Protection device and protection method of wafer flipping mechanism

Abstract

The present invention discloses a protection device for a wafer flipping mechanism and a protection method thereof, and relates to the field of semiconductor processing technology. The protection device comprises a limiting device, which is arranged outside a containing box of the wafer flipping mechanism, and a wafer box is arranged inside the containing box, and a wafer is arranged inside the wafer box. The limiting device can move between a first state and a second state. When in the first state, the limiting device can limit the sliding of the wafer box, and the limiting device can limit the wafer from leaving the wafer box. When in the second state, the wafer box can freely enter and exit the containing box, and the wafer can freely enter and exit the wafer box. By setting the limiting device, the sliding of the wafer box can be limited, and the wafer can be limited from sliding out of the wafer box, and then in the process of flipping the containing box, the wafer box and the wafer can be protected, and the wafer box and the wafer can be prevented from sliding and sliding out of the wafer box, thereby avoiding damage to the wafer during the flipping process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a protection device and a protection method for a wafer flipping mechanism. Background Art

[0002] During the wafer production process, the wafers placed in the cassette often need to be taken out piece by piece by a robot for various processes, and then put back into the cassette piece by piece after the process is completed. The wafer plane is horizontal during the robot's pick-and-place process. After the process is completed, the cassette full of wafers often needs to be transported as a whole. The cassette is usually placed in a receiving box. At this time, the receiving box needs to be flipped 90°, and then the cassette and the wafers inside the cassette need to be flipped 90° for easy transportation. During the flipping process, the cassette is prone to slipping and the wafer is also prone to slipping out, causing damage to the wafer. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the defects in the prior art that the wafer box is prone to slipping and the wafer is prone to slipping out during the flipping process, and to provide a protection device and a protection method for a wafer flipping mechanism.

[0004] The present invention solves the above technical problems through the following technical solutions:

[0005] A protective device for a wafer flipping mechanism, the protective device comprising a limiting device, the limiting device being arranged outside a containing box of the wafer flipping mechanism, a wafer box being arranged inside the containing box, a wafer being arranged inside the wafer box, the limiting device being able to limit the wafer box from sliding, and the limiting device being able to limit the wafer from leaving the wafer box.

[0006] In this solution, by setting a limit device, the sliding of the film box and the wafer can be restricted from sliding out of the film box. Therefore, during the flipping process of the containing box, the film box and the wafer can be protected to prevent the film box from sliding and the wafer from sliding out of the film box, thereby avoiding damage to the wafer during the flipping process.

[0007] Preferably, the limiting device can move between a first state and a second state. When in the first state, the limiting device can limit the sliding of the film box, and the limiting device can limit the wafer from leaving the film box. When in the second state, the film box can freely enter and exit the containing box, and the wafer can freely enter and exit the film box.

[0008] In this solution, the limiting device has two states. When the containing box is not turned over, the limiting device will not hinder the normal operation of the processing process.

[0009] Preferably, the limiting device comprises a film box limiting device and a wafer limiting device, the film box limiting device can limit the film box from sliding, and the wafer limiting device can limit the wafer from leaving the film box.

[0010] In this solution, the limiting device includes a film box limiting device and a wafer limiting device. The film box limiting device can limit the film box, and the wafer limiting device can limit the wafer, which is more flexible.

[0011] Preferably, the protection device further comprises a detection module, the detection module is arranged on the containing box, the detection module is used to detect the size of the wafer, and the detection module is electrically connected to the limiting device.

[0012] In this solution, the size of the wafer is obtained by the detection module and fed back to the limiting device, and the limiting device can limit the wafer according to the wafer size.

[0013] Preferably, the detection module includes a first infrared counter-radiation sensor, the wafers that can be accommodated in the wafer box include a first wafer and a second wafer, the diameter of the first wafer is larger than the diameter of the second wafer, and the position of the first infrared counter-radiation sensor relative to the accommodating box is set to be triggered after the first wafer is placed in the wafer box, and cannot be triggered after the second wafer is placed in the wafer box.

[0014] In this solution, when the first wafer is placed in the cassette, the first infrared sensor can be triggered by the first wafer, and when the second wafer is placed in the cassette, the first infrared sensor is triggered. Therefore, the first infrared sensor can detect whether the wafer placed in the cassette is the first wafer or the second wafer.

[0015] Preferably, the detection module further comprises a third infrared radiation sensor, and the position of the third infrared radiation sensor relative to the accommodating box is arranged so as to be triggered when the second wafer is placed in the wafer box.

[0016] In this solution, when the second wafer is placed in the cassette, the third infrared sensor will be triggered, because the diameter of the first wafer is larger than the diameter of the second wafer, so when the first wafer is placed in the cassette, the third infrared sensor will also be triggered. Therefore, the third infrared sensor can detect whether there is a wafer in the cassette.

[0017] Preferably, the detection module also includes a second infrared counter-radiation sensor, and the installation position of the second infrared counter-radiation sensor can make its counter-radiation rays located outside the outer periphery of the first wafer, and the installation position of the second infrared counter-radiation sensor can make its counter-radiation rays located in the path of the first wafer being placed into the wafer box.

[0018] In this solution, the second infrared radiation sensor can detect whether the first wafer is in place, and can detect whether there are foreign objects outside the first wafer.

[0019] Preferably, the film box limiting device includes a guide rod cylinder, a first base and a baffle, the first base is installed on the outside of the film box, the guide rod cylinder is installed on the first base, and a baffle is installed at the end of the guide rod cylinder, and the guide rod cylinder can push the baffle to above the upper surface of the edge of the film box.

[0020] In this solution, the guide rod cylinder can push the baffle to the upper surface of the edge of the film box to limit the film box, and when the limit is not needed, the guide rod cylinder can be retracted without affecting normal production work.

[0021] Preferably, the number of the guide rod cylinders is two.

[0022] In this solution, two guide rod cylinders are used to limit the film box more safely and reliably.

[0023] Preferably, when the baffle is located above the upper surface of the edge of the film box, the gap between the baffle and the upper surface of the edge of the film box is 1-3 mm.

[0024] In this solution, the baffle does not directly contact the film box, will not scratch the film box, and can also play a role of limiting.

[0025] Preferably, the wafer limiting device includes a rotating cylinder, a second base and a gear rod, the second base is installed on the outside of the wafer box, the rotating cylinder is installed on the second base, the rotating cylinder is provided with a gear rod, the rotating cylinder can drive the gear rod to rotate to the outside of the outer periphery of the wafer, and a certain gap is left between the gear rod and the outer periphery of the wafer.

[0026] In this solution, the rotating cylinder can drive the lever to rotate to the outside of the outer periphery of the wafer to limit the wafer and prevent the wafer from slipping out of the wafer box, and the lever will not contact the wafer to damage the wafer.

[0027] Preferably, the number of the rotating cylinders is two.

[0028] In this solution, there are two rotating cylinders, which can achieve the positioning of wafers of two different sizes.

[0029] Preferably, a protection method for a wafer flipping mechanism is provided, wherein the protection method for the wafer flipping mechanism utilizes the protection device for the wafer flipping mechanism as described above, wherein the wafer flipping mechanism further comprises a detection module, and the protection method for the wafer flipping mechanism adopts the following steps for protection:

[0030] Detecting the size of the wafer by the detection module;

[0031] Limiting the film box by the film box limiting device;

[0032] The wafer is limited by the wafer limiting device.

[0033] In this solution, the film box and the wafer can be limited. When the film box is turned over, the film box will not slide and the wafer inside the film box will not slide out, which is safer and more reliable.

[0034] The positive progressive effect of the present invention is that in this scheme, by setting a limit device, it is possible to limit the sliding of the film box and the sliding out of the wafer from the film box, and then during the flipping process of the containing box, it can protect the film box and the wafer, prevent the film box from sliding and the wafer from sliding out of the film box, and avoid damage to the wafer during the flipping process. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the front structure of the protection device of the wafer flipping mechanism in a preferred embodiment of the present invention;

[0036] Figure 2 It is a schematic diagram of the reverse structure of the protection device of the wafer flipping mechanism in a preferred embodiment of the present invention;

[0037] Figure 3 The figure is a flow chart of a method for protecting a wafer flipping mechanism according to a preferred embodiment of the present invention.

[0038] Guide rod cylinder 110, baffle 120, first base 130

[0039] The first rotary cylinder 210, the first gear rod 220, the second rotary cylinder 230, the second gear rod 240, and the second base 250

[0040] Storage box 300

[0041] Box 400

[0042] A first wafer 510 and a second wafer 520

[0043] The first infrared radiation sensor 610 and the second infrared radiation sensor 620 DETAILED DESCRIPTION

[0044] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0045] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0046] like Figure 1 and Figure 2 As shown, a protection device for a wafer flipping mechanism includes a limiting device, which is arranged outside a containing box 300 of the wafer flipping mechanism, a wafer box 400 is arranged inside the containing box 300, a wafer is arranged inside the wafer box 400, and the limiting device can limit the sliding of the wafer box 400, and the limiting device can limit the wafer from leaving the wafer box 400. In this solution, by setting the limiting device, the sliding of the wafer box 400 can be limited, and the wafer can be limited from sliding out of the wafer box 400, and then during the flipping process of the containing box 300, the wafer box 400 and the wafer can be protected, and the wafer box 400 can be prevented from sliding and the wafer from sliding out of the wafer box 400, thereby avoiding damage to the wafer during the flipping process.

[0047] Among them, in this embodiment, the limiting device includes a cassette 400 limiting device and a wafer limiting device, the cassette 400 limiting device can limit the sliding of the cassette 400, and the wafer limiting device can limit the wafer from leaving the cassette 400. The limiting device includes a cassette 400 limiting device and a wafer limiting device, the cassette 400 limiting device can limit the cassette 400, and the wafer limiting device can limit the wafer, which is more flexible.

[0048] Specifically, in this embodiment, the limiting device of the film box 400 includes two guide rod cylinders 110, two first bases 130 and two baffles 120, the first base 130 is installed outside the film box 400, the first base 130 is installed on the end surface of the accommodating box 300, the guide rod cylinder 110 is installed on the first base 130, and the baffle 120 is installed at the end of the guide rod cylinder 110, and the two guide rod cylinders 110 can push their respective baffles 120 to the upper surface of the edge of the film box 400. In this solution, the guide rod cylinder 110 can be used to push the baffle 120 to the upper surface of the edge of the film box 400, which plays a role in limiting the film box 400, and when the limiting is not needed, the guide rod cylinder 110 can be retracted without affecting the normal production work, and the use of two guide rod cylinders 110 is safer and more reliable for limiting the film box 400.

[0049] In other embodiments, the number of the guide rod cylinder 110 may be only one, which can also limit the film box 400.

[0050] In other embodiments, the limiting device of the film box 400 may also use an electric push rod to push the baffle 120 to limit the film box 400.

[0051] Among them, in this embodiment, when the baffle 120 is located above the upper surface of the edge of the film box 400, the gap between the baffle 120 and the upper surface of the edge of the film box 400 is 1-3mm. The baffle 120 does not directly contact the film box 400, will not scratch the film box 400, and can also play a limiting role.

[0052] In this embodiment, the limiting device includes a first rotating cylinder 210, a first gear rod 220, a second rotating cylinder 230, a second gear rod 240 and a second base 250. The second base 250 is installed on the outside of the film box 400, and the second base 250 is installed in the middle position of the side end surface of the accommodating box 300. The first rotating cylinder 210 and the second rotating cylinder 230 are installed on the second base 250. The first rotating cylinder 210 is provided with a first gear rod 220, and the second rotating cylinder 230 is provided with a second gear rod 240. The installation position of the cylinder 210 on the second base 250 enables the first rotary cylinder 210 to drive the first gear rod 220 to rotate to the outside of the outer periphery of the first wafer 510, and a certain gap is left between the first gear rod 220 and the outer periphery of the first wafer 510. The installation position of the second rotary cylinder 230 on the second base 250 enables the second rotary cylinder 230 to drive the second gear rod 240 to rotate to the outside of the outer periphery of the second wafer 520, and a certain gap is left between the second gear rod 240 and the outer periphery of the second wafer 520. The rotary cylinder can drive the gear rod to rotate to the outside of the outer periphery of the wafer to limit the wafer and prevent the wafer from slipping out of the wafer box 400, and the gear rod will not contact the wafer to damage the wafer. There are two rotary cylinders, which can limit the position of two wafers of different sizes.

[0053] Among them, in this embodiment, it should be noted that, Figure 2 In the figure, the first wafer 510 and the second wafer 520 are only used to indicate the size relationship, and the first wafer 510 and the second wafer 520 are not put into the wafer box 400 at the same time.

[0054] In other embodiments, the number of the rotating cylinder may be one, and only one type of wafer is limited.

[0055] In other embodiments, the rotating cylinder may also be implemented by other devices capable of realizing the rotating function, for example, the rotating cylinder may be replaced by a motor.

[0056] In this embodiment, the limiting device can move between a first state and a second state. When in the first state, the limiting device can limit the sliding of the film box 400, and the limiting device can limit the wafer from leaving the film box 400. When in the second state, the film box 400 can freely enter and exit the containing box 300, and the wafer can freely enter and exit the film box 400. The limiting device has two states. When the containing box 300 is not turned over, the limiting device will not hinder the normal operation of the processing process.

[0057] In this embodiment, the protection device also includes a detection module, which is arranged on the containing box 300. The detection module is used to detect the size of the wafer. The detection module is electrically connected to the limiting device. The size of the wafer is obtained through the detection module and fed back to the limiting device. The limiting device can limit the wafer according to the size of the wafer.

[0058] Specifically, Figure 1 and Figure 2 As shown, the detection module includes a first infrared radiation sensor 610, and the wafers that can be accommodated in the wafer box 400 include a first wafer 510 and a second wafer 520. The diameter of the first wafer 510 is greater than the diameter of the second wafer 520. The position of the first infrared radiation sensor 610 relative to the accommodating box 300 is set to be triggered after the first wafer 510 is placed in the wafer box 400, and cannot be triggered after the second wafer 520 is placed in the wafer box 400. In this solution, when the first wafer 510 is placed in the wafer box 400, the first infrared radiation sensor 610 can be triggered by the first wafer 510, and when the second wafer 520 is placed in the wafer box 400, the first infrared radiation sensor 610 will not be triggered. Therefore, the first infrared radiation sensor 610 can detect whether the wafer placed in the wafer box 400 is the first wafer 510 or the second wafer 520.

[0059] In this embodiment, the detection module further includes a second infrared radiation sensor 620, and the installation position of the second infrared radiation sensor 620 can make its radiation be located outside the outer periphery of the first wafer 510, and the installation position of the second infrared radiation sensor 620 can make its radiation be located in the path of the first wafer 510 into the cassette 400. In this solution, the second infrared radiation sensor 620 can detect whether the first wafer 510 is in place, and can detect whether there is any foreign matter outside the first wafer 510.

[0060] In other embodiments, the detection module further includes a third infrared radiation sensor, and the position of the third infrared radiation sensor relative to the containing box 300 is set to be triggered when the second wafer 520 is placed in the wafer box 400. In this solution, when the second wafer 520 is placed in the wafer box 400, the third infrared radiation sensor will be triggered, because the diameter of the first wafer 510 is greater than the diameter of the second wafer 520, so when the first wafer 510 is placed in the wafer box 400, the third infrared radiation sensor will also be triggered. Therefore, the third infrared radiation sensor can detect whether a wafer is placed in the wafer box 400.

[0061] Among them, when the infrared radiation is blocked, the infrared radiation sensor will be triggered.

[0062] In other embodiments, the detection module may also be replaced by other sensors capable of detecting size, such as an ultrasonic sensor, etc., or a camera may be used to detect the wafer size.

[0063] like Figure 3 As shown, in this embodiment, a protection method for a wafer flipping mechanism is also provided. The protection method for the wafer flipping mechanism utilizes the protection device for the wafer flipping mechanism as described above, and adopts the following steps for protection:

[0064] S1 detects the size of the wafer through the detection module;

[0065] S2: limiting the position of the film box 400 by the film box 400 limiting device;

[0066] S3 limits the wafer through the wafer limiting device.

[0067] In this solution, the chip box 400 and the wafer can be limited. When the chip box 400 is turned over, the chip box 400 will not slide, and the wafer inside the chip box 400 will not slide out, which is safer and more reliable.

[0068] Among them, S1 only needs to be implemented before S3.

[0069] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A protective device for a wafer flipping mechanism, characterized in that: The protection device includes a limiting device, the limiting device is arranged outside the accommodating box of the wafer flipping mechanism, a wafer box is arranged inside the accommodating box, a wafer is arranged inside the wafer box, the limiting device can limit the wafer box from sliding, and the limiting device can limit the wafer from leaving the wafer box; The limiting device includes a film box limiting device and a wafer limiting device, the film box limiting device can limit the film box from sliding, and the wafer limiting device can limit the wafer from leaving the film box; The film box limiting device includes a guide rod cylinder, a first base and a baffle, wherein the first base is installed outside the film box, the guide rod cylinder is installed on the first base, and a baffle is installed at the end of the guide rod cylinder, and the guide rod cylinder can push the baffle to above the upper surface of the edge of the film box; The wafer limiting device includes a rotating cylinder, a second base and a gear rod. The second base is installed on the outside of the wafer box, and the rotating cylinder is installed on the second base. The rotating cylinder is provided with a gear rod. The rotating cylinder can drive the gear rod to rotate to the outside of the outer periphery of the wafer, and a certain gap is left between the gear rod and the outer periphery of the wafer.

2. The protection device for the wafer flipping mechanism according to claim 1, characterized in that: The limiting device can move between a first state and a second state. When in the first state, the limiting device can limit the sliding of the film box, and the limiting device can limit the wafer from leaving the film box. When in the second state, the film box can freely enter and exit the containing box, and the wafer can freely enter and exit the film box.

3. The protection device for the wafer flipping mechanism according to claim 1, characterized in that: The protection device further comprises a detection module, the detection module is arranged on the containing box, the detection module is used to detect the size of the wafer, and the detection module is electrically connected to the limiting device.

4. The protection device for the wafer flipping mechanism according to claim 3, characterized in that: The detection module includes a first infrared counter-radiation sensor, and the wafers that can be accommodated in the wafer box include a first wafer and a second wafer. The diameter of the first wafer is larger than the diameter of the second wafer. The position of the first infrared counter-radiation sensor relative to the accommodating box is set to be triggered after the first wafer is placed in the wafer box, and cannot be triggered after the second wafer is placed in the wafer box.

5. The protection device for the wafer flipping mechanism according to claim 4, characterized in that: The detection module further includes a third infrared radiation sensor, and the position of the third infrared radiation sensor relative to the accommodating box is arranged so as to be triggered when the second wafer is placed in the wafer box.

6. The protection device for the wafer flipping mechanism according to claim 4, characterized in that: The detection module also includes a second infrared radiation sensor, and the installation position of the second infrared radiation sensor can make its radiation be located outside the outer periphery of the first wafer, and the installation position of the second infrared radiation sensor can make its radiation be located in the path of the first wafer being placed in the wafer box.

7. The protection device for the wafer flipping mechanism according to claim 1, characterized in that: The number of the guide rod cylinders is two.

8. The protection device for the wafer flipping mechanism according to claim 1, characterized in that: When the baffle is located above the upper surface of the edge of the film box, the gap between the baffle and the upper surface of the edge of the film box is 1-3 mm.

9. The protection device for the wafer flipping mechanism according to claim 1, characterized in that: The number of the rotary cylinders is two.

10. A method for protecting a wafer flipping mechanism, characterized in that: The protection method of the wafer flipping mechanism utilizes the protection device of the wafer flipping mechanism according to any one of claims 1 to 9, wherein the wafer flipping mechanism further comprises a detection module, and the protection method of the wafer flipping mechanism adopts the following steps for protection: Detecting the size of the wafer by the detection module; Limiting the film box by the film box limiting device; The wafer is limited by the wafer limiting device.

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