Method for manufacturing conductive film layer, conductive film layer structure, and touch sensor

Abstract

The present invention provides a method for manufacturing a conductive film layer, a conductive film layer structure, a touch sensor, and a touch screen. The method for manufacturing the conductive film layer includes: providing a conductive material film to be etched, which is obtained by processing a conductive material layer on the surface of a first region of a carrier layer, where the first region of the carrier layer corresponds to the sensing region of the conductive film layer, and the second region of the carrier layer corresponds to the lead region of the conductive film layer; etching the conductive material layer to form a patterned conductive layer; forming a dielectric layer with a groove on the surface of the second region of the carrier layer; and filling the groove with a metal paste to form an electrode lead. The method for manufacturing the conductive film layer provided by the present invention forms patterns of conductive electrodes and compensation electrodes with fine line spacing on the conductive film layer, and electrode leads disposed inside the groove, improving the color difference visibility problem of the touch screen in some scenarios and increasing the production yield and use reliability of the electrode leads.

Description

Technical Field

[0001] The present invention relates to the technical field of touch devices, and particularly to a method for manufacturing a conductive film layer, a conductive film layer structure, a touch sensor, and a touch screen. Background Art

[0002] With the rapid development of touch screen technology, the application fields of touch screens are becoming more and more extensive. In order to meet various usage requirements in different usage scenarios, the development of touch screen technology shows trends such as specialization, multi-functionality, three-dimensionality, and large screen.

[0003] Touch screens have advantages such as convenience, intuitiveness, clear images, durability, and space saving. However, in some usage scenarios, color differences may occur on the touch screen. For example, in special lighting or AR glass, in some special cases, the color difference on the surface of the touch screen will be more obvious, thus affecting the user experience. On the other hand, due to factors such as production processes or usage wear, breakpoints or loose connections may occur in the conductive lines, thereby affecting the normal use of the touch screen. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a method for manufacturing a conductive film layer, a conductive film layer structure, a touch sensor, and a touch screen, which can achieve ultra-precise manufacturing of conductive lines and improve the production yield and usage reliability of electrode leads.

[0005] In a first aspect, embodiments of the present invention provide a method for manufacturing a conductive film layer, including: providing a conductive material film to be etched, the conductive material film being obtained by processing a conductive material layer on the surface of a first region of a carrier layer, the first region of the carrier layer corresponding to the sensing region of the conductive film layer, and the second region of the carrier layer corresponding to the lead region of the conductive film layer; etching the conductive material layer to form a patterned conductive layer, wherein the patterned conductive layer includes a conductive electrode and a compensation electrode, and the conductive electrode and the compensation electrode are insulated from each other; forming a dielectric layer with a groove on the surface of the second region of the carrier layer; and filling a metal paste into the groove to form an electrode lead.

[0006] In certain embodiments of the first aspect of the present invention, the conductive material layer completely covers the first region and partially covers the second region, and the conductive electrode and the electrode lead have an overlapping and lapping portion in the second region.

[0007] In certain embodiments of the first aspect of the present invention, the conductive material layer is etched to form a patterned conductive layer, including: using a gravure roller mold to print an etchant on the conductive material layer to etch the conductive material layer to form a patterned conductive layer, or preparing a photoresist layer on the surface of the conductive material layer away from the carrier layer, wherein the photoresist layer is provided with a first hollow pattern; stacking a stencil jig having a second hollow pattern on the surface of the photoresist layer away from the conductive material layer, wherein the orthographic projection area of the second hollow pattern on the plane where the conductive material layer is located at least partially overlaps with the orthographic projection area of the first hollow pattern on the plane where the conductive material layer is located; based on the stencil jig and the photoresist layer, etching the conductive material layer to form a patterned conductive layer.

[0008] In certain embodiments of the first aspect of the present invention, a dielectric layer having a groove is formed on the surface of the second area of the carrier layer, including: coating a photosensitive resin layer on the surface of the second area of the carrier layer; performing an exposure and development process on the photosensitive resin layer to form a photosensitive resin layer having a groove; or, using a printing process to print a colloidal layer having a groove on the surface of the second area of the carrier layer.

[0009] In certain embodiments of the first aspect of the present invention, metal slurry is filled into the interior of the slot body to form an electrode lead, comprising: accurately aligning the hollow pattern of the stencil jig with the slot body and covering the stencil on the surface of the dielectric layer away from the carrier layer, so that the orthographic projection area formed by the hollow pattern of the stencil jig on the plane where the dielectric layer is located at least partially overlaps the orthographic projection area formed by the slot body on the plane where the dielectric layer is located; and filling the metal slurry into the interior of the slot body through the hollow pattern of the stencil jig to form the electrode lead.

[0010] In a second aspect, an embodiment of the present invention provides a conductive film layer structure, which includes: a conductive electrode, which is arranged in a sensing area of the conductive film layer, and the conductive electrode includes at least one sensing electrode strip; a compensation electrode, which includes one or more compensation blocks, which are arranged in a compensation area around at least one sensing electrode strip, and the compensation electrode is insulated from the conductive electrode; an electrode lead, which is located in a lead area of the conductive film layer, and the electrode lead is electrically connected to the conductive electrode; an insulating medium, which is located in the lead area of the conductive film layer, and the insulating medium is provided with a groove body, and the electrode lead is arranged inside the groove body; and a carrier, which is used to carry the conductive electrode, the compensation electrode, the electrode lead and the insulating medium. The structure of the conductive film layer has the advantages of improving the color difference of the touch screen surface and improving the reliability of electrical connection.

[0011] In some embodiments of the second aspect of the present invention, at least one end of the conductive electrode extends through the edge of the sensing area to the lead area to form an extension of the conductive electrode, and the extension of the conductive electrode overlaps with one end of an adjacent electrode lead.

[0012] In certain embodiments of the second aspect of the present invention, the electrode lead includes at least two parts. One end of the first part of the electrode lead is electrically connected to the conductive electrode, and one end of the second part of the electrode lead is electrically connected to the other end of the first part of the electrode lead. Wherein, the width of the first part of the electrode lead is greater than the width of the first part of the electrode lead.

[0013] In certain embodiments of the second aspect of the present invention, the structure of the electrode lead is a single metal strip, and / or, a metal grid strip, wherein the metal grid strip includes one or a combination of more of a rectangle, a rhombus, a regular polygon or an arbitrary polygon.

[0014] In certain embodiments of the second aspect of the present invention, the conductive electrode includes: a plurality of electrode blocks; and a connecting portion for connecting any two adjacent electrode blocks among the plurality of electrode blocks, and the connecting portion is provided with a hollow structure.

[0015] In a third aspect, an embodiment of the present invention provides a touch sensor, which includes the above-mentioned conductive film layer structure.

[0016] In a fourth aspect, an embodiment of the present invention provides a touch screen, which includes the above-mentioned touch sensor.

[0017] The manufacturing method of the conductive film layer, the conductive film layer structure, the touch sensor and the touch screen provided by the present invention form patterns of conductive electrodes and compensation electrodes with fine line spacings on the conductive film layer, improving the visual effect of the display area and the color difference visibility problem of the touch screen. At the same time, in the manufacturing method of the conductive film layer, the conductive film layer structure, the touch sensor and the touch screen provided by the present invention, the electrode leads are arranged inside the groove body, improving the production yield and electrical connection reliability of the electrode leads and extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a schematic flow chart of a method for manufacturing a conductive film layer provided by an exemplary embodiment of the present invention.

[0019] Figure 2A Shown is a schematic diagram of a touch control area and a lead area of a conductive film layer structure provided by an exemplary embodiment of the present invention.

[0020] Figure 2B Shown is a schematic diagram of a conductive film layer structure provided by an exemplary embodiment of the present invention.

[0021] Figure 3A Shown is a schematic diagram of an electrode pattern structure of a touch control area provided by an exemplary embodiment of the present invention.

[0022] Figure 3B Shown is a schematic diagram of an electrode pattern structure of a touch control area provided by another exemplary embodiment of the present invention.

[0023] Figure 3C The figure shows a schematic diagram of the electrode pattern structure of the touch area provided by another exemplary embodiment of the present invention.

[0024] Figure 4 The figure shows a schematic diagram of the conductive film layer structure provided by another exemplary embodiment of the present invention.

[0025] Figure 4A The figure shows a schematic diagram of part A of the conductive film layer structure provided by an exemplary embodiment of the present invention.

[0026] Figure 5 The figure shows a schematic diagram of forming a patterned conductive mold layer structure by using a gravure roller die provided by an exemplary embodiment of the present invention.

[0027] Figure 6 The figure shows a schematic diagram of the process of forming a patterned conductive layer provided by an exemplary embodiment of the present invention.

[0028] Figure 7 The figure shows a schematic diagram of forming a patterned conductive mold layer structure provided by an exemplary embodiment of the present invention.

[0029] Figure 8 The figure shows a schematic diagram of the process of manufacturing a conductive film layer provided by another exemplary embodiment of the present invention.

[0030] Figure 9 The figure shows a schematic diagram of the electrode lead structure provided by an exemplary embodiment of the present invention.

[0031] Figure 10 The figure shows a schematic diagram of the electrode lead structure provided by another exemplary embodiment of the present invention.

[0032] Figure 11 The figure shows a schematic diagram of the electrode lead structure provided by another exemplary embodiment of the present invention. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] The conductive layer of the touch screen is mainly formed on the insulating substrate by vacuum coating and patterning etching of ITO (indium tin oxide). The touch sensing area and the lead area adjacent to the touch sensing area are defined on the conductive layer. In the lead area, the electrode leads can use the printing process to directly print the silver paste on the conductive material layer and form the electrode leads after curing. However, the fineness of the circuit prepared by the printing process is too rough, and it is difficult to make the line width of the electrode leads thinner. For example, the line width is in the range of 80 to 120 microns in terms of fineness, which seriously affects the narrow bezel design of the display screen, and the production yield decreases as the electrode leads become thinner. In the touch sensing area, the ITO layer forms a conductive layer with a certain pattern with an uneven effect after photolithography. Due to the optical differences in light transmittance, reflectance, etc. between the hollow area and the ITO area (non-hollow area), in some cases, color differences exist on the surface of the capacitive touch screen, and under special lights or anti-reflection glasses with different wavelengths or different angles, the color differences on the surface of the capacitive touch screen will be more obvious, affecting the user experience.

[0035] To solve the above problems, the embodiments of the present invention provide a method for manufacturing a conductive film layer, a conductive film layer structure, a touch sensor, and a touch screen, which improve the visual effect of the display area and the color difference visibility of the touch screen, improve the production yield and electrical connection reliability of the electrode leads, and extend the service life.

[0036] In the embodiments provided by the present invention, taking the production of the conductive film layer of the touch screen as an example, in combination with Figures 1 to 8 it will be described in detail.

[0037] It should be noted that in the various diagrams of the present application, for the convenience of illustration, the sizes of some structures or parts are exaggerated relative to other structures or parts. Therefore, it is only used to illustrate the basic structure of the subject matter of the present application.

[0038] Figure 1 The flowchart of the method for manufacturing the conductive film layer provided by an exemplary embodiment of the present invention is shown. Figure 2A The schematic diagram of the touch area and the lead area of the conductive film layer structure provided by an exemplary embodiment of the present invention is shown. Figure 2B The schematic diagram of the conductive film layer structure provided by an exemplary embodiment of the present invention is shown. Figure 3A The schematic diagram of the electrode pattern structure of the touch area provided by an exemplary embodiment of the present invention is shown.

[0039] As Figure 1 shown, the method for manufacturing the conductive film layer includes the following contents.

[0040] S110: Provide a conductive material film to be etched, which is obtained by processing a conductive material layer on the surface of the first region of a carrier layer. The first region of the carrier layer corresponds to the sensing region of the conductive film layer, and the second region of the carrier layer corresponds to the lead region of the conductive film layer.

[0041] As Figure 2A , 2B shown, the conductive material film includes a conductive material layer 2020 and a carrier layer 2010. The carrier layer 2010 includes a first region Ⅰ and a second region Ⅱ. The first region Ⅰ of the carrier layer 2010 corresponds to the touch sensing region Ⅰ of the conductive film layer, and the second region Ⅱ of the carrier layer 2010 corresponds to the lead region Ⅱ of the conductive film layer. The conductive material layer 2020 is laminated on the upper surface of the first region Ⅰ of the carrier layer 2010, and the carrier layer 2010 is used to carry the conductive material layer 2020. In some embodiments, the material of the carrier layer 2010 can be an etching-resistant insulating polymer. For example, the carrier material can be at least one of polycarbonate, polyethylene terephthalate, polymethyl methacrylate, and glass. The conductive material layer 2020 can be formed on the upper surface of the first region Ⅰ of the carrier layer 2010 by sputtering, electroplating, evaporation, coating, etc. In some embodiments, the thickness of the conductive material layer 2020 is at the micron level. For example, it can be 2 microns, and in a thinner case, it can be less than 1 micron.

[0042] S120: Etch the conductive material layer to form a patterned conductive layer, where the patterned conductive layer includes a conductive electrode and a compensation electrode, and the conductive electrode and the compensation electrode are insulated from each other.

[0043] As Figure 3A shown, etch the conductive material layer to form a patterned conductive layer. The patterned conductive layer includes a conductive electrode and a compensation electrode. Among them, the conductive electrode includes at least one sensing electrode strip 301. The form of the sensing electrode strip 301 can be a cuboid or a series of multiple rhombuses, and the specific form is not limited.

[0044] S130: Form a dielectric layer with a groove on the surface of the second region of the carrier layer.

[0045] As Figure 2A, as shown in Figure 2B, the dielectric layer 2030 is stacked on the upper surface of the second region II of the carrier layer 2010, and the carrier layer 2010 is used to carry the dielectric layer 2030. The dielectric layer 2030 is made of a material that does not have a conductive function, such as a colloid or a resin. Among them, the dielectric layer 2030 has a groove 2040, and the groove 2040 is a groove with a certain depth formed on the dielectric layer. In some embodiments of the present invention, the depth of the groove 2040 can be the same as the thickness of the dielectric layer. The number of grooves 2040 can be one or more, and the shape of the groove 2040 can be set according to the target pattern, which is not limited here.

[0046] S140: Fill the metal paste into the groove to form the electrode lead.

[0047] The metal paste refers to any material that can achieve a conductive function, such as gold, silver, copper, or a metal alloy, etc. Fill the prepared metal paste into the groove of the dielectric layer, and after the metal paste is cured, the electrode lead is formed.

[0048] According to the method for manufacturing the conductive film layer provided by the embodiment of the present invention, the patterns of the conductive electrode and the compensation electrode are formed on the conductive film layer, which improves the visual effect of the display area and the color difference visibility problem of the touch screen. In addition, for the electrode lead manufactured according to this manufacturing method, the line width and spacing can be refined, which is beneficial to the design of a touch screen with a narrower border. At the same time, this manufacturing method arranges the electrode lead inside the groove, and the dielectric layer can play a certain protective role for the electrode lead, improving the production yield and electrical connection reliability of the electrode lead and extending the service life.

[0049] In some embodiments of the present invention, the conductive material layer completely covers the first region and partially covers the second region, and the conductive electrode and the electrode lead have an overlapping and overlapping part in the second region.

[0050] Figure 4 The figure shows a schematic diagram of the conductive film layer structure provided by another exemplary embodiment of the present invention. Figure 4A The figure shows a schematic diagram of a partial A of the conductive film layer structure provided by an exemplary embodiment of the present invention.

[0051] Specifically, in combination with Figure 1 -3, the conductive material layer 2020 provided in the first region I of the carrier layer 2010 extends to the second region II of the carrier layer 2010, and an extension part of the electrode is formed in the lead region II of the conductive film layer. As Figure 4As shown, the conductive material layer 2020 is etched (corresponding to S120) to form a patterned conductive layer, and a pattern including conductive electrodes is formed in the second region II of the carrier layer 2010. A dielectric layer 2030 having a groove 2040 is formed on the surface of the second region II of the carrier layer 2010 (corresponding to S130), and a part of the dielectric layer 2030 having the groove 2040 overlaps and is disposed on the upper surface of the conductive electrode of the extension of the electrode in the second region II.

[0052] As Figure 4 , Figure 4A shown, metal paste is filled into the groove 2040 to form an electrode lead 303 (corresponding to S130). One end of the electrode lead 303 overlaps with the conductive electrode in the second region II at an overlapping portion III, so as to form an overlapping connection between at least one end of the conductive electrode and one end of the electrode lead 303, thereby avoiding problems such as open circuit or virtual connection caused by factors such as insufficient filling of the conductive paste at the end, improving the reliability of the electrical connection of the circuit, and extending the service life.

[0053] In some embodiments of the present invention, etching the conductive material layer to form a patterned conductive layer includes: printing an etchant on the conductive material layer using a gravure roller die to etch and form a patterned conductive layer on the conductive material layer, or preparing a photoresist layer on the surface of the conductive material layer away from the carrier layer, wherein the photoresist layer is provided with a first hollow pattern; laminating a stencil fixture having a second hollow pattern on the surface of the photoresist layer away from the conductive material layer, wherein at least a part of the orthographic projection area of the second hollow pattern on the plane where the conductive material layer is located coincides with the orthographic projection area of the first hollow pattern on the plane where the conductive material layer is located; etching the conductive material layer based on the stencil fixture and the photoresist layer to form a patterned conductive layer.

[0054] Figure 5 Shown is a schematic diagram of a patterned conductive mold layer structure formed using a gravure roller die according to an exemplary embodiment of the present invention.

[0055] As Figure 5 shown, the gravure roller die 50 is provided with at least one groove 51, and an etchant 52 is filled in at least one groove 51 of the gravure roller die. By using the gravure printing method, the etchant 52 filled in the gravure roller die 50 is transferred to the conductive material layer 2020, and the conductive material layer 2020 is etched using the etchant 52 to form a patterned conductive layer. It should be noted that the pattern of the groove 51 of the gravure roller die 50 can be made according to a preset pattern, and the conductive material at the position where the etchant 52 is printed on the conductive material layer 2020 will be removed, thereby forming a patterned conductive layer.

[0056] Figure 6The figure shows a schematic flowchart of forming a patterned conductive layer provided by an exemplary embodiment of the present invention. Figure 7 The figure shows a schematic diagram of forming a patterned conductive mold layer structure provided by an exemplary embodiment of the present invention.

[0057] Alternatively, as Figures 6 - 7 shown, the patterned conductive layer can be fabricated and formed using the following process.

[0058] S610: Prepare a photoresist layer on the surface of the conductive material layer away from the carrier layer, wherein the photoresist layer is provided with a first hollow pattern.

[0059] The photoresist layer includes a photoresist material, which is also known as photoresist, photosensitive substance, or photosensitive glue, etc. Coat the photoresist material on the surface of the conductive material layer 2020 away from the preparation carrier to form a photoresist material layer. Cover a mask on the surface of the photoresist material layer away from the conductive material layer. Irradiate the surface of the mask away from the photoresist material layer, and then remove the mask. Develop and remove the uncured photoresist material in the photoresist material layer to obtain a photoresist layer 2050 including the first hollow pattern.

[0060] S620: Stack a stencil fixture with a second hollow pattern on the surface of the photoresist layer away from the conductive material layer, wherein at least part of the orthographic projection area of the second hollow pattern on the plane where the conductive material layer is located coincides with at least part of the orthographic projection area of the first hollow pattern on the plane where the conductive material layer is located.

[0061] The stencil fixture 2060 is stacked on the surface of the photoresist layer 2050. Based on the positioning marks, the stencil fixture 2060 and the photoresist layer 2050 are accurately positioned so that at least part of the orthographic projection area of the second hollow pattern of the stencil fixture 2060 on the plane where the conductive material layer 2020 is located coincides with at least part of the orthographic projection area of the first hollow pattern on the plane where the conductive material layer 2020 is located. It can be understood that at least part of the coincidence includes two parts: partial coincidence and full coincidence.

[0062] S630: Etch the conductive material layer based on the stencil fixture and the photoresist layer to form a patterned conductive layer.

[0063] Coat an etchant on the surface of the stencil fixture 2060 away from the photoresist layer. The etchant flows through the second hollow pattern and the first hollow pattern in sequence and then etches the conductive material layer 2020 to form a patterned conductive layer.

[0064] Combined with Figure 1 and Figure 6 the manufacturing method of the conductive film layer described above, using a stencil fixture to etch the conductive material layer to form a patterned conductive layer, realizes an electrode pattern with a finer line pitch.

[0065] In certain embodiments of the present invention, a dielectric layer with a groove is formed on the surface of the second region of the carrier layer, including: coating a photosensitive resin layer on the surface of the second region of the carrier layer; performing exposure and development process on the photosensitive resin layer to form a photosensitive resin layer with a groove; or, printing a colloidal layer with a groove on the surface of the second region of the carrier layer by using a printing process.

[0066] Specifically, a photosensitive resin layer is coated on the surface of the second region Ⅱ of the carrier layer. Preferably, the photosensitive resin material should be continuously and evenly coated. Perform exposure and development process on the photosensitive resin layer to form a photosensitive resin layer with a groove. The specific steps can refer to step S610 and will not be described in detail here.

[0067] Alternatively, in the dielectric layer of the embodiment, a printing process can also be used to directly print a colloidal layer with a groove on the surface of the second region Ⅱ of the carrier layer.

[0068] In this solution, the dielectric layer formed in the second region of the carrier layer protects the electrode leads, improving the production yield and reliability of the electrode leads.

[0069] In certain embodiments of the present invention, metal paste is filled into the groove to form electrode leads, including: precisely aligning the hollow pattern of the stencil fixture with the groove and covering the stencil on the surface of the dielectric layer away from the carrier layer, so that at least part of the positive projection area formed by the hollow pattern of the stencil fixture in the plane where the dielectric layer is located coincides with the positive projection area formed by the groove in the plane where the dielectric layer is located; filling the metal paste into the groove through the hollow pattern of the stencil fixture to form electrode leads.

[0070] Specifically, the hollow pattern of the stencil fixture can be made according to the preset pattern of the electrode leads. Positioning marks are set on the stencil fixture and the carrier layer, and the hollow pattern of the stencil fixture is precisely aligned with the groove of the carrier layer, so that the metal paste is filled into the groove through the hollow pattern of the stencil fixture to form electrode leads. This solution realizes the production of electrode leads with fine line spacing and improves the production yield of the electrode leads.

[0071] Figure 8 The figure shows a schematic flow chart of a method for manufacturing a conductive film layer provided by another exemplary embodiment of the present invention.

[0072] As Figure 8 shown, the manufacturing method includes the following content.

[0073] S810: Provide a conductive material film to be etched. The conductive material film includes a carrier layer and a conductive material layer formed on the first region and the extended second region of the carrier layer by sputtering.

[0074] S820: Coating a photoresist material on the surface of the conductive material layer away from the carrier layer, and performing exposure and development process steps on the photoresist material layer to obtain a photoresist layer with a hollow pattern.

[0075] S830: Stacking the stencil fixture layer on the surface of the photoresist layer away from the conductive material layer, and performing precise alignment based on the alignment marks.

[0076] S840: Passing the etchant through the hollow pattern of the stencil fixture and the photoresist layer in sequence to etch the conductive material layer to form an electrode pattern, and a part of the electrode pattern extends to the lead region of the conductive film layer.

[0077] In some embodiments of the present invention, the above steps S820 - S840 can be replaced by Figure 5 the embodiments shown.

[0078] S850: Coating a layer of photosensitive resin layer on the surface of the second region of the carrier layer, and the photosensitive resin layer has an overlapping part with the electrode pattern formed in the lead region of the conductive film layer.

[0079] S860: Setting a mask plate, performing exposure and development on the photosensitive resin layer, removing the mask plate, and forming a photosensitive resin layer with a groove.

[0080] S870: Stacking the stencil fixture with a hollow pattern on the surface of the photosensitive resin layer away from the carrier, and performing precise alignment based on the alignment marks.

[0081] S880: Providing metal paste, and filling the metal paste into the groove of the photosensitive resin layer through the hollow pattern of the stencil fixture to form electrode leads.

[0082] In some embodiments of the present invention, the above steps S850 - S860 can also adopt a printing process to directly print and form a colloidal layer with a groove on the surface of the second region of the carrier layer, so as to simplify the process flow and reduce the manufacturing cost.

[0083] An embodiment of the present invention provides a conductive film layer structure, as Figure 2A, 2B, 3A, the conductive film layer is defined with a sensing area I and a lead area II, the conductive film layer structure includes a conductive electrode, which is arranged in the sensing area I of the conductive film layer, and the conductive electrode includes at least one sensing electrode strip 301; a compensation electrode, including one or more compensation blocks 302, which are arranged in the compensation area around the at least one sensing electrode strip 301, and the compensation electrode is insulated from the conductive electrode; an electrode lead 303, which is located in the lead area II of the conductive film layer, and the electrode lead 303 is electrically connected to the conductive electrode; an insulating medium 2030, which is located in the lead area II of the conductive film layer, and the insulating medium is provided with a slot 2040, and the electrode lead 303 is arranged inside the slot 2040; and a carrier 2010, which is used to carry the conductive electrode, the compensation electrode, the electrode lead and the insulating medium.

[0084] By setting the electrode lead inside the slot of the insulating medium, on the one hand, the insulating medium plays a certain protective role on the electrode lead during use, reducing the probability of wear or breakage of the electrode lead, improving the reliability of the electrical connection, and extending the service life; on the other hand, by forming a slot with an ultra-fine width, the line spacing of the electrode lead can be refined and the touch screen can be designed with a narrower frame. At the same time, by setting one or more compensation blocks in the compensation area, the difference in optical properties such as transmittance, reflectivity and refractive index between the area where the conductive electrode is located and other non-conductive electrode areas (compensation areas) is reduced, thereby reducing the color difference of the conductive film layer structure, improving the color difference visibility problem of the touch screen in some scenarios, and improving the user experience.

[0085] In some embodiments of the present invention, in combination with the embodiment shown in FIG. 2 , the conductive material layer 2020 is formed on the carrier layer 2010 by vacuum coating or sputtering, and at least one end of the conductive material layer 2020 passes through the edge of the sensing area I and extends to the lead area II to form an extension of the conductive electrode, and the extension of the conductive electrode overlaps and overlaps with one end of the adjacent electrode lead. Figure 4 , Figure 4A As shown, one end of the sensing electrode strip 301 passes through the edge of the sensing area I and extends to the lead area II, wherein the sensing electrode strip 301 may be in the form of a rectangular parallelepiped, or may be a string of multiple rhombuses, or may be any polygon, which is not limited here. One end of the sensing electrode strip 301 and one end of the electrode lead 303 form an overlapping connection in the overlapping area III, thereby avoiding the situation of disconnection or virtual connection due to factors such as insufficient metal slurry filling at the end of the electrode lead, and improving the reliability of the electrical connection.

[0086] Figure 9 Shown is a schematic diagram of an electrode lead structure provided by an exemplary embodiment of the present invention.

[0087] In some embodiments of the present invention, the electrode lead includes at least two parts. One end of the first part of the electrode lead is electrically connected to the conductive electrode, and one end of the second part of the electrode lead is electrically connected to the other end of the first part of the electrode lead. Wherein, the width of the first part of the electrode lead is greater than the width of the first part of the electrode lead.

[0088] As Figure 9 shown, the electrode lead 303 includes a first part 3031 and a second part 3032. One end of the first part 3031 is electrically connected to the induction electrode strip 301, and the other end of the first part 3031 is electrically connected to the second part. Wherein, the width of the first part 3031 of the electrode lead is greater than that of the second part 3032, which effectively improves the electrical connection reliability between the conductive electrode and the electrode lead. The width of the second part 3032 of the electrode electrode lead is less than that of the first part 3032, which is more conducive to the design of the narrow border of the touch screen.

[0089] Figure 10 The figure shows a schematic diagram of the electrode lead structure provided by another exemplary embodiment of the present invention. Figure 11 The figure shows a schematic diagram of the electrode lead structure provided by another exemplary embodiment of the present invention.

[0090] In some embodiments of the present invention, as Figure 10 shown, the structure of the electrode lead 303 is in the form of a single metal strip.

[0091] In some embodiments of the present invention, as Figure 11 shown, the structure of the electrode lead 303 is a metal grid strip. Wherein, the metal grid strip includes one or more combinations of a rectangle, a rhombus, a regular polygon or any polygon. The electrode lead of the metal grid strip can ensure the reliability of the electrical connection. Even if a break occurs at any part of the electrode lead due to production factors, such as insufficient filling of the metal paste, or wear during use, etc., it will not affect the electrical connection of the entire electrode lead, thereby improving the electrical connection reliability.

[0092] Furthermore, the thickness of the electrode lead 303 is less than the thickness of the insulating dielectric layer 2030. This can prevent the wear of the electrode lead during use, increase the service life of the electrode lead, and improve the production yield of the electrode lead. Preferably, the thickness of the electrode lead is 2 microns to 12 microns, and the thickness of the insulating dielectric layer is 3 microns to 15 microns.

[0093] In some embodiments of the present invention, the induction electrode strip 301 includes a plurality of electrode blocks 304 and a connecting portion 305 for connecting any two adjacent electrode blocks 304 among the plurality of electrode blocks. The connecting portion 305 is provided with a hollow structure. Preferably, the hollow structure can be an asymmetric shape, or the boundary of the hollow structure can be composed of at least one or more of a straight line, a broken line and a curve.

[0094] When the touch conductive film layer structure realizes the touch function, the two conductive layers are arranged at intervals, so a double-layer structure will appear at the connection part 305. Due to the differences in optical properties such as light transmittance, reflectance, and refractive index between the double-layer structure and the single-layer structure, color difference is likely to occur. By setting the connection part 305 to include a hollow structure, the area of the double-layer structure at the cross-overlapping part can be reduced, and the differences in optical properties such as light transmittance, reflectance, and refractive index of the conductive film layer structure can be reduced, thereby reducing color difference.

[0095] Figure 3B The figure shows a schematic diagram of the electrode pattern structure of the touch area provided by another exemplary embodiment of the present invention.

[0096] In some embodiments of the present invention, as Figure 3B shown, the boundary of the conductive electrode includes an irregular boundary composed of at least one or more of straight lines, broken lines, and curves. The boundary shapes of the induction electrode strips 301 and the connection part 305 can be zigzag or wavy. The zigzag or wavy boundary can form gaps with different widths between the conductive electrode and the compensation block 302. Since the diffracted light generally changes periodically, the gaps with different widths are more conducive to the superposition and cancellation of diffracted light, thereby further reducing the color difference caused by diffracted light.

[0097] Figure 3C The figure shows a schematic diagram of the electrode pattern structure of the touch area provided by another exemplary embodiment of the present invention.

[0098] In some embodiments of the present invention, as Figure 3C shown, the compensation block 302 includes a regular compensation block and / or an irregular compensation block. The regular compensation block can be a compensation block with an isosceles triangle, regular polygon, or circular boundary. The irregular compensation block can be a compensation block with a closed figure boundary composed of multiple straight lines and multiple curves connected. By making the compensation block 302 include a regular compensation block and / or an irregular compensation block, gaps with different widths can be formed between adjacent compensation blocks 302 and / or between the conductive electrode and the compensation block 302, reducing the color difference and diffraction fringes caused by diffracted light.

[0099] An embodiment of the present invention provides a touch sensor, which includes a touch film layer structure. The touch film layer structure adopts the touch film layer structure mentioned in any of the above embodiments. The touch sensor has the advantages of improving the color difference visibility problem on the surface of the touch screen, improving the reliability of electrical connection, and being beneficial to the narrow border design of the touch screen.

[0100] An embodiment of the present invention provides a touch screen, which includes the touch sensor described above. The touch screen has the advantages of improving the color difference visibility on the surface of the touch screen, enhancing the reliability of electrical connection, and facilitating the narrow border design of the touch screen.

[0101] The technical features of all the above embodiments can be combined arbitrarily to form alternative embodiments of the present invention, which will not be elaborated herein one by one.

[0102] In the description of this specification, the description referring to terms such as "an embodiment", "some embodiments", "certain embodiments", "examples", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0103] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0104] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined by "first" and "second" may explicitly or implicitly include at least one of the features.

[0105] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A method for manufacturing a conductive film layer, characterized in that, Including: Providing a conductive material film to be etched, which is obtained by processing a conductive material layer on the surface of a first region of a carrier layer, the first region of the carrier layer corresponding to the induction region of the conductive film layer, and the second region of the carrier layer corresponding to the lead region of the conductive film layer; Etching the conductive material layer to form a patterned conductive layer, wherein the patterned conductive layer includes a conductive electrode and a compensation electrode, and the conductive electrode and the compensation electrode are insulated from each other; Forming a dielectric layer with a groove on the surface of the second region of the carrier layer; Filling the groove with a metal paste to form an electrode lead; Wherein, the etching of the conductive material layer to form a patterned conductive layer includes: Preparing a photoresist layer on the surface of the conductive material layer away from the carrier layer, wherein the photoresist layer is provided with a first hollow pattern; Stacking a stencil fixture with a second hollow pattern on the surface of the photoresist layer away from the conductive material layer, wherein the positive projection region of the second hollow pattern in the plane where the conductive material layer is located at least partially overlaps the positive projection region of the first hollow pattern in the plane where the conductive material layer is located; Based on the stencil fixture and the photoresist layer, etching the conductive material layer to form the patterned conductive layer.

2. The manufacturing method according to claim 1, wherein The conductive material layer completely covers the first region and partially covers the second region, and the conductive electrode and the electrode lead have an overlapping and lapping part in the second region.

3. The manufacturing method according to claim 1 or 2, characterized in that, The forming of the dielectric layer with a groove on the surface of the second region of the carrier layer includes: Coating a photosensitive resin layer on the surface of the second region of the carrier layer; Performing a process of exposure and development on the photosensitive resin layer to form the photosensitive resin layer with a groove; or, Printing and forming a colloidal layer with a groove on the surface of the second region of the carrier layer by using a printing process.

4. The manufacturing method according to claim 1 or 2, characterized in that The filling of the groove with a metal paste to form an electrode lead includes: Precisely aligning the hollow pattern of the stencil fixture with the groove and covering the stencil on the surface of the dielectric layer away from the carrier layer, so that the positive projection region of the hollow pattern of the stencil fixture in the plane where the dielectric layer is located at least partially overlaps the positive projection region of the groove in the plane where the dielectric layer is located; Filling the groove with a metal paste through the hollow pattern of the stencil fixture to form the electrode lead.

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