second process kit ring carrier is inserted into the first recess of the process kit housing system; The first process kit ring secured to the first process kit ring carrier is removed from a second recess of the process kit housing system, the second recess being above the first recess; and The first process kit ring carrier is inserted into the second groove.

17. A processing kit housing system, comprising: a plurality of surfaces for at least partially enclosing an interior volume of the process kit housing system; a first support structure disposed within the interior volume; a second support structure disposed within the interior volume; an empty process kit ring carrier disposed on a first approximately horizontal fin of the first support structure and a second approximately horizontal fin of the second support structure; a plurality of process kit ring carriers disposed on respective proximal horizontal fins of the first support structure and the second support structure, wherein the plurality of process kit ring carriers are positioned above the empty process kit ring carrier in the process kit housing system, and wherein a corresponding process kit ring is secured to each of the plurality of process kit ring carriers; one or more retaining devices for securing each of a plurality of process kit rings to a corresponding one of the plurality of process kit ring carriers and further for securing each of the plurality of process kit ring carriers within the process kit housing system during transport of the process kit housing system; as well as A placement verification wafer is disposed on a third substantially horizontal fin of the first support structure and a fourth substantially horizontal fin of the second support structure, wherein the placement verification wafer is positioned above the plurality of process kit ring carriers in the process kit housing system.

18. The process kit housing system of claim 17, wherein the process kit housing system enables a first automated transfer of the empty process kit ring carrier into a wafer handling system, and a second automated transfer of the empty process kit ring carrier holding a used process kit ring from the wafer handling system into the process kit housing system.

19. The process kit housing system of claim 17, wherein the process kit housing system enables a first automated transfer of a first process kit ring carrier holding a first process kit ring from the process kit housing system into a wafer processing system, and a second automated transfer of a second process kit ring carrier holding a second process kit ring from the wafer processing system into the process kit housing system.

20. The process kit housing system of claim 19, wherein said process kit housing system implements a third automated transfer of said placement verification wafer into said wafer processing system to verify placement of said first process kit in said wafer processing system.

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