Image sensing component, image sensor module, manufacturing method thereof, and electronic device

Abstract

An image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. The image sensing component includes at least one image sensing chip, at least one rigid circuit board, and an electrical contact assembly. The image sensing chip has a sensing area. The rigid circuit board has an upper surface, a lower surface, and a hollow portion that passes through the upper surface and the lower surface, wherein the upper surface of the rigid circuit board is suitable for correspondingly mounting the lens assembly so that the lens assembly is aligned with the hollow portion, wherein the image sensing chip is electrically connected and mounted on the lower surface of the rigid circuit board, and the sensing area of ​​the image sensing chip is aligned with the hollow portion. The electrical contact assembly includes a plurality of circuit board electrical contacts, and the circuit board electrical contacts are arranged on the upper surface and / or the lower surface of the rigid circuit board, and are used to electrically connect the flexible circuit board to the rigid circuit board after mounting the image sensing chip.

Description

Technical Field

[0001] The present invention relates to the field of optical imaging technology, and in particular to an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. Background Art

[0002] Image sensor modules are one of the standard configurations of most electronic devices, and the high imaging quality of image sensor modules plays an extremely important role in the development of electronic devices towards high performance. The quality of image sensor module assembly directly affects the imaging quality of the module, making the existing technology pay more and more attention to the assembly of the module and putting forward more and more stringent requirements on the assembly quality.

[0003] At present, the image sensor module used in the camera device of portable electronic products is a device in which an image sensing chip and a bracket are arranged on a circuit board, and a glass cover and a lens are arranged on the bracket. The commonly used module assembly methods currently include three chip packaging processes: COB (Chip On Board), MOB (Molding On Board) and MOC (Molding On Chip). Both the COB process and the MOB process first use glue or resin to glue and fix the chip on the circuit board, and then use wires to electrically connect the chip to the circuit board; while the MOC process first uses wires to electrically connect the chip to the circuit board, and then uses a molding process to mold and fix the chip on the circuit board.

[0004] However, the circuit boards required by the three existing chip packaging processes are usually hard-flex boards, that is, before mounting the chip, the circuit board combines the soft board with the hard board by means such as pressing to form a hard-flex board with an integrated structure, so that while the soft board is electrically connected to the external electronic device, the hard board can also provide a flat mounting area for the chip. However, it is precisely because the circuit boards required by the three existing chip packaging processes are hard-flex boards that the circuit boards cannot be mass-produced, and mass chip packaging cannot be completed in the same device. In other words, none of the three existing chip packaging processes can use a single device to complete chip packaging, which increases the cost of existing chip packaging equipment and requires a dust-free environment and complex processes, which in turn greatly increases the cost of module assembly.

[0005] In addition, the materials, processes and techniques used in the existing COB process, although the original starting point is to save the cost of the chip-scale packaging (CSP) process, are very different from the application conditions and environment of the chip in terms of reliability, resulting in large fluctuations in the packaging yield of the existing COB process (usually between 85% and 95%), so it is necessary to select and reprocess, further extending the process and increasing the assembly cost. Although the existing MOB process and MOC process meet the chip assembly conditions, they cannot achieve the cost advantages caused by sharing and standardization of jigs and molds, and the MOC process also has processing and cleaning problems (this is because when molding on the chip, the molding material is very easy to contaminate the sensing surface of the chip). Summary of the invention

[0006] One advantage of the present invention is that it provides an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device, which can optimize the reliability, high precision, and consistency of chip packaging, and help make consumer electronics-grade packaging processes compatible with security, AR, VR, AIOT applications, aerospace, automotive, industrial control, 2D / 3D, and hybrid applications.

[0007] Another advantage of the present invention is to provide an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the image sensing component can effectively reduce the assembly size, which is conducive to application in miniaturized devices and equipment.

[0008] Another advantage of the present invention is to provide an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the image sensing component can greatly improve the utilization rate of the circuit substrate, even to three times that of the existing chip packaging process.

[0009] Another advantage of the present invention is to provide an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the image sensing component can be manufactured by a single device and can obtain high-precision tolerances, thereby greatly improving product yield.

[0010] Another advantage of the present invention is to provide an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the manufacturing method of the image sensing component can first package chips in batches on a circuit substrate, and then electrically connect the flexible board through the electrical contacts reserved on the circuit substrate, so as to simplify the packaging process and reduce assembly costs.

[0011] Another advantage of the present invention is to provide an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the manufacturing method of the image sensing component can first package a plurality of the image sensor modules at one time, and then cut them into a single image sensor module or an array image sensor module according to demand, and then through standardized process procedures, the jig can be shared to achieve a high-precision structure, which helps to significantly reduce production costs.

[0012] Another advantage of the present invention is that it provides an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the manufacturing method of the image sensing component can also effectively reduce the assembly size and simplify the assembly process, and is highly intelligent to reduce the labor burden and environmental costs, so as to greatly optimize reliability and yield, allowing the traditional manufacturing process ecosystem to evolve towards precision.

[0013] Another advantage of the present invention is to provide an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the manufacturing method of the image sensing component can be greatly evolved and optimized in terms of reliability, high precision, and consistency of optical semiconductors.

[0014] Another advantage of the present invention is that it provides an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, although the manufacturing method of the image sensing component also utilizes a molding process to encapsulate the image sensing chip, since the photosensitive surface of the image sensing chip faces away from the molding base and will not contact the molding material, no processing and cleaning is required, which helps to shorten the assembly process and reduce manufacturing costs.

[0015] Another advantage of the present invention is to provide an image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device, wherein, in order to achieve the above-mentioned purpose, no expensive materials or complex structures are required in the present invention. Therefore, the present invention successfully and effectively provides a solution, not only providing a simple image sensing component, an image sensor module, a manufacturing method thereof, and an electronic device, but also increasing the practicality and reliability of the image sensing component, the image sensor module, a manufacturing method thereof, and the electronic device.

[0016] In order to achieve at least one of the above advantages or other advantages and purposes, the present invention provides an image sensing component for assembling an image sensor module with a flexible circuit board and a lens assembly, wherein the image sensing component comprises:

[0017] At least one image sensing chip, wherein the image sensing chip has a sensing area;

[0018] at least one rigid circuit board, wherein the rigid circuit board has an upper surface, a lower surface, and a hollow portion penetrating the upper surface and the lower surface, wherein the upper surface of the rigid circuit board is suitable for correspondingly mounting the lens assembly so that the lens assembly is aligned with the hollow portion of the rigid circuit board, wherein the image sensing chip is electrically connected and mounted on the lower surface of the rigid circuit board, and the sensing area of ​​the image sensing chip is aligned with the hollow portion of the rigid circuit board; and

[0019] An electrical contact assembly, wherein the electrical contact assembly includes a plurality of circuit board electrical contacts, and the circuit board electrical contacts are arranged on the upper surface and / or the lower surface of the rigid circuit board, for electrically connecting the flexible circuit board to the rigid circuit board after mounting the image sensing chip.

[0020] According to an embodiment of the present invention, the rigid circuit board is obtained by cutting the circuit substrate after mounting a plurality of the image sensing chips on the circuit substrate at one time.

[0021] According to an embodiment of the present invention, the image sensing component further comprises a sealing layer, wherein the sealing layer covers the image sensing chip and a portion of the lower surface of the rigid circuit board.

[0022] According to an embodiment of the present invention, the circuit board electrical contacts are disposed on the lower surface of the rigid circuit board, and the circuit board electrical contacts are exposed outside the sealing layer.

[0023] According to an embodiment of the present invention, the image sensing component further comprises a sealing layer, wherein the sealing layer covers the entire lower surface of the image sensing chip and the rigid circuit board.

[0024] According to one embodiment of the present invention, the electrical contact assembly further includes a plurality of conductor members, wherein the conductor members are disposed through the sealing layer, and the conductor members are electrically connected to the rigid circuit board, so as to electrically connect the flexible circuit board with the rigid circuit board through the conductor members.

[0025] According to one embodiment of the present invention, the conductor member is a conductor column, wherein the first end of the conductor column is penetrated through the rigid circuit board or fixedly disposed on the lower surface of the rigid circuit board, wherein the second end of the conductor column integrally extends downward from the first end of the conductor column and penetrates the sealing layer to serve as an electrical contact of the circuit board.

[0026] According to an embodiment of the present invention, the image sensing component further comprises at least one filter, wherein the filter is correspondingly mounted on the upper surface of the rigid circuit board, and the filter is aligned with the hollow portion of the rigid circuit board.

[0027] According to another aspect of the present invention, the present invention further provides an image sensor module, comprising:

[0028] a flexible printed circuit board;

[0029] a lens assembly; and

[0030] An image sensing component, wherein the image sensing component comprises:

[0031] At least one image sensing chip, wherein the image sensing chip has a sensing area;

[0032] at least one rigid circuit board, wherein the rigid circuit board has an upper surface, a lower surface, and a hollow portion penetrating the upper surface and the lower surface, wherein the lens assembly is correspondingly mounted on the upper surface of the rigid circuit board so that the lens assembly is aligned with the hollow portion of the rigid circuit board, wherein the image sensing chip is electrically connected and mounted on the lower surface of the rigid circuit board, and the sensing area of ​​the image sensing chip is aligned with the hollow portion of the rigid circuit board; and

[0033] An electrical contact assembly, wherein the electrical contact assembly includes a plurality of circuit board electrical contacts, and the circuit board electrical contacts are arranged on the upper surface and / or the lower surface of the rigid circuit board, so as to electrically connect the flexible circuit board to the rigid circuit board through the circuit board electrical contacts after mounting the image sensing chip.

[0034] According to an embodiment of the present invention, the image sensing component further includes a sealing layer, wherein the sealing layer covers the image sensing chip and the lower surface of the rigid circuit board.

[0035] According to one embodiment of the present invention, the flexible circuit board has an internal connection end, an external connection end and a notch, wherein the notch of the flexible circuit board is located at an internal connection end of the flexible circuit board, and when the internal connection end of the flexible circuit board is electrically connected to the upper surface of the rigid circuit board, the notch of the flexible circuit board matches the hollow portion of the rigid circuit board.

[0036] According to one embodiment of the present invention, the internal connection end of the flexible circuit board includes a base plate and one or more side wing plates, wherein the notch of the flexible circuit board is arranged on the base plate of the internal connection end, and the side wing plates extend outwardly from the side edge of the base plate as a whole to cover the side surface of the rigid circuit board.

[0037] According to one embodiment of the present invention, the image sensing component further includes a sealing layer, and the sealing layer covers the entire lower surface of the image sensing chip and the rigid circuit board, wherein the electrical contact component further includes a plurality of conductors, wherein the conductors are arranged through the sealing layer, and the conductors are electrically connected to the rigid circuit board so as to electrically connect the flexible circuit board with the rigid circuit board through the conductors.

[0038] According to one embodiment of the present invention, the flexible circuit board has an internal connection end and an external connection end, wherein the sealing layer is located between the internal connection end of the flexible circuit board and the lower surface of the rigid circuit board so as to electrically connect the internal connection end of the flexible circuit board to the rigid circuit board through the conductor.

[0039] According to one embodiment of the present invention, the electrical contact assembly further includes a plurality of lens electrical contacts, wherein the lens electrical contacts are correspondingly arranged on the upper surface of the rigid circuit board so as to electrically connect the lens assembly to the rigid circuit board through the lens electrical contacts.

[0040] According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

[0041] an electronic device body; and

[0042] At least one image sensor module, wherein the image sensor module is configured in the electronic device body for acquiring images, wherein the image sensor module comprises:

[0043] a flexible printed circuit board;

[0044] a lens assembly; and

[0045] An image sensing component, wherein the image sensing component comprises:

[0046] At least one image sensing chip, wherein the image sensing chip has a sensing area;

[0047] at least one rigid circuit board, wherein the rigid circuit board has an upper surface, a lower surface, and a hollow portion penetrating the upper surface and the lower surface, wherein the lens assembly is correspondingly mounted on the upper surface of the rigid circuit board so that the lens assembly is aligned with the hollow portion of the rigid circuit board, wherein the image sensing chip is electrically connected and mounted on the lower surface of the rigid circuit board, and the sensing area of ​​the image sensing chip is aligned with the hollow portion of the rigid circuit board; and

[0048] An electrical contact assembly, wherein the electrical contact assembly includes a plurality of circuit board electrical contacts, and the circuit board electrical contacts are arranged on the upper surface and / or the lower surface of the rigid circuit board, so as to electrically connect the flexible circuit board to the rigid circuit board through the circuit board electrical contacts after mounting the image sensing chip.

[0049] According to another aspect of the present invention, the present invention further provides a method for manufacturing an image sensor module, comprising the steps of:

[0050] An image sensing component is provided, wherein an image sensing chip of the image sensing component is mounted on a rigid circuit board of the image sensing component, and a plurality of circuit board electrical contacts in an electrical contact assembly of the image sensing component are disposed on an upper surface and / or a lower surface of the rigid circuit board;

[0051] electrically connecting a flexible circuit board to the rigid circuit board through the circuit board electrical contacts; and

[0052] A lens assembly is mounted on the upper surface of the rigid circuit board to assemble the image sensor module.

[0053] According to an embodiment of the present invention, the step of providing an image sensing component comprises the steps of:

[0054] A circuit substrate is prepared, wherein the circuit substrate is pre-divided into a plurality of rigid circuit boards, a hollow portion is provided on each of the rigid circuit boards, and a plurality of electrical conductors are provided on the surface of the circuit substrate to form electrical contacts of the circuit boards;

[0055] Mounting the plurality of image sensing chips on the lower surface of the rigid circuit board in an electrically connectable manner, and aligning the sensing areas of the image sensing chips with the hollowed-out portions of the rigid circuit board; and

[0056] The circuit substrate is cut to obtain a single image sensing component or an array image sensing component.

[0057] According to an embodiment of the present invention, the step of providing an image sensing component further comprises the steps of:

[0058] One or more sealing layers are provided to cover a part or the whole of the lower surface of the plurality of image sensing chips and the rigid circuit board.

[0059] According to an embodiment of the present invention, the step of providing an image sensing component further comprises the steps of:

[0060] Disposing a plurality of conductors to be electrically connected to the rigid circuit board; and

[0061] One or more sealing layers are provided to cover the plurality of image sensing chips and the entire lower surface of the rigid circuit board, and the conductor penetrates through the sealing layer to form the circuit board electrical contacts on the bottom side of the sealing layer.

[0062] According to an embodiment of the present invention, the step of providing an image sensing component further comprises the steps of:

[0063] A plurality of filters are mounted on the upper surface of the rigid circuit board respectively and correspondingly, and the filters are aligned with the hollow portion of the rigid circuit board.

[0064] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings.

[0065] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description, accompanying drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 is a structural schematic diagram of an image sensor module according to an embodiment of the present invention.

[0067] Figure 2 A three-dimensional schematic diagram of an image sensing component and a flexible circuit board in the image sensor module according to the above embodiment of the present invention is shown.

[0068] Figure 3 A front view schematic diagram of the image sensing assembly according to the above embodiment of the present invention is shown.

[0069] Figure 4 A left side schematic diagram of the image sensing component according to the above embodiment of the present invention is shown.

[0070] Figure 5 An exploded schematic diagram of the image sensing component according to the above embodiment of the present invention is shown.

[0071] Figure 6 A schematic structural diagram of a circuit substrate according to the above embodiment of the present invention is shown.

[0072] Figures 7 to 9 A first variant implementation of the image sensing component according to the above embodiment of the present invention is shown.

[0073] Figures 10 to 12 A second variant implementation of the image sensing component according to the above embodiment of the present invention is shown.

[0074] Figures 13 to 16 A third variant implementation of the image sensing component according to the above embodiment of the present invention is shown.

[0075] Fig.17 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

[0076] Fig.18 and Fig.19 FIG. 4 is a flow chart of a method for manufacturing an image sensor module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0077] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0078] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0079] In the present invention, the term "one" in the claims and the specification should be understood as "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. Unless it is clearly indicated in the disclosure of the present invention that the number of the element is only one, the term "one" cannot be understood as unique or single, and the term "one" cannot be understood as a limitation on the quantity.

[0080] In the description of the present invention, it should be understood that "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through a medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0081] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0082] Since the COB process, MOB process and MOC process in the existing technology cannot achieve the cost advantage caused by sharing and standardization of tools and molds, and the utilization rate of circuit substrates is low, the assembly yield is low or fluctuates greatly, resulting in poor existing packaging process conditions, an innovative process is urgently needed to solve the problems existing in the existing process.

[0083] Reference to the attached drawings of the specification Figures 1 to 6 As shown, an image sensor module according to an embodiment of the present invention is illustrated. Specifically, Figure 1 As shown, the image sensor module 1 may include an image sensing component 10, a flexible circuit board 20 and a lens assembly 30, wherein the flexible circuit board 20 is electrically connected to the image sensing component 10, and the lens assembly 30 is correspondingly installed on the image sensing component 10 so that the lens assembly 30 is located on the sensing path of the image sensing component 10, thereby completing the assembly of the image sensor module 1.

[0084] More specifically, if Figures 1 to 5As shown, the image sensing component 10 may include at least one image sensing chip 11, at least one rigid circuit board 12, and an electrical contact component 13. The rigid circuit board 12 has an upper surface 121, a lower surface 122, and a hollow portion 123 that penetrates the upper surface 121 and the lower surface 122, wherein the upper surface 121 of the rigid circuit board 12 is suitable for correspondingly mounting the lens assembly 30 so that the lens assembly 30 is aligned with the hollow portion 123 of the rigid circuit board 12, wherein the image sensing chip 11 is electrically connected and mounted on the lower surface 122 of the rigid circuit board 12, and the sensing area of ​​the image sensing chip 11 is aligned with the hollow portion 123 of the rigid circuit board 12. It can be understood that the hollow portion 123 of the rigid circuit board 12 of the present invention can be implemented as a through light hole, so that the external light passing through the lens assembly 30 is received by the image sensing chip 11 to form an image after passing through the rigid circuit board 12 via the hollow portion 123 of the rigid circuit board 12.

[0085] In particular, if Figure 1 and Figure 4 As shown, the electrical contact assembly 13 includes a plurality of circuit board electrical contacts 131, and the circuit board electrical contacts 131 can be disposed on the lower surface 122 of the rigid circuit board 12, for electrically connecting the flexible circuit board 20 to the rigid circuit board 12 after mounting the image sensing chip 11.

[0086] It is worth noting that since the flexible circuit board 20 is electrically connected to the rigid circuit board 12 through the circuit board electrical contacts 131 after the image sensor chip 11 is mounted, Figure 6 As shown, the present invention can mount multiple image sensing chips 11 on the circuit substrate 120 at one time before cutting a circuit substrate 120 into multiple rigid circuit boards 12, and then cut the circuit substrate 120 into a single rigid circuit board 12 or multiple rigid circuit boards 12 arranged in an array according to needs, and then package them into a single image sensor module or an array image sensor module, which greatly improves the packaging efficiency and packaging quality of the image sensor module. In other words, the present invention can package multiple image sensor modules at one time, and then cut them into a single image sensor module or an array image sensor module according to needs, so as to greatly reduce production costs.

[0087] In addition, if Figure 1As shown, the image sensing component 10 may further include at least one filter 14, wherein the filter 14 is correspondingly mounted on the upper surface 121 of the rigid circuit board 12, and the filter 14 is aligned with the hollow portion 123 of the rigid circuit board 12, so that the external light passing through the lens assembly 30 is first filtered by the filter 14, and then passes through the hollow portion 123 of the rigid circuit board 12 and then is received by the image sensing chip 11 for imaging, which helps to improve the imaging quality of the image sensor module 1. It can be understood that the filter 14 can be implemented as a blue glass but is not limited to it. Of course, the filter 14 can also be implemented as other types of filters such as infrared cut-off filter or infrared transmission filter, etc., and the present invention will not repeat them.

[0088] According to the above embodiments of the present invention, Figure 1 and Figure 4 As shown, the electrical contact assembly 13 may further include a plurality of chip electrical contacts 132, wherein the chip electrical contacts 132 are disposed between the image sensing chip 11 and the rigid circuit board 12, so as to directly and electrically connect the image sensing chip 11 to the lower surface 122 of the rigid circuit board 12 through the chip electrical contacts 132. It is understandable that the chip electrical contacts 132 correspond to the periphery of the sensing area of ​​the image sensing chip 11, so as to directly and electrically connect the image sensing chip 11 to the rigid circuit board 12 without affecting the sensing function of the image sensing chip 11 and without the need for gold wire bonding.

[0089] In addition, when the lens assembly 30 is implemented as a variable focus lens (such as a lens equipped with a voice coil motor), Figure 1 As shown, the electrical contact assembly 13 may further include a plurality of lens electrical contacts 133, wherein the lens electrical contacts 133 are correspondingly disposed on the upper surface 121 of the rigid circuit board 12 to electrically connect the lens assembly 30 to the rigid circuit board 12. It is understandable that when the lens assembly 30 is implemented as a fixed-focus lens, the electrical contact assembly 13 does not need to be provided with the lens electrical contacts 133, but the lens assembly 30 can be directly mounted on the rigid circuit board 12.

[0090] It is worth mentioning that in the above embodiments of the present invention, Figure 1 and Figure 4As shown, the image sensing component 10 may further include a sealing layer 15, wherein the sealing layer 15 covers the image sensing chip 11 so that the image sensing chip 11 is located between the lower surface 122 of the rigid circuit board 12 and the sealing layer 15, thereby protecting the image sensing chip 11.

[0091] Preferably, if Figure 1 and Figure 5 As shown, the sealing layer 15 can be implemented as a molded base 151, wherein the molded base 151 is molded on the lower surface 122 of the rigid circuit board 12 by a molding process, so that the sealing layer 15 can cover the image sensing chip 11 while also covering a portion of the lower surface 122 of the rigid circuit board 12, so as to enhance the connection strength between the image sensing chip 11 and the rigid circuit board 12 through the molded base 151, which is beneficial to improve the overall structural strength of the image sensor module 1. It can be understood that since the image sensing chip 11 is flipped on the lower surface 122 of the rigid circuit board 12, when the lower surface 122 of the rigid circuit board 12 is molded, the molten molding material will not contaminate the sensing area of ​​the image sensing chip 11, which is helpful to remove the subsequent cleaning process of the sensing area and shorten the entire assembly process. Of course, in other examples of the present invention, the sealing layer 15 can also be implemented as a curing glue layer such as a thermosetting glue or a light curing glue.

[0092] For example, in the above-mentioned embodiments of the present invention, Figures 2 to 4 As shown, the circuit board electrical contact 131 of the electrical contact assembly 13 is arranged on the lower surface 122 of the rigid circuit board 12, and the circuit board electrical contact 131 is exposed outside the sealing layer 15, that is, the sealing layer 15 does not cover the circuit board electrical contact 131, so that the flexible circuit board 20 can be electrically connected to the lower surface 122 of the rigid circuit board 12 through the circuit board electrical contact 131 after the sealing is completed.

[0093] Of course, if Figures 7 to 9 As shown, a variant implementation of the image sensing component 10 according to the above embodiment of the present invention is explained, wherein the circuit board electrical contact 131 of the electrical contact component 13 can also be arranged on the upper surface 121 of the rigid circuit board 12, that is, the sealing layer 15 will not cover the circuit board electrical contact 131, so that the flexible circuit board 20 can still be electrically connected to the lower surface 122 of the rigid circuit board 12 through the circuit board electrical contact 131 after the sealing is completed.

[0094] It is worth noting that Figure 2 and Figure 3 As shown, the flexible circuit board 20 generally has an internal terminal 21 and an external terminal 22, wherein the internal terminal 21 of the flexible circuit board 20 is used to be electrically connected to the rigid circuit board 12, and the rigid circuit board 12 is used to be electrically connected to an external device such as a processor, etc., so as to electrically connect the image sensor module 1 to the external device through the flexible circuit board 20.

[0095] In particular, if Figure 2 and Figure 3 As shown, the flexible circuit board 20 further has a notch 23, wherein the notch 23 of the flexible circuit board 20 is located at the inner connection end 21 of the flexible circuit board 20, and the notch 23 of the flexible circuit board 20 matches the sealing layer 15, so that when the flexible circuit board 20 is electrically connected to the lower surface 122 of the rigid circuit board 12, the sealing layer 15 is inserted into the notch 23 of the flexible circuit board 20, so that the flexible circuit board 20 can be close to the lower surface 122 of the rigid circuit board 12, so as to complete the electrical connection between the two. At the same time, since the sealing layer 15 is inserted into the notch 23 of the flexible circuit board 20, the thickness of the flexible circuit board 20 is not included in the overall thickness of the image sensing component 10, so this arrangement of the present invention can reduce the overall thickness of the image sensing component 10, thereby reducing the overall height of the image sensor module 1, which helps to promote the module towards a more miniaturized development.

[0096] More preferably, if Figure 2 and Figure 4As shown, the inner connection end 21 of the flexible circuit board 20 may include a bottom plate 211 and one or more side wing plates 212, wherein the notch 23 is provided on the bottom plate 211, and the side wing plates 212 extend outward from the side of the bottom plate 211 as a whole, wherein when the inner connection end 21 of the flexible circuit board 20 is electrically connected to the lower surface 122 of the rigid circuit board 12, the bottom plate 211 on the flexible circuit board 20 covers the lower surface 122 of the rigid circuit board 12, and the side wing plates 212 on the flexible circuit board 20 covers the side surface 124 of the rigid circuit board 12, so that the size of the inner connection end 21 of the flexible circuit board 20 is increased, and the wiring design in the flexible circuit board 20 is not affected by the provision of the notch 23. In other words, the side of the inner end 21 of the flexible circuit board 20 is tilted upward to cover the rigid circuit board 12, so that the effective area of ​​the inner end 21 of the flexible circuit board 20 will not be reduced due to the provision of the notch 23, which helps to meet the wiring requirements in the flexible circuit board 20.

[0097] It can be understood that when the inner connection end 21 of the flexible circuit board 20 is electrically connected to the upper surface 121 of the rigid circuit board 12, the notch 23 of the flexible circuit board 20 is correspondingly matched with the hollow portion 123 of the rigid circuit board 12, and the side of the inner connection end 21 of the flexible circuit board 20 is correspondingly bent downward, while still ensuring that the hollow portion 123 of the rigid circuit board 12 is exposed, the side surface 124 of the rigid circuit board 12 is covered to increase the effective area of ​​the inner connection end 21 of the flexible circuit board 20.

[0098] It is worth mentioning that Figures 10 to 12 A second variant embodiment of the image sensing component 10 according to the above embodiment of the present invention is shown. Compared with the above first variant embodiment of the present invention, the difference of the second variant embodiment of the present invention is that the sealing layer 15 completely covers the image sensing chip 11 and the lower surface 122 of the rigid circuit board 12 to maximize the connection strength between the image sensing chip 11 and the rigid circuit board 12. At the same time, the circuit board electrical contact 131 is provided on the upper surface 121 of the rigid circuit board 12 to electrically connect the flexible circuit board 20 to the upper surface 121 of the rigid circuit board 12.

[0099] It is worth noting that in this modified embodiment of the present invention, since the sealing layer 15 completely covers the lower surface 122 of the rigid circuit board 12, the side of the sealing layer 15 is flush with the side surface 124 of the rigid circuit board 12. Therefore, the side wing plate 212 of the flexible circuit board 20 can extend downward to cover the lower surface 122 of the rigid circuit board 12 while also covering the side of the sealing layer 15, so that the area of ​​the side wing plate 212 of the flexible circuit board 20 can be further increased, and thus the effective area of ​​the internal connection terminal 21 of the flexible circuit board 20 can also be further increased to provide sufficient wiring space.

[0100] It can be understood that, since the flexible circuit board 20 is electrically connected to the upper surface 121 of the rigid circuit board 12, when the lens assembly 30 is implemented as a variable focus lens, the lens assembly 30 can be electrically connected to the rigid circuit board 12 through the notch 23 of the flexible circuit board 20, or can be directly electrically connected to the flexible circuit board 20, and the present invention will not elaborate on this.

[0101] Attached Figures 13 to 16 A third variant embodiment of the image sensing component 10 according to the above embodiment of the present invention is shown. Compared with the above second variant embodiment of the present invention, the difference of the third variant embodiment of the present invention is that the electrical contact component 13 of the image sensing component 10 can further include a plurality of conductors 134, wherein the conductors 134 are disposed through the sealing layer 15, and the conductors 134 are electrically connected to the rigid circuit board 12, wherein the flexible circuit board 20 is disposed on the bottom side of the sealing layer 15, and the inner connection end 21 of the flexible circuit board 20 is electrically connected to the conductors 134. In other words, the sealing layer 15 is located between the flexible circuit board 20 and the rigid circuit board 12, and the flexible circuit board 20 is electrically connected to the rigid circuit board 12 through the conductors 134.

[0102] It is worth noting that, precisely because the flexible circuit board 20 is located on the bottom side of the sealing layer 15, the inner end 21 of the flexible circuit board 20 does not need to be additionally provided with any notch 23, and therefore the inner end 21 of the flexible circuit board 20 does not need to be provided with the side wing plate 212 wrapped around the side surface 124 of the rigid circuit board 12, so that the lateral size of the image sensing component 10 can be reduced while ensuring that the inner end 21 of the flexible circuit board 20 has sufficient area to meet the wiring requirements.

[0103] Preferably, if Fig.16As shown, the conductor 134 can be implemented as a conductor post 1341, and the first end of the conductor post 1341 is fixedly disposed on the lower surface 122 of the rigid circuit board 12, and the first end of the conductor post 1341 is electrically connected to the rigid circuit board 12; wherein the second end of the conductor post 1341 integrally extends downward from the first end of the conductor post 1341, and after penetrating the sealing layer 15, is electrically connected to the inner connection end 21 of the flexible circuit board 20. In other words, the end point of the second end of the conductor post 1341 can be implemented as the circuit board electrical contact 131, so as to electrically connect the rigid circuit board 12 and the flexible circuit board 20 spaced apart from each other through the conductor post 1341.

[0104] It can be understood that in other examples of the present invention, the first end of the conductor post 1341 can also be arranged to penetrate the rigid circuit board 12, so that the endpoint of the first end of the conductor post 1341 is implemented as the lens electrical contact 133, so as to electrically connect the lens assembly 30 to the rigid circuit board 12 through the conductor post 1341.

[0105] According to another aspect of the present invention, Fig.17 As shown, the present invention further provides an electronic device, wherein the electronic device may include an electronic device body 400 and any of the above-mentioned image sensor modules 1, wherein the image sensor module 1 is configured in the electronic device body 400 for acquiring images. It is worth mentioning that the type of the electronic device body 400 is not limited, for example, the electronic device body 400 may be any electronic device that can be configured with the camera module 1, such as a smart phone, a tablet computer, a laptop computer, an e-book, a personal digital assistant, a camera, etc. It can be understood by those skilled in the art that although the electronic device body 400 is implemented as a smart phone as an example in the accompanying drawings, it does not constitute a limitation on the content and scope of the present invention.

[0106] According to another aspect of the present invention, Fig.18 As shown, the present invention further provides a method for manufacturing an image sensor module 1, comprising the following steps:

[0107] S100: providing an image sensing component 10, wherein an image sensing chip 11 of the image sensing component 10 is mounted on a rigid circuit board 12 of the image sensing component 10, and a plurality of circuit board electrical contacts 131 of an electrical contact component 13 of the image sensing component 10 are disposed on an upper surface 121 and / or a lower surface 122 of the rigid circuit board 12;

[0108] S200: electrically connecting a flexible circuit board 20 to the rigid circuit board 12 through the circuit board electrical contacts 131; and

[0109] S300 : installing a lens assembly 30 on the upper surface of the rigid circuit board 12 to assemble the image sensor module 1 .

[0110] It is worth noting that Fig.19 As shown, the step S100 of the method for manufacturing the image sensor module 1 may include the following steps:

[0111] S110: preparing a circuit substrate 120, wherein the circuit substrate 120 is pre-divided into a plurality of rigid circuit boards 12, so that a hollow portion 123 is provided on each of the rigid circuit boards 12, and a plurality of electrical conductors are provided on the surface of the circuit substrate 120 to form the circuit board electrical contacts 131;

[0112] S120: mounting the plurality of image sensing chips 11 on the lower surface 122 of the rigid circuit board 12 so as to be electrically connectable, and aligning the sensing areas of the image sensing chips 11 with the hollow portion 123 of the rigid circuit board 12; and

[0113] S130: cutting the circuit substrate 120 to obtain a single image sensing component or an array image sensing component.

[0114] In one example of the present invention, Fig.19 As shown, the step S100 of the manufacturing method of the image sensor module 1 may further include the following steps before the step S130:

[0115] S140 : mounting a plurality of filters 14 on the upper surface 121 of the rigid circuit board 12 respectively and correspondingly, and aligning the filters 14 with the hollow portion 123 of the rigid circuit board 12 .

[0116] In one example of the present invention, Fig.19 As shown, the step S100 of the manufacturing method of the image sensor module 1 may further include the following steps between the step S120 and the step S130:

[0117] S150 : disposing one or more sealing layers 15 to cover the plurality of image sensor chips 11 and a portion or the entirety of the lower surface 122 of the rigid circuit board 12 .

[0118] It is worth mentioning that Fig.19As shown, in other examples of the present invention, the step S100 of the method for manufacturing the image sensor module 1 may further include the following steps between the step S120 and the step S130:

[0119] S150 ′: disposing a plurality of conductors 134 to be electrically connected to the rigid circuit board 12 ; and

[0120] S160 ′: One or more sealing layers 15 are provided to cover the plurality of image sensing chips 11 and the entire lower surface 122 of the rigid circuit board 12 , and the conductor 134 penetrates the sealing layer 15 to form the circuit board electrical contact 131 on the bottom side of the sealing layer 15 .

[0121] It is worth noting that in other examples of the present invention, before cutting the circuit substrate 120 , the sealing layer 15 may be ground first to reduce the overall thickness of the image sensing component 10 and further reduce the overall height of the image sensor module 1 .

[0122] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. An image sensing component, used to assemble an image sensor module with a flexible circuit board and a lens assembly, characterized in that: The image sensing component comprises: At least one image sensing chip, wherein the image sensing chip has a sensing area; at least one rigid circuit board, wherein the rigid circuit board has an upper surface, a lower surface, and a hollow portion penetrating the upper surface and the lower surface, wherein the upper surface of the rigid circuit board is suitable for correspondingly mounting the lens assembly so that the lens assembly is aligned with the hollow portion of the rigid circuit board, wherein the image sensing chip is electrically connected and mounted on the lower surface of the rigid circuit board, and the sensing area of ​​the image sensing chip is aligned with the hollow portion of the rigid circuit board; and An electrical contact assembly, wherein the electrical contact assembly includes a plurality of circuit board electrical contacts, and the circuit board electrical contacts are disposed on the upper surface and / or the lower surface of the rigid circuit board, and are used to electrically connect the flexible circuit board to the rigid circuit board after mounting the image sensing chip; wherein the electrical contact assembly further includes a plurality of chip electrical contacts, and the chip electrical contacts are disposed between the image sensing chip and the rigid circuit board; The image sensing component further comprises a sealing layer, wherein the sealing layer covers the image sensing chip and a portion of the lower surface of the rigid circuit board; The circuit board electrical contacts are arranged on the lower surface of the rigid circuit board, and the circuit board electrical contacts are exposed outside the sealing layer.

2. The image sensing component as claimed in claim 1, wherein: The rigid circuit board is obtained by cutting the circuit substrate after mounting a plurality of the image sensing chips on the circuit substrate at one time.

3. The image sensing component as described in claim 1 or 2 further comprises at least one filter, wherein the filter is correspondingly mounted on the upper surface of the rigid circuit board, and the filter is aligned with the hollow portion of the rigid circuit board.

4. An image sensing component, used to assemble an image sensor module with a flexible circuit board and a lens assembly, characterized in that: The image sensing component comprises: At least one image sensing chip, wherein the image sensing chip has a sensing area; at least one rigid circuit board, wherein the rigid circuit board has an upper surface, a lower surface, and a hollow portion penetrating the upper surface and the lower surface, wherein the upper surface of the rigid circuit board is suitable for correspondingly mounting the lens assembly so that the lens assembly is aligned with the hollow portion of the rigid circuit board, wherein the image sensing chip is electrically connected and mounted on the lower surface of the rigid circuit board, and the sensing area of ​​the image sensing chip is aligned with the hollow portion of the rigid circuit board; and An electrical contact assembly, wherein the electrical contact assembly includes a plurality of circuit board electrical contacts, and the circuit board electrical contacts are disposed on the upper surface and / or the lower surface of the rigid circuit board, and are used to electrically connect the flexible circuit board to the rigid circuit board after mounting the image sensing chip; wherein the electrical contact assembly further includes a plurality of chip electrical contacts, and the chip electrical contacts are disposed between the image sensing chip and the rigid circuit board; The image sensing component further comprises a sealing layer, wherein the sealing layer covers the entire lower surface of the image sensing chip and the rigid circuit board; The electrical contact assembly further includes a plurality of conductors, wherein the conductors are disposed through the sealing layer and are electrically connected to the rigid circuit board, so as to electrically connect the flexible circuit board with the rigid circuit board through the conductors.

5. The image sensing component as claimed in claim 4, wherein: The rigid circuit board is obtained by cutting the circuit substrate after mounting a plurality of the image sensing chips on the circuit substrate at one time.

6. The image sensing component as claimed in claim 5, wherein: The conductor member is a conductor post, wherein the first end of the conductor post is disposed through the rigid circuit board or is fixedly disposed on the lower surface of the rigid circuit board, wherein the second end of the conductor post integrally extends downward from the first end of the conductor post and penetrates the sealing layer to serve as an electrical contact of the circuit board.

7. The image sensing component as described in any one of claims 4 to 6 further comprises at least one filter, wherein the filter is correspondingly mounted on the upper surface of the rigid circuit board, and the filter is aligned with the hollow portion of the rigid circuit board.

8. An image sensor module, characterized in that: include: a flexible printed circuit board; a lens assembly; as well as An image sensing component, wherein the image sensing component comprises: At least one image sensing chip, wherein the image sensing chip has a sensing area; at least one rigid circuit board, wherein the rigid circuit board has an upper surface, a lower surface, and a hollow portion penetrating the upper surface and the lower surface, wherein the lens assembly is correspondingly mounted on the upper surface of the rigid circuit board so that the lens assembly is aligned with the hollow portion of the rigid circuit board, wherein the image sensing chip is electrically connected and mounted on the lower surface of the rigid circuit board, and the sensing area of ​​the image sensing chip is aligned with the hollow portion of the rigid circuit board; and An electrical contact assembly, wherein the electrical contact assembly includes a plurality of circuit board electrical contacts, and the circuit board electrical contacts are disposed on the upper surface and / or the lower surface of the rigid circuit board, so as to electrically connect the flexible circuit board to the rigid circuit board through the circuit board electrical contacts after mounting the image sensing chip; wherein the electrical contact assembly further includes a plurality of chip electrical contacts, and the chip electrical contacts are disposed between the image sensing chip and the rigid circuit board; Wherein, the image sensing component further comprises a sealing layer, wherein the sealing layer is coated on the image sensing chip and the lower surface of the rigid circuit board; The flexible circuit board has an internal connection end, an external connection end and a notch, wherein the notch of the flexible circuit board is located at an internal connection end of the flexible circuit board, and when the internal connection end of the flexible circuit board is electrically connected to the upper surface of the rigid circuit board, the notch of the flexible circuit board matches the hollow portion of the rigid circuit board.

9. The image sensor module according to claim 8, wherein: The inner connection end of the flexible circuit board includes a base plate and one or more side wing plates, wherein the notch of the flexible circuit board is arranged on the base plate of the inner connection end, and the side wing plates extend outward from the side edge of the base plate in an integral manner to cover the side surface of the rigid circuit board.

10. The image sensor module according to claim 8 or 9, wherein: The electrical contact assembly further includes a plurality of lens electrical contacts, wherein the lens electrical contacts are correspondingly arranged on the upper surface of the rigid circuit board so as to electrically connect the lens assembly to the rigid circuit board through the lens electrical contacts.

11. An image sensor module, characterized in that: include: a flexible printed circuit board; a lens assembly; as well as An image sensing component, wherein the image sensing component comprises: At least one image sensing chip, wherein the image sensing chip has a sensing area; at least one rigid circuit board, wherein the rigid circuit board has an upper surface, a lower surface, and a hollow portion penetrating the upper surface and the lower surface, wherein the lens assembly is correspondingly mounted on the upper surface of the rigid circuit board so that the lens assembly is aligned with the hollow portion of the rigid circuit board, wherein the image sensing chip is electrically connected and mounted on the lower surface of the rigid circuit board, and the sensing area of ​​the image sensing chip is aligned with the hollow portion of the rigid circuit board; and An electrical contact assembly, wherein the electrical contact assembly includes a plurality of circuit board electrical contacts, and the circuit board electrical contacts are disposed on the upper surface and / or the lower surface of the rigid circuit board, so as to electrically connect the flexible circuit board to the rigid circuit board through the circuit board electrical contacts after mounting the image sensing chip; wherein the electrical contact assembly further includes a plurality of chip electrical contacts, and the chip electrical contacts are disposed between the image sensing chip and the rigid circuit board; Wherein, the image sensing component further includes a sealing layer, and the sealing layer covers the entire lower surface of the image sensing chip and the rigid circuit board, wherein the electrical contact component further includes a plurality of conductors, wherein the conductors are arranged through the sealing layer, and the conductors are electrically connected to the rigid circuit board so as to electrically connect the flexible circuit board with the rigid circuit board through the conductors.

12. The image sensor module according to claim 11, wherein: The flexible circuit board has an inner connection end and an outer connection end, wherein the sealing layer is located between the inner connection end of the flexible circuit board and the lower surface of the rigid circuit board, so as to electrically connect the inner connection end of the flexible circuit board to the rigid circuit board through the conductor.

13. The image sensor module according to claim 11 or 12, wherein: The electrical contact assembly further includes a plurality of lens electrical contacts, wherein the lens electrical contacts are correspondingly arranged on the upper surface of the rigid circuit board so as to electrically connect the lens assembly to the rigid circuit board through the lens electrical contacts.

14. An electronic device, characterized in that: include: An electronic device body; and At least one image sensor module as claimed in any one of claims 8 to 13, wherein the image sensor module is configured in the electronic device body to acquire images.

15. A method for manufacturing an image sensor module, characterized in that: Includes steps: An image sensing component as claimed in any one of claims 1 to 7 is provided, wherein the image sensing chip of the image sensing component is mounted on a rigid circuit board of the image sensing component, and a plurality of circuit board electrical contacts in the electrical contact assembly of the image sensing component are arranged on an upper surface and / or a lower surface of the rigid circuit board; Electrically connecting a flexible circuit board to the rigid circuit board through the circuit board electrical contacts; as well as A lens assembly is mounted on the upper surface of the rigid circuit board to assemble the image sensor module.

16. The method for manufacturing an image sensor module according to claim 15, wherein: The step of providing an image sensing component comprises the steps of: A circuit substrate is prepared, wherein the circuit substrate is pre-divided into a plurality of rigid circuit boards, a hollow portion is provided on each of the rigid circuit boards, and a plurality of electrical conductors are provided on the surface of the circuit substrate to form electrical contacts of the circuit boards; Mounting the plurality of image sensing chips on the lower surface of the rigid circuit board in an electrically connectable manner, and aligning the sensing areas of the image sensing chips with the hollowed-out portions of the rigid circuit board; as well as The circuit substrate is cut to obtain a single image sensing component or an array image sensing component.

17. The method for manufacturing an image sensor module according to claim 16, wherein: The step of providing an image sensing component further comprises the steps of: One or more sealing layers are provided to cover a part or the whole of the lower surface of the plurality of image sensing chips and the rigid circuit board.

18. The method for manufacturing an image sensor module according to claim 16, wherein: The step of providing an image sensing component further comprises the steps of: Disposing a plurality of conductors to be electrically connected to the rigid circuit board; and One or more sealing layers are provided to cover the plurality of image sensing chips and the entire lower surface of the rigid circuit board, and the conductor penetrates through the sealing layer to form the circuit board electrical contacts on the bottom side of the sealing layer.

19. The method for manufacturing an image sensor module according to any one of claims 15 to 18, wherein: The step of providing an image sensing component further comprises the steps of: A plurality of filters are mounted on the upper surface of the rigid circuit board respectively and correspondingly, and the filters are aligned with the hollow portion of the rigid circuit board.

Images