A device, method and related equipment for imaging positioning holes of PCB board

Abstract

The present invention discloses a device, method, storage medium and related equipment for imaging positioning holes of a PCB board, wherein the device comprises: a color recognition module, a computer, a light source module and a camera module; the color recognition module recognizes the color of the solder resist ink layer of the PCB board and feeds back the recognition result to the computer; the computer sends a control instruction to the light source module according to the recognition result; the light source module respectively emits a plurality of lights of different colors or a combination of color lights according to the control instruction, irradiating one of the positioning holes on the PCB board and the solder resist ink layer on the circumferential edge of the positioning hole; the camera module captures an image and sends it to the computer; the computer processes the image, thereby fitting the contour image of the positioning hole, and calculating the center coordinates according to the contour image. The present invention can image the positioning holes of the PCB board with high definition, so that the repeated positioning accuracy of the PCB board can be calculated more accurately.

Description

Technical Field

[0001] The invention belongs to the field of PCB boards, and in particular relates to a device, method and related equipment for imaging positioning holes of a PCB board. Background Art

[0002] When using laser direct imaging equipment to expose a PCB (Printed Circuit Board, also known as a printed circuit board in Chinese), the PCB board needs to be accurately placed at a preset position on a workbench. A number of positioning holes are provided on the PCB board to achieve the purpose of accurately positioning the PCB board on the workbench.

[0003] refer to Figure 1 When the PCB board 50 moves back and forth multiple times along the X-axis and / or Y-axis on the workbench 60, the PCB board 50 will have a slight positional offset relative to the workbench 60. At this time, the positioning hole 51 on the PCB board 50 will also have a slight positional offset relative to the workbench, causing the repeated positioning accuracy of the PCB board to deteriorate.

[0004] To detect the repeatability of the PCB board after multiple reciprocating motions on the workbench, the repeatability of a positioning hole 51 on the PCB board can be detected. The repeatability of the positioning hole 51 can be detected by simply measuring the repeatability of the center of the positioning hole.

[0005] To measure the center of the positioning hole of the PCB board, the camera module must first capture a high-definition image of the positioning hole, and then identify the center of the positioning hole. When capturing the image of the positioning hole, a light source is required to illuminate the positioning hole and the solder mask ink layer at the edge of the positioning hole. When the camera module captures the positioning hole, it is impossible to capture only the positioning hole accurately, and the solder mask ink layer at the edge of the positioning hole will also be captured.

[0006] The solder resist ink layer of the PCB board has different colors, such as the common green solder resist ink layer, red solder resist ink layer, and black solder resist ink layer. For the solder resist ink layers sprayed with different colors, if only the same monochromatic light or mixed light is used to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole, the image of the positioning hole taken will have low image clarity due to the incompatibility between the color of the monochromatic light source and the color of the solder resist ink layer of the PCB board, which is not conducive to identifying the positioning hole and the center of the circle. Therefore, during the multiple reciprocating motions of the PCB board, when the positioning hole is illuminated by a light source that is not compatible with the color of the solder resist ink layer of the PCB board, the clarity of the multiple images obtained is not high, resulting in low contour accuracy of the multiple positioning holes fitted according to the multiple images, and therefore the repeated positioning value of the PCB board calculated based on the multiple positioning holes is inaccurate. Summary of the invention

[0007] The invention discloses a device for imaging positioning holes of a PCB board, and aims to solve the problem that the positioning hole fitting accuracy is low due to the low definition of the image of the positioning hole of the PCB board taken by a camera module, so that the repeated positioning accuracy of the PCB is inaccurate when calculated according to the center of the positioning hole.

[0008] The scheme of this device is as follows:

[0009] A device for imaging positioning holes of a PCB board, comprising: a color recognition module, a computer, a light source module and a camera module;

[0010] The color recognition module is used to identify the color of the solder mask ink layer of the PCB board and feed back the recognition result to the computer;

[0011] The computer is used to send a control instruction to the light source module according to the recognition result;

[0012] The light source module includes a plurality of light emitting units of different colors and a mixed light unit. The light source module emits an outgoing light that matches the color of the solder resist ink layer of the PCB board according to the control instruction. The outgoing light irradiates one of the positioning holes on the PCB board and the solder resist ink layer on the circumferential edge of the positioning hole.

[0013] The camera module is used to capture images of the solder resist ink layer including the positioning hole and the circumferential edge of the positioning hole, and send the images to a computer;

[0014] The computer fits the circular contour of the positioning hole according to the image and calculates the center of the positioning hole.

[0015] Further, the color of the solder mask ink layer of the PCB board includes white, green, black, red, yellow or blue;

[0016] The light emitting units of different colors include: a red light unit, a blue light unit and a green light unit; the mixed light unit is a mixed light composed of 75% red light and 25% green light.

[0017] Furthermore, the light source module emits light that matches the color of the solder mask ink layer of the PCB board according to the control instruction, specifically:

[0018] When the color of the solder resist ink layer of the PCB board is white, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0019] When the color of the solder resist ink layer of the PCB board is green, the computer controls the light source module to emit a mixed light consisting of 75% red light and 25% green light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0020] When the color of the solder resist ink layer of the PCB board is black, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0021] When the color of the solder resist ink layer of the PCB board is red, the computer controls the light source module to emit a mixed light consisting of 75% red light and 25% green light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0022] When the color of the solder resist ink layer of the PCB board is yellow, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0023] When the color of the solder resist ink layer of the PCB board is blue, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole.

[0024] Furthermore, the color recognition module recognizes the color of the solder mask ink layer of the PCB board by reading and recognizing it through an input computer or by recognizing it through a color sensor.

[0025] Furthermore, the camera module is an industrial CCD camera.

[0026] The present invention also discloses a method for imaging the positioning holes of a PCB board using the above device, comprising the following steps:

[0027] Step 1: The color recognition module identifies the color of the solder mask ink layer of the PCB board and feeds back the recognition result to the computer;

[0028] Step 2: Based on the recognition result, the computer controls the light source module to emit light that matches the color of the solder resist ink layer on the PCB board, and the emitted light illuminates one of the positioning holes on the PCB board and the solder resist ink layer on the circumferential edge of the positioning hole;

[0029] Step 3: The camera module captures an image of the solder mask ink layer including the positioning hole and the circumferential edge of the positioning hole, and sends the image to a computer;

[0030] Step 4: The computer fits the circular contour of the positioning hole based on the image and calculates the center of the positioning hole.

[0031] Furthermore, the light source module emits light that matches the color of the solder mask ink layer of the PCB board according to the control instruction, specifically:

[0032] When the color of the solder resist ink layer of the PCB board is white, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0033] When the color of the solder resist ink layer of the PCB board is green, the computer controls the light source module to emit a mixed light of 75% red light and 25% green light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0034] When the color of the solder resist ink layer of the PCB board is black, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0035] When the color of the solder resist ink layer of the PCB board is red, the computer controls the light source module to emit a mixed light consisting of 75% red light and 25% green light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0036] When the color of the solder resist ink layer of the PCB board is yellow, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0037] When the color of the solder resist ink layer of the PCB board is blue, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole.

[0038] Furthermore, before step 1, the method further includes: moving the camera module to be directly above the positioning hole, or moving the PCB board so that the positioning hole is directly below the camera module.

[0039] The present invention also discloses a storage medium on which a computer program is stored, and the steps of the above method are implemented when the program is executed by a processor.

[0040] The present invention also discloses a computer device, including a memory, a processor and a computer program stored in the memory and executable on the processor, and the steps of the above method are implemented when the processor executes the program.

[0041] Technical effect of the present invention: According to the present device and method, the color recognition module recognizes the color of the solder resist ink layer of the PCB board and sends the recognition result to the computer. The computer controls the light source module to emit monochromatic light or mixed light that matches the color of the solder resist ink layer of the PCB board to illuminate a positioning hole on the PCB board and the solder resist ink layer at the edge of the positioning hole. The camera module photographs the positioning hole and the solder resist ink layer at the edge of the positioning hole to obtain a corresponding image. The camera module sends the image to the computer for processing. The computer fits the circular contour of the positioning hole based on the image and identifies the center of the positioning hole. When the PCB board reciprocates, the present device and method are used to photograph multiple images of the same positioning hole and the solder resist ink layer at the circular edge of the positioning hole, multiple positioning hole circular contours are fitted based on the multiple images, and the maximum discrete value of the center of the multiple positioning hole circular contours calculated based on the multiple positioning hole circular contours is more accurate, so the calculated repeat positioning accuracy of the PCB board is more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a schematic diagram of placing a PCB board 50 on a workbench 60;

[0043] Figure 2 A schematic diagram of module connections of a device for imaging positioning holes based on a solder resist ink layer of a PCB board disclosed in the present invention;

[0044] Figure 3 is a schematic diagram of a positioning hole 51 and a portion of a solder resist ink layer 52 located at the edge of the positioning hole 51;

[0045] Figure 4 It is a schematic diagram of the maximum discrete value of the center 53 of the two positioning holes 51 among the 100 images processed by the computer;

[0046] The names and serial numbers of the components in the figure are: color recognition module 10, computer 20, light source module 30, camera module 40, PCB board 50, positioning hole 51, solder resist ink layer 52, and center 53 of the positioning hole 51. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention; the terms "first", "second", and "third" are only used to describe the difference, and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] The invention discloses a device for imaging positioning holes of a PCB board, comprising: a color recognition module, a computer, a light source module and a camera module;

[0050] The color recognition module is used to identify the color of the solder mask ink layer of the PCB board and feed back the recognition result to the computer;

[0051] The computer is used to send a control instruction to the light source module according to the recognition result;

[0052] The light source module includes a plurality of light emitting units of different colors and a mixed light unit. The light source module emits an outgoing light that matches the color of the solder resist ink layer of the PCB board according to the control instruction. The outgoing light irradiates one of the positioning holes on the PCB board and the solder resist ink layer on the circumferential edge of the positioning hole.

[0053] The camera module is used to capture images of the solder resist ink layer including the positioning hole and the circumferential edge of the positioning hole, and send the images to a computer;

[0054] The computer fits the circular contour of the positioning hole according to the image and calculates the center of the positioning hole.

[0055] refer to Figure 2 , a plurality of positioning holes are provided on the PCB board 50, one of which is named as positioning hole 51. The upper end surface of the PCB board 50 is covered with a solder resist ink layer 52. Figure 3 , the solder resist ink layer 52 is coated on the periphery of the positioning hole 51. The solder resist ink layer 52 has a variety of colors, such as white, green, black, red, yellow or blue, which is not limited here. Since the solder resist ink layers on the PCB board have different colors, if the light source module 30 only emits one monochromatic light to illuminate the solder resist layers of different colors on the PCB, the clarity of the image obtained by the camera module 40 photographing the positioning hole 51 will be different, so that the computer will deviate from the center of the positioning hole determined by the image. This is because, when the camera module 40 is used to photograph the positioning hole 51, due to the field of view of the camera module 40, the captured image not only shows the image of the positioning hole 51, but also includes the image of the partial solder resist ink layer 52 located at the edge of the hole of the positioning hole 51, such as Figure 3 shown. Figure 3 If the image is not clear enough, the circumferential contour of the positioning hole 51 and the solder mask ink layer 52 at the edge of the hole cannot be distinguished from the image, and the circumferential contour of the positioning hole cannot be fitted according to the image, so the coordinates of the center 53 of the positioning hole 51 cannot be calculated. Figure 3 A high-definition image of the solder resist ink layer 52 including the positioning hole 51 and the edge of the positioning hole 51 is a prerequisite for calculating the coordinates of the positioning hole.

[0056] In the present invention, the light source module 30 includes a plurality of light emitting units of different colors or mixed light units. As one embodiment, the plurality of light emitting units of different colors are red light units, blue light units and green light units, and the mixed light unit is a mixed light composed of 75% red light and 25% green light.

[0057] The color recognition module 10 first recognizes the color of the solder resist ink layer 52 sprayed on the upper end of the PCB board 50. The color of the solder resist ink layer 52 can be, for example, white, green, black, red, yellow or blue. The color recognition module 10 feeds back the recognition result to the computer 20. The computer 20 sends a control instruction to the light source module 30 according to the received recognition result. The light source module 30 emits red light, blue light, green light or a mixed light composed of 75% red light and 25% green light that matches the recognized color of the solder resist ink layer. The red light, blue light, green light or a mixed light composed of 75% red light and 25% green light illuminates the positioning hole 51 and the partial solder resist ink layer 52 at the edge of the positioning hole 51. The camera module 40 captures an image of the partial solder resist ink layer 52 including the positioning hole 51 and the edge of the positioning hole 51.

[0058] In order to determine which monochromatic light or mixed light is used to illuminate the solder resist ink layer at the PCB board positioning hole and the edge of the positioning hole to obtain the clearest image when the color of the solder resist ink layer of the PCB board is white, green, black, red, yellow or blue, so as to fit the most accurate image of the positioning hole, the applicant conducted the following experiment and obtained the data in Table 1.

[0059] Table 1: Several groups of images obtained after different colors of solder mask layers of PCB board are illuminated by different colors of light sources, and the maximum discrete value of the center of the positioning hole in each group of images.

[0060]

[0061] The experiment is as follows: Use red, blue and green monochromatic lights and mixed lights of red (75%) + green (25%) to illuminate the PCB board with solder mask ink layer colors of white, green, black, red, yellow or blue, and obtain 4*7=28 groups of images, each group of images contains 100 images. Then calculate the minimum value of the center offset of the positioning hole according to each group of 100 images. The experimental results are shown in Table 1. For example, when the color of the solder mask ink layer of the PCB board is white, use red light to illuminate the positioning hole 51 and part of the solder mask ink layer 52 at the edge of the positioning hole 51. The camera module 40 captures 100 images of the solder mask ink layer 52 including the positioning hole 51 and the outer diameter edge of the positioning hole 51, and then sends these 100 images to the computer 20 for processing. The computer 20 processes the positioning hole 51 and the center 53 of the positioning hole 51 in each image from these 100 images. The schematic diagram of the discrete distribution of the contours and centers of the 100 positioning holes finally obtained is shown in Figure 4 . Figure 4 The positioning holes 51 and the center 53 of the positioning holes 51 in the two images that deviate the farthest from the reference line O are included. The distance between the centers 53 of the two positioning holes 51 that deviate the farthest from the reference line O is the maximum discrete value of the center. As can be seen from Table 1, when the positioning holes 51 of the PCB board and the white ink layer at the edge of the positioning holes 51 are irradiated with red light, the maximum discrete value of the center of the positioning holes is ±1.51μm. Similarly, when the positioning holes 51 of the PCB board and the white ink layer at the edge of the positioning holes 51 are irradiated with blue light, the maximum discrete value of the center of the positioning holes is ±1.71μm; when the positioning holes 51 of the PCB board and the white ink layer at the edge of the positioning holes 51 are irradiated with green light, the maximum discrete value of the center of the positioning holes is ±1.82μm; when the positioning holes 51 of the PCB board and the white ink layer at the edge of the positioning holes 51 are irradiated with a mixed light source of red (75%) + green (25%), the maximum discrete value of the center of the positioning holes is ±1.92μm. In summary, when the color of the solder mask ink layer of the PCB board is white, the ink layer at the edge of the positioning hole 51 and the positioning hole 51 is irradiated with red light, and the maximum discrete value of the center of the positioning hole 51 is the smallest.

[0062] According to Table 1, it can be analyzed that when the color of the solder resist ink layer of the PCB board is green, the ink layer at the edge of the positioning hole 51 and the positioning hole 51 is irradiated with a mixed light of red (75%) + green (25%), and the maximum discrete value of the center of the positioning hole 51 in the 100 images obtained is ±1.45μm; when the color of the solder resist ink layer of the PCB board is black, the ink layer at the edge of the positioning hole 51 and the positioning hole 51 is irradiated with red light, and the maximum discrete value of the center of the positioning hole 51 is the smallest, which is ±1.24μm; when the color of the solder resist ink layer of the PCB board is red, the ink layer at the edge of the positioning hole 51 and the positioning hole 51 is irradiated with a mixed light of red (75%) + green (25%) ... The combined light source illuminates the positioning hole 51 and the ink layer at the edge of the positioning hole 51. Among the 100 images obtained, the maximum discrete value of the center of the positioning hole 51 is the smallest, which is ±1.23μm; when the color of the solder resist ink layer of the PCB board is yellow, the red light is used to illuminate the positioning hole 51 and the ink layer at the edge of the positioning hole 51. Among the 100 images obtained, the maximum discrete value of the center of the positioning hole 51 is the smallest, which is ±1.28μm; when the color of the solder resist ink layer of the PCB board is blue, the red light is used to illuminate the positioning hole 51 and the ink layer at the edge of the positioning hole 51. Among the 100 images obtained, the maximum discrete value of the center of the positioning hole 51 is the smallest, which is ±1.33μm. The smaller the maximum discrete value of the center of the positioning hole 51, the higher the repeatability positioning accuracy of the PCB board.

[0063] From the above analysis, it can be seen that when the color of the solder resist ink layer of the PCB board is white, the computer controls the light source module to use the red light unit to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole, and the image accuracy of the positioning hole is higher, and the circular contour of the positioning hole fitted according to the image is more accurate; when the PCB board repeatedly moves, the calculated maximum discrete value of the center of the same positioning hole of the PCB board is smaller, so the repeated positioning value of the PCB board is more accurate;

[0064] When the color of the solder resist ink layer of the PCB board is green, the computer controls the light source module to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole with 75% red light and 25% green light, so that the image accuracy of the positioning hole is higher and the circular contour of the positioning hole fitted according to the image is more accurate; when the PCB board repeatedly moves, the calculated maximum discrete value of the center of the same positioning hole of the PCB board is smaller, so the repeated positioning value of the PCB board is more accurate;

[0065] When the color of the solder resist ink layer of the PCB board is black, the computer controls the light source module to use the red light unit to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole, and the image accuracy of the positioning hole is higher; the image accuracy of the positioning hole is higher, the more accurate the circular contour of the positioning hole fitted according to the image is, when the PCB board repeatedly moves, the smaller the maximum discrete value of the center of the same positioning hole of the PCB board calculated is, so the repeated positioning value of the PCB board is more accurate;

[0066] When the color of the solder resist ink layer of the PCB board is red, the computer controls the light source module to irradiate the positioning hole and the solder resist ink layer at the edge of the positioning hole with 75% red light and 25% green light, and the image accuracy of the positioning hole is higher; the image accuracy of the positioning hole is higher, the more accurate the circular contour of the positioning hole fitted according to the image is, when the PCB board repeatedly moves, the smaller the maximum discrete value of the center of the same positioning hole of the PCB board is calculated, so the repeated positioning value of the PCB board is more accurate;

[0067] When the color of the solder resist ink layer of the PCB board is yellow, the computer controls the light source module to use the red light unit to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole, and the image accuracy of the positioning hole is higher; the more accurate the circular contour of the positioning hole fitted according to the image, the smaller the maximum discrete value of the center of the same positioning hole of the PCB board calculated when the PCB board moves repeatedly, and therefore the more accurate the repeated positioning value of the PCB board is;

[0068] When the color of the solder resist ink layer of the PCB board is blue, the computer controls the light source module to use a red light unit to irradiate the positioning hole and the solder resist ink layer at the edge of the positioning hole, and the image accuracy of the positioning hole is higher; the more accurate the circular contour of the positioning hole fitted according to the image, the smaller the maximum discrete value of the center of the same positioning hole of the PCB board calculated when the PCB board moves repeatedly, and therefore the more accurate the repeated positioning value of the PCB board is.

[0069] It should be noted that the color of the solder resist ink layer of the PCB board and the color of the monochromatic light or mixed light mentioned above are only exemplary. The solder resist ink layer of the PCB board can also be other colors, such as cyan and purple; the color of the monochromatic light can also include other colors, such as cyan and purple. In addition, affected by the environment, the above conclusion is not absolute. For example, when the color of the solder resist ink layer of the PCB board is white, the blue light unit is used to illuminate the solder resist ink layer of the positioning hole and the edge of the positioning hole, and the clarity of the image of the positioning hole is higher.

[0070] It should be noted that the above-mentioned 100 images in each group of images are merely exemplary, and the number of images can be increased or decreased as needed, and is not limited here.

[0071] It should be noted that, as one of the embodiments, the color recognition module identifies the color of the solder mask ink layer of the PCB board by inputting the color information of the solder mask ink layer of the PCB board into the computer for reading and identification or by identifying through a color sensor. The reading and identification mentioned here by inputting the computer, for example, can be inputting the information that the solder mask ink of the PCB board is black into the computer, and the computer will obtain the color of the solder mask ink of the PCB board. As one of the embodiments, the model of the color sensor is preferably TCS34725. The color sensor and the computer 20 are connected through an expansion interface IIC. IIC (Inter-Integrated Circuit) is the abbreviation of IICBus, which is called integrated circuit bus in Chinese. It is a serial communication bus that uses a multi-master-slave architecture and was developed by Philips in the 1980s to allow motherboards, embedded systems or mobile phones to connect to low-speed peripheral devices.

[0072] As one embodiment, the camera module 40 is preferably an industrial CCD camera. CCD stands for Charge Coupled Device in English and Charge Coupled Device in Chinese, and can also be called CCD image sensor. CCD is a semiconductor device that can convert optical images into digital signals.

[0073] The present invention also discloses a method for imaging the positioning holes of a PCB board using the above device, comprising the following steps:

[0074] Step 1: The color recognition module identifies the color of the solder mask ink layer of the PCB board and feeds back the recognition result to the computer;

[0075] Step 2: Based on the recognition result, the computer controls the light source module to emit light that matches the color of the solder resist ink layer on the PCB board, and the emitted light illuminates one of the positioning holes on the PCB board and the solder resist ink layer on the circumferential edge of the positioning hole;

[0076] Step 3: The camera module captures an image of the solder mask ink layer including the positioning hole and the circumferential edge of the positioning hole, and sends the image to a computer;

[0077] Step 4: The computer fits the circular contour of the positioning hole based on the image and calculates the center of the positioning hole.

[0078] The color recognition module in step 1 can recognize the color of the solder resist ink layer of the PCB board by inputting the color information of the solder resist ink layer of the PCB board into a computer for reading and recognition or by using a color sensor for recognition. As one embodiment, the color of the solder resist ink layer of the PCB board can be white, green, black, red, yellow or blue, which is not limited here.

[0079] In step 2, the computer sends a control instruction to control the light source module to emit monochromatic light or mixed light of different colors according to the recognition result. The specific control method is:

[0080] When the color of the solder resist ink layer of the PCB board is white, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0081] When the color of the solder resist ink layer of the PCB board is green, the computer controls the light source module to emit a mixed light consisting of 75% red light and 25% green light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0082] When the color of the solder resist ink layer of the PCB board is black, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0083] When the color of the solder resist ink layer of the PCB board is red, the computer controls the light source module to emit a mixed light consisting of 75% red light and 25% green light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0084] When the color of the solder resist ink layer of the PCB board is yellow, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole;

[0085] When the color of the solder resist ink layer of the PCB board is blue, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole.

[0086] It should be noted that when the solder mask ink color of the PCB board is different, the different monochromatic lights or mixed lights of the light source module illuminate the same positioning hole of the PCB board and the solder mask ink layer around the positioning hole.

[0087] In step 3, once the color of the solder resist ink layer of the PCB board is determined, the solder resist ink layer at the positioning hole and the peripheral edge of the positioning hole is irradiated with the corresponding emitted light in step 2, and then the camera module takes a picture of the positioning hole and the solder resist ink layer at the peripheral edge of the positioning hole. For example, when the color of the solder resist ink layer of the PCB board is white, the computer controls the light source module to emit red emitted light to irradiate the positioning hole and the solder resist ink layer at the edge of the positioning hole.

[0088] In step 4, the circumferential contour of the positioning hole is based on Figure 3 The image of the junction between the solder resist ink layer 52 and the positioning hole 51 is obtained by fitting.

[0089] It should be noted that before step 1, the camera module needs to be moved to be directly above the positioning hole to be photographed, for example, by installing the camera module on a slide rail, and moving the camera module on the slide rail to be above the positioning hole on the PCB board to be photographed; or by placing the PCB board on a workbench, and controlling the movement of the workbench so that the positioning hole to be photographed on the PCB board is directly below the camera module. The way to control the movement of the workbench is, for example, to control the X-axis moving mechanism and the Y-axis moving mechanism under the workbench to move the PCB board, so that the positioning hole to be photographed on the PCB board is located below the camera module.

[0090] By using the device and method disclosed in the present invention, a color recognition module recognizes the color of the solder resist ink layer of a PCB board and sends the recognition result to a computer. The computer controls the light source module to emit monochromatic light or mixed light that matches the color of the solder resist ink layer of the PCB board to illuminate a positioning hole on the PCB board and the solder resist ink layer at the edge of the positioning hole according to the recognition result. The camera module photographs the positioning hole and the solder resist ink layer at the edge of the positioning hole to obtain a corresponding image. The camera module sends the image to the computer for processing. The computer fits the circular contour of the positioning hole according to the image and identifies the center of the positioning hole. When the PCB board reciprocates, the device and method are used to photograph multiple images of the same positioning hole of the PCB board and the solder resist ink layer at the circular edge of the positioning hole, multiple positioning hole circular contours are fitted according to the multiple images, and the maximum discrete value of the center of the multiple positioning hole circular contours calculated according to the multiple positioning hole circular contours is more accurate, so the calculated repeated positioning accuracy of the PCB board is more accurate.

[0091] The present invention also discloses a storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0092] The present invention also discloses a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. The processor implements the above steps when executing the computer program.

[0093] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for imaging positioning holes of a PCB board, characterized in that: include: Color recognition module, computer, light source module and camera module; The color recognition module is used to recognize the color of the solder mask ink layer of the PCB board and feed back the recognition result to the computer; The computer is used to send a control instruction to the light source module according to the recognition result; The light source module includes a plurality of light emitting units and a mixed light unit of different colors. The light source module emits an outgoing light that matches the color of the solder resist ink layer of the PCB board according to the control instruction. The outgoing light irradiates one of the positioning holes on the PCB board and the solder resist ink layer on the circumferential edge of the positioning hole. The camera module is used to capture an image of the solder resist ink layer including the positioning hole and the circumferential edge of the positioning hole, and send the image to the computer; The computer is also used to fit the circumferential contour of the positioning hole according to the image and calculate the center of the positioning hole; The color of the solder mask ink layer of the PCB board includes white, green, black, red, yellow or blue; the light emitting units of different colors include: a red light unit, a blue light unit and a green light unit; the mixed light unit is a mixed light composed of 75% red light and 25% green light; The light source module emits light that matches the color of the solder mask ink layer of the PCB board according to the control instruction, specifically: When the color of the solder resist ink layer of the PCB board is white, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is green, the computer controls the light source module to emit a mixed light formed by the 75% red output light and the 25% green output light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is black, the computer controls the light source module to emit the red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is red, the computer controls the light source module to emit a mixed light of the 75% red output light and the 25% green output light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is yellow, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is blue, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole.

2. The device according to claim 1, characterized in that The color recognition module recognizes the color of the solder mask ink layer of the PCB board by reading and recognizing through an input computer or by recognizing through a color sensor.

3. The device according to claim 1, characterized in that The camera module is an industrial CCD camera.

4. A method for imaging positioning holes of a PCB board using the device according to any one of claims 1 to 3, characterized in that: The steps include: Step 1: The color recognition module identifies the color of the solder mask ink layer of the PCB board and feeds back the recognition result to the computer; Step 2: The computer controls the light source module to emit light that matches the color of the solder resist ink layer of the PCB board according to the recognition result, and the light irradiates one of the positioning holes on the PCB board and the solder resist ink layer on the circumferential edge of the positioning hole; Step 3: the camera module captures an image of the solder resist ink layer including the positioning hole and the circumferential edge of the positioning hole, and sends the image to the computer; Step 4: The computer fits the circumferential contour of the positioning hole according to the image and calculates the center of the positioning hole; The light source module emits light that matches the color of the solder mask ink layer of the PCB board according to the control instruction, specifically: When the color of the solder resist ink layer of the PCB board is white, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is green, the computer controls the light source module to emit a mixed light consisting of the 75% red output light and the 25% green output light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is black, the computer controls the light source module to emit the red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is red, the computer controls the light source module to emit the mixed light consisting of 75% red light and 25% green light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is yellow, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole; When the color of the solder resist ink layer of the PCB board is blue, the computer controls the light source module to emit red light to illuminate the positioning hole and the solder resist ink layer at the edge of the positioning hole.

5. The method according to claim 4, characterized in that Before step 1, the method further includes: moving the camera module to be directly above the positioning hole, or moving the PCB board so that the positioning hole is directly below the camera module.

6. A storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the steps of the method according to any one of claims 4 or 5 are implemented.

7. A computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the steps of the method according to any one of claims 4 or 5 are implemented.

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